Semiconductor device

By employing a recessed structure and laterally connected shielding layer design in semiconductor devices, the problems of package size and shielding layer yield are solved, achieving compact and efficient electromagnetic interference shielding suitable for system-in-package (SIP).

CN122121668APending Publication Date: 2026-05-29ADVANCED SEMICON ENG INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ADVANCED SEMICON ENG INC
Filing Date
2025-06-04
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing semiconductor devices have large package sizes due to the stacking of bare dies during the molding process, which affects the yield of sputtering of the shielding layer and makes it difficult to meet the size requirements of applications such as wearable devices.

Method used

An encapsulation structure with a recessed structure is adopted. An independent shielding layer is set in the recess of the encapsulation structure, and the shielding layers of different encapsulation structures are laterally connected by electrical connection elements to form an independent shielding layer to enhance the electromagnetic interference shielding effect.

Benefits of technology

It achieves a compact packaging design, improves the yield of the shielding layer, reduces the risk of short circuits, and enhances the electromagnetic interference shielding effect, while providing higher device density and flexibility.

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Abstract

A semiconductor device is disclosed. The semiconductor device includes a package structure, a first shielding layer, and a second shielding layer. The package structure has a first surface and a second surface opposite the first surface, wherein the package structure has a recessed portion recessed from the first surface. The first shielding layer is disposed on the first surface and an inner surface of the recessed portion of the package structure. The second shielding layer is disposed in the recessed portion and laterally connected to the first shielding layer. The first shielding layer is spaced apart from the second shielding layer.
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