Apparatus for spraying chemical solution and apparatus for processing substrate having the same

Abstract

A processing liquid spraying device is configured to spray a processing liquid onto a substrate being transported in an approximately horizontal direction and may include a first spraying unit and a second spraying unit. The first spraying unit may be configured to spray the processing liquid onto the substrate at a first angle from the horizontal direction along the direction in which the substrate is transported, upstream of the direction in which the substrate is transported, and the second spraying unit may be configured to spray the processing liquid onto the substrate at a second angle greater than the first angle from the horizontal direction along the direction in which the substrate is transported, downstream of the direction in which the substrate is transported.

Description

Technology Field

[0001] The present invention relates to a treatment liquid injection device and a substrate processing device including the same. More specifically, the present invention relates to a treatment liquid injection device capable of cleaning a developer remaining on a substrate by performing a development process, and a substrate processing device including the same. Background Technology

[0002] In the manufacturing of display devices such as OLEDs and QLEDs, a photolithography process can be performed to form a photoresist pattern on a substrate for manufacturing a display device. This photolithography process can be carried out by sequentially performing a coating process to apply photoresist onto a substrate, an exposure process to expose the photoresist, and a development process to selectively remove the exposed photoresist.

[0003] And after performing the development process, a cleaning process can be performed to remove the developer remaining on the substrate and to clean the developer.

[0004] The cleaning process for cleaning the aforementioned developer can be carried out by using first and second spraying units arranged parallel to each other along the direction of transport of the substrate, and each of the first and second spraying units can be configured to spray a processing solution onto the substrate at the same angle along the direction of transport of the substrate from the upstream and downstream sides, respectively, of the direction in which the substrate is transported.

[0005] Here, the processing liquid sprayed from the first and second spraying sections must flow slowly so that it remains on the substrate for a certain period of time and is sufficiently replaced with the developer to clean the developer more efficiently. However, if the sprayed liquid sprayed from the first spraying section and flowing along the direction in which the substrate is transported merges with the sprayed liquid sprayed from the second spraying section, it may not flow slowly and may flow relatively faster, and as a result, the developer may not be sufficiently cleaned.

[0006] In addition, since the treatment liquid from the second spraying unit is sprayed in a manner that adds to the upper portion of the treatment liquid sprayed from the first spraying unit, a situation may occur where the treatment liquid sprayed from the second spraying unit does not sufficiently participate in the exchange with the developer, and as a result, the developer may not be sufficiently cleaned.

[0007] As such, even though a relatively large amount of processing liquid is sprayed by providing two spraying units consisting of a first and second spraying unit, the developer cannot be sufficiently cleaned because the first and second spraying units spray the processing liquid onto the substrate at the same angle. The problem to be solved

[0008] One objective of the present invention is to provide a treatment liquid injection device capable of spraying a treatment liquid so that it remains on a substrate for a certain period of time and then flows away.

[0009] Another objective of the present invention is to provide a substrate processing apparatus comprising a processing liquid spraying unit capable of spraying a processing liquid so that it can remain on a substrate for a certain period of time and then flow away. means of solving the problem

[0010] A treatment liquid spraying device according to exemplary embodiments of the present invention for achieving the above-mentioned objective is configured to spray a treatment liquid onto a substrate being transported in a roughly horizontal direction, and may include a first spraying unit and a second spraying unit. The first spraying unit may be configured to spray the treatment liquid onto the substrate at a first angle from the horizontal direction along the direction in which the substrate is transported, upstream of the direction in which the substrate is transported, and the second spraying unit may be configured to spray the treatment liquid onto the substrate at a second angle greater than the first angle from the horizontal direction along the direction in which the substrate is transported, downstream of the direction in which the substrate is transported.

[0011] In exemplary embodiments, since the transfer of the substrate may be hindered if the processing liquid is sprayed in a direction opposite to the direction in which the substrate is transferred, the first spraying unit and the second spraying unit are each configured to spray the processing liquid along the direction in which the substrate is transferred, and the first angle may be configured to be 25 to 35° with respect to the horizontal direction so as to obstruct the flow of the processing liquid sprayed from the first spraying unit by the water film formed by the processing liquid sprayed from the second spraying unit, thereby allowing the processing liquid sprayed from the first spraying unit to remain on the substrate for a certain period of time and then flow away, and the second angle may be configured to be 40 to 80° with respect to the horizontal direction so as to form the water film.

