A lifting control method and device, electronic equipment and storage medium

Abstract

This application relates to a lifting control method, apparatus, electronic device, and storage medium. The lifting control method includes: determining a target wafer position and a current wafer position. The target wafer position includes one of multiple operating positions of the lifting mechanism. The multiple operating positions are determined based on the mechanical structure of the epitaxial equipment and the wafer lifting station. If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed according to the distance. In the embodiments of this application, the segmented control of the lifting mechanism's operating speed is achieved through multiple operating positions, thereby reducing the problem of damage to the wafer caused by certain structures in the lifting mechanism, which could adversely affect the epitaxial growth process.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a lifting control method, apparatus, electronic device and storage medium. Background Technology

[0002] Epitaxial processes are used to form high-quality epitaxial layers on semiconductor substrates. Epitaxial growth is slow, the process time is long, and the process cost is also high. At the same time, the quality requirements for epitaxial processes are very high.

[0003] Epitaxial growth is performed within the epitaxial cavity of an epitaxial apparatus. This cavity contains a base for supporting the wafer, and a lifting mechanism at the bottom of the base controls its movement. This lifting mechanism can control the base to move between multiple different positions in the vertical direction, corresponding to different operating conditions of the base. However, in related technologies, the speed of the lifting mechanism may cause certain structures within the mechanism to damage the wafer, thus adversely affecting the epitaxial growth process. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides a lifting control method, apparatus, electronic device, and storage medium.

[0005] On one hand, this application discloses a lifting control method, which is applied to the lifting mechanism of the base in an epitaxial device, including:

[0006] Determine the target wafer position and the current wafer position; the target wafer position includes one of multiple operating positions of the lifting mechanism; the multiple operating positions are determined based on the mechanical structure of the epitaxial equipment and the wafer lifting station;

[0007] If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmenting the operating speed according to the distance.

[0008] In some possible embodiments,

[0009] The lifting mechanism has multiple operating positions, including the epitaxial process position from high to low, the wafer pick-up position, and the wafer placement position;

[0010] The current position of the wafer is any position between the epitaxial process position and the wafer placement position.

[0011] In some possible embodiments,

[0012] The lifting mechanism is also provided with a first position and a second position; the first position and the second position are located between the epitaxial process position and the wafer pick-up position, and the first position is higher than the second position;

[0013] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0014] When the target position of the wafer is the epitaxial process position, and the current position of the wafer is between the first position and the epitaxial process position, the speed running data corresponding to the target position of the wafer is determined as the first speed data; the first speed data includes the first running direction, the first speed, the first acceleration, and the first deceleration;

[0015] The operating speed of the lifting mechanism is controlled based on the first speed data until it reaches the epitaxial process position.

[0016] In some possible embodiments,

[0017] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0018] When the target position of the wafer is an epitaxial process position, and the current position of the wafer is between the first position and the second position, the speed running data corresponding to the target position of the wafer is determined to be the second speed data and the first speed data; the second speed data includes the first running direction, the second speed, the second acceleration, and the second deceleration.

[0019] The operating speed of the lifting mechanism is controlled based on the second speed data until the current position of the wafer is the first position;

[0020] The operating speed of the lifting mechanism is controlled based on the first speed data until the epitaxial process position is reached;

[0021] The first velocity is greater than the second velocity; the first acceleration is greater than the second acceleration; the first deceleration is greater than the second deceleration.

[0022] In some possible embodiments,

[0023] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0024] When the target wafer position is an epitaxial process position, and the current wafer position is lower than the second position, the speed operation data corresponding to the target wafer position is determined as the third speed data, the second speed data, and the first speed data; the third speed data includes the first running direction, the third speed, the third acceleration, and the third deceleration;

[0025] The operating speed of the lifting mechanism is controlled based on the third speed data until the current position of the wafer is the second position;

[0026] The operating speed of the lifting mechanism is controlled based on the second speed data until the current position of the wafer is the first position;

[0027] The operating speed of the lifting mechanism is controlled based on the first speed data until the epitaxial process position is reached;

[0028] The third velocity is greater than the second velocity; the third acceleration is greater than the second acceleration; the third deceleration is greater than the second deceleration.

[0029] In some possible embodiments,

[0030] The lifting mechanism is also provided with a third position; the third position is located between the first position and the second position;

[0031] While controlling the operating speed of the lifting mechanism based on the second speed data until the wafer is in the first position, the speed of the lifting mechanism is zero in the third position.

[0032] In some possible embodiments,

[0033] The lifting mechanism is also provided with a fourth position and a fifth position; the fourth position and the fifth position are located between the wafer pick-up position and the wafer placement position, and the fourth position is higher than the fifth position;

[0034] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0035] When the target wafer position is the wafer placement position, and the current wafer position is between the fifth position and the wafer placement position, the speed data corresponding to the target wafer position is determined as the fourth speed data; the fourth speed data includes the second running direction, the fourth speed, the fourth acceleration, and the fourth deceleration;

[0036] The operating speed of the lifting mechanism is controlled based on the fourth speed data until the wafer placement position is reached.

[0037] In some possible embodiments,

[0038] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0039] When the target wafer position is the wafer placement position, and the current wafer position is between the fourth and fifth positions, the speed operation data corresponding to the target wafer position is determined as the fifth speed data and the fourth speed data; the fifth speed data includes the second running direction, the fifth speed, the fifth acceleration, and the fifth deceleration;

[0040] The operating speed of the lifting mechanism is controlled based on the fifth speed data until the current position of the wafer is the fifth position;

[0041] The operating speed of the lifting mechanism is controlled based on the fourth speed data until the wafer placement position is reached;

[0042] The fourth velocity is greater than the fifth velocity; the fourth acceleration is greater than the fifth acceleration; the fourth deceleration is greater than the fifth deceleration.

[0043] In some possible embodiments,

[0044] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0045] When the target wafer position is the wafer placement position, and the current wafer position is higher than the fourth position, the speed operation data corresponding to the target wafer position is determined as the sixth speed data, the fifth speed data, and the fourth speed data; the sixth speed data includes the second running direction, the sixth speed, the sixth acceleration, and the sixth deceleration;

[0046] The operating speed of the lifting mechanism is controlled based on the sixth speed data until the current position of the wafer is the fourth position;

[0047] The operating speed of the lifting mechanism is controlled based on the fifth speed data until the current position of the wafer is the fifth position;

[0048] The operating speed of the lifting mechanism is controlled based on the fourth speed data until the wafer placement position is reached;

[0049] The sixth velocity is greater than the fifth velocity; the sixth acceleration is greater than the fifth acceleration; the sixth deceleration is greater than the fifth deceleration.

