Display panel, broken line repairing method thereof and display device

Abstract

This application provides a display panel and a method and device for repairing broken lines therewith. The display panel includes a substrate, a wiring layer, and a connecting portion. The wiring layer is located on at least one surface of the substrate and includes multiple wiring structures, at least one of which includes at least a first segment and a second segment. The connecting portion overlaps with the first segment and the second segment. In the display panel provided by the first aspect embodiment of this application, the connecting portion is capable of repairing the broken first segment and the second segment in the wiring structure of the wiring layer located on any surface of the substrate. The broken first segment and the second segment are electrically and mechanically connected through the overlapping connecting portion.

Description

Technical Field

[0001] This application relates to the field of display device technology, specifically to a display panel and a method for repairing broken lines therewith, and a display device. Background Technology

[0002] With the continuous development of display technology, consumers' pursuit of higher screen ratios and larger screen sizes continues, giving rise to borderless splicing technology.

[0003] Double-sided wiring technology is one of the mainstream wiring technologies in bezel-less splicing technology. It leads the wiring of the front bezel to the back bezel through the side bezel wiring, realizing electrical connection with the back drive circuit board while further reducing the bezel size and increasing the screen ratio.

[0004] However, existing double-sided wiring technology is not yet mature, and due to environmental or equipment factors, circuit breaks occur frequently. Summary of the Invention

[0005] This application provides a display panel and a method and device for repairing broken lines, which can repair open circuit problems in frameless splicing display panels.

[0006] In a first aspect, according to an embodiment of this application, a display panel is provided, including a substrate, a wiring layer, and a connection portion; the wiring layer is located on at least one surface of the substrate, the wiring layer includes multiple wiring structures, at least one wiring structure includes at least a first segment and a second segment; the connection portion overlaps with the first segment and the second segment.

[0007] The display panel provided in the first aspect of this application has a connecting portion that can repair a first segment and a second segment that are broken in the wiring structure of the wiring layer located on any surface of the substrate. The broken first segment and the second segment are electrically and mechanically connected through the overlapping connecting portion.

[0008] According to any embodiment provided in the first aspect of this application, at least one of the first segment and the second segment includes at least a first conductive portion and a second conductive portion sequentially stacked along the direction away from the substrate.

[0009] According to any embodiment provided in the first aspect of this application, the surface of at least one of the first conductive portion, the second conductive portion, and the portion of the substrate located between the first segment and the second segment is a patterned surface.

[0010] According to any embodiment provided in the first aspect of this application, the surface of a portion of the second conductive portion facing away from the substrate is a patterned surface, and at least one end of the connecting portion is fitted into the second conductive portion.

[0011] According to any embodiment provided in the first aspect of this application, the surface of a portion of the first conductive part facing away from the substrate is a patterned surface, and the connecting part is in contact with the surface of the first conductive part facing away from the substrate.

[0012] According to any embodiment provided in the first aspect of this application, the surface of a portion of the substrate located between the first segment and the second segment is a patterned surface, and the connecting portion is in contact with the surface of the substrate located between the first segment and the second segment.

[0013] According to any embodiment provided in the first aspect of this application, the substrate includes a first surface, a second surface, and a side surface connecting the first surface and the second surface. The first surface and the second surface are disposed opposite each other in a direction perpendicular to the plane of the display panel. The first surface is the light-emitting side facing the display panel. The connecting portion is located at at least one of the first surface, the second surface, and the side surface.

[0014] According to any embodiment provided in the first aspect of this application, the substrate further includes a transition portion, the first surface and / or the second surface are connected to the side surface through the transition portion, and the connecting portion is also located in the transition portion.

[0015] According to any embodiment provided in the first aspect of this application, the transition portion further includes a first transition portion, the first surface and the side surface are connected through the first transition portion, the first segment includes a first trace segment located on the first surface, the second segment includes a second trace segment located on the second surface and a side trace segment located on the side surface; the connecting portion is located in the first transition portion, at least one end of the connecting portion is fitted with the second conductive portion of the side trace segment or the first trace segment, and the connecting portion is in contact with the surface of the side trace segment and the first conductive portion of the first trace segment on the side away from the substrate.

[0016] According to any embodiment provided in the first aspect of this application, the first transition portion includes a first transition surface, and the wiring structure further includes a third segment located on the first transition surface; the connecting portion overlaps with the first segment and the third segment, and overlaps with the second segment and the third segment, at least one end of the connecting portion is fitted with the second conductive portion of at least one of the side wiring segment, the first wiring segment and the third segment, and the connecting portion contacts the surface of the first conductive portion of the side wiring segment, the first wiring segment and the third segment on the side away from the substrate.

[0017] According to any embodiment provided in the first aspect of this application, the wiring structure further includes a plurality of fourth segments, and the portion of the substrate located between any two adjacent first segments, second segments, and a plurality of fourth segments is a patterned surface; the connecting portion overlaps with the first segment and the fourth segment, and overlaps with the second segment and the fourth segment, and the connecting portion also overlaps with two adjacent fourth segments, and the first segment, the second segment, and a plurality of fourth segments each include a first conductive portion and a second conductive portion; at least one end of the connecting portion is fitted with at least one of the second conductive portions of the first segment, the second segment, and any fourth segment, and the connecting portion contacts the surface of the first conductive portion of the first segment, the second segment, and any fourth segment on the side away from the substrate.

[0018] According to any embodiment provided in the first aspect of this application, the length of the second conductive portion of at least one of the first segment and the second segment is smaller than the length of the first conductive portion, at least one end of the first conductive portion extends beyond the second conductive portion, and the connecting portion contacts the surface of the first conductive portion on the side away from the substrate.

[0019] According to any embodiment provided in the first aspect of this application, the surface of a portion of the first conductive portion facing away from the substrate is a patterned surface, and at least one end of the connecting portion is fitted into the first conductive portion.

[0020] According to any embodiment provided in the first aspect of this application, the surface of a portion of the second conductive portion facing away from the substrate is a patterned surface, and at least one end of the connecting portion is simultaneously fitted with the first conductive portion and the second conductive portion.

[0021] According to any embodiment provided in the first aspect of this application, the surface of the portion of the substrate located between the first segment and the second segment is a patterned surface. The substrate includes a first surface, a second surface, and a side surface connecting the first surface and the second surface. The first surface and the second surface are disposed opposite to each other along the thickness direction of the substrate itself. The first surface is the light-emitting side facing the display panel. The first surface, the second surface, and the side surface also include a contact area and a non-contact area. The contact area is located between the first segment and the second segment, and the non-contact area is disposed around the contact area. The surface roughness of the contact area is greater than the surface roughness of the non-contact area.

[0022] According to any embodiment provided in the first aspect of this application, the surfaces of a portion of the first conductive portion and a portion of the second conductive portion of the first segment and the second segment are patterned surfaces. The first surface, the second surface, and the side surface also include a transition region. The transition region is located between the contact region and the non-contact region. The transition region is disposed around the contact region, and the non-contact region is disposed around the transition region. The surface roughness of the portion of the first segment and the second segment whose orthogonal projection on the substrate is located in the transition region is greater than the surface roughness of the portion of the first segment and the second segment whose orthogonal projection on the substrate is located in the non-contact region.

[0023] According to any embodiment provided in the first aspect of this application, at least one of the end face of the first segment near the second segment and the end face of the second segment near the first segment has an inclination angle with the substrate surface of no more than 90°.

[0024] According to any embodiment provided in the first aspect of this application, the connecting portion includes a third conductive portion and a protective portion. The third conductive portion overlaps with the first segment and the second segment, and the protective portion covers the surface of the third conductive portion away from the substrate.

[0025] According to any embodiment provided in the first aspect of this application, the protective part includes multiple protective sub-layers, and the material of the protective sub-layers includes at least one of insulating ink, conductive ink, hydrophobic adhesive layer, and conductive adhesive layer.

[0026] According to any embodiment provided in the first aspect of this application, the material of the third conductive part includes at least one of tungsten paste and silver paste.

[0027] Secondly, according to the embodiments of this application, a method for repairing broken lines in a display panel is provided. The display panel includes a substrate and a wiring layer. The wiring layer includes multiple wiring structures, and at least one wiring structure generates at least one point to be repaired. The points to be repaired are preprocessed to obtain the first segment and the second segment; The repair material is applied between the first segment and the second segment, and the repair material comes into contact with the first segment and the second segment to form a connection.

[0028] According to any embodiment provided in the second aspect of this application, at least one of the first segment and the second segment includes at least a first conductive portion and a second conductive portion stacked along the direction away from the substrate. The step of preprocessing the point to be repaired to obtain the first segment and the second segment further includes: The surface of at least one of the first conductive portion, the second conductive portion, and the portion of the substrate located between the first segment and the second segment is roughened.

[0029] According to any embodiment provided in the second aspect of this application, before the step of roughening the surface of at least one of the first conductive portion, the second conductive portion, and the portion of the substrate located between the first segment and the second segment, the method further includes: Remove a portion of the second conductive part from at least one of the first segment and the second segment. The second conductive part includes a body portion and a cutout portion, and a portion of the surface of the first conductive part facing away from the substrate is exposed by the cutout portion.

[0030] Thirdly, according to embodiments of this application, a display panel is provided, including the display device provided in any embodiment of the second aspect of this application. Attached Figure Description

[0031] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0032] Figure 1 This is a cross-sectional structural diagram of a display panel provided in the first aspect embodiment of this application; Figure 1a yes Figure 1 Enlarged structural diagram of region A in the middle; Figure 1b yes Figure 1 A magnified structural diagram of region B in the middle; Figure 1c yes Figure 1 A magnified structural diagram of region C in the middle; Figure 2 This is a schematic diagram of the overall structure of another display panel provided in the first aspect embodiment of this application; Figure 3 yes Figure 2 A schematic diagram of a cross-sectional structure along the AA direction; Figure 4a yes Figure 2 A schematic diagram of a cross-sectional structure along the BB direction; Figure 4b yes Figure 2 A schematic diagram of another cross-sectional structure along the BB direction; Figure 5 This is a cross-sectional structural schematic diagram of another display panel provided in the first aspect embodiment of this application; Figure 6 This is a cross-sectional structural schematic diagram of another display panel provided in the first aspect embodiment of this application; Figure 7 This is a cross-sectional structural schematic diagram of another display panel provided in the first aspect embodiment of this application; Figure 8 yes Figure 2 A schematic diagram of the planar structure of the first, second, and side surfaces; Figure 9 This is a cross-sectional structural schematic diagram of another display panel provided in the first aspect embodiment of this application; Figures 10a to 10d This is a cross-sectional structural schematic diagram of another display panel provided in the first aspect embodiment of this application; Figure 11 This is a flowchart illustrating the steps of a method for repairing broken lines in a display panel, as provided in a second aspect embodiment of this application. Figures 12 to 13 This is a schematic diagram of the process flow of another method for repairing broken lines in a display panel provided in the second aspect of this application; Figure 14 This is a schematic diagram of the overall structure of a display device provided in the third aspect of this application.

[0033] in: 10-Substrate; 11-First surface; 12-Second surface; 13-Side surface; 14-Transition portion; 141-First transition portion; 141a-First transition surface; 142-Second transition portion; 142a-Second transition surface; 10a - Contact area; 10b - Transition area; 10c - Non-contact area; 20 - Trace layer; 21 - First segment; 22 - Second segment; 23 - Third segment; 24 - Fourth segment; 201 - First conductive part; 202 - Second conductive part; 30 - Connecting part; 31 - Third conductive part; 32 - Protective part; 100 - Display device.

[0034] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0035] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0036] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the display panel and display module of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0037] Figure 1 A cross-sectional structure of a display panel provided in the first aspect embodiment of this application is shown.

[0038] Please see Figure 1 In a first aspect, embodiments of this application provide a display panel, including a substrate 10, a wiring layer 20, and a connection portion 30.

[0039] The wiring layer 20 is located on at least one surface of the substrate 10. The wiring layer 20 includes multiple wiring structures, and at least one wiring structure includes at least a first segment 21 and a second segment 22.

[0040] The connecting part 30 overlaps with the first segment 21 and the second segment 22.

[0041] The wiring layer 20 is disposed on the surface of the substrate 10 and is used to transmit electrical signals between multiple surfaces of the substrate 10.

[0042] The routing environment of the wiring layers 20 on some surfaces of the substrate 10 is relatively harsh, making them susceptible to physical impacts or corrosion from the external environment, which can lead to wire breakage. At the same time, the wiring layers 20 in the transition corner areas between two adjacent substrates 10 have a greater risk of wire breakage than the central area of ​​the substrate 10 surface. The wiring layer 20 also includes multiple parallel wiring structures. The wiring structure can be a single wiring or a group of multiple parallel wirings that transmit the same electrical signal.

