A die-bonding aid for integrated circuit transistors

Abstract

This invention discloses a die-bonding auxiliary device for integrated circuit transistors, relating to the field of integrated circuit board processing technology. It includes a support frame on which a first conveyor for transporting integrated circuit boards is mounted. Several transistor conveyors are arranged on the side of the first conveyor. This die-bonding auxiliary device for integrated circuit transistors utilizes a positioning mechanism driven by a first cylinder to move a single axis. Combined with a permanent magnet attraction positioning mechanism and a conversion mechanism involving a slant and slide bar, the vertical upward lifting motion is automatically converted into a lateral clamping motion. This allows for simultaneous lifting and lateral clamping of the circuit board. The support plate first contacts the bottom of the circuit board to provide support, preventing bending of the board that might occur during suspended clamping. The clamping plates then clamp from both sides, and springs provide a degree of adaptability and buffering in the clamping force, effectively preventing hard damage to the circuit board and its surface components, ensuring absolute stability and no displacement of the substrate during the die-bonding process.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit board processing technology, specifically to a die-attaching auxiliary device for integrated circuit transistors. Background Technology

[0002] In the packaging and assembly process of integrated circuits (ICs), the precise and reliable mounting of transistor chips onto the integrated circuit board (PCB) or lead frame coated with solder (such as solder paste, nano silver paste, etc.) is a crucial step, known as die bonding or mounting. The precision of this process directly determines the electrical performance and long-term reliability of the final product.

[0003] Traditional transistor die-attachment aids or automated die-attachment machines typically include basic modules such as conveying, vision positioning, and pick / placement. However, they still have some shortcomings in practical applications:

[0004] 1. Substrate fixation issues: When the chip mounter presses down for mounting, a certain impact force is generated. If the integrated circuit board is not fully and stably fixed, slight slippage or vibration can easily occur, causing the final placement position of the transistor to deviate from the preset coordinates, resulting in chip offset defects, which in turn affects the processing accuracy.

[0005] 2. Transistor release issue: Currently, mainstream equipment uses negative pressure adsorption to pick up and transfer transistor chips. During placement, the negative pressure needs to be released promptly and thoroughly to separate the chip from the pick-up tip. A common solution is to inject a brief positive pressure airflow into the pick-up tip to blow the chip off. However, the intervention of positive pressure airflow has two drawbacks: first, it may interfere with the precision solder patterns (such as nano silver paste) already printed underneath; second, there is a millisecond-level delay or pressure fluctuation in the air path switching, which may cause the chip to bounce or slip slightly at the moment of separation, affecting placement accuracy, especially when handling micro-sized chips. Summary of the Invention

[0006] The purpose of this invention is to provide a die-attachment aid for integrated circuit transistors to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a die-bonding auxiliary device for integrated circuit transistors, comprising a support frame, a first conveyor for transporting integrated circuit boards mounted on the support frame, a plurality of transistor conveyors arranged on the side of the first conveyor, a fixed frame arranged above the support frame, a first industrial camera mounted on the fixed frame for monitoring the position of the integrated circuit boards, and X and Y axis linear motors mounted on the fixed frame.

[0008] A positioning mechanism is used to clamp and fix the integrated circuit board during die bonding to prevent the integrated circuit board from shifting during the bonding process and affecting the accuracy of the bonding position. The positioning mechanism is mounted on a support frame.

[0009] The bonding mechanism achieves precise transistor bonding by automatically releasing negative pressure adsorption. The bonding mechanism is mounted on X and Y axis linear motors, which enable the bonding mechanism to move in the X and Y axis directions.

[0010] Preferably, the support frame has symmetrically fixed limiting plates at the front and back, and the limiting plates contact the integrated circuit board to achieve front and back positioning. The limiting plates are fixedly connected to the fixed frame. Through the function of the limiting plates, the front and back positioning of the integrated circuit board can be achieved, ensuring the stability of the movement of the integrated circuit board.