[0050] In some possible embodiments,

[0051] The lifting mechanism is also provided with a first position and a second position; the first position and the second position are located between the epitaxial process position and the wafer pick-up position, and the first position is higher than the second position;

[0052] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0053] When the target wafer position is the wafer pick-up position, and the current wafer position is between the wafer pick-up position and the second position, the speed operation data corresponding to the target wafer position is determined as the seventh speed data; the seventh speed data includes the second running direction, the seventh speed, the seventh acceleration, and the seventh deceleration;

[0054] The operating speed of the lifting mechanism is controlled based on the seventh speed data until the wafer pick-up position is reached.

[0055] In some possible embodiments,

[0056] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0057] When the target wafer position is the wafer pick-up position, and the current wafer position is between the first and second positions, the speed operation data corresponding to the target wafer position is determined to be the eighth speed data and the seventh speed data; the eighth speed data includes the second running direction, the eighth speed, the eighth acceleration, and the eighth deceleration;

[0058] The operating speed of the lifting mechanism is controlled based on the eighth speed data until the current position of the wafer is the second position;

[0059] The operating speed of the lifting mechanism is controlled based on the seventh speed data until the wafer pick-up position is reached;

[0060] The seventh velocity is greater than the eighth velocity; the seventh acceleration is greater than the eighth acceleration; the seventh deceleration is greater than the eighth deceleration.

[0061] In some possible embodiments,

[0062] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0063] When the target wafer position is the wafer pick-up position, and the current wafer position is higher than the first position, the speed operation data corresponding to the target wafer position is determined as the ninth speed data, the eighth speed data, and the seventh speed data; the ninth speed data includes the second running direction, the ninth speed, the ninth acceleration, and the ninth deceleration;

[0064] The operating speed of the lifting mechanism is controlled based on the ninth speed data until the current position of the wafer is the first position;

[0065] The operating speed of the lifting mechanism is controlled based on the eighth speed data until the current position of the wafer is the second position;

[0066] The operating speed of the lifting mechanism is controlled based on the seventh speed data until the wafer pick-up position is reached;

[0067] The ninth velocity is greater than the eighth velocity; the ninth acceleration is greater than the eighth acceleration; the ninth deceleration is greater than the eighth deceleration.

[0068] In some possible embodiments,

[0069] The lifting mechanism is also provided with a fourth position and a fifth position; the fourth position and the fifth position are located between the wafer pick-up position and the wafer placement position, and the fourth position is higher than the fifth position;

[0070] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0071] When the target wafer position is the wafer pick-up position, and the current wafer position is between the fourth position and the wafer pick-up position, the speed data corresponding to the target wafer position is determined as the tenth speed data; the tenth speed data includes the first running direction, the tenth speed, the tenth acceleration, and the tenth deceleration;

[0072] The operating speed of the lifting mechanism is controlled based on the tenth speed data until the wafer pick-up position is reached.

[0073] In some possible embodiments,

[0074] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0075] When the target wafer position is the wafer pick-up position, and the current wafer position is between the fourth and fifth positions, the speed operation data corresponding to the target wafer position is determined as the eleventh speed data and the tenth speed data; the eleventh speed data includes the first running direction, the eleventh speed, the eleventh acceleration, and the eleventh deceleration;

[0076] The operating speed of the lifting mechanism is controlled based on the eleventh speed data until the current position of the wafer is the fourth position;

[0077] The operating speed of the lifting mechanism is controlled based on the tenth speed data until the wafer pick-up position is reached;

[0078] The tenth velocity is greater than the eleventh velocity; the tenth acceleration is greater than the eleventh acceleration; the tenth deceleration is greater than the eleventh deceleration.

[0079] In some possible embodiments,

[0080] If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed based on this distance, including:

[0081] When the target wafer position is the wafer pick-up position, and the current wafer position is lower than the fifth position, the speed operation data corresponding to the target wafer position is determined as the twelfth speed data, the eleventh speed data, and the tenth speed data; the twelfth speed data includes the first running direction, the twelfth speed, the twelfth acceleration, and the twelfth deceleration;

[0082] The operating speed of the lifting mechanism is controlled based on the twelfth speed data until the current position of the wafer is the fifth position;

[0083] The operating speed of the lifting mechanism is controlled based on the eleventh speed data until the current position of the wafer is the fourth position;

[0084] The operating speed of the lifting mechanism is controlled based on the tenth speed data until the wafer pick-up position is reached;

[0085] The twelfth velocity is greater than the eleventh velocity; the twelfth acceleration is greater than the eleventh acceleration; the twelfth deceleration is greater than the eleventh deceleration.

[0086] On the other hand, embodiments of this application disclose a lifting control device applied to the lifting mechanism of a base in an epitaxial device, comprising:

[0087] The position determination module is configured to determine the target wafer position and the current wafer position; the target wafer position includes one of multiple operating positions of the lifting mechanism; the multiple operating positions are determined based on the mechanical structure of the epitaxial equipment and the wafer lifting station.

[0088] The speed control module is configured to control the lifting mechanism by segmenting the running speed according to the distance if there is a distance between the target position of the wafer and the current position of the wafer.

[0089] On the other hand, embodiments of this application disclose an electronic device, including: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to execute instructions to implement the above-described lifting control method.

[0090] On the other hand, embodiments of this application disclose a computer-readable storage medium that, when the instructions in the computer-readable storage medium are executed by the processor of an electronic device, enables the electronic device to perform the above-described lifting control method.

[0091] On the other hand, embodiments of this application disclose a computer program product, which includes a computer program stored in a readable storage medium. At least one processor of a computer device reads and executes the computer program from the readable storage medium, causing the device to perform the above-described lifting control method.

[0092] The technical solution provided in this application has the following technical effects:

[0093] The target wafer position and the current wafer position are determined. The target wafer position includes one of multiple operating positions of the lifting mechanism. These multiple operating positions are determined based on the mechanical structure of the epitaxial equipment and the wafer lifting station. If there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmenting the operating speed according to the distance. In this embodiment, the operating speed of the lifting mechanism is controlled segmentally through multiple operating positions, thereby reducing the problem of damage to the wafer caused by certain structures in the lifting mechanism, which could adversely affect the epitaxial growth process. Attached Figure Description

[0094] To more clearly illustrate the technical solutions and advantages in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0095] Figure 1 This is a schematic flowchart of a lifting control method provided in an embodiment of this application;

[0096] Figure 2 This is a schematic diagram of a lifting station of a lifting mechanism provided in an embodiment of this application;

[0097] Figure 3 This is a schematic flowchart of a lifting control method provided in an embodiment of this application;

[0098] Figure 4 This is a schematic flowchart of a lifting control method provided in an embodiment of this application;

[0099] Figure 5 This is a schematic flowchart of a lifting control method provided in an embodiment of this application;

[0100] Figure 6 This is a schematic diagram of the speed and position control of the lifting process during cold wafer unloading, provided in an embodiment of this application.