[0043] For example, in the splicing process, when adjacent display panels are assembled, a splicing structure is formed between adjacent substrates 10, and the wiring structure in the wiring layer 20 needs to extend outward across the edge of the substrate. In the transition corner area between the two substrates, due to the structural discontinuity at the seam of the adjacent substrates, coupled with the mechanical stress concentration effect brought about by the splicing operation itself, the wiring structure in this area bears greater bending stress and shear force than the central area of ​​the substrate 10 surface, increasing the risk of wire breakage.

[0044] For example, during installation, the display panel inevitably bears external loads from clamping, fixing, and assembly operations during transportation and installation. The transition corner area between the surfaces of the two substrates 10 of adjacent display panels becomes a highly concentrated area of ​​installation stress due to the abrupt change in geometry. External mechanical impact, clamping pressure, or accidental contact by installation tools can cause physical breakage of the wiring structure in the wiring layer 20 in this area, resulting in a broken wire. In addition, dynamic interference such as vibration in the installation environment further exacerbates the above-mentioned risk of broken wires.

[0045] Therefore, the wiring layer 20 is disconnected and pre-processed into at least two disconnected segments, the first segment 21 and the second segment 22. The connection part 30 is physically connected to the first segment 21 and the second segment 22 so that the connection part 30 can transmit electrical signals between the first segment 21 and the second segment 22 at the electrical signal transmission level.

[0046] For example, in the repair process, the connecting part 30 is formed by coating the first segment 21 and the second segment 22 with repair connecting material, and the connection is formed after the repair connecting material is shaped.

[0047] The method for repairing broken lines on the display panel will be further described in other embodiments of this application.

[0048] For example, the length of overlap between the connecting portion 30 and the first segment 21 is consistent with the length of overlap between the connecting portion 30 and the second segment 22.

[0049] For example, the overlapping area of ​​the orthographic projection of the connecting portion 30 on the substrate 10 and the orthographic projection of the first segment 21 on the substrate 10 is consistent with the overlapping area of ​​the orthographic projection of the connecting portion 30 on the substrate 10 and the orthographic projection of the second segment 22 on the substrate 10.

[0050] When the overlap length or overlapping area of ​​the connecting part 30 with the first segment 21 and the second segment 22 is consistent, the overlap resistance of the first segment 21 with the connecting part 30 and the overlap resistance of the second segment 22 with the connecting part 30 can be kept consistent. This ensures that the resistance value on the transmission path of the electrical signal is consistent and predictable, and guarantees that the electrical signal can still be transmitted smoothly between the first segment 21 and the second segment 22 after being repaired with the connecting part 30, avoiding drastic changes in resistance value on the propagation path of the electrical signal.

[0051] Meanwhile, when the overlap length or overlapping area of ​​the connecting part 30 is consistent with that of the first segment 21 and the second segment 22, the mechanical bonding strength of the connecting part 30 with the first segment 21 and the second segment 22 is also consistent, so that the connecting part 30 is subjected to uniform force between the first segment 21 and the second segment 22, and the stability of the overlap of the connecting part 30 can be further improved.

[0052] For example, the overlap length between the connecting part 30 and the first segment 21 and the overlap length between the connecting part 30 and the second segment 22 is 60 to 120 micrometers, which can achieve a balance between process difficulty, stability and smooth transmission of electrical signals.

[0053] For example, some of the connecting portions 30 also overlap with the surface of the substrate 10, and the surface of the substrate 10 also provides a mechanical support section at an intermediate position for the connecting portions 30, which further makes the connecting portions 30 subjected to uniform force between the first segment 21 and the second segment 22, and the overlap stability of the connecting portions 30 can be further improved.

[0054] For example, a portion of the connecting part 30 is in direct contact with the surface of the substrate 10. The surface of the substrate 10 provides a stable physical support foundation for the connecting part in the intermediate transition section where the connecting part 30 bridges the first segment 21 and the second segment 22. This avoids the risk of deformation and detachment caused by the connecting part 30 being suspended between the first segment 21 and the second segment 22 due to its own weight or external forces. At the same time, the support of the substrate 10 surface for the intermediate section of the connecting part 30 makes the bonding distribution between the connecting part 30 and the substrate 10 or the wiring structure 20 more uniform along the entire overlap area. This reduces the possibility of local stress concentration in the connecting part 30, thereby making the overall stress on the connecting part 30 between the first segment 21 and the second segment 22 more balanced. The stability of the overlap and the mechanical reliability are further improved, thus ensuring that the connecting part 30 can continuously maintain the integrity and stability of the electrical signal transmission path in the long-term use environment.

[0055] For example, the connecting part 30 is made of conductive materials such as tungsten or silver paste.

[0056] Tungsten has high hardness, high melting point and excellent chemical stability. The connector 30 made of tungsten can maintain structural integrity in the harsh physical and chemical environment of the wiring layer 20. It overlaps with the treated first segment 21 and second segment 22 and can effectively resist external physical collisions and environmental erosion, thereby giving the repaired wiring structure higher reliability and service life.

[0057] Materials such as silver paste have excellent electrical conductivity and good surface adhesion, and can be precisely applied to the broken area by coating. After overlapping with the treated first segment 21 and second segment 22, they form a continuous conductive path that matches the electrical characteristics of the trace structure well during the shaping process. This effectively controls the additional contact resistance introduced by the connection part 30 and ensures that the electrical signal can be transmitted smoothly in the repaired trace structure.

[0058] Furthermore, the excellent process adaptability of the aforementioned materials enables precise control over the amount and position of the connection part 30 during the repair process, which helps to achieve precise matching between the connection part 30 and the overlapping area between the treated first segment 21 and second segment 22, further improving the consistency of the repair process and the predictability of the repair quality.

[0059] The display panel provided in the first aspect embodiment of this application has a connecting part 30 that can repair the first segment 21 and the second segment 22 that are broken in the wiring structure of the wiring layer 20 located on any surface of the substrate 10. The broken first segment 21 and the second segment 22 are electrically and mechanically connected through the overlapping connecting part 30.

[0060] Please continue reading. Figure 1In some embodiments, at least one of the first segment 21 and the second segment 22 includes at least a first conductive portion 201 and a second conductive portion 202 sequentially stacked along the direction away from the substrate 10.

[0061] In these embodiments, the first conductive part 201 performs the function of transmitting current, and the second conductive part 202 is used to protect the first conductive part 201 on the side away from the substrate 10.

[0062] For example, the wiring film structure of the first segment 21 and the second segment 22 includes at least a first conductive part 201 for transmitting current and a second conductive part 202 located on the side of the first conductive part 201 away from the substrate 10, and the second conductive part 202 is used to protect the first conductive part 201.

[0063] Optionally, the first segment 21 and the second segment 22 also include an insulating protective layer located on the second conductive part 202 away from the substrate 10. When the two display panels are spliced, the insulating protective layers of the two display panels preferentially abut against each other to effectively protect the wiring structure and avoid damage caused by direct contact between the wiring structures of the two display panels. The insulating protective layer can also prevent the wiring structures of the two display panels from directly contacting each other and causing a short circuit, thereby achieving insulation of the wiring structures of the two display panels.

[0064] Optionally, the first segment 21 and the second segment 22 may also include other functional film layers located between the first conductive part 201 and the substrate 10. The functional film layers are mainly used to further protect the first conductive part 201 between the substrate 10 and the first conductive part 201, while preventing the first conductive part 201 from peeling off from the substrate 10 due to insufficient bonding force.

[0065] Figure 1 The wiring structure shown only shows the first conductive part 201 and the second conductive part 202. The insulating protective layer and other functional film layers can be flexibly adjusted according to actual needs.

[0066] For example, the resistance of the first conductive part 201 is less than the resistance of the second conductive part 202. The first conductive part 201 is mainly responsible for current transmission, while the second conductive part 202 is mainly responsible for protecting the first conductive part 201. The two form a clear hierarchical division of labor in terms of film layer function.

[0067] The first conductive part 201 has a low resistance value as its core characteristic. As the main path for electrical signal transmission in the wiring structure, most of the current is conducted through the first conductive part 201. The low resistance value effectively reduces the overall power consumption and heat effect of the wiring structure in the process of electrical signal transmission, ensuring that the loss of electrical signal on the transmission path is within an acceptable range. The second conductive part 202 is located on the outside of the first conductive part 201 away from the substrate 10. Its resistance value is higher than that of the first conductive part 201, which means that the material selected for the second conductive part 202 is relatively weak in terms of conductivity. However, the material of the second conductive part 202 usually has better hardness, density and corrosion resistance and oxidation resistance, giving the second conductive part 202 an effective physical protection function for the inner first conductive part 201. Under the physical collision and chemical corrosion conditions of the external environment, it preferentially withstands damage, thereby protecting the integrity of the electrical signal transmission function in the first conductive part 201.

[0068] For example, in the resistance relationship among the first conductive part 201, the second conductive part 202 and the connecting part 30, the first conductive part 201 has the lowest resistance and is mainly responsible for carrying the current transmission in the wiring structure; the second conductive part 202 has a higher resistance than the first conductive part 201 and is mainly for protection, with a relatively limited contribution to current transmission; the resistance of the connecting part 30 is not greater than the resistance of the second conductive part 202, that is, the conductivity of the connecting part 30 is at least equal to or better than that of the second conductive part 202.

[0069] When the connecting part 30 crosses the broken wire area and connects with the first segment 21 and the second segment 22, the current is conducted through the connecting part 30 in the repair section.

[0070] In related technologies, if the resistance of the connecting part 30 exceeds the resistance of the second conductive part 202, the repair section will introduce a high-resistance node in the signal transmission path, causing the electrical signal to generate an excessive local voltage drop when passing through the repair section, thereby causing signal attenuation or even distortion.

[0071] When the resistance of the connecting part 30 is controlled to be no more than the resistance of the second conductive part 202, the resistance of the repaired section is comparable to that of the original film layer in the wiring structure. The resistance distribution of the entire wiring structure remains relatively uniform after repair, which effectively ensures the smooth transmission of electrical signals when passing through the repaired section of the connecting part 30, and reliably restores the display function of the repaired display panel.

[0072] For example, the first conductive part 201 is made of copper metal, which is more suitable for current transmission and has a lower resistance, while the second conductive part 202 is made of titanium metal, which is thinner and denser.

[0073] The first conductive part 201 is made of copper, and the second conductive part 202 is made of titanium. The material selection of the two is consistent with their functional positioning.

[0074] Copper, with its extremely low resistivity and excellent electrical conductivity, is one of the most conductive metals in the field of thin-film wiring. The first conductive part 201, made of copper, can achieve efficient current transmission under low resistance conditions, reducing the overall impedance of the wiring structure and ensuring low loss characteristics of electrical signals in the transmission path. Meanwhile, titanium, with its high hardness, high density, and excellent oxidation and corrosion resistance, is more effective than copper in resisting external physical wear and the erosion of harsh chemical environments. The second conductive part 202, made of titanium, covers the side of the copper first conductive part 201 facing away from the substrate 10, forming a dense physical barrier for the copper layer. This prevents the copper layer from oxidizing or being mechanically damaged due to direct exposure to the external environment, extending the overall service life of the wiring structure. In addition, the presence of the titanium layer also helps to ensure that when the wiring structures of adjacent display panels make physical contact in the transition corner area during display panel splicing, the titanium layer is used to make contact first, reducing the probability of short circuit risk caused by direct contact between the copper first conductive parts 201, and further improving the reliability and safety of the wiring structure.

[0075] Figure 1a It shows Figure 1 The magnified structure of region A in the middle, Figure 1b It shows Figure 1 The magnified structure of region B in the middle, Figure 1c It shows Figure 1 The enlarged structure of region C in the middle.

[0076] Please continue reading. Figures 1a to 1c In some embodiments, the surface of at least one of the first conductive portion 201, the second conductive portion 202, and the portion of the substrate 10 located between the first segment 21 and the second segment 22 is a patterned surface.

[0077] In related technologies, at the end of the first segment 21 near the second segment 22, or at the end of the second segment 22 near the first segment 21, some of the second conductive parts 202 deform or oxidize due to physical peeling caused by wire breakage or moisture erosion. As a result, in the repair scheme of directly arranging the connecting part 30, the connecting part 30 cannot make close contact with the first segment 21 and the second segment 22, and is easy to fall off, while the electrical conductivity is poor. Under the subsequent continuous screen-on operation, the connecting part 30 is prone to peeling, poor contact and overheating with the first segment 21 and the second segment 22, which in turn causes failure again at the positions of the first segment 21 and the second segment 22.

[0078] In these embodiments, the surfaces of a portion of the first conductive portion 201, a portion of the second conductive portion 202, and a portion of the substrate 10 located between the first segment 21 and the second segment 22 are patterned. This increases the contact area between the wiring structure and the surface where the substrate 10 overlaps with the connecting portion 30, thereby improving the bonding force between the connecting portion 30 and the first segment 21, the second segment 22, and the substrate 10. The stability of the mechanical and electrical connections of the connecting portion 30 can be further improved, thus solving the problem of re-failure of the first segment 21 and the second segment 22 due to the inability to make close contact, which has occurred in the related art.

