Flow control method, apparatus, and medium for a sprinkler device

Abstract

This application discloses a flow control method, apparatus, and medium for a spray device. The flow control method includes setting a target outflow rate at the outlet of the spray device; determining a predetermined liquid level within the spray device; introducing at least two chemical solutions into the inlet of the spray device to mix them within the device, forming a mixture, with the mixture being discharged from the outlet simultaneously with the inlet; and controlling the inlet flow rate such that when the inlet inflow time is a first predetermined time, the liquid level within the spray device increases to the predetermined level, and the inlet flow rate equals the target outflow rate, and the outlet flow rate is close to or equal to the target outflow rate, so that the mixing time of the mixture within the spray device is a second predetermined time. This application enables the mixture to mix within the spray device for a second predetermined time, which helps achieve better substrate treatment results when the mixture is supplied to the substrate surface.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a flow control method, device and medium for a spray device. Background Technology

[0002] In semiconductor substrate processing, SPM (Sulfuric Acid Hydrogen Peroxide Mixture) is commonly used to remove photoresist. Sulfuric acid solution and hydrogen peroxide are passed into a spray system, where they mix to form the SPM solution, which is then supplied to the substrate surface. When the sulfuric acid reacts with the hydrogen peroxide, it generates carboxylic acid, which has a very strong oxidizing power. This carboxylic acid can oxidize the photoresist on the substrate, thereby removing it.

[0003] Research indicates that when sulfuric acid and hydrogen peroxide are mixed for a predetermined time, the concentration of carboxylic acid in the SPM solution is highly conducive to achieving a better degumming effect.

[0004] How to ensure that sulfuric acid and hydrogen peroxide are mixed in the spraying device for a predetermined time is a technical problem that needs to be solved. Summary of the Invention

[0005] The purpose of this application is to solve the problem in the prior art of how to mix sulfuric acid and hydrogen peroxide in a spraying device for a predetermined time so as to supply it to the substrate surface to achieve a better adhesive removal effect.

[0006] To address the aforementioned problems, the first aspect of this application proposes a flow control method for a spraying device used to supply a mixture to the surface of a substrate, comprising the following steps:

[0007] Set the target liquid flow rate at the outlet of the spray device;

[0008] Determine the predetermined liquid level height within the spray system;

[0009] At least two kinds of chemical solutions are introduced into the inlet of the spraying device to mix them within the device, forming a mixture. Simultaneously, the mixture is discharged from the outlet.

[0010] The inlet flow rate is controlled such that when the inlet duration is a first predetermined duration, the liquid level in the spray device increases to a predetermined level, and the inlet flow rate is equal to the target outlet flow rate, and the outlet flow rate is close to or equal to the target outlet flow rate, so that the mixing time of the mixed liquid in the spray device is a second predetermined duration.

[0011] A second aspect of this application provides a substrate processing apparatus, comprising:

[0012] A chamber for accommodating the substrate;

[0013] A spray device for supplying a mixture to the substrate within the chamber; and

[0014] The control device is operable to control the spraying device to implement the flow control method described above.

[0015] A third aspect of this application provides a computer-readable medium having computer instructions stored thereon, which, when executed by a processor, implement the flow control method described above.

[0016] This application controls the inlet flow rate of the spray device by combining the target outflow rate and the predetermined liquid level height in the spray device. When the inlet time is a first predetermined time, the liquid level height in the spray device increases to the predetermined liquid level height, and the inlet flow rate is equal to the target outflow rate. The outflow rate of the outlet is close to or equal to the target outflow rate. This ensures that the mixing time of the mixed liquid entering the spray device is a second predetermined time, so that the mixed liquid can achieve a better substrate treatment effect when supplied to the substrate surface.

[0017] Other features and corresponding beneficial effects of this application will be described in the latter part of the specification, and it should be understood that at least some of the beneficial effects will become obvious from the description in this application. Attached Figure Description

[0018] Figure 1 This is a schematic flowchart of a flow control method for a spray device according to an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the structure of a spray device according to an embodiment of this application;

[0020] Figure 3a This is a schematic diagram of the structure of a spray device according to another embodiment of this application;

[0021] Figure 3b This is a schematic diagram of a spray device according to another embodiment of this application;

[0022] Figure 4 This is a schematic diagram of the structure of a spray device according to another embodiment of this application;

[0023] Figure 5 The concentration-time curve of carboxylic acid generated according to an embodiment of this application;

[0024] Figure 6 This is a schematic diagram illustrating the relationship between the inlet flow rate and the outlet flow rate according to an embodiment of this application;

[0025] Figure 7 This is a schematic diagram illustrating the relationship between the inlet flow rate and the outlet flow rate according to another embodiment of this application; and

