A resin composition with high tg and high cti, and a preparation method and application thereof

Abstract

This application relates to the field of resin materials, and in particular to a high Tg, high CTI resin composition and its preparation method. The high Tg, high CTI resin composition, by weight, comprises the following raw material scheme: 90-120 parts epoxy resin system, 9-18 parts compounding agent, 40-60 parts curing agent, 100-120 parts functional filler, 140-200 parts solvent system, 1-1.5 parts coupling agent, 0.5-1 part accelerator, and 0.8-1.5 parts wetting and dispersing agent. The resin composition obtained by this application solves the process problems of high material rigidity, poor fluidity, and severe warping after pressing. It can simultaneously achieve high heat resistance, high insulation reliability, and excellent processing performance, providing performance for applications with stringent safety specifications, such as automotive electronics and high-end communication equipment.

Description

Technical Field

[0001] This application relates to the field of resin materials, and in particular to a resin composition with high Tg and high CTI, its preparation method, and its application. Background Technology

[0002] With the rapid development of the electronics industry, especially the evolution of high-end electronic equipment such as 5G communication, new energy vehicles, industrial automation, and smart grids towards high frequency, high speed, and high power density, the performance requirements for core insulating materials have reached unprecedented levels. Copper clad laminates, as a fundamental material for electronic components, not only need excellent mechanical and dielectric properties, but also face the severe challenge of maintaining long-term insulation reliability in harsh environments with high voltage, high humidity, and multiple pollutants. Tracking index (CTI) and glass transition temperature (Tg) are key indicators for evaluating the performance of such materials. Currently, the traditional epoxy resin systems commonly used in the industry mostly employ ordinary bisphenol A epoxy resin combined with fillers such as aluminum hydroxide. While these materials have certain advantages in terms of cost and processability, as end-use applications demand higher safety specifications, traditional materials are gradually showing limitations in heat resistance, carbonization resistance, and dimensional stability, making it difficult to meet the high-end application threshold of a CTI of 600V and above and a Tg exceeding 135℃.

[0003] To improve the CTI (Coefficient of Thermal Interaction) performance of materials, existing technologies typically employ the method of heavily filling the resin formulation with inorganic flame retardants. However, while this high-filling strategy enhances the flame retardant effect to some extent, it brings serious side effects. First, the specific resin modification and large amount of inorganic filler introduced to achieve high CTI performance often lead to a significant increase in the rigidity of the material system and a decrease in toughness, and a poor match between the thermal expansion coefficients of the material and the copper foil and fiberglass cloth during the lamination process. This mismatch in physical properties causes severe board bending and warping problems due to uneven stress release after high-temperature lamination and cooling. This deformation not only affects the SMT placement accuracy and assembly efficiency of PCB customers, leading to poor soldering, but may also cause stress cracking of the circuit, ultimately reducing the reliability of the end product. In addition, the molecular chain structure of traditional ordinary epoxy resin is relatively simple, with high chain segment flexibility and uneven distribution of polar functional groups, resulting in a limited density of the three-dimensional cross-linked network formed after curing. This not only limits the further increase of the glass transition temperature of the material, but also makes it easy to form leakage channels under the action of an electric field, making it difficult to meet the dual requirements of high heat resistance and high insulation.

[0004] Existing high CTI formulations often exhibit complex rheological properties. Due to high filler content and high crosslinking density, the melt viscosity of these resin systems is typically high, resulting in poor flowability. This poses significant challenges to compression molding processes. In actual production, this manifests as the resin failing to adequately fill the gaps between lines, easily leading to defects such as lamination white spots and voids, or performance degradation during storage due to moisture absorption or slow localized reactions. Furthermore, traditional solvent systems and curing processes are ill-suited to the requirements of these high-performance resin systems, resulting in low production efficiency or poor product consistency. Summary of the Invention

[0005] As mentioned above, how to significantly improve the CTI and Tg values ​​while solving the process problems of high material rigidity, poor fluidity, and severe warping after pressing, and how to develop a resin composition with high heat resistance, high insulation reliability, and excellent processing performance, has become a technical bottleneck that urgently needs to be solved by those skilled in the art.

