Optical interconnect module, optical interconnect device, and computing system

Abstract

This disclosure provides an optical interconnect module, an optical interconnect device, and a computing system. The optical interconnect module includes a photonic integrated circuit chip and a transceiver chip. The photonic integrated circuit chip includes a first optical switching section and a second optical switching section. The first optical switching section includes a plurality of first optical switching input ports, a plurality of first optical switching output ports, a plurality of second optical switching output ports, and a plurality of third optical switching output ports. An optical signal input from each first optical switching input port is selectively output from a corresponding one of the plurality of first optical switching output ports, a corresponding one of the plurality of second optical switching output ports, or a corresponding one of the plurality of third optical switching output ports. The second optical switching section includes a plurality of second optical switching input ports and a plurality of fourth optical switching output ports, each of the plurality of second optical switching input ports being connected to a corresponding one of the plurality of first optical switching output ports.

Description

Technical Field

[0001] This disclosure relates to the fields of optoelectronic communication and computing, and specifically to optical interconnect modules, optical interconnect devices including optical interconnect modules, and computing systems based on optical interconnect devices. Background Technology

[0002] With the development of artificial intelligence (AI), AI accelerator interconnect networks have become crucial for enhancing the computing power of computing hardware. In traditional AI accelerator interconnect networks, multiple computing modules are interconnected point-to-point on a printed circuit board (PCB) via PCB traces. However, due to distance limitations on the PCB, the computing scale of a single node is limited, typically to eight computing modules. Moreover, because PCB traces are fixed, the interconnections between computing modules cannot be reconfigured. Summary of the Invention

[0003] This disclosure provides an optical interconnect module that allows for rapid and flexible changes in the connections between computing modules, an optical interconnect device including the optical interconnect module, and a computing system with improved bandwidth utilization and scalability.

[0004] According to one aspect of this disclosure, an optical interconnect module is provided, including a photonic integrated circuit chip and a transceiver chip electrically connected to the photonic integrated circuit chip. The photonic integrated circuit chip includes an electro-optical conversion section, a first optical switching section, a second optical switching section, and a photoelectric conversion section. The electro-optical conversion section generates an optical signal output to the first optical switching section based on an electrical signal output from the transceiver chip. The first optical switching section includes a plurality of first optical switching input ports, a plurality of first optical switching output ports, a plurality of second optical switching output ports, and a plurality of third optical switching output ports. The optical signal input from each first optical switching input port selectively selects a corresponding port from one of the plurality of first optical switching output ports and another port from one of the plurality of second optical switching output ports. Corresponding to one or more of the third optical switching output ports, the second optical switching section includes multiple second optical switching input ports and multiple fourth optical switching output ports connected by reconfigurable optical paths. Each of the multiple second optical switching input ports of the second optical switching section is connected to a corresponding one of the multiple first optical switching output ports of the first optical switching section. The photoelectric conversion section includes multiple first optical input ports and multiple first electrical output ports. Optical signals input from the multiple first optical input ports are converted into electrical signals output from the multiple first electrical output ports to the transceiver chip. The first portions of the multiple first optical input ports are respectively connected to the multiple fourth optical switching output ports of the second optical switching section.

[0005] In some embodiments, the first optical switching section includes a plurality of first optical switching units and a plurality of second optical switching units. Each first optical switching unit includes a first optical switching input port, a first optical switching output port, and a fifth optical switching output port. An optical signal input from the first optical switching input port is selectively output from either the first optical switching output port or the fifth optical switching output port. Each second optical switching unit includes a third optical switching input port, a second optical switching output port, and a third optical switching output port. An optical signal input from the third optical switching input port is selectively output from either the second optical switching output port or the third optical switching output port. The third optical switching input port of each second optical switching unit is connected to the fifth optical switching output port of a corresponding first optical switching unit among the plurality of first optical switching units.

[0006] In some embodiments, the first optical switching section includes a plurality of first optical switching units, each first optical switching unit including a first optical switching input port, a first optical switching output port, a second optical switching output port and a third optical switching output port, wherein an optical signal input from the first optical switching input port is selectively output from the first optical switching output port, the second optical switching output port or the third optical switching output port.

[0007] In some embodiments, the photonic integrated circuit chip further includes a first optical coupler, a second optical coupler, a third optical coupler, and a fourth optical coupler. The first optical coupler is connected to the plurality of second optical switching output ports of the first optical switching section, the second optical coupler is connected to the plurality of third optical switching output ports of the first optical switching section, the third optical coupler is connected to a second portion of the plurality of first optical input ports of the photoelectric conversion section, and the fourth optical coupler is connected to a third portion of the plurality of first optical input ports of the photoelectric conversion section.

[0008] In some embodiments, the first optical switching section further includes a plurality of sixth optical switching output ports and a plurality of seventh optical switching output ports, and optical signals input from each first optical switching input port of the first optical switching section are selectively output from a corresponding one of the plurality of first optical switching output ports, a corresponding one of the plurality of second optical switching output ports, a corresponding one of the plurality of third optical switching output ports, a corresponding one of the plurality of sixth optical switching output ports, or a corresponding one of the plurality of seventh optical switching output ports.

[0009] In some embodiments, the first optical switching section includes a plurality of first optical switching units, a plurality of second optical switching units, a plurality of third optical switching units, and a plurality of fourth optical switching units. Each first optical switching unit includes a first optical switching input port, a first optical switching output port, and a fifth optical switching output port. An optical signal input from the first optical switching input port is selectively output from either the first or fifth optical switching output port. Each second optical switching unit includes a third optical switching input port, an eighth optical switching output port, and a ninth optical switching output port. An optical signal input from the third optical switching input port is selectively output from either the eighth or ninth optical switching output port. The third optical switching input port of each second optical switching unit is connected to the fifth optical switching output port of a corresponding first optical switching unit among the plurality of first optical switching units. Each third optical switching unit includes a fourth optical switching input port, a second optical switching output port, and a third optical switching output port. Optical signals input from the fourth optical switching input port are selectively output from either the second or third optical switching output port. The fourth optical switching input port of each third optical switching unit is connected to the eighth optical switching output port of a corresponding second optical switching unit among the plurality of second optical switching units. Each fourth optical switching unit includes a fifth optical switching input port, a sixth optical switching output port, and a seventh optical switching output port. Optical signals input from the fifth optical switching input port are selectively output from either the sixth or seventh optical switching output port. The fifth optical switching input port of each fourth optical switching unit is connected to the ninth optical switching output port of a corresponding second optical switching unit among the plurality of second optical switching units.

[0010] In some embodiments, the first optical switching section includes a plurality of first optical switching units, each first optical switching unit including a first optical switching input port, a first optical switching output port, a second optical switching output port, a third optical switching output port, a sixth optical switching output port, and a seventh optical switching output port, wherein an optical signal input from the first optical switching input port is selectively output from the first optical switching output port, the second optical switching output port, the third optical switching output port, the sixth optical switching output port, or the seventh optical switching output port.

[0011] In some embodiments, the photonic integrated circuit chip further includes a first optical coupler, a second optical coupler, a third optical coupler, a fourth optical coupler, a fifth optical coupler, a sixth optical coupler, a seventh optical coupler, and an eighth optical coupler. The first optical coupler is connected to the plurality of second optical switching output ports of the first optical switching section, the second optical coupler is connected to the plurality of third optical switching output ports of the first optical switching section, the third optical coupler is connected to the second portion of the plurality of first optical input ports of the photoelectric conversion section, the fourth optical coupler is connected to the third portion of the plurality of first optical input ports of the photoelectric conversion section, the fifth optical coupler is connected to the plurality of sixth optical switching output ports of the first optical switching section, the sixth optical coupler is connected to the plurality of seventh optical switching output ports of the first optical switching section, and the seventh optical coupler is connected to the fourth portion of the plurality of first optical input ports of the photoelectric conversion section. The eighth optical coupler is connected to the fifth portion of the plurality of first optical input ports of the photoelectric conversion section.

[0012] In some embodiments, the electro-optical conversion section includes a plurality of optical modulators, which are used to modulate an optical carrier input to the plurality of optical modulators into an optical signal output to the first optical switching section based on an electrical signal output by the transceiver chip.

[0013] In some embodiments, the photoelectric conversion section further includes a plurality of photodetectors, which are used to convert optical signals input from the plurality of first optical input ports of the photoelectric conversion section into electrical signals output to the transceiver chip.

[0014] In some embodiments, the photoelectric conversion section further includes a plurality of fifth optical switching units. The plurality of first optical input ports of the photoelectric conversion section include a first part, a second part, and a third part. Each fifth optical switching unit is used to selectively transmit an optical signal output from a corresponding first optical input port in the first part, a corresponding first optical input port in the second part, or a corresponding first optical input port in the third part to a corresponding one of the plurality of photodetectors.

[0015] In some embodiments, the photonic integrated circuit chip further includes a plurality of wavelength multiplexers, each wavelength multiplexer including a plurality of second optical input ports and a second optical output port. Light of different wavelengths from the electro-optical conversion module is input from the plurality of second optical input ports of each wavelength multiplexer and output from the second optical output port of each wavelength multiplexer, and the second optical output port of each wavelength multiplexer is connected to a corresponding one of the plurality of first optical switching input ports of the first optical switching section.

[0016] In some embodiments, the photonic integrated circuit chip further includes a plurality of demultiplexers, each demultiplexer including a third optical input port and a plurality of third optical output ports. Light of different wavelengths from outside the optical interconnect module or from the second optical switching section of the optical interconnect module is input from the third optical input port of each demultiplexer and output from the plurality of third optical output ports of each demultiplexer, and the plurality of third optical output ports of each demultiplexer are connected to a corresponding first optical input port among the plurality of first optical input ports of the photoelectric conversion section.

[0017] In some embodiments, each of the first optical switching unit and the second optical switching unit includes: a first beam splitter, including a fourth optical input port and two fourth optical output ports; a second beam splitter, including two fifth optical input ports and two fifth optical output ports; and two phase shifters, respectively connected between the two fourth optical output ports of the first beam splitter and the two fifth optical input ports of the second beam splitter.

