Wafer caching device, anti-collision control method thereof and wafer production line

Abstract

This invention provides a wafer cache device, a wafer production line, and a collision avoidance control method for the wafer cache device. The wafer cache device includes: a robotic arm with a gripper assembly at one end for gripping or releasing the mating part of a wafer cassette; a first distance detection element disposed on the robotic arm and located at the end of the robotic arm near the gripper assembly for detecting the distance between the robotic arm and the mating part; and a control system electrically connected to either the robotic arm or the first distance detection element. The control system can control the operating state of the robotic arm based on the detection result of the first distance detection element, that is, unify the measurement reference with the motion reference of the robotic arm, thereby directly and accurately obtaining the dynamic relative distance between the robotic arm and the mating part of the wafer cassette, improving the accuracy and reliability of collision avoidance.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer caching device, its anti-collision control method, and a wafer production line. Background Technology

[0002] Currently, wafer caching units (NTBs) are key equipment in wafer production lines. The robotic arms within these NTBs are primarily responsible for handling and positioning wafer cassettes. Related technologies typically employ sensors positioned on the NTB's frame or other fixed locations to detect the relative position of the robotic arm and the wafer cassette, thus preventing collisions.

[0003] However, due to the fixed position of the sensor, the positioning accuracy of the robot and the wafer cassette is insufficient, and collisions are likely to occur when the robot approaches or grasps the wafer cassette. Summary of the Invention

[0004] This invention provides a wafer caching device, its anti-collision control method, and a wafer production line to solve the problem of collisions that easily occur when the robotic arm of the wafer caching device approaches or grasps the wafer cassette in related technologies.

[0005] This invention provides a wafer cache device, comprising: A robotic arm, one end of which has a gripper assembly for gripping or releasing the mating part of a wafer cassette; A first distance detection element is disposed on the robotic arm and located at one end of the robotic arm near the gripper assembly, for detecting the distance between the robotic arm and the mating part; The control system is electrically connected to either the robotic arm or the first distance detection device, and the control system is capable of controlling the operating state of the robotic arm based on the detection result of the first distance detection device.

[0006] According to a wafer caching device provided by the present invention, the number of the first distance detection elements is at least two, and along a first direction, the at least two first distance detection elements are respectively located on opposite sides of the robotic arm.

[0007] According to a wafer caching device provided by the present invention, the robotic arm further includes: A robotic arm, wherein the gripper assembly is disposed on the robotic arm; A support is connected to the robotic arm, and the first distance detection element is connected to the support and is rotatable relative to the support.

[0008] According to a wafer caching device provided by the present invention, the robotic arm includes a connected bottom wall and a side wall, the gripper assembly is disposed on the bottom wall, the support is connected to the side wall, and the first distance detection element is located on the side wall.

[0009] According to a wafer cache device provided by the present invention, the gripper assembly includes a plurality of grippers, wherein the plurality of grippers includes at least a first gripper and a second gripper arranged at intervals along a second direction; Wherein, the distance between the first distance detection element and the first gripper in the second direction is equal to the distance between the first distance detection element and the second gripper in the second direction.

[0010] According to a wafer cache device provided by the present invention, the wafer cache device further includes: A second distance detection element is disposed on the robot arm and is located on the same side of the robot arm as the first distance detection element. The second distance detection element is electrically connected to the control system and is used to detect the distance between the robot arm and the mating part.

[0011] According to a wafer cache device provided by the present invention, the wafer cache device further includes: The device frame includes a cache slot for storing the wafer cassette. A third distance detection device is disposed on the equipment frame and electrically connected to the control system, and is used to detect the distance between the robot and the wafer cassette.

[0012] According to a wafer caching device provided by the present invention, the first distance detection element includes a laser rangefinder, an ultrasonic rangefinder, or a binocular stereo vision system.

[0013] According to the present invention, a wafer cache device is provided, wherein the control system includes: The collision avoidance controller is electrically connected to the first distance detection device; The main control module is electrically connected to either the anti-collision controller or the robotic arm.

[0014] The present invention also provides a wafer production line, including any of the above-mentioned wafer caching devices.

[0015] The present invention also provides a collision avoidance control method for a wafer cache device, used in any of the above-mentioned wafer cache devices, the collision avoidance control method comprising: During the process of the robotic arm approaching the wafer cassette, the distance between the robotic arm and the mating part is detected; The operating state of the robotic arm is controlled based on the distance between the robotic arm and the mating part.

[0016] According to the present invention, a collision avoidance control method for a wafer cache device, wherein controlling the operating state of the robotic arm based on the distance between the robotic arm and the mating part specifically includes: If the distance between the robotic arm and the mating part is less than the safe distance, a warning signal will be issued; When the distance between the robotic arm and the mating part reaches a warning threshold, the robotic arm is controlled to decelerate, stop, or retreat. Wherein, the safe distance is greater than the warning threshold.

