Node liquid cooling system and server

Abstract

This application relates to a node liquid cooling system and server, including a liquid cooling chassis with its internal space divided into a non-immersion zone and an immersion zone, the non-immersion zone being located above the immersion zone. A first heating module is arranged in the non-immersion zone, and a second heating module is arranged in the immersion zone. The liquid cooling chassis has a liquid supply port and a liquid drain port, the liquid supply port being connected to the non-immersion zone and the liquid drain port being connected to the immersion zone. Each liquid cooling module includes a liquid feeder, a liquid supply pipeline unit, and a cold plate unit. The liquid feeder is installed in the liquid cooling chassis and connected to the liquid supply port. One end of the liquid supply pipeline unit is connected to the liquid feeder, and the other end of the liquid supply pipeline unit is connected to the cold plate unit. The cold plate unit is installed with the first heating module and provides heat transfer. The liquid outlet of the cold plate unit is connected to the immersion zone, and the immersion zone contains a cooling medium to immerse the second heating module in the cooling medium. This not only improves cooling efficiency but also reduces operating energy consumption. The shorter pipeline length also reduces the difficulty of later maintenance.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation for electronic devices, and in particular to a node liquid cooling system and server. Background Technology

[0002] With the continuous advancement of technology and the rapid development of data center technology, compute-intensive servers are beginning to evolve towards high density, high performance, and low energy consumption. The electronic components within a server are highly sensitive to operating temperature. As these components operate, their surface heat flux density increases, generating more and more heat. Only by dissipating this heat promptly and maintaining the internal components at their optimal operating temperatures can the server's operating efficiency be improved and its operational stability guaranteed.

[0003] Currently, the main heat dissipation solutions for electronic components in servers include air cooling and liquid cooling. Air cooling relies primarily on the forced convection effect of the air-cooled heat dissipation module for cooling, but it suffers from low cooling efficiency, high energy consumption, and a large space occupation by the air-cooled heat dissipation module. Liquid cooling, on the other hand, involves a complex cold plate and liquid cooling pipeline layout that not only occupies a large installation space, but also has high flow resistance of the cooling medium in the pipeline, high flow rate requirements, poor heat dissipation effect, high operating energy consumption, and high maintenance difficulty. Summary of the Invention

[0004] Therefore, it is necessary to provide a node liquid cooling system and server to address the problems of low cooling efficiency, high operating energy consumption, large space occupation, and difficult maintenance.

[0005] A first aspect of this application proposes a node liquid cooling system, comprising:

[0006] A liquid-cooled chassis, the internal space of which is divided into a non-immersion zone and an immersion zone, the non-immersion zone being located above the immersion zone. A first heating module is arranged in the non-immersion zone, and a second heating module is arranged in the immersion zone. The liquid-cooled chassis has a liquid supply port and a liquid drain port, the liquid supply port being connected to the non-immersion zone and the liquid drain port being connected to the immersion zone; and

[0007] The liquid-cooled module includes a liquid supply unit, a liquid supply pipeline unit, and a cold plate unit. The liquid supply unit is installed in the liquid-cooled chassis and connected to the liquid supply port. One end of the liquid supply pipeline unit is connected to the liquid supply unit, and the other end of the liquid supply pipeline unit is connected to the cold plate unit. The cold plate unit is installed and heat-transferringly cooperates with the first heating module. The liquid outlet of the cold plate unit is connected to the immersion zone. The immersion zone contains a cooling medium so that the second heating module is immersed in the cooling medium.