[0018] In some embodiments, the second optical switching section includes a plurality of sixth optical switching units, each sixth optical switching unit including: a third beam splitter including two sixth optical input ports and two sixth optical output ports; a fourth beam splitter including two seventh optical input ports and two seventh optical output ports; and two phase shifters respectively connected between the two sixth optical output ports of the third beam splitter and the two seventh optical input ports of the fourth beam splitter.

[0019] In some embodiments, the optical interconnect module further includes a packaging substrate, wherein the photonic integrated circuit chip is disposed on the packaging substrate, the transceiver chip is flip-chip mounted on the surface of the photonic integrated circuit chip facing away from the packaging substrate, and the transceiver chip receives electrical signals from the outside of the optical interconnect module and transmits electrical signals to the outside of the optical interconnect module through conductive vias in the photonic integrated circuit chip.

[0020] In some embodiments, the optical interconnect module further includes a plurality of optical switching control electrical chips electrically connected to the photonic integrated circuit chip and used to control the first optical switching section and the second optical switching section to select the transmission path of the optical signal in the first optical switching section and the second optical switching section.

[0021] According to one aspect of this disclosure, an optical interconnect device is provided, comprising: a first printed circuit board (PCB); one or more of the aforementioned optical interconnect modules disposed on the first PCB; an electrical signal interface connected to a transceiver chip of the optical interconnect module; a first optical signal interface connected to a second portion of a plurality of second optical switching output ports of a first optical switching portion and a plurality of first optical input ports of a photoelectric conversion portion of a photonic integrated circuit chip of the optical interconnect module; and a second optical signal interface connected to a third portion of a plurality of third optical switching output ports of a first optical switching portion and a plurality of first optical input ports of a photoelectric conversion portion of the photonic integrated circuit chip of the optical interconnect module.

[0022] In some embodiments, the optical interconnect device further includes a third optical signal interface and a fourth optical signal interface, wherein the first optical switching section further includes a plurality of sixth optical switching output ports and a plurality of seventh optical switching output ports. Optical signals input from each first optical switching input port of the first optical switching section are selectively output from a corresponding one of the plurality of first optical switching output ports, a corresponding one of the plurality of second optical switching output ports, a corresponding one of the plurality of third optical switching output ports, a corresponding one of the plurality of sixth optical switching output ports, or a corresponding one of the plurality of seventh optical switching output ports. The third optical signal interface is connected to a fourth portion of the plurality of sixth optical switching output ports of the first optical switching section of the photonic integrated circuit chip of the optical interconnect module and the plurality of first optical input ports of the photoelectric conversion section, and the fourth optical signal interface is connected to a fifth portion of the plurality of seventh optical switching output ports of the first optical switching section of the photonic integrated circuit chip of the optical interconnect module and the plurality of first optical input ports of the photoelectric conversion section.

[0023] In some embodiments, the optical interconnect device further includes one or more re-timers arranged on a first PCB, connected between an electrical signal interface and the one or more optical interconnect modules, and used to convert a first electrical signal received from the electrical signal interface into a second electrical signal output to the one or more optical interconnect modules, and to convert a third electrical signal received from the one or more optical interconnect modules into a fourth electrical signal output from the electrical signal interface.

[0024] In some embodiments, the optical interconnect device further includes a light source module disposed on a first PCB and used to generate an optical carrier. The light source module is connected to the electro-optic conversion section of the photonic integrated circuit chip of each optical interconnect module, such that the optical carrier is output to the electro-optic conversion section and converted by the electro-optic conversion section into an optical signal output to the first optical switching section of the photonic integrated circuit chip.

[0025] According to one aspect of this disclosure, a computing system is provided, comprising: a plurality of computing devices, each computing device including a second printed circuit board (PCB), and a plurality of computing modules and a plurality of the aforementioned optical interconnect devices disposed on the second PCB; and at least one optical switch, wherein each computing device is optically interconnected with at least a portion of the optical switches in the at least one optical switch via one or more optical interconnect devices in each computing device, and at least a portion of the computing devices in the plurality of computing devices are optically interconnected with each other via the at least one optical switch.

[0026] In some embodiments, the at least one optical switch can reconstruct the optical link between the plurality of computing devices, enabling communication between any two of the plurality of computing devices.

[0027] In some embodiments, the plurality of computing devices includes a first computing device, a second computing device, and a third computing device, and the at least one optical switch is capable of establishing an optical link between a first portion of the plurality of optical interconnects of the first computing device and a portion of the plurality of optical interconnects of the second computing device, and establishing an optical link between a second portion of the plurality of optical interconnects of the first computing device and a portion of the plurality of optical interconnects of the third computing device, such that the first computing device communicates simultaneously with the second and third computing devices.

[0028] According to embodiments of this disclosure, the connection between computing modules can be changed quickly and flexibly through optical interconnect modules and optical interconnect devices including optical interconnect modules, and the topology can be switched quickly according to specific artificial intelligence models, thereby effectively improving bandwidth utilization and enhancing the scalability of artificial intelligence computing systems. Attached Figure Description

[0029] Figure 1A A schematic cross-sectional view of an example optical interconnect module according to an embodiment of the present disclosure is shown.

[0030] Figure 1B A schematic plan view of an example optical interconnect module according to an embodiment of the present disclosure is shown.

[0031] Figure 2A A schematic plan view of an example of a first switching portion of an optical interconnect module according to an embodiment of the present disclosure is shown.

[0032] Figure 2B A schematic plan view of another example of a first switching portion of an optical interconnect module according to an embodiment of the present disclosure is shown.

[0033] Figure 2CA schematic plan view of yet another example of a first switching portion of an optical interconnect module according to an embodiment of the present disclosure is shown.

[0034] Figure 3A A schematic plan view of another example of an optical interconnect module according to an embodiment of the present disclosure is shown.

[0035] Figure 3B A schematic plan view of yet another example of an optical interconnect module according to an embodiment of the present disclosure is shown.

[0036] Figure 4 A schematic plan view of an example of a second optical switching portion according to an embodiment of the present disclosure is shown.

[0037] Figure 5A A schematic plan view of an example optical switching unit of a first optical switching portion according to an embodiment of the present disclosure is shown.

[0038] Figure 5B A schematic plan view of an example optical switching unit of the second optical switching section according to an embodiment of the present disclosure is shown.

[0039] Figure 6A A schematic plan view of an example of an optical interconnect device according to an embodiment of the present disclosure is shown.

[0040] Figure 6B A schematic cross-sectional view of an example of an optical interconnect device according to an embodiment of the present disclosure is shown.

[0041] Figure 7 A schematic plan view of an example computing device according to an embodiment of the present disclosure is shown.

[0042] Figure 8 A schematic diagram of the topology between computing modules according to an embodiment of the present disclosure is shown.

[0043] Figure 9 A schematic plan view of an example computing system according to an embodiment of the present disclosure is shown. Detailed Implementation

[0044] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0045] It should be noted that the various components or parts described in the various embodiments of this disclosure are merely illustrative. In some cases, some components or parts may be omitted, or some components or parts may be replaced with other components or parts that have the same or similar functions, or additional components or parts may be added.

[0046] Furthermore, the various components or assemblies described in the different embodiments of this disclosure are merely for ease of description and do not imply actual physical separation or combination, nor do they imply that such separation or combination is necessary. Those skilled in the art can arbitrarily disassemble or combine the various components or assemblies according to actual needs.

[0047] Without departing from the inventive concept of this disclosure, any of the above variations or combinations fall within the protection scope of this disclosure.

[0048] Figure 1A A schematic cross-sectional view of an example of an optical interconnect module 100 according to an embodiment of the present disclosure is shown. Figure 1B A schematic plan view of an example of an optical interconnect module 100 according to an embodiment of the present disclosure is shown.

[0049] Reference Figure 1A According to embodiments of the present disclosure, the optical interconnect module 100 may include a photonic integrated circuit chip 110 and a transceiver chip 120 electrically connected to the photonic integrated circuit chip 110. According to embodiments of the present disclosure, the optical interconnect module 100 may further include a packaging substrate 130, with the photonic integrated circuit chip 110 disposed on the packaging substrate 130, and the transceiver chip 120 flip-chip mounted on the surface of the photonic integrated circuit chip 110 facing away from the packaging substrate 130. The transceiver chip 120 can receive electrical signals from outside the optical interconnect module 100 and transmit electrical signals to outside the optical interconnect module 100 through conductive vias 111 in the photonic integrated circuit chip 110.

[0050] The transceiver chip 120 can be used to convert a first electrical signal from the photonic integrated circuit chip 110 into a second electrical signal output to the outside of the optical interconnect module 100, and to convert a third electrical signal from the outside of the optical interconnect module 100 into a fourth electrical signal sent to the photonic integrated circuit chip 110. For example, the transceiver chip 120 can convert a first analog electrical signal from the photonic integrated circuit chip 110 into a first digital electrical signal output to the outside of the optical interconnect module 100, and convert a second digital electrical signal from the outside of the optical interconnect module 100 into a second analog electrical signal sent to the photonic integrated circuit chip 110. The photonic integrated circuit chip 110 may include an optical signal input port and an optical signal output port, and can communicate optically with external devices through an optical fiber 140 connected to the optical signal input port and the optical signal output port.

[0051] At the electrical connection between the power receiving / generating chip 120 and the photonic integrated circuit chip 110, bumps can be provided on the power receiving / generating chip 120 and / or the photonic integrated circuit chip 110 to achieve a good electrical connection. At the electrical connection between the photonic integrated circuit chip 110 and the packaging substrate 130, bumps can be provided on the photonic integrated circuit chip 110 and / or the packaging substrate 130 to achieve a good electrical connection.

[0052] According to embodiments of this disclosure, the materials used to form the photonic integrated circuit chip 110 may include silicon, silicon nitride, indium phosphide, gallium arsenide, lithium niobate, or combinations thereof, but the disclosure is not limited thereto. According to embodiments of this disclosure, the conductive vias 111 in the photonic integrated circuit chip 110 can be formed by etching the photonic integrated circuit chip 110 using an etching process to form through-holes in the photonic integrated circuit chip 110, and then filling the through-holes with conductive material using processes such as electroplating, physical vapor deposition, chemical vapor deposition, atomic layer deposition, etc.