[0017] According to the present invention, a collision avoidance control method for a wafer cache device, wherein controlling the operating state of the robotic arm based on the distance between the robotic arm and the mating part specifically includes: The operating information of the robotic arm is determined based on the distance between the robotic arm and the mating part; Based on the historical distance data between the robotic arm and the mating part, and the operation information, determine the trend of distance change between the robotic arm and the mating part within a future set time period; The operating state of the robotic arm is controlled according to the distance change trend; The operational information includes the current operating speed and / or acceleration of the robotic arm.

[0018] The wafer caching device, its anti-collision control method, and wafer production line provided by this invention integrate a first distance detection component for detecting the distance between the mating part and the robot arm onto the robot arm. This means that as the robot arm approaches or grasps the wafer cassette, it can drive the first distance detection component to move, thus unifying the measurement reference with the robot arm's motion reference. This allows for direct and accurate acquisition of the dynamic relative distance between the robot arm and the mating part of the wafer cassette. The control system controls the robot arm's operating state based on this dynamic relative distance, thereby actively avoiding collisions. Furthermore, compared to related technologies where sensors are fixedly mounted on the equipment frame, this avoids indirect measurement errors caused by the robot arm's own positioning errors, structural deformation, or vibration, ensuring data accuracy from the source. This achieves higher-precision real-time monitoring of the distance between the robot arm and the wafer cassette, improving the accuracy and reliability of collision avoidance.

[0019] Moreover, integrating the first distance detection component into the robotic arm results in a compact structure, eliminating the need for complex installation work and wiring for the sensor on the equipment frame. This leads to higher equipment integration and reduces reliance on and modifications to the equipment frame structure, making the equipment simpler, easier to install and maintain, and ultimately reducing overall costs.

[0020] Furthermore, by using the distance signal detected by the first distance detection device as direct feedback to the closed-loop control system, collision avoidance decisions can be made based on the real-time dynamic position of the robot itself, resulting in faster response speed and higher control precision. This is beneficial to improving the reliability and safety of wafer cache equipment and the entire wafer production line. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is one of the partial structural schematic diagrams of the wafer cache device provided by the present invention.

[0023] Figure 2 This is the second partial structural schematic diagram of the wafer cache device provided by the present invention.

[0024] Figure 3 This is a schematic block diagram of the wafer cache device provided by the present invention.

[0025] Figure 4 This is a flowchart of the anti-collision control method for the wafer cache device provided by the present invention.

[0026] Figure label: 1: Wafer cache device; 10: Robotic arm; 12: Gripper assembly; 122: Gripper; 124: First gripper; 126: Second gripper; 14: Robotic arm; 142: Bottom wall; 144: Side wall; 16: Support; 20: First distance detection component; 30: Control system; 32: Anti-collision controller; 34: Main control module; 4: Wafer box; 40: Mating part; 5: Laser beam; X: First direction; Y: Second direction. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0028] Currently, with the continuous development of semiconductor manufacturing processes, the wafer caching unit (NTB), as a key piece of equipment in the wafer production line, has a significant impact on overall production efficiency due to its level of automation and operational reliability. Within the wafer caching unit, robotic arms are responsible for the handling and positioning of the wafer pod upholstery (FOUP), and its operational safety directly relates to the integrity of expensive wafers and the continuous operation of the production line.

[0029] In related technologies, the anti-collision system for robotic arms in wafer caching devices mainly adopts a fixed sensor arrangement scheme, in which various sensors are fixedly installed on the equipment frame or in specific positions. Collisions are avoided by detecting the relative position of the robotic arm with respect to the surrounding environment. However, the fixed sensor arrangement scheme has insufficient sensing and positioning accuracy, making it difficult to accurately identify the position and orientation of the wafer cassette. In particular, when the wafer cassette is used multiple times or is slightly tilted, it is easy for the robotic arm to bump into or grab the wafer cassette during the process.

[0030] Based on this, the present invention provides a wafer caching device that integrates a first distance detection component for detecting the distance between the mating part and the robot arm onto the robot arm. In other words, during the process of the robot arm approaching or grasping the wafer cassette, the first distance detection component can be driven to move, thereby unifying the measurement reference with the movement reference of the robot arm. This allows for the direct and accurate acquisition of the dynamic relative distance between the mating part of the robot arm and the wafer cassette. The control system can accurately identify the position and orientation of the wafer cassette based on this dynamic relative distance, for example, whether the wafer cassette is tilted.