[0101] Figure 7 This is a schematic diagram of the speed and position control of the lifting process during hot wafer removal provided in an embodiment of this application;

[0102] Figure 8 This is a block diagram of a lifting control device provided in an embodiment of this application. Detailed Implementation

[0103] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0104] It should be noted that the term "an embodiment" or "embodiment" in the specification of the embodiments of this application refers to a specific feature, structure, or characteristic that can be included in at least one implementation of this application. It should be understood that in the specification, claims, and accompanying drawings of the embodiments of this application, the terms "upper," "lower," "top," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, in the description of this embodiment, unless otherwise stated, "a plurality of" means two or more. Additionally, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, or product that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0105] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0106] To make the objectives, technical solutions, and advantages disclosed in the embodiments of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the embodiments of this application and are not intended to limit the embodiments of this application.

[0107] In the manufacturing process of semiconductor devices, epitaxial growth processes are typically used to form epitaxial films on the surface of wafers, such as germanium-silicon films. Commonly used epitaxial equipment typically includes an epitaxial cavity, a substrate, a lifting assembly, and a controller. The substrate, housed within the epitaxial cavity, supports the wafer undergoing epitaxial growth. The lifting assembly, which enables the lifting of the substrate, includes a lifting mechanism and a servo motor. The lifting mechanism is located at the bottom of the substrate, and the servo motor drives it to move vertically, thus raising and lowering the substrate. Specifically, the servo motor drives a lead screw to rotate, extending vertically. The lifting mechanism, through a mechanism such as a slider threaded into the lead screw, moves up and down with the lead screw, raising and lowering the substrate. The controller controls the operation of the servo motor. In practical applications, epitaxial equipment often also includes a rotation module to rotate the substrate, meeting the process requirements for epitaxial growth of the wafer supported on the substrate.

[0108] In actual epitaxial growth processes (before epitaxial growth - during epitaxial growth - after epitaxial growth), the substrate in the epitaxial cavity needs to move up and down between multiple operating positions in the vertical direction. These multiple operating positions are determined based on the mechanical mechanism of the substrate and the wafer lifting station in the epitaxial growth process.

[0109] Taking the wafer lifting station of the substrate in the epitaxial growth process as an example, which includes placing the wafer before epitaxial growth, performing epitaxial growth, and retrieving the wafer after epitaxial growth, the wafer lifting and retrieval from the substrate can be achieved by a robot that only performs telescopic movements. In the vertical direction, the substrate is set with the wafer placement position (also known as the low position / robot operation position), the wafer retrieval position (also known as the middle position / robot operation position), and the epitaxial process position (also known as the high position / epitaxy process position) from bottom to top.

[0110] The lifting mechanism of the base in the PM cavity of the epitaxial device consists of a PIN structure, a tray structure, a slider guide rail and a motor screw. The PIN structure includes a PIN support and a PIN inner shaft, and the tray structure includes a tray support and a tray outer shaft, wherein the PIN inner shaft is inside the tray outer shaft.

[0111] In the epitaxial growth process of wafers, the movement of this substrate can be: wafer placement process and wafer removal process.

[0112] In one optional embodiment, the wafer placement process includes: a lifting mechanism controlling the base to be in the wafer placement position so that a robot arm can transport the wafer into the epitaxial cavity and place the wafer onto the PIN structure and the tray structure; then, the lifting mechanism controls the PIN structure and the tray structure to be raised to the wafer pick-up position via a slider guide rail and a motor screw so that the robot arm can be withdrawn from the epitaxial cavity; then, the lifting mechanism controls the tray structure to be raised to the epitaxial process position via a slider guide rail and a motor screw so that the wafer can undergo the epitaxial growth process.

[0113] The wafer retrieval process includes: the lifting mechanism controls the tray structure to descend from the epitaxial process position to the wafer retrieval position through the slider guide rail and the motor screw, so that the robot arm can be inserted into the epitaxial cavity. Then, the lifting mechanism controls the PIN structure and the tray structure to descend to the wafer placement position through the slider guide rail and the motor screw, so that the robot arm can remove the wafer from the epitaxial cavity by moving the wafer on the base.

[0114] In other words, the above-mentioned substrate lifting and lowering process includes: from the wafer placement position --> wafer pick-up position --> epitaxial process position, and then from the epitaxial process position --> wafer pick-up position --> wafer placement position.

[0115] In the process of developing this invention, it was discovered that during the wafer placement and handling process, the speed of the lifting mechanism may cause certain structures in the lifting mechanism to damage the wafer. For example, the PIN support in the lifting mechanism may cause scratches or uneven markings on the wafer, and the tray support in the lifting mechanism may also cause the wafer to drift.

[0116] In view of this, embodiments of this application can provide a lifting control method to alleviate the problems of scratches and uneven markings caused by PIN supports on wafers, while reducing the problem of wafer drift caused by tray supports. Figure 1 This is a flowchart illustrating a lifting control method according to an exemplary embodiment. It should be noted that this specification provides method operation steps as shown in the embodiments or flowcharts, but based on conventional or non-inventive labor, more or fewer operation steps may be included. The order of steps listed in the embodiments is merely one possible execution order among many steps and does not represent the only execution order. In actual system or product execution, the method can be executed in the order shown in the embodiments or drawings, or in parallel (e.g., in a parallel processor or multi-threaded processing environment). Specifically, as shown... Figure 1 As shown, this flowchart includes at least the following steps S101-S105:

[0117] In step S101, the target wafer position and the current wafer position are determined; the target wafer position includes one of the multiple operating positions of the lifting mechanism; the multiple operating positions are determined based on the mechanical structure of the epitaxial equipment and the wafer lifting station.

[0118] In this embodiment of the application, it can be seen from the lifting mechanism and the movement process of the base in the epitaxial growth process of the wafer described above that multiple operating positions can be determined based on the mechanical structure of the epitaxial equipment and the wafer lifting station.

[0119] In this embodiment, based on the base structure and lifting process described above, the multiple operating positions of the lifting mechanism may include, from high to low, an epitaxial process position, a wafer pick-up position, and a wafer placement position. The target wafer position may be one of the following operating positions: the epitaxial process position, the wafer pick-up position, and the wafer placement position.

[0120] In this embodiment, the current wafer position is any position between the epitaxial process position and the wafer placement position. Optionally, the current wafer position can be any one of the following: the current wafer position, the wafer pick-up position, and the wafer placement position; the current wafer position can be any one of the following: the current wafer position and the wafer pick-up position; or the current wafer position can be any one of the following: the wafer pick-up position and the wafer placement position.

[0121] In this embodiment of the application, the lifting mechanism also has multiple positions during the lifting process. Figure 2This is a schematic diagram of a lifting station of a lifting mechanism according to an exemplary embodiment, including an epitaxial process position, a wafer pick-up position and a wafer placement position from high to low, a first position, a second position and a third position located between the epitaxial process position and the wafer pick-up position, and a fourth position, a fifth position and a sixth position located between the wafer pick-up position and the wafer placement position.

