Low-pollution chip wafer plasma cleaning machine and cleaning process thereof

Abstract

The application relates to the technical field of semiconductor chip cleaning, and discloses a low-pollution chip wafer plasma cleaning machine and a cleaning process thereof, which comprises a box body, the bottom of the box body is fixedly connected with a mounting plate one, the bottom of the mounting plate one is fixedly connected with a mounting frame, and the bottom of the mounting frame is fixedly connected with bases at four corners. In the application, omnibearing dead-angle-free cleaning is realized through the design of a cleaning and cleaning degree improving turnover assembly of the cleaning machine, a motor drives a turnover plate to rotate around a support one through a driving rod and a connecting rod, accurate positioning of limit blocks one and two is achieved, stable turnover of the chip can be realized, continuous cleaning of the front and back surfaces of the chip can be completed without manual intervention, pollution residue caused by single-surface cleaning is avoided, pollution risks caused by manual turnover are eliminated, the chip surface cleaning is dead-angle-free, and the cleaning degree is obviously improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip cleaning technology, and in particular to a low-pollution chip wafer plasma cleaning machine and its cleaning process. Background Technology

[0002] Low-pollution chip wafers are high-cleanliness chip wafers in the semiconductor manufacturing field that have undergone low-pollution processes, resulting in extremely low surface contaminant residue, no secondary pollution, and no damage to surface integrity. The core is the high cleanliness state achieved by the wafer after low-pollution treatment, rather than a change in the wafer's material itself. As the core substrate for high-end semiconductor manufacturing, the high cleanliness, non-damage, and non-secondary pollution characteristics of low-pollution chip wafers dictate that they must rely on plasma cleaners. This is determined by the precision requirements of semiconductor manufacturing processes and also compensates for the shortcomings of traditional cleaning methods and adapts to the special needs of low-pollution wafers. In the semiconductor chip manufacturing process, contaminants such as particles, organic matter, and metal oxides on the wafer surface directly affect the yield and performance of the chip. As a core cleaning equipment, plasma cleaners are widely used in semiconductor manufacturing processes.

[0003] Existing ultrasonic cleaning equipment often uses fixed-installation structures for its ultrasonic generators, which cannot flexibly adjust the emission angle and position. This limits its compatibility with chips of a single specification. For chips of different sizes or irregular shapes, ultrasonic energy cannot evenly cover the chip surface, leading to incomplete cleaning in certain areas and residual contaminants, severely impacting cleaning accuracy. Furthermore, traditional cleaning machines mostly only clean one side of the chip. To clean the other side, the chip must be manually removed and flipped, increasing the risk of contamination from manual intervention and reducing production efficiency. Improper handling during flipping can also cause the chip to be scratched or fall off. Existing equipment often employs a single chip clamping and fixing structure, resulting in either insufficient clamping force, causing the chip to shift due to plasma impact or ultrasonic vibration during cleaning, leading to misalignment of the cleaning trajectory and reduced cleaning effectiveness, or an overly rigid fixing structure lacking buffer protection, easily scratching the chip surface film and even causing chip detachment and damage. Additionally, some equipment has poor sealing performance, allowing external contaminants to enter the cavity or allowing reaction waste gas to leak from within the cavity, affecting cleaning cleanliness and posing environmental hazards.

[0004] To address the aforementioned issues, a low-pollution chip wafer plasma cleaning machine and its cleaning process are proposed. Summary of the Invention

[0005] To overcome the above shortcomings, this invention provides a low-pollution chip wafer plasma cleaning machine and its cleaning process, aiming to improve the problems of poor adaptability of ultrasonic devices in existing cleaning equipment, the need for manual flipping, unreasonable clamping structure and poor sealing, which lead to incomplete cleaning, high risk of contamination, low efficiency and easy damage to wafers.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a low-pollution chip wafer plasma cleaning machine, comprising a housing, a mounting plate fixedly connected to the bottom of the housing, a mounting frame fixedly connected to the bottom of the mounting plate, bases fixedly connected to the four corners of the bottom of the mounting frame, a sealing plate rotatably connected to the front side of the housing, a flipping assembly provided at the bottom of the inner wall of the housing, a fixing assembly provided on the inner wall of the flipping assembly, multiple positioning assemblies provided on the inner wall of the fixing assembly, an adjustment assembly provided at the top of the inner wall of the housing, a vacuum device fixedly connected to the bottom right side of the mounting plate, a base plate fixedly connected to the middle of the inner wall of the mounting frame, a controller fixedly connected to the top left side of the base plate, a display rotatably connected to the left end of the front side of the housing, a bracket two installed on the right side of the housing, a monitor rotatably connected to the inner wall of the bracket two, and a sealing strip installed on the front side of the inner wall of the housing.

[0007] As a further description of the above technical solution: The flipping assembly includes a second mounting plate, which is fixedly connected to the bottom of the inner wall of the housing. A motor is fixedly connected to the right side of the inner wall of the second mounting plate. A first mounting block passes through the output end of the motor. A drive rod is fixedly connected to the output end of the motor. A connecting rod is fixedly connected to the inner wall of the drive rod. A flipping plate is fixedly connected to the left side of the outer wall of the connecting rod. A first limiting block is fixedly connected to the middle of both the left and right sides of the flipping plate. A second limiting block is fixedly connected to the front end of both the left and right sides of the flipping plate. A bracket is fixedly connected to the top left and right sides of the second mounting plate.