[0012] In exemplary embodiments, the first injection part may be configured to be fixed at a specific angle within the range of the first angle of 25 to 35°, and the second injection part may be configured to be variable within the range of the second angle of 40 to 80°.

[0013] In exemplary embodiments, the first spraying unit is configured to spray the processing liquid at a first pressure, and the second spraying unit may be configured to spray the processing liquid at a second pressure greater than the first pressure.

[0014] In exemplary embodiments, a developer remains on the substrate by performing a development process, and each of the first spraying unit and the second spraying unit may be provided to spray a cleaning solution for cleaning the developer on the substrate on which the developer remains.

[0015] A substrate processing apparatus according to exemplary embodiments of the present invention for achieving the above other objectives is configured to process a developer remaining on a substrate by performing a developing process and may include a conveying unit, an air injection unit, and a processing liquid injection unit. The conveying unit may be configured to convey the substrate in a roughly horizontal direction. The air injection unit may be configured to inject air onto the substrate so as to remove the developer remaining on the substrate. The processing liquid injection unit may be configured to inject a processing liquid onto the substrate so as to clean the developer remaining on the substrate that has passed through the air injection unit, and may comprise a first injection unit configured to inject the processing liquid onto the substrate at a first angle from the horizontal direction along the direction in which the substrate is conveyed upstream of the direction in which the substrate is conveyed, and a second injection unit configured to inject the processing liquid onto the substrate at a second angle greater than the first angle from the horizontal direction along the direction in which the substrate is conveyed downstream of the direction in which the substrate is conveyed.

[0016] In exemplary embodiments, the air injection unit may be configured to inject air in a direction approximately vertical with respect to the horizontal direction in which the substrate is transported, so as to form an air curtain capable of removing the developer and preventing the penetration of the processing liquid from the processing liquid injection unit.

[0017] In exemplary embodiments, since the transfer of the substrate may be hindered if the processing liquid is sprayed in a direction opposite to the direction in which the substrate is transferred, the first spraying unit and the second spraying unit are each configured to spray the processing liquid along the direction in which the substrate is transferred, and the first angle may be configured to be 25 to 35° with respect to the horizontal direction so as to obstruct the flow of the processing liquid sprayed from the first spraying unit by the water film formed by the processing liquid sprayed from the second spraying unit, thereby allowing the processing liquid sprayed from the first spraying unit to remain on the substrate for a certain period of time and then flow away, and the second angle may be configured to be 40 to 80° with respect to the horizontal direction so as to form the water film.

[0018] In exemplary embodiments, the first injection part may be configured to be fixed at a specific angle within the range of the first angle of 25 to 35°, and the second injection part may be configured to be variable within the range of the second angle of 40 to 80°.

[0019] In exemplary embodiments, the first spraying unit is configured to spray the processing liquid at a first pressure, and the second spraying unit may be configured to spray the processing liquid at a second pressure greater than the first pressure. Effects of the invention

[0020] The processing liquid injection device and substrate processing device according to exemplary embodiments of the present invention may allow the processing liquid injected from the first and second injection parts to remain on the substrate for a certain period of time and then flow away through angle adjustment in which the first and second injection parts are provided, thereby enabling the processing liquid injected from the first and second injection parts to sufficiently participate in the exchange with the developing liquid.

[0021] Accordingly, the processing liquid injection device and the substrate processing device according to exemplary embodiments of the present invention will be able to sufficiently clean the developer remaining on the substrate, and as a result, a photoresist pattern that is more in compliance with specifications will be formed.

[0022] Therefore, since the processing liquid injection device and substrate processing device according to the exemplary embodiments of the present invention can form a photoresist pattern that better conforms to specifications through sufficient cleaning treatment of the developer, it is possible to expect an improvement in process reliability in the manufacture of display devices.