[0011] Preferably, the positioning mechanism includes a first cylinder fixed on the support frame, and a movable plate is fixed to the output end of the first cylinder. The movable plate is slidably connected to the vertical rod. At the same time, a support plate is fixed to the upper end of the vertical rod. A first spring is fixed between the movable plate and the vertical rod. The sliding action between the movable plate and the vertical rod can ensure the stability of the movable plate's movement. The elastic action of the first spring can ensure the movement of the movable plate relative to the support plate.

[0012] Preferably, the vertical rod and the bracket are slidably connected, and the bracket is fixed on the support frame. An iron plate is fixed at the lower end of the vertical rod, and the iron plate and the permanent magnet are magnetically connected. The permanent magnet is fixed on the bracket, and the distance between the permanent magnet and the iron plate is equal to the distance between the tray and the lower end face of the integrated circuit board. Through the magnetic attraction between the permanent magnet and the iron plate, the tray can be positioned to ensure the normal operation of the device.

[0013] Preferably, the movable plate is also symmetrically fixed with fixing blocks on both sides, and the fixing blocks are provided with inclined grooves. The inclined grooves are slidably connected to the crossbar. At the same time, the crossbar is fixed to the connecting rod. The connecting rod is slidably connected to the guide rod, and a clamping plate is also fixed on the connecting rod. The distance between the upper surface of the clamping plate and the upper surface of the support plate is less than the distance between the support plate and the lower surface of the integrated circuit board. When the movable plate moves relative to the support plate, the sliding action between the inclined grooves and the crossbar can provide a basic force for the movement of the guide rod and the clamping plate, thereby realizing the clamping and fixing of the integrated circuit board and ensuring the accurate position of the integrated circuit board.

[0014] Preferably, the adhesive mechanism includes a second cylinder fixed on an X-axis or Y-axis linear motor, and a negative pressure cylinder is fixed to the output end of the second cylinder. A negative pressure connector is installed on the negative pressure cylinder, and the negative pressure connector is connected to a negative pressure pump through a conduit. The negative pressure cylinder also has through holes evenly distributed on it, and rotatable swing arms are symmetrically connected to the left and right sides of the negative pressure cylinder. A torsion spring is connected between the swing arms and the negative pressure cylinder. The swing arms are slidably connected to the inclined plate fixed on the second cylinder. Through the sliding action between the swing arms and the inclined plate, a basic force can be provided for the swing of the swing arms, thereby providing a basic guarantee for unlocking the swing arms and the locking block.

[0015] Preferably, one end of the negative pressure cylinder is fixed to the folded corrugated tube, and the other end of the folded corrugated tube is fixed to the circular plate. A second spring is fixed between the circular plate and the negative pressure cylinder. With the above structure, flexible downward pressure can be achieved when the transistor is pasted, ensuring the stability of the transistor and the integrated circuit board.

[0016] Preferably, a second industrial camera is symmetrically fixed on the lower end face of the circular plate, and a negative pressure suction head is also fixed on the lower end face of the circular plate. A silicone pad is fixed on the lower end face of the negative pressure suction head. Visual positioning can be performed through the second industrial camera to ensure the accuracy of the transistor bonding position.

[0017] Preferably, a circular rod is fixed at an equal angle on the circular plate, and a movable ring is fixed at the upper end of the circular rod. A sealing ring is fixed on the movable ring, and the sealing ring is slidably connected to the negative pressure cylinder. The sealing ring cooperates with the through hole to achieve a sealing effect, and the height of the sealing ring is greater than the diameter of the through hole. A locking block is also fixed on the movable ring, and the locking block cooperates with the swing rod to achieve a positioning effect. Through the sliding action between the sealing ring and the negative pressure cylinder, the sealing and unsealing of the through hole can be achieved, thereby ensuring the normal operation of the device.