[0079] The patterned surface should be understood as the contact area between the connection portion 30 and the wiring structure and the substrate 10 on the surface being greater than the contact area between the connection portion 30 and the normal surface of the wiring structure and the substrate 10. Optionally, the patterned surface can be prepared by various methods such as opening contact holes, physical additive or subtractive sputtering roughening, and chemical etching roughening.

[0080] The specific process and preparation method for forming the patterned surface will be further described in other aspects of this application.

[0081] First, the surface of the substrate 10 between the first conductive part 201, the second conductive part 202, and the first segment 21 and the second segment 22 is set as a patterned surface, which allows the connecting part 30 to be better embedded in the uneven parts of the first conductive part 201, the second conductive part 202 and the substrate 10, thereby reducing the contact resistance between the connecting part 30 and at least the first conductive part 201 and the second conductive part 202, thereby reducing the impedance of the overall repair circuit and improving the stability of the electrical connection.

[0082] Meanwhile, the surfaces of the first conductive part 201, the second conductive part 202, and the substrate 10 between the first segment 21 and the second segment 22 are patterned surfaces, which can provide the connecting part 30 with more mechanical engagement with the first conductive part 201, the second conductive part 202 and the substrate 10. The mechanical load can be more evenly distributed on the contact points between the connecting part 30 and the first conductive part 201, the second conductive part 202 and the substrate 10, making it less likely for the connecting part 30 to fall off due to external force, thus improving the firmness of the mechanical connection.

[0083] The first conductive part 201, the second conductive part 202, and the surface of the substrate 10 located between the first segment 21 and the second segment 22 are set as patterned surfaces. This can further improve the mechanical bonding strength between the connecting part 30 and the first segment 21, the second segment 22, and the substrate 10, while ensuring stable and reliable electrical connection between the connecting part 30 and the first segment 21 and the second segment 22, thus avoiding poor contact and overheating problems.

[0084] For example, when the first conductive part 201 is made of copper, the second conductive part 202 is made of titanium, and the substrate 10 is made of organic material, when the same chemical solution is used to etch the first conductive part 201, the second conductive part 202 and the substrate 10, the etching selectivity of the same chemical solution for the first conductive part 201, the second conductive part 202 and the substrate 10 is different because the materials of the first conductive part 201, the second conductive part 202 and the substrate 10 are different.

[0085] Typically, the etching rate of chemical solutions on the metallic materials of the first conductive part 201 and the second conductive part 202 is greater than that on the organic materials of the substrate 10. Therefore, on the final patterned surface, the roughness of the first conductive part 201 and the second conductive part 202 is greater than that of the substrate 10. That is, under the premise of the same overlapping area, the contact area between the connecting part 30 and the first conductive part 201 and the second conductive part 202 is greater than the contact area with the substrate 10. This enables the connecting part 30 to preferentially and closely contact the first conductive part 201 and the second conductive part 202 in the first segment 21 and the second segment 22. The contact between the connecting part 30 and the substrate 10 plays a role in helping to improve the firmness of the mechanical connection and the electrical connection.

[0086] Furthermore, the etching rate of the chemical solution typically decreases gradually for the first conductive part 201, the second conductive part 202, and the substrate 10. Therefore, on the final patterned surface, the roughness of the first conductive part 201, the second conductive part 202, and the substrate 10 gradually decreases. That is, the contact area between the connecting part 30 and the first conductive part 201, the second conductive part 202, and the substrate 10, under the premise of the same overlap area, gradually decreases. This further ensures that the connecting part 30 preferentially contacts the first conductive part 201 tightly to guarantee basic mechanical and electrical connections, while the second conductive part 202 plays a role in assisting to improve the firmness of mechanical and electrical connections.

[0087] For example, the roughness of the patterned surface can be characterized by the maximum height of the surface protrusions or the maximum depth of the recesses. On the patterned surface, the maximum height of the protrusions or the maximum depth of the recesses reflects the degree of surface undulation in the direction perpendicular to the substrate: when the maximum height of the protrusions or the maximum depth of the recesses is greater, the material of the connector can extend downward along the side of the protrusions or extend inward along the inner wall of the recesses to fill them when in contact with the patterned surface, forming a three-dimensional contact interface with a vertical component. This makes the actual effective contact area between the connector and the wiring structure and the substrate greater than the overlapping area of ​​their orthogonal projections in the plane of the substrate. Correspondingly, the greater the maximum height of the protrusions or the maximum depth of the recesses, the more significant the area gain of the three-dimensional contact interface, the smaller the contact resistance between the connector and the wiring structure, and the stronger the mechanical interlocking force between the connector and the wiring structure and the substrate. This further improves the electrical connection stability and mechanical connection firmness between the connector and the first and second segments, effectively avoiding the risk of poor contact and detachment caused by insufficient contact interface.

[0088] Alternatively, the roughness of the patterned surface can also be characterized by the maximum width of the surface protrusions or recesses. The maximum width of the protrusions or recesses reflects the degree of lateral expansion of the surface micromorphology in the direction parallel to the substrate: the larger the maximum width of the protrusions or recesses, the wider the lateral space occupied by each individual protrusion or recess unit. The connecting material can spread more fully in the lateral direction and cover the outer surface of each protrusion, or fill the bottom surface and sidewalls of each recess inward, thus forming a larger contact interface at the level of a single micromorphological unit. A larger protrusion or recess width also means that the mechanical interlocking structure between the connecting part and the wiring structure and the substrate has a wider bearing base in the lateral direction. When the connecting part 30 is subjected to external shear force or peeling force, the wide protrusion or recess structure can provide stronger lateral mechanical resistance, preventing the connecting part 30 from slipping or lifting in the lateral direction, thereby further improving the overall stability and reliability of the overlapping structure between the connecting part 30 and the first segment 21 and the second segment 22.

[0089] Optionally, the roughness of the patterned surface can also be characterized by the number of protrusions or depressions per unit area, i.e., the distribution density. A higher distribution density of protrusions or depressions per unit area means that within the same overlapping area, the patterned surface can provide a greater total number of effective contact points or contact units. This allows the material of the connector 30 to simultaneously form electrical contacts with the wiring structure at multiple discrete micro-contact points, and mechanical engagement with the wiring structure and substrate 10 at multiple discrete micro-contact points. The cumulative effective contact area increases with increasing density. Simultaneously, the high density of protrusions or depressions allows the mechanical load between the connector 30 and the wiring structure and substrate 10 to be distributed to more contact points, avoiding stress concentration at a few contact locations. This makes the connector 30 more evenly stressed within the overlapping area, significantly enhancing its overall resistance to peeling and detachment. Thus, while increasing the contact area, the long-term reliability of the overlapping structure is also ensured.

[0090] Alternatively, the roughness of the patterned surface can also be characterized by the minimum distance between two adjacent protrusions or depressions on the surface. The smaller the minimum spacing between adjacent protrusions or depressions, the more compact the arrangement of micro-topography units on the patterned surface, the denser the distribution of micro-contact structures per unit area, and the narrower the gap space that the material of the connector 30 needs to fill when covering the patterned surface. There are almost no large flat transition sections between protrusions or depressions, allowing the connector to maintain a tight fit with the undulating surface, achieving continuous and efficient accumulation of contact area. Furthermore, the smaller the minimum spacing, the more significant the capillary guiding effect of the gaps between adjacent protrusions or depressions on the connector material. This helps the connector material spontaneously penetrate the micro-gap during the coating and shaping process, forming a more complete micro-fit between the connector 30 and the wiring structure and substrate 10. This further reduces the contact resistance with the wiring structure, improves the mechanical holding ability and electrical connection stability of the connector 30 to the first segment 21 and the second segment 22, and eliminates the risk of electrical signal transmission failure caused by insufficient contact interface. Please refer to [link to relevant documentation]. Figure 1a In some embodiments, the surface of a portion of the second conductive portion 202 facing away from the substrate 10 is a patterned surface, and at least one end of the connecting portion 30 is fitted into the second conductive portion 202.

[0091] In these embodiments, the second conductive part 202 has a contact hole, and the connecting part 30 extends into the second conductive part 202 to achieve a fitting arrangement with the second conductive part 202, thereby increasing the contact area between the connecting part 30 and the second conductive part 202 and improving the firmness of the mechanical connection and electrical connection.

[0092] The fitting arrangement should be understood as follows: the second conductive part 202 has a contact hole with a through hole or blind hole shape, and the repair connecting material fills the contact hole when it overlaps with the second conductive part 202. After shaping, the shape of the fitting arrangement between the connecting part 30 and the second conductive part 202 is formed.

[0093] For example, the connecting part 30 is fitted with the second conductive part 202 of the first segment 21 or the second segment 22 at one end, which can improve the mechanical and electrical connection between the connecting part 30 and the second conductive part 202 of the first segment 21 or the second segment 22.

[0094] Optionally, the connecting part 30 is fitted with the second conductive part 202 of the first segment 21 or the second segment 22 at both ends. The mechanical and electrical connection forces between the connecting part 30 and the second conductive part 202 of the first segment 21 or the second segment 22 are kept consistent, further ensuring that the connecting part 30 is subjected to uniform force, thereby further improving the firmness of the mechanical and electrical connection.

[0095] Meanwhile, the connecting part 30 can be electrically connected at both ends through the second conductive part 202, thereby improving the redundancy of the repair structure of the connecting part 30.

[0096] Optionally, the second conductive part 202 is provided with a blind hole as a contact hole. The blind hole extends inward to a certain depth from the side surface of the second conductive part 202 away from the substrate 10, but does not penetrate the second conductive part 202 to the first conductive part 201.

[0097] During the coating process, the repair connection material fills the inside of the blind hole. After shaping, the connection part 30 forms a three-dimensional interlocking structure between its end and the second conductive part 202. The connection part 30 not only covers the surface of the second conductive part 202, but also forms a contact interface with the side wall and bottom wall of the blind hole by embedding and filling. This effectively expands the actual contact area between the connection part 30 and the second conductive part 202. When the connection part 30 is subjected to peeling or shearing external force, the mechanical locking effect formed by the inner wall of the blind hole can provide additional resistance to pull-out. The mechanical bonding strength and contact reliability between the connection part 30 and the second conductive part 202 are improved. At the same time, since the blind hole does not penetrate to the first conductive part 201, the second conductive part 202 still maintains complete physical coverage and chemical protection for the first conductive part 201 outside the opening area. This ensures that the core function of the first conductive part 201 in carrying out current transmission is not affected. While improving the interlocking firmness of the connection part 30, the integrity of the original film layer of the wiring structure is also taken into account.

[0098] Optionally, the second conductive part 202 has a through hole as a contact hole. The through hole completely penetrates the second conductive part 202 to the side surface of the first conductive part 201 away from the substrate 10. After the repair connecting material is filled into the through hole and shaped, the connecting part 30 is embedded in the side wall of the through hole, and its extended end further forms direct contact with the surface of the first conductive part located at the bottom of the through hole.

[0099] Compared to blind vias, through-holes allow the connecting portion 30 to establish a direct conductive path with the first conductive portion 201, in addition to forming an interlocking electrical connection with the second conductive portion 202. Since the first conductive portion 201 has a lower resistance, the connecting portion 30 directly contacts the first conductive portion 201 through the through-hole, further reducing the contact resistance between the connecting portion 30 and the wiring structure in the repair section. This allows for more efficient transmission of electrical signals between the first segment 21 and the second segment 22 via the connecting portion 30, resulting in a better overall impedance along the repair path. Simultaneously, the through-hole provides an interlocking contact surface between the sidewalls of the double-layer film, penetrating both the second conductive portion 202 and the first conductive portion 201. Within the through-hole, the connecting portion 30 simultaneously forms a three-dimensional mechanical lock with both the sidewall of the second conductive portion 202 and the surface of the first conductive portion 201. Compared to a single blind via structure, this further enhances the redundancy of the mechanical connection and the reliability of the electrical connection, giving the repaired wiring structure greater stability and resistance to failure under long-term operating conditions.

[0100] Optionally, a through hole and a blind hole are simultaneously provided on the second conductive part 202 of the first segment 21 or the second segment 22, wherein the through hole is located at the end of the first segment 21 or the second segment 22 closer to the broken wire position relative to the blind hole, and the blind hole is located at the end of the segment away from the broken wire position.

[0101] In the area near the broken end, the wiring structure is at risk of physical peeling or oxidative deterioration at the end of the second conductive part 202 due to the breakage. A through-hole is made in this area, penetrating the second conductive part 202, allowing the connecting part 30 to bypass the poorly maintained end of the second conductive part 202 during repair and directly form an electrical connection with the more stable first conductive part 201. This ensures efficient conduction of electrical signals in the repair structure, preferentially through the through-hole to the contact interface with the first conductive part 201, guaranteeing the reliability of the electrical connection at the broken end. In the relatively stable area far from the broken end, the protective function of the second conductive part 202 is more intact. By creating blind holes, on the one hand, the connection part 30 can be provided with a stable mechanical engagement anchor point without compromising the complete protection of the first conductive part 201 by the second conductive part 202. On the other hand, the interlocking structure formed by the blind holes further disperses the mechanical load borne by the connection part 30 in the outer area of ​​the wiring structure, making the force on the connection part 30 more uniform along its bridging direction. The coordinated arrangement of through holes and blind holes ensures that the repair interface between the connection part 30 and the wiring structure is fully guaranteed in terms of both electrical connection reliability and mechanical connection redundancy, effectively reducing the risk of contact failure of the repair structure during subsequent continuous use.