[0008] In this solution, the node liquid cooling system operates by supplying the cooling medium from an external liquid supply device to the liquid supply port of the liquid cooling chassis, which then flows into the liquid supply unit of the liquid cooling module. The liquid supply unit then delivers the cooling medium to the cold plate unit via the liquid supply pipeline unit. Since the cold plate unit is installed and cooperates with the first heating module in the non-immersion zone, the cooling medium can exchange heat with the first heating module as it flows through the cold plate unit. This allows the cooling medium to absorb the heat generated by the first heating module during operation, achieving a cooling effect and ensuring that the first heating module remains at its normal operating temperature, thus guaranteeing its performance and safety. Furthermore, the cooling medium flowing out of the cold plate unit directly flows into the non-immersion zone. In the immersion zone below, the second heating module, which was originally installed in the immersion zone, can be submerged in the cooling medium accumulated in the immersion zone. In this way, the second heating module can exchange heat with the cooling medium, so that the heat generated by the second heating module during operation can be absorbed by the cooling medium to achieve cooling and cooling, ensuring that the second heating module is always at a normal operating temperature to ensure working performance and safety. Finally, when the liquid level of the cooling medium in the immersion zone rises to the drain port, it can be discharged from the liquid cooling box by overflow. This ensures that there is always a flowing cooling medium participating in the heat dissipation of the first and second heating modules, ensuring the heat dissipation effect. Compared to traditional technologies, this solution offers several advantages. First, its liquid cooling system replaces air cooling, improving cooling efficiency, reducing energy consumption, and avoiding the space limitations of air-cooled modules. Second, compared to traditional liquid cooling solutions, this solution simplifies the layout of the cold plate and liquid cooling pipes by requiring only a liquid supply pipeline unit and a cold plate unit for the first heat-generating module. This results in less installation space, shorter pipe lengths, and effectively reduced flow resistance of the cooling medium in the pipes, improving heat dissipation and reducing the difficulty of later maintenance.

[0009] The technical solution of this application will be further described below:

[0010] In one embodiment, the first heating module includes a substrate and at least two first heating units, wherein the at least two first heating units are arranged side by side at intervals on the substrate along a first direction of the node liquid cooling system.

[0011] The liquid supply pipeline unit includes at least two first liquid supply pipelines, the cold plate unit includes at least two first cold plate assemblies, the first liquid outlet of the liquid supply device is connected to the corresponding liquid path of the first cold plate assembly through the first liquid supply pipeline, and the first cold plate assembly is installed and heatsinks in a one-to-one correspondence with the first heating unit.

[0012] In one embodiment, the first heating unit includes at least two first main heating devices, which are arranged side by side along a second direction of the node liquid cooling system, and the second direction intersects with the first direction;

[0013] The first cold plate assembly includes at least two first cold plates, which are installed and heat-transferringly connected to the first main heating element. The first liquid supply pipeline has at least two first liquid supply branch pipes, which are connected to the first cold plates. The liquid outlet of the first cold plate is connected to the immersion area.

[0014] In one embodiment, the liquid cooling module further includes at least two return lines, which are installed one-to-one with the first cold plate assembly;

[0015] The return liquid pipeline has at least two return liquid branch pipes, which are connected to the first cold plate in a one-to-one correspondence, and the other end of the return liquid pipeline extends into the immersion area.

[0016] In one embodiment, the liquid cooling module further includes a second liquid supply pipeline and a second cold plate assembly. One end of the second liquid supply pipeline is connected to the second liquid outlet of the liquid supply device, and the other end of the second liquid supply pipeline is connected to the second cold plate assembly. The second cold plate assembly is installed and heat-transferring with the second heating module.

[0017] In one embodiment, the second liquid supply pipeline has at least two second liquid supply branches, the second cold plate assembly includes at least two second cold plates, the second heating module includes a main board and at least two second main heating devices mounted on the main board, the second liquid supply branches are connected to the second cold plates in a one-to-one correspondence, the second cold plates are installed and heat-transferringly cooperate with the second main heating devices in a one-to-one correspondence, and the liquid outlet of the second cold plate is connected to the immersion area.

[0018] In one embodiment, the liquid cooling chassis is further provided with a liquid extraction port. The liquid extraction port, the liquid supply port, and the liquid discharge port are arranged on the same side of the liquid cooling chassis. The liquid extraction port is connected to the immersion zone. A one-way valve is installed at the liquid extraction port. The one-way valve is configured to allow the cooling medium to flow only from the immersion zone to the outside of the liquid cooling chassis.

