Wafer film pasting auxiliary device

Abstract

The application discloses a wafer film pasting auxiliary device and belongs to the related technical field of integrated circuit packaging. The wafer film pasting auxiliary device comprises an external auxiliary unit and an internal auxiliary unit. The external auxiliary unit is arranged on one side of a semi-automatic film pasting machine and comprises a first rotary motor, a pair of parallel clamps arranged on the output end of the first rotary motor and a second rotary motor. The two clamps are respectively abutted against the two sides of the handle of a cover plate. The output end of the second rotary motor is provided with a push plate used for pushing a rotary handle on the cover plate. The internal auxiliary unit is arranged on the other side of the semi-automatic film pasting machine. The output end of a second linear mechanism is provided with a dragging plate used for pushing and pulling a sliding block of the semi-automatic film pasting machine. The sliding end of a third linear mechanism is assembled with an obliquely arranged fourth linear mechanism. One side of the output end of the fourth linear mechanism is provided with an air clamp used for clamping the blue film after the blue film is cut off. The wafer film pasting auxiliary device can make full use of the semi-automatic film pasting machine, improve the automation level of the semi-automatic film pasting machine, reduce manual operation and improve work safety.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit packaging technology, and in particular to a wafer bonding auxiliary device. Background Technology

[0002] In integrated circuit packaging, one process involves cutting the chips off the wafer. Before cutting, to prevent the chips from scattering during the cutting process, a blue film needs to be applied to the wafer. To facilitate application and protect the wafer, a blue film ring is placed at intervals on the outer periphery of the wafer during application. The blue film connects the wafer and the blue film ring.

[0003] The most common wafer lamination equipment currently available is the semi-automatic laminator, which automatically moves the wafer and blue film ring to the working position and automatically completes the unwinding and lamination of the blue film. However, this equipment still involves many manual steps between the loading of the wafer and blue film ring and the unloading of the entire wafer after lamination. These steps include opening and closing the cover plate, manually cutting the blue film in a circular shape, cutting the pasted blue film from the unwound portion, and removing any remaining blue film. The level of automation remains low. Furthermore, manual operation after the cover plate is open poses a safety hazard, as workers may come into contact with the blades and risk injury. Therefore, a device is needed to improve the automation level of wafer lamination while making full use of existing equipment. Summary of the Invention

[0004] To address the aforementioned shortcomings, this invention provides a wafer lamination auxiliary device that can fully utilize a semi-automatic laminator and improve its automation level, reduce manual operation, and enhance work safety.

[0005] In order to achieve the objectives of this invention, the following technologies are proposed: A wafer bonding auxiliary device, comprising: An external auxiliary unit is located on one side of the semi-automatic film applicator and includes a first rotary motor. Its output end is provided with a pair of parallel clamping plates and a second rotary motor. The two clamping plates respectively abut against the handles on both sides of the cover plate of the semi-automatic film applicator. The output end of the second rotary motor is provided with a push plate for pushing the rotary handle on the cover plate. An internal auxiliary unit, located on the other side of the semi-automatic film applicator, includes a first linear mechanism whose output direction is perpendicular to one side of the semi-automatic film applicator. Below the output end of the first linear mechanism are a second linear mechanism and a third linear mechanism. The output end of the second linear mechanism is equipped with a drag plate for pushing and pulling the slider of the semi-automatic film applicator. The sliding end of the third linear mechanism is equipped with an inclined fourth linear mechanism. An air clamp is installed on one side of the output end of the fourth linear mechanism for clamping the blue film after it is cut.

[0006] Furthermore, a first rotating plate is provided at the output end of the first rotary motor.

[0007] Furthermore, both clamps are located on one side of one end of the first rotating plate.

[0008] Furthermore, a connecting plate is provided on one end face of the first rotating plate, and a connecting rod is provided on one end of the connecting plate, the length direction of which is parallel to the output shaft axis of the first rotary motor, and the second rotary motor is installed on one end of the connecting rod.

[0009] Furthermore, the output end of the first linear mechanism is equipped with an n-type hanger.

[0010] Furthermore, one side of the n-type hanger is provided with an inverted L-shaped frame, and the second linear mechanism is installed at the lower end of the vertical part of the inverted L-shaped frame.

[0011] Furthermore, the third linear mechanism is assembled at the lower end of the n-type hanger.

[0012] Furthermore, a vertical groove is provided at one end of the drag plate, and the distance between the two opposite surfaces in the vertical groove is the same as the distance between the two sides of the slider.

