Wafer cassette handling system
By designing a wafer cassette handling system with an inclined lifting mechanism and a horizontal platform, the problems of wafer cassette falling and operational difficulties during handling were solved, achieving stable and reliable wafer handling and sampling inspection, and reducing the risk of contamination and damage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING HEQI PRECISION TECH LTD
- Filing Date
- 2026-02-09
- Publication Date
- 2026-05-29
Smart Images
Figure CN122121604A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor manufacturing, and in particular, to a wafer cassette handling system. Background Technology
[0002] In semiconductor manufacturing, open wafer cassettes are commonly used to move multiple wafers housed within them to a specific location. CN218385147U discloses a wafer handling device suitable for a 200mm open wafer cassette. This device includes an open wafer cassette, a carrier, a robotic arm, and a tilting connection structure. The bottom wall of the wafer cassette is connected to the carrier, which is then mounted to the robotic arm via the tilting connection structure. During wafer handling, the wafer cassette is configured to tilt relative to the handling direction, raising the side of the wafer cassette with the opening. The wafers arranged within the wafer cassette are thus tilted relative to the handling direction. Under the influence of gravity, the risk of the wafers falling from the opening of the wafer cassette is reduced.
[0003] However, when wafer cassettes arrive at a designated site or require random inspection during transport, multiple wafers need to be removed and placed back into the cassettes by handling devices or operators who must overcome the cassettes' tilt. This increases the difficulty of handling and random inspection operations, making it difficult to ensure the consistency of the removed wafers, and may also cause contamination or damage to the wafers due to the challenging handling and random inspection operations. Summary of the Invention
[0004] In view of this, the present invention provides a wafer cassette handling system suitable for open wafer cassettes, to at least partially solve the above-mentioned technical problems. The wafer cassette handling system includes an inclined lifting mechanism and a horizontal platform. The wafer cassette has an opening on a first side along the transport direction and is closed on a second side along the transport direction. The inclined lifting mechanism is adapted to tilt and support the wafer cassette such that the first side of the wafer cassette is higher than the second side along the height direction of the wafer cassette handling system. The inclined lifting mechanism includes a first surface oblique to the height direction. The horizontal platform is adapted to horizontally support the wafer cassette such that the first and second sides are at the same height along the height direction. The horizontal platform includes a first channel allowing at least a portion of the inclined lifting mechanism to move through along the height direction. The inclined lifting mechanism can rise along the height direction through the first channel such that the first surface supports the bottom wall of the wafer cassette, separating the wafer cassette from the horizontal platform. The inclined lifting mechanism can also descend along the height direction out of the first channel such that the first surface separates from the bottom wall of the wafer cassette, and the wafer cassette is horizontally supported by the horizontal platform.
[0005] By designing a wafer cassette handling system comprising an inclined lifting mechanism and a horizontal platform, when the wafer cassette is supported by a first surface, it is in a first state where the first side is higher than the second side along the height direction, suitable for the handling process. When the wafer cassette is supported by the horizontal platform, it is in a second state where the first and second sides are at the same height along the height direction, suitable for pick-up / placement or sampling operations. The state of the wafer cassette can be switched by unidirectional movement of the inclined lifting mechanism along the height direction. This wafer cassette handling system reduces the risk of wafers falling from the first side during handling, while also reducing the difficulty for the robotic arm to overcome the tilt of the wafer cassette to pick up or place wafers during pick-up / placement and sampling operations. Furthermore, it is simple in construction, low in cost, and highly stable.
[0006] In one example, the wafer cassette handling system includes a transfer mechanism. The transfer mechanism is mounted to the bottom of the inclined lifting mechanism and drives the inclined lifting mechanism to move along the handling direction.
[0007] In one example, the transmission mechanism includes a drive motor and a synchronous belt module.
[0008] The transfer mechanism is installed at the bottom of the inclined lifting mechanism, thereby providing power for moving the wafer cassette to the designated site without interfering with the lifting mechanism's vertical movement relative to the horizontal platform. The transfer mechanism, consisting of a drive motor and a synchronous belt module, is simple in construction, easy to assemble, and adaptable to various spaces and sites in the semiconductor manufacturing process.
[0009] In one example, the bottom wall of the wafer cassette includes a first positioning surface and a second positioning surface spaced apart along the transport direction. A first limiting block and a second limiting block protrude from the first surface toward the top side and are spaced apart along the transport direction. The first limiting block and the second limiting block abut against the first positioning surface and the second positioning surface, respectively, to support the wafer cassette.
