Method of producing an emitter and backside passivated cell
By simplifying the fabrication process of solar cells through steps such as texturing, diffusion doping, etching, thin film deposition, and grid line printing, the photoelectric conversion efficiency and stability are improved, and the problem of complex processes in existing technologies is solved.
CN122138495APending Publication Date: 2026-06-02华能(嘉峪关)新能源有限公司 +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 华能(嘉峪关)新能源有限公司
- Filing Date
- 2024-11-30
- Publication Date
- 2026-06-02
AI Technical Summary
Technical Problem
The existing manufacturing process for solar cells is complex, resulting in low production efficiency.
Method used
By employing steps such as texturing, diffusion doping, etching, thin film deposition, grooving, grid line printing, and sintering, a pyramid-shaped textured surface structure and a locally open structure are formed, which improves light capture efficiency and ensures good contact between the electrode material and the silicon wafer.
Benefits of technology
It simplifies the fabrication process, improves the photoelectric conversion efficiency and stability of solar cells, and enhances the passivation effect and current extraction capability of the cells.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122138495A_ABST
Abstract
This invention belongs to the field of solar cell manufacturing technology and relates to a method for producing an emitter and back-side passivated solar cell. The method involves texturing a silicon wafer to form a pyramidal textured surface, improving light capture efficiency and thus increasing the photoelectric conversion efficiency of the cell; diffusing and doping N-type impurities onto the front side of the texturized silicon wafer; etching the back side and edges of the diffused-doped silicon wafer to remove excess material and improve cell efficiency; depositing a silicon nitride film on the front and back sides of the etched silicon wafer, and depositing an aluminum oxide film on the silicon nitride film on the back side; creating rectangular grooves on the back side of the silicon wafer; printing sub-grid lines and main grid lines on the silicon wafer; and sintering the printed silicon wafer at high temperature to obtain the emitter and back-side passivated solar cell. This invention's method for producing emitter and back-side passivated solar cells has a relatively simple manufacturing process and high cell efficiency.
Need to check novelty before this filing date? Find Prior Art