[0102] For example, the contact holes for filling the connecting portion 30 on the second conductive portion 202 are evenly distributed in the planar layout of the second conductive portion 202, so as to achieve uniform filling of the connecting portion 30, further ensuring that the connecting portion 30 is subjected to uniform force, thereby further improving the firmness of mechanical connection and electrical connection.

[0103] Optionally, the contact holes for filling the connecting portion 30 on the second conductive portion 202 can also be designed to avoid the adjacent trace structure. That is, the arrangement density of the contact holes on the side of the second conductive portion 202 closer to the adjacent trace structure is smaller, so that the connecting portion 30 is concentrated and distributed on the side of the second conductive portion 202 away from the adjacent trace structure, thereby avoiding short circuits caused by the connecting portion 30 contacting each other between two adjacent trace structures, which could lead to failure.

[0104] Optionally, the aperture of the contact hole on the second conductive part 202 has a gradient distribution that gradually decreases along the direction from away from the adjacent trace structure to close to the adjacent trace structure.

[0105] The size of the contact hole diameter directly determines the amount of repair connection material filling a single hole at that location. The larger the diameter, the more connection material can be accommodated in a single contact hole, resulting in a larger mating contact area between the connection part 30 and the second conductive part 202, and a greater contribution to electrical and mechanical connections. Conversely, the smaller the diameter, the less material is filled per hole. This aperture gradient distribution causes the material of the connection part 30 to preferentially accumulate towards the side with the larger aperture during filling. That is, the main distribution of the material of the connection part 30 is concentrated in the area of ​​the second conductive part 202 away from the adjacent wiring structure. The amount of connection part 30 material accommodated in the small-diameter contact holes closer to the adjacent wiring structure is effectively constrained, effectively reducing the risk of the material of the connection part 30 overflowing laterally in the direction close to the adjacent wiring structure and becoming conductive with the adjacent wiring structure. Thus, while ensuring sufficient mechanical mating strength and electrical connection reliability between the connection part 30 and the second conductive part 202, the probability of short-circuit failure due to the spread of the material of the connection part 30 between adjacent wiring structures is minimized, achieving a balance between the electrical safety and connection firmness of the repair structure.

[0106] Optionally, the minimum spacing between adjacent contact holes on the second conductive part 202 is distributed in a gradient that gradually decreases from away from the adjacent trace structure to close to the adjacent trace structure. That is, the contact holes on the side close to the adjacent trace structure are arranged more closely, while the contact hole spacing on the side away from the adjacent trace structure is relatively loose.

[0107] The smaller the spacing between adjacent contact holes, the narrower the solid partition walls between the holes. After the material of the connecting part 30 fills the adjacent contact holes, the material of the connecting part 30 between each hole tends to be connected and form a dense and continuous interlocking filling layer. The continuous dense filling area formed by the dense array of holes on the side close to the adjacent wiring structure restricts the lateral free flow of the material of the connecting part 30 on that side in the form of a sealing barrier. This confines the overall distribution boundary of the material of the connecting part 30 to a safe range far away from the adjacent wiring structure, effectively preventing the material of the connecting part 30 from spreading to the adjacent wiring structure due to uncontrolled flow, thereby avoiding short circuit problems caused by the overlap of the material of the connecting part 30 between adjacent wiring structures. At the same time, the dense array structure on the side close to the adjacent wiring structure provides dense micro-mechanical anchoring nodes for the connecting part 30 through multi-point small-pitch interlocking, ensuring the mechanical holding capacity of the connecting part 30 in that area. The overall stress uniformity of the connecting part 30 is further improved, and the long-term stability and reliability of the repair structure are further enhanced.

[0108] Specific embodiments relating to the planar layout of the contact holes will be further described in other aspects of this application.

[0109] Please see Figure 1a and Figure 1bIn some embodiments, the surface of a portion of the first conductive portion 201 facing away from the substrate 10 is a patterned surface, and the connecting portion 30 is in contact with the surface of the first conductive portion 201 facing away from the substrate 10.

[0110] In these embodiments, a portion of the surface of the first conductive portion 201 facing away from the substrate 10 is re-exposed, and the connecting portion 30 contacts the newly exposed surface of the first conductive portion 201 facing away from the substrate 10. In addition to being able to contact the flat surface of the first conductive portion 201 and improve the bonding force of the mechanical and electrical connections, the surface of a portion of the first conductive portion 201 is a patterned surface, which can further increase the contact area between the connecting portion 30 and the first conductive portion 201 and improve the firmness of the mechanical and electrical connections.

[0111] For example, please refer to Figure 1a While the connecting portion 30 is fitted into the second conductive portion 202, the connecting portion 30 further contacts a portion of the surface of the first conductive portion 201 facing away from the substrate 10; please refer to Figure 1b Part of the second conductive part 202 is directly removed, and the connecting part 30 directly overlaps with the exposed part of the first conductive part 201.

[0112] exist Figure 1a In the embodiments described, the second conductive part 202 has fewer structures that are oxidized or peeled off by external force due to wire breakage. Therefore, the second conductive part 202 only needs to be pre-treated to form contact holes. Furthermore, the connecting part 30 can be fitted with the second conductive part 202 to further enhance the mechanical and electrical connection between the connecting part 30 and the wiring structure.

[0113] For example, the contact hole is a through hole. The connecting part 30 and the second conductive part 202 are fitted together so that the connecting part 30 can fill the contact hole between the second conductive parts 202, and further realize that the connecting part 30 contacts the newly exposed flat surface of the first conductive part 201 on the side away from the substrate 10.

[0114] Optionally, the contact hole is a blind hole, and the connecting part 30 and the second conductive part 202 are fitted together to further enhance the mechanical and electrical connection between the connecting part 30 and the wiring structure.

[0115] Optionally, the second conductive portion 202 of the first segment 21 or the second segment 22 is provided with both through holes and blind holes. The through holes are located at the end of the first segment 21 near the second segment 22 or at the end of the second segment 22 near the first segment 21, and are in contact with the surface of the first conductive portion 201 on the side away from the substrate 10 near the break point, thereby further reducing the contact resistance between the connection portion 30 and the first segment 21 or the second segment 22 and improving the reliability of the electrical connection.

[0116] exist Figure 1b In the embodiments described, the second conductive part 202 has many structures that are oxidized or peeled off by external force due to wire breakage. Therefore, the part of the second conductive part 202 near the end is specifically pre-treated to remove it completely, and the connecting part 30 directly contacts the newly exposed first conductive part 201, thereby achieving a larger contact area between the connecting part 30 and the first conductive part 201, reducing the contact resistance and further improving the electrical connection between the connecting part 30 and the wiring structure.

[0117] Meanwhile, the surface of the first conductive part 201 facing away from the substrate 10 is a patterned surface, and the connecting part 30 can obtain more contact area with the first conductive part 201 under the same overlapping area, thereby further increasing the contact area between the connecting part 30 and the first conductive part 201 and improving the firmness of the mechanical and electrical connection between the connecting part 30 and the wiring structure.

[0118] For example, the surface of the first conductive portion 201 facing away from the substrate 10 is a rough surface formed by chemical etching.

[0119] Optionally, the surface of the first conductive part 201 facing away from the substrate 10 is a surface with a contact hole, which further increases the contact area.

[0120] Please see Figure 1c In some embodiments, the surface of the portion of the substrate 10 located between the first segment 21 and the second segment 22 is a patterned surface, and the connecting portion 30 is in contact with the surface of the substrate 10 between the first segment 21 and the second segment 22.

[0121] In these embodiments, the surface of the portion of substrate 10 between the first segment 21 and the second segment 22 is also a patterned surface. The connecting portion 30 is in contact with the portion of substrate 10 between the first segment 21 and the second segment 22. The connecting portion 30 can also obtain more contact area with the substrate 10 under the same overlapping area, thereby further increasing the contact area between the connecting portion 30 and the substrate 10 and improving the firmness of the mechanical connection between the connecting portion 30 and the substrate 10.

[0122] For example, the contact length between the connecting portion 30 and the substrate 10 between the first segment 21 and the second segment 22 is the same as the contact length between the connecting portion 30 and the first segment 21, and the contact length between the connecting portion 30 and the second segment 22, so that the filling amount of the material of the connecting portion 30 is highly controllable.

[0123] For example, the contact length between the connecting portion 30 and the substrate 10 between the first segment 21 and the second segment 22 is 60 to 120 micrometers.

[0124] For example, the surface of the substrate 10 between the first segment 21 and the second segment 22 is a rough surface formed by chemical etching.

[0125] Figure 2 This illustrates the overall structure of another display panel provided in the first aspect embodiment of this application.

[0126] Please see Figure 2 In some embodiments, the substrate 10 includes a first surface 11, a second surface 12, and a side surface 13 connecting the first surface 11 and the second surface 12. The first surface 11 and the second surface 12 are disposed opposite each other in a direction perpendicular to the plane of the display panel. The first surface 11 is the light-emitting side facing the display panel. The connecting portion 30 is located at at least one of the first surface 11, the second surface 12, and the side surface 13.

[0127] In these embodiments, the connecting portion 30 can be used to repair situations where the broken ends of the first segment 21 and the second segment 22 are located on the first surface 11, the second surface 12, and the side surface 13.

[0128] For example, the first side 11 is the front side of the substrate 10, that is, the side where the light-emitting element is arranged; the second side 12 is the back side of the substrate 10, that is, the part where the driver chip is bonded and is installed in conjunction with other support structures in the display module.

[0129] For example, when the break point between the first segment 21 and the second segment 22 is located solely on the side 13, i.e., a break occurs in the side 13 trace in the display panel, the side 13 trace in this application embodiment is used to replace the flexible circuit board and connect to the front bezel trace and the back trace in the double-sided trace technology; the connecting part 30 in this case is as follows: Figure 1 As shown in the embodiment, the connection between the first segment 21 and the second segment 22 enables separate repair of the side 13 wiring of the display panel on the first surface 11.

[0130] For example, when the break point between the first segment 21 and the second segment 22 is located solely on the first surface 11, i.e., a break occurs in the front bezel trace of the display panel, the front bezel trace is used to lead out the signal input terminals within the display panel to connect with the rear trace; the connection part 30 in this case... Figure 1 As shown in the embodiment, the connection between the first segment 21 and the second segment 22 enables separate repair of the front bezel wiring of the display panel on the first surface 11.

[0131] For example, when the break point between the first segment 21 and the second segment 22 is located solely on the second surface 12, i.e., a break occurs in the back trace of the display panel, the back trace being used to connect to the display driver chip; in this case, the connection part 30 is as follows: Figure 1 As shown in the embodiment, the connection between the first segment 21 and the second segment 22 enables separate repair of the back wiring of the display panel on the first surface 11.

[0132] Optionally, the connecting portion 30 is located on both the first surface 11 and the side surface 13 of the substrate 10. That is, the connecting portion 30 spans the transition corner area between the first surface 11 and the side surface 13 in space and extends continuously to cover a local area of ​​the first surface 11 and a local area of ​​the side surface 13.

[0133] In actual use cases of display panels, the wiring structure is subjected to bending stress and external environmental corrosion in the transition corner area extending from the first surface 11 to the side surface 13. The broken wires are very likely to occur in this transition corner area, causing the electrical signal transmission between the wiring on the first surface 11 and the wiring on the side surface 13 to be interrupted.

[0134] When the broken wire location between the first segment 21 and the second segment 22 crosses the transition corner area between the first surface 11 and the side surface 13, or is located on the first surface 11 and the side surface 13 respectively, the connecting part 30 is simultaneously arranged on the first surface 11 and the side surface 13, so that the connecting part 30 can completely bridge the broken wire section across the transition corner. On the one hand, the double-sided overlap of the connecting part 30 on the first surface 11 and the side surface 13 expands the total contact area with the wiring structure, and the mechanical bonding force and electrical connection reliability between the connecting part 30 and the first segment 21 and the second segment 22 are better than when the connecting part 30 is only located on a single surface. On the other hand, the continuous coverage of the transition corner area by the connecting part 30 provides additional physical reinforcement to the wiring structure in this area. The structural strength of the connecting part 30 itself shares the bending stress borne by the wiring structure at the transition corner to a certain extent, reducing the risk of the wiring structure breaking again in this vulnerable area after repair, and effectively improving the long-term reliability and durability of the repair structure.