[0010] One of the first and second limiting blocks, which protrude from the first surface toward the top, and is closer to the second side, abuts against the corresponding positioning surface of the bottom wall of the wafer cassette to support the wafer cassette at the first surface. The function of the first and second limiting blocks closer to the first side is to limit the wafer cassette when it tends to move in the opposite direction due to events such as collisions, impacts, or sudden stops of the transport mechanism, ensuring that the wafer cassette is stably supported.
[0011] In one example, the bottom wall of the wafer cassette includes a third positioning surface and a fourth positioning surface spaced apart along the width direction of the wafer cassette. A third limiting block and a fourth limiting block protrude from the first surface toward the top side and are spaced apart along the width direction. The third limiting block and the fourth limiting block abut against the third positioning surface and the fourth positioning surface, respectively, to position the wafer cassette.
[0012] Furthermore, the third and fourth limiting blocks, which protrude from the first surface toward the top and are spaced apart along the width direction, enable precise positioning of the inclined lifting mechanism and the wafer cassette in the width direction. The third and fourth limiting blocks can pass through the first channel set in the horizontal stage along the height direction, thereby defining the positional relationship between the wafer cassette and the horizontal stage in the width direction. This reduces assembly complexity and ensures high consistency in the spatial position of the wafer cassette. This wafer cassette handling system can accurately and reliably switch the wafer cassette between the first and second states multiple times, laying the foundation for subsequent handling, picking, and sampling operations.
[0013] In one example, the bottom wall of the wafer cassette includes a third positioning surface and a fourth positioning surface spaced apart along the width direction of the wafer cassette, and a third limiting block protrudes from the first surface and abuts against at least one of the third positioning surface and the fourth positioning surface to position the wafer cassette.
[0014] Alternatively, a third limiting block protruding from the first surface can be provided, with a component such as a slot on the bottom wall of the wafer cassette matching the third limiting block. This allows the third limiting block to abut against the third and fourth positioning surfaces, which are spaced apart along the width direction, thereby achieving precise positioning of the inclined lifting mechanism and the wafer cassette in the width direction. Similarly, a wafer cassette handling system configured in this way can accurately and reliably switch the wafer cassette between the first and second states multiple times, providing a basis for subsequent handling, picking, and sampling operations.
[0015] In one example, viewed along the height direction, the third and fourth limit blocks are arranged close to the second side.
[0016] When the tilting lifting mechanism is driven to rise so that the first surface abuts against the bottom wall of the wafer cassette, the positioning block on the first surface adjacent to the first side along the transport direction will first abut against the bottom wall, adjusting the wafer cassette's orientation from a horizontal second state to a tilted first state. The positioning block positioned along the transport direction near the second side will limit the wafer cassette's orientation from tilting beyond the first state. Therefore, the third and fourth limiting blocks can assist the first and second limiting blocks, specifically the one near the second side, in jointly resisting the wafer cassette tilting beyond the first state. This ensures the stability of the wafer cassette's state switching.
[0017] In one example, a first position sensor is disposed on a first surface.
[0018] The first position sensor is used to sense whether the wafer cassette is properly in the first state and can send signals to components such as control devices to warn or stop the drive mechanism, reducing the risk of wafer contamination or damage during improper operation.
[0019] In one example, the first position sensor is an optical sensor.
[0020] Compared to contact-based capacitive or voltage sensors, optical sensors can achieve position sensing without contacting the wafer cassette, which further reduces the risk of wafer contamination or damage.
[0021] In one example, a first position sensor is positioned between a first limiting block and a second limiting block.
[0022] The first position sensor is arranged between the first and second limiting blocks, which act as carriers and limit the wafer cassette along the transport direction. The first position sensor can more accurately sense whether the wafer cassette is in the first state, so as to avoid the wafer cassette being in a state where one end is lifted and tilted while the other end is not supported by the first and second limiting blocks, and thus avoid the wafer from falling and being damaged.
[0023] In one example, a first position sensor is disposed on the side of at least one of the third and fourth limiting blocks away from that block along the width direction of the wafer cassette.
[0024] The first position sensor arranged in this way can detect whether the bottom wall of the wafer box is in full contact with the first surface, so as to ensure that the wafer box is stably supported by the unloading lifting mechanism, thereby improving the stability of the wafer box handling system.