[0019] In one embodiment, the node liquid cooling system further includes a power supply interface, which is disposed on the liquid cooling chassis and electrically connected to the first heating module and the second heating module. The power supply interface, the liquid supply port and the liquid drain port are arranged on the same side of the liquid cooling chassis.

[0020] And / or, the node liquid cooling system further includes an input / output interface, which is disposed on the liquid cooling chassis and electrically connected to the first heating module and the second heating module, and the input / output interface, the liquid supply port and the liquid drain port are respectively located on opposite sides of the liquid cooling chassis.

[0021] In one embodiment, the liquid cooling chassis includes a chassis body and a chassis cover, the chassis cover being detachably mounted at the opening of the chassis body, and the chassis cover being provided with a handle.

[0022] A second aspect of this application also proposes a server comprising:

[0023] A vertical rack, the interior of which forms multiple storage compartments;

[0024] Multiple node liquid cooling systems as described in any of the above embodiments are installed one-to-one in the containment chamber; and

[0025] A liquid supply and return device is connected to all the liquid cooling system pipelines of the nodes. Attached Figure Description

[0026] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the main structure of a node liquid cooling system according to one embodiment.

[0029] Figure 2 for Figure 1 A schematic diagram of the left-side view structure.

[0030] Figure 3 for Figure 1 A schematic diagram of the right-side structure.

[0031] Figure 4 for Figure 1 A schematic diagram of the internal structure of the mid-node liquid cooling system.

[0032] Figure 5 This is a schematic diagram of the structure of a liquid cooling module according to one embodiment.

[0033] Figure 6 for Figure 5 A schematic diagram of the liquid cooling module after omitting the first and second cold plates.

[0034] Figure 7 This is a schematic diagram of the structure of a first heating module according to an embodiment.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100. Node liquid cooling system; 10. Liquid cooling chassis; 10a. Chassis body; 10b. Chassis cover; 10c. Handle; 11. Non-immersion area; 12. Immersion area; 13. Liquid supply port; 14. Liquid drain port; 15. Liquid extraction port; 16. Power supply interface; 17. Input / output interface; 20. First heating module; 21. Substrate; 22. First heating unit; 221. First main heating device; 30. Second heating module; 40. Liquid cooling module; 41. Liquid supply device; 42. Liquid supply pipeline unit; 421. First liquid supply pipeline; 4211. First liquid supply branch pipe; 43. Cold plate unit; 431. First cold plate; 44. Second liquid supply pipeline; 441. Second liquid supply branch pipe; 45. Second cold plate; 50. Liquid return pipeline; 51. Liquid return branch pipe. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0043] See Figures 1 to 4 This application illustrates a node liquid cooling system 100 according to an embodiment, which includes a liquid cooling chassis 10 and a liquid cooling module 40. The liquid cooling chassis 10 serves as the carrier of the node liquid cooling system 100, and plays the role of housing the integrated liquid cooling module 40, the first heating module 20, and the second heating module 30.

[0044] For example, in one embodiment, the liquid cooling chassis 10 has a hollow cuboid structure and is installed vertically, meaning that the length of the liquid cooling chassis 10 is in the vertical direction. This can better save space in the lateral direction, so that more node liquid cooling systems 100 can be arranged in a limited space.

[0045] Please continue reading. Figure 4 More specifically, the internal space of the liquid cooling chassis 10 is divided into a non-immersion zone 11 and an immersion zone 12 that are connected to each other. The non-immersion zone 11 is located above the immersion zone 12. A first heating module 20 is arranged in the non-immersion zone 11, and a second heating module 30 is arranged in the immersion zone 12.

[0046] It should be noted that the non-immersion area 11 and the immersion area 12 correspond to the two spatial regions of the internal hollow cavity of the liquid cooling chassis 10. The size of the non-immersion area 11 and the immersion area 12 can be the same or different, and can be flexibly selected according to actual needs.