[0135] Optionally, the connecting portion 30 is located on both the second surface 12 and the side surface 13 of the substrate 10. That is, the connecting portion 30 spans the transition corner area between the second surface 12 and the side surface 13 in space and extends continuously to cover a local area of ​​the second surface 12 and a local area of ​​the side surface 13.

[0136] The second side 12 of the substrate 10 is provided with back traces connected to the display driver chip, and the side 13 is provided with side traces that replace the flexible circuit board to realize the interconnection of electrical signals between the front and back sides. The back traces and side traces are also subject to the risk of breakage caused by splicing stress concentration or mechanical impact under installation conditions in the transition corner area where the two intersect. At the same time, the second side 12 and the side 13 are both located on the non-light-emitting side of the display panel, and their arrangement environment is relatively complex. They are subjected to greater clamping force and assembly load during installation, and the probability of breakage of the trace structure in this area is further increased.

[0137] When the broken wire position between the first segment 21 and the second segment 22 crosses the transition corner area between the second surface 12 and the side surface 13, or is located on the second surface 12 and the side surface 13 respectively, the connecting part 30 is simultaneously arranged on the second surface 12 and the side surface 13, so that the connecting part 30 can completely cross and cover the broken wire section at the transition corner. The double-sided overlap of the connecting part 30 on the second surface 12 and the side surface 13 expands the actual contact area with the wiring structure, effectively improving the bonding strength between the connecting part 30 and the first segment 21 and the second segment 22 in terms of both mechanical and electrical connection. At the same time, the continuous coverage of the transition corner area between the second surface 12 and the side surface 13 by the connecting part 30 provides physical reinforcement protection for the back wiring and side wiring in this area across the corner, reducing the risk of failure due to mechanical load during continuous use after repair, which may cause the connecting part to fall off or the wiring structure to break again. This further ensures the stable transmission of the display drive signal between the back wiring and the side wiring.

[0138] Figure 3 It shows Figure 2 A cross-sectional structure along the AA direction.

[0139] Please see Figure 3 In some embodiments, the substrate 10 further includes a transition portion 14, through which the first surface 11 and / or the second surface 12 are connected to the side surface 13, and the connecting portion 30 is also located in the transition portion 14.

[0140] In these embodiments, the transition portion 14 is located between the first surface 11 and / or the second surface 12 and the side surface 13, and is used to realize the transition from the first surface 11 and / or the second surface 12 to the side surface 13. The connecting portion 30 is located in the transition portion 14, which can facilitate the repair of the break between the first surface 11 and / or the second surface 12 and the side surface 13. At the same time, the transition portion 14 also facilitates the attachment of the connecting portion 30, making it less likely to peel off, thereby improving the firmness of the electrical and mechanical connections.

[0141] In the related technology, the wiring structure located on the first surface 11, that is, the line width of the front bezel wiring in the display panel, is greater than the line width of the array lines in the display panel; while the wiring structure located on the side 13, that is, the line width of the side 13 wiring in the display panel, is greater than the line width of the wiring structure located on the first surface 11, so as to ensure the safety redundancy and reliability of the side 13 when multiple display panels are spliced ​​together in the future; and the wiring structure located on the second surface 12, that is, the line width of the back wiring in the display panel, is further greater than the line width of the wiring structure located on the side 13 because the wiring structure located on the second surface 12 is not limited to the bezel area, and the wiring space is further widened.

[0142] Meanwhile, the wiring structure on the first surface 11, the wiring structure on the side surface 13, and the wiring structure on the second surface 12 are typically fabricated using three different processes. The wiring structures on the first surface 11 and the second surface 12 can usually be fabricated simultaneously using the process flow of the array lines in the display panel. However, the wiring structure on the side surface 13 is fabricated after the wiring structures on the first surface 11 and the second surface 12 are fabricated. The edge of the substrate 10 is polished to form a transition portion 14, and then the shape is defined using a photolithography mask. Subsequently, it is fabricated using physical vapor deposition (PVD) or magnetron sputtering, which means it is fabricated using an additional process.

[0143] In related technologies, the wiring structure located on the first surface 11, the wiring structure located on the second surface 12, and the wiring structure located on the side surface 13 can also be fabricated using the same process. That is, after the shape is defined by a photolithography mask, the wiring structures located on the first surface 11, the second surface 12, and the side surface 13 are simultaneously fabricated using PVD or magnetron sputtering.

[0144] For example, the width of one end of the connecting portion 30 located in the transition portion 14 is consistent with the line width of the overlapping wiring structure located on the first surface 11, the second surface 12, or the side surface 13, so as to maximize the orthographic overlap area between the connecting portion 30 and the overlapping wiring structure located on the first surface 11, the second surface 12, or the side surface 13.

[0145] Optionally, the width of one end of the connecting portion 30 that overlaps with the wiring structure on the first surface 11, the width of one end of the connecting portion 30 that overlaps with the wiring structure on the side surface 13, and the width of one end of the connecting portion 30 that overlaps with the wiring structure on the second surface 12 increase sequentially, that is, the connecting portion 30 presents an outline shape that gradually widens from the first surface 11 to the side surface 13 or from the side surface 13 to the second surface 12 along its extension direction.

[0146] The aforementioned increasing width relationship corresponds to the sequentially increasing linewidth distribution of the wiring structures on the first surface 11, the side surface 13, and the second surface 12. This ensures that the width of the connecting part 30 at each overlapping end remains consistent with the linewidth of the overlapping wiring structure, thereby maximizing the orthographic overlap area between the connecting part 30 and the corresponding wiring structure at each overlapping end. When the overlap area at each overlapping end reaches its optimal value, the contact resistance between the connecting part 30 and the wiring structures on the first surface 11, the side surface 13, and the second surface 12 is minimized, and the electrical signal crosses multiple... The interface impedance loss encountered during transmission between trace structures on the substrate surface is minimized, ensuring the electrical connection quality of the repaired trace structure. At the same time, the matching of the width of each overlap end with the line width of the corresponding trace structure maximizes the mechanical bonding area of ​​the connection part 30 in each overlap area. The distribution of mechanical load at each end of the connection part 30 is adapted to the load-bearing capacity of the corresponding trace structure, avoiding the risk of peeling failure caused by local stress concentration due to excessively narrow overlap width at one end of the connection part 30. It also avoids the problem of short circuit caused by excessively wide overlap width spreading to adjacent trace structures.

[0147] Optionally, the width of one end of the connecting portion 30 that overlaps with the wiring structure on the first surface 11, the width of one end of the connecting portion 30 that overlaps with the wiring structure on the side surface 13, and the width of one end of the connecting portion 30 that overlaps with the wiring structure on the second surface 12 are consistent, that is, the connecting portion 30 is arranged in a uniform and equal width along its overall extension direction.

[0148] The uniform width of each end of the connector 30 is constrained by the line width of the narrowest routing structure on the first surface 11. Under the premise that the overlap area between the connector 30 and the routing structure on the first surface 11 does not exceed the line width boundary and does not spread to adjacent routing structures causing short circuits, reliable electrical and mechanical connections can be formed within this uniform width range when the two ends of the connector 30 of the same width overlap with the routing structures on the side surface 13 and the second surface 12, which have relatively wider line widths. The uniform width of the connector ensures that its cross-sectional area remains consistent along its overall length, allowing electrical signals to cross the first surface 11 and the side surface 12 via the connector. When the signal is transmitted between the 13 and the second surface 12, there is no local impedance difference caused by the abrupt change in the width of the conductor cross-section at each position of the connecting part 30. The resistance distribution of the electrical signal is uniform and continuous along the transmission path inside the connecting part 30, which effectively avoids the problem of local signal attenuation caused by the uneven shape of the connecting part 30. In addition, the equal width shape of the connecting part 30 has higher process consistency in the repair process. The process of coating and shaping the repair connecting material along the equal width path is easier to achieve uniform filling, which reduces the process difficulty and uncertainty of the repair operation and helps to further improve the consistency and reliability of the repair structure in batch repair scenarios.

[0149] Figure 4a It shows Figure 2 A cross-sectional structure along the BB direction.

[0150] Please see Figure 4a In some embodiments, the transition portion 14 further includes a first transition portion 141, the first surface 11 and the side surface 13 are connected through the first transition portion 141, the first segment 21 includes a first wiring segment located on the first surface 11, and the second segment 22 includes a second wiring segment located on the second surface 12 and a side wiring segment located on the side surface 13.

[0151] The connecting portion 30 is located in the first transition portion 141. At least one end of the connecting portion 30 is fitted with the second conductive portion 202 of the side 13 trace segment or the first trace segment, and the connecting portion 30 is in contact with the surface of the side 13 trace segment and the first conductive portion 201 of the first trace segment away from the substrate 10.

[0152] In these embodiments, the connecting portion 30 has a contact hole in the first transition portion 141, the side wiring segment or the second conductive portion 202 of the first wiring segment. The connecting portion 30 extends into the second conductive portion 202 to achieve a fitting arrangement with the second conductive portion 202, thereby increasing the contact area between the connecting portion 30 and the second conductive portion 202 and improving the firmness of the mechanical connection and electrical connection.

[0153] Meanwhile, the surface of the first conductive part 201 on the side of the side trace or the first trace away from the substrate 10 is exposed again. The connecting part 30 contacts the newly exposed surface of the first conductive part 201 on the side away from the substrate 10. In addition to being able to contact the flat surface of the first conductive part 201 and improve the bonding force of mechanical and electrical connections, the surface of part of the first conductive part 201 is a patterned surface, which can further increase the contact area between the connecting part 30 and the first conductive part 201, and similarly improve the firmness of mechanical and electrical connections.

[0154] For example, one side of the first transition portion 141 is a patterned surface, and the connecting portion 30 also contacts the surface of one side of the first transition portion 141, which can further increase the contact area between the connecting portion 30 and the first transition portion 141, and also improve the firmness of the mechanical connection.

[0155] Optionally, the transition portion 14 further includes a second transition portion 142, through which the second surface 12 and the side surface 13 are connected. The first segment 21 includes a second trace segment located on the second surface 12, and the second segment 22 includes a first trace segment located on the first surface 11 and a side trace segment located on the side surface 13. The connecting portion 30 is located in the second transition portion 142, and at least one end of the connecting portion 30 is fitted with the second conductive portion 202 of the side trace segment or the second trace segment. The connecting portion 30 is in contact with the surface of the side trace segment and the first conductive portion 201 of the second trace segment away from the substrate 10. The connecting portion 30 can also repair the connection between the second trace segment of the second surface 12 and the side trace segment of the side surface 13 in the second transition portion 142.

[0156] The beneficial effects of the embodiment in which the connecting part 30 is arranged in the second transition part 142 have been explained in the embodiment in which the connecting part 30 is arranged in the first transition part 141, and will not be repeated here.

[0157] Figure 4b It shows Figure 2 Another cross-sectional structure along the BB direction.

[0158] Please see Figure 4b In some embodiments, the first transition portion 141 includes a first transition surface 141a, and the wiring structure further includes a third segment 23 located on the first transition surface 141a.

[0159] The connecting portion 30 overlaps with the first segment 21 and the third segment 23, and also overlaps with the second segment 22 and the third segment 23. At least one end of the connecting portion 30 is fitted with the second conductive portion 202 of at least one of the side trace segment 13, the first trace segment, and the third segment 23. The connecting portion 30 is in contact with the surface of the first conductive portion 201 of the side trace segment 13, the first trace segment, and the third segment 23 on the side away from the substrate 10.

[0160] In these embodiments, the transition portion 14 retains a third segment 23 formed by a partial break in the wire. The third segment 23 is located between the first trace segment and the side trace segment 13. The connecting portion 30 can also be fitted with the second conductive portion 202 of the third segment 23 and contact the surface of the first conductive portion 201 of the third segment 23 facing away from the substrate 10, further enhancing the strength of the mechanical and electrical connection of the connecting portion 30 in the first transition portion 141.

[0161] Optionally, the first transition surface 141a is tangent to the first surface 11 and the side surface 13, which further helps the connecting part 30 to achieve a smooth transition from the first surface 11 to the side surface 13, and the force is uniform, so that the uneven force caused by the abrupt change in the shape of the substrate 10 will not cause problems such as peeling and falling off.

[0162] For example, a portion of the first transition portion 141 is located between one of the first routing segment and the side routing segment 13 and the third segment 23, a portion of the first transition surface 141a is a patterned surface, and the connecting portion 30 also contacts a portion of the first transition surface 141a, which can further increase the contact area between the connecting portion 30 and the first transition portion 141, and also improve the firmness of the mechanical connection.

[0163] Optionally, the contact length between the connecting part 30 and the third segment 23 is the same as the contact length between the connecting part 30 and the first segment 21, and the contact length between the connecting part 30 and the second segment 22, so that the force is uniform.

[0164] Optionally, the contact length between the connecting portion 30 and the third segment 23 is 60 to 120 micrometers.