[0018] Preferably, a hollow rod is also fixed on the circular plate, and a silicone sealing plate is fixed on the upper end of the hollow rod. The hollow rod and the sliding rod are slidably connected, and the silicone sealing plate cooperates with the opening on the lower end face of the negative pressure cylinder to achieve a sealing effect. Through the above structure, auxiliary positioning can be achieved after the transistor is pasted, avoiding the transistor position from shifting and further ensuring the accuracy of processing.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] 1. The die-bonding auxiliary device for integrated circuit transistors uses a single-axis motion driven by the first cylinder in the positioning mechanism. Combined with the permanent magnet attraction positioning and the conversion mechanism of the inclined groove and slide bar, the vertical upward lifting motion is automatically converted into the horizontal clamping motion. This allows for the simultaneous lifting and lateral clamping of the circuit board. The support plate first contacts the bottom of the circuit board to provide support, avoiding bending of the board that may be caused by suspended clamping. The clamping plate clamps from both sides, and the springs provide a certain degree of self-adaptation and buffering for the clamping force, effectively preventing hard damage to the circuit board and its surface components, and ensuring that the substrate is absolutely stable and without displacement during the die-bonding process.

[0021] 2. The die-attachment auxiliary device for this integrated circuit transistor can precisely control two states during the die-attachment process through the die-attachment mechanism. When the transistor is in contact with the integrated circuit board, the elasticity of the second spring provides a flexible downward pressure force to ensure the stability of the die-attachment. In conjunction with the sealing ring, the seal of the through hole can be automatically released, allowing outside air to enter the negative pressure cylinder instantly, thereby disrupting the main negative pressure of the negative pressure suction head and automatically eliminating the adsorption force on the transistor. Then, the silicone sealing plate moves up to seal the lower port of the negative pressure cylinder, physically isolating the continuous suction of the negative pressure pump and preventing it from re-establishing or maintaining the residual negative pressure. This ensures that the transistor is not subject to any lateral force or airflow disturbance at the moment it is removed from the suction head, but only to the vertical downward pressure, thus accurately positioning and pressing it onto the solder, greatly improving the placement accuracy and repeatability. Attached Figure Description

[0022] Figure 1 This is a frontal three-dimensional structural diagram of the overall composition of the device of the present invention;

[0023] Figure 2 This is a bottom-view three-dimensional structural diagram of the positioning mechanism of the present invention;

[0024] Figure 3 This is a frontal three-dimensional structural diagram of the adhesive mechanism of the present invention;

[0025] Figure 4 This is a bottom-view three-dimensional structural diagram of the adhesive mechanism of the present invention;

[0026] Figure 5 This is a frontal cross-sectional three-dimensional structural diagram of the adhesive mechanism of the present invention;

[0027] Figure 6 This is a schematic diagram of the three-dimensional structure of the circular plate in front view.

[0028] In the diagram: 1. Support frame; 101. Limiting plate; 2. First conveyor; 3. Integrated circuit board; 4. Transistor conveyor; 5. Fixing frame; 6. First industrial camera; 7. X and Y axis linear motors; 8. Positioning mechanism; 801. First cylinder; 802. Movable plate; 803. Vertical rod; 804. Support plate; 805. First spring; 806. Bracket; 807. Iron plate; 808. Permanent magnet; 809. Fixing block; 810. Inclined groove; 811. Crossbar; 812. Connecting rod; 81 3. Guide rod; 814. Clamping plate; 9. Adhesive plate mechanism; 901. Second cylinder; 902. Negative pressure cylinder; 903. Negative pressure connector; 904. Through hole; 905. Swing rod; 906. Slanted panel; 907. Folded corrugated tube; 908. Round plate; 909. Second spring; 910. Second industrial camera; 911. Negative pressure suction head; 912. Silicone pad; 913. Round rod; 914. Movable ring; 915. Sealing ring; 916. Locking block; 917. Hollow rod; 918. Silicone sealing plate. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figures 1-6 The present invention provides a technical solution: a die bonding auxiliary device for integrated circuit transistors, including a support frame 1, a first conveyor 2 for conveying integrated circuit board 3 is mounted on the support frame 1, a plurality of transistor conveyors 4 are arranged on the side of the first conveyor 2, a fixed frame 5 is arranged above the support frame 1, a first industrial camera 6 is mounted on the fixed frame 5 for monitoring the position of integrated circuit board 3, and X and Y axis linear motors 7 are mounted on the fixed frame 5.