[0006] To achieve the above objectives, this application provides the following technical solution: The first aspect of this application provides a resin composition with high Tg and high CTI, wherein the raw material scheme comprises, by weight, 90-120 parts of epoxy resin system, 9-18 parts of compounding agent, 40-60 parts of curing agent, 100-120 parts of functional filler, 140-200 parts of solvent system, 1-1.5 parts of coupling agent, 0.5-1 part of accelerator, and 0.8-1.5 parts of wetting and dispersing agent.

[0007] Preferably, the epoxy resin system is a combination of bisphenol A type epoxy resin, BNE resin and flow-modified resin.

[0008] Preferably, the mass ratio of the bisphenol A type epoxy resin, BNE resin and flow-modified resin is (6~8):(2~3.5):(0.3~0.7).

[0009] Preferably, the mass ratio of the bisphenol A type epoxy resin, BNE resin and flow-modified resin is (7~7.8):(2.3~3):(0.4~0.6).

[0010] Preferably, the bisphenol A type epoxy resin is E-51 or CYD-128.

[0011] Preferably, the BNE resin is KB-116, manufactured by Shandong Shengquan New Materials Co., Ltd., China.

[0012] Preferably, the flow-modified resin is 19046, manufactured by Dingchuang Electronics in Yixing City, China.

[0013] Preferably, the mass ratio of the epoxy resin system, the compounding agent and the curing agent is (10~12):(1~1.6):(4.5~6).

[0014] Preferably, the mass ratio of the epoxy resin system, the compounding agent and the curing agent is (10~11):(1.1~1.4):(4.5~5.5).

[0015] In this application, the epoxy resin system uses the rigid fused ring structure of BNE resin as the backbone, which significantly improves the density and thermal stability of the crosslinking network, thus laying the foundation for high Tg and high intrinsic arc resistance. At the same time, the long-chain structure of the flow-modified resin plays a lubricating and toughening role in the molecular chain system. Without destroying the rigid backbone, the formation of a nanoscale elastic phase effectively improves the flow and filling properties of the resin at high temperatures and absorbs stress, avoiding brittle fracture of the material. The combination of rigidity enhancement and flexibility control at the molecular scale provides a good foundation for the resin material to ultimately obtain excellent comprehensive performance.

[0016] Preferably, the compounding agent is a combination of carboxyl-terminated butadiene-acrylonitrile rubber, polyetheramine, and epoxidized polybutadiene.

[0017] Preferably, the mass ratio of the carboxyl-terminated nitrile rubber, polyetheramine, and epoxidized polybutadiene is (5~6):(3~4):(2~3).

[0018] Preferably, the mass ratio of the carboxyl-terminated nitrile rubber, polyetheramine, and epoxidized polybutadiene is (5~5.5):(3.5~4):(2.6~3).

[0019] Preferably, the carboxyl-terminated nitrile butadiene rubber is CTBN 1300X8, manufactured by Huntsman, USA.

[0020] Preferably, the polyetheramine is D-230, manufactured by Huntsman, USA.

[0021] Preferably, the epoxidized polybutadiene is PB3600, manufactured by Daicel Japan.

[0022] The addition of compounding agents forms micro-elastic particles through phase separation of carboxyl-terminated butadiene-acrylonitrile rubber, inducing crack deflection to consume energy. The flexible segments of polyetheramine are used as part of the network, increasing the mobility between crosslinking points. Meanwhile, the long-chain structure of epoxidized polybutadiene can efficiently cure shrinkage stress, constructing a dynamically tough molecular chain system in the resin material system. Thus, without sacrificing the heat resistance of the main body, it significantly offsets the shrinkage stress caused by the difference in thermal expansion coefficients, maintains good comprehensive performance, and reduces performance contradictions.

[0023] Preferably, the curing agent is a linear phenolic resin.

[0024] Preferably, the linear phenolic resin is PF-8211, manufactured by China Greenlink (Jining) Chemical Co., Ltd.

[0025] Preferably, the functional filler is at least one of flaky boehmite, calcium carbonate, talc, and sericite powder.

[0026] Preferably, the functional filler is flaky boehmite or sericite powder.

[0027] Preferably, the functional filler is flaky boehmite.

[0028] Preferably, the average particle size of the functional filler is 1~5μm.

[0029] Preferably, the average particle size of the functional filler is 1~2μm.

[0030] Preferably, the solvent system is a combination of N,N-dimethylformamide and methylcyclohexane.

