Liquid-based cooling system for high-capacity power management systems
By using liquid cooling systems, especially cold plate cooling, single-phase and two-phase immersion cooling, the problem of inconsistent thermal management in high-density, high-capacity power management systems of traditional air-cooled systems has been solved, achieving more efficient thermal management and increased power density.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- EATON INTELLIGENT POWER LTD
- Filing Date
- 2025-11-12
- Publication Date
- 2026-06-02
AI Technical Summary
Traditional air-cooled systems are inefficient in high-density, high-capacity power management systems, leading to inconsistent thermal management, which may result in accelerated component wear and overheating risks, and cannot meet the ever-increasing power density requirements.
The system employs a liquid-based cooling system, including cold plate cooling, single-phase immersion cooling, and two-phase immersion cooling. It manages heat through the circulation and phase change of the dielectric working fluid, and achieves efficient heat transfer either through direct contact with the power module or through a cooling flow path.
It improves power density, supports higher UPS capacity, reduces energy consumption and noise, and achieves more efficient thermal management and system reliability.
Smart Images
Figure CN122137084A_ABST
Abstract
Description
Technical Field
[0001] This disclosure generally relates to thermal management in uninterruptible power supplies (UPS), and more specifically, to liquid-based cooling systems. Background Technology
[0002] High-capacity power management systems, including uninterruptible power supplies (UPS), can be deployed in a range of environments such as data centers and industrial facilities to maintain power continuity during power outages. Because these systems are designed to support ever-increasing power capacities, they typically integrate a greater number of power modules into a tightly packed arrangement within a single unit. This dense configuration generates significant heat, posing challenges for thermal management. Traditional air-cooled systems, often using fans or blowers, have become the standard for dissipating this heat. However, as power density increases, these systems may reach their limits in terms of efficient heat dissipation, potentially leading to higher energy consumption and an increased risk of overheating.
[0003] Under high-capacity operation, air-cooled systems may exhibit inconsistent thermal performance, which can lead to accelerated component wear, reduced energy efficiency, and increased risk of overheating, especially during peak load periods. As UPS and other high-capacity power management systems evolve to feature more densely packed power modules and enhanced power handling capabilities, more advanced and adaptable cooling solutions are needed to provide efficient thermal management under varying power configurations and environmental conditions. Summary of the Invention
[0004] Embodiments of this disclosure provide advanced liquid cooling systems for uninterruptible power supplies (UPS) that improve thermal management and increase power density. Some aspects of the inventive concept include three different liquid-based cooling methods: cold plate cooling, single-phase immersion cooling, and two-phase immersion cooling. Cold plate cooling systems circulate cooling fluid through channels in a plate that directly contacts the power module. Single-phase immersion systems immerse the power module in a dielectric fluid for direct heat transfer. Two-phase immersion systems use a dielectric liquid that vaporizes after absorbing heat, allowing for efficient thermal regulation through phase change. These systems can support higher power density and larger UPS capacity compared to conventional air-cooled systems.
[0005] Some illustrative examples are described in the following numbered clauses: Clause 1. A cooling system for a high-density power system, the cooling system comprising: The cooling flow path includes multiple columns configured to retain and circulate the dielectric working fluid in the liquid phase. Multiple power modules, each including a heating area and a control interface, wherein the heating area of the power module is located on opposite sides of each column and directly faces the dielectric working fluid inside the column; The steam space is positioned above the cooling flow path; and The condenser is in thermal connection with the steam space. In this process, the dielectric working fluid in the cooling flow path absorbs heat from the heating area of the power module and changes from the liquid phase to the vapor phase. The vaporized dielectric working fluid rises from the cooling flow path into the vapor space, and the condenser condenses the vaporized dielectric working fluid back into the liquid phase and returns the condensed fluid to the cooling flow path.
[0006] Clause 2. The cooling system according to Clause 1, wherein each column includes an internal channel structure configured to guide the flow of dielectric working fluid within the column.
[0007] Clause 3. A cooling system according to any of the preceding clauses, wherein power modules are arranged in a stacked configuration along each column, wherein the heat-generating areas of the power modules are arranged in vertical series on opposite sides of the cooling flow path.
[0008] Clause 4. A cooling system according to any of the preceding clauses, wherein each power module is configured without a heat insulation layer on the heat-generating area, thereby allowing direct thermal contact between the heat-generating area and the dielectric working fluid within each column.
[0009] Clause 5. The cooling system according to any of the preceding clauses further includes a manifold structure near the top of each column, the manifold structure being configured to guide the vaporized dielectric working fluid from the columns into the condenser.
[0010] Clause 6. A cooling system according to any of the preceding clauses, wherein each column includes an internal cooling volume configured to hold a dielectric working fluid, wherein the heat-generating area of the power module is located on the outer surface of the column and thermally coupled to the dielectric working fluid within the internal cooling volume.
[0011] Clause 7. The cooling system according to Clause 6, wherein the power modules are mounted along opposite outer surfaces of each column, wherein the heat-generating areas of the power modules are arranged such that heat is transferred through the walls of the columns to the dielectric working fluid contained within an internal cooling volume.
[0012] Clause 8. A cooling system according to any of the preceding clauses, wherein the column is oriented substantially vertically.
[0013] Clause 9. The cooling system according to any of the preceding clauses, wherein the high-density power system includes an uninterruptible power supply system.
