A vacuum processing apparatus and method of use thereof

Abstract

This invention relates to the field of vacuum processing technology, and discloses a vacuum processing device and its method of use. The vacuum processing device includes a vacuum chamber, a workpiece holder mechanism, and a sputtering target assembly. The workpiece holder mechanism includes a rotary drive mechanism and a fixture assembly. The sputtering target assembly includes a first set of sputtering targets, which comprises a first sputtering target unit and a second sputtering target unit. Both the first and second sputtering target units have a vertical projection on the rotation axis. The sputtering directions of both the first and second sputtering target units are directed towards the side of the workpiece. This invention achieves three-dimensional coating of complex workpieces by arranging two sputtering target units in a staggered and complementary manner on the rotation axis, with both sputtering directions pointing towards the side of the workpiece. This, combined with the workpiece's rotation, ensures uniform coating on the workpiece's side, solving the problems of decreased coating stability and increased coating costs caused by the use of tandem rotary fixtures in existing equipment.

Description

Technical Field

[0001] This invention relates to the field of vacuum processing technology, and in particular to a vacuum processing device and its method of use. Background Technology

[0002] Vacuum coating refers to a technique in which materials are evaporated or sputtered into gaseous atoms or molecules in a high vacuum environment through physical or chemical methods, and then deposited on the surface of a substrate to form a functional thin film. With the continuous expansion of material application fields, functional components such as cubic, regular or irregular curved surface parts, and polyhedral components have higher requirements for uniformity and consistency in the preparation of surface coatings.

[0003] For flat workpieces such as mobile phone frames, the sidewalls perpendicular to the top and bottom surfaces are a key focus during the coating process. Traditional single-target sputtering suffers from limitations in the relative angle between the target and the workpiece side, making it difficult to uniformly cover the entire side area simultaneously. To achieve uniform coating on the workpiece side, current technologies often employ a mass production method where multiple workpieces are tandemly mounted on a rotating axis for vacuum coating. However, this tandem rotating fixture is not only structurally complex and costly to manufacture, but also prone to jamming due to friction after prolonged operation in a high-temperature vacuum environment. Jamming causes variations in the workpiece's residence time in the target sputtering area, disrupting coating uniformity and leading to color or thickness differences within the same batch, severely impacting product yield. Frequent downtime for maintenance further increases production costs, becoming a bottleneck restricting production efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a vacuum processing device and its usage method to solve the problems of complex coating structure and high manufacturing cost caused by the use of serial rotary fixtures in existing equipment, as well as the problems of jamming during long-term operation in high temperature vacuum environment, which in turn damages coating uniformity, causes product color difference and film thickness difference, and affects product yield and production efficiency.

[0005] To achieve this objective, the present invention adopts the following technical solution: On one hand, the present invention provides a vacuum processing apparatus, comprising: Vacuum chamber; A workpiece holder mechanism is disposed in the vacuum chamber. The workpiece holder mechanism includes a rotary drive mechanism and a clamping assembly. The clamping assembly is used to fix the workpiece to be coated. The drive end of the rotary drive mechanism is connected to the clamping assembly and is used to drive the clamping assembly to rotate around the rotation axis. A sputtering target assembly, the sputtering target assembly including a first set of sputtering targets, the first set of sputtering targets including a first sputtering target unit and a second sputtering target unit; the first sputtering target unit and the second sputtering target unit are both disposed in the vacuum chamber and extend along a first direction; Define a first plane that includes the axis of rotation and is perpendicular to the first direction; In the first plane, both the first sputtering target unit and the second sputtering target unit have a vertical projection on the rotation axis, and the positions of their vertical projections are different; the sputtering directions of both the first sputtering target unit and the second sputtering target unit are towards the side of the workpiece, and their sputtering directions are adjacent on the same side or opposite on different sides of the workpiece.

[0006] As an alternative to the aforementioned vacuum processing equipment, in the first plane, the main directions of the sputtering directions of the first sputtering target unit and the second sputtering target unit respectively form a first angle and a second angle with the rotation axis, wherein the first angle and the second angle are each independently between 30° and 90°.