[0025] In one example, the wafer cassette includes a fifth positioning surface, which is arranged on the first side and perpendicular to the transport direction. A fifth limiting block and a sixth limiting block protrude from the horizontal stage toward the top side and are spaced apart on both sides of the first channel along the width direction of the wafer cassette. Both the fifth limiting block and the sixth limiting block abut against the fifth positioning surface to position the wafer cassette.
[0026] When the inclined lifting mechanism is driven to descend so that the horizontal stage touches the bottom wall of the wafer cassette, the first side of the wafer cassette will eventually contact the horizontal stage. The fifth and sixth limiting blocks, which are arranged to abut against the fifth positioning surface on the first side of the wafer cassette, can guide the first side of the wafer cassette to fall smoothly, avoiding vibration during the fall that could contaminate or even damage the wafer.
[0027] In one example, the wafer cassette includes a first wall and a second wall spaced apart along the width direction, and a seventh locating block and an eighth locating block protruding from the horizontal stage toward the top side and spaced apart on both sides of the first channel along the width direction of the wafer cassette. The seventh locating block and the eighth locating block abut against the first wall and the second wall, respectively, to position the wafer cassette.
[0028] Furthermore, the seventh and eighth limiting blocks, which protrude from the first surface toward the top and are spaced apart along the width direction, enable precise positioning of the horizontal stage and the wafer cassette in the width direction. This reduces assembly complexity and ensures a high degree of consistency in the spatial position of the wafer cassette. This wafer cassette handling system can accurately and reliably switch the wafer cassette between the first and second states multiple times, laying the foundation for subsequent handling, placement, and sampling operations.
[0029] In one example, a second position sensor is set on the horizontal platform.
[0030] In one example, the second position sensor is arranged between the fifth and seventh limit blocks, and / or between the sixth and seventh limit blocks.
[0031] Similarly, the second position sensor functions to sense whether the wafer cassette is properly in the second state and can send signals to components such as control devices to warn or stop the drive mechanism, reducing the risk of wafer contamination or damage during improper operation.
[0032] In one example, the horizontal platform is connected to the inclined lifting mechanism so that the transfer mechanism drives the horizontal platform and the inclined lifting mechanism to move synchronously in the transport direction.
[0033] In semiconductor manufacturing processes, a horizontal stage can be connected to a tilting lifting mechanism, allowing both the horizontal stage and the tilting lifting mechanism to move together under the drive of the transfer mechanism. When frequent wafer sampling is required, the wafer cassette handling system configured in this way is suitable for being controlled to switch to a second state suitable for sampling and wafer placement at any position on the transfer mechanism.
[0034] In one example, the horizontal platform is independent of the inclined lifting mechanism, so that when the inclined lifting mechanism moves in the transport direction, the horizontal platform does not move in the transport direction.
[0035] In semiconductor manufacturing processes, horizontal stages can be positioned at one or more points along the transport direction. This configuration allows wafer cassette handling systems to be supported by horizontal stages at designated points along the transport path. The transfer mechanism only needs to move the inclined lifting mechanism along the transport direction. This wafer cassette handling and system design is simple, consumes less energy, and is suitable for post-validation production lines.
[0036] In one example, viewed along the height direction, the area of the first channel is S1, in mm. 2 The area of the first surface is S2, in mm. 2 , 0.4≤S2 / S1≤1.
[0037] In one example, the angle between the first surface and the height direction is α, where 2°≤α≤4°. Attached Figure Description
[0038] It should be understood that the following figures only illustrate certain embodiments of the invention and should not be construed as limiting the scope.
[0039] It should be understood that the same or similar reference numerals are used in the accompanying drawings to denote the same or similar elements.
[0040] It should be understood that the accompanying drawings are only schematic, and the dimensions and scales of the elements in the drawings are not necessarily precise.
[0041] Figure 1 This is a schematic diagram of the wafer cassette handling system disclosed in this invention.
[0042] Figure 2 for Figure 1 A schematic diagram of the structure of the wafer cell.
[0043] Figure 3 for Figure 1 The diagram shows the structure of the inclined lifting mechanism, horizontal platform, and transmission mechanism.
[0044] Figure 4 for Figure 1 Another structural diagram of the inclined lifting mechanism, horizontal platform, and transmission mechanism in the system.
[0045] Figure 5 for Figure 1 Another structural diagram of the inclined lifting mechanism, horizontal platform, and transmission mechanism in the system.