[0008] As a further description of the above technical solution: The fixing assembly includes a fixing plate 1, which is fixedly connected to the front inner wall of the flip plate. An electric push rod 2 is fixedly connected to the top right side of the fixing plate 1, and a toothed plate 1 is fixedly connected to the output end of the electric push rod 2. An electric push rod 1 is fixedly connected to the top left side of the fixing plate 1, and a toothed plate 2 is fixedly connected to the output end of the electric push rod 1. Slide rails are fixedly connected to both ends of the rear side of the fixing plate 1, and a fixing plate 2 is fixedly connected to the rear side of the slide rails. Connecting blocks 4 are slidably connected to the rear outer wall of the fixing plate 2. The top of the connecting blocks 4... A connecting block 1 is installed. A fixing block 4 is fixedly connected to the left side of the connecting block 4. A fixing block 1 is fixedly connected to the right side of the connecting block 1. A connecting block 2 is slidably connected to the front right end of the slide rail. A rack 2 is fixedly connected to the rear side of the connecting block 2. A connecting block 3 is slidably connected to the front left end of the slide rail. A rack 1 is fixedly connected to the rear side of the connecting block 3. A fixing block 2 is fixedly connected to the right side of the connecting block 2. A fixing block 3 is fixedly connected to the left side of the connecting block 3. A gear 2 is installed at the top center of the flip plate. A gear 1 is installed on the top of the gear 2.

[0009] As a further description of the above technical solution: The positioning component includes multiple mounting blocks 2, each of which is fixedly connected to the inner wall of a fixing block 1. A pull rod is slidably connected to the inner wall of each mounting block 2, and a spring is sleeved on the outer wall of the pull rod. Multiple rubber strips are fixedly connected to the inner wall of the fixing block 1, and a positioning block is fixedly connected to one of the adjacent sides of each pull rod.

[0010] As a further description of the above technical solution: The adjustment assembly includes a connecting plate, which is fixedly connected to the rear side of the inner wall of the housing. A hydraulic rod is fixedly connected to the front side of the inner wall of the connecting plate, and an ultrasonic transmitter is fixedly connected to the output end of the hydraulic rod.

[0011] As a further description of the above technical solution: Both of the first limiting blocks are slidably connected to the inner wall of the first bracket, and both of the second limiting blocks are slidably connected to the inner wall of the first bracket.

[0012] As a further description of the above technical solution: The first gear is meshed with the first gear plate and the first rack, and the second gear is meshed with the second gear plate and the second rack.

[0013] As a further description of the above technical solution: The first toothed plate is fixedly connected to the front side of the first connecting block, and the second toothed plate is fixedly connected to the front side of the fourth connecting block.

[0014] As a further description of the above technical solution: Multiple springs are mounted on the top of mounting block two, and multiple positioning blocks are symmetrically distributed on the inner side of fixing block one.

[0015] As a further description of the above technical solution: S1: Pre-treatment preparation. Open the sealing plate and check whether the inner wall of the chamber and the fixed components are clean. Set the appropriate parameters such as plasma power, ultrasonic frequency, and cleaning time according to the chip size and degree of contamination on the display to prepare for cleaning.

[0016] S2: Chip positioning and fixing. Place the chip in the flip plate positioning area, start the fixing component, and the electric push rod drives the toothed plate one, gear one, and rack one to work together. Fixing block one and fixing block two are clamped from all sides. The positioning component is flexibly positioned by springs and rubber strips.

[0017] S3: Create a vacuum environment, close the sealing plate, ensure the sealing strip fits tightly against the chamber, start the vacuum pump to create a stable vacuum environment, prevent external particles and moisture from entering, avoid waste gas leakage, and provide clean conditions for plasma reaction and cleaning.

[0018] S4: Front-side collaborative cleaning. The adjustment component is activated, and the hydraulic rod adjusts the height, angle, and position of the ultrasonic transmitter. Combined with the strong oxidizing properties of plasma, the two work together to uniformly remove contaminants such as particles and organic matter from the front of the chip. The monitor provides real-time feedback on the status.

[0019] S5: Automated flipping. After the front side is cleaned, the controller commands the flipping assembly. The motor drives the drive rod and connecting rod to make the flipping plate rotate around the support frame. Limiting block one and limiting block two precisely limit the rotation, and the flipping is smooth 180° without manual intervention, avoiding contamination and scratches.

[0020] S6: Reverse side collaborative cleaning. After flipping the chip, the adjustment component fine-tunes the ultrasonic transmitter parameters, and the ultrasonic energy evenly covers the reverse side of the chip. The plasma and ultrasonic waves continue to work together to clean the chip, removing residual contaminants from the reverse side, thus eliminating any cleaning dead spots.

[0021] S7: Post-cleaning treatment. After cleaning, turn off the plasma and ultrasonic systems, introduce inert gas to balance the pressure, open the sealing plate, loosen the fixing components, remove the chip, start the device's self-cleaning program, clean the residue inside the cavity, and prepare for the next use.

[0022] The present invention has the following beneficial effects: 1. In this invention, the all-round, no-dead-angle cleaning and the design of the flipping component of the cleaning machine to improve the cleanliness of the chip realizes the automated flipping cleaning. The motor drives the flipping plate to rotate around the bracket one through the drive rod and connecting rod. With the precise limiting of limit block one and limit block two, the chip can be stably flipped. The continuous cleaning of the front and back of the chip can be completed without manual intervention, avoiding the contaminant residue caused by single-sided cleaning. At the same time, it eliminates the risk of contamination caused by manual flipping, ensuring that the chip surface is cleaned without dead angles and significantly improving the cleanliness of the chip.

[0023] 2. In this invention, the cleaning machine has strong adaptability and is compatible with cleaning chips of various specifications. By setting an adjustment component, the height, horizontal position and emission angle of the ultrasonic transmitter can be flexibly adjusted using a hydraulic rod. Combined with the linkage of the connecting plate, the coverage range of ultrasonic energy can be precisely adjusted according to the size, thickness and shape of the chip, ensuring that the surface of chips of different specifications can be uniformly cleaned by the combined action of plasma and ultrasonic waves, thus completely solving the problems of poor adaptability and incomplete cleaning of local areas in traditional equipment.