[0026] Figure 8 This is a schematic diagram of a substrate processing apparatus according to an embodiment of this application. Detailed Implementation

[0027] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with preferred embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0028] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0033] The flow control method for a spray apparatus provided in the first aspect of this application can be implemented via a control device in a substrate processing apparatus provided in the second aspect of this application. The substrate processing apparatus is further configured with a chamber and a spray apparatus, and the control device controls the spray apparatus to supply a mixture to the substrate within the chamber. The control device can be a computing device, such as a computer, configured with a memory and a processor, etc. The memory includes, but is not limited to, the computer-readable medium provided in the third aspect of this application, on which computer instructions are stored. When these computer instructions are executed by the processor, the flow control method is implemented.

[0034] The working principle of the control device described above will first be described with reference to some embodiments of flow control methods for sprinkler systems. Those skilled in the art will understand that these embodiments of flow control methods are merely non-limiting implementations provided in this application, intended to clearly demonstrate the main concepts of this application and provide specific solutions convenient for public implementation, rather than limiting all functions or operating modes of the control device. Similarly, the control device does not limit the executing entity or the execution order of the steps in these flow control methods.

[0035] Figure 1 A schematic flowchart of a flow control method for a spray device according to an embodiment of this application is shown. In other embodiments, additional operations may be added to these processes, or one or more operations may be removed from these processes.

[0036] refer to Figure 1 As shown, a flow control method for a spray device includes the following steps:

[0037] Set the target liquid flow rate at the outlet of the spray device;

[0038] Determine the predetermined liquid level height within the spray system;

[0039] At least two kinds of chemical solutions are introduced into the inlet of the spraying device to mix them within the device, forming a mixture. Simultaneously, the mixture is discharged from the outlet.

[0040] The inlet flow rate is controlled such that when the inlet duration is a first predetermined duration, the liquid level in the spray device increases to a predetermined level, and the inlet flow rate is equal to the target outlet flow rate, and the outlet flow rate is close to or equal to the target outlet flow rate, so that the mixing time of the mixed liquid in the spray device is a second predetermined duration.

[0041] Figures 2 to 4 Schematic diagrams of the spraying device in different embodiments of this application are shown. For convenience, in... Figures 2 to 4 Only one inlet 13 is shown in the diagram. In actual processes, inlet 13 may include a first inlet and a second inlet, used to introduce two different liquids respectively. The inlet flow rate is the sum of the first inlet flow rate and the second inlet flow rate.

[0042] refer to Figures 2 to 4 The aforementioned at least two solutions include, for example, sulfuric acid (H2SO4) and hydrogen peroxide (H2O2). Sulfuric acid and hydrogen peroxide are mixed within the spray device 100 to form SPM (Sulfuric Acid Hydrogen Peroxide Mixture). When sulfuric acid and hydrogen peroxide are mixed together, the following chemical reaction occurs:

[0043] H₂SO₄ + H₂O₂ → H₂SO₅ + H₂O

[0044] As shown in the above chemical equation, sulfuric acid and hydrogen peroxide react to form peroxysulfuric acid, also known as carboxylic acid (H2SO5). Carboxylic acid has a very strong oxidizing power and can easily react with organic compounds such as benzene and phenol, decomposing them into products such as carbon dioxide, thereby achieving a removal effect. This strong ability to remove organic matter makes the mixture of sulfuric acid and hydrogen peroxide (SPM solution) suitable for removing photoresist. The photoresist removal effect of the SPM solution is related to the concentration of carboxylic acid and the temperature of the SPM solution. In this embodiment, the sulfuric acid temperature introduced into the spray device 100 can be an ultra-high temperature of 170°C or higher, such as 180°C or 190°C. After the ultra-high temperature sulfuric acid above 170°C is mixed with room temperature hydrogen peroxide in the spray device 100, the temperature will rise to a higher temperature than 170°C, such as above 200°C. The SPM solution at this temperature can significantly improve the photoresist removal effect and help save the amount of sulfuric acid used. At the same time, within a reasonable range, the higher the temperature of the SPM solution, the faster the carboxylic acid is generated. The formation of carboxylic acid is accompanied by decomposition, and the decomposition rate increases with increasing temperature. The reaction process is represented as follows:

[0045] H2SO4+H2O2→H2SO5→H2SO4+1 / 2O2

[0046] Figure 5 The concentration versus time curve for the formation of carboxylic acid is shown. Figure 5 In the graph, the horizontal axis represents the mixing time of sulfuric acid and hydrogen peroxide, in minutes, and the vertical axis represents the concentration of carboxylic acid formed by the mixture of sulfuric acid and hydrogen peroxide, in mol / m³. 3 . refer to Figure 5 The peak value of the curve and the range near the peak value represent the optimal working range for achieving the maximum degumming effect. Sulfuric acid and hydrogen peroxide remain in the spray device 100 for a second predetermined time t for mixing. a The range is: minimum second predetermined duration t a_min ≤Second scheduled duration t a ≤ Maximum second scheduled duration t a_max Second scheduled duration t a The value can be adjusted according to the SPM solution temperature required by the process. For example, the second predetermined time t a The time interval is from a few seconds to a few minutes after the sulfuric acid and hydrogen peroxide are mixed. This is achieved by controlling the second predetermined time t for the mixing of sulfuric acid and hydrogen peroxide within the spray device 100. a This allows for control over the SPM solution to achieve a target state. This target state could be, for example, a carboxylic acid concentration close to or even at its peak, or other desired process parameters, such as optimal SPM solution temperature or minimum gas content. When the SPM solution reaches this target state and is supplied to the substrate surface, the best resist removal effect can be achieved in the shortest process time with the lowest solution cost.

[0047] Refer again Figures 2 to 4 In this application, while liquid is introduced into the spray device 100 through the inlet 13, the outlet 15 is in a draining state. The inlet flow rate of the spray device 100 is controlled by combining the target outlet flow rate and the predetermined liquid level height in the spray device 100. When the inlet time is a first predetermined time, the liquid level height in the spray device 100 increases to the predetermined liquid level height, and the inlet flow rate is equal to the target outlet flow rate. The outlet flow rate is close to or equal to the target outlet flow rate. This ensures that the mixing time of the SPM solution entering the spray device 100 is a second predetermined time, so that the SPM solution can achieve a better adhesive removal effect when supplied to the substrate surface. The determination of the predetermined liquid level height and the first predetermined time is described in detail below.

[0048] exist Figure 2In the example shown, the spray device 100 includes an inner cavity 11, which is cylindrical in shape. In some other embodiments, the inner cavity 11 may also be other shapes, such as triangular prism, square prism, ellipse, etc.

[0049] In some embodiments, a target outlet flow rate, a second predetermined duration for the mixture to remain in the spray device 100 for mixing, and the cross-sectional area of ​​the outlet 15 are set according to process requirements, and the predetermined liquid level height is then determined using Bernoulli's equation. (Refer to reference...) Figure 2 The detailed steps are as follows:

[0050] According to Bernoulli's equation, the relationship between the average flow velocity u0 of the mixture at outlet 15 and the liquid level height H at time t is expressed by formula (1):

[0051]

[0052] Where ε is the velocity coefficient and g is the gravitational acceleration;

[0053] Based on the above formula (1), the outflow rate Q of outlet 15 at time t is obtained. out The relationship between the average flow velocity u0 of the mixture at outlet 15 and the flow velocity u0 is expressed by formula (2):

[0054]

[0055] Where A0 is the cross-sectional area of ​​the outlet 15. If the cross-sectional shape of the outlet 15 is, for example, circular, then... d0 is the diameter of the liquid outlet 15.

[0056] Combining formulas (1) and (2) above, and given a determined target liquid flow rate, the flow rate within the spray device 100 (e.g., ...) can be obtained using the following formula. Figure 2 The final liquid level height H in the inner cavity 11 is expressed by formula (3):

[0057]

[0058] Determine the final liquid level height H (t＝∞) This is the predetermined liquid level height.

[0059] Furthermore, according to the second predetermined time t during which the mixture remains in the spray device 100 for mixing... a The volume V of the mixed liquid can be obtained. t＝∞ =Q out(t＝∞) *t a

[0060] Therefore, when designing the internal structure of the spraying device 100, in order to facilitate the containment of the liquid medicine, the internal volume of the spraying device 100 must meet the following requirement: the internal volume is greater than V. t＝∞ The internal height of the spray device 100 is greater than H. (t＝∞) .

[0061] In some embodiments, such as Figure 2 The spray device 100 includes an inner cavity 11. The step of introducing at least two kinds of medicinal liquids into the liquid inlet 13 of the spray device 100 includes a step of how to obtain a first predetermined duration, and the detailed steps are described below:

[0062] exist Figure 2 In the example shown, at least two kinds of liquid are introduced into the inner cavity 11 through inlet 13, which is shown as one inlet. Inlet 13 can also be two, for example, sulfuric acid and hydrogen peroxide are introduced respectively, and the inlet flow rate is the sum of the sulfuric acid flow rate and the hydrogen peroxide flow rate.