[0007] As an alternative to the aforementioned vacuum processing equipment, the workpiece is located between the vertical projections of the first sputtering target unit and the second sputtering target unit on the rotation axis, and closer to the side of the two vertical projections that is closer to the fixture assembly.

[0008] As an alternative to the aforementioned vacuum processing equipment, the first sputtering target unit and the second sputtering target unit are arranged on the same straight line parallel to the rotation axis, or the first sputtering target unit and the second sputtering target unit are respectively arranged on two straight lines parallel to the rotation axis and with equal spacing.

[0009] As an optional solution to the above-mentioned vacuum processing equipment, the sputtering target assembly further includes a second set of sputtering targets, the second set of sputtering targets including a third sputtering target unit, the third sputtering target unit being disposed in the vacuum chamber and extending along the first direction; in the first plane, the sputtering direction of the third sputtering target unit is toward the top surface of the workpiece.

[0010] As an alternative to the aforementioned vacuum processing equipment, the main direction of the sputtering direction of the third sputtering target unit is parallel to or coincides with the rotation axis.

[0011] As an alternative to the aforementioned vacuum processing equipment, the sputtering direction of the first sputtering target unit is configured to cover the area of ​​the workpiece side closest to the third sputtering target unit, and the sputtering direction of the second sputtering target unit is configured to cover the area of ​​the workpiece side away from the third sputtering target unit and extend to the edge area of ​​the bottom surface of the workpiece.

[0012] As an optional solution to the above-mentioned vacuum processing equipment, the sputtering target assembly further includes a first target magnet, a second target magnet, and a third target magnet extending along the first direction. The first target magnet, the second target magnet, and the third target magnet are respectively disposed in the first sputtering target unit, the second sputtering target unit, and the third sputtering target unit. The first target magnet, the second target magnet, and the third target magnet are rotatably disposed about the axes of the first sputtering target unit, the second sputtering target unit, and the third sputtering target unit, respectively.

[0013] As an alternative to the aforementioned vacuum processing equipment, the first sputtering target unit, the second sputtering target unit, and the third sputtering target unit are all rotatably arranged about their respective axes.

[0014] As an alternative to the aforementioned vacuum processing equipment, the vacuum processing equipment further includes a control system configured to independently adjust the sputtering power of the first sputtering target unit, the second sputtering target unit, and the third sputtering target unit according to the surface shape and size of the workpiece.

[0015] On the other hand, the present invention provides a method of using a vacuum processing device, wherein the method of using the vacuum processing device as described above includes the following steps: Select a clamping assembly according to the shape of the workpiece to clamp the workpiece, and adjust the position of the workpiece to be aligned with the rotation axis of the clamping assembly. The first sputtering target unit and the second sputtering target unit are both disposed in the vacuum chamber, such that the first sputtering target unit and the second sputtering target unit have vertical projections at different positions on the rotation axis, and the sputtering directions of the first sputtering target unit and the second sputtering target unit are both directed toward the side of the workpiece, and the sputtering directions of the two are adjacent on the same side or opposite on different sides of the workpiece. Adjust the rotation angles of the first and second target magnets corresponding to the first and second sputtering target units, and simultaneously adjust the height of the workpiece; Start the vacuum pump unit to evacuate the vacuum chamber and introduce inert argon gas; The rotary drive mechanism is activated to drive the fixture assembly to rotate, and the first sputtering target unit and the second sputtering target unit are powered by the power supply unit to coat the workpiece. Stop the rotary drive mechanism and disconnect the power to the first sputtering target unit and the second sputtering target unit through the power supply assembly. After the vacuum is broken, remove the workpiece.

[0016] As an alternative method of using the aforementioned vacuum processing equipment, the power supply component is a dual-channel power supply, and the power supply output modes of the dual-channel power supply to the first sputtering target unit and the second sputtering target unit include intermediate frequency mode and DC mode.