[0031] Preferably, the mass ratio of N,N-dimethylformamide to methylcyclohexane is (10~12):(4~6).

[0032] Preferably, the mass ratio of N,N-dimethylformamide to methylcyclohexane is (11~12):(4.5~5).

[0033] Preferably, the coupling agent is a combination of a silane coupling agent and an aluminate coupling agent DL-411.

[0034] Preferably, the coupling agent is a silane coupling agent and an aluminate coupling agent DL-411 in a mass ratio of (8~10):(2~3).

[0035] Preferably, the coupling agent is a silane coupling agent and an aluminate coupling agent DL-411 in a mass ratio of (8~9):(2~2.5).

[0036] Preferably, the silane coupling agent is at least one of KH-550, KH-560, KH-570 and KH-792.

[0037] Preferably, the silane coupling agent is KH-560 or KH-792.

[0038] Preferably, the silane coupling agent is KH-560.

[0039] Preferably, the promoter is at least one selected from 2-methylimidazole, 2-ethylimidazole and 2-ethyl-4-methylimidazole.

[0040] Preferably, the promoter is 2-methylimidazole or 2-ethylimidazole.

[0041] Preferably, the promoter is 2-methylimidazole.

[0042] Preferably, the wetting and dispersing agent is at least one of BYK-110, BYK-161, BYK-2009 and BYK-W996.

[0043] Preferably, the wetting and dispersing agent is BYK-110 or BYK-2009.

[0044] Preferably, the wetting and dispersing agent is BYK-110.

[0045] The second aspect of this application provides a method for preparing the above-mentioned high Tg and high CTI resin composition, specifically including the following steps: S1: After drying the functional filler, it is added to a high-speed heating mixer for preheating. The coupling agent is diluted with anhydrous ethanol and added to the functional filler. After stirring and keeping warm, the anhydrous ethanol is removed to obtain the modified filler for later use; S2: A solvent system is added to a reaction vessel, the temperature is raised and stirred, and an epoxy resin system and a compounding agent are added. After stirring and mixing evenly, the modified filler is added in three equal portions, each time fully dispersed. Then the remaining raw materials are added and dispersion is continued to obtain a slurry; S3: The slurry is degassed under vacuum, then cooled to below 40°C, stirred at low speed, and mixed evenly. The slurry is then sealed and cured at room temperature to obtain the resin composition. During curing, the temperature is first raised to 130~140°C and kept at 50~60 min, and a pressure of 2.5~3.5 MPa is applied. Then the temperature is raised to 160~170°C and kept at 1.5~2 h for curing.

[0046] Preferably, the preparation method of the high Tg and high CTI resin composition specifically includes the following steps: S1: Dry the functional filler at 110~120℃ for 3~4h, then add it to a high-speed heating mixer, preheat to 90~100℃, add the coupling agent diluted with anhydrous ethanol to the functional filler, keep it at 600~800rpm for 30~40min, after discharge, dry at 100℃ for 2~3h, remove the anhydrous ethanol, and obtain the modified filler for later use; S2: Add the solvent system to the reactor, heat to 60~70℃, and add the epoxy resin system and compounding agent under stirring. Stir at 300~400rpm for 40~45min to mix evenly, then add the modified filler in three equal portions, each time dispersing at 800~1000rpm for 15~20min, then add the remaining raw materials and continue dispersing for 10~15min to obtain a slurry; S3: Heat the slurry at 65~75℃ and a vacuum degree of -0.098 Degas at MPa for 30-40 minutes, then cool to below 40°C and stir at 200-300 rpm for 20-25 minutes. After mixing evenly, seal the adhesive at 25-30°C for 2-4 hours to obtain the resin composition. During curing, first heat to 130-140°C and hold for 50-60 minutes, and apply a pressure of 2.5-3.5 MPa. Then heat to 160-170°C and hold for 1.5-2 hours to cure.

[0047] The third aspect of this application defines the application of the above-mentioned high Tg and high CTI resin composition in 5G communication, new energy vehicles, industrial automation and smart grids.

