Dehumidifier

Abstract

This invention relates to the field of dehumidification equipment technology, and provides a dehumidifier including a semiconductor mechanism, a windshield mechanism, a connecting air duct, and a power mechanism. The semiconductor mechanism includes stacked semiconductor wafers, with air ducts formed between any adjacent semiconductor wafers. These adjacent air ducts are designated as a first air duct and a second air duct, respectively, and the energizing directions of any adjacent semiconductor wafers are opposite. The windshield mechanism connects only the first and second side spaces of the semiconductor mechanism in the first air duct, and only the third and fourth side spaces of the semiconductor mechanism in the second air duct. The connecting air duct connects the second and third side spaces. Thus, during dehumidification, one of the first and second air ducts is a hot air duct, and the other is a cold air duct. The gas directly exchanges heat with the semiconductor wafers within the cold and hot air ducts, avoiding the need for finned structures. The structure is compact and allows for increased contact area between the gas and semiconductor wafers by increasing the number of semiconductor wafers, thereby improving dehumidification efficiency.

Description

Technical Field

[0001] This invention relates to the field of dehumidification equipment technology, and more particularly to a dehumidifier. Background Technology

[0002] A dehumidifier is a device used to remove excess moisture from indoor air. It has important applications in various settings, such as homes and offices. Dehumidifiers work by condensing water vapor in the air into water droplets, collecting these droplets, and then expelling them outside the machine, thereby reducing indoor humidity.

[0003] Currently, dehumidifiers generally use compressor cooling. In practical use, noise is a bottleneck issue that hinders their operation. Some low-noise semiconductor cooling dehumidifiers have emerged on the market. These dehumidifiers use very few semiconductor wafers, typically employing fins on the cooling side of the wafers to increase the heat exchange area with the air and improve dehumidification efficiency. However, the finned design results in a dispersed internal structure, increasing the size and weight of the dehumidifier, making it suitable only for small spaces and limiting its widespread adoption.

[0004] Therefore, how to solve the problem of structural dispersion in improving the dehumidification efficiency of dehumidifiers has become an important technical problem for those skilled in the art to solve. Summary of the Invention

[0005] This invention provides a dehumidifier to address the structural defects in related technologies that exist when improving the dehumidification efficiency of dehumidifiers.

[0006] This invention provides a dehumidifier, comprising: A semiconductor structure includes multiple stacked semiconductor wafers, with a gap between any two adjacent semiconductor wafers to form an air channel, and any two adjacent air channels being a first air channel and a second air channel, and any two adjacent semiconductor wafers having opposite energizing directions; A windshield mechanism is adapted to allow the first air duct to connect only the first side space and the second side space of the semiconductor mechanism, and to allow the second air duct to connect only the third side space and the fourth side space of the semiconductor mechanism. A connecting duct is adapted to connect the second side space and the third side space of the semiconductor mechanism; A power mechanism, suitable for providing power for the flow of gas.

[0007] In this way, the gas directly exchanges heat with the semiconductor wafer in the first air duct and the second air duct, the fin structure is avoided, the structure is compact, the fin structure occupies space is avoided, the number of semiconductor wafers is increased to increase the contact area of the gas and the semiconductor wafers, the dehumidification efficiency is improved, and the problem of dispersed structure in the related art when improving the dehumidification efficiency of the dehumidifier is solved.

[0008] According to the dehumidifier provided by the application, the damper mechanism comprises: A pair of first baffles, two of the pair of first baffles are arranged on the first side and the second side of the semiconductor mechanism respectively, the first baffles are provided with first through holes, and each first air duct is provided with the first through hole in correspondence; A pair of second baffles, two of the pair of second baffles are arranged on the third side and the fourth side of the semiconductor mechanism respectively, the second baffles are provided with second through holes, and each second air duct is provided with the second through hole in correspondence.

[0009] In this way, the damper is used to control the gas flow, and the structure is simple and reliable.

[0010] According to the dehumidifier provided by the application, the first through hole on the first baffle on the second side of the semiconductor mechanism is suitable for discharging the condensed water in the first air duct to the connecting air duct, and the bottom of the connecting air duct is provided with a water collecting groove.

[0011] In this way, the condensed water formed in the first air duct can be discharged in time, the amount of frost in the first air duct is reduced, and the influence of the condensed water on other position structures in the dehumidifier is avoided.