[0046] Figure 6 for Figure 1 The diagram shows the structure of the wafer cassette, inclined lifting mechanism, horizontal stage, and transmission mechanism, with some components omitted. Detailed Implementation
[0047] Numerous specific details are set forth below to provide an understanding of the structure, function, and use of the embodiments described and illustrated in the specification and figures. It is to be understood that the embodiments described and illustrated herein are non-limiting examples, and thus it will be appreciated that the particular structural and functional details disclosed herein are representative and exemplary. Variations and changes may be made to these embodiments without departing from the scope of the claims.
[0048] refer to Figure 1 The present invention provides a 100 wafer cassette handling system 10 suitable for open wafer cassettes.
[0049] In semiconductor manufacturing, open cassettes 100 are used to hold multiple wafers 20, especially 200mm diameter wafers 20. Specifically, refer to... Figure 2 The open wafer cassette 100 includes a housing 101 and a carrier 102. The housing 101 includes a top wall 101a and a bottom wall 101b arranged opposite each other along the height direction of the housing 101, a pair of side walls 101c arranged opposite each other along the width direction of the housing 101, and a rear side wall 101d connected to the top wall 101a, the pair of side walls 101c, and at least a portion of the bottom wall 101b. Multiple wafers 20 enter or exit the wafer cassette 100 through an opening 104 formed by the pair of side walls 101c, the top wall 101a, and the bottom wall 101b. The bottom wall 101b of a standard open wafer cassette 100 includes a structural beam 1011 extending along the width direction of the wafer cassette 100 and adjacent portions 1012 extending from both ends of the structural beam 1011 and connected to the bottom edges of the corresponding side walls 101c. The carrier 102 can be a plurality of grooves 102a symmetrically distributed along the height direction in a stack of sidewalls 101c. The two sides of the plurality of wafers 20 are supported by a pair of corresponding grooves 102a to carry the plurality of wafers 20 onto the wafer cassette 100. In this invention, the side where the opening 104 is located is defined as the first side, and the side where the rear sidewall 101d is located is defined as the second side.
[0050] For ease of understanding, the following explanation is provided: In the figure, the X-axis represents the width direction of the wafer cassette transport system 10; the Y-axis represents the front-to-back direction of the wafer cassette transport system 10, which is also the transport direction of the wafer cassette 100 within the wafer cassette transport system 10; and the Z-axis represents the height direction of the wafer cassette transport system 10. The width direction, front-to-back direction, and height direction of the wafer cassette transport system 10 are all perpendicular to each other. The positive direction of the Z-axis indicates the direction from the bottom wall 101d of the wafer cassette 100 to its top wall 101a. The terms "top," "upper," "bottom," or "lower" used in any element of this disclosure can be used as a reference here.
[0051] When multiple wafers 20 need to be moved to a designated site, wafer cassette 100 needs to be loaded into wafer cassette handling system 10. It is expected that: wafer cassette 100 can be automatically and accurately installed into wafer cassette handling system 10 without manual operation; when wafer cassette 100 moves along the handling direction, the first side of wafer cassette 100 is always higher than the second side along the height direction; when multiple wafers 20 need to be removed from wafer cassette 100 or multiple wafers 20 need to be placed into wafer cassette 100, the first side and the second side of wafer cassette 100 are always at the same height along the height direction.
[0052] In view of this, refer to Figure 1 and Figure 3This invention provides a wafer cassette handling system 10. The wafer cassette handling system 10 includes an inclined lifting mechanism 200, a horizontal platform 300, and a transport mechanism 400. The inclined lifting mechanism 200 and the horizontal platform 300 are configured to move relative to each other along the height direction. Specifically, the inclined lifting mechanism 200 includes a first surface 201 obliquely intersecting the height direction, and the horizontal platform 300 includes a first channel 301. In a projection plane perpendicular to the height direction, the orthographic projection S1 of the first surface 201 is smaller than the orthographic projection S2 of the first channel 301. Therefore, the first surface 201 can pass through the first channel 301 along the height direction. When the first surface 201 is higher than the top surface of the horizontal platform 300 in the height direction, that is, when the inclined lifting mechanism 200 is driven to make the first surface 201 rise through the first channel 301, the first surface 201 supports the bottom wall 101b of the wafer cassette 100, the horizontal platform 300 separates from the bottom wall 101b, and the wafer cassette 100 is in a first state where the first side is always higher than the second side. When the first surface 201 is lower than the top surface of the horizontal platform 300 in the height direction, that is, when the inclined lifting mechanism 200 is driven to make the first surface 201 descend and exit the first channel 301, the horizontal platform 300 supports the bottom wall 101b of the wafer cassette 100, the first surface 201 separates from the bottom wall 101b, and the wafer cassette 100 is in a first state where the height of the first side and the second side are the same. In one possible embodiment, the inclined lifting mechanism 200 includes a drive motor 210 and a transmission mechanism 212, the transmission mechanism 212 may include a threaded rod and a threaded hole provided on the first surface 201. The drive motor 210 is activated to rotate the threaded rod, thereby enabling the first surface 201 to rise and fall relative to the first channel 301.