[0013] Furthermore, the output end of the fourth linear mechanism is equipped with a frame plate, and the pneumatic clamp is installed at one end of the frame plate.

[0014] The beneficial effects of this technical solution are as follows: 1. The external auxiliary unit of this wafer laminating auxiliary device can automatically open and close the cover plate of the semi-automatic laminating machine. The push plate driven by the second rotary motor can automatically cut the blue film in a circle. The internal auxiliary unit can operate the slider to automatically cut the blue film to be applied and the unwound blue film, avoiding the hand from touching the first roller. During the cutting, it can clamp the wafer and the remaining blue film on the outer periphery of the blue film ring and automatically lift it up, avoiding the accidental contact of the second roller on the inner side of the cover plate when the arm is raised when manually removing waste blue film, thus improving safety.

[0015] 2. The application still makes full use of the commonly used semi-automatic film applicator, without abandoning the equipment. It simply increases the degree of automation, making the application have good versatility. Attached Figure Description

[0016] Figure 1 The overall three-dimensional representation of the embodiment of this application is shown. Figure 1 .

[0017] Figure 2 The overall three-dimensional representation of the embodiment of this application is shown. Figure 2 .

[0018] Figure 3 A perspective view of the external auxiliary unit according to an embodiment of this application is shown.

[0019] Figure 4 A perspective view of the internal auxiliary unit in an embodiment of this application is shown.

[0020] Figure 5 A three-dimensional representation of a semi-automatic film applicator according to an embodiment of this application is shown. Figure 1 .

[0021] Figure 6 An embodiment of this application is shown. Figure 5 Enlarged view of part A.

[0022] Figure 7 A three-dimensional representation of a semi-automatic film applicator according to an embodiment of this application is shown. Figure 2 .

[0023] The diagram shows the following components: External auxiliary unit-1, first bracket-11, first rotary motor-12, first rotating plate-13, clamping plate-14, connecting plate-15, connecting rod-16, second rotary motor-17, push plate-18, internal auxiliary unit-2, second bracket-20, first linear mechanism-21, n-type hanger-22, inverted L-shaped frame-23, second linear mechanism-24, drag plate-25, vertical slot-251, third linear mechanism-26, hanging plate-261, fourth linear mechanism-27, frame plate-28, and pneumatic system. Clamp-29, Semi-automatic film applicator-3, Operation port-31, Film applicator assembly-32, Unwinding compartment-33, Side groove-34, Side rod-35, Slider-36, First roller cutter-37, Film applicator table-4, Main operating table-41, Platform-42, Circular slope-43, Circular groove-44, Groove-45, Secondary table-46, Knife groove-47, Cover plate-5, Handle-51, Rotating shaft-52, First rotating rod-53, Rotating grip-54, Second rotating rod-55, Fixing frame-56, Second roller cutter-57, Blue film ring-6. Detailed Implementation

[0024] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0025] like Figures 1-4 The illustrated wafer bonding auxiliary device includes an external auxiliary unit 1 and an internal auxiliary unit 2. This device is used to improve, for example,... Figures 5-7The semi-automatic wafer laminator 3 shown demonstrates a high level of automation in wafer lamination, reducing manual steps and improving operational safety. The semi-automatic wafer laminator 3 is a common wafer lamination device, briefly described below: An operation port 31 is located on the upper surface of the semi-automatic wafer laminator 3, extending inwards inside the machine. A lamination assembly 32 is located at one end above the operation port 31, containing a set of guide rollers, pressure rollers, and a vacuum suction cup. The guide rollers, typically a pair, guide the blue film through the middle. The pressure rollers can move up and down, allowing the wafer to move back and forth within the semi-automatic wafer laminator 3. The pressure rollers press down on the surface of the blue film, laminating it onto the wafer. The vacuum suction cup can lift the blue film a short distance before the wafer moves. 2. One end is provided with an unwinding bin 33 for storing and unwinding rolls of blue film. The unwound blue film is guided by guide rollers. The film application assembly 32 is also provided with a linear guide rail inside. Its sliding end is connected to a side rod 35 that passes through a side groove 34 on one side of the film application assembly 32. A slider 36 is installed at one end of the side rod 35. A first roller 37 for cutting the blue film is assembled at the lower end of the slider 36. In the prior art, the slider 36 is manually held to move the first roller 37. A film application table 4 is installed inside the operating port 31. Its lower end is fixed on a set of automatic guide rails at the bottom of the inner cavity of the semi-automatic film application machine 3. The film application table 4 includes a main operating table 41. A wafer-placement platform 42 is provided at the center of the upper end of the worktable 41. The outer periphery of the platform 42 is formed with an annular slope 43 that decreases in height from the inside to the outside. An annular groove 44 for placing the blue film ring 6 is provided on the outer periphery of the annular slope 43. The main worktable 41 is also provided with a pair of grooves 45 that penetrate the annular slope 43 and the annular groove 44 and extend towards the operator, so as to facilitate the operator to remove the object placed on the main worktable 41. A secondary platform 46 is provided at intervals at the end of the main worktable 41 away from the operator. A slit groove 47 is formed between the main worktable 41 and the secondary platform 46, which coincides with the lower part of the moving path of the first roller 37. The semi-automatic laminating machine 3 also includes a cover plate for opening and closing the operation port 31. 5. The two side plates of the cover plate 5 are rotatably fitted to both sides of the film applicator 32. When the cover plate 5 is closed, a handle 51 is installed on the end facing the operator. A rotating shaft 52 is passed through the top surface of the cover plate 5. A first rotating rod 53 located outside the cover plate 5 and a second rotating rod 55 located inside the cover plate 5 are fixedly mounted on the outer periphery of the rotating shaft 52. A rotating handle 54 is installed at one end of the first rotating rod 53. A fixing frame 56 is installed on the second rotating rod 55. A second roller cutter 57 is installed at the lower end of the fixing frame 56 for manually cutting the blue film on the surface of the blue film ring 6 in a circular motion. An observation window is also embedded on the surface of the cover plate 5 for observing the interior of the semi-automatic film applicator 3 when operating the rotating handle 54.