[0063] The first predetermined time t required for the liquid level to rise from outlet 15 to the predetermined liquid level height can be obtained according to the following formula (4):

[0064]

[0065] in,

[0066] Q in This refers to the inlet flow rate;

[0067] Q out This refers to the outflow rate;

[0068] A0 is the cross-sectional area of ​​the liquid outlet 15;

[0069] Let A be the cross-sectional area of ​​the inner cavity 11. The cross-sectional shape of the inner cavity 11 is, for example, a circle. D is the diameter of the inner cavity 11;

[0070] g is the acceleration due to gravity;

[0071] ε is the velocity coefficient.

[0072] The derivation of formula (4) is explained below:

[0073] At time t, the volume change of the mixed liquid in cavity 11 is as follows:

[0074]

[0075] Combining equations (2) and (4.1), we obtain...

[0076]

[0077] As an example, for ease of calculation, let a = A. c = Q in , Equation (4.2) can be simplified to obtain

[0078]

[0079] Separating variables from formula (4.3) yields

[0080]

[0081] Integrating equation (4.4) yields

[0082]

[0083] Let a=A, c = Q in , Substituting into formula (4.5), we get

[0084]

[0085] When t = 0, H (t＝0) =0, thus obtaining

[0086]

[0087] Substituting formula (4.7) into formula (4.6), we get

[0088]

[0089] Factor out the common factor and get

[0090]

[0091] Combining formulas (2) and (4.8), we obtain

[0092]

[0093] By extracting the common factor, formula (4) is finally derived:

[0094]

[0095] In some embodiments, such as Figure 3a The first predetermined duration can also be obtained through the following steps, as explained below:

[0096] exist Figure 3a In the example shown, the spray device 100 includes an inner cavity 11, and an outlet 15 extends outward from the bottom of the inner cavity 11. The first predetermined duration includes a first predetermined liquid supply duration and a second predetermined liquid supply duration. The step of introducing at least two kinds of liquid into the inlet 13 of the spray device 100 includes:

[0097] During the first liquid supply stage, the liquid level rises from the bottom of the outlet 15 to the bottom of the inner cavity 11, meaning the mixture is full. Figure 3a The liquid outlet 15 in the middle, Figure 3a The outlet 15 shown can be considered as an outlet pipe. The liquid level is denoted as h1. The first predetermined liquid supply time t1 required for the liquid level to increase from 0 to h1 is obtained according to the following formula:

[0098]

[0099] in,

[0100] In the second liquid supply stage, the liquid level rises from the bottom of the inner cavity 11 to the predetermined liquid level height, denoted as h2. The second predetermined liquid supply time t2 required for the liquid level to rise from h1 to h2 is obtained according to the following formula:

[0101]

[0102] Substituting into and Solving for the difference between the two solutions yields the second predetermined liquid supply duration t2; combined with... Figure 3b Regarding the Q here out(t′) and Q out(t″) The explanation is as follows:

[0103] refer to Figure 3b The liquid level heights h1 and h2 shown in the left model are the same as those shown in the right model. The second predetermined liquid supply time t2 shown in the left model can be equivalent to the time t2' required for the liquid level to increase from h1 to h2 in the right model. For the right model, the time t2' = t” - t', where t” is the time required for the liquid level to increase from 0 to h1+h2, and t' is the time required for the liquid level to increase from 0 to h1. Combining this with formula (2), we have: and Substitute these two values ​​into formula (6) respectively to solve the problem. The difference between the two solutions is the second predetermined liquid supply time t2.

[0104] The first predetermined duration t = t1 + t2;

[0105] In the above formula,

[0106] Q in This refers to the inlet flow rate;

[0107] Q out This refers to the outflow rate;

[0108] A0 is the cross-sectional area of ​​the liquid outlet 15;

[0109] Let A be the cross-sectional area of ​​the inner cavity 11. The cross-sectional shape of the inner cavity 11 is, for example, a circle. D is the diameter of the inner cavity 11;

[0110] h1 is the liquid level height from the bottom of the outlet 15 to the bottom of the inner cavity 11;

[0111] h2 is the liquid level height from the bottom of the inner cavity 11 to the predetermined liquid level height;

[0112] g is the acceleration due to gravity;

[0113] ε1 and ε2 are the flow rate coefficients of the first and second liquid supply stages, respectively.

[0114] It should be noted that Figure 3a In the example shown, the shape of the outlet 15 is similar to that of the inner cavity 11, both being cylindrical. During the first liquid supply stage, the liquid level rises from the bottom to the top of the outlet 15, based on the volume of the mixed liquid in the outlet 15: dV (t) =A0dH (t) H (t＝t1) =h1, A0 is the cross-sectional area of ​​the outlet 15. The derivation process of formula (5) can refer to the derivation process of formula (4) above. In some other embodiments, the shape of the outlet 15 can also be conical, triangular prism or square prism, etc. Accordingly, the formula and derivation process for calculating the first predetermined liquid supply time t1 are adapted to the shape of the outlet 15.

