Low temperature co-fired ceramic and preparation method and application thereof

Abstract

This invention relates to the field of glass-ceramic technology, specifically providing a low-temperature co-fired ceramic, its preparation method, and its application. The raw materials for the low-temperature co-fired ceramic include VSBBS glass frit and ceramic frit, with the total weight of the VSBBS glass frit and ceramic frit being 100%. The mass percentages of the VSBBS glass frit and ceramic frit are 20-40% and 60-80%, respectively. The raw materials for the VSBBS glass frit, by mass percentage, include 10-30 wt% vanadium oxide, 10-30 wt% antimony oxide, 10-30 wt% barium oxide, 10-20 wt% boron oxide, and 30-50 wt% silicon oxide, with the sum of all oxides being 100%. The LTCC material obtained by this invention achieves excellent millimeter-wave dielectric properties, with a relative permittivity between 4.8 and 6.8, a dielectric loss less than or equal to 0.001, and a flexural strength of 180-230 MPa.

Description

Technical Field

[0001] This invention relates to the field of glass ceramics technology, and in particular to a low-temperature co-fired ceramic, its preparation method, and its application. Background Technology

[0002] With the advent of the 5G high-frequency communication era, there is a growing demand for smaller and higher-quality electronic products, which in turn places more stringent requirements on their integration and packaging technologies. Electronic packaging technology is a key technology to ensure that electronic devices do not leak, directly affecting the high-speed transmission, power consumption, complexity, reliability, and cost of electronic devices and integrated circuits. Low-temperature co-fired ceramic (LTCC) technology, as a key technology for the integration of passive components, has significant advantages in developing high-frequency, high-performance, and highly integrated electronic components.

[0003] Low dielectric constant LTCC materials can be used to package resistors, capacitors, inductors and various passive devices in multilayer wiring substrates, which helps to reduce inductive coupling effects and integrate them with active devices into a complete circuit system.

[0004] To withstand harsh operating environments, electronic components require LTCC materials with higher flexural strength and a near-zero temperature coefficient of resonant frequency τf. Such materials will not cause carrier signal drift due to temperature fluctuations in complex operating environments, thus not affecting the performance of the device.

[0005] Currently, commercially available LTCC materials suffer from high dielectric loss or insufficient flexural strength. For example, DuPont's 951 material, a Pb-B-Si glass-alumina composite, contains lead, posing significant environmental and health risks. Ferro's A6 series, a CBS microcrystalline glass, has a relatively low dielectric constant and a dielectric loss of 2*10⁻⁶. -3 The ABS glass and alumina ceramic composite material developed by NEC Corporation of Japan has excessively high dielectric loss, resulting in unstable signal transmission. Chinese patent application CN110357419A discloses a low-temperature co-fired ceramic material and its preparation method. The resulting millimeter-wave low-temperature co-fired ceramic material exhibits good performance, but its dielectric loss remains high (0.003), limiting its application. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides an LTCC material with low dielectric constant and low dielectric loss in the millimeter-wave band to meet the requirements of millimeter-wave communication.

[0007] In a first aspect, the present invention provides a low-temperature co-fired ceramic, the raw materials of which include VSBBS glass frit and ceramic frit, and based on the total amount of VSBBS glass frit and ceramic frit being 100%, the mass percentages of VSBBS glass frit and ceramic frit are 20-40% and 60-80%, respectively; The raw materials of the VSBBS glass material, by mass percentage, include 10-30 wt% vanadium oxide, 10-30 wt% antimony oxide, 10-30 wt% barium oxide, 10-20 wt% boron oxide, and 30-50 wt% silicon oxide, with the sum of each oxide being 100%.

[0008] Vanadium oxide, antimony oxide, boron oxide, and silicon oxide exist as network generators within the glass structure. Vanadium oxide, antimony oxide, and boron oxide all possess low melting points and excellent fluxing effects, lowering the glass melting temperature. Furthermore, when mixed with alumina, they further reduce the sintering temperature. Barium oxide helps promote glass melting and improves chemical stability and electrical properties. By limiting the amounts of each raw material in the VSBBS glass charge within a reasonable range, better synergistic effects can be achieved, enhancing the VSBBS glass charge's fluxing and sintering temperature reduction properties, while also improving the chemical stability and electrical properties of low-temperature co-fired ceramics.