[0024] 3. In this invention, the cleaning machine stably fixes the chip, preventing displacement and damage, and protecting the chip's integrity. The synergistic effect of the fixing component and the positioning component achieves reliable chip fixation. The fixing component drives the toothed plate, toothed plate, gear, gear, rack, and rack through electric push rod one and electric push rod two, which in turn drive the fixing block one and fixing block two to clamp the chip from all sides. The positioning component, through the buffering force of the spring and the positioning effect of the positioning block, combined with the flexible contact of the rubber strip, not only avoids the chip from shifting or shaking during cleaning and flipping, but also prevents the fixing structure from scratching the chip surface. At the same time, the multiple fixing structures can adaptively adjust the clamping force according to the chip specifications, effectively preventing the chip from falling and being damaged, and ensuring the chip's integrity.

[0025] 4. In this invention, the cleaning machine cleans low-pollution chips, ensuring a clean cleaning environment. The equipment is equipped with a sealing plate and sealing strip to ensure the sealing performance of the vacuum chamber, preventing pollutants such as particles and water vapor in the outside air from entering the chamber, while also avoiding secondary pollution caused by leakage of reaction waste gas inside the chamber. In addition, the components that come into contact with the chip, such as the fixing block and positioning block, are made of low-pollution rubber, ceramic and other materials, reducing particle shedding during the contact process. Combined with the strong oxidizing properties of plasma and the physical peeling effect of ultrasound, pollutants are removed efficiently while minimizing the risk of pollution during the cleaning process, achieving the goal of low-pollution cleaning.

[0026] 5. In this invention, the cleaning machine has a high degree of automation, which improves production efficiency. This invention integrates the actions of the flipping component, fixing component, and adjusting component through the controller, and with the real-time feedback of the chip status by the monitor, it realizes the full-process automated control of chip positioning, fixing, flipping, and cleaning. There is no need for manual intervention to flip and adjust the fixing structure, which greatly shortens the chip cleaning cycle, improves production efficiency, and reduces human error and contamination risk caused by manual operation, making it more suitable for the needs of semiconductor mass production scenarios. Attached Figure Description

[0027] Figure 1 This is a perspective view of the housing of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 2 The flowchart shows the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 3 This is a schematic diagram of the sealing plate structure of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 4 This is a schematic diagram of the display structure of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 5 This is a schematic diagram of the support structure of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 6 For the present invention Figure 5 Enlarged view of point A in the middle; Figure 7 This is a schematic diagram of the mounting plate structure of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 8 This is a schematic diagram of the slide rail structure of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 9 This is a schematic diagram of the drive rod structure of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 10 This is a schematic diagram of the flip-plate structure of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 11 This is a schematic diagram of the fixed plate structure of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 12 This is a schematic diagram of the toothed plate structure of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention. Figure 13 This is a schematic diagram of the spring structure of the low-pollution chip wafer plasma cleaning machine and its cleaning process proposed in this invention.

[0028] Legend: 1. Housing; 2. Mounting Plate 1; 3. Mounting Frame; 4. Base; 5. Sealing Plate; 6. Flip Assembly; 601. Mounting Plate 2; 602. Motor; 603. Mounting Block 1; 604. Drive Rod; 605. Connecting Rod; 606. Flip Plate; 607. Limiting Block 1; 608. Limiting Block 2; 609. Bracket 1; 7. Fixing Assembly; 701. Fixing Plate 1; 702. Electric Push Rod 1; 703. Electric Push Rod 2; 704. Fixing Plate 2; 705. Slide Rail; 706. Gear Plate 1; 707. Gear 1; 708. Rack 1; 709. Connecting Block 1; 710. Fixing Block 1; 711. Connecting Block Two; 712. Fixing Block Two; 713. Gear Plate Two; 714. Rack Two; 715. Gear Two; 716. Connecting Block Three; 717. Connecting Block Four; 718. Fixing Block Three; 719. Fixing Block Four; 8. Positioning Assembly; 801. Mounting Block Two; 802. Pull Rod; 803. Spring; 804. Rubber Strip; 805. Positioning Block; 9. Adjustment Assembly; 901. Connecting Plate; 902. Hydraulic Rod; 903. Ultrasonic Transmitter; 10. Vacuum Unit; 11. Base Plate; 12. Controller; 13. Display; 14. Bracket Two; 15. Monitor; 16. Sealing Strip. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Reference Figure 1-13An embodiment of the present invention provides a low-pollution chip wafer plasma cleaning machine, comprising a housing 1, a mounting plate 2 fixedly connected to the bottom of the housing 1, a mounting frame 3 fixedly connected to the bottom of the mounting plate 2, bases 4 fixedly connected to the four corners of the bottom of the mounting frame 3, a sealing plate 5 rotatably connected to the front side of the housing 1, a flipping assembly 6 provided at the bottom of the inner wall of the housing 1, a fixing assembly 7 provided on the inner wall of the flipping assembly 6, a plurality of positioning assemblies 8 provided on the inner wall of the fixing assembly 7, an adjusting assembly 9 provided at the top of the inner wall of the housing 1, a vacuum device 10 fixedly connected to the bottom right side of the mounting plate 2, a base plate 11 fixedly connected to the middle of the inner wall of the mounting frame 3, a controller 12 fixedly connected to the top left side of the base plate 11, a display 13 rotatably connected to the front left end of the housing 1, a bracket 14 mounted on the right side of the housing 1, and a monitor rotatably connected to the inner wall of the bracket 14. 15. A sealing strip 16 is installed on the front side of the inner wall of the housing 1. This design is for the housing 1 to serve as the core cleaning chamber. The bottom is stably connected to the mounting bracket 3 through the mounting plate 2. The base 4 ensures that the cleaning machine is placed stably. The housing 1 integrates the flipping component 6, fixing component 7, adjusting component 9, and positioning component 8. Together with the vacuum device 10, controller 12, monitor 15, and sealing strip 16, it forms a complete cleaning process. The sealing plate 5 and sealing strip 16 fit tightly to prevent external pollutants from entering and internal exhaust gas from leaking. The controller 12 serves as the central hub, integrating the actions of the flipping component 6, fixing component 7, adjusting component 9, and positioning component 8. The display 13 visualizes the parameter settings, and the monitor 15 provides real-time feedback on the chip status. The cleaning machine achieves fully automated control of the entire process, solving the problems of poor sealing and excessive manual intervention in traditional equipment, and providing a hardware foundation for low-pollution and high-efficiency cleaning.