[0012] According to the dehumidifier provided by the application, the bottom of the water collecting groove is provided with a drain hole, and the dehumidifier further comprises: A water collecting box is detachably arranged below the drain hole, the upper end of the water collecting box is open, and the open end of the water collecting box is opposite to the drain hole.

[0013] In this way, the water in the water collecting groove can be collected into the water collecting box, the condensed water in the water collecting box can be cleaned as needed by disassembling the water collecting box, and maintenance is facilitated.

[0014] According to the dehumidifier provided by the application, the connecting air duct comprises: A first connecting air duct is arranged on the second side of the semiconductor mechanism, and one side of the first connecting air duct facing the semiconductor mechanism is in communication with the first air duct. A second connecting air duct is disposed on the third side of the semiconductor mechanism. The side of the second connecting air duct facing the semiconductor mechanism is connected to the second air duct, and the end of the second connecting air duct that is close to the first connecting air duct is connected to the second connecting air duct.

[0015] This configuration allows for segmented connection ductwork, facilitating design and manufacturing.

[0016] According to the present invention, a dehumidifier is provided, wherein the power mechanism comprises: A centrifugal impeller is rotatably disposed inside the first connecting air duct, and the centrifugal impeller is disposed adjacent to the end of the first air duct. A flow guiding structure is provided inside the first connecting air duct, and the flow guiding structure is adapted to guide the gas discharged by the centrifugal impeller to the second connecting air duct. A drive unit is disposed outside the connecting duct, and the drive unit is adapted to drive the centrifugal impeller to rotate.

[0017] This configuration, where the first connecting duct with a flow-guiding structure serves as the volute of the centrifugal impeller, integrates the centrifugal impeller with the connecting duct, further improving the structural compactness of the dehumidifier. Setting the power structure to a centrifugal fan configuration increases gas flow rate, reduces noise levels, and enhances stability and adaptability.

[0018] According to a dehumidifier provided by the present invention, the first side space and the second side space of the semiconductor mechanism are distributed along a first straight line on both sides of the semiconductor mechanism, and the third side space and the fourth side space of the semiconductor mechanism are distributed along a second straight line on both sides of the semiconductor mechanism. The first straight line and the second straight line are perpendicular to each other, and both the first straight line and the second straight line are parallel to the semiconductor sheet.

[0019] With this configuration, both the first and second air ducts extend in a straight line, allowing the gas to flow in a straight line within both ducts. This reduces gas flow resistance, which in turn improves dehumidification efficiency, reduces energy consumption, and minimizes noise.

[0020] A dehumidifier according to the present invention further includes: An air outlet duct is disposed on the fourth side of the semiconductor structure. The first end of the air outlet duct is connected to the end of the second air duct away from the connecting air duct, and the second end of the air outlet duct is connected to the external space of the dehumidifier.

[0021] With this configuration, the air outlet duct guides the dehumidified and heated gas to the air outlet of the dehumidifier, allowing the dehumidified and heated gas to be discharged to the outside of the dehumidifier.

[0022] According to a dehumidifier provided by the present invention, the semiconductor mechanism further includes: A power supply, adapted to be electrically connected to the semiconductor chip; A switching circuit is disposed between the semiconductor chip and the power supply. Each semiconductor chip is provided with one switching circuit, and the switching circuit is adapted to switch the current direction within the semiconductor chip.

[0023] With this configuration, by switching the direction of the current within the semiconductor chip, the positions of the cooling and heating surfaces of the semiconductor chip can be switched. The air duct that is a cold air duct in dehumidification mode can be switched to a hot air duct, and the air duct that is a hot air duct in dehumidification mode can be switched to a cold air duct, thus achieving the switching from dehumidification mode to defrosting mode.

[0024] A dehumidifier according to the present invention further includes: The outer casing, the semiconductor mechanism, the windshield mechanism, the connecting air duct and the power mechanism are all disposed inside the outer casing. The outer casing is provided with an air inlet and an air outlet. The air inlet is located on the first side of the semiconductor mechanism and the air outlet is located on the fourth side of the semiconductor mechanism.

[0025] This design allows the outer casing to support and protect the semiconductor mechanism, windshield mechanism, connecting air ducts, and power mechanism, thereby improving the structural stability and reliability of the dehumidifier and extending its service life.