[0031] The positioning mechanism 8 is used to clamp and fix the integrated circuit board 3 during the bonding process, so as to prevent the integrated circuit board 3 from shifting during the bonding process and affecting the accuracy of the bonding position. The positioning mechanism 8 is mounted on the support frame 1.

[0032] The bonding mechanism 9 achieves precise bonding of transistors by automatically releasing negative pressure adsorption. The bonding mechanism 9 is mounted on the X and Y axis linear motors 7, and the X and Y axis linear motors 7 enable the bonding mechanism 9 to move in the X and Y axis directions.

[0033] A limiting plate 101 is symmetrically fixed to the support frame 1, and the limiting plate 101 contacts the integrated circuit board 3 to achieve front and rear positioning. The limiting plate 101 is fixedly connected to the fixed frame 5. The positioning mechanism 8 includes a first cylinder 801 fixed to the support frame 1, and a movable plate 802 is fixed to the output end of the first cylinder 801. The movable plate 802 is slidably connected to the vertical rod 803. At the same time, a support plate 804 is fixed to the upper end of the vertical rod 803. A first spring 805 is fixed between the movable plate 802 and the vertical rod 803. The vertical rod 803 is slidably connected to the bracket 806, and the bracket 806 is fixed to the support frame 1. An iron plate 807 is fixed to the lower end of the vertical rod 803. The iron plate 807 is slidably connected to the support frame 1. The permanent magnets 808 are magnetically connected to each other and fixed on the bracket 806. The distance between the permanent magnets 808 and the iron plate 807 is equal to the distance between the support plate 804 and the lower end face of the integrated circuit board 3. The movable plate 802 is also symmetrically fixed with fixing blocks 809, and the fixing blocks 809 are provided with inclined grooves 810. The inclined grooves 810 and the crossbar 811 are slidably connected. At the same time, the crossbar 811 is fixed on the connecting rod 812. The connecting rod 812 and the guide rod 813 are slidably connected. The connecting rod 812 is also fixed with a clamping plate 814. The distance between the upper end face of the clamping plate 814 and the upper end face of the support plate 804 is less than the distance between the support plate 804 and the lower end face of the integrated circuit board 3.

[0034] When using the die-attachment aid for integrated circuit transistors, such as Figures 1-6 As shown, the integrated circuit board 3 coated with solder paste can be transported by the first conveyor 2. The limit plate 101 limits the front and rear movement of the integrated circuit board 3 to ensure the stability of the movement of the integrated circuit board 3. Different types of transistors can be transported by several transistor conveyors 4. During the movement of the integrated circuit board 3, the position of the integrated circuit board 3 can be monitored by the first industrial camera 6. When the integrated circuit board 3 moves directly above the movable plate 802, the first conveyor 2 stops transporting the integrated circuit board 3.

[0035] To prevent the integrated circuit board 3 from shifting during subsequent transistor bonding, the first cylinder 801 extends, causing the movable plate 802, vertical rod 803, support plate 804, first spring 805, and iron plate 807 to move upwards synchronously. Combined with the sliding guide action between the vertical rod 803 and the bracket 806, the stability of the movable plate 802 and support plate 804 is ensured. When the iron plate 807 contacts the permanent magnet 808 for adsorption and fixation, the support plate 804 is in contact with the lower surface of the integrated circuit board 3, and the clamping plate 814 is located on both sides of the integrated circuit board 3. As the first cylinder 801 continues to extend, the iron plate 807 contacts the permanent magnet 808 for positioning, meaning the position of the support plate 804 remains unchanged, thus ensuring the stability of the support plate. When 804 is subjected to force, it moves relative to the support plate 804, thereby synchronously driving the fixed block 809 to move. Through the sliding action between the inclined groove 810 and the crossbar 811, the connecting rod 812 and the clamping plate 814 can move laterally. With the sliding guiding action between the connecting rod 812 and the guide rod 813, the stability of the movement of the connecting rod 812 and the clamping plate 814 can be ensured, thereby adjusting the distance between the left and right clamping plates 814 until the clamping plates 814 contact the integrated circuit board 3 to achieve the left and right positioning of the integrated circuit board 3. With the limit plate 101 limiting the front and rear of the integrated circuit board 3, the stability of the integrated circuit board 3 can be ensured, effectively preventing the integrated circuit board 3 from shifting during subsequent transistor pasting and affecting the accuracy of the transistor pasting position.