[0115] During the second liquid supply phase, the liquid level rises from the bottom of the inner cavity 11 to the predetermined liquid level height, H (t＝t1+t2) =Predetermined liquid level height, and Figure 2 The example shown is similar, so the derivation process of formula (6) can also refer to the derivation process of formula (4) above, and will not be repeated here.

[0116] In some embodiments, such as Figure 4 The first predetermined duration can also be obtained through the following steps, as explained below:

[0117] exist Figure 4 In the example shown, the spray device 100 includes an inner cavity 11, which includes a conical section 111 and a cylindrical section 112 that are in communication with each other, and an outlet 15 extends outward from the bottom of the conical section 111. The first predetermined duration includes a first predetermined liquid supply duration, a second predetermined liquid supply duration, and a third predetermined liquid supply duration. The step of introducing at least two kinds of liquid into the inlet 13 of the spray device 100 includes:

[0118] During the first liquid supply stage, the liquid level rises from the bottom of the outlet 15 to the bottom of the conical section 111, meaning the mixture is full. Figure 4The liquid outlet 15 in the middle, Figure 4 The outlet 15 shown can be considered as an outlet pipe. The liquid level is denoted as h1. The first predetermined liquid supply time t1 required for the liquid level to increase from 0 to h1 is obtained according to the following formula:

[0119]

[0120] in,

[0121] In the second liquid supply stage, the liquid level rises from the bottom to the top of the conical section 111, and the liquid level height is denoted as h2. The relationship between the change in the volume of the mixed liquid in the conical section 111 and the liquid level height is obtained according to the following formula:

[0122]

[0123] Based on the boundary condition t=0, H (t＝t1) =h1, solve for the value of t in the above formula (8), and obtain Figure 4 In the example shown, the liquid level increases from the bottom to the top of the conical segment 111, i.e., from h1 to h2, requiring a second predetermined liquid supply time t2. In this embodiment, the Runge-Kutta methods can be used. Substituting the boundary condition t=0, H... (t＝t1) =h1, solve for the value of t in the above formula (8), preferably using the first-order Runge-Kutta method.

[0124] In the third liquid supply stage, the liquid level rises from the top of the conical section 111 to the predetermined liquid level height, denoted as h3. The third predetermined liquid supply time t3 required for the liquid level to rise from h1+h2 to h3 is obtained according to the following formula:

[0125]

[0126] Substituting into and

[0127] Solving for the solution, the difference between the two solutions is t3; here, Q... out(t′) and Q out(t″) Please refer to the explanation in formula (6) above.

[0128] The first predetermined duration t = t1 + t2 + t3;

[0129] In the above formula,

[0130] Q in This refers to the inlet flow rate;

[0131] Q out This refers to the outflow rate;

[0132] A0 is the cross-sectional area of ​​the liquid outlet 15;

[0133] A is the cross-sectional area of ​​the inner cavity 11;

[0134] H represents the liquid level at time t;

[0135] h1 is the height of the liquid level as it rises from the bottom of the outlet 15 to the bottom of the conical section 111;

[0136] h2 is the liquid level height from the bottom of the conical section 111 to the top of the conical section 111;

[0137] h3 is the liquid level height from the top of the conical section 111 to the predetermined liquid level height;

[0138] g is the acceleration due to gravity;

[0139] ε1, ε2, and ε3 are the flow rate coefficients for the first, second, and third liquid supply stages, respectively.

[0140] θ is the angle between the inclined plane of the conical segment 111 and the vertical direction.

[0141] It should be noted that Figure 4 In the example shown, the shape of the outlet 15 is similar to that of the inner cavity 11, both being cylindrical. During the first liquid supply stage, the liquid level rises from the bottom to the top of the outlet 15, based on the volume of the mixed liquid in the outlet 15: dV (t) =A0dH (t) H (t＝t1) =h1, A0 is the cross-sectional area of ​​the outlet 15, and the derivation process of formula (7) can adopt the derivation process of formula (4) above. In some other embodiments, the shape of the outlet 15 can also be conical, triangular prism or square prism, etc. Accordingly, the formula and derivation process for calculating the first predetermined liquid supply time t1 are adapted to the shape of the outlet 15.

[0142] During the third liquid supply stage, the liquid level rises from the bottom of the inner cavity 11 to the predetermined liquid level height, and... Figure 2 The example shown is similar, so the derivation process of formula (9) can also refer to the derivation process of formula (4) above, and will not be repeated here.

