Intermediate transceiver for enhanced power and data transfer
By using multiple communication coils with different orientations and dynamic load optimization in medical devices, the problems of low wireless transmission efficiency and alignment between implanted devices and external devices are solved, achieving stable power and data transmission.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- COCHLEAR LIMITED
- Filing Date
- 2024-10-03
- Publication Date
- 2026-05-29
AI Technical Summary
Existing medical devices suffer from inefficient wireless power and data transmission between implanted and external devices, and severe alignment problems lead to unstable communication and poor power delivery.
By employing multiple communication coils distributed in different orientations, load conditions are dynamically optimized. The communication coil with the maximum coupling to the implantation device and power supply is selected through the circuit system, thereby improving signal transmission efficiency and alleviating alignment problems.
It improves the efficiency and performance of wireless communication between the implanted device and the power source, ensuring stable power and data transmission, and adapting to changes in different locations and orientations.
Smart Images

Figure CN122121928A_ABST
Abstract
Description
background Technical Field
[0001] This application generally relates to systems and methods for wirelessly transmitting power and / or data between a device implanted on or inside a recipient's body and an external device outside the recipient's body. Background Technology
[0002] Over the past few decades, medical devices have provided a wide range of therapeutic benefits to recipients. Medical devices can include internal or implantable components / devices, external or wearable components / devices, or combinations thereof (e.g., devices having an external component that communicates with the implantable component). Medical devices, such as conventional hearing aids, partially or fully implantable hearing prostheses (e.g., bone conduction devices, mechanical stimulators, cochlear implants, etc.), pacemakers, defibrillators, functional electrical stimulation devices, and other medical devices, have been successful for many years in performing life-saving and / or lifestyle improvement functions and / or recipient monitoring.
[0003] Over the years, the types of medical devices and the range of functions they perform have increased. For example, many medical devices, sometimes referred to as “implantable medical devices,” now typically include one or more instruments, devices, sensors, processors, controllers, or other functional mechanical or electrical components that are permanently or temporarily implanted in the recipient’s body. These functional devices are typically used to diagnose, prevent, monitor, treat, or manage diseases / injuries or their symptoms, or to study, replace, or modify anatomical structures or physiological processes. Many of these functional devices utilize power and / or data received from an external device that is part of or operates in conjunction with the implantable component. Summary of the Invention
[0004] In one aspect disclosed herein, a device includes a support configured to be worn externally over a body portion of a recipient. The device further includes at least one first magnetic induction (MI) antenna, which is attached to the support and configured to wirelessly communicate with an implanted device on or within the body portion. The device also includes one or more second MI antennas, which are attached to the support and distributed across the support such that the one or more second MI antennas at least partially surround the body portion, and are configured such that at least one of the one or more second MI antennas wirelessly communicates with a power source relative to the body portion at multiple locations and / or orientations adjacent to the support. The device also includes a circuitry system electrically communicating with the at least one first MI antenna and the one or more second MI antennas. The circuitry system is configured to transmit electrical signals between the at least one first MI antenna wirelessly communicating with the implanted device and the at least one second MI antenna wirelessly communicating with the power source.
[0005] In another aspect disclosed herein, a method includes providing a device worn on the head of a recipient. The device includes a first communication coil and one or more second communication coils. The first communication coil is wirelessly coupled to an implanted communication coil within the head, and the one or more second communication coils substantially surround the head. The method further includes periodically receiving information indicating at least one operating parameter of the device and / or the recipient's comfort level as the device is worn on the head and the position and / or orientation of the head relative to a power source below the head is changed. The method further includes periodically selecting a second communication coil from the one or more second communication coils in response to the received information, and receiving power from the power source via the selected second communication coil. The method further includes providing the received power to the implanted communication coil via the first communication coil.
[0006] In another aspect disclosed herein, a device includes a first communication coil configured to be worn above the device at a first location on the head of a recipient, such that the first communication coil wirelessly communicates with the device. The device also includes a second communication coil configured to be worn at a second location on the recipient's head, different from the first location. The second communication coil is configured to wirelessly communicate with a power source resting on the recipient's head. The device further includes a circuitry in electrical communication with the first and second communication coils. The circuitry is configured to transmit power wirelessly received from the power source via the second communication coil to the device via the first communication coil. Attached Figure Description
[0007] The embodiments are described in this article with reference to the accompanying drawings, in which: Figure 1A This is a perspective view of an example cochlear implant auditory prosthesis implanted in a recipient according to some of the embodiments described herein; Figure 1B This is a perspective view of all example implantable middle ear implants and auditory prostheses implanted in a recipient according to some embodiments described herein; Figure 2 Example devices according to certain embodiments described herein are illustrated schematically; Figure 3A and 3B Perspective and top views of an example first MI antenna according to certain embodiments described herein are shown schematically, respectively. Figure 3C A perspective view of another example of a first MI antenna according to some embodiments described herein is schematically shown; Figure 4A and 4B Perspective and top views of an example second MI antenna according to certain embodiments described herein are shown schematically, respectively. Figure 4C A perspective view of another example of a second MI antenna 330 according to some embodiments described herein is shown schematically; Figures 5A-5F A portion of an apparatus having at least one first MI antenna and a plurality of second MI antennas in various configurations according to certain embodiments described herein is illustrated schematically. Figure 6 A cross-sectional view of a device between a body part and a power source, according to certain embodiments described herein, is shown schematically. Figure 7 The diagram schematically illustrates the power flow from a power source through a device to a apparatus, and the communication flow between the power source, the device, and the apparatus, according to certain embodiments described herein. Figure 8 This is a flowchart illustrating a method for optimizing load matching between devices and apparatuses and between devices and power supplies, according to certain embodiments described herein; and Figure 9 This is a flowchart of an example method for operating a device according to certain embodiments described herein. Detailed Implementation
[0008] Some embodiments described herein provide an intermediate device configured for use by a recipient and to facilitate the transfer of power, data, and / or control signals between an implanted device within the recipient's body and a power source (e.g., a pillow charger). The device has at least one first communication coil configured to wirelessly couple to the implanted device within the recipient's body and one or more second communication coils configured to wirelessly couple to the power source. The device can improve (e.g., optimize) signal transmission efficiency by utilizing multiple communication coils with different orientations to alleviate alignment problems and having a surface area with a larger coupling coefficient to the power source and / or the implanted device. Rather than attempting to extend the range of wireless communication, the device can be configured to facilitate improved efficiency and / or performance of wireless communication between the implanted device and the power source. The device's circuitry can be configured to dynamically optimize load conditions between at least one first communication coil and the implanted device and / or between one or more second communication coils and the power source, and to select among the communication coils to use the one with the maximum coupling to the implanted device and / or the power source.
[0009] The teachings detailed herein are applicable in at least some embodiments to any type of implantable or non-implantable stimulation or measurement system (e.g., implantable or non-implantable auditory prosthesis device or system). Embodiments may include any type of medical device that can utilize the teachings detailed herein and / or variations thereof. Furthermore, while some embodiments are described herein in the context of auditory prosthesis devices, certain other embodiments are compatible in the context of other types of devices or systems.
[0010] For ease of description only, the devices and methods disclosed herein are described primarily with reference to exemplary medical devices (i.e., implantable transducer assemblies), including but not limited to: electroacoustic / electrical systems, cochlear implant devices, implantable hearing aid devices, middle ear implant devices, bone conduction devices (e.g., active bone conduction devices; passive bone conduction devices; percutaneous bone conduction devices; transdermal bone conduction devices), direct acoustic cochlear implants (DACI), middle ear transducers (MET), electroacoustic implant devices, other types of auditory prostheses and / or combinations or variations thereof, or any other suitable hearing prosthesis system with or without one or more external components. Embodiments may include any type of auditory prosthesis capable of utilizing the teachings detailed herein and / or variations thereof. Some such embodiments may be referred to as “partially implantable,” “semi-implantable,” “largely implantable,” “fully implantable,” or “completely implantable” auditory prostheses. In some embodiments, the teachings detailed herein and / or variations thereof may be utilized in other types of prostheses besides auditory prostheses.