[0031] The control system controls the robot's operation based on this dynamic relative distance, effectively preventing collisions during the robot's approach to or grasping of the wafer cassette, thus proactively avoiding collisions. Furthermore, compared to related technologies that fix sensors to the equipment frame, this avoids indirect measurement errors caused by the robot's own positioning errors, structural deformation, or vibrations, ensuring data accuracy from the source. This enables more precise real-time monitoring of the distance between the robot and the wafer cassette, improving the accuracy and reliability of collision avoidance.

[0032] Moreover, integrating the first distance detection component into the robotic arm results in a compact structure, eliminating the need for complex installation work and wiring for the sensor on the equipment frame. This leads to higher equipment integration and reduces reliance on and modifications to the equipment frame structure, making the equipment simpler, easier to install and maintain, and ultimately reducing overall costs.

[0033] Furthermore, by using the distance signal detected by the first distance detection device as direct feedback to the closed-loop control system, collision avoidance decisions can be made based on the real-time dynamic position of the robot itself, resulting in faster response speed and higher control precision. This is beneficial to improving the reliability and safety of wafer cache equipment and the entire wafer production line.

[0034] The following is combined with Figures 1 to 4 The present invention describes a wafer cache device, a wafer production line, and a collision avoidance control method for the wafer cache device.

[0035] Firstly, such as Figure 1 and Figure 3As shown, this embodiment provides a wafer cache device 1, which includes a robotic arm 10, a first distance detection element 20, and a control system 30. One end of the robotic arm 10 has a gripper assembly 12 for gripping or releasing the mating portion 40 of the wafer cassette 4. The first distance detection element 20 is disposed on the robotic arm 10 and located at the end of the robotic arm 10 near the gripper assembly 12, and is used to detect the distance between the robotic arm 10 and the mating portion 40. The control system 30 is electrically connected to either the robotic arm 10 or the first distance detection element 20, and the control system 30 can control the operating state of the robotic arm 10 based on the detection result of the first distance detection element 20.

[0036] The wafer caching device 1 in this embodiment includes a robotic arm 10, a first distance detection element 20, and a control system 30. Specifically, as the robotic arm 10 approaches the wafer cassette 4, the first distance detection element 20 is electrically connected to the control system 30. The first distance detection element 20 sends the detected distance data to the control system 30 in real time. When the control system 30 determines that the dynamic distance between the robotic arm 10 and the mating part 40 is less than the safe distance, it indicates that the robotic arm 10 is too close to the wafer cassette 4, or that the wafer cassette 4 is tilted. If the robotic arm 10 continues to move, there is a risk of collision. At this time, the control system 30 can control the robotic arm 10 to decelerate, pause, or retreat, thereby avoiding collision between the robotic arm 10 and the wafer cassette 4.

[0037] It is understandable that if the dynamic distance between the robotic arm 10 and the mating part 40 is always greater than or equal to the current safe distance, it indicates that the robotic arm 10 is in a safe state and there is no need to interfere with its normal movement. The robotic arm 10 can grasp the wafer cassette 4 by grasping the mating part 40.

[0038] By integrating the first distance detection element 20, which is used to detect the distance between the mating part 40 and the robot arm 10, onto the robot arm 10, that is, when the robot arm 10 approaches or grasps the wafer cassette 4, it can drive the first distance detection element 20 to move, that is, unify the measurement reference with the movement reference of the robot arm 10, so that the dynamic relative distance between the robot arm 10 and the mating part 40 of the wafer cassette 4 can be directly and accurately obtained. The control system 30 can accurately identify the position and orientation of the wafer cassette 4 based on the dynamic relative distance, for example, whether the wafer cassette 4 is tilted.

[0039] The control system 30 controls the operating state of the robot arm 10 based on this dynamic relative distance, thereby effectively preventing collisions during the robot arm 10's approach to or grasping of the wafer cassette 4, and actively avoiding collisions. Furthermore, compared to related technologies where sensors are fixedly mounted on the equipment frame, this avoids indirect measurement errors caused by the robot arm 10's own positioning errors, structural deformation, or vibrations, ensuring data accuracy from the source. This achieves higher-precision real-time monitoring of the distance between the robot arm 10 and the wafer cassette 4, improving the accuracy and reliability of collision avoidance.

[0040] Moreover, integrating the first distance detection component 20 onto the robot arm 10 results in a compact structure, eliminating the need for complex installation work and wiring for the sensor on the equipment frame. This leads to higher equipment integration and reduces dependence on and modifications to the equipment frame structure, making the equipment simpler, easier to install and maintain, and ultimately reducing overall costs.

[0041] Furthermore, by using the distance signal detected by the first distance detection device 20 as direct feedback to the closed-loop control system 30, collision avoidance decisions can be made based on the real-time dynamic position of the robot arm 10 itself, resulting in faster response speed and higher control precision. This is beneficial to improving the reliability and safety of the wafer cache device 1 and the entire wafer production line.