[0165] Optionally, the contact length between the connecting part 30 and the first transition surface 141a is the same as the contact length between the connecting part 30 and the third segment 23, so as to achieve highly controllable filling amount of material in the connecting part 30.

[0166] Optionally, the contact length between the connecting portion 30 and the first transition surface 141a is 60 to 120 micrometers.

[0167] Optionally, the second transition section 142 includes a second transition surface 142a, and the wiring structure further includes a third segment 23 located on the second transition surface 142a.

[0168] The connecting portion 30 overlaps with the first segment 21 and the third segment 23, and also overlaps with the second segment 22 and the third segment 23. At least one end of the connecting portion 30 is fitted with the second conductive portion 202 of at least one of the side trace segment 13, the first trace segment, and the third segment 23. The connecting portion 30 is in contact with the surface of the first conductive portion 201 of the side trace segment 13, the first trace segment, and the third segment 23 on the side away from the substrate 10.

[0169] The third segment 23 can also be disposed on the second transition surface 142a between the second wiring segment and the side wiring segment 13, thereby further enhancing the robustness of the mechanical and electrical connections in the embodiment where the connecting portion 30 is located in the second transition portion 142. Optionally, the second transition surface 142a is tangent to the second surface 12 and the side surface 13.

[0170] Optionally, a portion of the second transition portion 142 is located between one of the second routing segment and the side routing segment 13 and the third segment 23, a portion of the second transition surface 142a is a patterned surface, and the connecting portion 30 also contacts a portion of the second transition surface 142a.

[0171] Optionally, the contact length between the connecting portion 30 and the second transition surface 142a is the same as the contact length between the connecting portion 30 and the third segment 23.

[0172] Optionally, the contact length between the connecting portion 30 and the second transition surface 142a is 60 to 120 micrometers.

[0173] The beneficial effects of the embodiment in which the third segment 23 is arranged on the second transition surface 142a have been described in the embodiment in which the third segment 23 is arranged on the first transition surface 141a, and will not be repeated here.

[0174] Figure 5 A cross-sectional structure of another display panel provided in the first aspect embodiment of this application is shown.

[0175] Please see Figure 5 In some embodiments, the wiring structure further includes a plurality of fourth segments 24, and the portion of the substrate 10 located between any two adjacent segments of the first segment 21, the second segment 22 and the plurality of fourth segments 24 is a patterned surface.

[0176] At least one end of the connecting portion 30 is fitted into at least one of the second conductive portions 202 of the first segment 21, the second segment 22, and any fourth segment 24, and the connecting portion 30 is in contact with the surface of the first conductive portion 201 of the first segment 21, the second segment 22, and any fourth segment 24 on the side opposite to the substrate 10.

[0177] In these embodiments, when multiple breakpoints at the break point are concentrated or the breakpoints are too large, multiple fourth segments 24 formed by partial breakpoints are retained between the first segment 21 and the second segment 22. The connecting portion 30 can also be fitted with the second conductive portion 202 of any of the fourth segments 24 and contact the surface of the first conductive portion 201 of any of the fourth segments 24 facing away from the substrate 10, further improving the firmness of the mechanical and electrical connections of the connecting portion 30.

[0178] The second conductive portion 202 of the first segment 21, the second segment 22 and any fourth segment 24 has a contact hole. The connecting portion 30 extends into the second conductive portion 202 to achieve a fitting arrangement with the second conductive portion 202, thereby increasing the contact area between the connecting portion 30 and the second conductive portion 202 and improving the firmness of the mechanical connection and electrical connection.

[0179] Meanwhile, the surface of the first conductive part 201 on the side away from the substrate 10 of the side 13 wiring segment or the first wiring segment is exposed again. The connecting part 30 contacts the newly exposed surface of the first conductive part 201 on the side away from the substrate 10. In addition to being able to contact the flat surface of the first conductive part 201 and improve the bonding force of mechanical and electrical connections, the surface of part of the first conductive part 201 is a patterned surface, which can further increase the contact area between the connecting part 30 and the first conductive part 201, and similarly improve the firmness of mechanical and electrical connections.

[0180] Optionally, the contact length between the connecting part and the fourth segment is the same as the contact length between the connecting part and the first segment, and the contact length between the connecting part and the second segment, so that the force is uniform.

[0181] Optionally, the contact length between the connector and the fourth segment is 60 to 120 micrometers.

[0182] For example, a portion of the substrate 10 is located between one of the first segment 21 and the second segment 22 and the fourth segment 24. One side of the portion of the substrate 10 is a patterned surface, and the connecting portion 30 is in contact with the surface of one side of the portion of the substrate 10, which can further increase the contact area between the connecting portion 30 and the substrate 10, and also improve the firmness of the mechanical connection.

[0183] Please see Figure 1b In some embodiments, the length of the second conductive portion 202 of at least one of the first segment 21 and the second segment 22 is smaller than the length of the first conductive portion 201, at least one end of the first conductive portion 201 extends beyond the second conductive portion 202, and the connecting portion 30 contacts the surface of the first conductive portion 201 on the side away from the substrate 10.

[0184] In these embodiments, since the oxidation and stripping ratio of the second conductive portion 202 on the surface of at least one of the first segment 21 and the second segment 22 is relatively high during pretreatment, the second conductive portion 202 at one end of at least one of the first segment 21 and the second segment 22 is directly removed, and the connecting portion 30 directly contacts the surface of the first conductive portion 201 on the side away from the substrate 10.

[0185] Optionally, the same setting method as described in the above embodiments applies to the relationship between the third segment 23 and the first segment 21 or the second segment 22, and the same setting method as described in the above embodiments applies to the relationship between any fourth segment 24 and the first segment 21 or the second segment 22. Figure 6 A cross-sectional structure of another display panel provided in the first aspect embodiment of this application is shown.

[0186] Please see Figure 6 In some embodiments, the surface of a portion of the first conductive portion 201 facing away from the substrate 10 is a patterned surface, and at least one end of the connecting portion 30 is simultaneously fitted with the first conductive portion 201.

[0187] In these embodiments, a portion of the surface of the first conductive part 201 facing away from the substrate 10 is re-exposed. The connecting part 30 contacts the newly exposed surface of the first conductive part 201 facing away from the substrate 10. Based on the ability to contact the flat surface of the first conductive part 201 and improve the bonding force of the mechanical and electrical connections, the first conductive part 201 is provided with a contact hole. The connecting part 30 extends into the first conductive part 201 to achieve a fitting arrangement with the first conductive part 201, thereby increasing the contact area between the connecting part 30 and the first conductive part 201 and improving the firmness of the mechanical and electrical connections.

[0188] For example, the contact hole on the first conductive part 201 is a blind hole to avoid the first conductive part 201 from peeling off from the substrate 10 due to the opening of through holes.

[0189] Optionally, the same setting method as described in the above embodiments applies to the relationship between the third segment 23 and the first segment 21 or the second segment 22, and the same setting method as described in the above embodiments applies to the relationship between any fourth segment 24 and the first segment 21 or the second segment 22. Figure 7 A cross-sectional structure of another display panel provided in the first aspect embodiment of this application is shown.

[0190] Please see Figure 7 In some embodiments, the surface of a portion of the second conductive portion 202 facing away from the substrate 10 is a patterned surface, and at least one end of the connecting portion 30 is simultaneously engaged with the first conductive portion 201 and the second conductive portion 202.

[0191] In these embodiments, the first conductive part 201 and the second conductive part 202 are formed with a sleeve-shaped morphology, and the connecting part 30 extends into the space between the first conductive part 201 and the second conductive part 202 at the same time, so as to realize the simultaneous fitting with the first conductive part 201 and the second conductive part 202, thereby further increasing the contact area between the connecting part 30 and the first conductive part 201 and the second conductive part 202, and improving the firmness of the mechanical connection and the electrical connection.

[0192] For example, the first conductive part 201 and the second conductive part 202 can be formed by laser etching simultaneously. The contact holes on the first conductive part 201 and the second conductive part 202 have the same diameter and the same shape, which not only satisfies the need to further increase the contact area between the connecting part 30 and the first conductive part 201 and the second conductive part 202, but also has considerable convenience in terms of process.

[0193] Alternatively, the first conductive part 201 and the second conductive part 202 can also be formed into holes using two separate etching processes.

[0194] Optionally, the aperture of the contact hole on the first conductive part 201 is smaller than the aperture of the contact hole on the second conductive part 202, leaving process redundancy for the etching process and increasing the fault tolerance of the process preparation.

[0195] The diameter of the contact hole on the first conductive part 201 is smaller than the diameter of the contact hole on the second conductive part 202, so that the contact holes on the first conductive part 201 and the second conductive part 202 present a stepped hole structure with a larger top and a smaller bottom in the cross section perpendicular to the direction of the substrate 10.

[0196] When etching is used to simultaneously or in stages form holes in the first conductive part 201 and the second conductive part 202, process deviations in the etching amount are inevitable. If the contact hole diameters on the first conductive part 201 and the second conductive part 202 are consistent, and over-etching occurs when etching the outer part of the second conductive part 202, the inner part of the first conductive part 201 will simultaneously suffer more etching damage than expected, affecting the structural integrity and current transmission function of the first conductive part 201. Conversely, when the contact hole diameter on the first conductive part 201 is designed to be smaller than that of the second conductive part 202, the relatively smaller opening of the first conductive part 201 provides additional dimensions for the etching process. With a small tolerance space, even if the etching amount on the second conductive part 202 side is slightly exceeded, the first conductive part 201 can still maintain structural stability within its smaller aperture range, thereby effectively improving the fault tolerance rate of the contact hole preparation process. At the same time, the larger opening of the second conductive part 202 serves as a guide inlet for the repair connection material, facilitating the smooth flow of the material in the connection part 30 and fully filling the upper space. Meanwhile, the smaller opening of the first conductive part 201 forms a precise fitting contact surface on the inner copper structure side after the connection part is shaped, enabling the connection part 30 to establish an effective electrical connection with the first conductive part 201, which has better conductivity. This ensures both process reliability and the quality of electrical connection of the repair structure.

[0197] Optionally, the diameter of the contact hole on the first conductive part 201 is larger than the diameter of the contact hole on the second conductive part 202. The larger diameter of the contact hole on the first conductive part 201 than the diameter of the contact hole on the second conductive part 202 results in the contact holes on the first conductive part 201 and the second conductive part 202 exhibiting an inverted stepped hole structure with a smaller top and a larger bottom in a cross-section perpendicular to the direction of the substrate 10. In this aperture design, the outer second conductive part 202 retains a relatively small opening, meaning that the second conductive part 202 maintains a large continuous covering layer around the contact hole, continuously providing physical protection to the inner first conductive part 201 near the edge of the opening, thus maximizing the protective function of the second conductive part 202. Meanwhile, the inner first conductive part 201 has a relatively larger opening, allowing the material of the connecting part 30 to expand and fill the surrounding area on the first conductive part 201 surface after entering through the smaller opening of the second conductive part 202. This forms a larger direct contact interface with the sidewalls of the first conductive part 201 and the bottom surface of the second conductive part 202, fully utilizing the low-resistance material properties of the first conductive part 201 to connect the connecting part 30 to the main current-carrying part. The contact resistance between the first conductive parts 201 is reduced to a lower level, further optimizing the conductive path quality of the repair section. The material of the connecting part 30 flows in through the narrower opening of the second conductive part 202 and expands and is shaped in the wider cavity of the first conductive part 201, forming a mechanical locking structure similar to a rivet. The upper part of the connecting part 30 is constrained by the smaller diameter of the second conductive part 202, while the lower part forms a wider extension in the cavity of the first conductive part 201. Together, they form an interlocking shape with a mechanical snap-fit ​​effect. When the connecting part 30 is subjected to a peeling force perpendicular to the substrate direction, the expansion and shaping body in the cavity of the first conductive part 201 can provide pull-out resistance, greatly improving the stability of the mechanical connection between the connecting part 30 and the wiring structure, and effectively preventing the connecting part 30 from falling off and failing under long-term use conditions.

[0198] Optionally, the same setting method as described in the above embodiments applies to the relationship between the third segment 23 and the first segment 21 or the second segment 22, and the same setting method as described in the above embodiments applies to the relationship between any fourth segment 24 and the first segment 21 or the second segment 22.

[0199] Figure 8 It shows Figure 2 The planar structure of the first surface 11, the second surface 12, and the side surface 13.

[0200] Please see Figure 8In some embodiments, the surface of the portion of the substrate 10 located between the first segment 21 and the second segment 22 is a patterned surface. The substrate 10 includes a first surface 11, a second surface 12 and a side surface 13 connecting the first surface 11 and the second surface 12. The first surface 11 and the second surface 12 are arranged opposite to each other along the thickness direction of the substrate 10 itself. The first surface 11 is the surface facing the light-emitting side of the display panel.

[0201] The first surface 11, the second surface 12, and the side surface 13 also include a contact area 10a and a non-contact area 10c. The contact area 10a is located between the first segment 21 and the second segment 22. The non-contact area 10c is arranged around the contact area. The surface roughness of the contact area 10a is greater than the surface roughness of the non-contact area 10c.