[0011] While certain embodiments are described herein in the context of auditory prosthetic devices, certain other embodiments compatible with other types of sensory prosthetic systems configured to evoke other types of neural or sensory perception (e.g., vision, touch, smell, taste) are also compatible with some of the embodiments described herein. These other types of sensory prosthetic systems include, but are not limited to, vestibular devices (e.g., vestibular implants), visual devices (e.g., bionic eyes), visual prostheses (e.g., retinal implants), somatosensory implants, and chemosensory implants. Certain other embodiments are compatible with other types of medical devices (e.g., tinnitus treatment; epilepsy monitoring systems; pain control systems; bladder control systems; sleep apnea control systems; neurostimulators; pacemakers; other medical implants including implantable power sources) that can utilize the teachings detailed herein and / or variations thereof to provide a wide range of therapeutic benefits to recipients, patients, or other users.
[0012] Figure 1A This is a perspective view of an example cochlear implant auditory prosthesis 100 implanted in a recipient according to certain embodiments described herein. The example auditory prosthesis 100 is... Figure 1A The image is shown to include an implantable stimulator unit 120 and a microphone assembly 124 (e.g., a partially implantable cochlear implant) external to the recipient. Example auditory prostheses 100 according to certain embodiments described herein (e.g., fully implantable cochlear implants; partially implantable cochlear implants) can be replaced with subcutaneously implantable microphone assemblies as described more fully herein. Figure 1A The external microphone assembly 124 is shown. In some embodiments, Figure 1A The example cochlear implant hearing prosthesis 100 can be combined with a liquid drug reservoir as described herein.
[0013] like Figure 1AAs shown, the recipient has an outer ear 101, a middle ear 105, and an inner ear 107. In a fully functional ear, the outer ear 101 includes an auricle 110 and an ear canal 102. Sound pressure, or sound waves 103, are collected by the auricle 110 and guided into and through the ear canal 102. A tympanic membrane 104, which vibrates in response to sound waves 103, is located at the distal end of the ear canal 102. This vibration is connected to an elliptical or oval window 112 via three bones in the middle ear 105, collectively referred to as ossicles 106, and including the malleus 108, incus 109, and stapes 111. The bones 108, 109, and 111 of the middle ear 105 filter and amplify the sound waves 103, causing the elliptical window 112 to oscillate or vibrate in response to the vibration of the tympanic membrane 104. This vibration creates a fluid motion wave of perilymph within the cochlea 140. This fluid motion then activates tiny hair cells (not shown) inside the cochlea 140. The activation of the hair cells causes appropriate neural impulses to be generated and transmitted to the brain (also not shown) via spiral ganglion cells (not shown) and the auditory nerve 114, where they are perceived as sound.
[0014] like Figure 1A As shown, the example hearing prosthesis 100 includes one or more components that are temporarily or permanently implanted in the recipient's body. The example hearing prosthesis 100 in... Figure 1A The device is shown to have: an external component 142 that is directly or indirectly attached to the recipient's body; and an internal component 144 that is temporarily or permanently implanted in the recipient's body (e.g., located in a recess of the temporal bone adjacent to the recipient's auricle 110). The external component 142 typically includes one or more sound input elements for detecting sound (e.g., an external microphone 124), a sound processing unit 126 (e.g., disposed in a behind-the-ear unit), a power supply (not shown), and an external transmitter unit 128. Figure 1A In an exemplary embodiment, the external transmitter unit 128 includes an external coil 130 (e.g., a linear antenna coil comprising a single or multiple strand of electrically insulated platinum or gold wire with multiple turns) and preferably includes a magnet (not shown) directly or indirectly attached to the external coil 130. The external coil 130 of the external transmitter unit 128 is part of an inductive radio frequency (RF) communication link with the internal component 144. The sound processing unit 126 processes the output of the microphone 124, which in the depicted embodiment is positioned outside the receiver's body by the receiver's auricle 110. The sound processing unit 126 processes the output of the microphone 124 and generates an encoded signal, sometimes referred to herein as an encoded data signal, which is provided to the external transmitter unit 128 (e.g., via a cable). It will be appreciated that the sound processing unit 126 may utilize digital processing techniques to provide frequency shaping, amplification, compression, and other signal conditioning, including conditioning based on receiver-specific fitting parameters.
[0015] The power source of the external component 142 is configured to supply power to the hearing prosthesis 100, which includes a battery (e.g., located in the internal component 144, or positioned in a separate implantation location) that is charged by power supplied by the external component 142 (e.g., via a transdermal power delivery link). The transdermal power delivery link is used to transfer power and / or data to the internal component 144 of the hearing prosthesis 100. Various types of power delivery (e.g., infrared (IR), electromagnetic, capacitive, and inductive) can be used to transfer power and / or data from the external component 142 to the internal component 144. During operation of the hearing prosthesis 100, power stored in the rechargeable battery is distributed as needed to various other implanted components.
[0016] Internal component 144 includes an internal receiver unit 132, a stimulator unit 120, and an elongated electrode assembly 118. In some embodiments, the internal receiver unit 132 and the stimulator unit 120 are hermetically sealed within a biocompatible housing. The internal receiver unit 132 includes an internal coil 136 (e.g., a linear antenna coil comprising a single or multiple strands of electrically insulated platinum or gold wire), and preferably includes a magnet (also not shown) fixed relative to the internal coil 136. The internal receiver unit 132 and the stimulator unit 120, hermetically sealed within a biocompatible housing, are sometimes collectively referred to as the stimulator / receiver unit. The internal coil 136 receives electrical and / or data signals from the external coil 130 via a transdermal power delivery link (e.g., an inductive RF link). The stimulator unit 120 generates an electrical stimulation signal based on the data signal, and the stimulation signal is delivered to the recipient via the elongated electrode assembly 118.
[0017] An elongated electrode assembly 118 has a proximal end connected to the stimulator unit 120 and a distal end implanted in the cochlea 140. The electrode assembly 118 extends from the stimulator unit 120 through the mastoid bone 119 to reach the cochlea 140. In some embodiments, the electrode assembly 118 may be implanted at least in the basal region 116, and sometimes deeper. For example, the electrode assembly 118 may extend toward the apex of the cochlea 140 (referred to as the cochlear apex 134). In some cases, the electrode assembly 118 may be inserted into the cochlea 140 via a cochlear fenestration 122. In other cases, the cochlear fenestration may be formed via a round window 121, an elliptical window 112, a promontory 123, or through the apical gyrus 147 of the cochlea 140.
[0018] The elongated electrode assembly 118 includes a longitudinally aligned and distally extending array 146 of electrodes or contacts 148 disposed along its length, sometimes referred to herein as an electrode or contact array 146. Although the electrode array 146 may be disposed on the electrode assembly 118, in most practical applications, the electrode array 146 is integrated into the electrode assembly 118 (e.g., the electrode array 146 is disposed within the electrode assembly 118). As noted, the stimulator unit 120 generates a stimulation signal, which is applied by the electrodes 148 to the cochlea 140, thereby stimulating the auditory nerve 114.
[0019] Although Figure 1A The auditory prosthesis 100 is schematically illustrated using an external component 142 comprising an external microphone 124, an external sound processing unit 126, and an external power supply. However, in some other embodiments, one or more of the microphone 124, sound processing unit 126, and power supply may be implanted on or within the recipient (e.g., within the internal component 144). For example, the auditory prosthesis 100 may have each of the microphone 124, sound processing unit 126, and power supply that can be implanted on or within the recipient (e.g., enclosed within a subcutaneous biocompatible component) and may be referred to as a fully implantable cochlear implant (“TICI”). For another example, the auditory prosthesis 100 may have most of the components of a cochlear implant that can be implanted on or within the recipient (e.g., excluding the microphone, which may be an in-ear canal microphone) and may be referred to as a largely implantable cochlear implant (“MICI”).