[0017] The beneficial effects of this invention are: The vacuum processing equipment includes a vacuum chamber, a workpiece holder mechanism, and a sputtering target assembly. The workpiece holder mechanism is located within the vacuum chamber and includes a rotary drive mechanism and a clamping assembly. The clamping assembly is used to fix the workpiece to be coated. The drive end of the rotary drive mechanism is connected to the clamping assembly and drives the clamping assembly to rotate around a rotation axis. In other words, the rotary drive mechanism drives the clamping assembly to rotate, and the clamping assembly drives the workpiece to rotate, thereby achieving the workpiece's rotation around the rotation axis, allowing each surface of the workpiece to be periodically deposited. The sputtering target assembly includes a first set of sputtering targets, which comprises a first sputtering target unit and a second sputtering target unit. Both the first and second sputtering target units are disposed within a vacuum chamber and extend along a first direction, defining a first plane. This first plane includes a rotation axis and is perpendicular to the first direction. Within this first plane, both the first and second sputtering target units have vertical projections onto the rotation axis, but their vertical projections are at different positions. Furthermore, the sputtering directions of both the first and second sputtering target units are directed towards the side of the workpiece, and their sputtering directions are adjacent on the same side or on different sides of the workpiece. Yes, that is, the first sputtering target unit and the second sputtering target unit are staggered and complementary on the rotation axis, and the sputtering direction is both pointing towards the side of the workpiece. This allows the first sputtering target unit and the second sputtering target unit to be responsible for the coating of different areas on the upper, middle and lower parts of the workpiece side at the same time. With the rotation of the workpiece, three-dimensional coating of complex workpieces can be achieved to achieve uniformity of coating on the side of the workpiece. This solves the key performance problems of existing equipment, such as complex coating structure, high manufacturing cost, and easy jamming under high temperature and vacuum environment, which can damage coating uniformity, cause product color difference, and affect product yield and production efficiency.

[0018] The method of using the vacuum processing equipment of the present invention utilizes the vacuum processing equipment described above. This method of using the vacuum processing equipment can ensure that sputtered particles cover the upper, middle, and lower parts of the workpiece side from a staggered and complementary spatial position and sputtering direction by rationally distributing two sputtering target units in space and coordinating with the rotation of the workpiece. This avoids insufficient or excessive local deposition on the workpiece, and achieves three-dimensional coating of complex workpieces. At the same time, by adjusting the power supply of the sputtering target units, the rotation angle of the target magnet, the rotation speed of the workpiece, and the height of the workpiece, precise control of the film thickness and uniformity of the workpiece can be achieved. Attached Figure Description

[0019] Figure 1 A schematic diagram of the structure of the vacuum processing equipment provided in the embodiments of the present invention. Figure 1 ; Figure 2 A schematic diagram of the structure of the vacuum processing equipment provided in the embodiments of the present invention. Figure 2 ; Figure 3 A schematic diagram of the structure of the vacuum processing equipment provided in the embodiments of the present invention. Figure 3 ; Figure 4 This is a flowchart illustrating the method of using the vacuum processing equipment provided in an embodiment of the present invention.

[0020] In the picture: 1. Vacuum chamber; 2. Workpiece holder mechanism; 21. Rotary drive mechanism; 22. Fixture assembly; 3. Sputtering target assembly; 31. First sputtering target unit; 32. Second sputtering target unit; 33. Third sputtering target unit; 34. First target magnet; 35. Second target magnet; 36. Third target magnet. Detailed Implementation

[0021] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Furthermore, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0025] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0026] Example 1 like Figure 1 As shown, the present invention provides a vacuum processing device for coating workpieces.

[0027] The vacuum processing equipment includes a vacuum chamber 1, a workpiece holder mechanism 2, and a sputtering target assembly 3. The workpiece holder mechanism 2 is disposed within the vacuum chamber 1 and includes a rotary drive mechanism 21 and a clamping assembly 22. The clamping assembly 22 is used to fix the workpiece to be coated. The drive end of the rotary drive mechanism 21 is connected to the clamping assembly 22 and is used to drive the clamping assembly 22 to rotate around a rotation axis. That is, the rotary drive mechanism 21 drives the clamping assembly 22 to rotate, and the clamping assembly 22 drives the workpiece to rotate, thereby realizing the workpiece's rotation around the rotation axis, allowing each surface of the workpiece to be periodically deposited. Optionally, the clamping assembly 22 is a turntable clamp. Further optionally, the specific structure of the first rotating assembly can be set with reference to existing technology, which will not be described in detail here.