[0036] The bonding mechanism 9 includes a second cylinder 901 fixed to the X and Y axis linear motors 7. A negative pressure cylinder 902 is fixed to the output end of the second cylinder 901, and a negative pressure connector 903 is installed on the negative pressure cylinder 902. The negative pressure connector 903 is connected to a negative pressure pump via a conduit. The negative pressure cylinder 902 also has evenly spaced through holes 904, and rotatable rocker arms 905 are symmetrically connected to it. A torsion spring connects the rocker arm 905 to the negative pressure cylinder 902, and the rocker arm 905 is slidably connected to the inclined plate 906 fixed to the second cylinder 901. One end of the negative pressure cylinder 902 is fixed to a folded corrugated tube 907, and the other end of the folded corrugated tube 907 is fixed to a circular plate 908. A second spring 909 is fixed between the circular plate 908 and the negative pressure cylinder 902. Symmetrical springs 909 are fixed to the lower end face of the circular plate 908. The second industrial camera 910 is also included, and a negative pressure suction head 911 is fixed to the lower end face of the circular plate 908, with a silicone pad 912 fixed to the lower end face of the negative pressure suction head 911. A circular rod 913 is also fixed at equal angles on the circular plate 908, and a movable ring 914 is fixed to the upper end of the circular rod 913. A sealing ring 915 is fixed to the movable ring 914, and the sealing ring 915 is slidably connected to the negative pressure cylinder 902. The sealing ring 915 cooperates with the through hole 904 to achieve a sealing effect, and the height of the sealing ring 915 is greater than the diameter of the through hole 904. A locking block 916 is also fixed to the movable ring 914, and the locking block 916 cooperates with the swing rod 905 to achieve a positioning effect. A hollow rod 917 is also fixed to the circular plate 908, and a silicone sealing plate 918 is fixed to the upper end of the hollow rod 917. The silicone sealing plate 918 cooperates with the opening on the lower end face of the negative pressure cylinder 902 to achieve a sealing effect.

[0037] After the integrated circuit board 3 is fixed, as follows Figures 1-6 As shown, the X and Y axis linear motors 7 can drive the second cylinder 901 to move back and forth or left and right, thereby adjusting the position of the negative pressure suction head 911. Depending on the transistor to be attached, the negative pressure suction head 911 can be moved above the corresponding transistor conveyor 4 for transistor pickup. When picking up the transistor, the extension of the second cylinder 901 can move the negative pressure cylinder 902 and the negative pressure suction head 911 downwards. When the negative pressure suction head 911 contacts the transistor, the second spring 909 is not under force or is slightly contracted. In the contracted state, the sealing ring 915 blocks and seals the through hole 904. With the action of the negative pressure pump, negative pressure is generated in the negative pressure cylinder 902, the folded bellows 907 and the negative pressure suction head 911, thereby achieving the adsorption of the transistor. Then, the contraction of the second cylinder 901 can cause the negative pressure suction head 911 to drive the adsorbed transistor to reset. The position of the negative pressure suction head 911 and the transistor can be adjusted by the X and Y axis linear motors 7. With the action of the second industrial camera 910, the adsorbed transistor can be moved to directly above the pasting position.