[0048] The beneficial effects and application advantages of this application are as follows: 1. The high Tg and high CTI resin composition provided in this application has significant beneficial effects. This composition achieves a performance balance of high insulation reliability, excellent high-temperature stability, and good processing technology. It also enables the final product to achieve extremely high resistance to tracking and heat resistance, fundamentally meeting the stringent safety requirements of applications such as automotive electronics and high-end communication equipment. At the same time, this material effectively improves the flow and filling characteristics and wettability of the high-filler system during lamination, significantly improving the quality consistency of the laminate, eliminating lamination defects such as white spots and voids, and greatly alleviating the inherent internal stress of high-performance boards. This effectively suppresses board bending and warping after lamination, giving the finished product excellent dimensional stability and long-term reliability.

[0049] 2. The epoxy resin system of this application uses the rigid fused ring structure of BNE resin as the backbone, which greatly improves the density and thermal stability of the crosslinking network, thus laying the foundation for high Tg and high intrinsic arc resistance. At the same time, the long chain structure of the flow-modified resin plays a lubricating and toughening role in the molecular chain system. Without destroying the rigid backbone, the formation of a nanoscale elastic phase effectively improves the flow and filling properties of the resin at high temperatures and absorbs stress, avoiding brittle fracture of the material. This provides a good foundation for the resin material to finally obtain excellent comprehensive performance.

[0050] 3. This application incorporates micro-elastic particles formed by phase separation of carboxyl-terminated butadiene-acrylonitrile rubber, which induce crack deflection to consume energy. The flexible segments of polyetheramine are used as part of the network, increasing the mobility between crosslinking points. Meanwhile, the long-chain structure of epoxidized polybutadiene can efficiently solidify shrinkage stress, constructing a dynamically tough molecular chain system in the resin material system. Thus, without sacrificing the heat resistance of the main body, it significantly offsets the shrinkage stress caused by the difference in thermal expansion coefficients, maintains good comprehensive performance, and reduces performance contradictions. Attached Figure Description

[0051] Figure 1 This is a schematic diagram of the high Tg and high CTI resin composition prepared in Example 1 of this application after curing on the surface of a copper plate; (a) is a copper plate, and (b) is a copper plate with the surface-cured resin composition. Detailed Implementation

[0052] In the following specific embodiments, unless otherwise specified, the sources / preparation methods of some raw materials are as follows: Bisphenol A type epoxy resin E-51, Nan Ya Plastics, Taiwan, China.

[0053] BNE resin KB-116, Shandong Shengquan New Materials, China.

[0054] Flow-modified resin 19046, Dingchuang Electronics, Yixing City, China.

[0055] Carboxyl-terminated butadiene nitrile rubber CTBN 1300X8, Huntsman, USA.

[0056] The epoxidized polybutadiene is specifically PB3600, manufactured by Daicel Japan.

[0057] Linear phenolic resin PF-8211, China Green Alliance (Jining) Chemical.

[0058] Example 1 A resin composition with high Tg and high CTI, by weight, comprises the following raw materials: 105 parts epoxy resin system, 12.6 parts compounding agent, 52.2 parts curing agent, 100 parts functional filler, 171.3 parts solvent system, 1.2 parts coupling agent, 0.8 parts accelerator, and 1.2 parts wetting and dispersing agent.

[0059] The epoxy resin system is a combination of bisphenol A type epoxy resin E51, BNE resin KB-116 and flow-modified resin 19046, with a mass ratio of 7.1:2.4:0.5.

[0060] The compounding agent is a combination of carboxyl-terminated butadiene-acrylonitrile rubber CTBN 1300X8, polyetheramine D-230, and epoxidized polybutadiene PB3600, with a mass ratio of 5.2:4:2.8.

[0061] The curing agent is linear phenolic resin PF-8211; the accelerator is 2-methylimidazole; the wetting and dispersing agent is BYK-110; and the functional filler is lamellar boehmite with an average particle size of 1 μm.

[0062] The solvent system is a combination of N,N-dimethylformamide and methylcyclohexane in a mass ratio of 11.5:4.5.

[0063] The coupling agent is a combination of silane coupling agent KH-560 and aluminate coupling agent DL-411, with a mass ratio of 9:2.