[0053] Reference Figure 1B According to embodiments of the present disclosure, the photonic integrated circuit chip 110 may include an electro-optical conversion section 112, a first optical exchange section 114, a second optical exchange section 116, and a photoelectric conversion section 118.

[0054] The electro-optic conversion section 112 can generate an optical signal output to the first optical switching section 114 based on the fourth electrical signal output from the transceiver chip 120. According to embodiments of this disclosure, the electro-optic conversion section 112 may include a plurality of optical modulators 1121, which modulate the optical carrier L1 input to the plurality of optical modulators 1121 into an optical signal output to the first optical switching section 114 based on the fourth electrical signal output from the transceiver chip 120. According to embodiments of this disclosure, the photonic integrated circuit chip 110 may further include a light source input port, through which the optical carrier L1 is input to the plurality of optical modulators 1121. The optical modulators 1121 can modulate the amplitude, phase, and other characteristics of the optical carrier L1, thereby modulating the information carried in the electrical signal output from the transceiver chip 120 onto the optical carrier L1 to form an optical signal provided to the first optical switching section 114. Optionally, the optical carrier L1 modulated by the optical modulators 1121 can be generated internally within the optical interconnect module 100. In this configuration, the optical interconnect module 100 may not include a light source input port, but may instead include an optical transmitter for transmitting the optical carrier to be modulated. For example, the optical transmitter may be located in the photonic integrated circuit chip 110. Typical examples of the optical modulator 1121 may include integrated photonic modulators based on silicon, indium phosphide, thin-film lithium niobate, or polymers, and structurally may be micro-ring modulators, Mach-Zehnder modulators, or electroabsorption modulators. However, this disclosure is not limited thereto, and the optical modulator 1121 may be implemented using any suitable components in the art.

[0055] According to embodiments of this disclosure, a first optical switching section 114 may include a plurality of first optical switching input ports, a plurality of first optical switching output ports, a plurality of second optical switching output ports, and a plurality of third optical switching output ports. An optical signal input from each first optical switching input port is selectively output from a corresponding port among the plurality of first optical switching input ports, a corresponding port among the plurality of second optical switching output ports, or a corresponding port among the plurality of third optical switching output ports. The plurality of first optical switching input ports of the first optical switching section 114 may be connected to an electro-optical conversion section 112 to receive optical signals from the electro-optical conversion section 112. The plurality of first optical switching output ports of the first optical switching section 114 may be connected to a second optical switching section 116 to selectively transmit optical signals to the second optical switching section 116. The photonic integrated circuit chip 110 includes a first optical signal output port and a second optical signal output port. The plurality of second optical switching output ports of the first optical switching section 114 can be connected to the first optical signal output port of the photonic integrated circuit chip 110 to selectively transmit optical signals to the outside of the optical interconnect module 100 (e.g., another optical interconnect module), and the plurality of third optical switching output ports of the first optical switching section 114 can be connected to the second optical signal output port of the photonic integrated circuit chip 110 to selectively transmit optical signals to the outside of the optical interconnect module 100 (e.g., yet another optical interconnect module). Although Figure 1B The diagram shows a first optical switching section 114 comprising eight first optical switching input ports, eight first optical switching output ports, eight second optical switching output ports, and eight third optical switching output ports, but this disclosure is not limited thereto. The first optical switching section 114 may include other numbers of first optical switching input ports and a number of first to third optical switching output ports corresponding to the number of first optical switching input ports.

[0056] According to embodiments of this disclosure, the photonic integrated circuit chip 110 may further include a first optical coupler 1191 and a second optical coupler 1192. The first optical coupler 1191 may be connected between the plurality of second optical switching output ports of the first optical switching section 114 and the first optical signal output port of the photonic integrated circuit chip 110, and outputs the optical signal output from the plurality of second optical switching output ports of the first optical switching section 114 through the first optical signal output port of the photonic integrated circuit chip 110 via an external optical fiber to the outside of the optical interconnect module 100 (e.g., another optical interconnect module). The second optical coupler 1192 may be connected between the plurality of third optical switching output ports of the first optical switching section 114 and the second optical signal output port of the photonic integrated circuit chip 110, and outputs the optical signal output from the plurality of third optical switching output ports of the first optical switching section 114 through the second optical signal output port of the photonic integrated circuit chip 110 via an external optical fiber to the outside of the optical interconnect module 100 (e.g., yet another optical interconnect module).

[0057] According to embodiments of this disclosure, the second optical switching section 116 may include a plurality of second optical switching input ports and a plurality of fourth optical switching output ports connected via reconfigurable optical path connections, each of the plurality of second optical switching input ports of the second optical switching section 116 being connected to a corresponding one of the plurality of first optical switching output ports of the first optical switching section 114. According to embodiments of this disclosure, the second optical switching section 116 may be configured to selectively output an optical signal input from any one of the plurality of second optical switching input ports via at least one of the plurality of fourth optical switching output ports to change the output path of the optical signal, thereby changing the topology of the optical transmission network. Although Figure 1B The second optical switching section 116 is shown to include eight second optical switching input ports and eight fourth optical switching output ports, but this disclosure is not limited thereto. The second optical switching section 116 may include a number of second optical switching input ports and fourth optical switching output ports corresponding to the number of first optical switching output ports of the first optical switching section 114.

[0058] According to embodiments of this disclosure, the photoelectric conversion section 118 may include a plurality of first optical input ports and a plurality of first electrical output ports. Optical signals input from the plurality of first optical input ports can be converted into electrical signals output from the plurality of first electrical output ports to the transceiver chip 120. First portions of the plurality of first optical input ports are respectively connected to the plurality of fourth optical switching output ports of the second optical switching section 116 to selectively receive optical signals from the second optical switching section 116. The photonic integrated circuit chip 110 may include a first optical signal input port and a second optical signal input port. Second portions of the plurality of first optical input ports of the photoelectric conversion section 118 may be connected to the first optical signal input ports of the photonic integrated circuit chip 110 to selectively receive optical signals from outside the optical interconnect module 100 (e.g., another optical interconnect module). Third portions of the plurality of first optical input ports of the photoelectric conversion section 118 may be connected to the second optical signal input ports of the photonic integrated circuit chip 110 to selectively receive optical signals from outside the optical interconnect module 100 (e.g., yet another optical interconnect module).

[0059] According to embodiments of this disclosure, the photonic integrated circuit chip 110 may further include a third optical coupler 1193 and a fourth optical coupler 1194. The third optical coupler 1193 may be connected between a second portion of the plurality of first optical input ports of the photoelectric conversion section 118 and a first optical signal input port of the photonic integrated circuit chip 110, and transmits optical signals input from outside the optical interconnect module 100 (e.g., another optical interconnect module) via an external optical fiber through the first optical signal input port of the photonic integrated circuit chip 110 to the second portion of the plurality of first optical input ports of the photoelectric conversion section 118. The fourth optical coupler 1194 may be connected between a third portion of the plurality of first optical input ports of the photoelectric conversion section 118 and a second optical signal input port of the photonic integrated circuit chip 110, and transmits optical signals input from outside the optical interconnect module 100 (e.g., yet another optical interconnect module) via an external optical fiber through the second optical signal input port of the photonic integrated circuit chip 110 to the third portion of the plurality of first optical input ports of the photoelectric conversion section 118.

[0060] The photoelectric conversion section 118 can convert optical signals from external sources of the optical interconnect module 100 or the second optical switching section 116 into electrical signals provided to the transceiver chip 120. According to embodiments of this disclosure, the photoelectric conversion section 118 may include a plurality of photodetectors 1181. The plurality of photodetectors 1181 can be used to convert optical signals input from the plurality of first optical input ports of the photoelectric conversion section 118 into electrical signals output to the transceiver chip 120. The photodetectors 1181 may include microring detectors or various types of photodiodes, such as photomultiplier tubes (PMTs), avalanche photodiodes (APDs), silicon photomultiplier tubes (SiPMs), etc. However, this disclosure is not limited thereto, and the photodetectors 1181 may be implemented using any suitable components in the art.

[0061] According to embodiments of this disclosure, such as Figure 1B As shown, each first optical switching input port or each first optical switching unit 1141 of the first optical switching section 114 can correspond to an optical modulator 1121 in the electro-optical conversion section 112 and three photodetectors 1181 in the photoelectric conversion section 118. One of the three photodetectors 1181 is connected to the second optical switching section 116 to receive optical signals from the second optical switching section 116, another of the three photodetectors 1181 is connected to the third optical coupler 1193 to receive optical signals from outside the photonic integrated circuit chip 110, and the remaining one of the three photodetectors 1181 is connected to the fourth optical coupler 1194 to receive another optical signal from outside the photonic integrated circuit chip 110. Although Figure 1B The electro-optic conversion section 112 is shown to include eight optical modulators 1121 and the photoelectric conversion section 118 includes 24 photodetectors 1181, but this disclosure is not limited thereto. The number of optical modulators and photodetectors can be changed as needed.

[0062] In this application, the first optical switching section 114 of the photonic integrated circuit chip 110 includes multiple first optical switching output ports connected to the second optical switching section 116, multiple second optical switching output ports connected to the first optical coupler 1191, and multiple third optical switching output ports connected to the second optical coupler 1192, allowing the transmission path of the optical signal entering the photonic integrated circuit chip 110 to be selected in various ways. Therefore, in the case of assembling a large-scale computing system, the optical interconnect module 100 can provide a more flexible connection relationship to reduce the number of redundant devices in the computing system, thereby saving costs.

[0063] According to embodiments of this disclosure, such as Figure 1BAs shown, the first optical switching section 114 may include a plurality of first optical switching units 1141 and a plurality of second optical switching units 1142. Each first optical switching unit 1141 may include a first optical switching input port, a first optical switching output port, and a fifth optical switching output port. Optical signals input from the first optical switching input port may be selectively output from either the first optical switching output port or the fifth optical switching output port. Each second optical switching unit 1142 may include a third optical switching input port, a second optical switching output port, and a third optical switching output port. Optical signals input from the third optical switching input port may be selectively output from either the second optical switching output port or the third optical switching output port. The third optical switching input port of each second optical switching unit 1142 may be connected to the fifth optical switching output port of a corresponding first optical switching unit 1141 among the plurality of first optical switching units 1141. The internal structure of the first optical switching section 114 is not limited to... Figure 1B The structure shown can include various other configurations.