[0023] However, the problems and effects of the present invention are not limited to those mentioned above and may be extended in various ways without departing from the spirit and scope of the present invention. Brief explanation of the drawing

[0024] FIG. 1 is a schematic diagram illustrating a substrate processing apparatus according to exemplary embodiments of the present invention. FIG. 2 is a schematic diagram for explaining a processing liquid sprayed from a processing liquid spraying unit of a substrate processing device according to exemplary embodiments of the present invention. Specific details for implementing the invention

[0025] The present invention is susceptible to various modifications and may take various forms, and embodiments are to be described in detail in the text. However, this is not intended to limit the invention to the specific disclosed forms, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Similar reference numerals have been used for similar components in the description of each figure. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. Such terms are used solely for the purpose of distinguishing one component from another. The terms used in this application are used only to describe specific embodiments and are not intended to limit the invention. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "consisting of" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0026] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0027] Furthermore, exemplary embodiments will be described in more detail with reference to the attached drawings. Identical components in the drawings are given the same reference numerals, and redundant descriptions of identical components are omitted.

[0028] FIG. 1 is a schematic diagram illustrating a substrate processing apparatus according to exemplary embodiments of the present invention.

[0029] Referring to FIG. 1, a substrate processing apparatus (500) according to exemplary embodiments of the present invention is used in a photolithography process for forming a photoresist pattern on a substrate to be manufactured into a display device such as an OLED or QLED, and in particular, is used to remove the developer remaining on the substrate after performing a development process during the photolithography process and to perform a cleaning process for cleaning the developer.

[0030] Accordingly, the substrate processing device (500) according to exemplary embodiments of the present invention may be equipped with a member for transporting the substrate, a member for removing the developer solution and for cleaning treatment, and specifically, may be equipped with a transport unit (200), an air injection unit (300), a processing liquid injection unit (100), etc.

[0031] However, the processing liquid injection unit (100) in the substrate processing device (500) according to exemplary embodiments of the present invention may also be understood as a processing liquid injection device.

[0032] First, the air injection unit (300) and the processing liquid injection unit (100) in the substrate processing device (500) according to exemplary embodiments of the present invention may have a configuration in which they are arranged sequentially.

[0033] Accordingly, the transfer unit (200) may be configured such that the substrate passes sequentially through the air injection unit (300) and the processing liquid injection unit (100), and may be configured such that the substrate is transferred by the rotational drive of a roller that mainly contacts the back surface of the substrate, and may be configured such that the substrate is transferred in an approximately horizontal direction.

[0034] The air injection unit (300) is provided to remove the developer remaining on the substrate, and can be provided to remove the developer by injecting air onto the substrate.

[0035] In performing a process using a substrate processing device (500) according to exemplary embodiments of the present invention, a situation may occur in which the processing liquid sprayed from the processing liquid spraying unit (100) penetrates toward the air spraying unit (300).

[0036] Accordingly, the air injection unit (300) in the substrate processing device (500) according to exemplary embodiments of the present invention is configured to form an air curtain so as to prevent the processing liquid from the processing liquid injection unit (100) from penetrating by the aforementioned air curtain.

[0037] As mentioned above, in the present invention, an air injection unit (300) may be provided to inject air into the substrate in an approximately vertical direction relative to the horizontal direction in which the substrate is transported, so as to form an air curtain that can remove the processing liquid and prevent the processing liquid from the processing liquid injection unit (100) from penetrating.

[0038] And although not illustrated, the substrate processing device (500) according to exemplary embodiments of the present invention may have a configuration in which a transfer unit (200), an air injection unit (300), and a processing liquid injection unit (100) are disposed within a process chamber that is isolated from the external environment, and the process chamber may be provided with a structure in which only the path for transferring the substrate is open, and the transfer unit (200) may be provided with a structure in which the transfer unit is disposed in the path for transferring the substrate.

[0039] The processing liquid injection unit (100) may be configured to spray a processing liquid onto a substrate, and the processing liquid injection unit (100) in the substrate processing device (500) according to exemplary embodiments of the present invention may be configured to spray a processing liquid onto a substrate that has passed through an air injection unit (300).

[0040] In particular, since the substrate processing device (500) according to exemplary embodiments of the present invention is intended to be used to remove the developer remaining on the substrate after performing a development process and to perform a cleaning process for cleaning the developer, the processing liquid spraying unit (100) may be provided to spray a cleaning liquid for cleaning the developer remaining on the substrate.