[0064] A method for preparing the above-mentioned high Tg and high CTI resin composition specifically includes the following steps: S1: Drying the functional filler at 120℃ for 4 hours, then adding it to a high-speed heating mixer, preheating to 95℃, adding the coupling agent diluted with anhydrous ethanol to the functional filler, keeping it at 600 rpm for 36 minutes, and drying it at 100℃ for 3 hours after discharge to remove the anhydrous ethanol, obtaining the modified filler for later use; S2: Adding the solvent system to the reactor, heating to 65℃, and adding the epoxy resin system and compounding agent under stirring, stirring at 400 rpm for 40 minutes to mix evenly, then adding the modified filler in three equal portions, dispersing at 800 rpm for 20 minutes each time, then adding the remaining raw materials and continuing to disperse for 12 minutes to obtain a slurry; S3: Discharging the slurry at 70℃ and a vacuum degree of -0.098 Degas at MPa for 40 min, then cool to below 40℃, stir at 240 rpm for 22 min, mix evenly, and then seal and cure the resin at 25℃ for 3 h to obtain the resin composition. During curing, first heat to 140℃ and hold for 60 min, apply 3 MPa pressure, and then heat to 170℃ and hold for 2 h to cure.

[0065] A schematic diagram of the actual product after the resin composition prepared in this application has been cured on the surface of a copper plate is shown below. Figure 1As shown in the figure, (a) is a copper plate and (b) is a copper plate with a surface-cured resin composition.

[0066] Example 2 A resin composition with high Tg and high CTI, by weight, comprises the following raw materials: 112 parts epoxy resin system, 14.5 parts compounding agent, 55.5 parts curing agent, 105 parts functional filler, 178.6 parts solvent system, 1.3 parts coupling agent, 0.8 parts accelerator, and 1.2 parts wetting and dispersing agent.

[0067] The epoxy resin system is a combination of bisphenol A type epoxy resin E51, BNE resin KB-116 and flow-modified resin 19046, with a mass ratio of 8:2:0.4.

[0068] The above are the only differences between this embodiment and Embodiment 1; all other aspects are the same.

[0069] Example 3 A resin composition with high Tg and high CTI, by weight, comprises the following raw materials: 100 parts epoxy resin system, 11.5 parts compounding agent, 51.5 parts curing agent, 100 parts functional filler, 165.4 parts solvent system, 1.2 parts coupling agent, 0.8 parts accelerator, and 1.2 parts wetting and dispersing agent.

[0070] The compounding agent is a combination of carboxyl-terminated butadiene-acrylonitrile rubber CTBN 1300X8, polyetheramine D-230, and epoxidized polybutadiene PB3600 in a mass ratio of 6:3:3.

[0071] The above are the only differences between this embodiment and Embodiment 1; all other aspects are the same.

[0072] Comparative Example 1 A resin composition with high Tg and high CTI, by weight, comprises the following raw materials: 115 parts epoxy resin system, 7.2 parts compounding agent, 59.5 parts curing agent, 100 parts functional filler, 171.3 parts solvent system, 1.2 parts coupling agent, 0.8 parts accelerator, and 1.2 parts wetting and dispersing agent.

[0073] The above are the only differences between this comparative example and Example 1; all other aspects are the same.

[0074] Comparative Example 2 A resin composition with high Tg and high CTI, comprising, by weight, the following raw material scheme: 105 parts epoxy resin system, 16.5 parts compounding agent, 40.8 parts curing agent, 100 parts functional filler, 171.3 parts solvent system, 1.2 parts coupling agent, 0.8 parts accelerator, and 1.2 parts wetting and dispersing agent.

[0075] The above are the only differences between this comparative example and Example 1; all other aspects are the same.

[0076] Comparative Example 3 A resin composition with high Tg and high CTI, by weight, comprises the following raw materials: 105 parts epoxy resin system, 12.6 parts compounding agent, 52.2 parts curing agent, 100 parts functional filler, 171.3 parts solvent system, 1.2 parts coupling agent, 0.8 parts accelerator, and 1.2 parts wetting and dispersing agent.

[0077] The epoxy resin system is a combination of bisphenol A type epoxy resin E51, BNE resin KB-116 and flow-modified resin 19046, with a mass ratio of 8.8:1:0.2.

[0078] The above are the only differences between this comparative example and Example 1; all other aspects are the same.

[0079] Comparative Example 4 A resin composition with high Tg and high CTI, by weight, comprises the following raw materials: 105 parts epoxy resin system, 12.6 parts compounding agent, 52.2 parts curing agent, 100 parts functional filler, 171.3 parts solvent system, 1.2 parts coupling agent, 0.8 parts accelerator, and 1.2 parts wetting and dispersing agent.