[0014] Clause 10. A cooling system for a high-density power system, the cooling system comprising: A cold plate having a fluid inlet and a fluid outlet defines an internal fluid channel configured to circulate a dielectric working fluid. Multiple power modules, each including a heating area and a control interface, wherein the heating area of the power module is mounted along the opposite outer surface of the cold plate, and the heating areas are arranged to transfer heat through the wall of the cold plate to the dielectric working fluid in the internal fluid channel; A heat exchanger, in fluid communication with the working fluid outlet and working fluid inlet of the cold plate, is configured to dissipate the heat absorbed by the dielectric working fluid as it circulates through the heat exchanger and returns to the cold plate.
[0015] Clause 11. The cooling system pursuant to Clause 10, wherein the dielectric working fluid comprises a mixture of water and ethylene glycol.
[0016] Clause 12. The cooling system according to Clause 10, wherein the cold plate is positioned in a horizontal orientation and defines a substantially horizontal flow path for the dielectric working fluid, the cold plate including a fluid inlet located on one side of the cold plate and a fluid outlet located on the opposite side of the cold plate, such that the dielectric working fluid flows laterally through the internal channels of the cold plate in a substantially horizontal direction.
[0017] Clause 13. The cooling system according to Clause 12, wherein the power module is mounted on the upper and lower outer surfaces of the cold plate, wherein the heat-generating area of the power module is in thermal communication with the dielectric working fluid flowing through the cold plate.
[0018] Clause 14. The cooling system according to Clause 10, wherein the cold plate comprises a plurality of individual cold plates arranged in a stacked configuration, each individual cold plate being in fluid communication with a common fluid inlet manifold and a common fluid outlet manifold, and wherein a power module is mounted on the opposite outer surface of each individual cold plate, wherein the heat-generating area of the power module is in thermal communication with a dielectric working fluid flowing through each cold plate.
[0019] Clause 15. Cooling system pursuant to Clause 10, wherein the high-density power system includes an uninterruptible power supply system.
[0020] Clause 16. A cooling system for a high-density power system, the cooling system comprising: The cooling flow path is configured to maintain and circulate the working fluid to manage the heat load generated by the power system during operation; and Multiple power modules, each including a heating area and a control interface, wherein the heating area of the power module is mounted on the outer surface opposite to the cooling flow path and directly faces the cooling flow path, so that each heating area is thermally connected to the working fluid in the cooling flow path.
[0021] Clause 17. Cooling system pursuant to Clause 16, wherein the high-density power system includes an uninterruptible power supply system. Attached Figure Description
[0022] Throughout the accompanying drawings, reference numerals may be repeated to indicate the correspondence between the referenced elements. The drawings are provided to illustrate embodiments of this disclosure and not to limit its scope.
[0023] Figure 1 An implementation of a cooling system for a high-density power system is shown.
[0024] Figure 2A An embodiment of a power module cold plate system for implementing a cooling flow path is shown, the power module cold plate system including a cold plate for managing heat load in a high-density power configuration.
[0025] Figure 2B An alternative implementation of a power module cold plate system is shown, which uses cold plates to manage heat loads in high-density power configurations, similar to... Figure 2A The configuration shown.
[0026] Figure 3 An embodiment of a cooling system configured to manage the heat load in a high-density power system is shown.
[0027] Figure 4A An embodiment of the cooling system is shown, wherein the power module cold plate system is arranged in a stacked configuration.
[0028] Figure 4B It shows Figure 4A Side view of the cooling system.
[0029] Figure 4C An example of a cross-section of a cold plate is shown.
[0030] Figure 5 An implementation of a two-phase cooling system for managing heat load in a high-density power configuration is shown.
[0031] Figure 6A and Figure 6B Side view and three-dimensional perspective view of an embodiment of a two-phase cooling system designed to manage heat load within a high-density power configuration are shown respectively.
[0032] Figure 7AExemplary total UPS power capacities achieved through various cooling configurations are shown.
[0033] Figure 7B Examples of improvements in UPS power density are shown for different cooling methods. Detailed Implementation
[0034] Managing the heat load in high-capacity power management systems, including uninterruptible power supplies (UPS), can improve system performance in environments such as data centers and industrial facilities. Traditional air-cooling solutions, typically relying on fans or blowers, have been widely used to manage the heat generated by densely packed power modules. However, with the increasing demand for higher power densities, air-cooling approaches may encounter limitations that impact thermal efficiency and overall system reliability. These limitations highlight the need for adaptable cooling methods that can support dense heat loads while maintaining energy efficiency.
[0035] Some of the inventive concepts described herein relate to liquid-based cooling architectures that address the limitations of air-cooled or other designs. In some configurations, the cooling system may include a cooling flow path designed to circulate the working fluid for thermal management. Furthermore, the cooling system may include power modules designed to integrate major heat-generating components, such as power transistors, capacitors, and inductors, into dedicated heat-generating regions. These heat-generating regions can be mounted along the cooling flow path, with each region directly facing the working fluid. This configuration allows the heat-generating regions to be arranged in thermal communication with the working fluid, thereby facilitating efficient heat transfer. Liquid-based cooling architectures can support higher power densities and compact configurations while overcoming the limitations associated with traditional air-cooled systems.