[0020] Figure 1B A perspective view is schematically shown of an example fully implantable auditory prosthesis 200 (e.g., a fully implantable middle ear implant or a fully implantable acoustic system) implanted in a recipient using an acoustic actuator according to certain embodiments described herein. Figure 1B Example hearing prosthesis 200 includes a biocompatible implantable component 202 (e.g., including an implantable capsule) located subcutaneously (e.g., under the recipient's skin and on the recipient's skull). Although Figure 1BAn example implantable component 202 including a microphone is schematically shown, but in other example hearing prostheses 200, a pendant microphone (e.g., connected to the implantable component 202 via a cable) may be used. The implantable component 202 includes a signal receiver 204 (e.g., including a coil element) and an acoustic transducer 206 (e.g., a microphone including a diaphragm and an electret or piezoelectric transducer), the acoustic transducer being positioned to receive acoustic signals through the recipient's covering tissue. The implantable component 202 may also be used to accommodate multiple components of the entire implantable hearing prosthesis 200. For example, the implantable component 202 may include an energy storage device and a signal processor (e.g., a sound processing unit). Various additional processing logic and / or circuitry components may also be included in the implantable component 202 as a design option.
[0021] for Figure 1B The example hearing prosthesis 200 shown includes an implantable component 202 whose signal processor and actuator 210 (e.g., including a transducer configured to generate mechanical vibrations in response to an electrical signal from the signal processor) operate in communication (e.g., electrically interconnected via wire 208). In some embodiments, Figure 1A and 1B The example auditory prostheses 100, 200 shown may include implantable microphone components, such as Figure 1B The microphone assembly 206 is shown. For such an example auditory prosthesis 100, the signal processor of the implantable component 202 can operatively communicate (e.g., via electrical interconnection via wires) with the microphone assembly 206 and the stimulator unit of the main implantable component 120. In some embodiments, at least one of the microphone assembly 206 and the signal processor (e.g., a sound processing unit) is implanted on or inside the recipient.
[0022] Figure 1B The actuator 210 of the example auditory prosthesis 200 shown is supportably connected to a positioning system 212, which is then (e.g., via a hole drilled through the skull) connected to a bone anchor 214 installed within the recipient's mastoid process. The actuator 210 includes a connection device 216 for connecting the actuator 210 to the recipient's ossicles 106. In the connected state, the connection device 216 provides a communication path for acoustic stimulation of the ossicles 106 (e.g., by transmitting vibrations from the actuator 210 to the incus 109).
[0023] During normal operation, ambient acoustic signals (e.g., ambient sounds) impact the recipient's tissue and are received transdermally at microphone assembly 206. Upon receiving the transdermal signal, a signal processor implantable within assembly 202 processes the signal to provide a processed audio drive signal to actuator 210 via wire 208. It will be appreciated that the signal processor can utilize digital processing techniques to provide frequency shaping, amplification, compression, and other signal conditioning, including conditioning based on recipient-specific fitting parameters. The audio drive signal causes actuator 210 to transmit acoustic vibrations to connection device 216 to influence the desired sound sensation via mechanical stimulation of the recipient's incus 109.
[0024] The subcutaneously implantable microphone assembly 202 is configured to respond to auditory signals (e.g., sound; pressure changes within the audible frequency range) by generating output signals (e.g., electrical signals; optical signals; electromagnetic signals), the output signals indicating auditory signals received by the microphone assembly 202, and these output signals are used by auditory prostheses 100, 200 to generate stimulus signals that are provided to the auditory system of a recipient. To compensate for the reduced acoustic signal intensity reaching the microphone assembly 202 due to implantation, the septum of the implantable microphone assembly 202 may be configured to provide higher sensitivity than that of externally non-implantable microphone assemblies. For example, the septum of the implantable microphone assembly 202 may be configured to be more robust and / or larger than that of externally non-implantable microphone assemblies.
[0025] Figure 1A The example hearing prosthesis 100 shown utilizes an external microphone 124, and Figure 1B The auditory prosthesis 200 shown utilizes an implantable microphone assembly 206 including a subcutaneously implantable acoustic transducer. In some embodiments described herein, the auditory prosthesis 100 utilizes one or more implantable microphone assemblies located on or within the recipient. In some embodiments described herein, the auditory prosthesis 200 utilizes one or more microphone assemblies positioned externally to the recipient and / or implanted on or within the recipient, and utilizes one or more acoustic transducers (e.g., actuator 210) implanted on or within the recipient. In some embodiments, an external microphone assembly may be used to supplement the implantable microphone assembly of the auditory prosthesis 100, 200. Therefore, the teachings detailed herein and / or variations thereof can be used with any type of external or implantable microphone arrangement, and Figure 1A and 1B The acoustic transducer shown is merely illustrative.
[0026] Figure 2An example device 300 according to certain embodiments described herein is schematically illustrated. Device 300 includes a support 310 configured to be worn externally over a body portion 400 of a recipient, at least one first magnetic induction (MI) antenna 320 attached to the support 310, and a plurality of second MI antennas 330 attached to the support 310 and distributed across the support such that the plurality of second MI antennas 330 at least partially surround the body portion 400. At least one first MI antenna 320 is configured to wirelessly communicate with a device 410 on or within the body portion 400. The plurality of second MI antennas 330 are configured such that at least one of the plurality of second MI antennas 330 wirelessly communicates with a power source 450 relative to multiple locations and / or orientations of the body portion 400 adjacent to the support 310. Device 300 also includes a circuitry 340 electrically communicating with the at least one first MI antenna 320 and the plurality of second MI antennas 330. The circuit system 340 is configured to transmit electrical signals between at least one first MI antenna 320 that communicates wirelessly with the device 410 and at least one second MI antenna 330 that communicates wirelessly with the power supply 450.
[0027] In some embodiments, device 300, apparatus 410, and power supply 450 are part of a transdermal system, wherein device 300 provides intermediate wireless coupling between apparatus 410 (e.g., the implanted portion of the transdermal system) and power supply 450 (e.g., the external portion of the transdermal system). For example, apparatus 410 may include at least one MI antenna 412 (e.g., a communication coil) configured to wirelessly communicate with at least one first MI antenna 320 external to body portion 400, and power supply 450 may include at least one external MI antenna 452 (e.g., a communication coil) configured to wirelessly communicate with at least one second MI antenna 330. Circuitry 340 may be configured (e.g., via wireless coupling of at least one first MI antenna 320 to at least one MI antenna 412) to transmit power, data, and / or control signals received from power supply 450 to apparatus 410 (e.g., via wireless coupling of at least one external MI antenna 452 to at least one second MI antenna 330). The circuit system 340 can also be configured to transmit (e.g., via wireless coupling of at least one external MI antenna 452 to at least one second MI antenna 330) data and / or control signals received from the device 410 to the power supply 450 (e.g., via wireless coupling of at least one first MI antenna 320 to at least one MI antenna 412).
[0028] In some embodiments, device 410 is the implanted portion of a "partially implantable," "semi-implantable," "largely implantable," "fully implantable," or "fully implantable" transdermal system (e.g., configured to operate using power currently received by device 410 and / or previously received and stored by device 410). Device 410 may include a stimulation and / or measurement circuitry system 414 comprising one or more active elements (e.g., stimulator unit 120; assembly 202; vibration actuator) configured to deliver stimulation (e.g., stimulation signals) to a portion of a recipient's body and / or detect attributes or conditions of the recipient's body, and the device may be in electrical communication with that portion of the recipient's body via an electrical conduit (e.g., electrode assembly 118; return electrode) extending from device 410 to that region of the recipient's body. In some embodiments, stimulation and / or measurement circuitry system 414 is configured to directly use power received by at least one MI antenna 412. In some other embodiments, device 410 includes a power storage circuitry system 416 (e.g., a battery; a capacitor) configured to receive and store power from at least one MI antenna 412 during a first time period (e.g., when body part 400 is near power source 450 and / or within wireless communication range of power source 450), and to provide the stored power to stimulation and / or measurement circuitry system 414 of device 410 during a second time period following the first time period (e.g., when body part 400 is spaced apart from power source 450 and / or outside wireless communication range of power source 450).