[0031] The flipping assembly 6 includes a second mounting plate 601, which is fixedly connected to the bottom of the inner wall of the housing 1. A motor 602 is fixedly connected to the right side of the inner wall of the second mounting plate 601. The output end of the motor 602 passes through a first mounting block 603. A drive rod 604 is fixedly connected to the output end of the motor 602. A connecting rod 605 is fixedly connected to the inner wall of the drive rod 604. A flipping plate 606 is fixedly connected to the left side of the outer wall of the connecting rod 605. Limiting blocks 607 are fixedly connected to the middle of both sides of the flipping plate 606. Limiting blocks 608 are fixedly connected to the front ends of both sides of the flipping plate 606. Brackets 609 are fixedly connected to the top left and right sides of the second mounting plate 601. This design is... To fix the mounting plate 601 of the flipping component 6 to the bottom of the inner wall of the housing 1 and provide a stable mounting reference for the motor 602, after the motor 602 is started, the output end drives the flipping plate 606 to rotate around the bracket 609 through the drive rod 604 and the connecting rod 605. The limiting blocks 607 and 608 on the left and right sides slide along the inner wall of the bracket 609, precisely limiting the rotation angle and trajectory of the flipping plate 606. The motor 602 can achieve a precise 180° flip according to the instructions of the controller 12 without manual intervention. This avoids the risk of contamination and chip damage caused by manual flipping, and also realizes continuous cleaning of both sides. With the collaborative cleaning mechanism, it completely solves the defect of incomplete single-sided cleaning of traditional equipment.

[0032] The fixing assembly 7 includes a fixing plate 701, which is fixedly connected to the front side of the inner wall of the flip plate 606. An electric push rod 703 is fixedly connected to the top right side of the fixing plate 701. A toothed plate 706 is fixedly connected to the output end of the electric push rod 703. An electric push rod 702 is fixedly connected to the top left side of the fixing plate 701. A toothed plate 713 is fixedly connected to the output end of the electric push rod 702. Slide rails 705 are fixedly connected to both the left and right ends of the rear side of the fixing plate 701. A fixing plate 704 is fixedly connected to the rear side of the slide rails 705. Connecting blocks 4 717 are slidably connected to the rear side of the outer wall of plate 2 704. Connecting block 1 709 is installed on the top of connecting block 4 717. Fixing block 4 719 is fixedly connected to the left side of connecting block 4 717. Fixing block 1 710 is fixedly connected to the right side of connecting block 1 709. Connecting block 2 711 is slidably connected to the front right end of slide rail 705. Rack 2 714 is fixedly connected to the rear side of connecting block 2 711. Connecting block 3 716 is slidably connected to the front left end of slide rail 705. Rack 1 708 is fixedly connected to the rear side of connecting block 3 716. The right side of connecting block 2 711 is... A fixing block 712 is fixedly connected to the left side of the connecting block 716, and a fixing block 718 is fixedly connected to the left side of the connecting block 716. A gear 715 is installed at the top center of the flip plate 606, and a gear 707 is installed on the top of the gear 715. This design is to ensure a stable connection between the fixing plate 701 of the fixing component 7 and the flip plate 606. Electric push rods 702 and 703 drive the gear plate 706 and gear plate 713 to move, respectively. Through the meshing of gear 707 with gear plate 706 and rack 708, gear 715 meshes with gear plate 713. The meshing transmission of rack 2 714 drives connecting block 1 709, connecting block 2 711, connecting block 3 716, and connecting block 4 717 to slide synchronously along slide rail 705, thereby driving fixing block 1 710, fixing block 2 712, fixing block 3 718, and fixing block 4 719 to move closer to the chip from all sides. This linkage structure has precise transmission and can adaptively adjust the clamping range according to the chip size. It can provide sufficient clamping force to prevent displacement during cleaning, and avoid the drawbacks of a single fixing structure. Together with positioning component 8, it achieves flexible clamping, ensuring the fixing stability and integrity of chips of different specifications.

[0033] The positioning component 8 includes multiple mounting blocks 801, each fixedly connected to the inner wall of the fixing block 710. A pull rod 802 is slidably connected to the inner wall of each mounting block 801, and a spring 803 is sleeved on the outer wall of the pull rod 802. Multiple rubber strips 804 are fixedly connected to the inner wall of the fixing block 710, and positioning blocks 805 are fixedly connected to adjacent sides of each pull rod 802. This design ensures that the multiple mounting blocks 801 of the positioning component 8 are evenly distributed on the inner wall of the fixing block 710, with the pull rods 802 penetrating the mounting blocks 801 and their outer walls sleeved. A spring 803 and a positioning block 805 are fixed to the same side as the pull rod 802 and symmetrically distributed. The rubber strip 804 on the inner wall of the fixing block 710 is in flexible contact with the chip. When the fixing component 7 drives the fixing block to clamp, the spring 803 provides buffer force through elastic deformation, the positioning block 805 accurately fits the edge of the chip, and the rubber strip 804 reduces contact wear, thereby avoiding scratches on the chip surface film layer caused by rigid fixation. At the same time, through the adaptive adjustment of the spring 803, it can adapt to chips of different thicknesses, prevent the chip from shaking or falling off during cleaning and flipping, and ensure the integrity of the chip.

[0034] The adjustment component 9 includes a connecting plate 901, which is fixedly connected to the rear side of the inner wall of the housing 1. A hydraulic rod 902 is fixedly connected to the front side of the inner wall of the connecting plate 901. An ultrasonic transmitter 903 is fixedly connected to the output end of the hydraulic rod 902. This design is to fix the connecting plate 901 of the adjustment component 9 to the rear side of the inner wall of the housing 1 to provide stable support for the hydraulic rod 902. The output end of the hydraulic rod 902 is rigidly connected to the ultrasonic transmitter 903. During actual cleaning, the hydraulic rod 902 can be flexibly adjusted in three dimensions to achieve precise adjustment of the height, horizontal position and emission angle of the ultrasonic transmitter 903. For chips of different sizes and irregular structures, the controller 12 can drive the hydraulic rod 902 to move according to preset parameters to ensure that the ultrasonic energy evenly covers the chip surface. In synergy with the strong oxidation of plasma, it completely solves the problems of poor adaptability and incomplete local cleaning of traditional fixed ultrasonic devices, and improves the cleaning accuracy.