[0041] That is, the substrate processing device (500) according to exemplary embodiments of the present invention may be configured to remove the developer remaining on the substrate using an air injection unit (300) and to clean the developer that continues to remain on the substrate using a processing liquid injection unit (100).

[0042] Here, the mentioned developer may be 2.38% TMAH (tetramethylammonium hydroxide), and the treatment solution sprayed from the treatment solution spraying unit (100) may be deionized water. Therefore, in the present invention, the cleaning treatment of the developer may be achieved by causing a substitution reaction between the developer and the deionized water.

[0043] In this way, the substrate processing device (500) according to exemplary embodiments of the present invention can remove the developer remaining on the substrate using an air injection unit (300) and also clean the developer that continues to remain on the substrate using a cleaning liquid injection unit.

[0044] Hereinafter, the processing liquid injection unit in the substrate processing apparatus according to exemplary embodiments of the present invention will be described in more detail.

[0045] The treatment liquid spraying unit (100) in the present invention may be composed of two spraying units, namely a first spraying unit (11) and a second spraying unit (13), and may be provided to have an arrangement structure at different angles.

[0046] First, the first injection unit (11) may be configured to spray a processing liquid onto the substrate at a first angle (θ1) from the horizontal direction along the direction in which the substrate is transported, upstream of the direction in which the substrate is transported.

[0047] And the second injection unit (13) may be provided to spray a processing liquid onto the substrate at a second angle (θ2) from the horizontal direction along the direction in which the substrate is transported, downstream of the direction in which the substrate is transported.

[0048] Here, the first and second angles from the horizontal direction are angles with respect to the substrate being transferred to the processing liquid injection unit (100), and may be angles formed between the processing liquid injected from the processing liquid injection unit (100) and the aforementioned substrate, and may be acute angles.

[0049] Accordingly, the processing liquid from the processing liquid injection unit (100), which consists of the first injection unit (11) and the second injection unit (13), can be injected in the same direction as the direction in which the substrate is transported.

[0050] However, if the processing liquid from the second spraying unit (13) is sprayed in a direction opposite to the direction in which the substrate is transported, the flow of the processing liquid sprayed from the first spraying unit (11) can be blocked, allowing the processing liquid to remain on the substrate for a relatively long time, thereby increasing the cleaning processing efficiency of the developer. However, since the spraying force of the processing liquid sprayed in a direction opposite to the direction in which the substrate is transported may hinder the transport of the substrate, as mentioned in the present invention, both the processing liquid from the first spraying unit (11) and the second spraying unit (13) are provided to be sprayed in the same direction as the direction in which the substrate is transported.

[0051] In the present invention, even though the processing liquid from the first spraying unit and the second spraying unit (13) is sprayed in the same direction as the direction in which the substrate is transported, as mentioned above, by varying the first angle and the second angle at which the first spraying unit (11) and the second spraying unit (13) are each positioned, the processing liquid can remain on the substrate for a certain period of time and then flow away, thereby relatively increasing the cleaning processing efficiency of the developer.

[0052] In the present invention, as shown in FIG. 2, the flow of the treatment liquid sprayed from the first spraying unit (11) is obstructed by the water film (21) formed by the treatment liquid sprayed from the second spraying unit (13), thereby allowing the treatment liquid sprayed from the first spraying unit (11) to remain on the substrate for a certain period of time and then flow away. If the first angle at the first spraying unit (11) is less than about 25°, it may not be desirable because the flow of the treatment liquid from the first spraying unit (11) is relatively fast; if it is greater than about 35°, it may not be desirable because the treatment liquid is sprayed intensively in one place on the substrate and may cause damage; if the second angle at the second spraying unit (13) is less than about 40°, it may not be desirable because the aforementioned water film (21) cannot be easily formed; and if the second angle at the second spraying unit (13) is greater than 80°, it may not be desirable because it may hinder the flow of the substrate.