[0042] In some embodiments, such as Figure 1 As shown, there are at least two first distance detection elements 20, and along the first direction X, at least two first distance detection elements 20 are located on opposite sides of the robot arm 10.

[0043] In this embodiment, at least two first distance detection elements 20 are located on opposite sides of the robot arm 10 along the first direction X. Specifically, the robot arm 10 can move from the right side to the left of the wafer cassette 4 to grasp the wafer cassette 4. In this case, at least one first distance detection element 20 located on the left side of the robot arm 10 is used to detect the dynamic distance between the robot arm 10 and the mating part 40. The robot arm 10 can also move from the left side to the right of the wafer cassette 4 to grasp the wafer cassette 4. In this case, at least one first distance detection element 20 located on the right side of the robot arm 10 is used to detect the dynamic distance between the robot arm 10 and the mating part 40.

[0044] In other words, by setting the first distance detection element 20 on the left and right sides of the robot arm 10, the distance between the robot arm 10 and the wafer cassette 4 can be monitored in real time under various operating modes of the robot arm 10. This facilitates the robot arm 10 to quickly grasp the wafer cassette 4 located in different buffer positions, while improving the accuracy and reliability of the robot arm 10's anti-collision decision.

[0045] Optionally, the first direction X is the direction of movement of the robot arm 10 relative to the wafer cassette 4, for example, the horizontal direction.

[0046] In some embodiments, such as Figure 2 As shown, the robotic arm 10 also includes a robotic arm 14 and a support 16. A gripper assembly 12 is disposed on the robotic arm 14. The support 16 is connected to the robotic arm 14, and a first distance detection element 20 is connected to the support 16 and is rotatable relative to the support 16.

[0047] In this embodiment, since the first distance detection element 20 can rotate relative to the support 16, the pitch angle of the first distance detection element 20 can be adjusted appropriately according to the measurement requirements to ensure that the robot arm 10 can detect the dynamic distance between the robot arm 10 and the mating part 40 during the process of approaching or grasping the wafer cassette 4.

[0048] Optionally, the support 16 includes a base body and an adjusting member. The base body is connected to the robotic arm 14, and the adjusting member is connected to the base body and the first distance detection member 20. Specifically, the adjusting member can move between a first position and a second position. When the adjusting member is in the first position, the first distance detection member 20 can rotate relative to the support 16 to adjust the pitch angle. When the adjusting member is in the second position, the first distance detection member 20 is in a locked state.

[0049] In some embodiments, such as Figure 1 and Figure 2 As shown, the robotic arm 14 includes a bottom wall 142 and a side wall 144 connected together. The gripper assembly 12 is disposed on the bottom wall 142, the support 16 is connected to the side wall 144, and the first distance detection element 20 is located on the side wall 144.

[0050] In this embodiment, since the first distance detection element 20 is located on the side wall 144, that is, the first distance detection element 20 is located on the side of the robot arm 10, it can avoid interference with other structural components during the process of the robot arm 10 grasping the wafer cassette 4 due to the first distance detection element 20 being located on the top of the robot arm 14. While realizing the anti-collision function of the robot arm 10, it is beneficial to further improve the reliability of the wafer cache device 1.

[0051] In some embodiments, such as Figure 1 As shown, the gripper assembly 12 includes a plurality of grippers 122, and the plurality of grippers 122 includes at least a first gripper 124 and a second gripper 126 arranged at intervals along the second direction Y. The distance between the first distance detection element 20 and the first gripper 124 in the second direction Y is equal to the distance between the first distance detection element 20 and the second gripper 126 in the second direction Y.

[0052] In other words, the first distance detection element 20 is located near the middle between the first gripper 124 and the second gripper 126.

[0053] Since multiple grippers 122 are used to grip the mating part 40 respectively, and the first distance detection element 20 is set close to the center, as the robot arm 10 approaches the wafer cassette 4, the laser beam 5 or ultrasonic wave emitted by the emitting part of the first distance detection element 20 can continuously irradiate the surface of the mating part 40 and be reflected back to the receiving part of the first distance detection element 20 through the surface of the mating part 40, thus ensuring that the wafer cassette 4 can obtain an effective reflected signal in various postures.

[0054] In some embodiments, the wafer cache device 1 further includes a second distance detection element disposed on the robot arm 10 and located on the same side of the robot arm 10 as the first distance detection element 20. The second distance detection element is electrically connected to the control system 30 and is used to detect the distance between the robot arm 10 and the mating part 40.