[0064] Figure 2A A schematic plan view of an example of a first switching portion 114A of an optical interconnect module according to an embodiment of the present disclosure is shown. Figure 2B A schematic plan view of another example of the first switching portion 114B of an optical interconnect module according to an embodiment of the present disclosure is shown. Figure 2C A schematic plan view of yet another example of a first switching portion 114C of an optical interconnect module according to an embodiment of the present disclosure is shown.

[0065] Reference Figure 2A According to embodiments of the present disclosure, the first optical switching section 114A may include a plurality of first optical switching units 1141A. Each first optical switching unit 1141A may include a first optical switching input port, a first optical switching output port, a second optical switching output port, and a third optical switching output port. An optical signal input from the first optical switching input port may be selectively output from the first optical switching input port, the second optical switching output port, or the third optical switching output port. Figure 1B Compared to the first optical switching section 114 shown, the first optical switching section 114A can include fewer optical switching units, thus reducing the number of components in the photonic integrated circuit chip and simplifying the internal structure of the photonic integrated circuit chip.

[0066] Reference Figure 2BIn addition to the first to third optical switching output ports, the first optical switching section 114B according to embodiments of the present disclosure may further include a plurality of sixth optical switching output ports and a plurality of seventh optical switching output ports. An optical signal input from each first optical switching input port of the first optical switching section 114B can be selectively output from a corresponding one of the plurality of first optical switching output ports, a corresponding one of the plurality of second optical switching output ports, a corresponding one of the plurality of third optical switching output ports, a corresponding one of the plurality of sixth optical switching output ports, or a corresponding one of the plurality of seventh optical switching output ports. In this case, with Figure 1B Compared to the embodiments shown, the optical signals entering the photonic integrated circuit chip have more selectable transmission paths, enabling the optical interconnect module 100 to provide more flexible interconnects. This further reduces the number of redundant devices in the computing system, thereby further saving costs.

[0067] According to embodiments of this disclosure, such as Figure 2BAs shown, the first optical switching section 114B according to an embodiment of the present disclosure may include a plurality of first optical switching units 1141B, a plurality of second optical switching units 1142B, a plurality of third optical switching units 1143B, and a plurality of fourth optical switching units 1144B. Each first optical switching unit 1141B may include a first optical switching input port, a first optical switching output port, and a fifth optical switching output port. An optical signal input from the first optical switching input port may be selectively output from either the first or fifth optical switching output port. Each second optical switching unit 1142B may include a third optical switching input port, an eighth optical switching output port, and a ninth optical switching output port. An optical signal input from the third optical switching input port may be selectively output from either the eighth or ninth optical switching output port. The third optical switching input port of each second optical switching unit 1142B may be connected to the fifth optical switching output port of a corresponding first optical switching unit 1141B among the plurality of first optical switching units 1141B. Each third optical switching unit 1143B may include a fourth optical switching input port, a second optical switching output port, and a third optical switching output port. Optical signals input from the fourth optical switching input port can be selectively output from either the second or third optical switching output port. The fourth optical switching input port of each third optical switching unit 1143B can be connected to the eighth optical switching output port of a corresponding second optical switching unit 1142B among a plurality of second optical switching units 1142B. Each fourth optical switching unit 1144B may include a fifth optical switching input port, a sixth optical switching output port, and a seventh optical switching output port. Optical signals input from the fifth optical switching input port can be selectively output from either the sixth or seventh optical switching output port. The fifth optical switching input port of each fourth optical switching unit 1144B can be connected to the ninth optical switching output port of a corresponding second optical switching unit 1142B among a plurality of second optical switching units 1142B.

[0068] Reference Figure 2C According to embodiments of the present disclosure, the first optical switching section 114C may include a plurality of first optical switching units 1141C. Each first optical switching unit 1141C may include a first optical switching input port, a first optical switching output port, a second optical switching output port, a third optical switching output port, a sixth optical switching output port, and a seventh optical switching output port. An optical signal input from the first optical switching input port may be selectively output from the first optical switching output port, the second optical switching output port, the third optical switching output port, the sixth optical switching output port, or the seventh optical switching output port. Figure 2BCompared to the first optical switching section 114B shown, the first optical switching section 114C may include fewer optical switching units, thus reducing the number of components in the photonic integrated circuit chip and simplifying the internal structure of the photonic integrated circuit chip.

[0069] In a photonic integrated circuit chip including a first optical switching section 114B or 114C, in addition to the first to fourth optical couplers 1191 to 1194, a fifth optical coupler 1195, a sixth optical coupler 1196, a seventh optical coupler (not shown), and an eighth optical coupler (not shown) may also be included. Furthermore, in a photonic integrated circuit chip including a first optical switching section 114B or 114C, in addition to the first and second optical signal output ports and the first and second optical signal input ports, a third and fourth optical signal output port and a third and fourth optical signal input port may also be included.

[0070] The fifth optical coupler 1195 can be connected between the plurality of sixth optical switching output ports of the first optical switching section 114B or 114C and the third optical signal output port of the photonic integrated circuit chip, and outputs the optical signal output from the plurality of sixth optical switching output ports of the first optical switching section 114B or 114C to the outside of the optical interconnect module via the third optical signal output port of the photonic integrated circuit chip through an external optical fiber. The sixth optical coupler 1196 can be connected between the plurality of seventh optical switching output ports of the first optical switching section 114B or 114C and the fourth optical signal output port of the photonic integrated circuit chip, and outputs the optical signal output from the plurality of seventh optical switching output ports of the first optical switching section 114B or 114C to the outside of the optical interconnect module via the fourth optical signal output port of the photonic integrated circuit chip through an external optical fiber. A seventh optical coupler (not shown) can be connected between the fourth portion of the plurality of first optical input ports of the photoelectric conversion section 118 and the third optical signal input port of the photonic integrated circuit chip, and transmits the optical signal input from outside the optical interconnect module via an external optical fiber through the third optical signal input port of the photonic integrated circuit chip to the fourth portion of the plurality of first optical input ports of the photoelectric conversion section 118. An eighth optical coupler (not shown) can be connected between the fifth portion of the plurality of first optical input ports of the photoelectric conversion section 118 and the fourth optical signal input port of the photonic integrated circuit chip, and transmits the optical signal input from outside the optical interconnect module via an external optical fiber through the fourth optical signal input port of the photonic integrated circuit chip to the fifth portion of the plurality of first optical input ports of the photoelectric conversion section 118.

[0071] It should be understood that Figure 1B , Figure 2A , Figure 2B and Figure 2CThe first optical switching section shown is merely an example, and this disclosure is not limited thereto; the first optical switching section may include other structures.

[0072] Figure 3A A schematic plan view of another example of an optical interconnect module according to an embodiment of the present disclosure is shown.

[0073] Reference Figure 3A According to embodiments of this disclosure, the photoelectric conversion section 118D may further include a plurality of fifth optical switching units 1182. The plurality of first optical input ports of the photoelectric conversion section 118D may include a first part, a second part, and a third part, and each fifth optical switching unit 1182 may be used to selectively transmit an optical signal output from a corresponding first optical input port in the first part, a corresponding first optical input port in the second part, or a corresponding first optical input port in the third part to a corresponding one of the plurality of photodetectors 1181.

[0074] According to embodiments of this disclosure, such as Figure 3A As shown, each photodetector 1181 can be connected to the third optical coupler 1193, the fourth optical coupler 1194, and the second optical switching section 116 via one of the multiple fifth optical switching units 1182. Each fifth optical switching unit 1182 can selectively transmit optical signals from the second optical switching section 116, the third optical coupler 1193, or the fourth optical coupler 1194 to a corresponding photodetector 1181.

[0075] By including the fifth optical switching unit 1182, each photodetector 1181 of the photoelectric conversion section 118D can receive optical signals from the second optical switching section 116, the third optical coupler 1193, and the fourth optical coupler 1194 at different times, thus reducing the number of photodetectors 1181 in the photoelectric conversion section 118D.

[0076] Figure 3B A schematic plan view of another example of an optical interconnect module according to an embodiment of the present disclosure is shown.

[0077] Reference Figure 3BThe photonic integrated circuit chip 110E according to embodiments of the present disclosure may further include a plurality of wavelength multiplexers 113. Each wavelength multiplexer 113 may include a plurality of second optical input ports and a second optical output port. Light of different wavelengths from the electro-optical conversion module 112 may be input from the plurality of second optical input ports of each wavelength multiplexer 113 and output from the second optical output port of each wavelength multiplexer 113. The second optical output port of each wavelength multiplexer 113 may be connected to a corresponding one of the plurality of first optical switching input ports of the first optical switching section 114.

[0078] According to embodiments of this disclosure, each first optical switching input port or each first optical switching unit 1141 of the first optical switching section 114 can be connected to a group of optical modulators 1121 among a plurality of optical modulators 1121 in the electro-optical conversion section 112 via a wavelength multiplexer 113. Specifically, each of the plurality of second optical input ports of each wavelength multiplexer 113 can be connected to one optical modulator 1121, and each second optical output port of each wavelength multiplexer 113 can be connected to one first optical switching input port of the first optical switching section 114.

[0079] According to embodiments of this disclosure, different modulators in each group of optical modulators 1121 can modulate optical carriers of different wavelengths. Each optical modulator 1121 can modulate the optical carrier L1 according to the electrical signal received from the transceiver chip 120, thereby modulating the information carried by the electrical signal onto the optical carrier L1 to output an optical signal carrying the information. Each wavelength multiplexer 113 can integrate the optical signals of different wavelengths output by a corresponding group of optical modulators 1121 into a single optical signal. The transmission path of this optical signal is selected by the first optical switching section 114 to transmit to the second optical switching section 116, to the outside of the optical interconnect module 100 via the first optical coupler 1191, or to the outside of the optical interconnect module 100 via the second optical coupler 1192.