[0122] Optionally, the third position is the substrate mounting position, which refers to the position where the wafer simultaneously contacts both the pin and the substrate during the process of transferring the wafer from the pin to the substrate (or the tray on the substrate). The first position higher than the third position can be called the high substrate mounting position, and the second position lower than the third position can be called the low substrate mounting position.

[0123] Optionally, the sixth position is the PIN placement position, which refers to the position where the wafer simultaneously contacts both the robot and the pin during the process of transferring the wafer from the robot to the pin. The fourth position, which is higher than the sixth position, can be called the PIN high position, and the fifth position, which is lower than the sixth position, can be called the PIN low position.

[0124] In step S103, if there is a distance between the target wafer position and the current wafer position, the lifting mechanism is controlled by segmented running speeds based on the distance.

[0125] In this embodiment of the application, the speed operation data can be determined based on the relative distance between the target position of the wafer and the current position of the wafer.

[0126] In one alternative embodiment, if the target wafer position coincides with the current wafer position, that is, the wafer is moved to the target wafer position by the pedestal, then the operation stops.

[0127] In another optional embodiment, if there is a certain distance between the target wafer position and the current wafer position, speed operation data corresponding to the target wafer position can be obtained so that subsequent speed control can be performed based on the speed operation data corresponding to the target wafer position. Further, if there is a certain distance between the target wafer position and the current wafer position, multiple workstation stages between the target wafer position and the current wafer position can be obtained, and speed operation data corresponding to each workstation stage can be determined so that subsequent speed control can be performed based on the speed operation data corresponding to each workstation stage.

[0128] The following discussion is based on whether the target wafer location is the epitaxial process location, the wafer pick-up location, or the wafer placement location.

[0129] In some possible embodiments, the wafer target location is the epitaxial process location.

[0130] In one possible embodiment, when the target wafer position is the epitaxial process position and the current wafer position is between the first position and the epitaxial process position, the speed running data corresponding to the target wafer position is determined as the first speed data, and the running speed of the lifting mechanism is controlled according to the first speed data until the epitaxial process position is reached.

[0131] The first velocity data includes a first direction of travel, a first velocity, a first acceleration, and a first deceleration. Optionally, the first direction of travel is upward.

[0132] Specifically, the first velocity, first acceleration, and first deceleration can be determined in conjunction with the distance between the current position of the wafer and the epitaxial process position.

[0133] In one embodiment, the lifting mechanism can carry the wafer to a first speed with a first acceleration, and after running at the first speed for a certain period of time, decelerate with a first deceleration until the speed is 0 to the epitaxial process position.

[0134] In another possible embodiment, when the target wafer position is an epitaxial process position and the current wafer position is between a first position and a second position, the speed data corresponding to the target wafer position is determined as second speed data and first speed data. The operating speed of the lifting mechanism is controlled according to the second speed data until the current wafer position is the first position, and then the operating speed of the lifting mechanism is controlled according to the first speed data until the epitaxial process position is reached.

[0135] The second speed data includes a first direction of travel, a second speed, a second acceleration, and a second deceleration. The first speed data includes a first direction of travel, a first speed, a first acceleration, and a first deceleration. Optionally, the first direction of travel is upward.

[0136] Specifically, the second velocity, second acceleration, and second deceleration can be determined in conjunction with the distance between the current position of the wafer and the first position. Optionally, the first velocity is greater than the second velocity, the first acceleration is greater than the second acceleration, and the first deceleration is greater than the second deceleration.

[0137] Optionally, while controlling the operating speed of the lifting mechanism based on the second speed data until the wafer is at the first position, the speed of the lifting mechanism at the third position can be zero. Thus, by keeping the speed zero at the third position, the drifting problem caused by the graphite tray to the wafer can be reduced during wafer transport.

[0138] In the first embodiment, if the wafer's current position is between the third position and the second position, the lifting mechanism can carry the wafer to a second speed with a second acceleration, run at the second speed for a preset time, and then decelerate with a second deceleration until the speed reaches 0 to the third position. Next, the lifting mechanism can carry the wafer to a second speed with a second acceleration, run at the second speed for a certain time, and then reach the first position. Subsequently, the lifting mechanism can carry the wafer to a first speed with a first acceleration, run at the first speed for a certain time, and then decelerate with a first deceleration until the speed reaches 0 to the epitaxial process position.

[0139] Thus, by setting the velocity to 0 at the third position, the drift problem caused by the tray support to the wafer can be reduced.

[0140] In the second embodiment, if the wafer is currently positioned between the third position and the first position, the lifting mechanism can carry the wafer to a second speed with a second acceleration, and after running at the second speed for a certain period of time, reach the first position. Subsequently, the lifting mechanism can carry the wafer to a first speed with a first acceleration, and after running at the first speed for a certain period of time, decelerate with a first deceleration until the speed reaches 0 to the epitaxial process position.

[0141] In another possible embodiment, when the target wafer position is the epitaxial process position and the current wafer position is lower than the second position, the speed operation data corresponding to the target wafer position is determined as the third speed data, the second speed data, and the first speed data. The operating speed of the lifting mechanism is controlled according to the third speed data until the current wafer position is the second position. The operating speed of the lifting mechanism is controlled according to the second speed data until the current wafer position is the first position. The operating speed of the lifting mechanism is controlled according to the first speed data until the epitaxial process position is reached.

[0142] The first speed data includes a first direction of travel, a first speed, a first acceleration, and a first deceleration. The second speed data includes a first direction of travel, a second speed, a second acceleration, and a second deceleration. The third speed data includes a first direction of travel, a third speed, a third acceleration, and a third deceleration. Optionally, the first direction of travel is upward.

[0143] Optionally, the first velocity is greater than the second velocity, the first acceleration is greater than the second acceleration, and the first deceleration is greater than the second deceleration. The third velocity is greater than the second velocity, the third acceleration is greater than the second acceleration, and the third deceleration is greater than the second deceleration.

[0144] In one alternative embodiment, the first velocity is equal to the third velocity, the first acceleration is equal to the third acceleration, and the first deceleration is equal to the third deceleration.

[0145] Specifically, the third velocity, third acceleration, and third deceleration can be determined in conjunction with the distance between the current position and the second position of the wafer.

[0146] In one embodiment, if the wafer is currently positioned between the second position and the wafer pick-up position, including at the wafer pick-up position, the lifting mechanism can carry the wafer and increase its speed to a third speed with a third acceleration, and then decelerate it with a third deceleration for a certain period of time until the speed reaches the second speed to the second position. Next, it runs at the second speed for a certain period of time, and then decelerates it with a second deceleration until the speed reaches 0 to the third position. Then, the lifting mechanism can carry the wafer and increase its speed to the second speed with a second acceleration, and then run it at the second speed for a certain period of time to reach the first position. Subsequently, the lifting mechanism can carry the wafer and increase its speed to the first speed with a first acceleration, and then decelerate it with a first deceleration for a certain period of time until the speed reaches 0 to the epitaxial process position.