[0053] refer to Figure 4 The wafer cassette handling system 10 also includes a transfer mechanism 400. The transfer mechanism 400 is mounted to the bottom of the inclined lifting mechanism 200 and drives the inclined lifting mechanism 200 to move along a transport direction. The transport direction indicates a specially designed transport route. For example, the wafer cassette 100 supported by the inclined lifting mechanism 200 moves via one or more workstations or one or more scenarios via the drive of the transfer mechanism 400. The transfer mechanism 400 may include a drive motor and a timing belt module 401. The timing belt module 401 mounts the inclined lifting mechanism 200 to a timing belt via a connecting component such as a timing belt clamp 402. This allows the timing belt module 401 to rotate around its rollers when the drive motor is running, driving the inclined lifting mechanism 200 connected to the timing belt module 401 to move. The transfer mechanism 400 may also be a lead screw transmission mechanism, a linear motor drive mechanism, or a gear drive mechanism, as long as it enables movement of the wafer cassette 100 along the designed route.
[0054] In one possible implementation, the horizontal stage 300 is connected to the inclined lifting mechanism 200, or the horizontal stage 300 is connected to the transfer mechanism 400, so that the transfer mechanism 400 can drive the horizontal stage 300 and the inclined lifting mechanism 200 to move synchronously in the transport direction. By way of example only, the horizontal stage 300 can be supported by a bracket and directly connected to the synchronous belt module 401 via a fixture such as a synchronous belt clamp 402. During semiconductor manufacturing, when experimentally setting up the production line or when multiple sampling inspections are required, the transfer mechanism 400 can be stopped at any time, and the inclined lifting mechanism 300 can be driven to descend, with the wafer cassette 100 supported by the horizontal stage 300, placing the wafer cassette in a second state. Subsequently, a robot or operator can easily perform pick-and-place operations or sampling inspections.
[0055] In another possible implementation, the horizontal stage 300 is independent of the inclined lifting mechanism 200. In this case, when the transfer mechanism 400 drives the inclined lifting mechanism 200 to move in the transport direction, the horizontal stage 300 does not move in the transport direction. By way of example only, the horizontal stage 300 can be fixedly installed at a specific location on the production line (such as a sampling inspection station), while the inclined lifting mechanism 200 is connected to the synchronous belt module 401 via a fixture such as a synchronous belt clamp. During semiconductor manufacturing, when the production line has been determined and pick-up / placement or sampling inspection is required at a specific station, the transfer mechanism 400 can precisely move the inclined lifting mechanism 200 carrying the wafer cassette 100 above the horizontal stage 300. Subsequently, the transfer mechanism 400 stops, the inclined lifting mechanism 200 descends, and the fixed horizontal stage 300 supports the wafer cassette 100, placing it in a second state. At this time, a robot or operator can conveniently perform pick-up / placement or sampling inspection operations at this station. After the operation is completed, the inclined lifting mechanism 200 is driven upward, and the wafer cassette 100 is supported by the first surface 201. It is then driven by the transfer mechanism 400 to its next destination. This design allows for the standardization and specialization of specific operating positions, improving the clarity and reliability of the operational process.
[0056] refer to Figures 3 to 6 The first surface 201 abuts against the bottom wall 101b of the wafer cassette 100. The surface of the structural beam 1011 closest to the first side along the transport direction is a first positioning surface. The surface of the structural beam 1011 closest to the first side along the transport direction is a second positioning surface. A first limiting block 202 and a second limiting block 203 protrude from the first surface 201 toward the top side and are spaced apart along the transport direction. The first limiting block 202 and the second limiting block 203 abut against the first positioning surface and the second positioning surface, respectively, to support the wafer cassette 100.