[0055] In this embodiment, the wafer cache device 1 further includes a second distance detection element. Specifically, the second distance detection element and the first distance detection element 20 are located on the same side of the robot arm 10 and are used to detect the distance between the robot arm 10 and the mating part 40. That is, during the process of the robot arm 10 approaching or grasping the wafer cassette 4, a second distance detection element is added to measure the distance in addition to the distance measured by the first distance detection element 20. The control system 30 can fuse the data detected by the first distance detection element 20 and the second distance detection element to improve the measurement accuracy of the dynamic distance between the robot arm 10 and the wafer cassette 4, thereby improving the accuracy of anti-collision control. At the same time, it can improve the reliability and response speed of the system (such as using the second distance detection element to achieve rapid initial judgment) and enhance the robustness of the system.

[0056] Optionally, the second distance detection element can be an infrared proximity sensor or an ultrasonic proximity sensor. The first distance detection element 20 is a laser rangefinder, that is, a laser rangefinder and a low-cost infrared or ultrasonic proximity sensor are installed on the robot arm 10 simultaneously. The laser sensor serves as a high-precision main sensor, while the infrared or ultrasonic proximity sensor serves as an auxiliary, faster-responding coarse distance warning sensor. The data from both are fused to achieve graded warning.

[0057] In some embodiments, the wafer caching device 1 further includes a device frame and a third distance detection element. The device frame has cache slots for storing wafer cassettes 4. The third distance detection element is disposed on the device frame and electrically connected to the control system 30 for detecting the distance between the robot arm 10 and the wafer cassette 4.

[0058] In this embodiment, the wafer cache device 1 is further defined as including a device frame and a third distance detection element. That is, in addition to the distance measurement by the first distance detection element 20, a third distance detection element is added to the device frame to detect the distance between the robot arm 10 and the wafer cassette 4. Specifically, while retaining the first distance detection element 20 that moves along the robot arm 10, a third distance detection element is additionally fixedly installed on the device frame (e.g., near the cache position) for global monitoring and to provide a reference for absolute position. Combined with the data from the first distance detection element 20 on the robot arm 10, it performs cross-validation and more complex trajectory prediction, thereby compensating for potential blind spots (e.g., obstruction by the robot arm 10 itself) that may exist with a single moving distance detection element. This is particularly suitable for complex collision avoidance scenarios where multiple robot arms 10 work together, providing a higher level of safety assurance.

[0059] Optionally, the number of third distance detectors can be one or more.

[0060] Optionally, the third distance detection element can be a ranging sensor, such as a wide-angle ranging sensor.

[0061] In some embodiments, the first distance detection element 20 includes a laser rangefinder, an ultrasonic rangefinder, or a binocular stereo vision system.

[0062] In this embodiment, when the first distance detection element 20 is a laser rangefinder, it is understood that the laser rangefinder includes a transmitter and a receiver. The transmitter emits a laser beam 5 toward the surface of the mating part 40. After the laser beam 5 hits the surface of the mating part 40, it is reflected back to the receiver. Based on triangulation or time-of-flight distance, the distance between the robot 10 and the mating part 40 is detected. This enables real-time and high-precision distance measurement of the target wafer cassette 4 from the perspective of the robot 10, providing a direct and reliable basis for active collision avoidance control.

[0063] Furthermore, based on the principle of laser ranging, the response speed can be improved, enabling real-time monitoring of the distance between the robotic arm 10 and the wafer cassette 4 with millisecond-level or even higher precision. This allows for truly proactive collision avoidance, rather than passive emergency stopping after a collision. Moreover, by eliminating the huge computational overhead of complex image processing or predictions based on historical data, the control system 30 directly processes the simple yet crucial physical quantity of distance and compares it with a preset safety threshold. The decision-making logic is direct and computationally efficient, allowing the control system 30 to issue commands in a very short time before a collision occurs, adjusting the speed or trajectory of the robotic arm 10. This further enhances the accuracy and reliability of collision avoidance control.

[0064] Furthermore, laser ranging technology is less affected by environmental factors (e.g., changes in lighting, slight particulate contamination) and exhibits better stability, making it suitable for the clean environments required for semiconductor manufacturing. Compared to related technologies that utilize 2D vision sensors or ultrasonic sensors with lower recognition accuracy, lasers (especially those employing specific wavelengths or modulation techniques) have inherent advantages such as good directionality and strong anti-interference capabilities. This avoids the need to arrange complex light sources in the robotic arm's operating area, simplifies the system, and improves stability under varying operating conditions.

[0065] When the first distance detection element 20 is an ultrasonic ranging sensor, the real-time distance between the robot arm 10 and the mating part 40 is determined by emitting ultrasonic waves towards the surface of the mating part 40, receiving the echoes, and calculating the flight time of the sound waves. Ultrasonic ranging sensors are low-cost and insensitive to the optical properties of the mating part 40 surface (e.g., transparency and reflectivity). They also provide continuous distance feedback, enabling active collision avoidance.