[0143] For the second liquid supply stage, the derivation process of the calculation formula (8) in the second liquid supply stage is explained in detail below:

[0144] refer to Figure 4 The diameter of the liquid surface in the conical section 111 changes with the liquid supply time. When the liquid level is in the conical section 111, it has h1. <H(t) Figure 4 The light-shaded areas represent the large cone segments, and the dark-shaded areas represent the small cone segments. When calculating the volume of cone segment 111 at time t, it can be assumed that the volume of the large cone segment changes with time, while the volume of the small cone segment remains constant.

[0145] Figure 4 In, it has:

[0146] d (t) Let d be the diameter of the liquid surface of the conical segment 111 at time t, and d0 be the diameter of the outlet 15.

[0147] Substitution get

[0148] At time t, Substitution get

[0149]

[0150] Therefore, at time t, the volume of the conical segment 111 is

[0151]

[0152] Furthermore, at time t, the diameter d of the liquid surface in the conical segment 111 is... (t) With liquid level height H (t) The relationship between them is:

[0153] d (t) =2(H (t) -h1)tanθ+d0

[0154] Substituting into formula (10), we can obtain

[0155]

[0156] Taking the derivative, we get

[0157]

[0158] Combining formulas (4.2) and (11), formula (8) is derived:

[0159]

[0160] ​The basic idea of ​​the above embodiment is to use Bernoulli's equation to calculate the liquid level height at a set flow rate, and then calculate the time required to reach that liquid level height, which is the first predetermined duration. When the liquid inlet 13 has been inlet for the first predetermined duration, the spray device 100 reaches an equilibrium state. This equilibrium state is characterized by the liquid level in the inner cavity 11 being maintained at a predetermined liquid level height, the inlet flow rate being equal to the target outlet flow rate, and the outlet flow rate being close to or equal to the target outlet flow rate. In this equilibrium state, at least two kinds of liquids entering from the inlet 13 are allowed to remain in the spray device 100 for a second predetermined duration for mixing, thereby enabling the mixture of the at least two kinds of liquids (such as SPM liquid) to reach the target state described above. When the mixture in this target state is supplied to the substrate surface, it achieves a better substrate treatment effect.

[0161] In addition, based on the first predetermined duration, it can be determined when to supply the mixture for the second predetermined duration to the substrate surface, so as to efficiently process the substrate and control the process time between the current process (e.g., the resist removal process) and the previous or next process.

[0162] It should also be noted that, in Figure 2 In the example shown, the spray device 100 includes an inner cavity 11, in which Figure 3a and Figure 4 In the example shown, the spray device 100 includes an inner cavity 11 and the liquid outlet pipe described above.

[0163] Figure 6 A schematic diagram showing the relationship between the inlet flow rate and the outlet flow rate according to an embodiment of this application is shown.

[0164] In some embodiments, reference Figure 6 Control the inlet flow rate Q of inlet 13 in The steps include the first mode.

[0165] The first mode is: controlling the inlet flow rate Q. in The inlet flow rate remains constant and equal to the target outlet flow rate until the inlet duration at inlet 13 is the first predetermined duration t. For this mode, the inlet flow rate Q... in Under the condition that the output flow rate remains constant and equal to the target output flow rate, and within a reasonable process time range, the output flow rate Q out It can get very close to the target effluent flow rate, but it may be difficult to equal the target effluent flow rate, such as... Figure 6 As shown. In this mode, for the outflow rate Q out Approximately the target discharge flow rate, i.e., the discharge flow rate Q. out Approximate inlet flow rate Q in It can be Q out =KQ in The value of K can range from 0.7 to 0.99, for example, Q.out =0.99Q in .

[0166] Figure 7 A schematic diagram showing the relationship between the inlet flow rate and the outlet flow rate according to another embodiment of this application is shown.

[0167] In some embodiments, reference Figure 7 Control the inlet flow rate Q of inlet 13 in The steps include a second mode.

[0168] The second mode is: controlling the inlet flow rate Q. in The outflow rate is greater than the target outflow rate. When the inlet duration of inlet 13 is the first predetermined duration t, and the outflow rate Q is greater than the target outflow rate, the outflow rate is greater than the target outflow rate. out When the inlet flow rate is equal to the target outlet flow rate, reduce the inlet flow rate Q. in So that the inlet flow rate Q in It equals the target outflow rate.

[0169] Figures 2 to 4 In the examples shown, either the first or second mode described above can be used. It should be noted that, in comparison... Figure 6 and Figure 7 As can be seen, in the second mode, during the stage of controlling the inlet flow rate to be greater than the target outlet flow rate, the required first predetermined time is different for different inlet flow rates. The larger the inlet flow rate, the shorter the required first predetermined time, which saves process time to a certain extent.