[0029] In some embodiments of transdermal systems that are sensory prosthetic systems (e.g., auditory prosthetic systems; visual prosthetic systems; vestibular prosthetic systems) or brain stimulation or monitoring systems, device 410 is implanted on or within the recipient's head, and support 310 includes headgear (e.g., hat, brimless hat, face mask, goggles, mask, headset) or straps configured to be worn on or above the head, wherein at least one first MI antenna 320 is wirelessly connected to device 410 and a plurality of second MI antennas 330 at least partially surround the head. For auditory prosthetic systems, such as... Figure 2 As illustrated, the device 410 can be implanted on and substantially parallel to the bone surface in the recipient’s body (e.g., the surface of the skull on a portion of the auricle 110 or behind the ear wing; the surface of the mastoid bone 119), and the device 300 is configured to be worn on the head, wherein at least one first MI antenna 320 (e.g., on and / or behind the auricle 110) wirelessly communicates with at least one MI antenna 412 and a plurality of second MI antennas 330 are at least partially surrounding the head (e.g., distributed around the periphery of the head).
[0030] In some other embodiments of the transdermal system that is a sleep disorder breathing (SDB) (e.g., sleep apnea) treatment system, the device 410 is implanted on or within the recipient's jaw, neck, or shoulder region (e.g., where the stimulating electrodes are on, within, or near the recipient's tongue or hypoglossal nerve), and the support 310 includes a scarf, sleeve, strap, or pad configured to be worn, wherein at least one first MI antenna 320 is wirelessly connected to the device 410 and a plurality of second MI antennas 330 at least partially surround the jaw, neck, or shoulder region. In some other embodiments of the transdermal system that is a cardiac pacemaker system or spinal cord stimulation system, the device 410 is on or within the recipient's torso, and the support 310 includes a strap, belt, vest, or shirt. Some other embodiments are compatible with other types of transdermal systems.
[0031] In some embodiments, the power supply 450 includes at least one external MI antenna 452 and a pad 454 (e.g., a pillow; cushion; mattress) configured to receive a body part 400, wherein at least a portion of the pad 454 is between the body part 400 and the at least one external MI antenna 452. For example, the pad 454 may be a pillow on which a recipient may rest their head (e.g., during sleep). In some embodiments, the power supply 450 includes a base station configured to be positioned close to the device 300 (e.g., on a bedside table).
[0032] In some embodiments, the power supply 450 includes a single, generally flat external MI antenna 452 (e.g., a communication coil), while in other embodiments, the power supply 450 includes multiple, generally flat external MI antennas 452 (e.g., see [link to other embodiments]). Figure 2 External MI antennas 452 may be positioned to overlap or not overlap each other. At least some of the external MI antennas 452 may be substantially parallel or coplanar with each other, and at least some of the external MI antennas 452 may be substantially perpendicular to one or more other external MI antennas 452 (e.g., in three orthogonal orientations). The external MI antennas 452 may be positioned around the area where the body portion 400 and device 300 are to be placed (e.g., along two or more sides of the area). In some embodiments, the at least one external MI antenna 452 is configured to deliver power, data, and / or control signals to and / or receive data and / or control signals from the device 300 when the power supply 450 is activated, when the device 300 is worn on the body portion 400, and when the body portion 400 is in multiple positions and / or orientations relative to the power supply 450. U.S. Patent No. 10,530,177 discloses an example power supply 450 compatible with some of the embodiments described herein.
[0033] In some embodiments, device 300 is configured to be worn such that support 310 holds at least one first MI antenna 320 wirelessly communicating with device 410, and a plurality of second MI antennas at least partially surround body portion 400 (e.g., holding a plurality of second MI antennas 330 such that the plurality of second MI antennas 330 are distributed around the periphery of body portion 400). For example, support 310, at least one first MI antenna 320, and a plurality of second MI antennas 330 may be sufficiently flexible (e.g., bendable) to conform to (e.g., follow) the curvature of body portion 400 when device 300 is worn by a recipient. Although some embodiments in which device 300 is worn over the recipient's skin have been described herein, in some other embodiments, device 300 is configured to be implanted under the recipient's skin (e.g., above device 410).
[0034] In some embodiments, the support 310 comprises a fabric material (e.g., cloth) and may be adjustable to fit onto the recipient's body part 400. For example, the support 310 may include an elastic material configured to stretch and provide a restoring force configured to hold the support 310 onto the body part 400. In some embodiments, at least one first MI antenna 320, a plurality of second MI antennas 330, and / or a circuit system 340 are contained within the support 310 (e.g., hermetically sealed within the support 310), and the support comprises electrically insulating and biocompatible or skin-friendly materials (e.g., silicone rubber; polymers; polyetheretherketone (PEEK); ceramics; titanium dioxide; glass; glycerol), and may be configured to remain in contact with the body part 400. The support 310 can also substantially transmit electromagnetic or magnetic fields between the device 300 and the apparatus 410 (e.g., so that the support 310 does not significantly interfere with the transmission of power, data and / or control signals between the device 300 and the apparatus 410 and / or between the device 300 and the power supply 450).
[0035] Figure 3A and 3B Perspective and top views of an example first MI antenna 320 according to certain embodiments described herein are shown schematically, respectively. Figure 3CA perspective view of another example of a first MI antenna 320 according to some embodiments described herein is schematically shown. In some embodiments, the first MI antenna 320 includes at least one conductive and substantially flat first coil 322 configured to magnetically communicate with at least one MI antenna 412 (e.g., a communication coil). For example, the first coil 322 may include conductive wire (e.g., platinum, gold, copper, or other metal; electrically insulating single or multiple strands) having one or more loops wound around and substantially orthogonal to the first antenna axis 324. As another example, the first coil 322 may include metallic traces (e.g., copper) having one or more loops extending (e.g., wound) on a flexible substrate (e.g., a printed circuit board) and around the first antenna axis 324. To secure the first MI antenna 320 to a support 310, the wire or substrate may be sewn into the fabric of the support 310 or may be held by an adhesive material. As another example, the first coil 322 may include conductive ink printed into the support 310 (e.g., screen-printed onto fabric).
[0036] like Figure 3A and 3B As shown, the coil loops can be substantially coplanar with each other (e.g., planar spirals), and as... Figure 3C As shown, the coil loops can be substantially parallel to each other (e.g., spring-shaped). Figures 3A-3C As shown, the first coil 322 may have three coil loops and may be substantially circular. Other numbers of coil loops (e.g., 2, 4, 5, 6 or more) and other shapes (e.g., rectangular, elliptical, oblong, bean-shaped, kidney-shaped or others) are also compatible with some embodiments described herein.
[0037] The first coil 322 may have a lateral dimension (e.g., diameter, length, and / or width along a direction substantially perpendicular to the first antenna axis 324) of less than or equal to 100 mm (e.g., in the range of 15 mm to 40 mm; in the range of 25 mm to 50 mm; in the range of less than 30 mm; in the range of 20 mm to 60 mm; in the range of greater than 60 mm). In some embodiments of the device 300 including a plurality of first MI antennas 320 having a plurality of first coils 322, the first coils 322 may include the same number of coil loops as each other and the coil loops may have substantially equal widths as each other, while in some other embodiments, two or more of the first MI antennas 320 may have different numbers of coil loops and / or coil loop widths as each other.
[0038] In some embodiments, the first coil 322 has at least one lateral dimension substantially equal to at least one lateral dimension of at least one MI antenna 412 to facilitate inductive coupling between the first MI antenna 320 and the MI antenna 412. For example, at least one first MI antenna 320 may be tuned to a first carrier having a first frequency (e.g., 5 MHz; tens to hundreds of MHz) for wireless communication with device 410. The first frequency carrier may be compatible with short-range transmissions (e.g., from the first MI antenna 320 through the skin layer to the MI antenna 412).