[0066] In the case where the first distance detection component 20 is a binocular stereo vision system, it can be understood that the binocular stereo vision system includes two miniature cameras. By calculating the parallax of the same feature point on the surface of the mating part 40 in the images of the two miniature cameras, the three-dimensional coordinates of the feature point are calculated in real time, and then the relative distance with the robot arm 10 is calculated. By using visual three-dimensional reconstruction technology, not only distance information can be obtained, but also the attitude information of the wafer cell 4 can be acquired for collision avoidance judgment, providing richer environmental information.

[0067] In some embodiments, such as Figure 3 As shown, the control system 30 includes a collision avoidance controller 32 and a main control module 34. The collision avoidance controller 32 is electrically connected to the first distance detection element 20. The main control module 34 is electrically connected to either the collision avoidance controller 32 or the robot arm 10.

[0068] In this embodiment, the anti-collision controller 32 is electrically connected to the first distance detection element 20. That is, the distance data detected by the first distance detection element 20 is transmitted to the anti-collision controller 32 in real time. The anti-collision controller 32 compares the detected dynamic distance with the current safe distance. If the current dynamic distance is greater than or equal to the corresponding safe distance, no intervention is required and the robot arm 10 continues to move. If the current dynamic distance is less than the corresponding safe distance, it indicates that the wafer cassette 4 is tilted. If the robot arm 10 continues to move, there is a risk of collision. At this time, the anti-collision controller 32 sends an anti-collision command to the main control module 34. The main control module 34 controls the robot arm 10 to decelerate, stop moving, or retreat according to the anti-collision command to achieve the anti-collision effect.

[0069] Optionally, the anti-collision controller 32 is mounted on the robotic arm 10.

[0070] In one specific embodiment, the present invention relates to an integrated laser ranging anti-collision system and method for a robotic arm used in a wafer caching device (NTB). A laser ranging sensor is directly integrated into the end effector of the robotic arm 10 that grips a wafer fowl (FOUP), making the sensor and the robotic arm a unified motion and sensing system. After the laser beam hits the mushroom-shaped head (fitting part 40), it is reflected back to the laser ranging sensor. Based on the principles of triangulation or time-of-flight (ToF), the distance between the robotic arm 10 and the FOUP is detected. This enables real-time, high-precision distance measurement of the target FOUP from the perspective of the robotic arm 10, providing a direct and reliable basis for active anti-collision control.

[0071] Specifically, wafer cassette 4 is the object being manipulated, used to store multiple wafers. The robotic arm 10 is the actuator responsible for motion positioning. A robotic gripper (gripper assembly 12) is mounted at the end of the robotic arm 10 for directly grasping and releasing the FOUP. A laser rangefinder (first distance detection element 20) is directly and fixedly mounted on the robotic arm 10. This is a rigid, angle-adjustable connection, allowing the pitch angle of the laser rangefinder to be adjusted appropriately according to measurement requirements. This sensor is electrically connected to an anti-collision controller (such as a PLC (Programmable Logic Controller) or a dedicated motion control card) via a cable routed along with the robotic arm 14. The anti-collision controller then communicates at high speed with the main control system (main control module 34) of the robotic arm 10.

[0072] The laser beam 5 emitted by the laser rangefinder sensor can continuously illuminate the mushroom-shaped surface of the FOUP as the robotic arm 10 approaches it. Figure 1 As shown, laser beam 5 is directed towards the mushroom-shaped head region of the FOUP to ensure effective reflection signals under various postures. The mechanical gripper and the end of the robotic arm 10 are rigidly connected. The FOUP is placed on the buffer position and is separable from the sensor-equipped robotic arm 10 for grasping.

[0073] Working principle: When the system is working, the laser rangefinder sensor mounted on the robot arm 10 continuously emits a laser beam 5 towards the surface of the target FOUP mushroom head and receives the echo. Based on the principle of triangulation or time-of-flight (ToF), the sensor can calculate the precise distance D_measured from a fixed point on the robot arm (e.g., the sensor mounting point) to the FOUP surface in real time.

[0074] The control system 30 of the robotic arm 10 pre-sets safe grasping paths for different buffer positions. This path not only includes the position trajectory but also defines the safe distance D_safe that the robotic arm 10 should maintain between itself and the FOUP at each point along the path. The control system 30 compares the real-time measured D_measured with the D_safe corresponding to the current point. If D_measured is consistently greater than or equal to D_safe, it indicates that the robotic arm 10 is in a safe state, and the system does not interfere with its normal movement. If D_measured is less than D_safe and reaches a preset warning threshold, it indicates that the robotic arm 10 is too close to the FOUP or the FOUP is tilted, posing a collision risk. The system will immediately trigger an anti-collision command, controlling the robotic arm 10 to decelerate, pause, or make minor adjustments to its backward movement along a safe direction, thereby actively avoiding a collision.