[0080] The photonic integrated circuit chip 110E according to embodiments of the present disclosure may further include a plurality of demultiplexers 115. Each demultiplexer 115 may include a third optical input port and a plurality of third optical output ports. Light of different wavelengths from outside the optical interconnect module 100 or from the second optical switching section 116 of the optical interconnect module 100 is input from the third optical input port of each demultiplexer 115 and output from the plurality of third optical output ports of each demultiplexer 115, respectively. The plurality of third optical output ports of each demultiplexer 115 may be connected to a corresponding first optical input port among the plurality of first optical input ports of the photoelectric conversion section 118.

[0081] According to embodiments of this disclosure, the plurality of demultiplexers 115 may include a first group of demultiplexers 115, a second group of demultiplexers 115, and a third group of demultiplexers 115. The first group of demultiplexers 115 may be connected between the plurality of fourth optical switching output ports of the second optical switching section 116 and a first portion (e.g., a first portion of the plurality of photodetectors 1181) of the plurality of first optical input ports of the photoelectric conversion section 118. The second group of demultiplexers 115 may be connected between a first optical signal input port of the photonic integrated circuit chip 110 and a second portion of the plurality of first optical input ports of the photoelectric conversion section 118, for example, between a third optical coupler 1193 and a second portion of the plurality of photodetectors 1181. The third group of demultiplexers 115 may be connected between a second optical signal input port of the photonic integrated circuit chip 110 and a third portion of the plurality of first optical input ports of the photoelectric conversion section 118, for example, between a fourth optical coupler 1194 and a third portion of the plurality of photodetectors 1181. Optical signals of different wavelengths from the external optical interconnect module 100 or the second optical switching section 116 can be demultiplexed by each demultiplexer 305 and then transmitted through different optical fiber paths to the corresponding photodetectors 1181 among the multiple photodetectors 1181 for photoelectric conversion.

[0082] Figure 4 A schematic plan view of an example of a second optical switching section 116 according to an embodiment of the present disclosure is shown.

[0083] Reference Figure 4 The second optical switching section 116 according to embodiments of the present disclosure may include a plurality of sixth optical switching units 1161. According to embodiments of the present disclosure, the second optical switching section 116 may be an 8×8 strictly non-blocking optical switch, which consists of 64 2×2 sixth optical switching units 1161. By controlling the signal output port of each sixth optical switching unit 1161, [the following can be achieved]... Figure 4 The eight input channels and eight output channels can be combined in any way, and the insertion loss on each channel is path-independent. Therefore, the input-to-output topology can be changed. Furthermore, according to embodiments of this disclosure, the 8×8 strictly non-blocking optical switch can be further laterally repeated to meet greater bandwidth switching requirements. It should be understood that... Figure 4 The structure of the second optical switching section 116 shown is merely an example. Depending on actual needs, the second optical switching section 116 can be configured as any n×n non-blocking optical switch. The second optical switching section 116 can implement reconfigurable optical interconnects to change the network topology for different artificial intelligence applications, thereby optimizing data migration efficiency and improving computing system performance.

[0084] Figure 5AA schematic plan view of an example optical switching unit of a first optical switching portion according to an embodiment of the present disclosure is shown. Figure 5B A schematic plan view of an example optical switching unit of the second optical switching section according to an embodiment of the present disclosure is shown.

[0085] Reference Figure 5A The optical switching unit of the first optical switching section according to embodiments of the present disclosure (e.g., referring to...) Figure 1B , Figure 2A , Figure 2B and Figure 2C The first to fourth optical switching units described can be 1×2 optical switching units. According to embodiments of this disclosure, the optical switching unit of the first optical switching section can be a MEMS optical path switching unit or a Mach-Zehnder interferometer (MZI) optical path switching unit. For example, such as... Figure 5A As shown, the first optical switching unit is an MZI optical path switching unit. Each optical switching unit in the first optical switching section may include a first beam splitter 501, a second beam splitter 502, and two phase shifters 503. The first beam splitter 501 may include a fourth optical input port and two fourth optical output ports. The second beam splitter 502 may include two fifth optical input ports and two fifth optical output ports. The two phase shifters 503 may be respectively connected between the two fourth optical output ports of the first beam splitter 501 and the two fifth optical input ports of the second beam splitter 502. According to embodiments of this disclosure, each phase shifter 503 may be an electro-optic or thermo-optic phase shifter. By controlling the external electric field or heat applied to each phase shifter 503, the refractive index of the optical material included in the phase shifter 503 is changed, thereby controlling the phase of the optical signal transmitted therein, and using interference effects to select the output port of the optical signal.

[0086] Reference Figure 5B The optical switching unit of the second optical switching section according to embodiments of the present disclosure (e.g., referring to...) Figure 4 The described sixth optical switching unit 1161 can be a 2×2 optical switching unit. According to embodiments of this disclosure, the optical switching unit of the second optical switching section can be an MZI optical path switching unit. For example, such as... Figure 5BAs shown, each optical switching unit of the second optical switching section may include a third beamsplitter 504, a fourth beamsplitter 505, and two phase shifters 506. The third beamsplitter 504 may include two sixth optical input ports and two sixth optical output ports, the fourth beamsplitter 505 may include two seventh optical input ports and two seventh optical output ports, and the two phase shifters 506 may be respectively connected between the two sixth optical output ports of the third beamsplitter 504 and the two seventh optical input ports of the fourth beamsplitter 505. According to embodiments of this disclosure, each phase shifter 506 may be an electro-optic or thermo-optic phase shifter. By controlling the external electric field or heat applied to each phase shifter 506 to change the refractive index of the optical material included in the phase shifter 506, the phase of the transmitted optical signal is controlled, and the output port of the optical signal is selected using interference effects.

[0087] According to embodiments of this disclosure, the photonic integrated circuit chip 110 may further include a seventh optical coupler (not shown) and an optical power splitter (not shown). The seventh optical coupler may be configured to input light from an external light source into the photonic integrated circuit chip 110, and the optical power splitter may be connected to the seventh optical coupler and configured to split one input light into multiple output lights. Each of the multiple output lights includes substantially the same power, and the multiple output lights are transmitted to respective optical modulators 1121.

[0088] In existing technologies, multiple computing modules are fully interconnected point-to-point on a printed circuit board (PCB) via PCB traces. However, the PCB traces are fixed, thus limiting the flexibility of changing the connections between computing modules. According to embodiments of this disclosure, optical interconnect modules can be used, making the connections between computing modules reconfigurable. This allows for changes to the network topology for different artificial intelligence applications, optimizing data migration efficiency and improving computing system performance. Furthermore, according to embodiments of this disclosure, the optical signal entering each first optical switching input port of the first optical switching section of the photonic integrated circuit chip in the optical interconnect module can be selectively switched from at least three optical switching output ports (e.g., such as...). Figure 1B The first to third optical switch output ports shown, or as... Figure 2B The first to third optical switching output ports and the sixth and seventh optical switching output ports shown are used for output, and at least two optical switching output ports are connected to the optical signal output port for external communication (e.g., as shown). Figure 1B The second and third optical switching output ports shown are connected to the optical signal output ports, or as shown in the diagram. Figure 2BThe second to third optical switching output ports and the sixth and seventh optical switching output ports shown are connected to the optical signal output ports, which allows the optical interconnect module to be connected to more other optical interconnect modules. Therefore, in the case of forming a large-scale computing system, the optical interconnect module can provide a more flexible connection relationship to reduce the number of redundant devices in the computing system, thereby saving costs.

[0089] Figure 6A A schematic plan view of an example of an optical interconnect device 600 according to an embodiment of the present disclosure is shown. Figure 6B A schematic cross-sectional view of an example of an optical interconnect device 600 according to an embodiment of the present disclosure is shown.

[0090] Reference Figure 6A and Figure 6B The optical interconnect device 600 according to an embodiment of the present disclosure may include a first printed circuit board (PCB) 601; one or more optical interconnect modules 670 are disposed on the first PCB 601. The optical interconnect module 670 may include a photonic integrated circuit chip 671, a transceiver chip 673, and a packaging substrate 675, and may be connected to the optical interconnect device 600 according to the above reference. Figures 1A to 5B The optical interconnect modules of any of the described embodiments are substantially the same, so repeated descriptions are omitted here; an electrical signal interface 650 is connected to a transceiver chip 673 of the optical interconnect module 670; and a first optical signal interface 641 and a second optical signal interface 642 are connected to a photonic integrated circuit chip 671 of the optical interconnect module 670. For example, the optical interconnect device 600 may include the form of an expansion card, but this disclosure is not limited thereto.

[0091] An electrical signal interface 650 can be disposed on the first PCB 601 and can be used to receive and / or transmit digital electrical signals. First and second optical signal interfaces 641 and 642 can be connected to the optical signal input port and optical signal output port of the photonic integrated circuit chip 671. In the photonic integrated circuit chip 671, the plurality of second and third optical switching output ports of the first optical switching section can be connected to the first and second optical signal output ports respectively; the first portion of the plurality of first optical input ports of the photoelectric conversion section can be connected to the plurality of fourth optical switching output ports of the second optical switching section; and the second and third portions of the plurality of first optical input ports of the photoelectric conversion section can be connected to the first and second optical signal input ports respectively. The first and second optical signal interfaces 641 and 642 can be disposed on the first PCB 601. Specifically, the first optical signal interface 641 can be connected to the second portion of the plurality of second optical switching output ports of the first optical switching section of the photonic integrated circuit chip 671 and the second portion of the plurality of first optical input ports of the photoelectric conversion section of the photonic integrated circuit chip 671; the second optical signal interface 642 can be connected to the third portion of the plurality of third optical switching output ports of the first optical switching section of the photonic integrated circuit chip 671 and the third portion of the plurality of first optical input ports of the photoelectric conversion section of the photonic integrated circuit chip 671. Although Figure 6A The illustration shows two optical interconnect modules 670 sharing a first optical signal interface 641 and a second optical signal interface 642, but this disclosure is not limited thereto. An optical interconnect device 600 according to embodiments of this disclosure may include other numbers of optical interconnect modules 670, and furthermore, a first optical signal interface and a second optical signal interface may be configured separately for each optical interconnect module 670. Furthermore, although... Figure 6A The first and second optical signal interfaces 641 and 642 are shown connected to the optical signal input port and optical signal output port of the photonic integrated circuit chip 671, respectively. However, this disclosure is not limited to this. It may also include two additional optical signal interfaces, with each optical signal interface connected to only one of the optical signal input ports or the optical signal output ports of the photonic integrated circuit chip 671. For example, the first optical signal interface 641 may be connected to the plurality of second optical switching output ports of the first optical switching section of the photonic integrated circuit chip 671; the second optical signal interface 642 may be connected to the plurality of third optical switching output ports of the first optical switching section of the photonic integrated circuit chip 671; the fifth optical signal interface (not shown) may be connected to the second part of the plurality of first optical input ports of the photoelectric conversion section of the photonic integrated circuit chip 671; and the sixth optical signal interface (not shown) may be connected to the third part of the plurality of first optical input ports of the photoelectric conversion section of the photonic integrated circuit chip 671.