[0026] The dehumidifier provided by this invention includes a semiconductor mechanism, a windshield mechanism, a connecting air duct, and a power mechanism. The semiconductor mechanism comprises multiple semiconductor wafers stacked on top of each other, with a gap between any two adjacent wafers. The gap between adjacent wafers serves as an air duct for gas flow. Any two adjacent air ducts are designated as a first air duct and a second air duct, forming multiple spaced-apart first and second air ducts among the semiconductor wafers. When the semiconductor mechanism is energized, the energizing directions of any two adjacent semiconductor wafers are opposite, so that the facing surfaces of adjacent wafers simultaneously function as either cooling or heating surfaces, forming either a cold air duct or a hot air duct. That is, one of the first and second air ducts is a hot air duct, and the other is a cold air duct, forming multiple spaced-apart hot and cold air ducts among the semiconductor wafers. The windshield mechanism connects only the first and second side spaces of the semiconductor mechanism to the first air duct, and only the third and fourth side spaces of the semiconductor mechanism to the second air duct. The connecting air duct connects the second and third side spaces of the semiconductor mechanism. The power mechanism provides power for the gas flow, allowing gas from the first side of the semiconductor device to enter the first air duct, then through the connecting air duct into the second air duct, and finally discharged to the fourth side of the semiconductor device. During dehumidification, the first air duct is a cold air duct, and the second air duct is a hot air duct. Gas is condensed in the first air duct, forming condensate, which separates from the gas, reducing its humidity. Gas absorbs heat in the second air duct, increasing its temperature and preventing the dehumidified gas from becoming too cold. This design allows the gas to directly exchange heat with the semiconductor wafers in both the first and second air ducts, avoiding the need for finned structures. The compact structure minimizes the space occupied by finned structures and allows for increased contact area between the gas and semiconductor wafers by increasing the number of semiconductor wafers, thereby improving dehumidification efficiency. This solves the structural dispersion problem present in related technologies when improving dehumidification efficiency.

[0027] In addition, the dehumidifier provided by the present invention heats the gas by using the heating surface of the semiconductor chip during the dehumidification process, making full use of the heat generated by the semiconductor mechanism, avoiding energy waste, and eliminating the need for an additional heating device, thus avoiding the space occupation of the heating device and further improving the compactness of the dehumidifier. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0029] Figure 1This is a structural schematic diagram of the dehumidifier provided by the present invention from one perspective.

[0030] Figure 2 This is a structural schematic diagram of the dehumidifier provided by the present invention from another perspective.

[0031] Figure 3 This is a schematic diagram of the internal structure of the dehumidifier provided by the present invention (the outer casing is not shown).

[0032] Figure 4 This is a schematic diagram showing the relative positions of the centrifugal impeller, water collection box, and semiconductor mechanism provided by the present invention (the connecting air duct is not shown).

[0033] Figure 5 This is a schematic diagram of the semiconductor mechanism provided by the present invention.

[0034] Figure 6 This is a schematic diagram of the distribution of the semiconductor wafer provided by the present invention (the air duct between two adjacent thick solid lines is the first air duct, and the air duct between two adjacent thin solid lines is the second air duct).

[0035] Figure 7 yes Figure 6 A magnified view of point X in the middle.

[0036] Figure 8 This is a schematic diagram of the windshield mechanism provided by the present invention.

[0037] Figure 9 yes Figure 8 A magnified view of point Y in the middle.

[0038] Figure 10 This is a schematic diagram of the connecting air duct provided by the present invention.

[0039] Figure 11 This is a schematic diagram of the gas flow path in the dehumidifier provided by the present invention.

[0040] Figure label: 1. Semiconductor structure; 2. Semiconductor wafer; 3. First air duct; 4. Second air duct; 5. Connecting air duct; 6. First baffle; 7. First through hole; 8. Second baffle; 9. Second through hole; 10. Water collection tank; 11. Drain hole; 12. Water collection box; 13. Centrifugal impeller; 14. Air guide structure; 15. Air outlet channel; 16. Outer shell; 17. Positioning rib; 18. Air inlet; 19. Air outlet; 20. Windshield mechanism. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0042] The following is combined Figures 1 to 11 The dehumidifier of the present invention is described.

[0043] like Figures 1 to 11 As shown, the dehumidifier provided in this embodiment of the invention includes a semiconductor mechanism 1, a windshield mechanism 20, a connecting air duct 5, and a power mechanism.

[0044] Specifically, the semiconductor structure 1 includes multiple semiconductor wafers 2, which are stacked together. Specifically, the multiple semiconductor wafers 2 can be arranged parallel to each other.