[0009] According to the low-temperature co-fired ceramic provided by the present invention, the preparation method of the VSBBS glass material includes: weighing vanadium oxide, antimony oxide, barium oxide, boron oxide and silicon oxide according to the mass ratio, mixing them, heating to 1000-1200℃ and holding for 2-6 hours, and water quenching to obtain the VSBBS glass material.

[0010] The low-temperature co-fired ceramic provided by the present invention is made of alumina.

[0011] The low-temperature co-fired ceramic provided by the present invention further includes a casting system material as a raw material, wherein the casting system material includes an organic solvent, a dispersant, a binder, and a plasticizer.

[0012] The addition of materials to the casting system is for the subsequent casting of green ceramic tape.

[0013] Furthermore, based on the total mass of the VSBBS glass material and ceramic material, the amount of each component in the casting system material is 35-60 wt% organic solvent, 1-5 wt% dispersant, 5-10 wt% binder and 4-9 wt% plasticizer.

[0014] In some embodiments of the present invention, the organic solvent is a mixture of two or three of butanone, xylene, and isopropanol. In some specific embodiments, the mass ratio of butanone:xylene:isopropanol is (10~25):(0~20):(15~35).

[0015] In some embodiments of the present invention, the dispersant is fish oil.

[0016] In some embodiments of the present invention, the adhesive is polyvinyl butyral.

[0017] In some embodiments of the present invention, the plasticizer is one or more of dioctyl phthalate, polyethylene glycol, and dibutyl phthalate.

[0018] Understandably, in order to improve the performance of the casting paste and enable better casting molding, some other additives, such as leveling agents and defoamers, may be selectively added.

[0019] The low-temperature co-fired ceramic of the present invention has the following dielectric properties in the range of 1 GHz to 20 GHz: relative permittivity between 4.8 and 6.8, dielectric loss less than 0.001, and bending strength of 180 to 230 MPa.

[0020] Secondly, the present invention provides a method for preparing the above-mentioned low-temperature co-fired ceramic, comprising the following steps: VSBBS glass frit and ceramic frit are mixed, organic solvent and dispersant are added and ball milling is performed, then binder and plasticizer are added and ball milling is continued to obtain cast slurry; The cast slurry is degassed and cast to obtain a green ceramic tape. The raw ceramic strip is perforated, printed with conductor paste, laminated, isostatically pressed, debinded, and sintered to obtain the low-temperature co-fired ceramic.

[0021] In some embodiments of the present invention, the VSBBS glass material is pulverized and then sieved before being mixed with the ceramic material. Preferably, the sieve mesh size is 120 mesh.

[0022] In some embodiments of the present invention, the glue removal is achieved by heating to 480-520°C at a heating rate of 1-3°C / min and holding at that temperature for 1-4 hours.

[0023] In some embodiments of the present invention, the sintering is performed by heating to 750-850°C at a heating rate of 3-5°C / min and holding at that temperature for 30-120 min.

[0024] In some embodiments of the present invention, the isostatic pressing pressure is 12-18 MPa.

[0025] In some embodiments of the present invention, the method for preparing the low-temperature co-fired ceramic includes the following steps: (1) Mix VSBBS glass powder and alumina powder in a certain proportion; wherein the mass ratio of VSBBS glass powder to alumina is 20-40:60-80; (2) Add organic solvent and dispersant to the mixed powder and ball mill for 2 hours; (3) Add binder and plasticizer to the ball-milled slurry and ball-mill for 1 hour to obtain cast slurry; (4) After vacuum degassing the casting slurry, the LTCC green ceramic tape is obtained by casting in a casting machine; (5) Cut the single-layer LTCC green ceramic tape into 45*45mm size, punch holes and screen print silver electrodes, then stack them and place them in a warm water isostatic press for isostatic pressing. (6) Place the isostatically pressed sample in a muffle furnace and heat it to 500°C for 1-4 hours to remove organic components. Then heat it to 750-850°C and hold it for 30-120 minutes to obtain the LTCC material.

[0026] Thirdly, the present invention provides the application of the above-mentioned low-temperature co-fired ceramics in the preparation of electronic components.

[0027] The low-temperature co-fired ceramic of the present invention has low dielectric constant and low dielectric loss, and good bending resistance. Therefore, it can be widely used in modern microwave electronic communication fields such as high-frequency electronics, aerospace electronic equipment, mobile communication, satellite communication, Beidou system (GPS), Bluetooth technology, wireless local area network (MLAN) and Internet of Things.