[0035] Two limiting blocks 607 are slidably connected to the inner wall of bracket 609, and two limiting blocks 608 are slidably connected to the inner wall of bracket 609. This design allows the limiting blocks 607 and 608 to be slidably connected to the inner wall of bracket 609. They are fixed to the middle and front of the left and right sides of the flipping plate 606, respectively, forming a double limiting structure. When the motor 602 drives the flipping plate 606 to rotate, the limiting blocks 607 and 608 slide along the grooves on the inner wall of bracket 609. This limits the rotation range of the flipping plate 606, ensuring a precise 180° flip, and also provides support for the flipping plate 606 to prevent shaking during rotation. This connection method ensures the stability of the flipping process, prevents the chip from shifting due to flipping and causing misalignment of the cleaning trajectory, and avoids collision between the chip and the inner wall of the housing 1 during flipping, further protecting the chip integrity. Combined with automated control, this enables continuous cleaning.

[0036] Gear 707 is meshed with gear plate 706 and rack 708, and gear 715 is meshed with gear plate 713 and rack 714. This design ensures that gear 707 meshes with gear plate 706 and rack 708, and gear 715 meshes with gear plate 713 and rack 714. This meshing connection method provides high transmission efficiency and high precision. When driving gear plate 706 and gear plate 713, gears 707 and 715, through meshing, drive racks 708 and 714 to move synchronously, thereby enabling connecting block 1... 709, Connecting Block 2 711, Connecting Block 3 716, and Connecting Block 4 717 drive Fixing Block 1 710, Fixing Block 2 712, Fixing Block 3 718, and Fixing Block 4 719 to clamp or loosen synchronously from all sides. The synchronicity of the meshing transmission avoids uneven chip force caused by inconsistent movements of Fixing Block 1 710, Fixing Block 2 712, Fixing Block 3 718, and Fixing Block 4 719, ensuring uniform clamping force. This prevents chip displacement due to excessive looseness and chip damage due to excessive tightness. At the same time, it adapts to the clamping requirements of chips of different specifications, improving the adaptability and cleaning stability of the cleaning machine.

[0037] The toothed plate 706 is fixedly connected to the front side of the connecting block 709, and the toothed plate 713 is fixedly connected to the front side of the connecting block 717. This design ensures that the power transmission is direct and without delay. The driving force is directly transmitted to the connecting blocks 709, 711, 716, and 717 through the toothed plates, which in turn drive the fixed blocks 710, 712, 718, and 719 to move, reducing power loss. This allows the clamping and loosening actions of the fixing components 7 to respond quickly. Combined with the precision of the meshing transmission, it enables rapid chip positioning and fixing, shortening the cleaning preparation time. At the same time, the stability of the fixed connection prevents the components from loosening during the transmission process, ensuring the long-term reliability of the cleaning machine, reducing maintenance costs, and making it suitable for semiconductor mass production scenarios.

[0038] Multiple springs 803 are mounted on top of mounting block 2 801, and multiple positioning blocks 805 are symmetrically distributed inside the fixing block 1 710. This design ensures that the springs 803 are mounted on top of mounting block 2 801, ensuring that the deformation direction of the springs 803 is stable and providing uniform buffering force for the positioning blocks 805. The symmetrical distribution of the positioning blocks 805 inside the fixing block 1 710 ensures that the chip edge is subjected to balanced force. When the chip is clamped, the symmetrically distributed positioning blocks 805 accurately position the chip center, preventing the chip from shifting. The elastic force of the springs 803 can be adaptively adjusted according to the chip thickness to prevent excessive pressure from scratching the chip. This ensures both positioning accuracy and protects the chip surface integrity through buffering, solving the problems of high rigidity and poor adaptability of traditional positioning structures and improving the low-pollution cleaning effect.

[0039] Pre-treatment preparation: Open the sealing plate 5 and check the cleanliness of the inner wall of the chamber 1 and the fixing component 7. Using the display 13, set the appropriate parameters such as plasma power, ultrasonic frequency, and cleaning time according to the chip size and degree of contamination to prepare for cleaning. Chip positioning and fixing: Place the chip in the positioning area of ​​the flip plate 606, activate the fixing component 7, and the electric push rod drives the toothed plate 706, gear 707, rack 708, and other structures to work together. Fixing block 710 and fixing block 712 clamp the chip from all sides. The positioning component 8 uses spring 803 and rubber strip 804 for flexible positioning, ensuring the chip is stable and undamaged. Establish a vacuum environment: Close the sealing plate 5. The sealing strip 16 fits tightly against the housing 1. The vacuum device 10 is activated to create a stable vacuum environment, preventing external particles and moisture from entering and avoiding exhaust gas leakage, thus providing clean conditions for plasma reaction and cleaning. For front-side cleaning, the adjustment component 9 is activated, and the hydraulic rod 902 adjusts the height, angle, and position of the ultrasonic transmitter 903. Combined with the strong oxidizing properties of plasma, the two work synergistically to evenly remove contaminants such as particles and organic matter from the front of the chip. The monitor 15 provides real-time feedback on the status. For automated flipping, after front-side cleaning is complete, the controller 12 instructs the flipping component 6. The motor 602 drives the drive rod 604 and connecting rod 605 to rotate the flipping plate 606 around the support 6. 09. Rotation: Limiting blocks 607 and 608 precisely limit the rotation, smoothly flipping the chip 180° without manual intervention, avoiding contamination and scratches. Reverse side cleaning: After flipping, adjusting component 9 fine-tunes the parameters of the ultrasonic transmitter 903 to ensure even energy coverage of the chip's reverse side. Plasma and ultrasound continue to work together to thoroughly remove residual contaminants, ensuring no cleaning dead spots. Post-cleaning treatment: After cleaning, the plasma and ultrasonic systems are shut off, inert gas is introduced to balance the pressure, sealing plate 5 is opened, fixing component 7 is loosened, the chip is removed, and the equipment's self-cleaning program is activated to clean any residue inside the cavity, preparing for the next use. This design aims to achieve... The entire cleaning process, from pretreatment to posttreatment, is characterized by low pollution. In the pretreatment stage, the adaptation parameters are set via display 13 to ensure targeted cleaning. In the positioning and fixing stage, the fixing and positioning components 8 work together to ensure the stability and safety of the chip. The vacuum environment is constructed using vacuum unit 10 and a sealed structure to isolate external contaminants. The front and back side cleaning is coordinated by adjusting component 9 and plasma to achieve uniform cleaning. Automated flipping relies on flipping component 6 to avoid manual intervention. In the posttreatment stage, inert gas is introduced to balance the pressure and initiate self-cleaning to ensure the cleanliness of the equipment. The cleaning process is complete, and the cleaning machine components are adapted to achieve the cleaning goals of high cleanliness, high efficiency, and low pollution.