[0045] There is a gap between any two adjacent semiconductor wafers 2, and the gap between two adjacent semiconductor wafers 2 serves as an air duct for gas flow. Any two adjacent air ducts are designated as the first air duct 3 and the second air duct 4, and multiple first air ducts 3 and second air ducts 4 are formed between multiple semiconductor wafers 2 at intervals.

[0046] When the semiconductor mechanism 1 is energized, the energizing directions of any two adjacent semiconductor wafers 2 are opposite, so that the facing sides of the two adjacent semiconductor wafers 2 simultaneously serve as either cooling or heating surfaces. The heating surfaces of the two adjacent semiconductor wafers 2 face each other, making the airflow between them a hot airflow channel. The cooling surfaces of the two adjacent semiconductor wafers 2 face each other, making the airflow between them a cold airflow channel. In other words, one of the first airflow channel 3 and the second airflow channel 4 is a hot airflow channel, and the other is a cold airflow channel, forming multiple spaced hot and cold airflow channels between the multiple semiconductor wafers 2.

[0047] The windbreak mechanism 20 is used to ensure that the first air duct 3 connects only the first and second side spaces of the semiconductor mechanism 1, and that the second air duct 4 connects only the third and fourth side spaces of the semiconductor mechanism 1. The connecting air duct 5 is used to connect the second and third side spaces of the semiconductor mechanism 1. The power mechanism is used to provide power for the flow of gas, so that the gas on the first side of the semiconductor mechanism 1 enters the first air duct 3, then enters the second air duct 4 through the connecting air duct 5, and is then discharged to the fourth side of the semiconductor mechanism 1.

[0048] During dehumidification, the first air duct 3 is a cold air duct, and the second air duct 4 is a hot air duct. The gas is condensed in the first air duct 3, forming condensate, which separates from the gas, reducing its humidity. After entering the second air duct 4, the gas absorbs heat and its temperature rises. The warmed gas is then discharged to the outside of the dehumidifier, preventing the dehumidified gas from becoming too cold and ensuring that the discharged gas is approximately at room temperature.

[0049] With this configuration, the gas directly exchanges heat with the semiconductor plate 2 in both the first air duct 3 and the second air duct 4, avoiding the need for finned structures. This results in a compact structure that avoids the space occupied by finned structures. It also allows for increasing the contact area between the gas and the semiconductor plate 2 by increasing the number of semiconductor plates 2, thereby improving dehumidification efficiency. This solves the problem of structural dispersion that exists in related technologies when improving the dehumidification efficiency of dehumidifiers.

[0050] In addition, the dehumidifier provided in this embodiment of the invention heats the gas using the heating surface of the semiconductor chip 2 during the dehumidification process, making full use of the heat generated by the semiconductor mechanism 1, avoiding energy waste, and eliminating the need for additional heating devices, thus avoiding the space occupation of heating devices and further improving the compactness of the dehumidifier.

[0051] In this embodiment of the invention, the first side space and the second side space of the semiconductor mechanism 1 are distributed on both sides of the semiconductor mechanism 1 along a first straight line, and the third side space and the fourth side space of the semiconductor mechanism 1 are distributed on both sides of the semiconductor mechanism 1 along a second straight line. The first straight line and the second straight line are perpendicular to each other, and both the first straight line and the second straight line are parallel to the semiconductor wafer 2.

[0052] In other words, both the first air duct 3 and the second air duct 4 extend in a straight line, and the gas flows in a straight line within both the first air duct 3 and the second air duct 4. This can reduce the resistance to gas flow, which is beneficial to improving dehumidification efficiency, reducing energy consumption, and reducing noise.

[0053] It should be noted that in this embodiment, the first air duct 3 and the second air duct 4 are both parallel to the semiconductor sheet 2. The shape of the semiconductor sheet 2 is not specifically limited. The semiconductor sheet 2 can be, but is not limited to, square, rectangular, circular, etc.

[0054] Reference Figure 5 In this embodiment, the semiconductor sheet 2 is square, and the first and second straight lines are parallel to two adjacent sides of the square, respectively. Multiple semiconductor sheets 2 are spaced apart along their own thickness direction, and the semiconductor structure 1 is cubic in shape.

[0055] In this embodiment of the invention, the windshield mechanism 20 includes a first baffle 6 and a second baffle 8. The first baffle 6 connects the first air duct 3 only to the first side space and the second side space of the semiconductor mechanism 1, allowing gas from the first side space of the semiconductor mechanism 1 to enter only the first air duct 3, while preventing gas from the first side space and the second side space of the semiconductor mechanism 1 from entering the second air duct 4. The second baffle 8 connects the second air duct 4 only to the third side space and the fourth side space of the semiconductor mechanism 1, allowing gas from the third side space of the semiconductor mechanism 1 to enter only the second air duct 4, while preventing gas from the third side space and the fourth side space of the semiconductor mechanism 1 from entering the first air duct 3.