[0028] This invention provides a low-temperature co-fired ceramic, its preparation method, and its applications. Through material selection, the LTCC material obtained by this invention achieves excellent millimeter-wave dielectric properties, with a relative permittivity εr between 4.8 and 6.8, a dielectric loss less than or equal to 0.001, and a flexural strength of 180–230 MPa, which helps improve the transmission efficiency of electromagnetic signals at high frequencies. Simultaneously, this invention exhibits good chemical compatibility with Ag electrodes and can be co-fired at 750–850 °C. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this invention, not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0030] Where specific techniques or conditions are not specified in the examples, they shall be performed in accordance with the techniques or conditions described in the literature in this field, or in accordance with the product instructions. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased through legitimate channels.

[0031] The definitions and explanations of abbreviations, English terms, and key terms appearing in this article are as follows: PVB: Polyvinyl butyral LTCC: Low-temperature co-fired ceramics.

[0032] Example 1 This embodiment provides a low-temperature co-fired ceramic, the preparation method of which is as follows: 1. Preparation of VSBBS glass powder (1) Ingredients: Weigh 30g vanadium oxide, 10g antimony oxide, 10g barium oxide, 20g boron oxide and 30g silicon oxide according to the mass ratio and mix them evenly.

[0033] (2) Melting: The mixture is placed in a platinum crucible and heated to 1000℃ at 3℃ / min and held for 6 hours before being quenched in water to obtain glass slag.

[0034] (3) Crushing: Place the glass slag in an alumina ball mill jar, add alcohol and zirconia ball mill, and mill the planetary ball mill for 3 hours. After discharge, place the material in a vacuum oven and dry for 6 hours. Then pass it through a 120-mesh sieve to obtain glass powder, which is denoted as VSBBS-1.

[0035] 2. LTCC Preparation (1) Weigh 40g of VSBBS-1 glass powder and 60g of alumina powder with a purity greater than 99.9% precisely according to the mass ratio and mix them evenly.

[0036] (2) Pour 100g of mixed powder into a polytetrafluoroethylene ball mill jar, add 10g of butanone, 20g of isopropanol, 10g of xylene, 2g of fish oil, and add a zirconia ball mill planetary ball mill for 2 hours.

[0037] Add 10g PVB and 8g dibutyl phthalate, and ball mill for 1 hour to obtain cast slurry.

[0038] (3) Use a vacuum machine to degas the slurry and then cast it into a single-layer LTCC green ceramic tape using a casting machine.

[0039] (4) Cut the single-layer LTCC green ceramic tape into 45*45mm size, punch holes and screen print silver electrodes, then stack them and place them in a warm water isostatic press for isostatic pressing.

[0040] (5) The isostatically pressed sample is placed in a muffle furnace, heated to 500℃ and held for 2 hours to remove organic components, and then heated to 750℃ and held for 60 minutes to obtain millimeter-wave low dielectric high bending LTCC material, denoted as LY-1.

[0041] Example 2 This embodiment provides a low-temperature co-fired ceramic, the preparation method of which is as follows: 1. Preparation of VSBBS glass powder (1) Ingredients: Weigh 15g vanadium oxide, 15g antimony oxide, 30g barium oxide, 10g boron oxide and 30g silicon oxide according to the mass ratio and mix them evenly.

[0042] (2) Smelting: The mixture is placed in a platinum crucible and heated to 1200℃ at 3℃ / min and held for 2 hours before being quenched in water to obtain glass slag.

[0043] (3) Crushing: Place the glass slag in an alumina ball mill jar, add alcohol and zirconia ball mill, and mill the planetary ball mill for 3 hours. After discharge, place the material in a vacuum oven and dry for 6 hours. Then pass it through a 120-mesh sieve to obtain glass powder, which is denoted as VSBBS-2.

[0044] 2. LTCC Preparation (1) Weigh 30g of VSBBS-2 glass powder and 70g of alumina powder with a purity greater than 99.9% precisely according to the mass ratio and mix them evenly.

[0045] (2) Pour 100g of mixed powder into a polytetrafluoroethylene ball mill jar, add 20g of butanone, 25g of isopropanol, 1g of fish oil, and add a zirconia ball mill planetary ball mill for 2 hours.