[0202] In these embodiments, the roughness of the contact area 10a of the substrate 10 is greater than that of the non-contact area 10c, so that the contact area between the connection portion 30 and the substrate 10 is increased in the contact area 10a compared to the non-contact area 10c, with the same overlapping area, thereby improving the firmness of the mechanical connection.

[0203] For example, the contact area 10a is formed by chemical etching, specifically, the roughness of the contact area 10a is greater than the roughness of the non-contact area 10c.

[0204] Optionally, the contact area 10a is formed by physical additive or subtractive processing, specifically, the roughness of the contact area 10a is greater than the roughness of the non-contact area 10c.

[0205] As explained above, surface roughness can be characterized by one of the following: the maximum height of the surface protrusions or the maximum depth of the surface depressions, the maximum width of the surface protrusions or depressions, and the number of surface protrusions or depressions per unit area, i.e., the distribution density. These will not be elaborated further here.

[0206] Optionally, the same setting method as described in the above embodiments applies to the relationship between the third segment 23 and the first segment 21 or the second segment 22, and the same setting method as described in the above embodiments applies to the relationship between any fourth segment 24 and the first segment 21 or the second segment 22.

[0207] Please continue reading. Figure 8 In some embodiments, the surfaces of the first conductive portion 201 and the second conductive portion 202 of the first segment 21 and the second segment 22 are patterned surfaces. The first surface 11, the second surface 12 and the side surface 13 include a transition region 10b. The transition region 10b is located between the contact region 10a and the non-contact region 10c. The transition region is arranged around the contact region 10a and the non-contact region 10c is arranged around the transition region 10b.

[0208] The surface roughness of the first segment 21 and the second segment 22, which are projected onto the substrate 10 in the transition region 10b, is greater than the surface roughness of the first segment 21 and the second segment 22, which are projected onto the substrate 10 in the non-contact region 10c.

[0209] In these embodiments, the surface roughness of the first segment 21 and the second segment 22 located in the transition region 10b is increased. Compared with the non-contact region 10c, the contact area between the connecting portion 30 and the first segment 21 and the second segment 22 is increased in the transition region 10b with the same overlapping area, thereby improving the strength of the electrical and mechanical connections.

[0210] For example, the surfaces of the first segment 21 and the second segment 22 located in the transition region 10b are etched with chemical solution, specifically manifested in that the roughness of the transition region 10b is greater than the roughness of the non-contact region 10c.

[0211] Optionally, the surfaces of the first segment 21 and the second segment 22 located in the transition region 10b are formed by physical additive or subtractive processing, specifically, the roughness of the transition region 10b is greater than the roughness of the non-contact region 10c.

[0212] For example, the surface roughness of the first conductive portion 201 and the second conductive portion 202 located in the transition region 10b is greater than the surface roughness of the first conductive portion 201 and the second conductive portion 202 located in the non-contact region 10c.

[0213] Optionally, the same setting method as described in the above embodiments applies to the relationship between the third segment 23 and the first segment 21 or the second segment 22, and the same setting method as described in the above embodiments applies to the relationship between any fourth segment 24 and the first segment 21 or the second segment 22.

[0214] Figure 9 A cross-sectional structure of another display panel provided in the first aspect embodiment of this application is shown.

[0215] Please see Figure 9 In some embodiments, at least one of the end face of the first segment 21 near the end of the second segment 22 and the end face of the second segment 22 near the end of the first segment 21 has an inclination angle with the surface of the substrate 10 not exceeding 90°.

[0216] In these embodiments, at the end face of the first segment 21 near the second segment 22 and the end face of the second segment 22 near the first segment 21, the connecting portion 30 can smoothly transition from overlapping with the substrate 10 to overlapping with the first segment 21 and the second segment 22, further improving the firmness of the mechanical and electrical connections of the connecting portion 30.

[0217] In related technologies, if at least one of the end face of the first segment 21 near the second segment 22 and the end face of the second segment 22 near the first segment 21 has an inclination angle with the surface of the substrate 10 exceeding 90°, there will be a space below the first segment 21 and the second segment 22 where the connecting portion 30 cannot make complete contact, which may easily lead to poor contact between the connecting portion 30 and the first segment 21 and the second segment 22.

[0218] For example, by controlling the tilt angle between at least one of the end face of the first segment 21 near the end of the second segment 22 and the end face of the second segment 22 near the end of the first segment 21 and the surface of the substrate 10 to not exceed 90°, the smooth transition of the connecting portion 30 from overlapping the substrate 10 to overlapping the first segment 21 and the second segment 22 can be effectively achieved.

[0219] For example, the tilt angle between at least one of the end face of the first segment 21 near the end of the second segment 22 and the end face of the second segment 22 near the end of the first segment 21 and the surface of the substrate 10 is controlled to be no more than 80°.

[0220] For example, the inclination angle between the end face of the first segment 21 near the second segment 22 and the surface of the substrate 10 is . Figure 9 The first tilt angle A1 is shown in the figure.

[0221] For example, the inclination angle between the end face of the second segment 22 near the first segment 21 and the surface of the substrate 10 is . Figure 9 The second tilt angle A2 is shown in the figure.

[0222] Optionally, further, in the first tilt angle A1 or the second tilt angle A2, the tilt angle between the first conductive part 201 and the surface of the substrate 10 is greater than the tilt angle between the first conductive part 201 and the surface of the substrate 10. That is, at the end face of the first segment 21 or the second segment 22, the tilt of the end face of the second conductive part 202 located on the outer side is gentler than the end face of the first conductive part 201 located on the inner side, while the end face of the first conductive part 201 is relatively steeper.

[0223] Under the aforementioned end-face tilt angle relationship, the second conductive portion 202 located on the outer side forms a slope shape that gently transitions upward from the surface of the substrate 10 with a smaller tilt angle. As the material of the connecting portion 30 extends from the substrate surface to the wiring structure, it gradually descends along the relatively gentle slope of the second conductive portion 202. This avoids the problem of contact gaps between the connecting portion 30 and the second conductive portion 202 due to an excessively steep end face, allowing the connecting portion 30 to fully fit with the tilted end face of the second conductive portion 202, ensuring that the connecting portion 30, in conjunction with the second conductive portion 202,... A reliable surface contact is formed at the overlapping interface of the electrical part 202; at the same time, since the tilt angle of the end face of the first conductive part 201 is relatively large, the end face of the first conductive part 201 is fully exposed in a relatively vertical manner within the contactable area of ​​the connecting part, and the connecting part 30 can smoothly climb up the slope of the second conductive part 202 and then directly contact the end face of the first conductive part 201, so that the connecting part 30 and the first conductive part 201, which mainly undertakes the current transmission function, can form an effective electrical contact, ensuring the reliability of electrical signal transmission in the repair section.

[0224] The aforementioned tilt angle difference causes the connecting part 30 to be guided and supported by the gentle slope of the second conductive part 202 on the transition path from the substrate 10 to the second conductive part 202 and then to the first conductive part 201. The overall fit of the connecting part 30 is uniform, and the mechanical bonding firmness and electrical connection stability are further improved.

[0225] Optionally, further, in the first tilt angle A1 or the second tilt angle A2, the tilt angle between the first conductive part 201 and the surface of the substrate 10 is smaller than the tilt angle between the first conductive part 201 and the surface of the substrate 10. That is, at the end face of the first segment 21 or the second segment 22, the tilt of the end face of the first conductive part 201 located on the inner side is gentler than that of the end face of the second conductive part 202 located on the outer side, while the end face of the second conductive part 202 is relatively steeper.

[0226] Under the aforementioned end-face inclination relationship, the first conductive part 201 located on the inner side extends outward at a smaller inclination angle, forming a slope shape that smoothly transitions directly upward from the surface of the substrate 10. As the material of the connecting part 30 extends from the surface of the substrate 10 to the wiring structure, it climbs and contacts with low resistance along the relatively gentle end-face slope of the first conductive part 201. A larger contact interface can be formed between the connecting part 30 and the first conductive part 201, reducing the contact resistance between the connecting part 30 and the first conductive part 201 with better conductivity, ensuring that the electrical signal can be efficiently conducted preferentially through the interface between the first conductive part 201 and the connecting part 30. The inclination angle of the end face of the second conductive part 202 is relatively large, so that its end is fully exposed in the vertical direction. After the connecting part 30 climbs along the slope of the first conductive part 201, it can further overlap to the surface of the second conductive part 202. The overlap between the second conductive part 202 and the connecting part 30 provides additional mechanical holding and electrical connection redundancy for the repair structure.

[0227] The aforementioned tilt angle difference allows the connecting part 30 to establish a high-quality electrical contact with the first conductive part 201, which mainly undertakes the function of current transmission. On the gentle transition path from the substrate 10 to the first conductive part 201, the connecting part 30 is subjected to uniform force and fits fully. The overall contact resistance of the repair section is at the optimal level, and the electrical signal can be transmitted smoothly and reliably between the repaired first segment 21 and the second segment 22.

[0228] Please see Figure 1 In some embodiments, the connecting portion 30 includes a third conductive portion 31 and a protective portion 32. The third conductive portion 31 is overlapped with the first segment 21 and the second segment 22, and the protective portion 32 covers the surface of the third conductive portion 31 facing away from the substrate 10.

[0229] In these embodiments, in addition to the third conductive portion 31 that overlaps with the first segment 21 and the second segment 22, the connecting portion 30 also includes a protective portion 32, which is used to protect the third conductive portion 31 on the side of the third conductive portion 31 away from the substrate 10.

[0230] Please continue reading. Figure 1 In some embodiments, the protective part 32 includes multiple protective sub-layers, and the material of the protective sub-layers includes at least one of insulating ink, conductive ink, hydrophobic adhesive layer, and conductive adhesive layer.

[0231] In these embodiments, the protective part 32 employs one or more of the following combinations: insulating ink, conductive ink, hydrophobic adhesive layer, and conductive adhesive layer, thereby improving the overall protective performance and environmental adaptability.

[0232] The insulating ink layer can serve as a basic insulating barrier, effectively blocking current leakage, preventing short circuits and static electricity accumulation, and ensuring electrical safety.

[0233] The conductive ink layer creates a stable conductive path and simultaneously provides electromagnetic shielding, suppressing the adverse effects of external interference on signal transmission.

[0234] The hydrophobic adhesive layer forms a highly effective waterproof and moisture-proof interface, resisting the intrusion of moisture and liquids and preventing corrosion and functional degradation of the joint.

[0235] The conductive adhesive layer enhances the mechanical adhesion and conductive continuity of the conductive connection points, thereby improving structural stability and long-term reliability.

[0236] The organic combination of multiple materials in the protection section 32 not only achieves complementary enhancement of multiple protections, but also improves the durability and adaptability of the equipment in complex environments, effectively overcoming the limitations of single-material protection.

[0237] In some embodiments, the material of the third conductive portion 31 includes at least one of tungsten paste and silver paste.

[0238] In these embodiments, the third conductive part 31 is prepared using tungsten paste or silver paste, and the process is mature.

[0239] Figures 10a to 10d This paper shows a cross-sectional structure of another display panel provided by the first aspect embodiment of this application. The arrangement of the first conductive part 201 and the second conductive part 202 in the first segment 21 and the second segment 22 mentioned in the above embodiment can be arbitrarily combined without conflict.

[0240] For example, please refer to Figure 10a The first conductive part 201 of the first segment 21 is roughened on the surface near the end of the second segment 22 and directly contacts the connecting part 30. At the same time, the connecting part 30 is fitted with the remaining second conductive part 202. The second conductive part 202 is provided with a blind hole as a contact hole. The first conductive part 201 of the second segment 22 is roughened and contacts the connecting part 30 through the through hole opened in the second conductive part 202. The second conductive part 202 of the second segment 22 is provided with a through hole as a contact hole on the side near the first segment 21 and a blind hole as a contact hole at the position away from the first segment 21. At the same time, the inclination angle between the end face of the first segment 21 near the second segment 22 and the end face of the second segment 22 near the first segment 21 and the surface of the substrate 10 is less than 90°.

[0241] For example, please refer to Figure 10b The first conductive part 201 of the first segment 21 has a roughened surface near the end of the second segment 22 and is in direct contact with the connecting part 30. At the same time, the connecting part 30 is fitted with the remaining second conductive part 202. The second conductive part 202 is provided with a blind hole as a contact hole. The first conductive part 201 of the second segment 22 has a roughened surface near the end of the first segment 21 and is in direct contact with the connecting part 30. At the same time, the connecting part 30 is fitted with the remaining second conductive part 202. The first conductive part 201 and the second conductive part 202 are provided with blind holes as contact holes. Meanwhile, the inclination angle between the end face of the first segment 21 near the end of the second segment 22 and the end face of the second segment 22 near the end of the first segment 21 and the surface of the substrate 10 is less than 90°.