[0039] Figure 4A and 4B Perspective and top views of an example second MI antenna 330 according to certain embodiments described herein are shown schematically, respectively. Figure 4C A perspective view of another example of a second MI antenna 330 according to some embodiments described herein is schematically shown. In some embodiments, the second MI antenna 330 includes at least one conductive and substantially flat second coil 332 configured to magnetically communicate with at least one external MI antenna 452 (e.g., a communication coil) of a power source 450. For example, the second coil 332 may include conductive wire (e.g., platinum, gold, copper, or other metal; electrically insulating single or multiple strands) having one or more loops wound around and substantially orthogonal to the second antenna axis 334. As another example, the second coil 332 may include metallic traces (e.g., copper) having one or more loops extending (e.g., wound) on a flexible substrate (e.g., a printed circuit board) and around the second antenna axis 334. To secure the second MI antenna 330 to a support 310, the wire or substrate may be sewn into the fabric of the support 310 or may be held in place by an adhesive material. As another example, the second coil 332 may include conductive ink printed into the support 310 (e.g., screen-printed onto fabric).
[0040] like Figure 4A and 4B As shown, the coil loops can be substantially coplanar with each other (e.g., planar spirals), and as... Figure 4C As shown, the coil loops can be substantially parallel to each other (e.g., spring-shaped). Figures 4A-4C As shown, the second coil 332 may have three coil loops and may be substantially rectangular. Other numbers of coil loops (e.g., 2, 4, 5, 6 or more) and other shapes (e.g., circular, elliptical, oblong, bean-shaped, kidney-shaped or others) are also compatible with some embodiments described herein.
[0041] The second coil 332 may have at least one lateral dimension (e.g., diameter, length, and / or width along a direction substantially perpendicular to the second antenna axis 334) less than or equal to 500 mm (e.g., in the range of 75 mm to 200 mm; in the range of 125 mm to 250 mm; in the range of less than 150 mm; in the range of 100 mm to 300 mm; in the range of greater than 300 mm). In some embodiments, the second coil 332 may include the same number of coil loops and the coil loops may have substantially equal widths, while in some other embodiments, two or more second MI antennas in the second MI antenna 330 may have different numbers and / or coil loop widths than each other.
[0042] In some embodiments, the second coil 332 has at least one lateral dimension substantially equal to at least one lateral dimension of at least one external MI antenna 452 to facilitate inductive coupling between the second MI antenna 330 and the external MI antenna 452. For example, each of the plurality of second MI antennas 330 may be tuned to a second carrier having a second frequency (e.g., radio frequency; 130 kHz; 6.78 MHz; in the range of several hundred kHz to tens of MHz) for wireless communication with the power supply 450. The second frequency carrier may be compatible with remote transmissions (e.g., from the external MI antenna 452 to the second MI antenna 330 via pad 454).
[0043] One or more lateral dimensions of the second coil 332 may be larger than one or more lateral dimensions of the first coil 312 (e.g., 1.2, 2, 3, 4, 5 or more times), and the second frequency for wireless communication via the second MI antenna 330 may be different from the first frequency for wireless communication via the first MI antenna 320. By allowing the first frequency to be different from the second frequency, certain embodiments described herein are not limited to operating the power supply 450 at a frequency compatible with the implanted device 410, and the device 300 can be easily and efficiently wirelessly coupled to both the device 410 and the power supply 450.
[0044] Figures 5A-5F A portion of an apparatus 300 having at least one first MI antenna 320 and a plurality of second MI antennas 330 in various configurations according to certain embodiments described herein is illustrated schematically. In some embodiments, at least one first MI antenna 320 comprises a single first MI antenna 320, and the plurality of second MI antennas 330 do not overlap each other (e.g., see [link to relevant documentation]). Figure 5AIn some other embodiments, adjacent second MI antennas 330 of the plurality of second MI antennas 330 at least partially overlap each other. In some embodiments, at least one first MI antenna 320 includes a plurality of first MI antennas 320 that extend only partially across the support 310 and do not overlap each other (e.g., see...). Figure 5B In some embodiments, the plurality of second MI antennas 330 do not overlap each other, while in other embodiments, adjacent second MI antennas 330 of the plurality of second MI antennas 330 at least partially overlap each other (e.g., see [link to relevant documentation]). Figure 5C In some embodiments, the plurality of first MI antennas 320 do not overlap each other and are distributed across the support 310 such that the plurality of first MI antennas 320 at least partially surround the body portion 400 (e.g., see...). Figure 5D In some other embodiments, adjacent first MI antennas 320 of the plurality of first MI antennas 320 at least partially overlap each other (e.g., see...). Figure 5E In some embodiments, adjacent first MI antennas 320 of the plurality of first MI antennas 320 at least partially overlap each other and are distributed across the support 310 such that the plurality of first MI antennas 320 at least partially surround the body portion 400, and adjacent second MI antennas 330 of the plurality of second MI antennas 330 at least partially overlap each other (see, for example, see...). Figure 5F Other configurations of at least one first MI antenna 320 and multiple second MI antennas 330 may also be compatible with certain embodiments described herein. For example, although Figures 5A-5F It is shown that a plurality of second MI antennas 330 at least partially overlap with at least one first MI antenna 320, but in some other configurations, the plurality of second MI antennas 330 do not overlap with at least one first MI antenna 320.
[0045] In some implementations (e.g., see...) Figures 5A-5F The second MI antenna 330 is distributed across the support 310 to at least partially surround the body portion 400. For example, the second MI antenna 330 may be distributed across the perimeter of the receiver's head (see, for example, see...). Figure 2 This ensures that, in the event of any rotation of the head on the power source 450 (e.g., a pillow charger), the second MI antenna 330 of the plurality of second MI antennas 330 is substantially parallel to at least one external MI antenna 452 of the power source 450 (e.g., there is an optimal coupling coefficient between the second MI antenna 330 and the external MI antenna 452). Due to the redundancy of the second MI antennas 330 surrounding the body portion 400, it is expected that at least one of the second MI antennas 330 will be in an optimal orientation to wirelessly receive power from the power source 450 via a second frequency carrier.
[0046] Some implementations allow the receiver to lie in various orientations relative to the power source 450 while maintaining sufficiently good signal transmission efficiency between the device 410 and the power source 450. For example, if the device 410 is on a first side of the receiver's head and the receiver is lying with the first side away from the power source 450 (e.g., a second side of the receiver's head opposite the first side is on the power source 450), then at least one second MI antenna 330 can have a sufficiently large coupling coefficient with at least one external MI antenna 452 of the power source 450, such that the device 300 transmits power from the power source 450 (e.g., via at least one second MI antenna 330, circuitry 340, and at least one first MI antenna 320) to the device 410 with sufficiently high power transmission efficiency (e.g., a sufficiently high charging rate).
[0047] In some implementations (see, for example) Figure 5D-5F Device 300 includes a plurality of first MI antennas 320 positioned across support 310 to at least partially surround body portion 400 (e.g., distributed across the perimeter of the receiver's head), such that for any rotational orientation of device 300 on the head, the first MI antennas 320 are substantially parallel to at least one MI antenna 412 of device 410 (e.g., having an optimal coupling coefficient between the first MI antennas 320 and MI antenna 412). Due to the redundancy of the first MI antennas 320 surrounding body portion 400, it is anticipated that at least one of the first MI antennas 320 will be in an optimal orientation to wirelessly transmit power to device 410 via a first frequency carrier.
[0048] Figure 6 A schematic cross-sectional view of a device 300 between a body portion 400 and a power supply 450, according to certain embodiments described herein, is shown. At least one first MI antenna 320 and a plurality of second MI antennas 330 overlap each other. Figure 6 The device 300 includes a conductive layer 350 between at least one first MI antenna 320 and a plurality of second MI antennas 330. Layer 350 may include a flexible solid layer or mesh that is electrically communicating with the circuit system 340 or ground and / or configured to reduce cross-coupling between the at least one first MI antenna 320 and the plurality of second MI antennas 330. For example, layer 350 may include a nonferrous metal (e.g., copper; aluminum; silver) and / or a ferrous material (e.g., stainless steel; μ metal; pure ferrite; ferrite-doped plastic or epoxy resin), configured to passively or actively shield the first MI antenna 320 relative to the electric and / or magnetic fields generated by the plurality of second MI antennas 330, and vice versa. Additionally, layer 350 may shield the first MI antenna 320 and / or the second MI antennas 330 relative to electromagnetic interference from other devices.