[0046] Continue adding 8g PVB, 2g dioctyl phthalate, and 4g dibutyl phthalate, and ball mill for 1 hour to obtain the cast slurry.

[0047] (3) Use a vacuum machine to degas the slurry and then cast it into a single-layer LTCC green ceramic tape using a casting machine.

[0048] (4) Cut the single-layer LTCC green ceramic tape into 45*45mm size, punch holes and screen print silver electrodes, then stack them and place them in a warm water isostatic press for isostatic pressing.

[0049] (5) The isostatically pressed sample is placed in a muffle furnace and heated to 500℃ for 2 hours to remove organic components. Then it is heated to 800℃ and held for 60 minutes to obtain millimeter-wave low dielectric high bending LTCC material, denoted as LY-2.

[0050] Example 3 This embodiment provides a low-temperature co-fired ceramic, the preparation method of which is as follows: 1. Preparation of VSBBS glass powder (1) Ingredients: Weigh 10g vanadium oxide, 10g antimony oxide, 10g barium oxide, 20g boron oxide and 50g silicon oxide according to the mass ratio and mix them evenly.

[0051] (2) Smelting: The mixture is placed in a platinum crucible and heated to 1200℃ at 3℃ / min and held for 2 hours before being quenched in water to obtain glass slag.

[0052] (3) Crushing: Place the glass slag in an alumina ball mill jar, add alcohol and zirconia ball mill, and mill the planetary ball mill for 3 hours. After discharge, place the material in a vacuum oven and dry for 6 hours. Then pass it through a 120-mesh sieve to obtain glass powder, which is denoted as VSBBS-3.

[0053] 2. LTCC Preparation (1) Weigh 35g of VSBBS-3 glass powder and 65g of alumina powder with a purity greater than 99.9% precisely according to the mass ratio and mix them evenly.

[0054] (2) Pour 100g of mixed powder into a polytetrafluoroethylene ball mill jar, add 10g of butanone, 15g of isopropanol, 20g of xylene, 5g of fish oil, and add a zirconia ball mill planetary ball mill for 2 hours.

[0055] Continue adding 10g PVB, 5g polyethylene glycol, and 4g dibutyl phthalate, and ball mill for 1 hour to obtain the cast slurry.

[0056] (3) Use a vacuum machine to degas the slurry and then cast it into a single-layer LTCC green ceramic tape using a casting machine.

[0057] (4) Cut the single-layer LTCC green ceramic tape into 45*45mm size, punch holes and screen print silver electrodes, then stack them and place them in a warm water isostatic press for isostatic pressing.

[0058] (5) The isostatically pressed sample is placed in a muffle furnace and heated to 500℃ for 2 hours to remove organic components. Then it is heated to 785℃ and held for 60 minutes to obtain millimeter-wave low dielectric high bending LTCC material, denoted as LY-3.

[0059] Example 4 This embodiment provides a low-temperature co-fired ceramic, the preparation method of which is as follows: 1. Preparation of VSBBS glass powder (1) Ingredients: Weigh 10g vanadium oxide, 30g antimony oxide, 15g barium oxide, 10g boron oxide and 35g silicon oxide according to the mass ratio and mix them evenly.

[0060] (2) Melting: The mixture is placed in a platinum crucible and heated to 1100℃ at 3℃ / min and held for 4 hours before being quenched in water to obtain glass slag.

[0061] (3) Crushing: Place the glass slag in an alumina ball mill jar, add alcohol, zirconium oxide ball mill, and planetary ball mill for 3 hours. After discharge, place the material in a vacuum oven and dry for 6 hours. Then pass it through a 120-mesh sieve to obtain glass powder, which is denoted as VSBBS-4.

[0062] 2. LTCC Preparation (1) Weigh 30g of VSBBS-4 glass powder and 70g of alumina powder with a purity greater than 99.9% according to the mass ratio and mix them evenly.

[0063] (2) Pour 100g of mixed powder into a polytetrafluoroethylene ball mill jar, add 25g of butanone, 35g of isopropanol, 2g of fish oil, and add a zirconia ball mill planetary ball mill for 2 hours.

[0064] Continue adding 5g PVB, 3g polyethylene glycol, and 5g dibutyl phthalate, and ball mill for 1 hour to obtain the cast slurry.