[0036] Some of the inventive concepts described herein relate to cooling systems that include cooling flow paths implemented using channels configured to retain and circulate the working fluid from adjacent power modules. These channels allow the working fluid to absorb heat from the power modules without completely immersing them, reducing the required fluid volume. This design also prevents the power modules from being directly exposed to the working fluid, simplifying system integration and reducing the likelihood of potential problems associated with fluid exposure. By utilizing channel-based cooling flow paths, cooling systems can achieve liquid-cooled heat exchange, such as efficient heat dissipation and higher power density, while addressing challenges related to fluid management and maintenance.
[0037] Some of the inventive concepts described herein relate to cooling systems comprising one or more cooling plates configured to circulate a working fluid for thermal management. In some configurations, the cooling plates may include internal channels that allow dielectric or other cooling fluids to flow through, thereby absorbing heat from a power module positioned in thermal communication with the cooling plate. In some cases, the heat-generating areas of the power module may be arranged in direct thermal communication with the cooling plate, facilitating efficient heat transfer without requiring the module to be fully submerged in the cooling fluid. Cooling plate configurations can provide a compact and efficient solution for managing high heat loads, thereby supporting increased power density in high-capacity power systems while maintaining consistent temperature control.
[0038] Some of the inventive concepts described herein relate to cooling systems that employ two-phase or multi-phase cooling technologies to provide thermal management capabilities. In some embodiments, the cooling flow path may hold the working fluid and circulate it through a separate channel or path. The heat-generating region of the power module may be mounted on an outer surface opposite the cooling flow path, thereby positioning the heat-generating region in thermal communication with the working fluid. As the working fluid absorbs heat from the power module, it can transform from a liquid phase to a vapor phase, rise to the condenser, and at the condenser return to a liquid form and recirculate through the cooling flow path. This configuration can establish a continuous heat dissipation cycle and support efficient thermal management for high-density power systems. In some cases, such a cooling system can support higher heat loads by reducing reliance on active cooling components, such as fans, which can help reduce noise and energy consumption.
[0039] Some of the inventive concepts represent advancements in thermal management for high-capacity power management systems. By combining liquid-based cooling technologies and / or two-phase cooling technologies, these concepts offer advantages in thermal performance and adaptability to a wide range of operating conditions. The disclosed technologies can provide potential benefits to UPS systems and other high-capacity power systems, enabling efficient thermal regulation in densely packed configurations and across diverse environments.
[0040] Some of the inventive concepts described herein relate to liquid-cooled architectures for uninterruptible power supplies (UPS) that can significantly improve thermal management and power density. Such architectures include cooling systems tailored to UPS configurations, including cold-plate cooling, single-phase cooling, and / or two-phase cooling. Cold-plate systems can utilize ethylene glycol (EGW) fluid circulation through cold plates thermally contacting the power modules, potentially increasing power density by approximately 1.2 times in some configurations. Single-phase cooling systems can employ dielectric fluid in thermal contact with the power module surface, reducing thermal resistance by removing the intermediate insulation layer, with some instances demonstrating reductions of up to 90%. This configuration can achieve improvements such as a two-fold increase in power density and supports UPS capacities in the range of several megawatts, including up to 3MW in certain implementations. Two-phase systems can use Novec 7200 dielectric liquid for phase-change cooling, where the fluid vaporizes after absorbing heat, exhibiting a potential power density increase of up to 2.5 times and supporting UPS capacities in several megawatts, such as up to 4.5MW in some implementations.
[0041] Exemplary cooling system Figure 1 An embodiment of a cooling system 100 for a high-density power system is illustrated. In this example, the cooling system 100 includes a cooling flow path 120 configured to retain and circulate a working fluid 122 to manage the heat load generated during operation by at least part of a plurality of power modules 110a, 110b (individually referred to as power module 110 or collectively as power module 110). The cooling flow path 120 provides a path for the working fluid 122 to flow in the vicinity of the power modules 110, thereby allowing efficient heat transfer.
[0042] Power systems (not shown) can be implemented in a variety of high-density power applications, including but not limited to data centers and industrial facilities. In some cases, the power system may be an uninterruptible power supply (UPS) system. In other cases, the power system may be configured to provide a stable power delivery to the connected loads, maintaining consistent power regulation and system reliability even during fluctuations or interruptions in the mains power supply.
[0043] Power module 110 can be configured to perform various functions related to power regulation, monitoring, and / or protection within a power system. For example, power module 110 can regulate power output, manage backup battery charging cycles, monitor operating parameters, or detect potential faults. In some cases, power module 110 can transmit status and diagnostics to external systems, thereby supporting continuous monitoring and maintenance of the power system.
[0044] Each power module 110 may include various components arranged to facilitate thermal management and functional organization. In some configurations, the power module 110 may utilize a design that integrates major heat-generating components such as power transistors, capacitors, and inductors into heat-generating regions 112a, 112b (individually or collectively referred to as heat-generating regions 112). Determining which components to include in the heat-generating regions may be based on objective factors such as heat output during typical operation, operating power levels, or energy dissipation characteristics.
[0045] Integrating heat-generating components into specific areas offers several advantages. This allows for targeted thermal management, concentrating cooling resources on areas of highest heat output, thereby reducing the need for system-wide heat dissipation measures. This design also simplifies thermal modeling and improves overall cooling efficiency by limiting the variability of heat distribution across the entire module.