[0040] Working Principle: Initialization and Parameter Setting of the Plasma Cleaner. After starting the plasma cleaner, the controller 12 first performs a system self-test, checking the operating status of core components such as the housing 1, flipping assembly 6, fixing assembly 7, adjusting assembly 9, vacuum unit 10, and monitor 15. The operator inputs the parameters of the chip to be cleaned, including size, thickness, and degree of contamination such as particle content and organic residue, through the display 13 on the front of the housing 1. The controller 12 automatically matches the optimal cleaning scheme based on the input parameters, setting key parameters such as plasma power, ultrasonic frequency, front cleaning time, back cleaning time, and flipping interval. If custom parameters are required, the operator can manually adjust them through the display 13. After the parameters are set, the display 13 displays the set values ​​and the current status of the equipment in real time, providing accurate information for subsequent cleaning.

[0041] The chip is placed and positioned. The operator opens the sealing plate 5 on the front of the housing 1 and places the chip to be cleaned stably in the positioning area of ​​the flip plate 606, ensuring that the center of the chip is roughly aligned with the positioning block 805 of the positioning component 8. After placement, the sealing plate 5 is closed, and the sealing strip 16 fits tightly against the housing 1, initially achieving cavity sealing. The controller 12 then instructs the fixing component 7 to start, and electric push rod 1 702 and electric push rod 2 703 are simultaneously energized. Electric push rod 1 702 drives the gear plate 2 713 forward, and electric push rod 2 703 drives the gear plate 1 706 backward. Because gear 1 707 meshes with gear plate 1 706 and rack 1 708, and gear 2 715 meshes with gear plate 2 713 and rack 2 714, the gear plate... The motion drives gear 1 707 and gear 2 715 to rotate synchronously, which in turn drives rack 1 708 and rack 2 714 to slide along slide rail 705. The rack drives connecting block 1 709, connecting block 2 711, connecting block 3 716, and connecting block 4 717 to move synchronously towards the chip. The connecting blocks respectively drive fixing block 1 710, fixing block 2 712, fixing block 3 718, and fixing block 4 719 to move towards the chip from all sides. When the fixing block is about to contact the chip, the positioning component 8 starts to function. The edge of the chip squeezes the positioning block 805, and the positioning block 805 pushes the pull rod 802 to slide into the mounting block 2 801. The spring 803 is compressed and generates a reverse buffer force. At the same time, the rubber strip 804 on the inner wall of fixing block 1 710 makes flexible contact with the chip surface. The controller 12 adjusts the thrust of electric push rod 1 702 and electric push rod 2 703 in real time through the pressure signal fed back by the monitor 15 to ensure that the fixing force is appropriate, so as to prevent the chip from shifting during the cleaning process and avoid scratching the chip surface film layer, and finally achieve precise positioning and stable fixing of the chip.

[0042] After the vacuum environment is established and the chip is fixed, the controller 12 instructs the vacuum pump 10 to start. The vacuum pump 10 extracts air from the inside of the chamber 1 through the pipe, creating a stable vacuum environment within the cavity. During the vacuuming process, the monitor 15 monitors the air pressure value inside the cavity in real time and feeds the data back to the controller 12 and the display 13. When the air pressure reaches the preset vacuum level, the vacuum pump 10 automatically stops pumping and maintains the vacuum state. The cooperation between the sealing plate 5 and the sealing strip 16 ensures the sealing performance of the cavity, preventing pollutants such as particles and water vapor in the outside air from entering the cavity. At the same time, it avoids leakage of reaction waste gas inside the cavity during subsequent cleaning processes. This not only ensures the cleanliness of the cleaning environment but also eliminates environmental hazards, providing suitable vacuum conditions for the synergistic cleaning of plasma and ultrasound.

[0043] After the front-side collaborative cleaning process and the vacuum environment stabilizes, the controller 12 instructs the adjustment component 9 and the core components of the plasma generation system to start. The hydraulic rod 902 of the adjustment component 9 precisely adjusts the height, horizontal position, and emission angle of the ultrasonic transmitter 903 according to preset parameters: for large-sized chips, the hydraulic rod 902 drives the ultrasonic transmitter 903 to move horizontally to expand the coverage area; for irregularly shaped chips, the emission angle is adjusted to ensure that the ultrasonic energy can cover every area on the front of the chip. When the ultrasonic transmitter 903 is powered on, it generates high-frequency vibrations, forming an ultrasonic field that physically removes particulate contaminants from the front of the chip. Simultaneously, the plasma generation system introduces specific reactive gases, such as oxygen or argon, into the cavity. Under the influence of a strong electric field, the gases ionize to form plasma. The high-energy particles in the plasma chemically react with contaminants such as organic matter and metal oxides on the front of the chip, decomposing them into volatile substances. During the cleaning process, the monitor 15 uses high-definition imaging and sensor technology to monitor the cleaning status of the front of the chip in real time, including the amount of contaminant residue and the chip surface temperature. If incomplete cleaning is detected in certain areas, the controller 12 automatically adjusts the parameters of the ultrasonic transmitter 903 or extends the cleaning time to ensure that the contaminants on the front of the chip are completely removed.