[0065] (3) Use a vacuum machine to degas the slurry and then cast it into a single-layer LTCC green ceramic tape using a casting machine.

[0066] (4) Cut the single-layer LTCC green ceramic tape into 45*45mm size, punch holes and screen print silver electrodes, then stack them and place them in a warm water isostatic press for isostatic pressing.

[0067] (5) The isostatically pressed sample is placed in a muffle furnace and heated to 500℃ for 2 hours to remove organic components. Then it is heated to 850℃ and held for 60 minutes to obtain millimeter-wave low dielectric high bending LTCC material, denoted as LY-4.

[0068] Example 5 This embodiment provides an LTCC material, which differs from Embodiment 1 in that the VSBBS glass powder is prepared by precisely weighing 10g of vanadium oxide, 15g of antimony oxide, 15g of barium oxide, 20g of boron oxide, and 40g of silicon oxide according to the specified mass ratio and mixing them uniformly. The resulting LTCC material is designated as LY-5.

[0069] Example 6 This embodiment provides an LTCC material, which differs from Embodiment 1 in that the VSBBS glass powder is prepared by precisely weighing 15g of vanadium oxide, 20g of antimony oxide, 10g of barium oxide, 10g of boron oxide, and 45g of silicon oxide according to the specified mass ratio and mixing them uniformly. The resulting LTCC material is designated as LY-6.

[0070] Example 7 This embodiment provides an LTCC material, which differs from Embodiment 2 in that the ratio of VSBBS glass powder to alumina powder is 35:65; the organic components of the casting slurry are: 30g methyl ethyl ketone, 10g isopropanol, 1g fish oil; 10g PVB, 4g dioctyl phthalate, and 5g dibutyl phthalate. The resulting LTCC material is designated LY-7.

[0071] Example 8 This embodiment provides an LTCC material, which differs from Embodiment 3 in that the ratio of VSBBS glass powder to alumina powder is 30:70; the organic components of the casting slurry are: 15g methyl ethyl ketone, 20g isopropanol, 2g fish oil; 9g PVB, 2g dioctyl phthalate, and 2g dibutyl phthalate. The resulting LTCC material is designated LY-8.

[0072] Example 9 This embodiment provides an LTCC material, which differs from Embodiment 2 in that the ratio of VSBBS glass powder to alumina powder is 20:80. The resulting LTCC material is designated LY-9.

[0073] Example 10 This embodiment provides an LTCC material, which differs from Embodiment 2 in that the organic components of the casting slurry are: 20g methyl ethyl ketone (MEK), 15g xylene, 10g isopropanol, 1g fish oil; 8g PVB, 1g dioctyl phthalate, and 5g dibutyl phthalate. The resulting LTCC material is designated LY-10.

[0074] Comparative Example 1 This comparative example provides an LTCC material that differs from Example 2 in that the glass powder is prepared as follows: 15g of vanadium oxide, 15g of antimony oxide, 30g of calcium oxide, 10g of boron oxide, and 30g of silicon oxide are precisely weighed according to the mass ratio and uniformly mixed. The resulting LTCC material is designated as DY-1.

[0075] Comparative Example 2 This comparative example provides an LTCC material that differs from Example 2 in that the glass powder is prepared as follows: 10g of vanadium oxide, 5g of antimony oxide, 5g of barium oxide, 20g of boron oxide, and 60g of silicon oxide are precisely weighed according to the specified mass ratio and uniformly mixed. The resulting LTCC material is designated as DY-2.

[0076] The test results of various performance indicators of the low-temperature co-fired ceramics provided in Examples 1-10 and Comparative Examples 1-2 of this invention are shown in Table 1.

[0077] The test methods for dielectric constant and dielectric loss are as follows: Section 5.11 of the national standard GB / T 5593-2015 "Structural Ceramic Materials for Electronic Components".

[0078] The test method for flexural strength is as follows: Section 5.6 of the national standard GB / T 5593-2015 "Structural Ceramic Materials for Electronic Components".

[0079] Table 1 As shown in Table 1 above, the present invention prepares an LTCC material by mixing and casting VSBBS glass with alumina ceramic and co-firing, with a dielectric constant of 4.8-6.8, a dielectric loss of less than 0.001, and a bending strength between 180-230 MPa.