[0080] The epoxy resin system is a combination of bisphenol A type epoxy resin E51, BNE resin KB-116 and flow-modified resin 19046, with a mass ratio of 5:2.5:2.5.

[0081] The above are the only differences between this comparative example and Example 1; all other aspects are the same.

[0082] Comparative Example 5 A resin composition with high Tg and high CTI, by weight, comprises the following raw materials: 105 parts epoxy resin system, 12.6 parts compounding agent, 52.2 parts curing agent, 100 parts functional filler, 171.3 parts solvent system, 1.2 parts coupling agent, 0.8 parts accelerator, and 1.2 parts wetting and dispersing agent.

[0083] The compounding agent is a combination of carboxyl-terminated butadiene-acrylonitrile rubber CTBN 1300X8, polyetheramine D-230, and epoxidized polybutadiene PB3600, with a mass ratio of 1:6:5.

[0084] The above are the only differences between this comparative example and Example 1; all other aspects are the same.

[0085] Comparative Example 6 A resin composition with high Tg and high CTI, by weight, comprises the following raw materials: 105 parts epoxy resin system, 12.6 parts compounding agent, 52.2 parts curing agent, 100 parts functional filler, 171.3 parts solvent system, 1.2 parts coupling agent, 0.8 parts accelerator, and 1.2 parts wetting and dispersing agent.

[0086] The compounding agent is a combination of carboxyl-terminated butadiene-acrylonitrile rubber CTBN 1300X8, polyetheramine D-230, and epoxidized polybutadiene PB3600, with a mass ratio of 7:4.5:0.5.

[0087] The above are the only differences between this comparative example and Example 1; all other aspects are the same.

[0088] Performance testing 1. CTI: The test is conducted in accordance with IEC 60112. A flat plate sample conforming to the standard is prepared. An ammonium chloride solution (0.1 wt%) is dropped between the two electrodes on the sample surface. The test starts at 300V and gradually increases the voltage in 25V intervals until failure occurs within 50 drops, leakage current ≥0.5A lasts for 2 seconds, or continuous arcing / burn-through occurs. The highest voltage value that passes the test is recorded, and the results are recorded in Table 1.

[0089] 2. TG: The cured resin was tested using a DMA instrument in three-point bending mode, heated at 5°C / min, and the storage modulus curve was recorded. The temperature corresponding to the peak value of the loss modulus or the inflection point temperature of the storage modulus was taken as Tg, and the results were recorded in Table 1.

[0090] 3. Thermal delamination time: Place the cured sample on a hot plate that has been preheated to 288°C, start timing, observe whether the sample shows delamination, blistering or other failure phenomena, record the time from contact to the first occurrence of any of the above phenomena, and record the results in Table 1.

[0091] 4. Volume resistivity: The volume resistivity was measured using a volume resistivity tester. Electrodes were placed on both sides of the cured sample, a DC voltage was applied, and the current passing through the sample volume was measured and calculated. The sample was stored in a standard temperature and humidity environment of 23°C / 50%RH for 24 hours before the test. The results were recorded in Table 1.

[0092] 5. Peel strength: The test references IPC-TM-650 2.4.8. The cured specimen of standard width is peeled from the substrate at a vertical angle and constant rate. The average force required is measured. The three-point bending method is used to apply a load to the center of the rectangular strip specimen until it breaks. The strength value is calculated. The result is the average of 10 tests and recorded in Table 1.