[0038] During the bonding of the transistor, the extension of the second cylinder 901 causes the negative pressure cylinder 902, the swing rod 905, the negative pressure suction head 911, and the adsorbed transistor to move downwards. When the swing rod 905 separates from the inclined plate 906, it returns to a vertical position under the elastic action of the torsion spring. At this point, the negative pressure cylinder 902, the swing rod 905, the negative pressure suction head 911, and the adsorbed transistor continue to move downwards. When the transistor contacts the integrated circuit board 3, the extension of the second cylinder 901 causes the negative pressure suction head 911 and the circular plate 908 to move relative to the negative pressure cylinder 902, thereby moving the circular rod 913, the movable ring 914, the sealing ring 915, and the locking block 916. At this time, the sealing ring 915 slides on the outside of the negative pressure cylinder 902. When the locking block 916 contacts the swing rod 905, the swing rod 905 can be tilted by the sliding action between the upper inclined surface of the locking block 916 and the upper inclined surface of the swing rod 905. When the upper inclined surface of the locking block 916 separates from the upper inclined surface of the swing rod 905, the locking block 916 can be engaged with the swing rod 905 under the action of the torsion spring, thereby realizing the position locking function of the circular plate 908, the circular rod 913, the movable ring 914 and the sealing ring 915. When the locking block 916 moves upward and contacts the swing rod 905, the sealing ring 915 separates from the through hole 904. At this time, the negative pressure state inside the negative pressure cylinder 902 and the negative pressure suction head 911 is destroyed. However, due to the continuous suction of the negative pressure pump, the negative pressure cylinder 902 and the negative pressure suction head 911 are in a slightly negative pressure state. When the locking block 916 moves upward and engages with the swing rod 905, the silicone sealing plate 918 contacts the opening at the lower end of the negative pressure cylinder 902 to achieve a seal. This prevents the continuous suction of the negative pressure pump from affecting the negative pressure suction head 911, thus automatically releasing the adsorption between the negative pressure suction head 911 and the transistor. At this time, the negative pressure suction head 911 acts as a pressure head to press and position the transistor and the integrated circuit board 3. After the transistor and the integrated circuit board 3 are pasted together, the negative pressure suction head 911 can be reset by retracting the second cylinder 901. At this time, due to the locking block 916 and the swing rod 905, the negative pressure suction head 911 is released. The locking action between the rods 905 ensures that the silicone sealing plate 918 and the lower end opening of the negative pressure cylinder 902 remain sealed. This prevents the negative pressure pump from generating negative pressure on the negative pressure suction head 911, effectively avoiding displacement of the transistor's bonding position due to negative pressure when the negative pressure suction head 911 is separated from the transistor. This ensures the accuracy of the transistor's bonding position. After the negative pressure cylinder 902 has moved upward and reset, the sliding action between the swing rod 905 and the inclined plate 906 releases the locking action between the locking block 916 and the swing rod 905. Combined with the second spring 909, the negative pressure suction head 911 can be reset relative to the negative pressure cylinder 902 for the next processing.

[0039] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above descriptions are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. A die-attachment aid for integrated circuit transistors, comprising a support frame (1), characterized in that: The support frame (1) is equipped with a first conveyor (2) for transporting the integrated circuit board (3). Several transistor conveyors (4) are arranged on the side of the first conveyor (2). A fixed frame (5) is arranged above the support frame (1). A first industrial camera (6) is installed on the fixed frame (5) for monitoring the position of the integrated circuit board (3). X and Y axis linear motors (7) are installed on the fixed frame (5). The positioning mechanism (8) is used to clamp and fix the integrated circuit board (3) during the bonding process to prevent the integrated circuit board (3) from shifting during the bonding process and affecting the accuracy of the bonding position. The positioning mechanism (8) is installed on the support frame (1). The bonding mechanism (9) achieves precise bonding of transistors by automatically releasing negative pressure adsorption. The bonding mechanism (9) is mounted on the X and Y axis linear motors (7), and the bonding mechanism (9) can move in the X and Y axis directions through the X and Y axis linear motors (7).

2. The die-attachment aid for integrated circuit transistors according to claim 1, characterized in that: The support frame (1) is symmetrically fixed with a limiting plate (101) in front and back, and the limiting plate (101) contacts the integrated circuit board (3) to achieve front and back positioning. The limiting plate (101) and the fixed frame (5) are fixedly connected.