[0075] Usage: System Calibration: Calibrate each laser rangefinder mounted on the robotic arm to determine its measurement zero point and its transformation relationship with the robotic arm's coordinate system. Set a safe grasping path and corresponding safe distance threshold D_safe for each FOUP buffer position. Operation Monitoring: This system is automatically activated when the robotic arm performs the task of grasping or placing FOUPs. The laser rangefinders begin working, feeding back distance data to the collision avoidance controller in real time. Real-time Decision-Making and Intervention: The collision avoidance controller continuously monitors distance and makes logical judgments. Once a potential collision risk is detected, the main control module immediately intervenes in the robotic arm's movement according to the preset strategy to ensure safety. Status Feedback: The collision avoidance controller uploads real-time distance status, alarm information, etc., to the main control module for monitoring and fault diagnosis.

[0076] This invention achieves higher precision and faster response active collision avoidance control through the innovative design of directly integrating a laser rangefinder sensor into the end effector of a robotic arm, significantly improving the safety and reliability of wafer cache devices.

[0077] Based on laser reflection ranging, this method detects the distance between a robotic arm and a wafer pod, offering fast response and high accuracy. By calculating the time difference between the laser beam's emission and reflection from the FOUP surface back to the receiver, the absolute distance between the robotic arm and the FOUP can be directly and accurately calculated. This non-contact, high-precision, and fast-response method allows for timely adjustments to the robotic arm's movements, fundamentally preventing collisions. The sensor itself has a compact structure, making it easy to integrate into wafer caching devices and control systems, facilitating practical application and deployment.

[0078] Furthermore, the high-quality and high-reliability real-time data provided by this invention makes it possible to develop adaptive control algorithms based on real-time distance feedback and to achieve efficient collaboration among multiple robotic arms based on precise relative positions. This improves the intelligence and automation level of wafer caching devices and the entire wafer production line, and significantly enhances the safety, efficiency, and economy of wafer caching device operation.

[0079] Secondly, this embodiment provides a wafer production line, including the wafer cache device 1 of the first aspect embodiment described above. Since the wafer production line shown in this embodiment includes the wafer cache device 1 of the first aspect embodiment, it possesses all the beneficial technical effects of the wafer cache device 1, which will not be repeated here.

[0080] Thirdly, this embodiment provides a collision avoidance control method for a wafer cache device, used in the wafer cache device of the first aspect embodiment described above. Since the collision avoidance control method for the wafer cache device shown in this embodiment is used in the wafer cache device of the first aspect embodiment described above, it possesses all the beneficial technical effects of the wafer cache device, and will not be elaborated further here.

[0081] like Figure 4 As shown, the anti-collision control method for the wafer cache device provided in this embodiment includes: Step 102: Detect the distance between the robot arm and the mating part as the robot arm approaches the wafer cassette; Step 104: Control the operating status of the robot arm based on the distance between the robot arm and the mating part.

[0082] The anti-collision control method for the wafer cache device provided in this embodiment detects the distance between the robot and the mating part in real time during the process of the robot approaching or grasping the wafer cassette. Since the first distance detection component is integrated into the robot, the measurement reference is unified with the robot's motion reference, thereby directly and accurately obtaining the dynamic relative distance between the robot and the mating part. The control system can accurately identify the wafer cassette's pose based on this dynamic relative distance, and then control the robot's operating state, effectively avoiding collisions during the robot's approach to or grasping of the wafer cassette. At the same time, it can also avoid indirect measurement errors caused by the robot's own positioning errors, structural deformation, or vibration, ensuring data accuracy from the root, and achieving higher-precision real-time monitoring of the distance between the robot and the wafer cassette, improving the accuracy and reliability of anti-collision.

[0083] The operating states of the robotic arm include, but are not limited to, deceleration, pause, or reversal.

[0084] In some embodiments, the operating state of the robotic arm is controlled based on the distance between the robotic arm and the mating part. Specifically, this includes: issuing a warning signal when the distance between the robotic arm and the mating part is less than a safe distance; and controlling the robotic arm to decelerate, stop, or retreat when the distance between the robotic arm and the mating part reaches a warning threshold. The safe distance is greater than the warning threshold.

[0085] In this embodiment, when the distance between the robot and the mating part is less than the safe distance, it indicates that the robot is too close to the wafer cassette, or that the wafer cassette is tilted, and a warning signal is issued.

[0086] When the distance between the robotic arm and the mating part further decreases to the warning threshold, if the robotic arm continues to move, there is a risk of collision. At this time, an anti-collision command is triggered to control the robotic arm to decelerate, stop, or retreat to prevent collision.