[0026] like Figures 1-3As shown, the external auxiliary unit 1 is located on one side of the semi-automatic film applicator 3, including a first bracket 11. A first rotary motor 12 is installed on the upper end of the first bracket 11, and a first rotating plate 13 is provided at its output end. A pair of parallel clamping plates 14 are provided on one side of one end of the first rotating plate 13. The two clamping plates 14 respectively abut against the two sides of the handle 51 of the cover plate 5. A connecting plate 15 is provided on one end face of the first rotating plate 13. A connecting rod 16 with a length direction parallel to the output shaft axis of the first rotary motor 12 is provided at one end of the connecting plate 15. A second rotary motor 17 is installed on one end of the connecting rod 16, and a push plate 18 for pushing the rotating handle 54 on the cover plate 5 is provided at its output end.

[0027] like Figure 1 , Figure 2 , Figure 4 As shown, the internal auxiliary unit 2 is located on the other side of the semi-automatic film applicator 3, including a second bracket 20. A first linear mechanism 21 is mounted on the upper end of the second bracket 20, and its output direction is perpendicular to one side of the semi-automatic film applicator 3. An n-shaped hanger 22 is provided at the output end of the first linear mechanism 21. An inverted L-shaped frame 23 is provided on one side of the n-shaped hanger 22. A second linear mechanism 24 is mounted on the lower vertical part of the inverted L-shaped frame 23. A drag plate 25 is provided at the output end of the second linear mechanism 24. One end of the drag plate 25 has an upper and lower opening. The vertical groove 251 is through, and the distance between the two opposite surfaces in the vertical groove 251 is the same as the distance between the two sides of the slider 36 of the semi-automatic film applicator 3. The lower end of the n-shaped hanger 22 is equipped with a third linear mechanism 26. The sliding end of the third linear mechanism 26 is equipped with a hanging plate 261. The lower end of the hanging plate 261 is equipped with an inclined fourth linear mechanism 27. The output end of the fourth linear mechanism 27 is provided with a frame plate 28. One end of the frame plate 28 is equipped with an air clamp 29, which is used to clamp the blue film from one end of the knife groove 47 after it is cut.

[0028] In this embodiment, the first linear mechanism 21, the second linear mechanism 24, and the fourth linear mechanism 27 all use single-axis linear cylinders, while the third linear mechanism 26 uses a rodless linear cylinder.

[0029] Work style: Combination Figure 1 and Figure 4 In the initial state, the blue film ring 6 is placed in the ring groove 44 and the cover plate 5 is in the open state.

[0030] Then, the wafer is placed on the stage 42, and the semi-automatic laminator 3 moves the laminating stage 4 and performs the lamination operation. The specific process is not detailed here, as it is a built-in function of the equipment. After lamination, the laminating stage 4 returns to its original position. At this time, the first linear mechanism 21 retracts its output end and, through the external auxiliary unit 1, closes the cover plate 5. Figure 2 As shown.