[0028] The sputtering target assembly 3 includes a first set of sputtering targets, which includes a first sputtering target unit 31 and a second sputtering target unit 32. Both the first sputtering target unit 31 and the second sputtering target unit 32 are disposed in the vacuum chamber 1 and extend along a first direction, defining a first plane. The first plane includes a rotation axis and is perpendicular to the first direction. Within the first plane, both the first sputtering target unit 31 and the second sputtering target unit 32 have vertical projections on the rotation axis, but their vertical projection positions are different. Furthermore, the sputtering directions of both the first sputtering target unit 31 and the second sputtering target unit 32 are directed towards the side of the workpiece, and their sputtering directions are adjacent on the same side of the workpiece or opposite on different sides. That is, the first sputtering target unit 31 and the second sputtering target unit 32 are staggered and complementary on the rotation axis. The first sputtering target unit 31 and the second sputtering target unit 32 are positioned such that the sputtering direction is always directed towards the side of the workpiece. This allows them to simultaneously coat different areas of the upper, middle, and lower sides of the workpiece side. Combined with the workpiece's rotation, this achieves three-dimensional coating of complex workpieces, eliminating the film thickness gradient problem inherent in traditional single-target coating. Simultaneously, the sputtering angle can fully cover the side area of ​​the workpiece, achieving uniform coating and improving the film uniformity in the side area. This is beneficial for enhancing key performance characteristics such as the color properties of the workpiece surface. Furthermore, it solves the problems of complex coating structures, high manufacturing costs, and the tendency for jamming during long-term operation in high-temperature vacuum environments due to the use of tandem rotating fixtures in existing equipment. These problems can lead to coating uniformity issues, color differences in products, and reduced product yield and production efficiency. The sputtering direction refers to the range of sputtered material ejection direction, with the first direction being horizontal. Understandably, when the sputtering directions of the first sputtering target unit 31 and the second sputtering target unit 32 are adjacent on the same side of the workpiece, the vacuum processing equipment can ensure coating stability and uniformity while also having a compact structure. Optionally, by adjusting the positional distance between the first sputtering target unit 31 and the second sputtering target unit 32, as well as the positional distances of the first sputtering target unit 31 and the second sputtering target unit 32 relative to the workpiece, uniform coating can also be achieved on a portion of the top and bottom surfaces of the workpiece.

[0029] Furthermore, within the first plane, the principal directions of the sputtering directions of the first sputtering target unit 31 and the second sputtering target unit 32 respectively form a first angle and a second angle with the rotation axis, and the first angle and the second angle are each independently between 30° and 90°, thereby adaptively adjusting the principal directions of the sputtering directions of the first sputtering target unit 31 and the second sputtering target unit 32 to meet the needs of coating different types of workpieces. Optionally, the target unit is a hollow cylindrical structure. In one embodiment, such as Figure 1As shown, both the first and second included angles are 90°, meaning that the principal directions of the sputtering directions of the first sputtering target unit 31 and the second sputtering target unit 32 are perpendicular to the rotation axis. This design is universal, meeting the coating requirements of some workpieces, and simplifies the design. Using the first and second included angles at 90° as a reference, the angle of the principal direction of subsequent sputtering directions is adjusted. The principal direction of the sputtering direction is the main emission direction of the sputtered material. For a planar target, it is the average normal direction of its sputtered surface; for a rotating target, it is the normal direction at the midpoint of the arc formed by the projection of its cylindrical sputtered surface onto the first plane. Furthermore, both the first and second included angles refer to the acute angles between the principal direction vector of the sputtering direction and the rotation axis.

