Electroplated graphene copper conductor and method of making same
By electroplating graphene onto the surface of a copper substrate, the problems of low strength and poor wear resistance of pure copper wires are solved, achieving improved conductivity and enhanced strength. This method is suitable for high-speed, heavy-duty wires and cables and has good process feasibility.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WEIHAI HONGLIN ELECTRIC POWER TECH CO LTD
- Filing Date
- 2024-12-02
- Publication Date
- 2026-06-02
AI Technical Summary
In existing technologies, pure copper wires have low strength, poor wear resistance, and poor heat resistance. Furthermore, the preparation methods of graphene-copper composite materials suffer from high cost, low efficiency, or insufficient graphene addition, making it difficult to form a conductive network.
Graphene is electroplated onto the surface of a copper substrate using a direct current electroplating method. Through pretreatment, electroplating solution preparation, and post-treatment processes, the electroplating parameters are controlled to ensure that graphene is uniformly deposited on the surface of the copper substrate, forming a dense coating.
It improves the conductivity, strength, and wear resistance of copper conductors, making it suitable for high-speed, heavy-duty wires and cables. It also has high process feasibility and is suitable for large-scale production.