[0049] In some embodiments, device 300 does not include a magnetic element (e.g., a non-magnetic link) configured to generate a magnetic force with device 410 to hold device 300 in proper position relative to device 410 on a recipient's body. In some other embodiments, device 300 does include a magnetic element (e.g., a magnetic element hermetically sealed within support 310). For example, the magnetic element may include at least one magnetic material (e.g., ferromagnetic; ferrimagnetic; permanent magnet; diamagnetic magnet) and may have a substantially planar shape (e.g., a disk; a plate; substantially circular, elliptical, or rectangular). The magnetic element may be configured to generate a magnetic force of sufficient strength to hold device 300 on or above the recipient's skin above device 410, such that the first MI antenna 320 and MI antenna 412 (e.g., via magnetic induction; via a radio frequency or RF link) are operatively wirelessly connected, and the coil and coil center alignment are improved.
[0050] In some embodiments, circuit system 340 includes: one or more microprocessors (e.g., application-specific integrated circuits; general-purpose integrated circuits programmed with software having computer-executable instructions; microelectronic circuit systems; microcontrollers) and at least one storage device (e.g., at least one tangible or non-transitory computer-readable storage medium; read-only memory; random access memory; flash memory), said at least one storage device being configured to store information (e.g., data; commands) accessed by the one or more microprocessors during operation. The at least one storage device may be encoded with software (e.g., a computer program downloaded as an application) including computer-executable instructions (e.g., executable data access logic, evaluation logic, and / or information output logic) for instructing the one or more microprocessors. In some embodiments, the one or more microprocessors execute the instructions of the software to provide the functionality described herein. In some embodiments, the circuit system 340 is configured to use power received from the power source 450 (e.g., device 300 does not include a battery) and includes a communication circuit system (e.g., an RF antenna; a Bluetooth antenna) configured to receive data and / or control signals from external devices (e.g., smartphones; smart tablets; smartwatches; other remote devices operated by the recipient) and / or transmit data signals to external devices. In some other embodiments, device 300 does include a battery that can be configured to provide power to device 410 when device 300 is not within range of the power source 450. In some embodiments, the circuit system 340 can be positioned on a portion of support 310 intended to be away from the power source 450 (e.g., in front of the recipient's head), thereby shielding the electromagnetic field of the circuit system 340 relative to the power source 450 and / or allowing other portions of device 300 to be thinner.
[0051] In some embodiments, each first MI antenna 320 is currently isolated from each second MI antenna 330, and the circuit system 340 is electrically in communication with each first MI antenna 320 and each second MI antenna 330. The circuit system 340 may be independently electrically coupled to two or more first MI antennas 320 that are currently isolated from each other and / or the circuit system 340 may be independently electrically coupled to two or more second MI antennas 330 that are currently isolated from each other.
[0052] In some embodiments, the circuit system 340 is configured to select at least one first MI antenna 320 from a plurality of first MI antennas 320 in real time in response to information indicating the coupling strength of the first MI antenna 320 to the device 410. For example, the circuit system 340 may be configured to determine which of the first MI antennas 320 is sufficiently wirelessly coupled to the device 410 (e.g., which first MI antenna 320 has a coupling coefficient value with at least one MI antenna 412 greater than a predetermined threshold) and to receive signals from and / or transmit signals to the device using the selected sufficiently wirelessly coupled first MI antenna 320. In some embodiments, the circuit system 340 is configured to select at least one second MI antenna 330 from a plurality of second MI antennas 330 in real time in response to information indicating the coupling strength of the second MI antenna 320 to the power supply 450. For example, the circuit system 340 may be configured to determine which of the second MI antennas 330 is fully wirelessly coupled to the power supply 450 (e.g., which second MI antenna 330 has a coupling coefficient value with at least one external MI antenna 452 greater than a predetermined threshold) and to receive signals from and / or transmit signals to the power supply 450 using the selected fully wirelessly coupled second MI antenna 330.
[0053] In some embodiments, circuit system 340 includes a first coil driver and / or a second coil driver, the first coil driver being configured to dynamically determine an optimal load for wireless communication between at least one first MI antenna 320 and device 410, and the second coil driver being configured to dynamically determine an optimal load for wireless communication between at least one second MI antenna 330 and power supply 450. For example, the first coil driver and / or the second coil driver may receive real-time information regarding power (e.g., a higher ratio of measured transmitted power to measured received power corresponds to a higher coupling coefficient), temperature rise due to power transmission (e.g., a lower temperature rise corresponds to a higher coupling coefficient), and / or voltage or current (e.g., a higher transmitted voltage or current corresponds to a higher coupling coefficient).
[0054] In some embodiments, at least one first MI antenna 320 and / or at least one second MI antenna 330 have a fixed Q value, while in other embodiments, the circuit system 340 is configured (e.g., via a control loop) to controllably adjust the Q value of at least one first MI antenna 320 and / or at least one second MI antenna 330. The circuit system 340 may be configured to rectify the power signal received from the power supply 450 via the second MI antenna 330 and / or (e.g., via a buck / boost DC-DC power converter) adjust the load, and then drive the first MI antenna 320 (e.g., which is tuned to the frequency matching the MI antenna 412).
[0055] Figure 7 The diagram schematically illustrates the power flow from power source 450 via device 300 to apparatus 410 according to certain embodiments described herein, as well as the communication flow between power source 450, device 300, and apparatus 410. Apparatus 300 includes a plurality of first MI antennas 320a-m (e.g., each first MI antenna includes a coil driver or analog switch), a plurality of second MI antennas 330a-n (e.g., each second MI antenna includes a coil driver or analog switch), and a circuit system 340 including a first coil module 342 (e.g., a transmitter module; coil driver) electrically coupled to the first MI antennas 320a-m, a second coil module 344 (e.g., a receiver module; coil receiver) electrically coupled to the second MI antennas 330a-n, an electronic module controller 346, and a wireless communication controller 348 (e.g., operable at a 2.4 GHz, Bluetooth-compatible frequency). Although... Figure 7 The wireless communication controller 348 is shown as part of the device 300, but in some embodiments, the wireless communication controller 348 is part of a separate device (e.g., a smartphone; a smart tablet; a smartwatch; or other remote device operated by a receiver) that communicates wirelessly with the device 300.
[0056] like Figure 7As indicated by the thick arrows, power can be supplied by the circuitry 456 of power supply 450 to at least one external MI antenna 452 of power supply 450. This external MI antenna can wirelessly transmit power to at least one of a plurality of second MI antennas 330, selected by a second coil module 344 from among the plurality of second MI antennas 330a-n. The second coil module 344 can (e.g., via a flexible circuitry) receive power from at least one second MI antenna 330 and transmit the received power to an electronic module controller 346, which can transmit power to a first coil module 342 (and some power to a wireless communication controller 348). The first coil module 342 can (e.g., via a flexible circuitry) supply power to at least one first MI antenna 320, selected by the first coil module 342 from among the plurality of first MI antennas 320a-n, which can wirelessly transmit power to at least one MI antenna 412 of device 410. The power received by at least one MI antenna 412 can be provided to the control circuitry system 418 of the device 410, used by the stimulation and / or measurement circuitry system 414, or stored by the power storage circuitry system 416 for later use by the stimulation and / or measurement circuitry system 414.
[0057] like Figure 7 As indicated by the thin arrows, the various parts of the circuit system 340 communicate with each other and with the device 410 and the power supply 450. The wireless communication controller 348 can communicate with the electronic module controller 346 (e.g., via a bidirectional digital data interface), wherein commands are sent to facilitate wireless communication between the device 300, the device 410, and the power supply 450.
[0058] The second coil module 344 (e.g., a receiver module) can communicate with the electronic module controller 346 (e.g., via a bidirectional digital data interface), wherein measurement signals (e.g., indicating voltage, current, temperature, and / or power) are provided to the electronic module controller 346, and control signals (e.g., logic or pulse width modulation (PWM) signals) are provided to the second coil module 344 to determine which second MI antenna 330 has sufficient coupling with the power supply 450 and to enable and / or disable the selected second MI antenna 330.