[0087] In some embodiments, controlling the operating state of the robot arm based on the distance between the robot arm and the mating part specifically includes: determining the robot arm's operating information based on the distance between the robot arm and the mating part; determining the distance change trend between the robot arm and the mating part over a future set time period based on historical distance data and the operating information; and controlling the robot arm's operating state based on the distance change trend. The operating information includes the robot arm's current operating speed and / or acceleration.

[0088] In this embodiment, the robot's operating speed and acceleration are calculated based on the distance between the robot and the mating part and the robot's movement time. Using the robot's operating speed, acceleration, and historical distance data, algorithms (e.g., Kalman filtering, simple linear extrapolation, or lightweight machine learning models) can predict the distance change trend between the robot and the wafer cassette within a set future timeframe. This allows for early collision avoidance intervention, earlier identification of potential risks, smoother deceleration or avoidance, and further improves operational stability and efficiency.

[0089] Optionally, the time can be set to 100 milliseconds.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer cache device, characterized in that, include: A robotic arm, one end of which has a gripper assembly for gripping or releasing the mating part of a wafer cassette; A first distance detection element is disposed on the robotic arm and located at one end of the robotic arm near the gripper assembly, for detecting the distance between the robotic arm and the mating part; The control system is electrically connected to either the robotic arm or the first distance detection device, and the control system is capable of controlling the operating state of the robotic arm based on the detection result of the first distance detection device.

2. The wafer cache device according to claim 1, characterized in that, The number of the first distance detection elements is at least two, and along the first direction, the at least two first distance detection elements are respectively located on opposite sides of the robot arm.

3. The wafer cache device according to claim 1, characterized in that, The robotic arm also includes: A robotic arm, wherein the gripper assembly is disposed on the robotic arm; A support is connected to the robotic arm, and the first distance detection element is connected to the support and is rotatable relative to the support.

4. The wafer cache device according to claim 3, characterized in that, The robotic arm includes a connected bottom wall and a side wall, the gripper assembly is disposed on the bottom wall, the support is connected to the side wall, and the first distance detection element is located on the side wall.

5. The wafer cache device according to claim 1, characterized in that, The gripper assembly includes a plurality of grippers, and the plurality of grippers includes at least a first gripper and a second gripper arranged at intervals along a second direction. Wherein, the distance between the first distance detection element and the first gripper in the second direction is equal to the distance between the first distance detection element and the second gripper in the second direction.

6. The wafer caching device according to claim 1, characterized in that, The wafer cache device also includes: A second distance detection element is disposed on the robot arm and is located on the same side of the robot arm as the first distance detection element. The second distance detection element is electrically connected to the control system and is used to detect the distance between the robot arm and the mating part.

7. The wafer cache device according to claim 1, characterized in that, The wafer cache device also includes: The device frame includes a cache slot for storing the wafer cassette. A third distance detection device is disposed on the equipment frame and electrically connected to the control system, and is used to detect the distance between the robot and the wafer cassette.

8. The wafer cache device according to any one of claims 1 to 7, characterized in that, The first distance detection device includes a laser rangefinder, an ultrasonic rangefinder, or a binocular stereo vision system.

9. The wafer cache device according to any one of claims 1 to 7, characterized in that, The control system includes: The collision avoidance controller is electrically connected to the first distance detection device; The main control module is electrically connected to either the anti-collision controller or the robotic arm.

10. A wafer fabrication production line, characterized in that, Includes the wafer cache device as described in any one of claims 1 to 9.

11. A collision avoidance control method for a wafer cache device, characterized in that, For a wafer cache device as described in any one of claims 1 to 9, the collision avoidance control method comprises: During the process of the robotic arm approaching the wafer cassette, the distance between the robotic arm and the mating part is detected; The operating state of the robotic arm is controlled based on the distance between the robotic arm and the mating part.

12. The anti-collision control method for a wafer cache device according to claim 11, characterized in that, The step of controlling the operating state of the robotic arm based on the distance between the robotic arm and the mating part specifically includes: If the distance between the robotic arm and the mating part is less than the safe distance, a warning signal will be issued; When the distance between the robotic arm and the mating part reaches a warning threshold, the robotic arm is controlled to decelerate, stop, or retreat. Wherein, the safe distance is greater than the warning threshold.

13. The anti-collision control method for a wafer cache device according to claim 11, characterized in that, The step of controlling the operating state of the robotic arm based on the distance between the robotic arm and the mating part specifically includes: The operating information of the robotic arm is determined based on the distance between the robotic arm and the mating part; Based on the historical distance data between the robotic arm and the mating part, and the operation information, determine the trend of distance change between the robotic arm and the mating part within a future set time period; The operating state of the robotic arm is controlled according to the distance change trend; The operational information includes the current operating speed and / or acceleration of the robotic arm.

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