An AiP package antenna structure and a preparation method thereof
By introducing vertical coaxial interconnect components and precision manufacturing processes into the AiP package, the problem of electromagnetic environment control under high-frequency communication has been solved, enabling mass production with stable impedance and high signal purity, and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG BAIDU COMMUNICATIONS CO LTD
- Filing Date
- 2026-03-27
- Publication Date
- 2026-06-02
AI Technical Summary
Existing AiP packaging technology faces challenges in electromagnetic environment control under high-frequency communication. Traditional vertical interconnect structures are susceptible to interference, impedance mismatch, and significant parasitic inductance. Crosstalk between channels is severe, and lateral energy leakage leads to increased transmission loss. Existing improvement solutions are complex in process, have low yield, and high cost, making it difficult to balance electromagnetic performance with mass production economics.
The structure adopts a substrate layer, a redistribution interconnect layer, a molded insulating layer, an antenna radiating layer, and a top protective layer. It embeds a vertical coaxial interconnect component, including a central signal conductor, an inner dielectric sleeve, and a metal shielding wall, forming a closed electromagnetic transmission channel. The coaxial structure is constructed through precision manufacturing processes such as laser processing and electroplating.
It achieves precise control of characteristic impedance at high frequencies, reduces impedance mismatch and electromagnetic coupling, reduces transmission loss, improves signal purity and phase accuracy of the array antenna, is suitable for mass production, and reduces costs.
Smart Images
Figure CN122136606A_ABST