[0056] Specifically, a pair of first baffles 6 are provided, with each pair of first baffles 6 respectively located on the first side and the second side of the semiconductor mechanism 1. Each first baffle 6 has a first through hole 7, and each first air duct 3 has a corresponding first through hole 7. The first baffle 6 has no perforations at the positions corresponding to the second air duct 4, thus preventing gas from the first and second sides of the semiconductor mechanism 1 from entering the second air duct 4.

[0057] Similarly, a pair of second baffles 8 are provided, with each pair of second baffles 8 respectively located on the third and fourth sides of the semiconductor mechanism 1. Each second baffle 8 has a second through hole 9, and each second air duct 4 has a corresponding second through hole 9. The second baffle 8 has no perforations at the positions corresponding to the first air duct 3, thus preventing gas from the third and fourth sides of the semiconductor mechanism 1 from entering the first air duct 3.

[0058] In a specific embodiment, the first air duct 3 and the second air duct 4 are flat slits. The cross-sectional shape of the first air duct 3 and the cross-sectional shape of the second air duct 4 are both long rectangles, where the length of the long rectangle is much greater than its width. The cross-section of the first air duct 3 is a section perpendicular to the first straight line, and the cross-section of the second air duct 4 is a section perpendicular to the second straight line.

[0059] The first through hole 7 is configured as a strip-shaped hole, and the length direction of the first through hole 7 is consistent with the length direction of the long rectangle corresponding to the first air duct 3. The first through hole 7 extends from one end of the long rectangle to the other end.

[0060] The second through hole 9 is also configured as a strip hole. The length direction of the second through hole 9 is consistent with the length direction of the long rectangle corresponding to the second air duct 4. The second through hole 9 extends from one end of the long rectangle to the other end.

[0061] Multiple semiconductor wafers 2 are located between a pair of first baffles 6 and between a pair of second baffles 8. Positioning structures are provided on the side of the first baffles 6 facing the semiconductor mechanism 1 and on the side of the second baffles 8 facing the semiconductor mechanism 1. The positioning structures are used to position each semiconductor wafer 2 to ensure the stability of each semiconductor wafer 2.

[0062] Specifically, the positioning structure can be positioning ribs 17 disposed on the first baffle 6 and the second baffle 8. Multiple positioning ribs 17 are provided, which are parallel to each other and spaced apart along the thickness direction of the semiconductor sheet 2. A receiving groove is formed between two adjacent positioning ribs 17, and the edge of the semiconductor sheet 2 can be embedded in the receiving groove. The positioning of the semiconductor sheet 2 is achieved through the interaction between the semiconductor sheet 2 and the positioning ribs 17.

[0063] In this embodiment of the invention, the first through hole 7 on the first baffle 6 located on the second side of the semiconductor mechanism 1 is used to discharge the condensate in the first air duct 3 to the connecting air duct 5.

[0064] Specifically, the semiconductor wafers 2 of the semiconductor mechanism 1 can be arranged vertically, parallel to the vertical direction, and distributed horizontally. A first straight line is parallel to the semiconductor wafers 2 and arranged horizontally. A pair of first baffles 6 are arranged vertically and distributed along the first straight line on both sides of the semiconductor mechanism 1. A second straight line is arranged vertically, and a pair of second baffles 8 are arranged horizontally and distributed along the second direction on both sides of the semiconductor mechanism 1. The second baffle 8 located below the semiconductor mechanism 1 can serve as the bottom wall of the first air duct 3. Condensate formed in the first air duct 3 collects on the bottom wall of the first air duct 3 and is discharged through the first through hole 7 on the first baffle 6.

[0065] A water collection tank 10 is provided at the bottom of the connecting air duct 5. Condensate enters the connecting air duct 5 through the first through hole 7 and collects in the water collection tank 10. The condensate formed in the first air duct 3 can be discharged in time, reducing the amount of frost in the first air duct 3 and preventing the condensate from affecting other parts of the dehumidifier's internal structure.