3. The die-attachment aid for integrated circuit transistors according to claim 1, characterized in that: The positioning mechanism (8) includes a first cylinder (801) fixed on the support frame (1), and a movable plate (802) is fixed at the output end of the first cylinder (801). The movable plate (802) and the vertical rod (803) are slidably connected. Meanwhile, a support plate (804) is fixed at the upper end of the vertical rod (803). A first spring (805) is fixed between the movable plate (802) and the vertical rod (803).

4. The die-attachment aid for an integrated circuit transistor according to claim 3, characterized in that: The vertical rod (803) and the bracket (806) are slidably connected, and the bracket (806) is fixed on the support frame (1). The lower end of the vertical rod (803) is fixed with an iron plate (807). At the same time, the iron plate (807) and the permanent magnet (808) are magnetically connected. The permanent magnet (808) is fixed on the bracket (806), and the distance between the permanent magnet (808) and the iron plate (807) is equal to the distance between the tray (804) and the lower end face of the integrated circuit board (3).

5. The die-attachment aid for an integrated circuit transistor according to claim 4, characterized in that: The movable plate (802) is also symmetrically fixed with fixing blocks (809), and the fixing blocks (809) are provided with inclined grooves (810), and the inclined grooves (810) are slidably connected to the crossbar (811). At the same time, the crossbar (811) is fixed on the connecting rod (812), and the connecting rod (812) is slidably connected to the guide rod (813). The connecting rod (812) is also fixed with a clamping plate (814), and the distance between the upper end face of the clamping plate (814) and the upper end face of the support plate (804) is less than the distance between the support plate (804) and the lower end face of the integrated circuit board (3).

6. The die-attachment aid for an integrated circuit transistor according to claim 1, characterized in that: The adhesive plate mechanism (9) includes a second cylinder (901) fixed on the X and Y axis linear motors (7), and a negative pressure cylinder (902) is fixed at the output end of the second cylinder (901). A negative pressure connector (903) is installed on the negative pressure cylinder (902), and the negative pressure connector (903) is connected to the negative pressure pump through a conduit. The negative pressure cylinder (902) is also evenly provided with through holes (904), and rotatable swing rods (905) are symmetrically connected on the left and right sides of the negative pressure cylinder (902). A torsion spring is connected between the swing rod (905) and the negative pressure cylinder (902), and the swing rod (905) is slidably connected to the inclined plate (906) fixed on the second cylinder (901).

7. The die-attachment aid for an integrated circuit transistor according to claim 6, characterized in that: The negative pressure cylinder (902) is fixed to one end of the folded corrugated pipe (907), and the other end of the folded corrugated pipe (907) is fixed on the circular plate (908). A second spring (909) is fixed between the circular plate (908) and the negative pressure cylinder (902).

8. The die-attachment aid for an integrated circuit transistor according to claim 7, characterized in that: The lower end face of the circular plate (908) is symmetrically fixed with a second industrial camera (910), and a negative pressure suction head (911) is also fixed on the lower end face of the circular plate (908), and a silicone pad (912) is fixed on the lower end face of the negative pressure suction head (911).

9. The die-attachment aid for an integrated circuit transistor according to claim 8, characterized in that: A circular rod (913) is fixed at equal angles on the circular plate (908), and a movable ring (914) is fixed at the upper end of the circular rod (913). A sealing ring (915) is fixed on the movable ring (914). The sealing ring (915) and the negative pressure cylinder (902) are slidably connected. The sealing ring (915) cooperates with the through hole (904) to achieve a sealing effect. The height of the sealing ring (915) is greater than the diameter of the through hole (904). A locking block (916) is also fixed on the movable ring (914), and the locking block (916) cooperates with the swing rod (905) to achieve a positioning effect.

10. The die-attachment aid for an integrated circuit transistor according to claim 9, characterized in that: A hollow rod (917) is also fixed on the circular plate (908), and a silicone sealing plate (918) is fixed on the upper end of the hollow rod (917). The silicone sealing plate (918) cooperates with the opening on the lower end face of the negative pressure cylinder (902) to achieve a sealing effect.

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