[0147] Figure 3 This is a flowchart illustrating a lifting control method according to an exemplary embodiment, applied when the target wafer position is an epitaxial process position and the current wafer position is not an epitaxial process position, including:

[0148] In step S301, the current position of the wafer is determined; if the current position of the wafer is lower than the second position, proceed to step S303; if the current position of the wafer is between the first position and the second position, proceed to step S307; otherwise, proceed to step S311.

[0149] In step S303, the speed running data is determined to be the third speed data; the third speed data includes the first running direction, the third speed, the third acceleration, and the third deceleration;

[0150] In step S305, the operating speed of the lifting mechanism is controlled according to the third speed data until the current position of the wafer is the second position;

[0151] In step S307, the speed running data is determined to be the second speed data; the second speed data includes the first running direction, the second speed, the second acceleration, and the second deceleration;

[0152] In step S309, the operating speed of the lifting mechanism is controlled according to the second speed data until the current position of the wafer is the first position;

[0153] In step S311, the speed running data is determined to be the first speed data; the first speed data includes the first running direction, the first speed, the first acceleration, and the first deceleration;

[0154] In step S313, the operating speed of the lifting mechanism is controlled according to the first speed data until the epitaxial process position is reached.

[0155] Optionally, the first velocity is greater than the second velocity, the first acceleration is greater than the second acceleration, and the first deceleration is greater than the second deceleration. The third velocity is greater than the second velocity, the third acceleration is greater than the second acceleration, and the third deceleration is greater than the second deceleration.

[0156] In one alternative embodiment, the first velocity is equal to the third velocity, the first acceleration is equal to the third acceleration, and the first deceleration is equal to the third deceleration.

[0157] In some possible embodiments, the wafer target location is the wafer placement location.

[0158] In one possible embodiment, when the target wafer position is the wafer placement position and the current wafer position is between the fifth position and the wafer placement position, the speed running data corresponding to the target wafer position is determined as the fourth speed data, and the running speed of the lifting mechanism is controlled according to the fourth speed data until the wafer placement position is reached.

[0159] The fourth velocity data includes the second direction of travel, the fourth velocity, the fourth acceleration, and the fourth deceleration. Optionally, the second direction of travel is downward.

[0160] Specifically, the fourth velocity, fourth acceleration, and fourth deceleration can be determined in conjunction with the distance between the current position of the wafer and the wafer placement position.

[0161] In the first embodiment, the lifting mechanism can carry the wafer to a fourth speed with a fourth acceleration, and after running at the fourth speed for a certain period of time, decelerate with a fourth deceleration until the speed is 0 to the wafer placement position.

[0162] In the second embodiment, the lifting mechanism can carry the wafer to the fourth speed with a fourth acceleration, and decelerate with a fourth deceleration until the speed is 0 to the wafer placement position.

[0163] In another possible embodiment, when the target wafer position is the wafer placement position and the current wafer position is between the fourth and fifth positions, the speed operation data corresponding to the target wafer position is determined to be the fifth speed data and the fourth speed data. The operating speed of the lifting mechanism is controlled according to the fifth speed data until the current wafer position is the fifth position. The operating speed of the lifting mechanism is then controlled according to the fourth speed data until the wafer placement position is reached.

[0164] The fourth velocity data includes the second direction of travel, the fourth velocity, the fourth acceleration, and the fourth deceleration. The fifth velocity data includes the second direction of travel, the fifth velocity, the fifth acceleration, and the fifth deceleration. Optionally, the second direction of travel is downward.

[0165] Optionally, the fifth velocity, fifth acceleration, and fifth deceleration can be determined in conjunction with the distance between the current position of the wafer and the fifth position. Optionally, the fourth velocity is greater than the fifth velocity, the fourth acceleration is greater than the fifth acceleration, and the fourth deceleration is greater than the fifth deceleration.

[0166] In the first embodiment, if the wafer is currently positioned between the fourth and fifth positions, the lifting mechanism can carry the wafer and increase its speed to the fifth speed with a fifth acceleration, and then decelerate it with a fifth deceleration after running at the fifth speed for a certain period of time until the speed reaches the fifth position. Next, the lifting mechanism can carry the wafer and increase its speed to the fourth speed with a fourth acceleration, and then decelerate it with a fourth deceleration after running at the fourth speed for a certain period of time until the speed reaches 0 at the wafer placement position.

[0167] In the second embodiment, if the wafer is currently positioned between the fourth and fifth positions, the lifting mechanism can carry the wafer and increase its speed to the fifth speed with a fifth acceleration, and then operate at the fifth speed for a certain period of time to reach the fifth position. Next, the lifting mechanism can carry the wafer and increase its speed to the fourth speed with a fourth acceleration, and then decelerate with a fourth deceleration until the speed reaches 0 at the wafer placement position.

[0168] In another possible embodiment, when the target wafer position is the wafer placement position and the current wafer position is higher than the fourth position, the speed operation data corresponding to the target wafer position is determined as the sixth speed data, the fifth speed data, and the fourth speed data. The operating speed of the lifting mechanism is controlled according to the sixth speed data until the current wafer position is the fourth position. The operating speed of the lifting mechanism is controlled according to the fifth speed data until the current wafer position is the fifth position. The operating speed of the lifting mechanism is controlled according to the fourth speed data until the wafer placement position is reached.

[0169] The fourth speed data includes the second direction of travel, the fourth speed, the fourth acceleration, and the fourth deceleration. The fifth speed data includes the second direction of travel, the fifth speed, the fifth acceleration, and the fifth deceleration. The sixth speed data includes the second direction of travel, the sixth speed, the sixth acceleration, and the sixth deceleration. Optionally, the second direction of travel is downward.

[0170] Optionally, the sixth velocity is greater than the fifth velocity, the sixth acceleration is greater than the fifth acceleration, and the sixth deceleration is greater than the fifth deceleration. The fourth velocity is greater than the fifth velocity, the fourth acceleration is greater than the fifth acceleration, and the fourth deceleration is greater than the fifth deceleration.

[0171] In one alternative embodiment, the sixth velocity is equal to the fourth velocity, the sixth acceleration is equal to the fourth acceleration, and the sixth deceleration is equal to the fourth deceleration.

[0172] Specifically, the sixth velocity, sixth acceleration, and sixth deceleration can be determined in conjunction with the distance between the current position of the wafer and the fourth position.

[0173] In one embodiment, if the wafer's current position is between the fourth position and the wafer pick-up position, including the wafer pick-up position, the lifting mechanism can accelerate the wafer with a sixth acceleration to a sixth speed, run at the sixth speed for a certain period of time, then decelerate with a sixth deceleration until the speed reaches the fifth speed to the fourth position. Then, it runs at the fifth speed for a certain period of time to the fifth position. Subsequently, the lifting mechanism can increase the speed of the wafer with a fourth acceleration to the fourth speed, then decelerate with a fourth deceleration until the speed reaches 0 to the wafer placement position.