[0170] Figure 8 This is a schematic diagram of a substrate processing apparatus according to an embodiment of this application. (Reference) Figure 8 As shown, the substrate processing apparatus 1000 includes a chamber 200, a spray device 100, and the aforementioned control device. The spray device 100 supplies a mixing liquid to the substrate 300 within the chamber 200. The control device is operable to control the spray device 100 and implement the aforementioned flow control method, so that the mixing liquid is mixed within the spray device 100 for a second predetermined time while the spray device 100 is simultaneously feeding and discharging liquid, which helps to achieve a better substrate processing effect when the mixing liquid is supplied to the substrate surface.

[0171] When the flow control method for the spray device 100 is implemented as a computer program, it can also be stored as an article of manufacture in a computer-readable storage medium. For example, a computer-readable storage medium may include, but is not limited to, magnetic storage devices (e.g., hard disks, floppy disks, magnetic stripes), optical discs (e.g., compact discs (CDs), digital multifunction discs (DVDs)), smart cards, and flash memory devices (e.g., electrically erasable programmable read-only memory (EPROM), cards, sticks, key drives). Furthermore, the various storage media described herein can represent one or more devices and / or other machine-readable media for storing information. The term "machine-readable medium" may include, but is not limited to, wireless channels and various other media (and / or storage media) capable of storing, containing, and / or carrying code and / or instructions and / or data.

[0172] It should be understood that the embodiments described above are merely illustrative. The embodiments described herein may be implemented in hardware, software, firmware, middleware, microcode, or any combination thereof. For hardware implementation, the processor may be implemented within one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, and / or other electronic units designed to perform the functions described herein, or combinations thereof.

[0173] Some aspects of this application can be executed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The aforementioned hardware or software may be referred to as a "data block," "module," "engine," "unit," "component," or "system." The processor may be one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DAPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, or combinations thereof. Furthermore, aspects of this application may manifest as computer products residing in one or more computer-readable media, including computer-readable program code. For example, computer-readable media may include, but are not limited to, magnetic storage devices (e.g., hard disks, floppy disks, magnetic tapes, etc.), optical discs (e.g., compressed CDs, digital multifunction DVDs, etc.), smart cards, and flash memory devices (e.g., cards, sticks, key drives, etc.).

[0174] A computer-readable medium may contain a propagated data signal containing computer program code, for example, on baseband or as part of a carrier wave. This propagated signal may take various forms, including electromagnetic, optical, and so on, or suitable combinations thereof. A computer-readable medium can be any computer-readable medium other than a computer-readable storage medium, which can be connected to an instruction execution system, apparatus, or device to enable communication, propagation, or transmission of a program for use. The program code located on the computer-readable medium can be propagated through any suitable medium, including radio, cable, fiber optic cable, radio frequency signals, or similar media, or any combination of the above media.

[0175] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0176] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A flow control method for a spraying device, the spraying device being used to supply a mixture to a substrate surface, characterized in that, Includes the following steps: Set the target liquid flow rate at the outlet of the spray device; Determine the predetermined liquid level height within the spray device; At least two kinds of chemical solutions are introduced into the inlet of the spraying device to mix the at least two kinds of chemical solutions within the spraying device to form a mixture. Simultaneously, the mixture is discharged from the outlet while the solution is being introduced into the inlet; and The inlet flow rate is controlled such that when the inlet duration is a first predetermined duration, the liquid level in the spray device increases to the predetermined liquid level, and the inlet flow rate is equal to the target outlet flow rate, and the outlet flow rate is close to or equal to the target outlet flow rate, so that the mixing time of the mixture in the spray device is a second predetermined duration.

2. The flow control method according to claim 1, characterized in that, The steps for determining the predetermined liquid level height within the spray device include: According to Bernoulli's equation, the relationship between the average flow velocity u0 of the mixture at the outlet and the liquid level height H at time t can be calculated using the following formula: Where ε is the velocity coefficient and g is the gravitational acceleration; The outflow rate Q at time t is calculated using the following formula. out The relationship between the average flow velocity u0 of the mixture at the outlet: Where A0 is the cross-sectional area of ​​the liquid outlet; Given a fixed target outflow rate, the final liquid level H within the spray device is obtained using the following formula: Determine the final liquid level height H (t＝∞) The predetermined liquid level height.