[0080] The comparison results of Examples 2, 7, and 9 show that, with the VSBBS glass composition unchanged, appropriately reducing the ratio of VSBBS glass to alumina ceramic results in a low-temperature co-fired ceramic that has both low dielectric constant and low dielectric loss, as well as high bending resistance.

[0081] The selection of VSBBS glass frit raw materials and the amount of each raw material in the low-temperature co-fired ceramic of this invention have a significant impact on the performance of the low-temperature co-fired ceramic. A comparison between Comparative Example 1 and Example 2 shows that replacing the oxides in the VSBBS glass powder of this invention with oxides of other components increases the dielectric constant of the co-fired ceramic, increases dielectric loss, and significantly reduces flexural strength. A comparison between Comparative Example 2 and Example 2 shows that limiting the amount of each raw material in the VSBBS glass frit within a reasonable range is beneficial for reducing the dielectric constant of the co-fired ceramic, reducing dielectric loss, and improving flexural strength.

[0082] It should be noted that the endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0083] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "detailed implementation," or "some specific implementations," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A low-temperature co-fired ceramic, characterized in that, The raw materials include VSBBS glass and ceramic materials, and based on the total amount of VSBBS glass and ceramic materials being 100%, the mass percentages of VSBBS glass and ceramic materials are 20-40% and 60-80%, respectively. The raw materials of the VSBBS glass material, by mass percentage, include 10-30 wt% vanadium oxide, 10-30 wt% antimony oxide, 10-30 wt% barium oxide, 10-20 wt% boron oxide, and 30-50 wt% silicon oxide, with the sum of each oxide being 100%.

2. The low-temperature co-fired ceramic according to claim 1, characterized in that, The preparation method of the VSBBS glass material includes: weighing vanadium oxide, antimony oxide, barium oxide, boron oxide and silicon oxide according to the mass ratio, mixing them, heating to 1000-1200℃ and holding for 2-6 hours, and water quenching to obtain the VSBBS glass material.

3. The low-temperature co-fired ceramic according to claim 1, characterized in that, The ceramic material is alumina.

4. The low-temperature co-fired ceramic according to claim 1, characterized in that, The raw materials for the low-temperature co-fired ceramic also include casting system materials, which include organic solvents, dispersants, binders and plasticizers; Preferably, the total mass of the VSBBS glass material and ceramic material is used as the measurement standard, and the amount of each component in the casting system material is 35-60 wt% organic solvent, 1-5 wt% dispersant, 5-10 wt% binder and 4-9 wt% plasticizer.

5. The low-temperature co-fired ceramic according to claim 4, characterized in that, The organic solvent is a mixture of two or three of the following: butanone, xylene, and isopropanol; And / or, the dispersant is fish oil; And / or, the adhesive is polyvinyl butyral; And / or, the plasticizer is one or more of dioctyl phthalate, polyethylene glycol, and dibutyl phthalate.

6. The low-temperature co-fired ceramic according to any one of claims 1-5, characterized in that, The dielectric properties of the low-temperature co-fired ceramic at 1 GHz to 20 GHz are as follows: relative permittivity between 4.8 and 6.8, dielectric loss less than 0.001, and flexural strength between 180 and 230 MPa.

7. The method for preparing the low-temperature co-fired ceramic according to any one of claims 1-6, characterized in that, Includes the following steps: VSBBS glass frit and ceramic frit are mixed, organic solvent and dispersant are added and ball milling is performed, then binder and plasticizer are added and ball milling is continued to obtain cast slurry; The cast slurry is degassed and cast to obtain a green ceramic tape. The raw ceramic strip is perforated, printed with conductor paste, laminated, isostatically pressed, debinded, and sintered to obtain the low-temperature co-fired ceramic.

8. The method for preparing low-temperature co-fired ceramics according to claim 7, characterized in that, Before mixing the VSBBS glass material with the ceramic material, it is first crushed and then sieved.

9. The method for preparing low-temperature co-fired ceramics according to claim 7, characterized in that, The glue removal process involves heating the material to 480-520℃ at a rate of 1-3℃ / min and holding it at that temperature for 1-4 hours. The sintering process involves heating to 750-850℃ at a heating rate of 3-5℃ / min and holding at that temperature for 30-120min. And / or, the isostatic pressing pressure is 12-18 MPa.

10. The application of the low-temperature co-fired ceramic according to any one of claims 1-6 in the preparation of electronic components.

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