[0059] The first coil module 342 (e.g., a transmitter module) can communicate with the electronic module controller 346 (e.g., via a bidirectional digital data interface), wherein measurement signals (e.g., indicating voltage, current, temperature, and / or power) are provided to the electronic module controller 346, and control signals (e.g., logic or pulse width modulation (PWM) signals) are provided to the first coil module 342 to determine which first MI antenna 320 has sufficient coupling with the MI antenna 412 and to enable and / or disable the selected first MI antenna 320.
[0060] The wireless communication controller 348 can communicate (e.g., via a bidirectional digital data interface) with the circuitry 456 of the power supply 450, wherein measurement signals (e.g., indicating voltage, current, temperature and / or power) are provided to the wireless communication controller 348, and control signals are provided to at least one external MI antenna 452 to enable and / or disable the selected external MI antenna 452.
[0061] The wireless communication controller 348 can communicate (e.g., via a bidirectional digital data interface) with the control circuitry 418 of the device 410, providing measurement signals (e.g., indications of voltage, current, temperature, and / or power) to the wireless communication controller 348 and control signals to the control circuitry 418 to enable and / or disable the MI antenna 412 or otherwise control the operation of the device 410. Additionally, the circuitry 456 of the power supply 450 can communicate (e.g., via a bidirectional digital data interface) with the control circuitry 418 of the device 410, transmitting data and / or commands between the device 410 and the power supply 450. For example, the circuitry 456 of the power supply 450 can be configured to receive signals from the wireless communication controller 348 and / or the control circuitry 418 of the device 410 to switch the power supply 450 between a first mode, in which power is directly supplied to the device 410, and in a second mode, in which power is supplied to the device 410 via the device 300.
[0062] Figure 8 This is a flowchart of a method 500 for optimizing load matching between device 300 and apparatus 410 and between device 300 and power supply 450, according to certain embodiments described herein. Although by referring to... Figure 2 , Figures 3A-3C , Figures 4A-4C , Figures 5A-5F and Figure 6 The example device structure is used to describe method 500, but other devices and systems with other configurations of components may also be used to perform method 500 according to some embodiments described herein.
[0063] In operation block 510, method 500 includes selecting a first coil 322 with an optimal coupling coefficient. For example... Figure 8 As shown, the selection may include sequentially enabling each first coil 322 (e.g., while disabling other first coils 322) and adjusting (e.g., scanning) the duty cycle of the first coil module 342 to maximize the output load of the first coil 322. The selection may also include measuring at least one parameter indicating the coupling coefficient between the first coil 322 and at least one MI antenna 412 (e.g., a communication coil) of the device 410. The measured at least one parameter may include the transmitted power, the temperature rise due to power transmission, and / or the transmitted voltage or current. The selected first coil 322 may be the first coil 322 with the largest coupling coefficient compared to the other first coils 322.
[0064] In operation block 520, method 500 further includes selecting a second coil 332 with an optimal coupling coefficient. For example... Figure 8 As shown, this selection may include sequentially enabling each second coil 332 (e.g., simultaneously disabling other second coils 332) and adjusting (e.g., scanning) the duty cycle of the second coil module 344 to maximize the output load of the second coil 332. This selection may also include measuring at least one parameter indicating the coupling coefficient between the second coil 332 and at least one external MI antenna 452 (e.g., a communication coil) of the power supply 450. The measured at least one parameter may include the transmitted power, the temperature rise due to power transmission, and / or the transmitted voltage or current. The selected second coil 332 may be the second coil 332 with the largest coupling coefficient compared to other second coils 332. By selecting the first and second coils 322, 332 with optimal coupling coefficients, some embodiments described herein expose the receiver to lower electromagnetic emissions and / or lower specific absorption rate (SAR) and / or are more power efficient than conventional systems.
[0065] In operation block 530, method 500 also includes ensuring that the global load matching of the selected first and second coils 322, 332 is optimized. For example... Figure 8As shown, at least one parameter can be remeasured and global load matching can be evaluated. For example, the coupling between device 410 and power supply 450 can be compared to a predetermined threshold level (e.g., 50%), and if the coupling is greater than the predetermined threshold level, global load matching can be considered optimized. At least one parameter can be remeasured at predetermined time intervals to ensure that coupling remains optimized. If coupling is not optimized (e.g., coupling is less than the predetermined threshold level), the duty cycles of the first coil module and the second coil module 342, 344 can be adjusted (e.g., scanned) to maximize the output load of the selected first coil and the second coil 322, 332. The at least one parameter can be measured, and global load matching can be compared to the predetermined threshold level. If coupling is still not optimized, operation blocks 510, 520 can be executed.
[0066] Figure 9 This is a flowchart of an example method 600 for operating device 300 according to certain embodiments described herein. Although by reference... Figure 2 , Figures 3A-3C , Figures 4A-4C , Figures 5A-5F and Figure 6 The example device structure is used to describe method 600, but other devices and systems with other configurations of components may also be used to perform method 600 according to some of the embodiments described herein.
[0067] In operation block 610, method 600 includes providing a device (e.g., device 300) to be worn on the head of a recipient. The device may include a first communication coil (e.g., first coil 322) and a plurality of second communication coils (e.g., second coil 332). The first communication coil may be wirelessly coupled to an implanted communication coil within the head (e.g., the communication coil of MI antenna 412). The plurality of second communication coils may substantially surround the head.
[0068] In operation frame 620, method 600 further includes periodically receiving information indicating at least one operating parameter of the device and / or the comfort of the recipient while the device is worn on the head and the position and / or orientation of the head relative to a power source (e.g., power source 450) below the head is changed. For example, the at least one operating parameter may indicate the wireless power transmission efficiency (e.g., coupling coefficient) between the power source and the second communication coil, and may include at least one of the following: a measurement of power received from the power source; a measurement of power transmitted from the power source; a measurement of the temperature rise of the second communication coil; a measurement of the voltage of the second communication coil; battery state of charge; battery charging time; historical battery usage data (e.g., information obtained from charging schedules, such as sleep schedule habits; other information obtained as part of extending the battery life of the device). As another example, the temperature of the recipient's body (e.g., skin) can be used as information indicating the recipient's comfort level, and this temperature can be measured by a temperature sensor on or within the device or in operative communication with the device (e.g., a temperature sensor on or within an implant that includes an implanted communication coil and is configured to communicate with the device, for example, via telemetry) (e.g., a thermistor; a thermocouple).
[0069] In operation block 630, method 600 further includes periodically selecting a second communication coil from a plurality of second communication coils in response to received information, and receiving power from a power source via the selected second communication coil. For example, periodically selecting the second communication coil may include selecting the second communication coil from a plurality of second communication coils that has the highest wireless power transmission efficiency (e.g., coupling coefficient with the power source).
[0070] In some embodiments where the device includes a plurality of first communication coils, method 600 may further include receiving second information indicating the efficiency of wireless power transmission between the first communication coils and the implanted communication coil when the device is worn on the head. For example, the second information may include at least one of the following: a measurement of the power received by the implanted communication coil; a measurement of the power transmitted from the first communication coil; a measurement of the temperature rise of the first communication coil; and a measurement of the voltage of the first communication coil.
[0071] In operation block 640, method 600 further includes providing the received power to the implanted communication coil via the first communication coil.
[0072] While common terminology is used to describe systems and methods of certain embodiments for ease of understanding, these terms are used herein for their broadest reasonable interpretation. Although various aspects of this disclosure are described with respect to illustrative examples and embodiments, the disclosed examples and embodiments should not be construed as limiting. Unless otherwise specifically stated, or understood otherwise in the context used, conditional language such as “can,” “could,” “might,” or “may” is generally intended to convey that a particular embodiment includes a particular feature, element, and / or step, while other embodiments do not. Therefore, such conditional language is generally not intended to imply that features, elements, and / or steps are required in any way for one or more embodiments, or to imply that one or more embodiments must include logic for determining whether such features, elements, and / or steps are included in or will be performed in any particular embodiment, with or without user input or prompting. Specifically, the terms “comprises” and “comprising” should be interpreted as referring to an element, component, or step in a non-exclusive manner, indicating that the referenced element, component, or step may be present in or utilize other elements, components, or steps not expressly referenced, or may be combined with such other elements, components, or steps.