[0242] For example, please refer to Figure 10c The first conductive part 201 of the first segment 21 has a through hole opened in the second conductive part 202, and a blind hole is opened on the surface near the end of the second segment 22 as a contact hole and contacts the connecting part 30. At the same time, the connecting part 30 is fitted with the remaining second conductive part 202, and the second conductive part 202 is provided with a blind hole as a contact hole. The surface of the first conductive part 201 of the second segment 22 near the end of the first segment 21 is roughened and contacts the connecting part 30 through the through hole opened in the second conductive part 202. At the same time, the connecting part 30 is fitted with the remaining second conductive part 202. At the same time, the inclination angle between the end face of the first segment 21 near the end of the second segment 22 and the end face of the second segment 22 near the end of the first segment 21 and the surface of the substrate 10 is less than 90°.

[0243] For example, please refer to Figure 10d The first conductive part 201 of the first segment 21 has a through hole opened in the second conductive part 202, and a blind hole is opened on the surface near the second segment 22 as a contact hole and contacts the connecting part 30. At the same time, the connecting part 30 is fitted with the remaining second conductive part 202, and the second conductive part 202 is provided with a blind hole as a contact hole. The first conductive part 201 of the second segment 22 has a roughened surface near the first segment 21 and directly contacts the connecting part 30. At the same time, the connecting part 30 is fitted with the remaining second conductive part 202, and the first conductive part 201 and the second conductive part 202 are provided with blind holes as contact holes. At the same time, the inclination angle between the end face of the first segment 21 near the second segment 22 and the end face of the second segment 22 near the first segment 21 and the surface of the substrate 10 is less than 90°.

[0244] Figure 11 A flowchart illustrating the steps of a method for repairing broken lines in a display panel according to a second aspect embodiment of this application is shown.

[0245] Please see Figure 11 Secondly, embodiments of this application provide a method for repairing broken lines in a display panel. The display panel includes a substrate and a wiring layer. The wiring layer includes multiple wiring structures, and at least one wiring structure generates at least one point to be repaired.

[0246] Step S10: Preprocess the points to be repaired to obtain the first segment and the second segment; Step S20: Apply the repair material between the first segment and the second segment, and the repair material contacts the first segment and the second segment to form a connection.

[0247] The display panel provided in the second aspect of this application, since it is used to prepare the display panel provided in any of the first aspect embodiments of this application, has the beneficial effects of the display panel provided in any of the first aspect embodiments of this application, which will not be repeated here.

[0248] Figures 12 to 13 A process flow diagram of another method for repairing broken lines in a display panel, provided in a second aspect embodiment of this application, is shown.

[0249] Please see Figures 12 to 13 In some embodiments, at least one of the first segment 21 and the second segment 22 includes at least a first conductive portion 201 and a second conductive portion 202 stacked along the direction away from the substrate 10, and step S10 further includes: Step S11: The surface of at least one of the first conductive part 201, the second conductive part 202, and the portion of the substrate 10 located between the first segment 21 and the second segment 22 is patterned.

[0250] For example, the second conductive part 202 can be patterned in the previous process, and the first conductive part 201 can be patterned in the next process.

[0251] Optionally, laser etching technology can be used to pattern both the first conductive part 201 and the second conductive part 202 simultaneously, which offers considerable convenience in terms of process.

[0252] The graphic processing should be understood as including both implementations that create cutouts or contact holes to increase the contact area and implementations that roughen the surface. The roughening methods specifically include at least chemical etching, physical additive or subtractive processing.

[0253] Please see Figure 13 In some embodiments, step S11 further includes: Step S111: Remove a portion of the second conductive part 202 of at least one of the first segment 21 and the second segment 22. The second conductive part 202 includes a body part 202a and a cutout part 202b. A portion of the surface of the first conductive part 201 facing away from the substrate is exposed by the cutout part 202b.

[0254] For example, the spacing between two adjacent cutout portions 202b is equal, and the cutout portions 202b are evenly distributed on the surface of the first conductive portion 201, so as to achieve uniform force and uniform contact resistance, and further improve the stability of mechanical connection and electrical connection.

[0255] Optionally, the cutout portion 202b is concentrated at one end of the first segment 21 near the second segment 22 or at one end of the second segment 22 near the first segment 21, and is concentrated at the end away from the adjacent wiring structure. This improves the stability of the mechanical and electrical connections at key locations while avoiding the connection portion 30 being distributed to the side near the adjacent wiring structure and coming into contact with the adjacent wiring structure, which could cause a short circuit.

[0256] Optionally, the cutout portion 202b directly exposes the first conductive portion 201 of one of the first segment 21 and the second segment 22, allowing the repair material to directly contact the first conductive portion 201, thereby increasing the contact area between the repair material and the first conductive portion 201 and improving the stability of the mechanical and electrical connection between the connecting portion 30 and the first conductive portion 201.

[0257] Optionally, in step S111, the location on the second conductive part 202 that is easy to peel off or oxidize and fall off can also be identified by detection means. While achieving precise removal, multiple hollow parts 202b are formed and the fresh surface of the first conductive part 201 on the side away from the substrate 10 is exposed. This is more precise and can further improve the stability of the mechanical and electrical connection between the connecting part 30 and the first segment 21 and the second segment 22.

[0258] Figure 14 The overall structure of a display device 100 provided in a third aspect embodiment of this application is shown.

[0259] Please see Figure 14 Thirdly, embodiments of this application provide a display device 100, including the display panel provided in any of the first aspects of this application.

[0260] The display device 100 provided in the third aspect embodiment of this application has the beneficial effects of the display panel provided in any of the first aspect embodiments of this application since it includes the display panel provided in any of the first aspect embodiments of this application, which will not be described again here.

[0261] The display device 100 in this application embodiment includes, but is not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0262] The display device 100 can be any device with a display function, such as mobile devices such as mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), or non-mobile devices such as personal computers (PCs), televisions (TVs), ATMs, or self-service machines.

[0263] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, include: substrate; A wiring layer is located on at least one surface of the substrate, the wiring layer includes multiple wiring structures, and at least one of the wiring structures includes at least a first segment and a second segment. The connecting part overlaps with the first segment and the second segment.

2. The display panel according to claim 1, characterized in that, At least one of the first segment and the second segment includes at least a first conductive portion and a second conductive portion that are sequentially stacked along a direction away from the substrate.

3. The display panel according to claim 2, characterized in that, The surface of at least one of the first conductive portion, the second conductive portion, and the portion of the substrate located between the first segment and the second segment is a patterned surface.

4. The display panel according to claim 3, characterized in that, The surface of the second conductive portion facing away from the substrate is a patterned surface, and at least one end of the connecting portion is fitted into the second conductive portion.

5. The display panel according to claim 3, characterized in that, The surface of the first conductive portion facing away from the substrate is a patterned surface, and the connecting portion is in contact with the surface of the first conductive portion facing away from the substrate.

6. The display panel according to claim 3, characterized in that, The surface of the substrate located between the first segment and the second segment is a patterned surface, and the connecting portion is in contact with the surface of the substrate located between the first segment and the second segment.

7. The display panel according to claim 3, characterized in that, The substrate includes a first surface, a second surface, and a side surface connecting the first surface and the second surface. The first surface and the second surface are disposed opposite each other in a direction perpendicular to the plane of the display panel. The first surface is the light-emitting side facing the display panel. The connecting portion is located at at least one of the first surface, the second surface, and the side surface.

8. The display panel according to claim 7, characterized in that, The substrate further includes a transition portion, through which the first surface and / or the second surface are connected to the side surface, and the connecting portion is also located in the transition portion.

9. The display panel according to claim 8, characterized in that, The transition portion further includes a first transition portion, the first surface and the side surface are connected through the first transition portion, the first segment includes a first trace segment located on the first surface, and the second segment includes a second trace segment located on the second surface and a side trace segment located on the side surface; The connecting portion is located in the first transition portion, at least one end of the connecting portion is fitted with the side trace segment or the second conductive portion of the first trace segment, and the connecting portion is in contact with the surface of the side trace segment and the first conductive portion of the first trace segment on the side away from the substrate.

10. The display panel according to claim 9, characterized in that, The first transition portion includes a first transition surface, and the wiring structure further includes a third segment located on the first transition surface; The connecting portion overlaps with the first segment and the third segment, and also overlaps with the second segment and the third segment. At least one end of the connecting portion is fitted with the second conductive portion of at least one of the side trace segment, the first trace segment, and the third segment. The connecting portion is in contact with the surface of the first conductive portion of the side trace segment, the first trace segment, and the third segment that is away from the substrate.

11. The display panel according to claim 3, characterized in that, The wiring structure further includes multiple fourth segments, and the portion of the substrate located between any two adjacent segments of the first segment, the second segment, and the multiple fourth segments is a patterned surface; The connecting portion overlaps with the first segment and the fourth segment, and also overlaps with the second segment and the fourth segment. The connecting portion also overlaps with two adjacent fourth segments. The first segment, the second segment, and the plurality of fourth segments all include the first conductive portion and the second conductive portion. At least one end of the connecting portion is fitted into at least one of the second conductive portions of the first segment, the second segment, and any of the fourth segments, and the connecting portion is in contact with the surface of the first conductive portion of the first segment, the second segment, and any of the fourth segments opposite to the substrate.

12. The display panel according to claim 3, characterized in that, The length of the second conductive portion of at least one of the first segment and the second segment is smaller than the length of the first conductive portion, at least one end of the first conductive portion extends beyond the second conductive portion, and the connecting portion contacts the surface of the first conductive portion on the side away from the substrate.

13. The display panel according to claim 3, characterized in that, The surface of the first conductive portion facing away from the substrate is a patterned surface, and at least one end of the connecting portion is fitted into the first conductive portion.

14. The display panel according to claim 13, characterized in that, The surface of the second conductive portion facing away from the substrate is a patterned surface, and at least one end of the connecting portion is simultaneously fitted with both the first conductive portion and the second conductive portion.

15. The display panel according to claim 2, characterized in that, The surface of the substrate located between the first segment and the second segment is a patterned surface. The substrate includes a first surface, a second surface, and a side surface connecting the first surface and the second surface. The first surface and the second surface are arranged opposite to each other along the thickness direction of the substrate itself. The first surface is the light-emitting side facing the display panel. The first surface, the second surface, and the side surface also include a contact area and a non-contact area. The contact area is located between the first segment and the second segment, and the non-contact area is arranged around the contact area. The surface roughness of the contact area is greater than that of the non-contact area.

16. The display panel according to claim 15, characterized in that, The surfaces of a portion of the first conductive portion and a portion of the second conductive portion of the first segment and the second segment are patterned surfaces. The first surface, the second surface and the side surface also include a transition region. The transition region is located between the contact region and the non-contact region. The transition region is arranged around the contact region and the non-contact region is arranged around the transition region. The surface roughness of the first and second segments in the portion of the substrate projected onto the transition region is greater than the surface roughness of the first and second segments in the portion of the substrate projected onto the non-contact region.

17. The display panel according to claim 1, characterized in that, The inclination angle between at least one of the end face of the first segment near the end of the second segment and the end face of the second segment near the end of the first segment and the substrate surface does not exceed 90°.

18. The display panel according to claim 3, characterized in that, The connecting portion includes a third conductive portion and a protective portion. The third conductive portion overlaps with the first segment and the second segment, and the protective portion covers the surface of the third conductive portion away from the substrate.

19. The display panel according to claim 18, characterized in that, The protective layer includes multiple protective sub-layers, and the material of the protective sub-layers includes at least one of insulating ink, conductive ink, hydrophobic adhesive layer, and conductive adhesive layer.

20. The display panel according to claim 18, characterized in that, The material of the third conductive part includes at least one of tungsten paste and silver paste.

21. A method for repairing broken lines in a display panel, characterized in that, The display panel includes a substrate and a wiring layer. The wiring layer includes multiple wiring structures, and at least one of the wiring structures generates at least one repair point. The points to be repaired are preprocessed to obtain the first segment and the second segment; The repair material is applied between the first segment and the second segment, and the repair material contacts the first segment and the second segment to form a connection.

22. The method for repairing broken lines in a display panel according to claim 21, characterized in that, At least one of the first segment and the second segment includes at least a first conductive portion and a second conductive portion stacked along a direction away from the substrate. The step of preprocessing the point to be repaired to obtain the first segment and the second segment further includes: The surface of at least one of the first conductive portion, the second conductive portion, and the portion of the substrate located between the first segment and the second segment is patterned.

23. The method for repairing broken lines in a display panel according to claim 22, characterized in that, The step of patterning the surface of at least one of the first conductive portion, the second conductive portion, and the portion of the substrate located between the first segment and the second segment further includes: Remove a portion of the second conductive portion from at least one of the first segment and the second segment. The second conductive portion includes a body portion and a cutout portion, and a portion of the surface of the first conductive portion facing away from the substrate is exposed by the cutout portion.

24. A display device, characterized in that, The display panel includes any one of claims 1 to 20.

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