3. The flow control method according to claim 2, characterized in that, The spraying device includes an inner cavity, and the step of introducing at least two kinds of medicinal solutions into the inlet of the spraying device includes: The first predetermined time t required for the liquid level to rise from the outlet to the predetermined liquid level height is obtained according to the following formula: in, Q in The inlet flow rate is [value missing]. Q out The outflow rate is [missing information]. A0 is the cross-sectional area of ​​the liquid outlet; A is the cross-sectional area of ​​the inner cavity; g is the acceleration due to gravity; ε is the velocity coefficient.

4. The flow control method according to claim 2, characterized in that, The spraying device includes an inner cavity, and the liquid outlet extends outward from the bottom of the inner cavity. The first predetermined duration includes a first predetermined liquid supply duration and a second predetermined liquid supply duration. The step of introducing at least two kinds of liquid into the liquid inlet of the spraying device includes: In the first liquid supply phase, the first predetermined liquid supply time t1 required for the liquid level to rise from the bottom of the outlet to the bottom of the inner cavity is obtained according to the following formula: in, In the second liquid supply stage, the second predetermined liquid supply time t2 required for the liquid level to rise from the bottom of the inner cavity to the predetermined liquid level height is obtained according to the following formula: Substituting into and Solve for the difference between the two solutions, which is the second predetermined liquid supply duration t2; The first predetermined duration t = t1 + t2; in, Q in The inlet flow rate is [value missing]. Q out The outflow rate is [missing information]. A0 is the cross-sectional area of ​​the liquid outlet; A is the cross-sectional area of ​​the inner cavity; h1 is the liquid level height from the bottom of the outlet to the bottom of the inner cavity; h2 is the liquid level height from the bottom of the inner cavity to the predetermined liquid level height; g is the acceleration due to gravity; ε1 and ε2 are the flow rate coefficients of the first and second liquid supply stages, respectively.

5. The flow control method according to claim 2, characterized in that, The spraying device includes an inner cavity, which comprises a conical section and a cylindrical section that communicate with each other, and the liquid outlet extends outward from the bottom of the conical section. The first predetermined duration includes a first predetermined liquid supply duration, a second predetermined liquid supply duration, and a third predetermined liquid supply duration. The step of introducing at least two kinds of liquid into the liquid inlet of the spraying device includes: In the first liquid supply phase, the first predetermined liquid supply time t1 required for the liquid level to rise from the bottom of the outlet to the bottom of the conical section is obtained according to the following formula: in, During the second liquid supply stage, the liquid level rises from the bottom to the top of the conical section. The relationship between the change in the volume of the mixed liquid within the conical section and the liquid level height is obtained using the following formula: Based on the boundary condition t=0, H (t＝t1) =h1, solve for the value of t in the above formula, that is, obtain the second predetermined liquid supply time t2 required for the liquid level to increase from the bottom of the cone section to the top of the cone section; In the third liquid supply stage, the third predetermined liquid supply time t3 required for the liquid level to rise from the top of the conical section to the predetermined liquid level height is obtained according to the following formula: Substituting into and Solve the problem, and the difference between the two solutions is t3; The first predetermined duration t = t1 + t2 + t3; In the above formula, Q in The inlet flow rate is [value missing]. Q out The outflow rate is [missing information]. A0 is the cross-sectional area of ​​the liquid outlet; d0 is the diameter of the liquid outlet; A is the cross-sectional area of ​​the inner cavity; H represents the liquid level at time t; h1 is the liquid level height from the bottom of the outlet to the bottom of the conical section; h2 is the height between the bottom and the top of the conical segment; h3 is the height between the top of the conical section and the liquid level at the predetermined liquid level. g is the acceleration due to gravity; ε1, ε2, and ε3 are the flow rate coefficients for the first, second, and third liquid supply stages, respectively. θ is the angle between the inclined plane of the conical segment and the vertical direction.

6. The flow control method according to claim 1, characterized in that, The steps for controlling the inlet flow rate include: The inlet flow rate is kept constant and equal to the target outlet flow rate until the inlet duration is the first predetermined duration.

7. The flow control method according to claim 1, characterized in that, The steps for controlling the inlet flow rate include: The inlet flow rate is controlled to be greater than the target outlet flow rate. When the inlet duration is the first predetermined duration and the outlet flow rate is equal to the target outlet flow rate, the inlet flow rate is reduced so that the inlet flow rate is equal to the target outlet flow rate.

8. The flow control method according to claim 1, characterized in that, The at least two solutions include sulfuric acid and hydrogen peroxide.

9. A substrate processing apparatus, characterized in that, include: A chamber for accommodating the substrate; A spraying device for supplying a mixture to the substrate within the chamber; as well as The control device is operable to control the spraying device to implement the flow control method as described in any one of claims 1 to 8.

10. A computer-readable medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the flow control method as described in any one of claims 1 to 8 is implemented.

Images