[0046] In some configurations, heat-generating components may be confined to one side of the power module, while substantially non-heat-generating components (such as control circuitry, signal connections, or monitoring elements) are located on the opposite side, referred to as control interface sections 114a, 114b (individually or collectively referred to as control interface section 114). Alternatively, heat-generating and non-heat-generating components may be located on the same side of the power module but separated into different areas to generally maintain spatial or thermal isolation. Other layouts may include, but are not limited to, grouping heat-generating components near the center of the power module 110, while non-heat-generating components are arranged along the periphery. In another example, components may be located at opposite corners or opposite sides of the same face to further separate high-heat-output and low-heat-output areas.
[0047] like Figure 1 As shown, in some cases, the power module 110 can be arranged such that the heat-generating area 112 is positioned adjacent to the cooling flow path 120, while the control interface portion 114 is positioned away from the cooling flow path. This arrangement allows cooling resources to be concentrated on the area with the highest heat output, thereby achieving efficient thermal management of the heat-generating components. By integrating these components on one side of each power module, this design can facilitate a more compact arrangement of the power modules around the cooling flow path and reduce the need for cooling resources in other areas.
[0048] In some configurations, the control interface portion 114 may not require dedicated cooling because it is located away from the main heat transfer area. This separation allows for dense packaging of the power module while maintaining efficient heat dissipation. By arranging the cooling flow paths in direct thermal communication with the heat-generating area 112, this configuration improves thermal management efficiency where it is most needed, while reducing thermal exposure of the control interface portion 114 to maintain its functionality in high-density environments.
[0049] Cooling flow path 120 may include one or more paths within cooling system 100, which are designed to circulate working fluid 122 that absorbs and removes heat from power module 110. By guiding the working fluid 122 along paths adjacent to the heat-generating region 112 of power module 110, cooling flow path 120 manages the heat load in high-density power configurations. This design facilitates efficient heat exchange between heat-generating region 112 and working fluid 122, thereby helping to maintain stable operating temperatures and ensure reliable system performance.
[0050] Based on the cooling requirements and space arrangement of the power module 110, the cooling flow path 120 can be implemented in various structural configurations. In some cases, the cooling flow path 120 can be closed, allowing the working fluid 122 to circulate without direct contact with the power module 110. This closed configuration isolates the working fluid 122 while still enabling efficient heat transfer through thermal coupling with the heat-generating region 112. In some cases, the cooling flow path 120 may include multiple channels, which can be configured as generally horizontal channels, vertical columns, or angled paths to accommodate the fluid distribution layout throughout the system. In some cases, the cooling flow path 120 may include one or more cold plates, as described herein.
[0051] Arranging power modules 110 along or around a cooling flow path 120 may include positioning the power modules 110 on different sides of the cooling flow path 120, with a heat-generating region 112 on each power module 110 facing the cooling flow path 120. This arrangement may allow two or more power modules 110 to use the same common portion of the cooling flow path 120 for multi-sided thermal management. For example, power modules 110 may be stacked side-by-side along one side of the cooling flow path 120, forming a series of heat-generating regions 112 in direct thermal communication with the cooling flow path 120. Additional power modules 110 may also be positioned on the other side of the cooling flow path (e.g., adjacent side, opposite side), aligned or offset (e.g., diagonally) from the power modules 110 on the first side. In some cases, two, three, four or more power modules 110 may share a single segment of the cooling flow path. For example, two power modules 110 may be positioned on one side, stacked vertically, while another one or two power modules 110 are positioned on the opposite side, aligned or offset relative to the first group. This arrangement allows several power modules 110 to efficiently share the cooling capacity of the same section of the cooling flow path 120, utilizing its surface area to achieve efficient thermal connectivity and support compact, high-density system configurations.
[0052] Cooling flow path 120 is a path within the cooling system configured to circulate the working fluid, which absorbs heat and carries it away from the power module 110. By guiding the working fluid along a route adjacent to the heat-generating area 112 of the power module, cooling flow path 120 supports heat load management in high-density power configurations. This path is designed to facilitate heat exchange between the power module and the circulating fluid, thereby helping to maintain a stable operating temperature.
[0053] The working fluid 122 within the cooling flow path 120 can be selected to support efficient heat transfer and compatibility with system components. In some cases, the working fluid 122 can be a dielectric fluid, which can facilitate thermal contact with the heat-generating areas of the power module 110 without affecting electrical functionality. The working fluid 122 can flow through various channels and paths in the cooling flow path 120, absorbing heat as it moves toward adjacent heat-generating components. The working fluid 122 can be a blend, such as a mixture of water and ethylene glycol (EGW), or it can be another suitable coolant based on the system's thermal requirements. In some cases, the working fluid 122 circulates from the fluid inlet of the cooling flow path 120, flows along the heat-generating areas 112 of the power module, and is directed toward the thermal management unit 130 for heat dissipation.
[0054] The thermal management unit 130 may be in fluid communication with the cooling flow path 120 and may be configured to dissipate heat absorbed by the working fluid 122 as it circulates through the cooling system 100. In some cases, the cooling flow path 120 is in fluid communication with the thermal management unit 130 to facilitate continuous heat dissipation and fluid recirculation. In other cases, the thermal management unit 130 may function as a heat exchanger, transferring heat from the working fluid to the external environment, allowing the working fluid to cool before recirculating back through the cooling flow path 120. This continuous cycle of heat absorption and dissipation supports stable temperature regulation in high-density power configurations.
[0055] The thermal management unit 130 can be implemented in various forms, depending on the cooling requirements and design of the cooling system 100. For example, the thermal management unit 130 may include a radiator to release heat from the working fluid into the ambient air, or it may include a condenser to facilitate phase change cooling in a two-phase configuration. In some embodiments, the thermal management unit 130 may be configured as a liquid-to-gas or liquid-to-liquid heat exchanger to suit the specific heat dissipation requirements of the cooling system.