[0047] Please continue reading. Figures 1 to 3 ,as well as Figure 5 In addition, the liquid cooling chassis 10 is provided with a liquid supply port 13 and a liquid drain port 14. The liquid supply port 13 is connected to the non-immersion area 11, and the liquid drain port 14 is connected to the immersion area 12. The liquid cooling module 40 includes a liquid supply device 41, a liquid supply pipeline unit 42, and a cold plate unit 43. The liquid supply device 41 is installed in the liquid cooling chassis 10 and is connected to the liquid supply port 13. One end of the liquid supply pipeline unit 42 is connected to the liquid supply device 41, and the other end of the liquid supply pipeline unit 42 is connected to the cold plate unit 43. The cold plate unit 43 is installed with the first heating module 20 and cooperates in heat transfer. The liquid outlet of the cold plate unit 43 is connected to the immersion area 12. The immersion area 12 contains a cooling medium so that the second heating module 30 is immersed in the cooling medium.

[0048] Optionally, the cooling medium can be any one of water, oil, dielectric cooling medium, etc., and can be flexibly selected according to the needs.

[0049] For example, the cooling medium used in this application is a dielectric cooling medium, specifically non-conductive silicone oil or hydrocarbon synthetic oil. Using high-boiling-point non-conductive cooling oil to cool heat-generating components eliminates the need for a fan, utilizing the ultra-high heat transfer capacity of the submerged coolant, resulting in high overall heat exchange efficiency and strong heat dissipation. The non-conductive cooling oil will not damage any components in the piping and cooling system; even if it leaks, it will not harm any parts on the board, eliminating the risk of short circuits or burn-out caused by leaks of water-based coolants in existing water-cooled plate liquid cooling solutions. The amount of non-conductive cooling oil used is very small, and it hardly evaporates, reducing environmental and health impacts and lowering operating costs.

[0050] In summary, implementing the technical solution of this embodiment will achieve the following beneficial effects: When the node liquid cooling system 100 of this solution is working, the cooling medium is delivered by an external liquid supply device to the liquid supply port 13 of the liquid cooling chassis 10, and then flows into the liquid supply device 41 of the liquid cooling module 40; then, the liquid supply device 41 delivers the cooling medium to the cold plate unit 43 through the liquid supply pipeline unit 42. Since the cold plate unit 43 is installed and cooperates with the first heating module 20 in the non-immersion area 11, the cooling medium can exchange heat with the first heating module 20 during the flow of the cooling medium through the cold plate unit 43, so that the heat generated by the first heating module 20 during operation is absorbed by the cooling medium to achieve the cooling effect, ensuring that the first heating module 20 is always in a normal working temperature state and thus ensuring working performance and safety; furthermore, the cooling medium flows from the cold plate unit 43 to the cold plate unit 43. The cooling medium flows directly into the immersion zone 12 below the non-immersion zone 11, allowing the second heating module 30, originally installed in the immersion zone 12, to be immersed in the cooling medium accumulated in the immersion zone 12. In this way, the second heating module 30 can exchange heat with the cooling medium, so that the heat generated by the second heating module 30 during operation can be absorbed by the cooling medium to achieve cooling and temperature reduction, ensuring that the second heating module 30 is always at a normal operating temperature to guarantee its performance and safety. Finally, when the level of the cooling medium in the immersion zone 12 rises to the drain port 14, it can overflow and be discharged from the liquid cooling housing 10 through the drain port 14. This ensures that there is always a flowing cooling medium participating in the heat dissipation of the first heating module 20 and the second heating module 30, ensuring the heat dissipation effect.

[0051] Compared to traditional technologies, this solution offers several advantages. First, the liquid cooling system replaces the air cooling system, improving cooling efficiency, reducing energy consumption, and avoiding the space limitations of air-cooled modules. Second, compared to traditional liquid cooling solutions, only the first heat-generating module 20 needs a liquid supply pipeline unit 42 and a cold plate unit 43, resulting in a more streamlined arrangement of the cold plate and liquid cooling pipelines, requiring less installation space and shorter pipeline lengths. This effectively reduces the flow resistance of the cooling medium in the pipelines, improves heat dissipation, and also reduces the difficulty of later maintenance.