[0044] The automated flipping process begins when the front cleaning time reaches a preset value. After the monitor 15 reports that the front cleaning has met the standard, the controller 12 instructs the plasma generator and ultrasonic transmitter 903 to temporarily stop operating. Subsequently, it instructs the flipping assembly 6 to start, energizing the motor 602. The output of the motor 602 drives the drive rod 604 to rotate. The drive rod 604 transmits power through the connecting rod 605, causing the flipping plate 606 to rotate around the support 609. The limiting blocks 607 and 608 on the left and right sides of the flipping plate 606 slide along the grooves on the inner wall of the support 609, providing guidance and limiting the rotation of the flipping plate 606. When the flipping plate 606 rotates to 180°, the monitor 15 detects a flipping completion signal, and the controller 12 instructs the motor 602 to stop. At this point, the chip is facing upwards. The entire flipping process requires no manual intervention, avoiding the risk of contamination associated with manual flipping. Simultaneously, the precise positioning of the limiting blocks prevents the chip from shaking or falling during the flipping process, ensuring the chip's integrity.

[0045] After flipping the chip, the controller 12 instructs the adjustment component 9 to fine-tune the parameters of the ultrasonic transmitter 903. Based on the contamination distribution characteristics on the reverse side of the chip, the emission angle and energy intensity of the ultrasonic transmitter 903 are adjusted to ensure uniform ultrasonic energy coverage of the chip's reverse side. Then, the plasma generation system and the ultrasonic transmitter 903 are restarted. The strong oxidizing properties of the plasma and the physical stripping effect of the ultrasound work together again to deeply clean the contaminants such as particles, organic matter, and metal oxides on the reverse side of the chip. The monitor 15 continuously monitors the cleaning status of the chip's reverse side, providing real-time feedback on the residual contaminants. If residual contaminants are detected, the controller 12 automatically extends the cleaning time until the reverse side cleaning meets the standards. Due to the flexible adaptability of the adjustment component 9, even if the contamination levels on the front and back sides of the chip differ, targeted cleaning can be achieved through parameter adjustments, thoroughly solving the problem of incomplete single-sided cleaning in traditional equipment.

[0046] After cleaning and equipment reset, once the chip's reverse side cleaning meets the standards, the monitor 15 sends a cleaning completion signal to the controller 12. The controller 12 instructs the plasma generation system and ultrasonic transmitter 903 to shut down, and simultaneously instructs the vacuum unit 10 to stop maintaining a vacuum state. An inert gas, such as nitrogen, is slowly introduced into the cavity through a pipe to balance the internal and external air pressure. When the internal air pressure returns to normal, the controller 12 instructs the fixing component 7 to reverse its operation. Electric push rod 1 702 and electric push rod 2 703 drive in reverse, the gear plate drives the gear and rack to move in reverse, the connecting block drives the fixing block to move away from the chip, the spring 803 of the positioning component 8 returns to its original deformation, the pull rod 802 drives the positioning block 805 to reset, and the connection is released. The chip is secured, allowing the operator to open the sealing plate 5 and remove the cleaned chip. The chip surface has extremely low contaminant residue, with no secondary contamination or surface damage. Finally, the controller 12 instructs the equipment to start the self-cleaning program. The ultrasonic transmitter 903 runs briefly, working in conjunction with the inert gas flow inside the chamber to clean the residual contaminants on the inner wall of the housing 1, the fixing component 7, and the positioning component 8. After self-cleaning is completed, the equipment automatically resets to its initial state, awaiting the next cleaning operation. The entire cleaning process is automated through the controller 12, which integrates the actions of the flipping component 6, the fixing component 7, the adjusting component 9, and the positioning component 8, achieving fully automated control and significantly improving cleaning efficiency and cleanliness, thus meeting the needs of semiconductor mass production scenarios.

[0047] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A low-pollution chip wafer plasma cleaning machine, comprising a housing (1), characterized in that: The bottom of the box (1) is fixedly connected to a mounting plate (2), the bottom of the mounting plate (2) is fixedly connected to a mounting bracket (3), and the four corners of the bottom of the mounting bracket (3) are fixedly connected to bases (4). The front side of the box (1) is rotatably connected to a sealing plate (5). The bottom of the inner wall of the box (1) is provided with a flipping component (6), the inner wall of the flipping component (6) is provided with a fixing component (7), the inner wall of the fixing component (7) is provided with multiple positioning components (8), and the top of the inner wall of the box (1) is provided with... Adjustment component (9), a vacuum device (10) is fixedly connected to the bottom right side of the mounting plate (2), a base plate (11) is fixedly connected to the middle of the inner wall of the mounting bracket (3), a controller (12) is fixedly connected to the top left side of the base plate (11), a display (13) is rotatably connected to the front left end of the box (1), a bracket (14) is installed on the right side of the box (1), a monitor (15) is rotatably connected to the inner wall of the bracket (14), and a sealing strip (16) is installed on the front side of the inner wall of the box (1).

2. The low-pollution chip wafer plasma cleaning machine according to claim 1, characterized in that: The flipping assembly (6) includes a second mounting plate (601), which is fixedly connected to the bottom of the inner wall of the housing (1). A motor (602) is fixedly connected to the right side of the inner wall of the second mounting plate (601). A first mounting block (603) passes through the output end of the motor (602). A drive rod (604) is fixedly connected to the output end of the motor (602). A connecting rod (605) is fixedly connected to the inner wall of the drive rod (604). A flipping plate (606) is fixedly connected to the left side of the outer wall of the connecting rod (605). A first limiting block (607) is fixedly connected to the middle of both the left and right sides of the flipping plate (606). A second limiting block (608) is fixedly connected to the front end of both the left and right sides of the flipping plate (606). A first bracket (609) is fixedly connected to the top left and right sides of the second mounting plate (601).