[0056] Figure 2AAn embodiment of a power module cold plate system 200 for implementing a cooling flow path is shown, the power module cold plate system including a cold plate 230 for managing heat loads in a high-density power configuration. In this example, the power module cold plate system 200 includes a plurality of power modules 210, each power module having a heat-generating region 212 and a normally non-heat-generating region 214. The heat-generating region 212 of each power module 210 is thermally coupled to (e.g., facing) the cold plate 230, thereby allowing heat to be transferred from the heat-generating region 212 of the power module to the cold plate 230.
[0057] The cold plate 230 is configured with an internal fluid flow path 220, allowing working fluid to flow through and absorb heat from the heating region 212 of the power module 210. The cold plate 230 includes a fluid inlet 232 and a fluid outlet 234, facilitating the entry and exit of the working fluid as it moves through the cold plate 230. In some cases, the internal fluid flow path 220 may include fins to increase the surface area available for heat transfer, thereby improving the cooling efficiency of the cold plate 230. In some embodiments, the cold plate 230 may be implemented without fins. The working fluid may be a dielectric fluid, such as a mixture of water and ethylene glycol (EGW), which flows through the internal fluid flow path 220 and absorbs heat from the cold plate 230 as it passes through it.
[0058] In some cases, the cold plate 230 is oriented generally horizontally, with the working fluid inlet 232 on one side and the working fluid outlet 234 on the opposite side, thereby facilitating lateral flow of the working fluid across the internal channels. In other cases, the cold plate 230 is oriented generally vertically, allowing the working fluid to flow from the lower inlet 232 to the upper outlet 234, thus utilizing gravity-assisted flow. In still other cases, the cold plate 230 is positioned at an angle, enabling the working fluid to flow diagonally, which may be based on the system layout facilitating fluid distribution or thermal interactions.
[0059] As shown in the figure, multiple power modules 210 can be positioned on a common cold plate 230. Although this example shows two power modules, additional modules can be accommodated depending on the design. This dual- or multi-seat arrangement enables a more compact, high-density configuration. In some cases, this arrangement can increase power density by approximately 1.2 to 1.5 times or more compared to a similarly rated air-cooled system. At least part of this improvement in power density can be attributed to the use of multiple sides of the cold plate 230 for heat dissipation, thereby allowing for more efficient utilization of the cooling surface area.
[0060] After flowing through the cold plate 230, the heated working fluid can be directed to an external thermal management unit (such as thermal management unit 130), such as a radiator or heat exchanger, which dissipates the absorbed heat into the surrounding environment. The thermal management unit can be in fluid communication with both the working fluid outlet and inlet of the cold plate, thereby allowing the working fluid to cool before re-entering the cold plate 230, thus maintaining the circulation of heat transfer.
[0061] Figure 2B An alternative implementation of the power module cold plate system 201 is shown, which uses a cold plate 280 to manage the heat load in a high-density power configuration, similar to... Figure 2A The configuration shown. The power module cold plate system 201 can be Figure 2A An embodiment of the power module cold plate system 200 is described. In this embodiment, the power module cold plate system 201 includes a plurality of power modules 214, each power module having a heating area 262 located adjacent to the cold plate 280 and a normally non-heating area 264. The cold plate 280 includes an internal fluid flow path 270 that allows working fluid to flow through it and absorb heat from the heating area of the power module.
[0062] and Figure 2A This embodiment illustrates a different arrangement for the normally non-heating region 264. The normally non-heating region 264 may include components such as monitoring or control circuitry, which may be positioned at various locations surrounding the cold plate 280, such as... Figure 2B As shown. Although an alternative arrangement of control modules is used, the general function of the power module cold plate system 201 remains the same, in which the working fluid enters and exits through inlets and outlets on the cold plate 280, thereby allowing for efficient thermal management in high-density power applications.
[0063] like Figure 2B As shown, the working fluid exits the cold plate 280 and can be directed to an external thermal management unit (not shown), such as a radiator or heat exchanger, to dissipate the absorbed heat. This configuration provides flexibility in positioning the normally non-heating area 264 while maintaining efficient cooling of the heat-generating area 262 of the power module 214.
[0064] As shown in the figure, the heat-generating area 262 and the non-heat-generating area 264 of each power module 260 are located on the same surface of the power module 260 but on different sides. Furthermore, only the heat-generating area is connected to the cold plate 280. This configuration allows for efficient heat dissipation.
[0065] Figure 3 An embodiment of a cooling system 300 configured to manage the heat load in a high-density power system is shown. The cooling system 300 may be... Figure 1An embodiment of the cooling system 100. In this example, the cooling system 300 includes a series of power module cold plate systems 310 arranged in a stacked configuration. Each power module cold plate system 310 can be a separate... Figure 2A and Figure 2B The implementation of the power module cold plate system 200 or 201 is described herein. Each power module cold plate system 310 can be configured to be thermally coupled to the power module. The cooling system 300 facilitates the circulation of the working fluid to absorb and remove heat from the power module, thereby supporting temperature management in high-density power applications.