[0092] For example, the optical interconnect device 600 may further include a third optical signal interface and a fourth optical signal interface. The first optical switching section of the photonic integrated circuit chip 671 may include a plurality of first optical switching input ports, a plurality of first optical switching output ports, a plurality of second optical switching output ports, a plurality of third optical switching output ports, a plurality of sixth optical switching output ports, and a plurality of seventh optical switching output ports. An optical signal input from each first optical switching input port of the first optical switching section is selectively output from a corresponding one of the plurality of first optical switching output ports, a corresponding one of the plurality of second optical switching output ports, a corresponding one of the plurality of third optical switching output ports, a corresponding one of the plurality of sixth optical switching output ports, or a corresponding one of the plurality of seventh optical switching output ports. The third optical signal interface may be connected to a fourth portion of the plurality of sixth optical switching output ports of the first optical switching section of the photonic integrated circuit chip 671 and the plurality of first optical input ports of the photoelectric conversion section. The fourth optical signal interface may be connected to a fifth portion of the plurality of seventh optical switching output ports of the first optical switching section of the photonic integrated circuit chip 671 and the plurality of first optical input ports of the photoelectric conversion section.

[0093] According to embodiments of this disclosure, each optical interconnect device 600 can receive control signals from an external optical switching control chip (not shown) via an electrical signal interface 650 for controlling the first and second optical switching portions in each optical interconnect module 670. The control signals can control the transmission path of optical signals in the first and second optical switching portions. For example, when the optical switching units of the first and second optical switching portions are MZI optical path switching units as described above, the control signals can control the external electric field or heat applied to the phase shifter of the MZI optical path switching unit to control the transmission path of the optical signals.

[0094] According to embodiments of this disclosure, the optical interconnect device 600 may further include one or more re-timers 610. The one or more re-timers 610 may be disposed on a first PCB 601, connected between the electrical signal interface 650 and the one or more optical interconnect modules 670, and used to convert a fifth electrical signal received from the electrical signal interface 650 into a third electrical signal output to the one or more optical interconnect modules 670, and to convert a second electrical signal received from the one or more optical interconnect modules 670 into an eighth electrical signal output from the electrical signal interface 650. The re-timer 610 can be used to solve signal attenuation and jitter problems in high-speed data transmission, ensuring signal quality, thereby maintaining the reliability and stability of data transmission.

[0095] Each retimer 610 may include multiple channels, and the electrical signal interface 650 may also include multiple channels. The total number of channels of one or more retimer 610s may be equal to the total number of channels of the electrical signal interface 650. One or more retimer 610s may be connected to one or more optical interconnect modules 670 via conductive channels 603 on or within the first PCB 601. Although Figure 6A Two re-timers 610 and one electrical signal interface 650 are shown, but this disclosure is not limited thereto. The optical interconnect device 600 may include other numbers of electrical signal interfaces 650 and re-timers 610, and the number of re-timers 610 may vary depending on the total number of channels of the electrical signal interfaces 650 and the number of channels of each re-timer 610. For example, if the electrical signal interfaces 650 of the optical interconnect device 600 include 64 channels and each re-timer 610 includes 16 channels, the optical interconnect device 600 may include four re-timers.

[0096] Similar to the configuration of the number of retimer 610, the total number of channels of the electrical interface of the optical interconnect module 670 can be equal to the total number of channels of the electrical signal interface 650, and the number of optical interconnect modules 670 can be changed according to the total number of channels of the electrical signal interface 650 and the number of channels of the electrical interface of each optical interconnect module 670.

[0097] According to embodiments of this disclosure, the optical interconnect device 600 may further include a light source module 660 disposed on a first PCB 601 for generating an optical carrier. The light source module 660 may be connected to the electro-optical conversion section of the photonic integrated circuit chip 671 of each optical interconnect module 670, such that the generated optical carrier is output to the electro-optical conversion section and converted into an optical signal output to the first optical switching section of the photonic integrated circuit chip 671. The light source module 660 may be optically connected to the optical interconnect module 670 via an optical fiber 677 to input an optical carrier to the optical interconnect module 670. Although Figure 6A Two light source modules 660 are shown, but this disclosure is not limited thereto. The optical interconnect device 600 may include only one light source module 660, which can be connected to one or more optical interconnect modules 670 via optical fiber.

[0098] According to embodiments of this disclosure, the electrical signal interface 650 can receive electrical signals from external devices (e.g., a computing module) of the optical interconnect device 600. These electrical signals can be reshaped and / or amplified by a re-timer 610. The reshaped and / or amplified electrical signals can be transmitted to the optical interconnect module 670 via conductive channels 603 on or within the first PCB 601, and further transmitted to a corresponding transceiver chip 673 via conductive channels in the packaging substrate 675 of the optical interconnect module 670 and conductive vias 672 in the photonic integrated circuit chip 671. The transceiver chip 673 can send the received electrical signals to the photonic integrated circuit chip 671. The photonic integrated circuit chip 671 can modulate the electrical signals output by the transceiver chip 673 onto an optical carrier generated by the light source module 660 via an electro-optic conversion section (e.g., an optical modulator), thereby generating an optical signal carrying information. After optical path reconstruction by the first and second optical switching sections in the photonic integrated circuit chip 671, the optical signal is output to the communication peer (e.g., another computing module connected to the optical interconnect device 600) via optical fiber 677 and optical signal interfaces 641 and 642. Conversely, the optical signal received via optical signal interfaces 641 and 642 and optical fiber 677 can undergo photoelectric conversion by the photoelectric conversion section (e.g., photodetector) of the photonic integrated circuit chip 671. The converted electrical signal can then be transmitted to the receiving end (e.g., the aforementioned computing module) via the transceiver chip 673, the timer 610, and the electrical signal interface 650. Optical path reconstruction via the optical interconnect module 670 of the optical interconnect device 600 can change the connection relationships between multiple external devices (e.g., multiple computing modules) connected to the optical interconnect device 600.

[0099] According to embodiments of this disclosure, the optical interconnect device 600 may further include a first voltage regulation module 620 (e.g., 54V to 12V) and a second voltage regulation module 630 (12V to voltage rail (i.e., maximum voltage input range)) for regulating the voltage of the electrical signal transmitted between the electrical signal interface and the optical interconnect module 670.

[0100] Figure 7 A schematic plan view of an example computing device according to an embodiment of the present disclosure is shown. Figure 8 A schematic diagram of the topology between computing modules according to an embodiment of the present disclosure is shown.

[0101] Reference Figure 7The computing device 70 according to embodiments of the present disclosure may include a second printed circuit board (PCB) 701, and a plurality of computing modules 711, 712, 713, 714, 715, 716, 717 and 718 disposed on the second PCB 701, and a plurality of optical interconnect devices 721, 722, 723, 724, 725, 726, 727 and 728. The optical interconnect devices 721-728 may be connected to the components described above. Figure 6A and Figure 6B The optical interconnect device 600 described in the embodiments is substantially the same, therefore repeated descriptions are omitted here. According to embodiments of this disclosure, the second PCB 701 may be a Universal Base Board (UBB). According to embodiments of this disclosure, multiple computing modules 711-718 can be connected to multiple optical interconnect devices 721-728 via conductive channels (e.g., PCB traces) 703 on the second PCB 701. The computing modules 711-718 may include a high-speed, long-distance SerDes interface for interfacing with the electrical signal interfaces (e.g., ...) of the optical interconnect devices 721-728. Figure 6A Communication via the electrical signal interface 650. Figure 7 In the illustrated embodiment, there are eight computing modules and eight optical interconnect devices, and each computing module includes eight electrical signal interfaces. The first electrical signal interface of each of the eight electrical signal interfaces in computing modules 711-718 is connected to the first optical interconnect device 721, the second electrical signal interface of each of the eight electrical signal interfaces in computing modules 711-718 is connected to the second optical interconnect device 722, and so on.

[0102] The multiple computing modules 711-718 may be OCP Accelerator Modules (OAM) from the Open Compute Project (OCP), but this disclosure is not limited thereto. Any one of the multiple computing modules 711-718 can be of various other types, such as, but not limited to, Graphics Processing Units (GPUs), Neural Processing Units (NPUs), Tensor Processing Units (TPUs), Intelligent Processing Units (IPUs), Deep Learning Processing Units (DPUs), etc. Furthermore, Figure 7 The number of optical interconnect devices and computing modules and their electrical signal interfaces shown are merely examples, and this disclosure is not limited thereto.

[0103] According to embodiments of this disclosure, as referred to above... Figure 1BThe first optical switching portion 114 of the photonic integrated circuit chip 110 of the optical interconnect module 100 can selectively transmit optical signals to the second optical switching portion 116 or to the optical signal output port of the photonic integrated circuit chip 110 (e.g., via the first optical coupler 1191 or the second optical coupler 1192). Therefore, communication between computing modules within the same computing device 70 or between corresponding computing modules in different computing devices 70 can be achieved by controlling the first optical switching portion and / or the second optical switching portion of the optical interconnect module 100.