[0066] In a further embodiment, a drain hole 11 is provided at the bottom of the water collection tank 10. In this case, the dehumidifier also includes a water collection box 12, which is detachably disposed below the drain hole 11. The upper end of the water collection box 12 is open, and the open end of the water collection box 12 is opposite to the drain hole 11. Condensate in the water collection tank 10 can enter the water collection box 12 through the drain hole 11. By disassembling and assembling the water collection box 12, the condensate in the water collection box 12 can be cleaned as needed, which is convenient for maintenance.

[0067] The dehumidifier also includes a housing 16, inside which the semiconductor mechanism 1, the windshield mechanism 20, the connecting air duct 5, and the power mechanism are all housed. The housing 16 provides support and protection for the semiconductor mechanism 1, the windshield mechanism 20, the connecting air duct 5, and the power mechanism, thereby improving the structural stability and reliability of the dehumidifier and extending its service life.

[0068] The housing 16 is provided with an air inlet 18 and an air outlet 19. The air inlet 18 is located on the first side of the semiconductor mechanism 1, and the air outlet 19 is located on the fourth side of the semiconductor mechanism 1.

[0069] The water collection box 12 is also located inside the outer casing 16, allowing the water collection box 12 to slide and connect with the outer casing 16. The water collection box 12 is designed as a drawer, making it convenient to disassemble and assemble the water collection box 12.

[0070] It should be noted that, in order to ensure the normal operation of the dehumidifier, it is necessary to ensure the airtightness between the water collection box 12 and the outer casing 16, so as to prevent the gas in the connecting air duct 5 from leaking through the gap between the water collection box 12 and the outer casing 16.

[0071] A handle is provided on the water collection box 12 for easy application of force and convenient operation.

[0072] In this embodiment of the invention, the connecting air duct 5 includes a first connecting air duct and a second connecting air duct.

[0073] The first connecting air duct is disposed on the second side of the semiconductor mechanism 1, and the side of the first connecting air duct facing the semiconductor mechanism 1 is connected to the first air duct 3. The second connecting air duct is disposed on the third side of the semiconductor mechanism 1, and the side of the second connecting air duct facing the semiconductor mechanism 1 is connected to the second air duct 4. The end of the second connecting air duct that is close to the first connecting air duct is connected.

[0074] The first connecting air duct and the second connecting air duct are connected to form an integral structure. Specifically, the first connecting air duct and the second connecting air duct can be processed separately and then fixedly connected together. Alternatively, the first connecting air duct and the second connecting air duct can be integrally formed.

[0075] For the power mechanism, in some embodiments, the fan can be directly installed in the first connecting air duct, so that the air inlet 18 of the fan faces the first baffle 6.

[0076] In other embodiments, the power mechanism includes a centrifugal impeller 13 and a drive unit. The centrifugal impeller 13 is rotatably disposed inside the first connecting air duct and is disposed adjacent to the end of the first air duct 3. The air inlet 18 of the centrifugal impeller 13 faces the first baffle 6.

[0077] A flow guiding structure 14 is provided in the first connecting air duct, which is used to guide the gas discharged from the centrifugal impeller 13 to the second connecting air duct.

[0078] The drive unit is located outside the connecting duct 5 and is used to drive the centrifugal impeller 13 to rotate.

[0079] With this configuration, the first connecting duct with the airflow guiding structure 14 serves as the volute of the centrifugal impeller 13, integrating the centrifugal impeller 13 with the connecting duct 5, further improving the structural compactness of the dehumidifier. Setting the power structure to a centrifugal fan configuration increases gas flow rate, reduces noise levels, and enhances stability and adaptability.

[0080] The dehumidifier provided in this embodiment can control the air volume and dehumidification efficiency by controlling the rotational speed of the centrifugal impeller 13 during operation. Specifically, the drive component can be a DC motor, which can be set to three speeds: high, medium, and low. For example, the high speed is 1680 rpm, the medium speed is 1400 rpm, and the low speed is 610 rpm. The lower the DC motor speed, the lower the noise of the dehumidifier during operation. When the DC motor is running at low speed, it can be considered that the dehumidifier is operating in a silent dehumidification mode.

[0081] In this embodiment, the semiconductor structure 1 includes 30 semiconductor wafers 2, each of which is square, with a side length of 150 mm and a thickness of 4 mm. The spacing between two adjacent semiconductor wafers 2 is 1.25 mm. Twenty-nine air ducts are formed inside the semiconductor structure 1, of which 15 are first air ducts 3 and 14 are second air ducts 4. During dehumidification, the 15 first air ducts 3 serve as cold air ducts, and the 14 second air ducts 4 serve as hot air ducts.