[0057] When the wafer cassette 100 is in the second state and the inclined lifting mechanism 300 rises through the first channel 301, the first surface 201 first contacts the adjacent portion 1012 along the transport direction, and the wafer cassette 100 is lifted from the adjacent portion 1012. At this time, the wafer cassette 100 exhibits a tendency to move in the opposite direction to the transport direction. The first limiting block 202 near the first side contacts the structural beam 1011 and further slides into the gap between the structural beam 1011 and the adjacent portion 1012 after switching to the first state, and then contacts the first positioning surface. The second limiting block 203 near the second side conforms to this tendency to move and contacts the second positioning surface of the structural beam 1011. In this way, the wafer cassette 100 is fixed to the first surface 201, and the wafer cassette 100 is supported by the inclined lifting mechanism 200 as the inclined lifting mechanism 200 continues to rise.
[0058] At this time, the bottom wall 101b of the wafer cassette 100 also includes a third positioning surface and a fourth positioning surface spaced apart along the width direction of the wafer cassette 100. Specifically, the third positioning surface is the side of the adjacent portion 1012 near the second side, and the fourth positioning surface is the other side of the adjacent portion 1012 along the width direction. The third limiting block 204 and the fourth limiting block 205 protrude from the first surface 201 toward the top side and are spaced apart along the width direction. The third limiting block 204 and the fourth limiting block 205 abut against the third positioning surface and the fourth positioning surface, respectively, to position the wafer cassette 100. Preferably, when viewed along the height direction, the third limiting block 204 and the fourth limiting block 205 are arranged near the second side.
[0059] The third limiting block 204 and the fourth limiting block 205 ensure that the wafer cassette 100 is precisely positioned relative to the horizontal platform 300 and the inclined lifting mechanism 200 along its width direction after multiple state changes. When the wafer cassette 100 exhibits a tendency to move in the opposite direction to the transport direction, the third limiting block 204 and the fourth limiting block 205 also act together with the first limiting block 202 to resist this tendency to move. This configuration of the first surface 201 further improves the stability and consistency of the wafer cassette transport system 10.
[0060] In another possible implementation, the bottom wall 101b of the wafer cassette 100 includes a third positioning surface and a fourth positioning surface spaced apart along the width direction of the wafer cassette 100. Specifically, a slot can be cut in the structural beam 1011, and the third and fourth positioning surfaces can be two sides of the slot along its width direction, respectively. In this case, only a single third limiting block 204 can be provided on the first surface 201. The third limiting block 204 protrudes from the first surface 201 and abuts against at least one of the third and fourth positioning surfaces to position the wafer cassette 100. The third limiting block 204 thus provided further serves to support the wafer cassette 100.
[0061] To ensure that the wafer cassette 100 is properly positioned in the first state, a first position sensor 500 may be disposed on the first surface 201. Optionally, the first position sensor 500 is an optical sensor. In one possible implementation, the first position sensor 500 is disposed between the first limiting block 202 and the second limiting block 203. In another possible implementation, the first position sensor 500 may be disposed on a side of at least one of the third limiting block 204 and the fourth limiting block 205 away from the third limiting block 204 and the fourth limiting block 205 along the width direction of the wafer cassette 100, that is, located outside the third limiting block 204 and the fourth limiting block 205.
[0062] Optionally, the wafer cassette 100 may further include a fifth positioning surface. The fifth positioning surface is arranged on the first side and perpendicular to the transport direction. Specifically, the fifth positioning surface is a side extending perpendicular to the transport direction at the opening 104. A fifth limiting block 206 and a sixth limiting block 207 protrude from the horizontal stage 300 toward the top side and are spaced apart on both sides of the first channel 301 along the width direction of the wafer cassette 100. When the wafer cassette is in the second state, both the fifth limiting block 206 and the sixth limiting block 207 abut against the fifth positioning surface to position the wafer cassette 100.
[0063] Optionally, the wafer cassette includes a first wall and a second wall spaced apart along the width direction. Specifically, the first wall and the second wall are the opposite side walls 101c. A seventh limiting block 208 and an eighth limiting block 209 protrude from the horizontal stage 300 toward the top side and are spaced apart on both sides of the first channel 301 along the width direction of the wafer cassette 100. The seventh limiting block 208 and the eighth limiting block 209 abut against the first wall and the second wall, respectively, to position the wafer cassette 100.