[0104] Specifically, in order to enable communication between corresponding computing modules within the same computing device, a first optical switching unit connected to the output computing module can be controlled so that an optical signal modulated according to the electrical signal output by the output computing module is transmitted to a second optical switching unit (e.g., transmitted to...). Figure 1B The second optical switching unit 116 shown does not transmit the optical signal to the optical signal output port of the photonic integrated circuit chip (e.g., not to...). Figure 1B The first optical coupler 1191 and the second optical coupler 1192 are shown; and the second optical switching unit can be controlled to select a transmission path, so that the optical signal entering the second optical switching unit is transmitted to the photodetector connected to the target computing module through the selected transmission path. Furthermore, in order to enable communication between corresponding computing modules in different computing devices, the first optical switching unit connected to the output computing module in a computing device can be controlled so that the optical signal modulated according to the electrical signal output by the output computing module is transmitted to the optical signal output port of the photonic integrated circuit chip (e.g., transmitted to...). Figure 1B The first optical coupler 1191 and the second optical coupler 1192 shown do not transmit to the second optical switching unit (e.g., do not transmit to). Figure 1B The second optical switching unit 116 shown enables the optical signal to travel through an external optical fiber from the optical signal input port (e.g., from...). Figure 1B The third optical coupler 1193 and the fourth optical coupler 1194 shown transmit data to the corresponding photodetector of the corresponding optical interconnect module connected to the target computing module in another computing device.

[0105] Reference Figure 8 The connection topology between multiple computing modules 711-718 can be reconfigured using an optical interconnect device (which includes an optical interconnect module, and the optical interconnect module includes a first optical switching section and a second optical switching section). For example, the connection topology between computing modules 711-718 can be changed in real time to be fully interconnected externally. Figure 8 (a) in the middle, full interconnection within the internal network ( Figure 8 (b) in the middle, and ring ( Figure 8 (c) or point-to-point ( Figure 8 (d) in the middle.

[0106] For example, in order to achieve Figure 8 The connection topology shown in (a) allows control of the first optical switching unit of all optical interconnect devices, enabling all optical signals modulated according to the electrical signals output by computing modules 711-718 to be transmitted to the optical signal output port of the photonic integrated circuit chip (e.g., transmitted to...). Figure 1B The first optical coupler 1191 and the second optical coupler 1192 shown do not transmit to the second optical switching unit (e.g., do not transmit to). Figure 1B The second optical switching unit 116 shown. For example, in order to achieve... Figure 8 The connection topology shown in (b)-(d) allows control of the first optical switching unit for all optical interconnect devices, enabling all optical signals modulated according to the electrical signals output by computing modules 711-718 to be transmitted to the second optical switching unit (e.g., transmitted to...). Figure 1B The second optical switching unit 116 shown does not transmit the optical signal to the optical signal output port of the photonic integrated circuit chip (e.g., not to...). Figure 1B The first optical coupler 1191 and the second optical coupler 1192 shown are shown; and the second optical switching unit can be controlled to select a transmission path, so that each optical signal entering the second optical switching unit is transmitted to the corresponding photodetector through the selected transmission path.

[0107] Therefore, the communication bandwidth between the first computing module 711 and the second computing module 712 can be bandwidth B ( Figure 8 (b) in the middle: full interconnection), bandwidth 4B ( Figure 8 (c) in the middle: ring, bandwidth 8B ( Figure 8 The real-time switching between (d): point-to-point communication enables the matching of bandwidth requirements of different communication algorithms, improves bandwidth utilization, and thus improves the overall operating efficiency of the artificial intelligence computing system.

[0108] It should be understood that the connection topology between computing modules is not limited to... Figure 8 The topology shown is illustrated. Various other connection topologies can be implemented by controlling the first and / or second optical switching sections of the optical interconnect modules in the optical interconnect device, depending on actual needs.

[0109] In this application, the change of topology does not require manual alteration of the fiber optic connections between different computing modules. Instead, it only requires controlling the first and / or second optical switching sections of the optical interconnect module in the optical interconnect device to achieve the switching of link conduction. Therefore, it is more convenient and faster, and can achieve millisecond-level topology switching latency.

[0110] Figure 9A schematic plan view of an example computing system according to an embodiment of the present disclosure is shown.

[0111] Reference Figure 9 The computing system 9 according to embodiments of the present disclosure may include a plurality of computing devices 70 and at least one optical switch 900. Each computing device 70 may be optically interconnected with at least a portion of the optical switches 900 via one or more optical interconnect devices 721-728 in each computing device 70. At least a portion of the plurality of computing devices 70 may be optically interconnected with each other via at least one optical switch 900.

[0112] According to embodiments of the present disclosure, at least one optical switch 900 is capable of reconfiguring optical links between a plurality of computing devices 70, enabling communication between any two of the plurality of computing devices 70.

[0113] According to embodiments of this disclosure, the plurality of computing devices 70 may include a first computing device, a second computing device, and a third computing device. At least one optical switch 900 is capable of establishing an optical link between a portion of the plurality of optical interconnects 721-728 of the first computing device and a portion of the plurality of optical interconnects 721-728 of the second computing device, and establishing an optical link between a second portion of the plurality of optical interconnects 721-728 of the first computing device and a portion of the plurality of optical interconnects 721-728 of the third computing device, enabling the first computing device to communicate simultaneously with the second and third computing devices.

[0114] At least one optical switch 900 can control the optical path based on different physical principles, including piezoelectric, microelectromechanical, and electro-optical. For example, each optical switch 900 can be composed of a series of free-space optical components or a series of integrated optical components. Multiple computing devices 70 can be connected to at least one optical switch 900 via optical fiber 901.

[0115] Different AI applications have varying requirements for computing and interconnectivity. Training large models requires significant computing power and bandwidth migration, typically necessitating the collaborative work of many computing modules. In this case, optical interconnects can be used to create a topology where all computing modules within a computing device are interconnected. For small to medium-sized models, switches can be placed in standby mode to save power, distributing multiple tasks to different computing devices for separate processing. Optical interconnects can then be used to interconnect computing modules within the same computing device. This flexible configuration of network interconnects can accelerate various AI applications.

[0116] This disclosure overcomes the interconnection distance limitations imposed by PCB traces in existing technologies by employing optical interconnect modules, enabling long-distance fiber optic connections and facilitating large-scale expansion of computing modules. Furthermore, the use of optical interconnect devices allows for field-reconfigurable interconnections between computing modules, making them no longer static. Therefore, the topology can be altered based on specific artificial intelligence models. Using reconfigurable optical interconnects enables rapid switching of interconnection topologies between different computing modules, effectively improving bandwidth utilization and enhancing the scalability of the artificial intelligence computing system.

[0117] In the foregoing description, embodiments of the present disclosure have been described in conjunction with the accompanying drawings. It should be understood that the above embodiments are merely illustrative, and those skilled in the art should understand that the combination of constituent elements and processes of the present embodiments can be modified in various ways, and such modifications also fall within the scope of the present disclosure.

Claims

1. An optical interconnect module, comprising: Photonic integrated circuit chips; as well as The transceiver chip is electrically connected to the photonic integrated circuit chip, wherein... The photonic integrated circuit chip includes an electro-optical conversion section, a first optical switching section, a second optical switching section, and a photoelectric conversion section. The electro-optical conversion section generates an optical signal that is output to the first optical switching section based on the electrical signal output from the transceiver chip. The first optical switching section includes multiple first optical switching input ports, multiple first optical switching output ports, multiple second optical switching output ports, and multiple third optical switching output ports. Optical signals input from each first optical switching input port are selectively output from a corresponding port among the multiple first optical switching output ports, a corresponding port among the multiple second optical switching output ports, or a corresponding port among the multiple third optical switching output ports. The second optical switching section includes a plurality of second optical switching input ports and a plurality of fourth optical switching output ports connected via reconfigurable optical paths. Each of the plurality of second optical switching input ports of the second optical switching section is connected to a corresponding one of the plurality of first optical switching output ports of the first optical switching section. The photoelectric conversion section includes multiple first optical input ports and multiple first electrical output ports. Optical signals input from the multiple first optical input ports are converted into electrical signals output from the multiple first electrical output ports to the transceiver chip. The first portions of the multiple first optical input ports are respectively connected to the multiple fourth optical switching output ports of the second optical switching section.

2. The optical interconnect module according to claim 1, wherein... The first optical switching section includes multiple first optical switching units and multiple second optical switching units. Each first optical switching unit includes a first optical switching input port, a first optical switching output port, and a fifth optical switching output port. An optical signal input from the first optical switching input port is selectively output from either the first optical switching output port or the fifth optical switching output port. Each second optical switching unit includes a third optical switching input port, a second optical switching output port, and the third optical switching output port. An optical signal input from the third optical switching input port is selectively output from either the second optical switching output port or the third optical switching output port. The third optical switching input port of each second optical switching unit is connected to the fifth optical switching output port of a corresponding first optical switching unit among the plurality of first optical switching units.

3. The optical interconnect module according to claim 1, wherein the first optical switching part includes a plurality of first optical switching units, each first optical switching unit including a first optical switching input port, a first optical switching output port, a second optical switching output port and a third optical switching output port, wherein an optical signal input from the first optical switching input port is selectively output from the first optical switching output port, the second optical switching output port or the third optical switching output port.

4. The optical interconnect module according to claim 1, wherein... The photonic integrated circuit chip also includes a first optical coupler, a second optical coupler, a third optical coupler, and a fourth optical coupler. The first optical coupler is connected to the plurality of second optical switching output ports of the first optical switching section, and the second optical coupler is connected to the plurality of third optical switching output ports of the first optical switching section. The third optical coupler is connected to the second part of the plurality of first optical input ports of the photoelectric conversion section, and the fourth optical coupler is connected to the third part of the plurality of first optical input ports of the photoelectric conversion section.

5. The optical interconnect module according to claim 1, wherein... The first optical switching section further includes multiple sixth optical switching output ports and multiple seventh optical switching output ports, and Optical signals input from each of the first optical switching input ports of the first optical switching section are selectively output from a corresponding one of the plurality of first optical switching output ports, a corresponding one of the plurality of second optical switching output ports, a corresponding one of the plurality of third optical switching output ports, a corresponding one of the plurality of sixth optical switching output ports, or a corresponding one of the plurality of seventh optical switching output ports.