[0073] It should be recognized that the embodiments disclosed herein are not mutually exclusive and can be combined with each other in various arrangements. Furthermore, although the disclosed methods and apparatuses are described largely in the context of various devices, the various embodiments described herein can be incorporated into a variety of other suitable devices, methods, and contexts. More generally, as will be understood, certain embodiments described herein can be used in the context of various implantable medical devices that can benefit from certain properties described herein.
[0074] As used herein, degree language such as the terms “approximately,” “about,” “roughly,” and “substantially” indicates a value, quantity, or characteristic that is close to the stated value, quantity, or characteristic while still performing the desired function or achieving the desired result. For example, the terms “approximately,” “about,” “roughly,” and “substantially” can refer to a quantity within ±10%, ±5%, ±2%, ±1%, or ±0.1% of the stated quantity. As another example, the terms “generally parallel” and “substantially parallel” refer to a value, quantity, or characteristic that deviates from exact parallelism by ±10, ±5, ±2, ±1, or ±0.1 degrees, and the terms “generally perpendicular” and “substantially perpendicular” refer to a value, quantity, or characteristic that deviates from exact perpendicularity by ±10, ±5, ±2, ±1, or ±0.1 degrees. The scope of this disclosure also covers any and all overlapping, subscopes, and combinations thereof. Language such as “up to,” “at least,” “greater than,” “less than,” “between,” etc., includes the enumerated numbers. As used herein, unless the context clearly indicates otherwise, “a / an” and “the” have the meaning of the plural. Additionally, as used in the description herein, unless the context clearly indicates otherwise, “in” has the meaning of “towards” and “on”.
[0075] Although the methods and systems are discussed in this paper based on elements marked by ordinal adjectives (e.g., first, second, etc.), ordinal adjectives are used only as markers to distinguish one element from another (e.g., one signal from another signal, or one circuit from another circuit), and ordinal adjectives are not used to indicate the order of these elements or their order of use.
[0076] The invention described and claimed herein is not limited in scope to the specific exemplary embodiments disclosed herein, as these embodiments are intended to be illustrative of several aspects of the invention and not to limit it. Any equivalent embodiments are intended to be within the scope of the invention. In fact, various modifications in form and detail of the invention will become apparent to those skilled in the art based on the foregoing description, in addition to those shown and described herein. Such modifications are also intended to fall within the scope of the claims. The breadth and scope of the invention should not be limited to any of the exemplary embodiments disclosed herein, but should be defined only by the claims and their equivalents.
Claims
1. An apparatus comprising: A support member configured to be worn externally over a portion of the recipient's body; At least one first magnetic induction (MI) antenna, the at least one first MI antenna being fixed to the support and configured to wirelessly communicate with an implanted device on or within the body part; One or more second MI antennas, the one or more second MI antennas being fixed to the support and distributed across the support such that the one or more second MI antennas at least partially surround the body portion, and the one or more second MI antennas being configured such that at least one of the one or more second MI antennas wirelessly communicates with the power source relative to the body portion at multiple locations and / or orientations adjacent to the power source of the support. as well as A circuit system in electrical communication with the at least one first MI antenna and the one or more second MI antennas, the circuit system being configured to transmit electrical signals between the at least one first MI antenna that is in wireless communication with the implanted device and the at least one second MI antenna that is in wireless communication with the power supply.
2. The device of claim 1, wherein the support includes a headpiece, and the body portion includes the head of the recipient.
3. The device according to claim 1 or claim 2, wherein the support is configured to hold the one or more second MI antennas such that the one or more second MI antennas are distributed around the periphery of the body portion.
4. The device according to any of the preceding claims, wherein the at least one first MI antenna comprises a substantially flat and flexible first coil.
5. The device according to any of the preceding claims, wherein the one or more second MI antennas comprise a plurality of substantially flat and flexible second coils.
6. The device according to any of the preceding claims, wherein the one or more second MI antennas overlap with the at least one first MI antenna.
7. The device of claim 6, further comprising a layer between the at least one first MI antenna and the one or more second MI antennas.
8. The device of claim 7, wherein the layer is configured to reduce the cross-coupling between the at least one first MI antenna and the one or more second MI antennas.
9. The device according to any of the preceding claims, wherein each of the one or more second MI antennas comprises a plurality of rings, the plurality of rings being equal to each other and having substantially equal widths.
10. The device according to any of the preceding claims, wherein the at least one first MI antenna is tuned to a first frequency for wireless communication with the implanted device, and each of the one or more second MI antennas is tuned to a second frequency for wireless communication with the power supply, the second frequency being different from the first frequency.
11. The device according to any of the preceding claims, wherein the circuitry is configured to select the at least one second MI antenna from the one or more second MI antennas in real time in response to information indicating the coupling strength of the one or more second MI antennas to the power supply.
12. The device according to any of the preceding claims, wherein the implantation device is an implantation portion of an acoustic prosthesis system positioned on the surface of the recipient's skull.
13. A method comprising: A device is provided to be worn on the head of a recipient, the device including a first communication coil and one or more second communication coils, the first communication coil being wirelessly coupled to an implanted communication coil within the head, the one or more second communication coils substantially surrounding the head; When the device is worn on the head and the position and / or orientation of the head relative to the power source below the head are changed, information indicating at least one operating parameter of the device and / or the comfort of the recipient is periodically received. In response to the received information, a second communication coil of the one or more second communication coils is periodically selected, and power is received from the power source via the selected second communication coil; as well as The received power is supplied to the implanted communication coil via the first communication coil.
14. The method of claim 13, wherein the at least one operating parameter indicates the wireless power transfer efficiency between the power source and the one or more second communication coils.
15. The method of claim 14, wherein the information includes at least one of the following: a measurement of power received from the power source; a measurement of power transmitted from the power source; a measurement of the temperature rise of the one or more second communication coils; a measurement of the voltage of the one or more second communication coils; battery state of charge; battery charging time; and historical battery usage data.
16. The method of claim 14 or claim 15, wherein periodically selecting the second communication coil includes selecting the second communication coil having the highest wireless power transmission efficiency among the one or more second communication coils.
17. The method of any one of claims 13 to 16, wherein the device includes one or more first communication coils, and the method further includes receiving second information indicating the wireless power transmission efficiency between the one or more first communication coils and the implanted communication coil when the device is worn on the head.
18. The method of claim 17, wherein the second information includes at least one of the following: a measurement of power received by the implanted communication coil; a measurement of power transmitted from the one or more first communication coils; a measurement of the temperature rise of the one or more first communication coils; and a measurement of the voltage of the one or more first communication coils.
19. An apparatus comprising: A first communication coil is configured to be worn on a first positioning point on the head of a receiver above the device, such that the first communication coil communicates wirelessly with the device. A second communication coil is configured to be worn on the head of the recipient at a second location different from the first location, and the second communication coil is configured to communicate wirelessly with a power source on which the head of the recipient rests. as well as A circuit system that is in electrical communication with the first communication coil and the second communication coil, the circuit system being configured to transmit power wirelessly received from the power source via the second communication coil to the device via the first communication coil.
20. The device of claim 19, wherein the first position is located on a first side of the recipient's head, and the second position is located on a second side of the recipient's head, the second side being opposite to the first side.
21. The device according to claim 19 or claim 20, wherein the first communication coil at the first location and the second communication coil at the second location at least partially overlap.
22. The device according to any one of claims 19 to 21, wherein the power is transmitted to the device via a first communication coil via a first frequency carrier, and the power is received from the power source via a second communication coil via a second frequency carrier different from the first frequency carrier.
23. The device of claim 22, wherein the first frequency carrier is compatible with short-range transmission and the second frequency carrier is compatible with long-range transmission.
24. The device of claim 22 or claim 23, wherein the circuitry is configured to convert the power from the second frequency carrier to the first frequency carrier.