[0093] Table 1 Performance Test Results Example CTI(V) TG (°C) Thermal stratification (s) Volume resistivity (MΩ) Peel strength (N / mm) Example 1 675 142 88 <![CDATA[1.8×10 6 ]]> 1.25 Example 2 650 140 87 <![CDATA[1.7×10 6 ]]> 1.23 Example 3 675 139 84 <![CDATA[1.8×10 6 ]]> 1.27 Comparative Example 1 500 127 62 <![CDATA[0.8×10 6 ]]> 0.95 Comparative Example 2 575 130 59 <![CDATA[0.7×10 6 ]]> 1.02 Comparative Example 3 600 133 74 <![CDATA[1.2×10 6 ]]> 1.11 Comparative Example 4 550 134 69 <![CDATA[1.3×10 6 ]]> 1.14 Comparative Example 5 600 137 70 <![CDATA[1.4×10 6 ]]> 1.17 Comparative Example 6 575 135 75 <![CDATA[1.3×10 6 ]]> 1.09 Analysis of Test Results: Example 1 of this application, by employing a defined technical solution, outperforms Comparative Examples 1-6 in all performance test results. The defined epoxy resin system significantly improves the density and thermal stability of the crosslinking network, thus laying the foundation for high Tg and high intrinsic arc resistance. It effectively improves the resin's flowability and filling properties at high temperatures and absorbs stress, preventing brittle fracture and providing a good foundation for the resin material to achieve excellent overall performance. Furthermore, the added compounding agent constructs a dynamically tough molecular chain system in the resin material system, thereby significantly offsetting the shrinkage stress caused by differences in thermal expansion coefficients without sacrificing the overall heat resistance, maintaining good overall performance, reducing performance contradictions, and achieving superior overall performance. In contrast, Comparative Examples 1-6, by employing different technical solutions than those defined in this application, significantly reduced the effectiveness of their raw materials in the system, ultimately leading to a decline in the overall performance of the resin material.

[0094] The above description is the preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principles described in this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A resin composition with high Tg and high CTI, characterized in that: The raw material formula, by weight, includes: 90-120 parts epoxy resin system, 9-18 parts compounding agent, 40-60 parts curing agent, 100-120 parts functional filler, 140-200 parts solvent system, 1-1.5 parts coupling agent, 0.5-1 part accelerator, and 0.8-1.5 parts wetting and dispersing agent; The epoxy resin system is a combination of bisphenol A type epoxy resin, BNE resin and flow-modified resin, with a mass ratio of (6~8):(2~3.5):(0.3~0.7). The compounding agent is a combination of carboxyl-terminated nitrile rubber, polyetheramine and epoxidized polybutadiene, with a mass ratio of (5~6):(3~4):(2~3). The bisphenol A type epoxy resin is specifically E-51 or CYD-128.

2. The high Tg, high CTI resin composition according to claim 1, characterized in that: The mass ratio of the epoxy resin system, compounding agent and curing agent is (10~12):(1~1.6):(4.5~6).

3. The high Tg, high CTI resin composition according to claim 2, characterized in that: The curing agent is a linear phenolic resin.

4. The high Tg, high CTI resin composition according to claim 3, characterized in that: The functional filler is at least one of the following: flaky boehmite, calcium carbonate, talc, and sericite powder.

5. The high Tg, high CTI resin composition according to claim 4, characterized in that: The average particle size of the functional filler is 1~5μm.

6. The high Tg, high CTI resin composition according to claim 5, characterized in that: The solvent system is a combination of N,N-dimethylformamide and methylcyclohexane in a mass ratio of (10~12):(4~6).

7. The high Tg, high CTI resin composition according to claim 6, characterized in that: The coupling agent is a combination of silane coupling agent and aluminate coupling agent DL-411, with a mass ratio of (8~10):(2~3).

8. The high Tg, high CTI resin composition according to claim 7, characterized in that: The promoter is at least one of 2-methylimidazole, 2-ethylimidazole and 2-ethyl-4-methylimidazole.

9. A method for preparing a high Tg, high CTI resin composition according to any one of claims 1 to 8, characterized in that: Specifically, the following steps are included: S1: After drying the functional filler, add it to a high-speed heating mixer for preheating. Dilute the coupling agent with anhydrous ethanol and add it to the functional filler. After stirring and keeping warm, remove the anhydrous ethanol to obtain the modified filler for later use. S2: Add the solvent system to the reactor, heat and stir, and add the epoxy resin system and compounding agent. After stirring and mixing evenly, add the modified filler in three equal portions, dispersing completely each time. Then add the remaining raw materials and continue to disperse to obtain a slurry. S3: Degas the slurry under vacuum, then cool it to below 40°C, stir at low speed, and mix evenly. Then seal and cure the slurry at room temperature to obtain the resin composition. During curing, first heat to 130~140°C and keep warm for 50~60 minutes, and apply a pressure of 2.5~3.5 MPa. Then heat to 160~170°C and keep warm for 1.5~2 hours to cure.

10. The application of a high Tg, high CTI resin composition according to any one of claims 1 to 8 in 5G communication, new energy vehicles, industrial automation and smart grid.

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