6. The optical interconnect module according to claim 5, wherein... The first optical switching section includes multiple first optical switching units, multiple second optical switching units, multiple third optical switching units, and multiple fourth optical switching units. Each first optical switching unit includes a first optical switching input port, a first optical switching output port, and a fifth optical switching output port. An optical signal input from the first optical switching input port is selectively output from either the first optical switching output port or the fifth optical switching output port. Each second optical switching unit includes a third optical switching input port, an eighth optical switching output port, and a ninth optical switching output port. An optical signal input from the third optical switching input port is selectively output from either the eighth or the ninth optical switching output port. The third optical switching input port of each second optical switching unit is connected to the fifth optical switching output port of a corresponding first optical switching unit among the plurality of first optical switching units. Each third optical switching unit includes a fourth optical switching input port, a second optical switching output port, and a third optical switching output port. Optical signals input from the fourth optical switching input port are selectively output from either the second or third optical switching output port. The fourth optical switching input port of each third optical switching unit is connected to the eighth optical switching output port of a corresponding second optical switching unit among the plurality of second optical switching units. Each fourth optical switching unit includes a fifth optical switching input port, a sixth optical switching output port, and a seventh optical switching output port. An optical signal input from the fifth optical switching input port is selectively output from either the sixth or the seventh optical switching output port. The fifth optical switching input port of each fourth optical switching unit is connected to the ninth optical switching output port of a corresponding second optical switching unit among the plurality of second optical switching units.

7. The optical interconnect module according to claim 5, wherein the first optical switching part includes a plurality of first optical switching units, each first optical switching unit including a first optical switching input port, a first optical switching output port, a second optical switching output port, a third optical switching output port, a sixth optical switching output port and a seventh optical switching output port, wherein an optical signal input from the first optical switching input port is selectively output from the first optical switching output port, the second optical switching output port, the third optical switching output port, the sixth optical switching output port or the seventh optical switching output port.

8. The optical interconnect module according to claim 5, wherein... The photonic integrated circuit chip further includes a first optical coupler, a second optical coupler, a third optical coupler, a fourth optical coupler, a fifth optical coupler, a sixth optical coupler, a seventh optical coupler, and an eighth optical coupler. The first optical coupler is connected to the plurality of second optical switching output ports of the first optical switching section, and the second optical coupler is connected to the plurality of third optical switching output ports of the first optical switching section. The third optical coupler is connected to the second portion of the plurality of first optical input ports of the photoelectric conversion section, and the fourth optical coupler is connected to the third portion of the plurality of first optical input ports of the photoelectric conversion section. The fifth optical coupler is connected to the plurality of sixth optical switching output ports of the first optical switching section, and the sixth optical coupler is connected to the plurality of seventh optical switching output ports of the first optical switching section. The seventh optical coupler is connected to the fourth part of the plurality of first optical input ports of the photoelectric conversion section, and the eighth optical coupler is connected to the fifth part of the plurality of first optical input ports of the photoelectric conversion section.

9. The optical interconnect module according to claim 1, wherein the electro-optical conversion section includes a plurality of optical modulators, the plurality of optical modulators being used to modulate an optical carrier input to the plurality of optical modulators into an optical signal output to the first optical switching section according to the electrical signal output by the transceiver chip.

10. The optical interconnect module according to claim 1, wherein the photoelectric conversion section further includes a plurality of photodetectors, the plurality of photodetectors being used to convert optical signals input from the plurality of first optical input ports of the photoelectric conversion section into electrical signals output to the transceiver chip.

11. The optical interconnect module according to claim 10, wherein... The photoelectric conversion section also includes multiple fifth optical switching units. The plurality of first optical input ports of the photoelectric conversion section include a first part, a second part, and a third part. Each fifth optical switching unit is used to selectively transmit an optical signal output from a corresponding first optical input port in the first part, a corresponding first optical input port in the second part, or a corresponding first optical input port in the third part to a corresponding one of the plurality of photodetectors.

12. The optical interconnect module according to claim 1, wherein... The photonic integrated circuit chip also includes multiple wavelength multiplexers. Each wavelength multiplexer includes multiple second optical input ports and one second optical output port. Light of different wavelengths from the electro-optical conversion module is input from the multiple second optical input ports of each wavelength multiplexer and output from the second optical output port of each wavelength multiplexer. The second optical output port of each wavelength multiplexer is connected to a corresponding one of the plurality of first optical switching input ports of the first optical switching section.

13. The optical interconnect module according to claim 12, wherein... The photonic integrated circuit chip also includes multiple demultiplexers. Each demultiplexer includes a third optical input port and multiple third optical output ports. Light of different wavelengths from outside the optical interconnect module or from the second optical switching section of the optical interconnect module is input from the third optical input port of each demultiplexer and output from the multiple third optical output ports of each demultiplexer. The plurality of third optical output ports of each demultiplexer are connected to the corresponding first optical input port among the plurality of first optical input ports of the photoelectric conversion section.

14. The optical interconnect module according to claim 2, wherein each of the first optical switching unit and the second optical switching unit comprises: The first beam splitter includes a fourth optical input port and two fourth optical output ports; The second beam splitter includes two fifth optical input ports and two fifth optical output ports; as well as Two phase shifters are respectively connected between the two fourth optical output ports of the first beam splitter and the two fifth optical input ports of the second beam splitter.

15. The optical interconnect module according to claim 1, wherein the second optical switching section includes a plurality of sixth optical switching units, each sixth optical switching unit comprising: The third beam splitter includes two sixth optical input ports and two sixth optical output ports; The fourth beam splitter includes two seventh optical input ports and two seventh optical output ports; as well as Two phase shifters are respectively connected between the two sixth optical output ports of the third beam splitter and the two seventh optical input ports of the fourth beam splitter.

16. The optical interconnect module according to claim 1, further comprising a packaging substrate, wherein... The photonic integrated circuit chip is disposed on the packaging substrate, and the transceiver chip is flip-chip mounted on the surface of the photonic integrated circuit chip opposite to the packaging substrate. The transceiver chip receives electrical signals from the outside of the optical interconnect module and transmits electrical signals to the outside of the optical interconnect module through conductive vias in the photonic integrated circuit chip.

17. The optical interconnect module according to claim 1, further comprising: Multiple optical switching control chips are electrically connected to the photonic integrated circuit chip and are used to control the first optical switching section and the second optical switching section to select the transmission path of the optical signal in the first optical switching section and the second optical switching section.

18. An optical interconnect device, comprising: First printed circuit board (PCB); One or more optical interconnect modules according to any one of claims 1 to 17 are disposed on the first PCB; An electrical signal interface is connected to the transceiver chip of the optical interconnect module; The first optical signal interface is connected to the second part of the plurality of second optical switching output ports of the first optical switching part of the photonic integrated circuit chip of the optical interconnect module and the second part of the plurality of first optical input ports of the photoelectric conversion part; as well as The second optical signal interface is connected to the third portion of the plurality of third optical switching output ports of the first optical switching portion of the photonic integrated circuit chip of the optical interconnect module and the third portion of the plurality of first optical input ports of the photoelectric conversion portion.

19. The optical interconnect device according to claim 18, further comprising a third optical signal interface and a fourth optical signal interface, wherein... The first optical switching section also includes multiple sixth optical switching output ports and multiple seventh optical switching output ports. The optical signal input from each first optical switching input port of the first optical switching section is selectively output from a corresponding one of the plurality of first optical switching output ports, a corresponding one of the plurality of second optical switching output ports, a corresponding one of the plurality of third optical switching output ports, a corresponding one of the plurality of sixth optical switching output ports, or a corresponding one of the plurality of seventh optical switching output ports. The third optical signal interface is connected to the fourth part of the plurality of sixth optical switching output ports of the first optical switching section of the photonic integrated circuit chip of the optical interconnect module and the plurality of first optical input ports of the photoelectric conversion section, and The fourth optical signal interface is connected to the fifth portion of the plurality of seventh optical switching output ports of the first optical switching section of the photonic integrated circuit chip of the optical interconnect module and the fifth portion of the plurality of first optical input ports of the photoelectric conversion section.

20. The optical interconnect device according to claim 18, further comprising: One or more re-timers are arranged on the first PCB, connected between the electrical signal interface and the one or more optical interconnect modules, and are used to convert a first electrical signal received from the electrical signal interface into a second electrical signal output to the one or more optical interconnect modules, and to convert a third electrical signal received from the one or more optical interconnect modules into a fourth electrical signal output from the electrical signal interface.

21. The optical interconnect device according to claim 18, further comprising: A light source module, disposed on the first PCB and used to generate an optical carrier, is connected to the electro-optical conversion section of the photonic integrated circuit chip of each optical interconnect module, such that the optical carrier is output to the electro-optical conversion section and converted by the electro-optical conversion section into the optical signal output to the first optical switching section of the photonic integrated circuit chip.

22. A computing system, comprising: A plurality of computing devices, each computing device including a second printed circuit board (PCB), a plurality of computing modules disposed on the second PCB, and a plurality of optical interconnect devices according to any one of claims 18 to 21; as well as At least one optical switch, wherein Each computing device is optically interconnected with at least a portion of the optical switches in the at least one optical switch via one or more of the optical interconnect devices in each computing device, and At least some of the computing devices are optically interconnected via the at least one optical switch.

23. The computing system according to claim 22, wherein The at least one optical switch can reconstruct the optical link between the plurality of computing devices, enabling communication between any two computing devices among the plurality of computing devices.

24. The computing system of claim 22, wherein The plurality of computing devices includes a first computing device, a second computing device, and a third computing device, and The at least one optical switch is capable of establishing an optical link between a first portion of the plurality of optical interconnects of the first computing device and a portion of the plurality of optical interconnects of the second computing device, and establishing an optical link between a second portion of the plurality of optical interconnects of the first computing device and a portion of the plurality of optical interconnects of the third computing device, so that the first computing device communicates simultaneously with the second computing device and the third computing device.

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