[0052] Please continue reading. Figures 4 to 7 In one embodiment, the first heating module 20 includes a substrate 21 and at least two first heating units 22, which are arranged side by side at intervals on the substrate 21 along a first direction of the node liquid cooling system 100.

[0053] The liquid supply pipeline unit 42 includes at least two first liquid supply pipelines 421, and the cold plate unit 43 includes at least two first cold plate 431 assemblies. The first liquid outlet of the liquid supply device 41 is connected to the corresponding first cold plate 431 assembly through the first liquid supply pipeline 421. The first cold plate 431 assembly is installed and heats the first heating unit 22 in a one-to-one correspondence.

[0054] The substrate 21 is used to mount and fix at least two first heating units 22, and the substrate 21 is used to assemble and connect with the liquid cooling chassis 10, so as to reliably and stably install the first heating module 20 in the liquid cooling chassis 10. The installation method can be at least one of screwing, snap-fitting, welding, riveting, etc., and can be flexibly selected according to actual needs.

[0055] At least two first heating units 22 are arranged at intervals along the first direction of the node liquid cooling system 100, that is, the length direction, so as to make full use of the length direction space of the liquid cooling chassis 10 and avoid stacking arrangement that would result in excessive thickness of the liquid cooling chassis 10.

[0056] During operation, the liquid supply device 41 simultaneously inputs the cooling medium into at least two first liquid supply lines 421. The cooling medium then flows into the corresponding first cold plate 431 assembly through each first liquid supply line 421 to exchange heat with the corresponding first heating unit 22 and cool down all the first heating units 22.

[0057] Please continue reading. Figure 7 More specifically, based on the above embodiments, the first heating unit 22 includes at least two first main heating devices 221, which are arranged side by side along the second direction of the node liquid cooling system 100, and the second direction intersects with the first direction.

[0058] Optionally, the first main heat-generating device 221 is a GPU (Graphics Processing Unit).

[0059] Please continue reading. Figure 5 The first cold plate 431 assembly includes at least two first cold plates 431. The first cold plates 431 are installed and heat-transferringly cooperate with the first main heating device 221 in a one-to-one correspondence. The first liquid supply pipeline 421 has at least two first liquid supply branch pipes 4211. The first liquid supply branch pipes 4211 are connected to the first cold plates 431 in a one-to-one correspondence. The liquid outlet of the first cold plate 431 is connected to the immersion area 12.

[0060] Because GPUs generate a lot of heat when they are working, each GPU is equipped with a separate first heatsink 431 to ensure the heat absorption efficiency of each GPU and thus ensure the cooling effect.

[0061] It should be noted that the first heating unit 22 may also include two switches arranged in the middle of the substrate 21 and a VR device on top. These devices, as auxiliary heating devices, also have heat transfer contact with each of the first cold plates 431, thereby meeting the heat dissipation requirements.

[0062] For example, in this application, a total of eight GPUs are arranged on the substrate 21, arranged in two rows along the length of the liquid-cooled chassis 10, with four GPUs in each row. Therefore, there are also eight first cold plates 431, which are installed one-to-one with the GPUs. Each first cold plate 431 has a liquid outlet for the cooling medium to flow from the first cold plate 431 into the immersion zone 12.

[0063] However, considering that the cooling medium discharged from the first cold plate 431 in the previous row may damage the GPU or other devices in the next row if it flows through them, in an optional embodiment, the liquid cooling module 40 further includes at least two return pipes 50, which are installed one-to-one with the first cold plate 431 assembly.

[0064] The return liquid pipeline 50 has at least two return liquid branch pipes 51, which are connected to the first cold plate 431 in a one-to-one correspondence. The other end of the return liquid pipeline 50 extends into the immersion zone 12.

[0065] By connecting the return branch pipe 51 to the outlet of each first cold plate 431, the cooling medium flowing out of all the first cold plates 431 can be collected in the return pipe 50 and flow directly into the immersion area 12 under the guidance of the return pipe 50, thereby avoiding the cooling medium from contacting devices such as GPU and causing damage.