[0082] Statistical analysis of experimental data shows that when the DC motor is running at high speed, the power of the DC motor is approximately 120 watts, the total power of semiconductor mechanism 1 is approximately 2700 watts, and the total power of the dehumidifier is greater than 3000 watts. At this time, the circulating air volume of the dehumidifier is approximately 210 cubic meters per hour, and the dehumidification speed is fast.

[0083] In this embodiment of the invention, the dehumidifier further includes an air outlet duct 15, which is disposed on the fourth side of the semiconductor mechanism 1. The first end of the air outlet duct 15 is connected to the end of the second air duct 4 away from the connecting air duct 5, and the second end of the air outlet duct 15 is connected to the external space of the dehumidifier. The gas that has been condensed, dehydrated, and heated can be discharged to the outside of the dehumidifier through the air outlet duct 15.

[0084] In this embodiment of the invention, the semiconductor mechanism 1 further includes a power supply and a switching circuit. The power supply is electrically connected to the semiconductor chip 2 and is used to supply power to the semiconductor chip 2.

[0085] A switching circuit is set between the semiconductor chip 2 and the power supply. Each semiconductor chip 2 is equipped with a corresponding switching circuit, which is used to switch the direction of current in the semiconductor chip 2.

[0086] By switching the direction of the current within the semiconductor chip 2, the positions of the cooling and heating surfaces of the semiconductor chip 2 can be switched. For example, in each semiconductor chip 2 of the semiconductor mechanism 1, if a forward current is applied to the semiconductor chip 2 located at odd-numbered positions and a reverse current is applied to the semiconductor chip 2 located at even-numbered positions, a cold air channel is formed between the (2N-1)th and 2Nth semiconductor chips 2, and a hot air channel is formed between the 2Nth and 2N+1th semiconductor chips 2. If the current direction of each semiconductor chip 2 in the semiconductor mechanism 1 is switched so that a reverse current is applied to the semiconductor chip 2 located at odd-numbered positions and a forward current is applied to the semiconductor chip 2 located at even-numbered positions, a hot air channel is formed between the (2N-1)th and 2Nth semiconductor chips 2, and a cold air channel is formed between the 2Nth and 2N+1th semiconductor chips 2. Here, N is a positive integer greater than or equal to 1.

[0087] In other words, before the current direction of each semiconductor chip 2 in the semiconductor mechanism 1 is switched as a whole, the first air duct 3 is a cold air duct and the second air duct 4 is a hot air duct; after the current direction of each semiconductor chip 2 in the semiconductor mechanism 1 is switched as a whole, the first air duct 3 is switched to a hot air duct and the second air duct 4 is switched to a cold air duct.

[0088] When the dehumidifier is running in dehumidification mode, the first air duct 3 is a cold air duct and the second air duct 4 is a hot air duct. As the dehumidifier runs, when the temperature in the first air duct 3 drops to the frosting temperature, the water vapor in the air will directly condense into ice crystals, which will gradually reduce the cross-sectional area of ​​the first air duct 3.

[0089] At this time, the current direction of each semiconductor chip 2 in the semiconductor mechanism 1 can be switched by switching the circuit, so that the first air duct 3 is switched to a hot air duct and the second air duct 4 is switched to a cold air duct, thereby heating the ice crystals in the first air duct 3 to achieve the purpose of defrosting.

[0090] Specifically, a temperature sensor can be installed in the first air duct 3, and both the temperature sensor and the switching circuit can be electrically connected to the control device so that when the temperature in the first air duct 3 is too low, it can automatically switch to the defrosting mode to defrost the first air duct 3 in a timely manner, and when the temperature in the first air duct 3 is higher than the freezing point of water, it can automatically switch to the dehumidification mode.

[0091] In summary, the dehumidifier provided in this embodiment of the invention has the advantages of high dehumidification efficiency and compact structure. Furthermore, by switching the direction of the current flowing through the semiconductor chip 2, the dehumidifier can switch between dehumidification mode and defrosting mode, making operation convenient. The dehumidifier provided in this embodiment does not have a compressor or fan, resulting in low noise and avoiding the use of a refrigerant, thus ensuring safe operation. While utilizing the cooling capacity of the semiconductor mechanism 1, it also fully utilizes the heat generated by the semiconductor mechanism 1, avoiding energy waste.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A dehumidifier, characterized in that, include: The semiconductor structure (1) includes multiple stacked semiconductor wafers (2), with a gap between any two adjacent semiconductor wafers (2) to form an air duct, and any two adjacent air ducts are respectively a first air duct (3) and a second air duct (4), and the current conduction directions of any two adjacent semiconductor wafers (2) are opposite. The windshield mechanism (20) is adapted to connect the first air duct (3) only to the first side space and the second side space of the semiconductor mechanism (1), and to connect the second air duct (4) only to the third side space and the fourth side space of the semiconductor mechanism (1); The connecting air duct (5) is adapted to connect the second side space of the semiconductor mechanism (1) with the third side space; A power mechanism, suitable for providing power for the flow of gas.