[0064] Similarly, a second position sensor 600 is provided on the horizontal stage 300. The second position sensor 600 is arranged between the fifth limiting block 206 and the seventh limiting block 208. Optionally, the second position sensor 600 is arranged between the sixth limiting block 207 and the seventh limiting block 208. Preferably, there are two second position sensors 600, arranged on both sides of the horizontal stage 300 along the width direction of the wafer cassette transport system 10.
[0065] To ensure that the first surface 201 can pass through or exit the first channel 301 along the height direction, the relationship between the area S1 of the first channel 301 and the area S1 of the first surface 201 can be determined as follows: 0.4 ≤ S2 / S1 ≤ 1.
[0066] Optionally, the value of S1 / S2 can be 0.40, 0.43, 0.46, 0.49, 0.53, 0.56, 0.59, 0.62, 0.65, 0.68, 0.72, 0.75, 0.78, 0.81, 0.84, 0.87, 0.91, 0.94, 0.97, or 1.00. Particularly preferred is S2 / S1 = 0.6.
[0067] The ratio of the area of the first surface 201 to the area of the first channel should not be too large or too small. When the value of S2 / S1 is too small, i.e., S2 / S1 < 0.4, the area of the first surface 201 of the inclined lifting mechanism 200 is too small. When the first surface 201 abuts against and supports the wafer cassette 100, the mass of the wafer cassette 100 is concentrated in a small area, which increases the load on the first limiting block 202 and the second limiting block 203, accelerates the wear of the first surface 201, and makes the support of the inclined lifting mechanism 200 on the wafer cassette 100 unstable. When the value of S2 / S1 is too large, i.e., S2 / S1 > 0.6, the area of the first channel 301 formed by the horizontal stage 300 is too small. At this time, the space required for the first surface 201 to pass through or exit the first channel 301 is insufficient, which may cause interference or friction between the edge of the first surface 201 and the edge of the first channel 301, affecting the smoothness and accuracy of the lifting action. Meanwhile, an excessively small channel area will significantly weaken the support area and structural rigidity of the horizontal stage 300 for the wafer cassette 100. In the second state (horizontal stage support), this may lead to uneven stress on the bottom wall of the wafer cassette 100 and localized stress concentration on the horizontal stage 300, thereby affecting the horizontal stability and positioning accuracy of the wafer cassette 100. Long-term use may also cause structural deformation. By setting the values of S1 / S2 to satisfy 0.4≤S2 / S1≤1, the first surface 201 and the first channel 301 can ensure the stable cooperation and support between the horizontal stage 300 and the standard open wafer cassette 100 during lifting and lowering of the inclined lifting mechanism 200. This improves the stability and consistency of the wafer cassette handling system 10. Particularly preferably, S2 / S1=0.6.
[0068] Preferably, the angle between the first surface 201 and the height direction is α, where 2° ≤ α ≤ 4°. Particularly preferably, α = 4°.
[0069] It should be noted that the elements described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, the present invention will not describe the various possible combinations separately.
[0070] It should be understood that multiple components and / or parts can be provided by a single integrated component or part. Alternatively, a single integrated component or part can be divided into multiple separate components and / or parts. The use of the public designation "a" or "an" to describe a component or part does not imply the exclusion of other components or parts.
[0071] It should be understood that although terms such as "first" or "second" may be used in this invention to describe various elements (such as the first limiting block and the second limiting block), these elements are not defined by these terms, which are only used to distinguish one element from another.
[0072] The basic principles of the present invention have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in the present invention are merely examples and not limitations, and should not be considered as essential features of each embodiment of the present invention. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the present invention to the necessity of employing the aforementioned specific details.
[0073] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. A wafer cassette handling system, applicable to wafer cassettes, wherein the wafer cassette has an opening on a first side along the handling direction and is closed on a second side along the handling direction, characterized in that, The wafer cassette handling system includes: An inclined lifting mechanism is adapted to tilt the wafer cassette such that the first side is higher than the second side in the height direction of the wafer cassette transport system, including a first surface oblique to the height direction; A horizontal stage, adapted to horizontally support the wafer cassette such that the first side and the second side are at the same height along the height direction, includes a first channel allowing at least a portion of the inclined lifting mechanism to move through along the height direction, wherein: The inclined lifting mechanism can rise along the height direction through the first channel so that the first surface supports the bottom wall of the wafer cassette, and the wafer cassette is separated from the horizontal stage; The inclined lifting mechanism can descend and exit the first channel along the height direction, so that the first surface is separated from the bottom wall of the wafer cassette, and the wafer cassette is horizontally supported by the horizontal stage.