[0066] Furthermore, considering that the cooling medium discharged from the first cold plate 431 and flowing into the immersion zone 12 has already reached a high temperature due to absorbing heat from the GPU, its ability to exchange heat with the second heat-generating module 30 is extremely limited, thus affecting the cooling effect on the second heat-generating module 30.

[0067] Therefore, based on any of the above embodiments, the liquid cooling module 40 further includes a second liquid supply pipe 44 and a second cold plate assembly. One end of the second liquid supply pipe 44 is connected to the second liquid outlet of the liquid supply device 41, and the other end of the second liquid supply pipe 44 is connected to the second cold plate assembly. The second cold plate assembly is installed and heat-transferring with the second heating module 30.

[0068] In other words, in actual operation, in addition to using the cooling medium in the immersion zone 12 to immerse and cool the second heating module 30, a low-temperature cooling medium is also supplied from the second outlet of the liquid supply device 41 to the second cold plate assembly through the second liquid supply pipeline 44. This allows the second cold plate assembly to directly exchange heat with the second heating module 30, absorbing and carrying away more heat from the second heating module 30. This liquid cooling of the second heating module 30 compensates for the insufficient heat absorption capacity of the original high-temperature cooling medium in the immersion zone 12, resulting in a combined cooling effect of immersion heat dissipation and liquid cooling on the second heating module 30. This greatly enhances the cooling effect and efficiency of the second heating module 30.

[0069] Understandably, the cooling medium flowing through the second cold plate assembly flows directly into the immersion zone 12 after being discharged from the liquid outlet of the second cold plate assembly, and can also participate in the immersion cooling operation of the second heating module 30, and then is discharged from the liquid outlet 14 of the liquid cooling chassis 10.

[0070] Please continue reading. Figure 5 and Figure 6 More specifically, based on the above embodiments, the second liquid supply pipeline 44 has at least two second liquid supply branch pipes 441, the second cold plate assembly includes at least two second cold plates 45, the second heating module 30 includes a main board and at least two second main heating devices mounted on the main board, the second liquid supply branch pipes 441 and the second cold plates 45 are connected in a one-to-one correspondence, the second cold plates 45 and the second main heating devices are installed in a one-to-one correspondence and cooperate in heat transfer, and the liquid outlet of the second cold plate 45 is connected to the immersion area 12.

[0071] Considering that the second main heating element operates at a high temperature, a second cold plate 45 is configured for each second main heating element to ensure the cooling efficiency of each second main heating element.

[0072] For example, in this application, the second main heat-generating device is a CPU (Central Processing Unit). There are two CPUs specifically configured to enhance the computing power of the node liquid cooling system 100. Therefore, two second cold plates 45 are also configured to be installed corresponding to the CPUs.

[0073] It should be noted that within the immersion zone 12, in the peripheral area of ​​the CPU, there are also low-power, low-heat-flux-density chips, such as memory DIMMs. Therefore, the cooling medium within the immersion zone 12 can also provide immersion cooling for these chips.

[0074] It should also be noted that the first liquid supply line 421 or the second liquid supply line 44 mentioned above can also be supplemented with a tail pipe branch to provide a low-temperature cooling medium for components such as optical module liquid cooling plates in the IO area and storage modules or network card modules such as SSDs or E1.S, which are not immersed in the cooling medium, to meet their heat dissipation requirements.

[0075] Please continue reading. Figure 1 , Figure 2 and Figure 4 In addition, based on any of the above embodiments, the liquid cooling housing 10 is also provided with a liquid extraction port 15. The liquid extraction port 15, the liquid supply port 13 and the liquid discharge port 14 are arranged on the same side of the liquid cooling housing 10. The liquid extraction port 15 is connected to the immersion zone 12. A one-way valve is installed at the liquid extraction port 15. The one-way valve is configured to allow the cooling medium to flow from the immersion zone 12 to the outside of the liquid cooling housing 10 only.