[0030] Furthermore, the workpiece is located between the vertical projections of the first sputtering target unit 31 and the second sputtering target unit 32 on the rotation axis, and is close to the side of the two vertical projections that is closer to the fixture assembly 22. Thus, the first sputtering target unit 31 and the second sputtering target unit 32 that is closer to the fixture assembly 22 can be concentrated to reach the junction of the bottom surface and the side surface of the workpiece, and the first sputtering target unit 31 and the second sputtering target unit 32 that is farther away from the fixture assembly 22 can be concentrated to reach the junction of the top surface and the side surface of the workpiece. Under certain conditions, it may also completely cover the top surface of the workpiece, thereby meeting the requirements for three-dimensional coating of the workpiece. Meanwhile, the first sputtering target unit 31 and the second sputtering target unit 32 are arranged on the same straight line parallel to the rotation axis, or the first sputtering target unit 31 and the second sputtering target unit 32 are respectively arranged on two straight lines parallel to the rotation axis and with equal spacing. This makes the vertical distance between the first sputtering target unit 31 and the second sputtering target unit 32 and the rotation axis equal, which facilitates the control of the deposition rate of the first sputtering target unit 31 and the second sputtering target unit 32 to the workpiece and simplifies process debugging.

[0031] In another embodiment, such as Figure 2 and Figure 3As shown, the sputtering target assembly 3 also includes a second set of sputtering targets, which includes a third sputtering target unit 33. The third sputtering target unit 33 is disposed in the vacuum chamber 1 and extends along the first direction. In the first plane, the sputtering direction of the third sputtering target unit 33 is towards the top surface of the workpiece. Thus, in addition to the arrangement of the first sputtering target unit 31 and the second sputtering target unit 32, the third sputtering target unit 33 is additionally arranged on the top surface of the workpiece. The spatial arrangement of the three sputtering target units can form a multi-directional sputtering coverage area. With the rotation of the workpiece, the irradiation of all surfaces of the workpiece can be achieved, further effectively eliminating local shading and thickness differences, and ensuring the functionality and reliability of the workpiece. Optionally, the main direction of the sputtering direction of the third sputtering target unit 33 is parallel to or coincides with the rotation axis. That is, controlling the main direction of the sputtering direction of the third sputtering target unit 33 ensures that when the third sputtering target unit 33 coats the workpiece from the top surface, it can meet the uniformity requirements of the coating on the top surface of the workpiece, eliminate the difference in film thickness between the top and side surfaces of the workpiece, and improve the three-dimensional coating capability for complex workpieces. Optionally, adjusting the positional distance between the target units near the fixture assembly 22 in the first and second sputtering target units 31 and 32 on the side surface and relative to the workpiece can also simultaneously achieve uniform coating on a portion of the bottom surface area of ​​the workpiece.

[0032] Specifically, the sputtering direction of the first sputtering target unit 31 is configured to cover the area of ​​the workpiece side closest to the third sputtering target unit 33, and the sputtering direction of the second sputtering target unit 32 is configured to cover the area of ​​the workpiece side away from the third sputtering target unit 33 and extend to the edge area of ​​the bottom surface of the workpiece. That is, the second sputtering target unit 32 can coat the bottom edge and side of the workpiece, the first sputtering target unit 31 can coat the top edge and side of the workpiece, and the third sputtering target unit 33 can coat the top surface of the workpiece, so that the coating on the workpiece is completely and uniformly covered without dead corners, thus solving the problem of local occlusion in the blind area of ​​the bottom edge of the workpiece.

[0033] Furthermore, the sputtering target assembly 3 also includes a first target magnet 34, a second target magnet 35, and a third target magnet 36 extending along a first direction. The first target magnet 34, the second target magnet 35, and the third target magnet 36 are respectively disposed in the first sputtering target unit 31, the second sputtering target unit 32, and the third sputtering target unit 33. The first target magnet 34, the second target magnet 35, and the third target magnet 36 are rotatably arranged about the axes of the first sputtering target unit 31, the second sputtering target unit 32, and the third sputtering target unit 33, thereby adjusting the magnetic field formed on the surface of the first sputtering target unit 31, the second sputtering target unit 32, and the third sputtering target unit 33. This achieves dynamic control of the magnetic field distribution, significantly improves process flexibility, optimizes the target sputtering situation, and improves the uniformity of film deposition. Meanwhile, the first sputtering target unit 31, the second sputtering target unit 32 and the third sputtering target unit 33 are all rotatably set on their respective axes, so as to ensure uniform wear on the surface of the sputtering target unit during the sputtering process, avoid local overheating and uneven wear, and thus facilitate precise control of the film thickness and uniformity on the workpiece.