2. The wafer cassette handling system according to claim 1, characterized in that, It includes a transmission mechanism, which is installed at the bottom of the inclined load lifting mechanism and drives the inclined load lifting mechanism to move along the transport direction.
3. The wafer cassette handling system according to claim 2, characterized in that, The transmission mechanism includes a drive motor and a synchronous belt module.
4. The wafer cassette handling system according to claim 1, characterized in that, The bottom wall of the wafer cassette includes a first positioning surface and a second positioning surface arranged at intervals along the transport direction. A first limiting block and a second limiting block protrude from the first surface toward the top side and are arranged at intervals along the transport direction. The first limiting block and the second limiting block abut against the first positioning surface and the second positioning surface, respectively, to support the wafer cassette.
5. The wafer cassette handling system according to claim 4, characterized in that, The bottom wall of the wafer cassette includes a third positioning surface and a fourth positioning surface spaced apart along the width direction of the wafer cassette. A third limiting block and a fourth limiting block protrude from the first surface toward the top side and are spaced apart along the width direction. The third limiting block and the fourth limiting block abut against the third positioning surface and the fourth positioning surface, respectively, to position the wafer cassette.
6. The wafer cassette handling system according to claim 4, characterized in that, The bottom wall of the wafer cassette includes a third positioning surface and a fourth positioning surface spaced apart along the width direction of the wafer cassette. A third limiting block protrudes from the first surface and abuts against at least one of the third positioning surface and the fourth positioning surface to position the wafer cassette.
7. The wafer cassette handling system according to claim 5, characterized in that, Viewed along the height direction, the third limiting block and the fourth limiting block are arranged close to the second side.
8. The wafer cassette handling system according to claim 1, characterized in that, A first position sensor is disposed on the first surface.
9. The wafer cassette handling system according to claim 8, characterized in that, The first position sensor is an optical sensor.
10. The wafer cassette handling system according to claim 8, characterized in that, The first position sensor is arranged between the first limiting block and the second limiting block.
11. The wafer cassette handling system according to claim 8, characterized in that, The first position sensor is disposed on the side of at least one of the third and fourth limiting blocks away from the first one along the width direction of the wafer cassette.
12. The wafer cassette handling system according to claim 1, characterized in that, The wafer cassette includes a fifth positioning surface, which is arranged on the first side and perpendicular to the transport direction. A fifth limiting block and a sixth limiting block protrude from the horizontal platform toward the top side and are spaced apart on both sides of the first channel along the width direction of the wafer cassette. The fifth limiting block and the sixth limiting block both abut against the fifth positioning surface to position the wafer cassette.
13. The wafer cassette handling system according to claim 12, characterized in that, The wafer cassette includes a first wall and a second wall spaced apart along the width direction. A seventh limiting block and an eighth limiting block protrude from the horizontal stage toward the top side and are spaced apart on both sides of the first channel along the width direction of the wafer cassette. The seventh limiting block and the eighth limiting block abut against the first wall and the second wall respectively to position the wafer cassette.
14. The wafer cassette handling system according to claim 1, characterized in that, A second position sensor is installed on the horizontal platform.
15. The wafer cassette handling system according to claim 13, characterized in that, The second position sensor is arranged between the fifth limiting block and the seventh limiting block, and / or between the sixth limiting block and the seventh limiting block.
16. The wafer cassette handling system according to claim 2, characterized in that, The horizontal platform is connected to the inclined lifting mechanism so that the transmission mechanism drives the horizontal platform and the inclined lifting mechanism to move synchronously along the transport direction.
17. The wafer cassette handling system according to claim 2, characterized in that, The horizontal platform is independent of the inclined lifting mechanism, so that when the inclined lifting mechanism moves along the transport direction, the horizontal platform does not move along the transport direction.
18. The wafer cassette handling system according to claim 16 or 17, characterized in that, When viewed along the height direction, the area of the first channel is S1, in mm. 2 The area of the first surface is S2, in mm. 2 , 0.4≤S2 / S1≤1.
19. The wafer cassette handling system according to claim 1, characterized in that, The angle between the first surface and the height direction is α, where 2°≤α≤4°.