[0053] Accordingly, the first angle in the first injection part (11) can be formed to have an angle of approximately 25 to 35° with respect to the horizontal direction, and the second angle in the second injection part (13) can be formed to have an angle of approximately 40 to 80° with respect to the horizontal direction, but more preferably, the first angle in the first injection part (11) can be formed to have an angle of approximately 30° with respect to the horizontal direction, and the second angle in the second injection part (13) can be formed to have an angle of 50° with respect to the horizontal direction.

[0054] Here, since the processing liquid sprayed from the second spraying unit (13) may be configured to join with the processing liquid sprayed from the first spraying unit (11), even if the second spraying unit (13) has an angle of about 40 to 80°, it will not cause damage by spraying intensively to any one part of the substrate.

[0055] In this way, the substrate processing device (500) according to exemplary embodiments of the present invention can relatively increase the cleaning processing efficiency of the developer by having a structure that delays the flow of the processing liquid without hindering the transport of the substrate.

[0056] And each of the first injection unit (11) and the second injection unit (13) may be provided to be positioned upstream and downstream with respect to the transfer direction of the substrate, but the spacing between them may be provided to be relatively adjacent.

[0057] In the substrate processing device (500) according to exemplary embodiments of the present invention, the first injection unit (11) may be provided to have a fixed structure, and the second injection unit (13) may be provided to have a variable structure, and the aforementioned variable structure (15) may be provided to have a rail structure, etc.

[0058] Specifically, the first injection part (11) may be provided to be fixed at a specific angle within the range of 25 to 35°, which is the first angle, and the second injection part (13) may be provided to be variable within the range of 40 to 80°, which is the second angle.

[0059] That is, when performing a process of spraying a processing liquid using a substrate processing device (500) according to exemplary embodiments of the present invention, the first spraying unit (11) may be configured to spray the processing liquid while fixed at a specific angle within the mentioned first angle range, and the second spraying unit (13) may be configured to spray the processing liquid while varying it within the mentioned second angle range.

[0060] And when performing a process of spraying a processing liquid using a substrate processing device (500) according to exemplary embodiments of the present invention, the second spraying unit (13) may also be configured to spray the processing liquid while fixed at a specific angle among the second angles mentioned.

[0061] In addition, the first injection unit (11) may be provided with a structure that is not continuously fixed only at the mentioned specific angle, but is adjusted to be fixed at a specific angle within the first angle range according to process conditions.

[0062] In the substrate processing apparatus (500) according to exemplary embodiments of the present invention, each of the first injection unit (11) and the second injection unit (13) may be configured to inject a processing liquid at different pressures, wherein the first injection unit (11) may be configured to inject the processing liquid at a first pressure and the second injection unit (13) may be configured to inject the processing liquid at a second pressure.

[0063] Here, if the second pressure in the second injection unit (13) is lower than the first pressure in the first injection unit (11), it is undesirable because the treatment liquid sprayed from the second injection unit (13) cannot overcome the spraying force of the treatment liquid sprayed from the first injection unit (11) and may merge and flow together.

[0064] Accordingly, the substrate processing device (500) according to exemplary embodiments of the present invention may be configured such that the second pressure in the second injection unit (13) is greater than the first pressure in the first injection unit (11).

[0065] In this way, the substrate processing device (500) according to exemplary embodiments of the present invention may allow the processing liquid sprayed from the first spraying unit (11) and the second spraying unit (13) to remain on the substrate for a certain period of time and then flow away through angle adjustment in which the first spraying unit (11) and the second spraying unit (13) are provided, thereby allowing the processing liquid sprayed from the first spraying unit (11) and the second spraying unit (13) to sufficiently participate in the exchange with the developer liquid, and as a result, the developer liquid remaining on the substrate may be sufficiently cleaned. Industrial applicability

[0066] The processing liquid injection device and the substrate processing device including the same according to exemplary embodiments of the present invention can be used in a photolithography process for forming a photoresist pattern on a substrate for manufacturing a display device, and thus can be more actively applied to the manufacturing of display devices such as OLEDs and QLEDs.