[0034] Furthermore, the vacuum processing equipment also includes a control system configured to independently adjust the sputtering power of the first sputtering target unit 31, the second sputtering target unit 32, and the third sputtering target unit 33 according to the surface shape and size of the workpiece, thereby ensuring that the film thickness of each micro-region on the workpiece reaches the design specifications through precise power matching, reducing film thickness unevenness caused by shape differences.

[0035] Furthermore, the vacuum processing equipment also includes a lifting mechanism. The drive end of the lifting mechanism is connected to the rotary drive mechanism 21, which drives the rotary drive mechanism 21 to move vertically. This allows the lifting mechanism to adjust the distance between the workpiece and the three sputtering target units to a suitable level. Simultaneously, it works in conjunction with the corresponding target magnet within each sputtering target unit to prevent uneven coating thickness or excessive heat generation leading to film cracking when the workpiece is too close to the sputtering target unit, and to avoid reduced sputtering efficiency when the workpiece is too far from the sputtering target unit. Optionally, the specific structure of the lifting mechanism can be configured according to existing technology, and will not be elaborated upon in this embodiment.

[0036] Example 2 This embodiment also provides a method for using a vacuum processing device, such as the vacuum processing device in Embodiment 1. Figure 4 As shown, the method of using the vacuum processing equipment includes the following steps: Select the clamping assembly 22 according to the shape of the workpiece to clamp the workpiece, and adjust the position of the workpiece to be aligned with the rotation axis of the clamping assembly 22. The first sputtering target unit 31 and the second sputtering target unit 32 are both disposed in the vacuum chamber 1, such that the first sputtering target unit 31 and the second sputtering target unit 32 have vertical projections at different positions on the rotation axis, and the sputtering directions of the first sputtering target unit 31 and the second sputtering target unit 32 are both directed toward the side of the workpiece, and the sputtering directions of the two are adjacent on the same side of the workpiece or opposite on different sides. Adjust the rotation angles of the corresponding first target magnet 34 and second target magnet 35 in the first sputtering target unit 31 and the second sputtering target unit 32, and simultaneously adjust the height of the workpiece. Start the vacuum pump unit to evacuate vacuum chamber 1 and introduce inert argon gas; The rotary drive mechanism 21 is activated to drive the fixture assembly 22 to rotate, and the first sputtering target unit 31 and the second sputtering target unit 32 are powered through the power supply assembly to coat the workpiece. Stop the rotation drive mechanism 21 and disconnect the power to the first sputtering target unit 31 and the second sputtering target unit 32 through the power supply assembly. Remove the workpiece after the vacuum is broken.

[0037] The vacuum processing equipment utilizes the rational spatial distribution of two sputtering target units, combined with the workpiece's rotation, to ensure that sputtered particles cover the upper, middle, and lower parts of the workpiece's side from a staggered and complementary spatial position and sputtering direction. This avoids insufficient or excessive local deposition on the workpiece, achieving three-dimensional coating of complex workpieces. Furthermore, by adjusting the power supply of the sputtering target units, the rotation angle of the target magnets, the rotation speed of the workpiece, and the height of the workpiece, precise control over the film thickness and uniformity of the workpiece can be achieved.

[0038] Before selecting the clamping assembly 22 to hold the workpiece according to its shape, the process includes inspecting the vacuum chamber 1 to ensure it is clean and free of impurities. The inner wall of the chamber is cleaned to prevent contaminants from affecting the coating quality. A cooling system is also installed to control the temperature inside the chamber. After starting the vacuum pump to evacuate the vacuum chamber 1 and introducing inert argon gas, the process includes checking the vacuum level inside the vacuum chamber 1 to ensure that the mean free space of the plasma within the vacuum chamber 1 meets the requirements for film formation on the workpiece. The gas flow rate is also adjusted to ensure that the argon flow rate is stable within the process range. Reactive gases, such as nitrogen and hydrogen, are added and their flow rates are adjusted according to the coating requirements of the workpiece.