[0174] Figure 4 This is a flowchart illustrating a lifting control method according to an exemplary embodiment, applied when the target wafer position is the wafer placement position and the current wafer position is not the wafer placement position, including:

[0175] In step S401, the current position of the wafer is determined; if the current position of the wafer is higher than the fourth position, proceed to step S403; if the current position of the wafer is between the fourth and fifth positions, proceed to step S407; otherwise, proceed to step S411.

[0176] In step S403, the speed running data is determined to be the sixth speed data; the sixth speed data includes the second running direction, the sixth speed, the sixth acceleration, and the sixth deceleration;

[0177] In step S405, the operating speed of the lifting mechanism is controlled according to the sixth speed data until the current position of the wafer is the fourth position;

[0178] In step S407, the speed running data is determined to be the fifth speed data; the fifth speed data includes the second running direction, the fifth speed, the fifth acceleration, and the fifth deceleration;

[0179] In step S409, the operating speed of the lifting mechanism is controlled according to the fifth speed data until the current position of the wafer is the fifth position;

[0180] In step S411, the speed running data is determined to be the fourth speed data; the fourth speed data includes the second running direction, the fourth speed, the fourth acceleration, and the fourth deceleration;

[0181] In step S413, the operating speed of the lifting mechanism is controlled according to the fourth speed data until the wafer placement position is reached.

[0182] Optionally, the sixth velocity is greater than the fifth velocity, the sixth acceleration is greater than the fifth acceleration, and the sixth deceleration is greater than the fifth deceleration. The fourth velocity is greater than the fifth velocity, the fourth acceleration is greater than the fifth acceleration, and the fourth deceleration is greater than the fifth deceleration.

[0183] Optionally, the sixth velocity is equal to the fourth velocity, the sixth acceleration is equal to the fourth acceleration, and the sixth deceleration is equal to the fourth deceleration.

[0184] In some possible embodiments, the wafer target location is the wafer pick-up location.

[0185] In one possible embodiment, when the target wafer position is the wafer pick-up position and the current wafer position is between the wafer pick-up position and the second position, the speed running data corresponding to the target wafer position is determined as the seventh speed data, and the running speed of the lifting mechanism is controlled according to the seventh speed data until the wafer pick-up position is reached.

[0186] The seventh velocity data includes the second running direction, the seventh velocity, the seventh acceleration, and the seventh deceleration. Optionally, the second running direction is downward. Optionally, the seventh velocity, the seventh acceleration, and the seventh deceleration are determined based on the distance between the current wafer position and the wafer pick-up position.

[0187] In the first embodiment, the lifting mechanism can carry the wafer to the seventh speed with the seventh acceleration, and after running at the seventh speed for a certain period of time, decelerate with the seventh deceleration until the speed is 0 to the wafer pick-up position.

[0188] In the second embodiment, the lifting mechanism can carry the wafer to the seventh speed with the seventh acceleration, and then decelerate with the seventh deceleration until the speed is 0 to the wafer pick-up position.

[0189] In another possible embodiment, when the target wafer position is the wafer pick-up position and the current wafer position is between the first position and the second position, the speed operation data corresponding to the target wafer position is determined as the eighth speed data and the seventh speed data. The operating speed of the lifting mechanism is controlled according to the eighth speed data until the current wafer position is the second position. The operating speed of the lifting mechanism is controlled according to the seventh speed data until the wafer pick-up position is reached.

[0190] The seventh velocity data includes the second direction of travel, the seventh velocity, the seventh acceleration, and the seventh deceleration. The eighth velocity data includes the second direction of travel, the eighth velocity, the eighth acceleration, and the eighth deceleration. Optionally, the second direction of travel is downward.

[0191] Optionally, the eighth velocity, eighth acceleration, and eighth deceleration are determined based on the distance between the current position and the second position of the wafer. Optionally, the seventh velocity is greater than the eighth velocity, the seventh acceleration is greater than the eighth acceleration, and the seventh deceleration is greater than the eighth deceleration.

[0192] In one embodiment, if the wafer is currently positioned between a first position and a second position, the lifting mechanism can carry the wafer and increase its speed to an eighth speed with an eighth acceleration, and operate at the eighth speed for a certain period of time until it reaches the second position. Then, the lifting mechanism can carry the wafer and increase its speed to a seventh speed with a seventh acceleration, and operate at the seventh speed for a certain period of time before decelerating with a seventh deceleration until the speed reaches 0 at the wafer pick-up position.

[0193] In another possible embodiment, when the target wafer position is the wafer pick-up position and the current wafer position is higher than the first position, the speed operation data corresponding to the target wafer position is determined to be the ninth speed data, the eighth speed data, and the seventh speed data. The operating speed of the lifting mechanism is controlled according to the ninth speed data until the current wafer position is the first position. The operating speed of the lifting mechanism is controlled according to the eighth speed data until the current wafer position is the second position. The operating speed of the lifting mechanism is controlled according to the seventh speed data until the wafer pick-up position is reached.

[0194] Optionally, the seventh speed data includes the second direction of travel, the seventh speed, the seventh acceleration, and the seventh deceleration. The eighth speed data includes the second direction of travel, the eighth speed, the eighth acceleration, and the eighth deceleration. The ninth speed data includes the second direction of travel, the ninth speed, the ninth acceleration, and the ninth deceleration. Optionally, the second direction of travel is downward.

[0195] Optionally, the ninth velocity is greater than the eighth velocity, the ninth acceleration is greater than the eighth acceleration, and the ninth deceleration is greater than the eighth deceleration. The seventh velocity is greater than the eighth velocity, the seventh acceleration is greater than the eighth acceleration, and the seventh deceleration is greater than the eighth deceleration.

[0196] Optionally, the ninth velocity is equal to the seventh velocity, the ninth acceleration is equal to the seventh acceleration, and the ninth deceleration is equal to the seventh deceleration.

[0197] Specifically, the ninth velocity, ninth acceleration, and ninth deceleration can be determined in conjunction with the distance between the current position of the wafer and the first position.

[0198] In one embodiment, if the wafer's current position is higher than the first position, the lifting mechanism can lift the wafer with a ninth acceleration to a ninth speed, operate at the ninth speed for a certain period, decelerate with a ninth deceleration until it reaches the first position at an eighth speed, and operate at the eighth speed for a certain period until it reaches the second position. Then, the lifting mechanism can lift the wafer with a seventh acceleration to a seventh speed, operate at the seventh speed for a certain period, and decelerate with a seventh deceleration until the speed reaches 0 at the wafer pick-up position.