3. The low-pollution chip wafer plasma cleaning machine according to claim 1, characterized in that: The fixing component (7) includes a fixing plate one (701), which is fixedly connected to the front side of the inner wall of the flip plate (606). An electric push rod two (703) is fixedly connected to the top right side of the fixing plate one (701). A toothed plate one (706) is fixedly connected to the output end of the electric push rod two (703). An electric push rod one (702) is fixedly connected to the top left side of the fixing plate one (701). A toothed plate two (713) is fixedly connected to the output end of the electric push rod one (702). Slide rails (705) are fixedly connected to both the left and right ends of the rear side of the fixing plate one (701). A fixing plate two (704) is fixedly connected to the rear side of the slide rails (705). A connecting block four (717) is slidably connected to the rear side of the outer wall of the fixing plate two (704). A connecting block is installed on the top of the connecting block four (717). A (709) is connected to a fixed block four (719) on the left side of the connecting block four (717), and a fixed block one (710) is connected to the right side of the connecting block one (709). A connecting block two (711) is slidably connected to the front right end of the slide rail (705). A rack two (714) is fixedly connected to the rear side of the connecting block two (711). A connecting block three (716) is slidably connected to the front left end of the slide rail (705). A rack one (708) is fixedly connected to the rear side of the connecting block three (716). A fixed block two (712) is fixedly connected to the right side of the connecting block two (711). A fixed block three (718) is fixedly connected to the left side of the connecting block three (716). A gear two (715) is installed at the top middle of the flip plate (606). A gear one (707) is installed at the top of the gear two (715).

4. The low-pollution chip wafer plasma cleaning machine according to claim 1, characterized in that: The positioning component (8) includes multiple mounting blocks (801), which are fixedly connected to the inner wall of the fixing block (710). A pull rod (802) is slidably connected to the inner wall of the mounting block (801), and a spring (803) is sleeved on the outer wall of the pull rod (802). Multiple rubber strips (804) are fixedly connected to the inner wall of the fixing block (710), and a positioning block (805) is fixedly connected to one of the adjacent sides of the multiple pull rods (802).

5. The low-pollution chip wafer plasma cleaning machine according to claim 1, characterized in that: The adjustment assembly (9) includes a connecting plate (901), which is fixedly connected to the rear side of the inner wall of the housing (1). A hydraulic rod (902) is fixedly connected to the front side of the inner wall of the connecting plate (901), and an ultrasonic transmitter (903) is fixedly connected to the output end of the hydraulic rod (902).

6. The low-pollution chip wafer plasma cleaning machine according to claim 2, characterized in that: Both of the first limiting blocks (607) are slidably connected to the inner wall of the first bracket (609), and both of the second limiting blocks (608) are slidably connected to the inner wall of the first bracket (609).

7. The low-pollution chip wafer plasma cleaning machine according to claim 3, characterized in that: The gear one (707) is meshed with the gear plate one (706) and the rack one (708), and the gear two (715) is meshed with the gear plate two (713) and the rack two (714).

8. The low-pollution chip wafer plasma cleaning machine according to claim 3, characterized in that: The first toothed plate (706) is fixedly connected to the front side of the first connecting block (709), and the second toothed plate (713) is fixedly connected to the front side of the fourth connecting block (717).

9. The low-pollution chip wafer plasma cleaning machine according to claim 4, characterized in that: Multiple springs (803) are mounted on the top of mounting block two (801), and multiple positioning blocks (805) are symmetrically distributed on the inner side of fixing block one (710).

10. A low-pollution chip wafer plasma cleaning process, applied to the low-pollution chip wafer plasma cleaning machine according to any one of claims 1-9, characterized in that: The cleaning processes include the following: S1: Pre-treatment preparation, open the sealing plate (5), check whether the inner wall of the box (1) and the fixing components (7) are clean, and set the plasma power, ultrasonic frequency, cleaning time and other suitable parameters according to the chip size and degree of contamination through the display (13) to make basic preparations for cleaning. S2: Chip positioning and fixing. Place the chip in the positioning area of ​​the flip plate (606), start the fixing component (7), and the electric push rod drives the toothed plate (706), gear (707), and rack (708) to work together. Fixing block (710) and fixing block (712) clamp from all sides. The positioning component (8) is flexibly positioned by spring (803) and rubber strip (804). S3: Construct a vacuum environment, close the sealing plate (5), seal the sealing strip (16) tightly against the box, start the vacuum device (10) to draw a vacuum, form a stable vacuum environment, prevent external particles and water vapor from entering, avoid waste gas leakage, and provide clean conditions for plasma reaction and cleaning. S4: Front-side collaborative cleaning, start the adjustment component (9), the hydraulic rod (902) adjusts the height, angle and position of the ultrasonic transmitter (903), combined with the strong oxidizing properties of plasma, the two work together to uniformly remove the contaminants of particles and organic matter on the front of the chip, and the monitor (15) provides real-time feedback on the status. S5: Automatic flipping. After the front is cleaned, the controller (12) instructs the flipping component (6). The motor (602) drives the drive rod (604) and the connecting rod (605) to make the flipping plate (606) rotate around the bracket (609). The first limit block (607) and the second limit block (608) are precisely limited, and the flipping is smooth 180° without manual intervention, avoiding pollution and scratches. S6: Reverse side co-cleaning. After flipping, adjust the parameters of the ultrasonic transmitter (903) of the adjustment component (9). The ultrasonic energy evenly covers the reverse side of the chip. The plasma and ultrasonic waves continue to clean in tandem, removing residual contaminants on the reverse side, thus eliminating cleaning dead corners. S7: Post-cleaning treatment. After cleaning, turn off the plasma and ultrasonic system, introduce inert gas to balance the pressure, open the sealing plate (5), loosen the fixing component (7), take out the chip, start the device self-cleaning program, clean the residue in the cavity, and prepare for the next use.

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