[0031] Specifically, the cover plate 5 is closed by rotating the first rotary motor 12, which drives the handle 51 through the clamping plate 14, causing the entire cover plate 5 to rotate until the cover plate 5 is closed.

[0032] Then, the push plate 18 is controlled by the second rotary motor 17 so that the second roller 57 cuts the blue film in a circular shape on the surface of the blue film ring 6. After the cutting is completed, the cover plate 5 is reopened by the first rotary motor 12.

[0033] Next, the first linear mechanism 21 extends its output end, and then the second linear mechanism 24 extends the drag plate 25, causing the vertical groove 251 to clamp the slider 36. Then, the first linear mechanism 21 drives the drag plate 25 to move the slider 36, so that the blue film is cut. When the blue film is just cut, the fourth linear mechanism 27 extends the air clamp 29, which clamps the corner of the blue film to be discarded from above the knife groove 47. As the output end of the first linear mechanism 21 continues to move as a whole, the blue film can be lifted upward by the contraction of the fourth linear mechanism 27. The blue film to be discarded here is a piece of blue film with a rectangular outline and lacking a circle in the middle.

[0034] In existing technology, when manually removing the discarded blue film, it is torn off along the diagonal of a rectangle. Therefore, when the blue film is clamped using the device of this application, while the air clamp 29 moves synchronously with the movement of the drag plate 25, the third linear mechanism 26 also causes the air clamp 29 to move on the horizontal plane in a direction perpendicular to the output direction of the first linear mechanism 21. This allows the blue film to be lifted and moved along the diagonal of the main operating table 41. After the discarded blue film is completely torn off, the air clamp 29 is released, and the staff collects the waste.

[0035] The above are only some of the embodiments listed in this application and are not intended to limit this application.

Claims

1. A wafer lamination auxiliary device, characterized in that, include: An external auxiliary unit (1) is located on one side of the semi-automatic film applicator (3), including a first rotary motor (12), the output end of which is provided with a pair of parallel clamps (14) and a second rotary motor (17). The two clamps (14) respectively abut against the handles (51) on both sides of the cover plate (5) of the semi-automatic film applicator (3). The output end of the second rotary motor (17) is provided with a push plate (18) for pushing the rotating handle (54) on the cover plate (5). An internal auxiliary unit (2) is located on the other side of the semi-automatic film applicator (3). It includes a first linear mechanism (21) whose output direction is perpendicular to one side of the semi-automatic film applicator (3). A second linear mechanism (24) and a third linear mechanism (26) are provided below the output end of the first linear mechanism (21). A drag plate (25) is provided at the output end of the second linear mechanism (24) for pushing and pulling the slider (36) of the semi-automatic film applicator (3). A fourth linear mechanism (27) is mounted at the sliding end of the third linear mechanism (26) and an air clamp (29) is installed on one side of the output end of the fourth linear mechanism (27) for clamping the blue film after it is cut.

2. The wafer lamination auxiliary device according to claim 1, characterized in that, The first rotary motor (12) has a first rotating plate (13) at its output end.

3. The wafer lamination auxiliary device according to claim 2, characterized in that, Both clamps (14) are located on one side of one end of the first rotating plate (13).

4. The wafer lamination auxiliary device according to claim 2, characterized in that, The first rotating plate (13) has a connecting plate (15) on one end face. The connecting plate (15) has a connecting rod (16) with its length direction parallel to the output shaft axis of the first rotary motor (12) at one end. The second rotary motor (17) is installed at one end of the connecting rod (16).

5. The wafer lamination auxiliary device according to claim 1, characterized in that, The first linear mechanism (21) has an n-type hanger (22) at its output end.

6. The wafer lamination auxiliary device according to claim 5, characterized in that, The n-type hanger (22) has an inverted L-shaped frame (23) on one side, and the second linear mechanism (24) is installed at the lower end of the vertical part of the inverted L-shaped frame (23).

7. The wafer lamination auxiliary device according to claim 5, characterized in that, The third linear mechanism (26) is mounted on the lower end of the n-type hanger (22).

8. The wafer lamination auxiliary device according to claim 1, characterized in that, The drag plate (25) has a vertical groove (251) that runs vertically through one end. The distance between the two opposite surfaces in the vertical groove (251) is the same as the distance between the two sides of the slider (36).

9. The wafer bonding auxiliary device according to claim 1, characterized in that, The output end of the fourth linear mechanism (27) is provided with a frame plate (28), and the air clamp (29) is installed at one end of the frame plate (28).

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