[0199] In another possible embodiment, when the target wafer position is the wafer pick-up position and the current wafer position is between the fourth position and the wafer pick-up position, the speed running data corresponding to the target wafer position is determined as the tenth speed data, and the running speed of the lifting mechanism is controlled according to the tenth speed data until the wafer pick-up position is reached.

[0200] Optionally, the tenth velocity data includes the first direction of travel, the tenth velocity, the tenth acceleration, and the tenth deceleration. Optionally, the first direction of travel is the upward direction.

[0201] Specifically, the tenth velocity, tenth acceleration, and tenth deceleration can be determined in conjunction with the distance between the current position of the wafer and the wafer pick-up position.

[0202] In the first embodiment, the lifting mechanism can carry the wafer to the tenth acceleration speed to the tenth speed, and after running at the tenth speed for a certain period of time, decelerate at the tenth deceleration speed until the speed is 0 to the wafer pick-up position.

[0203] In the second embodiment, the lifting mechanism can carry the wafer to increase the speed to the tenth speed with the tenth acceleration, and then decelerate with the tenth deceleration until the speed is 0 to the wafer pick-up position.

[0204] In another possible embodiment, when the target wafer position is the wafer pick-up position and the current wafer position is between the fourth and fifth positions, the speed operation data corresponding to the target wafer position is determined to be the eleventh speed data and the tenth speed data. The operating speed of the lifting mechanism is controlled according to the eleventh speed data until the current wafer position is the fourth position. The operating speed of the lifting mechanism is then controlled according to the tenth speed data until the wafer pick-up position is reached.

[0205] Optionally, the tenth velocity data includes the first direction of travel, the tenth velocity, the tenth acceleration, and the tenth deceleration. The eleventh velocity data includes the first direction of travel, the eleventh velocity, the eleventh acceleration, and the eleventh deceleration. Optionally, the first direction of travel is upward.

[0206] Optionally, the eleventh velocity, eleventh acceleration, and eleventh deceleration can be determined based on the distance between the current position of the wafer and the fourth position. Specifically, the tenth velocity is greater than the eleventh velocity, the tenth acceleration is greater than the eleventh acceleration, and the tenth deceleration is greater than the eleventh deceleration.

[0207] In the first embodiment, if the wafer is currently positioned between the fourth and fifth positions, the lifting mechanism can carry the wafer and increase its speed to the eleventh speed with an eleventh acceleration, and then operate at the eleventh speed for a certain period of time until it reaches the fourth position. Next, the lifting mechanism can carry the wafer and increase its speed to the tenth speed with a tenth acceleration, and after operating at the tenth speed for a certain period of time, it can decelerate with a tenth deceleration until the speed reaches 0 at the wafer pick-up position.

[0208] In the second embodiment, if the wafer is currently positioned between the fourth and fifth positions, the lifting mechanism can carry the wafer and increase its speed to the eleventh speed with an eleventh acceleration, and operate at the eleventh speed for a certain period of time until it reaches the fourth position. Then, the lifting mechanism can carry the wafer and increase its speed to the tenth speed with a tenth acceleration, and then decelerate with a tenth deceleration until the speed reaches 0 at the wafer pick-up position.

[0209] In another possible embodiment, when the target wafer position is the wafer pick-up position and the current wafer position is below the fifth position, the speed operation data corresponding to the target wafer position is determined as the twelfth speed data, the eleventh speed data, and the tenth speed data. The operating speed of the lifting mechanism is controlled according to the twelfth speed data until the current wafer position is the fifth position. The operating speed of the lifting mechanism is controlled according to the eleventh speed data until the current wafer position is the fourth position. The operating speed of the lifting mechanism is controlled according to the tenth speed data until the wafer pick-up position is reached.

[0210] Optionally, the tenth speed data includes the first direction of travel, the tenth speed, the tenth acceleration, and the tenth deceleration. The eleventh speed data includes the first direction of travel, the eleventh speed, the eleventh acceleration, and the eleventh deceleration. The twelfth speed data includes the first direction of travel, the twelfth speed, the twelfth acceleration, and the twelfth deceleration. Optionally, the first direction of travel is upward.

[0211] Optionally, the twelfth velocity, twelfth acceleration, and twelfth deceleration are determined based on the distance between the current wafer position and the fifth position. Optionally, the twelfth velocity is greater than the eleventh velocity, the twelfth acceleration is greater than the eleventh acceleration, and the twelfth deceleration is greater than the eleventh deceleration. Alternatively, the tenth velocity is greater than the eleventh velocity, the tenth acceleration is greater than the eleventh acceleration, and the tenth deceleration is greater than the eleventh deceleration.

[0212] Optionally, the twelfth velocity is equal to the tenth velocity, the twelfth acceleration is equal to the tenth acceleration, and the twelfth deceleration is equal to the tenth deceleration.

[0213] In one embodiment, if the wafer's current position is lower than the fifth position, the lifting mechanism can carry the wafer, increasing its speed to the twelfth speed with the twelfth acceleration, and then decelerating it to the eleventh speed with the twelfth deceleration until it reaches the fifth position. Next, the lifting mechanism can carry the wafer at the eleventh speed for a certain period until it reaches the fourth position. Then, the lifting mechanism can carry the wafer, increasing its speed to the tenth speed with the tenth acceleration, and then decelerating it with the tenth deceleration until the speed reaches 0 at the wafer pick-up position.

[0214] Figure 5 This is a flowchart illustrating a lifting control method according to an exemplary embodiment, applied when the target wafer position is the wafer pick-up position, and the current wafer position is not at the wafer pick-up position, including:

[0215] In step S501, the current position of the wafer is determined; if the current position of the wafer is higher than the first position, proceed to step S503; if the current position of the wafer is between the first and second positions, proceed to step S507; if the current position of the wafer is between the second position and the wafer pick-up position, proceed to step S511; if the current position of the wafer is lower than the fifth position, proceed to step S521; if the current position of the wafer is between the fourth and fifth positions, proceed to step S525; if the current position of the wafer is between the fourth position and the wafer pick-up position, proceed to step S529.

[0216] In step S503, the speed running data is determined to be the ninth speed data; the ninth speed data includes the second running direction, the ninth speed, the ninth acceleration, and the ninth deceleration;

[0217] In step S505, the operating speed of the lifting mechanism is controlled according to the ninth speed data until the current position of the wafer is the first position;

[0218] In step S507, the speed running data is determined to be the eighth speed data; the eighth speed data includes the second running direction, the eighth speed, the eighth acceleration, and the eighth deceleration;

[0219] In step S509, the operating speed of the lifting mechanism is controlled according to the eighth speed data until the current position of the wafer is the second position;

[0220] In step S511, the speed running data is determined to be the seventh speed data; the seventh speed data includes the second running direction, the seventh speed, the seventh acceleration, and the seventh deceleration;

[0221] In step S515, the operating speed of the lifting mechanism is controlled according to the seventh speed data until the wafer pick-up position is reached, and the process ends.