[0039] Furthermore, starting the rotary drive mechanism 21 to drive the fixture assembly 22 to rotate, and energizing the first sputtering target unit 31 and the second sputtering target unit 32 through the power supply assembly includes starting the rotary drive mechanism 21 to rotate, the sputtering target unit to rotate, and energizing the sputtering target unit. Stopping the rotary drive mechanism 21 and de-energizing the first sputtering target unit 31 and the second sputtering target unit 32 through the power supply assembly includes stopping the rotary drive mechanism 21 to rotate, the sputtering target unit to rotate, and energizing the sputtering target unit. In this way, the rotation time of the workpiece, the rotation time of the sputtering target unit, and the energizing time of the sputtering target unit are uniformly controlled to ensure that the start time and end time of sputtering are coupled, complete the entire deposition process, and avoid over-plating and under-plating.

[0040] Furthermore, the number of rotations of the rotary drive mechanism 21 is an integer number of rotations, thereby ensuring the uniformity of the coating thickness and the consistency of the composition, and ensuring that the coating structure has precise periodicity, so that the workpiece can return to the initial spatial position and orientation after each coating, avoiding the situation where some areas are continuously over-coated and other areas are continuously under-coated, which will eventually cause uneven film thickness and composition.

[0041] Furthermore, the power supply assembly is a dual-channel power supply. The dual-channel power supply provides power to the first sputtering target unit 31 and the second sputtering target unit 32 in both intermediate frequency (IF) and DC modes. This allows the power supply mode to be selected based on the type of sputtering target unit and the film requirements of the workpiece, thereby controlling the deposition rate on different surfaces of the workpiece. Optionally, when the power supply assembly is in IF mode, a duty cycle is also set. The duty cycle setting needs to be adjusted according to the sputtering angles on different surfaces of the workpiece and the distance between the workpiece and the sputtering target unit.

[0042] In another embodiment, the method of using the vacuum processing equipment further includes placing the third sputtering target unit 33 in the vacuum chamber 1, such that the third target unit is located above the workpiece and higher than the other two sputtering target units. At the same time, the rotation angle of the third target magnet 36 is adjusted. When the rotation drive mechanism 21 is started or stopped, the power supply component synchronously powers on or off the third sputtering target unit 33. The spatial arrangement of the three sputtering target units can form a multi-directional sputtering coverage area. Combined with the rotation of the workpiece, it can achieve irradiation of all surfaces of the workpiece, further effectively eliminating local shading and thickness differences, and ensuring the functionality and reliability of the workpiece.

[0043] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A vacuum processing device, characterized in that, include: Vacuum chamber (1); The workpiece holder mechanism (2) is disposed in the vacuum chamber (1). The workpiece holder mechanism (2) includes a rotary drive mechanism (21) and a clamp assembly (22). The clamp assembly (22) is used to fix the workpiece to be coated. The drive end of the rotary drive mechanism (21) is connected to the clamp assembly (22) and is used to drive the clamp assembly (22) to rotate around the rotation axis. The sputtering target assembly (3) includes a first set of sputtering targets, which includes a first sputtering target unit (31) and a second sputtering target unit (32). The first sputtering target unit (31) and the second sputtering target unit (32) are both disposed in the vacuum chamber (1) and extend along a first direction. Define a first plane that includes the axis of rotation and is perpendicular to the first direction; In the first plane, the first sputtering target unit (31) and the second sputtering target unit (32) both have vertical projections on the rotation axis, and the positions of their vertical projections are different; the sputtering directions of the first sputtering target unit (31) and the second sputtering target unit (32) are both toward the side of the workpiece, and their sputtering directions are adjacent on the same side or opposite on different sides of the workpiece.

2. The vacuum processing equipment according to claim 1, characterized in that, In the first plane, the main directions of the sputtering directions of the first sputtering target unit (31) and the second sputtering target unit (32) form a first angle and a second angle with the axis of rotation, respectively, and the first angle and the second angle are each independently 30° to 90°.

3. The vacuum processing equipment according to claim 1, characterized in that, The workpiece is located between the vertical projections of the first sputtering target unit (31) and the second sputtering target unit (32) on the rotation axis, and is closer to the side of the two vertical projections that is closer to the fixture assembly (22).