[0076] When the second heating module 30 in the immersion zone 12 is damaged and needs to be disassembled for repair or replacement, an external liquid extraction device can be connected to the liquid extraction port 15 to drain and temporarily store the cooling medium in the immersion zone 12. This makes it easier to remove the second heating module 30 from the liquid cooling housing 10. After the second heating module 30 is repaired, replaced and reinstalled, the temporarily stored cooling medium can be reinjected into the immersion zone 12 through the liquid extraction device. This improves the utilization rate of the cooling medium, avoids waste of resources, and facilitates the maintenance and replacement of the second heating module 30.

[0077] As is easily understood, the one-way valve installed at the extraction port 15 serves two purposes: firstly, to prevent the cooling medium in the immersion zone 12 from leaking from the extraction port 15, ensuring the sealing reliability of the extraction port 15; secondly, when the extraction device is performing extraction operations on the cooling medium in the immersion zone 12, it can also prevent the extracted cooling medium from flowing back into the immersion zone 12, ensuring the efficiency of the extraction operation.

[0078] Please continue reading. Figure 1 , Figure 2 and Figure 4 In another optional embodiment, the node liquid cooling system 100 further includes a power supply interface 16. The power supply interface 16 is disposed on the liquid cooling chassis 10 and electrically connected to the first heating module 20 and the second heating module 30. The power supply interface 16, the liquid supply port 13, and the liquid drain port 14 are arranged on the same side of the liquid cooling chassis 10. Therefore, power can be supplied to the first heating module 20 and the second heating module 30 through the power supply interface 16 to enable the first heating module 20 and the second heating module 30 to operate normally.

[0079] And / or, in another embodiment, the node liquid cooling system 100 further includes an input / output interface 17, which is disposed on the liquid cooling chassis 10 and electrically connected to the first heating module 20 and the second heating module 30. The input / output interface 17, the liquid supply port 13, and the liquid drain port 14 are respectively located on opposite sides of the liquid cooling chassis 10. The input / output interface 17 serves as a connection medium and port, facilitating connection with external devices to enable information exchange between the first heating module 20 and the second heating module 30 and external devices.

[0080] Please continue reading. Figure 1 In another embodiment, the liquid cooling chassis 10 includes a chassis body 10a and a chassis cover 10b. The chassis cover 10b is detachably mounted at the opening of the chassis body 10a, and a handle 10c is provided on the chassis cover 10b. The detachable chassis cover 10b facilitates the insertion and removal of the first heating module 20 and the second heating module 30 from the chassis body 10a. The handle 10c on the chassis cover 10b facilitates the installation and removal of the chassis cover 10b.

[0081] In addition to the above, this application also proposes a server that includes a vertical rack, a plurality of node liquid cooling systems 100 as described in any of the above embodiments, and a liquid supply and return device.

[0082] The vertical rack has multiple storage compartments inside; each node liquid cooling system 100 is installed in a corresponding compartment; the liquid supply and return device is connected to the piping of all node liquid cooling systems 100.

[0083] It should also be noted that the liquid supply and return device is also connected to an external cooling tower for circulating cooling medium, ensuring that the cooling medium delivered to each node of the liquid cooling system 100 remains at a low temperature and has excellent heat absorption capacity, so that the cooling medium continuously cools and lowers the temperature of the first heating module 20 and the second heating module 30.

[0084] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A node liquid cooling system, characterized in that, include: A liquid-cooled chassis, wherein the internal space of the liquid-cooled chassis is divided into a non-immersion zone and an immersion zone, the non-immersion zone being located above the immersion zone, a first heating module being arranged in the non-immersion zone, and a second heating module being arranged in the immersion zone; the liquid-cooled chassis has a liquid supply port and a liquid drain port, the liquid supply port being connected to the non-immersion zone, and the liquid drain port being connected to the immersion zone; as well as The liquid-cooled module includes a liquid supply unit, a liquid supply pipeline unit, and a cold plate unit. The liquid supply unit is installed in the liquid-cooled chassis and connected to the liquid supply port. One end of the liquid supply pipeline unit is connected to the liquid supply unit, and the other end of the liquid supply pipeline unit is connected to the cold plate unit. The cold plate unit is installed and heat-transferringly cooperates with the first heating module. The liquid outlet of the cold plate unit is connected to the immersion zone. The immersion zone contains a cooling medium so that the second heating module is immersed in the cooling medium.