[0066] Cooling system 300 includes a fluid flow path 320 that allows working fluid to continuously circulate through the components of the system. For example, a pump 332 can facilitate the propulsion of working fluid through cooling system 300, directing it to inlet manifold 338. Inlet manifold 338 distributes working fluid to each power module cold plate system 310. In some cases, this arrangement can help maintain uniform cooling throughout cooling system 300 because each power module cold plate system 310 receives a controlled flow of working fluid in thermal contact with the heated surface.
[0067] After the working fluid passes through the power module cold plate system 310 and absorbs heat, it exits via the outlet manifold 339. The heated working fluid is then directed to the radiator 334, where it releases the heat absorbed by the working fluid into the surrounding environment. The radiator 334 can operate in conjunction with a fan 336, which facilitates airflow across the radiator surface, thereby increasing the heat dissipation rate. This combination of radiator 334 and fan 336 supports thermal management by rapidly dissipating heat from the working fluid.
[0068] After being cooled by radiator 334, the working fluid returns to pump 332 for repeated circulation, thereby contributing to the continuous cooling of the power module cold plate system 310. This closed-loop fluid path 320 allows cooling system 300 to maintain a stable operating temperature of power module cold plate system 310, thus supporting efficient thermal regulation in high-density configurations.
[0069] Figure 4A An embodiment of the cooling system 401 is shown, wherein the power module cold plate system 420 is arranged in a stacked configuration. The cooling system 401 can be respectively Figure 1 or Figure 3The cooling system 100 or 300 is implemented as follows. As described herein, each power module 410 can be thermally coupled to a cold plate 430. The cold plate 430 is configured to allow working fluid to circulate through internal channels, thereby enabling heat transfer from the heat-generating areas of the power module 410 to the working fluid. The heated working fluid exits the cold plate 430 and is guided to a heat sink 434, where heat is dissipated into the surrounding environment. This stacked configuration of the power module cold plate system 420 allows for compact, high-density thermal management.
[0070] Figure 4B It shows Figure 4A A side view of the cooling system 401. The system 401 includes multiple power modules 410, each of which is thermally coupled to a corresponding cold plate 430. The cold plate 430 facilitates the flow of working fluid from the inlet to the radiator 434, where heat absorbed from the power modules 410 is dissipated into the surrounding environment.
[0071] Figure 4C An example cross-section of the cold plate 430 is shown. The cold plate 430 is part of the power module cold plate system 420 and includes designated coupling regions 431, 432 configured to thermally interface with the heat-generating regions of the power module 410. These designated regions on the cold plate 430 represent locations where the heat-generating regions of the power module 410 can directly contact the cold plate for thermal communication.
[0072] Exemplary two-phase cooling system Figure 5 An embodiment of a two-phase cooling system 500 for managing heat load in a high-density power configuration is shown. The cooling system 500 can be respectively... Figure 1 , Figure 3 , Figure 4A or Figure 4B Implementations of cooling systems 100, 300, 400, or 401. In this example, cooling system 500 includes a plurality of power modules 510, each power module having a heat-generating area 512. In some implementations, the power modules 510 may be replaced by a power module cold plate system, such as... Figure 2A and Figure 2B The power module cold plate system 200 or 201. The power module 510 is arranged near the cooling flow path 520, which is configured to circulate the working fluid to absorb and dissipate heat from the heat-generating area 512.
[0073] The cooling flow path 520 includes a dielectric working fluid that absorbs heat from the heat-generating region 512 of the power module 510. In some cases, the working fluid can change from a liquid phase to a vapor phase as it absorbs heat. This vaporized working fluid then rises from the cooling flow path 520 into a vapor space 540 positioned above the power module 510.
[0074] A condenser 550 is located adjacent to the steam space 540 and is in thermal communication with the steam space. The vaporized working fluid enters the condenser 550, where it is cooled and condensed back into the liquid phase. The condensed working fluid then returns to the cooling flow path 520, continuing the continuous cycle of heat absorption, vaporization, condensation, and recirculation.
[0075] In some configurations, the cooling flow path 520 may include internal channels 522 to guide the flow of the working fluid, thereby allowing efficient heat transfer between the power module 510 and the working fluid. Enclosed designs, for example, can advantageously aid thermal management by isolating the working fluid within a defined path and directing heat transfer primarily to the heat-generating region 512. In some cases, at least a portion of the power module 510 may be disposed within the cooling flow path 520, allowing the working fluid to directly contact the power module 510.
[0076] In some cases, the vertical orientation of the cooling flow path, combined with the constrained design of the cooling channels, reduces the volume of dielectric working fluid required for efficient thermal management. This efficient use of two-phase fluids reduces coolant volume while maintaining high thermal performance. The constrained vertical volume allows the fluid to vaporize and condense within a controlled space, enabling precise thermal conditioning and reducing the overall coolant requirement of the system. This design not only enhances system compactness but also reduces the maintenance complexity and operating costs associated with managing large fluid volumes.
[0077] Cooling system 500 may include a heat exchanger 560 in fluid communication with condenser 550. Heat exchanger 560 can dissipate residual heat from the working fluid before it re-enters the cooling flow path 520. This arrangement allows the working fluid to return to the cooling flow path 520 in a cooled state, ready to absorb additional heat from power module 510. By allowing the working fluid to transition between liquid and vapor phases, cooling system 500 advantageously dissipates heat from power module 510, supporting stable operation under high heat loads.