2. The dehumidifier according to claim 1, characterized in that, The windshield mechanism (20) includes: A pair of first baffles (6), two of the pair of first baffles (6) are respectively disposed on the first side and the second side of the semiconductor mechanism (1), and a first through hole (7) is provided on the first baffle (6), and each first air duct (3) is correspondingly provided with the first through hole (7). A pair of second baffles (8) are respectively disposed on the third and fourth sides of the semiconductor mechanism (1). The second baffles (8) are provided with second through holes (9), and each second air duct (4) is provided with a corresponding second through hole (9).

3. The dehumidifier according to claim 2, characterized in that, The first through hole (7) on the first baffle (6) located on the second side of the semiconductor mechanism (1) is adapted to allow condensate in the first air duct (3) to be discharged to the connecting air duct (5), and a water collection tank (10) is provided at the bottom of the connecting air duct (5).

4. The dehumidifier according to claim 3, characterized in that, The bottom of the water collection tank (10) is provided with a drain hole (11), and the dehumidifier also includes: A water collection box (12) is detachably disposed below the drain hole (11). The upper end of the water collection box (12) is open, and the open end of the water collection box (12) is opposite to the drain hole (11).

5. The dehumidifier according to claim 1, characterized in that, The connecting duct (5) includes: A first connecting air duct is disposed on the second side of the semiconductor mechanism (1), and the side of the first connecting air duct facing the semiconductor mechanism (1) is connected to the first air duct (3); The second connecting air duct is disposed on the third side of the semiconductor mechanism (1). The side of the second connecting air duct facing the semiconductor mechanism (1) is connected to the second air duct (4). The second connecting air duct is connected to the end of the first connecting air duct that is close to it.

6. The dehumidifier according to claim 5, characterized in that, The power mechanism includes: A centrifugal impeller (13) is rotatably disposed inside the first connecting air duct, and the centrifugal impeller (13) is disposed adjacent to the end of the first air duct (3). A flow guiding structure (14) is provided inside the first connecting air duct, and the flow guiding structure (14) is adapted to guide the gas discharged by the centrifugal impeller (13) to the second connecting air duct. A drive unit is disposed outside the connecting duct (5) and is adapted to drive the centrifugal impeller (13) to rotate.

7. The dehumidifier according to any one of claims 1-6, characterized in that, The first side space and the second side space of the semiconductor mechanism (1) are distributed on both sides of the semiconductor mechanism (1) along a first straight line, and the third side space and the fourth side space of the semiconductor mechanism (1) are distributed on both sides of the semiconductor mechanism (1) along a second straight line. The first straight line and the second straight line are perpendicular to each other, and both the first straight line and the second straight line are parallel to the semiconductor wafer (2).

8. The dehumidifier according to any one of claims 1-6, characterized in that, Also includes: An air outlet channel (15) is disposed on the fourth side of the semiconductor mechanism (1). The first end of the air outlet channel (15) is connected to the end of the second air duct (4) away from the connecting air duct (5). The second end of the air outlet channel (15) is connected to the external space of the dehumidifier.

9. The dehumidifier according to any one of claims 1-6, characterized in that, The semiconductor mechanism (1) further includes: A power supply, adapted to be electrically connected to the semiconductor chip (2); A switching circuit is disposed between the semiconductor chip (2) and the power supply. Each semiconductor chip (2) is provided with one switching circuit. The switching circuit is adapted to switch the current direction in the semiconductor chip (2).

10. The dehumidifier according to any one of claims 1-6, characterized in that, Also includes: The outer casing (16), the semiconductor mechanism (1), the windshield mechanism (20), the connecting air duct (5) and the power mechanism are all located inside the outer casing (16). The outer casing (16) is provided with an air inlet (18) and an air outlet (19). The air inlet (18) is located on the first side of the semiconductor mechanism (1), and the air outlet (19) is located on the fourth side of the semiconductor mechanism (1).

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