4. The vacuum processing equipment according to claim 1, characterized in that, The first sputtering target unit (31) and the second sputtering target unit (32) are arranged on the same straight line parallel to the rotation axis, or the first sputtering target unit (31) and the second sputtering target unit (32) are respectively arranged on two straight lines parallel to the rotation axis and with equal spacing.

5. The vacuum processing equipment according to any one of claims 1 to 4, characterized in that, The sputtering target assembly (3) further includes a second set of sputtering targets, the second set of sputtering targets including a third sputtering target unit (33), the third sputtering target unit (33) being disposed in the vacuum chamber (1) and extending along the first direction; in the first plane, the sputtering direction of the third sputtering target unit (33) is toward the top surface of the workpiece.

6. The vacuum processing equipment according to claim 5, characterized in that, The main direction of the sputtering direction of the third sputtering target unit (33) is parallel to or coincides with the rotation axis.

7. The vacuum processing equipment according to claim 5, characterized in that, The sputtering direction of the first sputtering target unit (31) is configured to cover the area of ​​the side of the workpiece close to the third sputtering target unit (33), and the sputtering direction of the second sputtering target unit (32) is configured to cover the area of ​​the side of the workpiece away from the third sputtering target unit (33) and extend to the edge area of ​​the bottom surface of the workpiece.

8. The vacuum processing equipment according to claim 5, characterized in that, The sputtering target assembly (3) further includes a first target magnet (34), a second target magnet (35), and a third target magnet (36) extending along the first direction. The first target magnet (34), the second target magnet (35), and the third target magnet (36) are respectively disposed in the first sputtering target unit (31), the second sputtering target unit (32), and the third sputtering target unit (33). The first target magnet (34), the second target magnet (35), and the third target magnet (36) are rotatably disposed about the axes of the first sputtering target unit (31), the second sputtering target unit (32), and the third sputtering target unit (33).

9. The vacuum processing equipment according to claim 5, characterized in that, The first sputtering target unit (31), the second sputtering target unit (32) and the third sputtering target unit (33) are all rotatably arranged about their respective axes.

10. The vacuum processing equipment according to claim 5, characterized in that, The vacuum processing equipment also includes a control system configured to independently adjust the sputtering power of the first sputtering target unit (31), the second sputtering target unit (32), and the third sputtering target unit (33) according to the surface shape and size of the workpiece.

11. A method of using a vacuum processing device, characterized in that, The method of using the vacuum processing equipment as described in any one of claims 1 to 10 includes the following steps: Select a clamping assembly (22) according to the shape of the workpiece to clamp the workpiece, and adjust the position of the workpiece to be aligned with the rotation axis of the clamping assembly (22); The first sputtering target unit (31) and the second sputtering target unit (32) are both disposed in the vacuum chamber (1), such that the first sputtering target unit (31) and the second sputtering target unit (32) have different vertical projections on the rotation axis, and the sputtering directions of the first sputtering target unit (31) and the second sputtering target unit (32) are both directed toward the side of the workpiece, and the sputtering directions of the two are adjacent on the same side or opposite on different sides of the workpiece; Adjust the rotation angles of the first target magnet (34) and the second target magnet (35) corresponding to the first sputtering target unit (31) and the second sputtering target unit (32), and simultaneously adjust the height of the workpiece; Start the vacuum pump group to evacuate the vacuum chamber (1) and introduce inert gas argon; The rotary drive mechanism (21) is activated to drive the fixture assembly (22) to rotate, and the first sputtering target unit (31) and the second sputtering target unit (32) are powered by the power supply assembly to coat the workpiece. Stop the rotary drive mechanism (21) and disconnect the power to the first sputtering target unit (31) and the second sputtering target unit (32) through the power supply assembly, and remove the workpiece after the vacuum is broken.

12. The method of using the vacuum processing equipment according to claim 11, characterized in that, The power supply component is a dual-channel power supply, and the power supply output modes of the dual-channel power supply to the first sputtering target unit (31) and the second sputtering target unit (32) include intermediate frequency mode and DC mode.

Images