[0078] Figure 6A and Figure 6B Side view and three-dimensional perspective view of an embodiment of a two-phase cooling system 600 are shown, respectively. This two-phase cooling system is designed to manage heat loads within a high-density power configuration. The cooling system 600 can be respectively... Figure 1 , Figure 3 , Figure 4A , Figure 4B or Figure 5 Implementation of cooling systems 100, 300, 400, 401 or 500.
[0079] The cooling system 600 includes a series of power modules 610, each configured with a heat-generating area located adjacent to the cooling channel 632. In this example, the power modules 610 are stacked vertically along the channel wall to form a dense arrangement suitable for high-power applications.
[0080] Cooling passage 632 includes a dielectric working fluid that absorbs heat from the heat-generating areas of power module 610. As the working fluid absorbs heat, it changes from a liquid phase to a vapor phase. The vaporized fluid rises into a vapor space 640 positioned above power module 610, where it is contained before entering condenser 650.
[0081] The condenser 650 is in thermal communication with the vapor space 640 and condenses the vaporized working fluid back into the liquid phase. The condensed fluid then flows downward back into the reservoir 670, which is in fluid communication with the cooling passage 632. The working fluid is recirculated from the reservoir 670 through the passage, thus forming a continuous cycle of heat absorption, vaporization, condensation, and recirculation within the system.
[0082] Heat exchanger 660 is positioned adjacent to reservoir 670 to dissipate residual heat from the working fluid before it re-enters cooling channel 632. Heat exchanger 660 helps maintain a stable temperature within the system by allowing the working fluid to return to the channel in a cooled state, ready to absorb additional heat from power module 610.
[0083] Figure 7A Exemplary total UPS power capacities achieved through various cooling configurations are illustrated. The figure compares an existing air-cooled system supporting approximately 1.5 MW capacity with an exemplary implementation of the disclosed liquid-based cooling method. Systems utilizing cold plates cooled by a fluid of ethylene glycol and water (EGW) can support approximately 1.8 MW capacity. In some cases, the disclosed single-phase cooling can extend the potential capacity to approximately 3 MW or greater, while the disclosed two-phase cooling system can achieve capacities up to approximately 4.5 MW or greater. These examples highlight the adaptability of the liquid-based cooling method to achieve higher power capacities in different configurations.
[0084] Using an air-cooled system as a baseline, normalized to 1x, systems incorporating cold plate cooling showed approximately 1.2x improvement. Single-phase cooling provided further enhancements, reaching about 2x of the baseline, while two-phase immersion cooling could support up to approximately 2.5x or more of increase. These results illustrate how liquid-based cooling systems can support higher power densities, providing a flexible and scalable solution for uninterruptible power supply (UPS) configurations.
[0085] Additional considerations Unless otherwise specified, conjunctions such as “at least one of X, Y, and Z” should be understood in context as generally used to convey that an item, term, etc., may be X, Y, or Z. Therefore, such conjunctions are not generally intended to imply that some implementation requires at least one of X, at least one of Y, and at least one of Z to be present individually.
[0086] Unless otherwise specifically stated or otherwise understood in the context in which they are used, conditional language such as “can,” “may,” “may,” or “may” is generally intended to convey that certain implementations include certain features, elements, and / or steps that are not included in other implementations. Therefore, such conditional language is not generally intended to imply that features, elements, and / or steps are necessary in any way for one or more implementations, or that one or more implementations must include logic for determining whether such features, elements, and / or steps are included in any particular implementation or will be performed in any particular implementation, with or without user input or prompting.
[0087] Unless the context explicitly requires otherwise, throughout the specification and claims, the words “comprising,” “including,” etc., shall be interpreted in an inclusive sense, not an exclusive or exhaustive sense; that is, in the sense of “including but not limited to.” As used herein, the terms “connection,” “coupled,” or any variation thereof mean any direct or indirect connection or coupling between two or more elements; the coupling or connection between elements may be physical, logical, or a combination thereof. Additionally, when used in this application, the words “this article,” “above,” “below,” and words with similar meanings refer to the entire application and not any particular part of it. Where the context permits, singular or plural words used in the above detailed description may also include the plural or singular, respectively. Regarding a list of two or more items, the word “or” covers all of the following interpretations: any one item in the list, all items in the list, and any combination of items in the list. Similarly, regarding a list of two or more items, the term “and / or” covers all of the following interpretations: any one item in the list, all items in the list, and any combination of items in the list.
[0088] Depending on the implementation, certain runs, actions, events, or functions of any algorithm described herein may be executed in a different order, or may be added, combined, or omitted entirely (e.g., not all runs, actions, events, or functions are necessary for the practice of the algorithm). Furthermore, in some implementations, runs, actions, functions, or events may be executed concurrently, for example, through multithreading, interrupt handling, or on multiple processors or processor cores or other parallel architectures, rather than sequentially.
[0089] The systems and modules described herein may include software, firmware, hardware, or any combination of software, firmware, or hardware suitable for the purposes described herein. The software and other modules may reside and execute on servers, workstations, personal computers, computerized tablets, PDAs, and other computing devices suitable for the purposes described herein. The software and other modules may be accessed via local storage, via a network, via a browser, or via other means suitable for the purposes described herein. The data structures described herein may include computer files, variables, programming arrays, programming structures, or any electronic information storage scheme or method, or any combination thereof, suitable for the purposes described herein. The user interface elements described herein may include elements from graphical user interfaces, interactive voice responses, command-line interfaces, and other suitable interfaces.