[0067] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the following claims. Explanation of the symbols

[0068] 11: 1st injection unit 13: 2nd injection unit 100 : Treatment liquid injection unit (treatment liquid injection device) 200: Transfer section 300: Air injection section 500 : Substrate processing device

Claims

Claim 1 A processing liquid spraying device configured to spray a processing liquid onto a substrate being transported in an approximately horizontal direction, comprising: a first spraying unit configured to spray the processing liquid onto the substrate at a first angle with respect to the horizontal plane of the substrate in the horizontal direction when the substrate is transported along the horizontal direction upstream of the direction in which the substrate is transported; A treatment liquid injection device comprising a second injection unit configured to spray the treatment liquid onto the substrate at a second angle greater than the first angle with respect to the horizontal plane of the substrate at the downstream side of the direction in which the substrate is transported, and wherein, because the transport of the substrate may be hindered if the treatment liquid is sprayed in a direction opposite to the direction in which the substrate is transported, each of the first injection unit and the second injection unit is configured to spray the treatment liquid along the direction in which the substrate is transported, and wherein the first angle is 25 to 35° with respect to the horizontal plane of the substrate and the second angle is 40 to 80° with respect to the horizontal plane of the substrate so as to form the water film formed by the treatment liquid sprayed from the second injection unit, thereby obstructing the flow of the treatment liquid sprayed from the first injection unit so that the treatment liquid sprayed from the first injection unit may remain on the substrate for a certain period of time and then flow away. Claim 2 delete Claim 3 A treatment liquid injection device according to claim 1, characterized in that the first injection part is configured to be fixed at a specific angle within the range of the first angle of 25 to 35°, and the second injection part is configured to be variable within the range of the second angle of 40 to 80°. Claim 4 A treatment liquid injection device according to claim 1, wherein the first injection unit is configured to inject the treatment liquid at a first pressure, and the second injection unit is configured to inject the treatment liquid at a second pressure greater than the first pressure. Claim 5 A treatment liquid spraying device according to claim 1, wherein a developer remains on the substrate by performing a development process, and each of the first spraying unit and the second spraying unit sprays a cleaning liquid to clean the developer on the substrate on which the developer remains. Claim 6 A substrate processing apparatus for processing a developer solution remaining on a substrate by performing a development process, comprising: a conveying unit configured to convey the substrate in a roughly horizontal direction; and an air injection unit configured to inject air onto the substrate so as to remove the developer solution remaining on the substrate. The apparatus comprises a processing liquid spraying unit configured to spray a processing liquid onto a substrate so as to clean the developer remaining on the substrate after passing through the air spraying unit, wherein the processing liquid is sprayed onto the substrate at a first angle relative to the horizontal plane of the substrate in the horizontal direction when the substrate is transported along the horizontal direction from the upstream side of the direction in which the substrate is transported, and a second spraying unit configured to spray the processing liquid onto the substrate at a second angle greater than the first angle relative to the horizontal plane of the substrate from the downstream side of the direction in which the substrate is transported. Furthermore, since the transport of the substrate may be hindered if the processing liquid is sprayed in a direction opposite to the direction in which the substrate is transported, each of the first spraying unit and the second spraying unit is configured to spray the processing liquid along the direction in which the substrate is transported, and the flow of the processing liquid sprayed from the first spraying unit is obstructed by a water film formed by the processing liquid sprayed from the second spraying unit, so that the processing liquid sprayed from the first spraying unit remains on the substrate for a certain period of time before flowing away. A substrate processing apparatus in which the first angle is 25 to 35° with respect to the horizontal plane of the substrate, and the second angle is 40 to 80° with respect to the horizontal plane of the substrate to form the water film. Claim 7 A substrate processing apparatus according to claim 6, wherein the air injection unit is configured to inject air in an approximately vertical direction relative to the horizontal direction in which the substrate is transported, so as to form an air curtain capable of removing the developer and preventing the penetration of the processing liquid from the processing liquid injection unit. Claim 8 delete Claim 9 A substrate processing apparatus according to claim 6, wherein the first injection unit is configured to be fixed at a specific angle within the range of the first angle of 25 to 35°, and the second injection unit is configured to be variable within the range of the second angle of 40 to 80°. Claim 10 A substrate processing apparatus according to claim 6, wherein the first injection unit is configured to spray the processing liquid at a first pressure, and the second injection unit is configured to spray the processing liquid at a second pressure greater than the first pressure.

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