2. The node liquid cooling system according to claim 1, characterized in that, The first heating module includes a substrate and at least two first heating units, wherein the at least two first heating units are arranged side by side at intervals on the substrate along a first direction of the node liquid cooling system; The liquid supply pipeline unit includes at least two first liquid supply pipelines, the cold plate unit includes at least two first cold plate assemblies, the first liquid outlet of the liquid supply device is connected to the corresponding liquid path of the first cold plate assembly through the first liquid supply pipeline, and the first cold plate assembly is installed and heatsinks in a one-to-one correspondence with the first heating unit.

3. The node liquid cooling system according to claim 2, characterized in that, The first heating unit includes at least two first main heating devices, which are arranged side by side along a second direction of the node liquid cooling system, and the second direction intersects with the first direction. The first cold plate assembly includes at least two first cold plates, which are installed and heat-transferringly connected to the first main heating element. The first liquid supply pipeline has at least two first liquid supply branch pipes, which are connected to the first cold plates. The liquid outlet of the first cold plate is connected to the immersion area.

4. The node liquid cooling system according to claim 3, characterized in that, The liquid cooling module also includes at least two liquid return lines, which are installed one-to-one with the first cold plate assembly. The return liquid pipeline has at least two return liquid branch pipes, which are connected to the first cold plate in a one-to-one correspondence, and the other end of the return liquid pipeline extends into the immersion area.

5. The node liquid cooling system according to claim 1, characterized in that, The liquid cooling module further includes a second liquid supply pipeline and a second cold plate assembly. One end of the second liquid supply pipeline is connected to the second liquid outlet of the liquid supply device, and the other end of the second liquid supply pipeline is connected to the second cold plate assembly. The second cold plate assembly is installed and heat-transferring with the second heating module.

6. The node liquid cooling system according to claim 5, characterized in that, The second liquid supply pipeline has at least two second liquid supply branches, the second cold plate assembly includes at least two second cold plates, the second heating module includes a main board and at least two second main heating devices mounted on the main board, the second liquid supply branches are connected to the second cold plates in a one-to-one correspondence, the second cold plates are installed and heat-transferringly cooperate with the second main heating devices in a one-to-one correspondence, and the liquid outlet of the second cold plate is connected to the immersion area.

7. The node liquid cooling system according to claim 1, characterized in that, The liquid cooling chassis is also provided with a liquid extraction port. The liquid extraction port, the liquid supply port and the liquid discharge port are arranged on the same side of the liquid cooling chassis. The liquid extraction port is connected to the immersion zone. A one-way valve is installed at the liquid extraction port. The one-way valve is configured to allow the cooling medium to flow from the immersion zone to the outside of the liquid cooling chassis only.

8. The node liquid cooling system according to claim 1, characterized in that, The node liquid cooling system also includes a power supply interface, which is disposed on the liquid cooling chassis and electrically connected to the first heating module and the second heating module. The power supply interface, the liquid supply port and the liquid drain port are arranged on the same side of the liquid cooling chassis. And / or, the node liquid cooling system further includes an input / output interface, which is disposed on the liquid cooling chassis and electrically connected to the first heating module and the second heating module, and the input / output interface, the liquid supply port and the liquid drain port are respectively located on opposite sides of the liquid cooling chassis.

9. The node liquid cooling system according to claim 1, characterized in that, The liquid cooling chassis includes a chassis body and a chassis cover. The chassis cover is detachably installed at the opening of the chassis body and is provided with a handle.

10. A server, characterized in that, include: A vertical rack, the interior of which forms multiple storage compartments; Multiple node liquid cooling systems as described in any one of claims 1 to 9, wherein each node liquid cooling system is installed in the containment chamber in a one-to-one correspondence; as well as A liquid supply and return device is connected to all the liquid cooling system pipelines of the nodes.

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