[0090] Furthermore, the processing of the various components of the illustrated system can be distributed across multiple machines, networks, and other computing resources. Additionally, two or more components of the system can be combined into fewer components. The various components of the illustrated system can be implemented in one or more virtual machines, rather than in dedicated computer hardware systems and / or computing devices. Similarly, the data storage devices shown can represent physical and / or logical data storage, including, for example, storage area networks or other distributed storage systems. Furthermore, the connections between the illustrated components can represent possible paths for data flow, rather than actual connections between hardware components. While some examples of possible connections are shown, in various implementations, any subset of the illustrated components can communicate with any other subset of the components.
[0091] The embodiments have also been described above with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products. Each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. Such instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, a specially equipped computer (e.g., including a high-performance database server, a graphics subsystem, etc.), or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the actions specified in the flowchart and / or one or more block diagram blocks.
[0092] These computer program instructions may also be stored in a non-transitory computer-readable storage medium that can instruct a computer or other programmable data processing apparatus to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including means of instruction that implement the actions specified in the flowchart and / or one or more block diagram blocks. The computer program instructions may also be loaded onto a computing device or other programmable data processing apparatus to cause a series of operations to be performed on the computing device or other programmable apparatus to produce a computer-implemented process, such that the instructions, which execute on the computer or other programmable apparatus, provide steps for implementing the actions specified in the flowchart and / or one or more block diagram blocks.
[0093] Any patents and applications mentioned above, as well as other references (including any patents and applications and other references that may be listed in the accompanying application documents), are incorporated herein by reference. If necessary, aspects of this disclosure may be modified to incorporate the systems, functions, and concepts of the various references described above to provide further implementations of this disclosure.
[0094] These and other changes can be made based on the detailed description above. While the foregoing description describes certain examples of this disclosure and outlines the expected best practices, however detailed the foregoing may appear in the text, this disclosure can be practiced in many ways. The details of the system can vary significantly in its specific implementations while still being covered by the disclosure herein. As noted above, specific terms used when describing certain features or aspects of this disclosure should not be construed as implying that such terms are redefined herein as limited to any particular characteristic, feature, or aspect of the disclosure associated with that term. Generally, terms used in the appended claims should not be construed as limiting this disclosure to the specific examples disclosed in the specification, unless such terms are expressly defined in the detailed description section above. Therefore, the actual scope of this disclosure covers not only the disclosed examples but also all equivalent ways of practicing or implementing this disclosure according to the claims.
Claims
1. A cooling system for a high-density power system, the cooling system comprising: The cooling flow path includes multiple columns, which are configured to maintain and circulate the dielectric working fluid in a liquid phase. Multiple power modules, each power module including a heating area and a control interface portion, wherein the heating area of the power module is located on opposite sides of each column and directly faces the dielectric working fluid inside the column; The steam space is positioned above the cooling flow path; and The condenser is in thermal communication with the steam space. In the cooling flow path, the dielectric working fluid absorbs heat from the heating area of the power module and changes from the liquid phase to the vapor phase. The vaporized dielectric working fluid rises from the cooling flow path into the vapor space, and the condenser condenses the vaporized dielectric working fluid back into the liquid phase and returns the condensed dielectric working fluid to the cooling flow path.
2. The cooling system according to claim 1, wherein, Each of the pillars includes an internal channel structure configured to guide the flow of the dielectric working fluid within the pillar.
3. The cooling system according to any one of claims 1 and 2, wherein, The power modules are arranged in a stacked configuration along each of the columns, wherein the heat-generating regions of the power modules are arranged in vertical series on opposite sides of the cooling flow path.
4. The cooling system according to any one of claims 1 to 3, wherein, Each of the power modules is configured to have no insulation layer on the heating area, thereby allowing direct thermal contact between the heating area and the dielectric working fluid within each of the pillars.
5. The cooling system according to any one of claims 1 to 4, further comprising a manifold structure near the top of each of the columns, the manifold structure being configured to guide the vaporized dielectric working fluid from the plurality of the columns into the condenser.
6. The cooling system according to any one of claims 1 to 5, wherein, Each of the pillars includes an internal cooling volume configured to hold the dielectric working fluid, wherein the heat-generating region of the power module is located on the outer surface of the pillar and thermally coupled to the dielectric working fluid within the internal cooling volume.
7. The cooling system according to claim 6, wherein, The power modules are mounted along opposite outer surfaces of each of the pillars, wherein the heat-generating regions of the power modules are arranged such that heat is transferred through the walls of the pillars to the dielectric working fluid housed within the internal cooling volume.
8. The cooling system according to any one of claims 1 to 7, wherein, The column is oriented substantially vertically.
9. The cooling system according to any one of claims 1 to 8, wherein, The high-density power system includes an uninterruptible power supply (UPS) system.
10. A cooling system for a high-density power system, the cooling system comprising: A cold plate having a fluid inlet and a fluid outlet, the cold plate defining an internal fluid channel configured to circulate a dielectric working fluid; Multiple power modules, each power module including a heating area and a control interface portion, wherein the heating area of the power module is mounted along the opposite outer surface of the cold plate, and wherein the heating areas are arranged to transfer heat through the wall of the cold plate to the dielectric working fluid in the internal fluid channel; A heat exchanger is in fluid communication with the working fluid outlet and the working fluid inlet of the cold plate, the heat exchanger being configured to dissipate heat absorbed by the dielectric working fluid as the dielectric working fluid circulates through the heat exchanger and returns to the cold plate.