[0222] In step S521, the speed running data is determined to be the twelfth speed data; the twelfth speed data includes the first running direction, the twelfth speed, the twelfth acceleration, and the twelfth deceleration;

[0223] In step S523, the operating speed of the lifting mechanism is controlled according to the twelfth speed data until the current position of the wafer is the fifth position;

[0224] In step S525, the speed running data is determined to be the eleventh speed data; the eleventh speed data includes the first running direction, the eleventh speed, the eleventh acceleration, and the eleventh deceleration;

[0225] In step S527, the operating speed of the lifting mechanism is controlled according to the eleventh speed data until the current position of the wafer is the fourth position;

[0226] In step S529, the speed running data is determined to be the tenth speed data; the tenth speed data includes the first running direction, the tenth speed, the tenth acceleration, and the tenth deceleration;

[0227] In step S531, the operating speed of the lifting mechanism is controlled according to the tenth speed data until the wafer pick-up position is reached, and the process ends.

[0228] The following describes a possible lifting speed control method for the lifting structure, using the substrate lifting process as an example. The substrate lifting process includes: from the wafer placement position --> wafer pick-up position --> epitaxial process position, and then from the epitaxial process position --> wafer pick-up position --> wafer placement position.

[0229] In this embodiment of the application, the process from wafer placement position to wafer take-off position to epitaxial process position can be referred to as cold placement process.

[0230] Figure 6 This is a schematic diagram of the speed and position control of a cold-state wafer loading process according to an exemplary embodiment.

[0231] In an optional embodiment, the current position of the wafer is the wafer pick-up position. The lifting mechanism can carry the wafer, increasing its speed to the twelfth speed with a twelfth acceleration, and then decelerating it to the eleventh speed with a twelfth deceleration until reaching the fifth position. Next, the lifting mechanism can carry the wafer at the eleventh speed for a certain period of time until reaching the fourth position. Then, the lifting mechanism can carry the wafer, increasing its speed to the tenth speed with a tenth acceleration, and then decelerating it to the tenth deceleration until the speed reaches 0, reaching the wafer pick-up position.

[0232] Next, the lifting mechanism can carry the wafer, increasing its speed to a third speed with a third acceleration, and then decelerating at the third speed for a certain period of time until it reaches the second speed and the second position. Then, it can continue operating at the second speed for a certain period of time, then decelerate at the second speed until the speed reaches 0 and the third position. Next, the lifting mechanism can carry the wafer, increasing its speed to the second speed with a second acceleration, and then decelerating at the second speed for a certain period of time until it reaches the first position. Finally, the lifting mechanism can carry the wafer, increasing its speed to the first speed with a first acceleration, and then decelerating at the first speed for a certain period of time until the speed reaches 0 and the epitaxial process position.

[0233] In this embodiment of the application, the process from epitaxial process location --> wafer pick-up location --> wafer placement location can be referred to as the hot pick-up process.

[0234] Figure 7 This is a schematic diagram of the speed and position control of a hot-state wafer picking process according to an exemplary embodiment.

[0235] In an optional embodiment, the wafer is currently positioned at an epitaxial process location. The lifting mechanism can raise the wafer to a ninth speed with a ninth acceleration, operate at the ninth speed for a certain period, decelerate with a ninth deceleration until it reaches a first position at an eighth speed, and operate at the eighth speed for a certain period until it reaches a second position. Next, the lifting mechanism can raise the wafer to a seventh speed with a seventh acceleration, operate at the seventh speed for a certain period, and then decelerate with a seventh deceleration until the speed reaches 0 at the wafer pick-up position.

[0236] Next, the lifting mechanism can accelerate the wafer to the sixth speed with the sixth acceleration, run at the sixth speed for a certain period of time, and then decelerate with the sixth deceleration until the speed reaches the fifth speed to the fourth position. Then, it runs at the fifth speed for a certain period of time to the fifth position. Subsequently, the lifting mechanism can increase the speed of the wafer to the fourth speed with the fourth acceleration, and then decelerate with the fourth deceleration until the speed reaches 0 to the wafer placement position.

[0237] In summary, during cold wafer placement, the combination of velocity + zero velocity + velocity between the second and first positions, coupled with a zero velocity at the third position, reduces wafer drift caused by the graphite tray during transport. During hot wafer unloading, the combination of velocity + low velocity + high velocity near the fifth and sixth positions mitigates scratches and uneven markings caused by the PIN support components.

[0238] Figure 8This is a block diagram illustrating a lifting control device according to an exemplary embodiment. The device is applied to a lifting control method and has the function of implementing the data processing method in the above-described method embodiments. The function can be implemented in hardware or by hardware executing corresponding software. (Refer to...) Figure 8 The device includes a position determination module 601 and a speed control module 602.

[0239] The position determination module 601 is configured to determine the target position and the current position of the wafer; the target position of the wafer includes one of multiple operating positions of the lifting mechanism; the multiple operating positions are determined based on the mechanical structure of the epitaxial equipment and the wafer lifting station.

[0240] The speed data determination module 602 is configured to control the lifting mechanism by segmenting the running speed based on the distance if there is a distance between the target position of the wafer and the current position of the wafer.

[0241] In some possible embodiments,

[0242] The lifting mechanism has multiple operating positions, including the epitaxial process position from high to low, the wafer pick-up position, and the wafer placement position;

[0243] The current position of the wafer is any position between the epitaxial process position and the wafer placement position.

[0244] In some possible embodiments,

[0245] The lifting mechanism is also provided with a first position and a second position; the first position and the second position are located between the epitaxial process position and the wafer pick-up position, and the first position is higher than the second position;

[0246] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as first speed data when the wafer target position is an epitaxial process position and the current wafer position is between the first position and the epitaxial process position; the first speed data includes a first running direction, a first speed, a first acceleration, and a first deceleration;

[0247] The control module is configured to control the operating speed of the lifting mechanism based on the first speed data until it reaches the epitaxial process position.

[0248] In some possible embodiments,

[0249] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as second speed data and first speed data when the wafer target position is an epitaxial process position and the wafer current position is between a first position and a second position; the second speed data includes a first running direction, a second speed, a second acceleration, and a second deceleration.

[0250] The control module is configured to control the operating speed of the lifting mechanism according to the second speed data until the current position of the wafer is the first position; control the operating speed of the lifting mechanism according to the first speed data until the epitaxial process position is reached; the first speed is greater than the second speed; the first acceleration is greater than the second acceleration; the first deceleration is greater than the second deceleration.

[0251] In some possible embodiments,

[0252] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as third speed data, second speed data, and first speed data when the wafer target position is an epitaxial process position and the current wafer position is lower than the second position; the third speed data includes the first running direction, third speed, third acceleration, and third deceleration.

[0253] The control module is configured to control the operating speed of the lifting mechanism according to the third speed data until the current position of the wafer is the second position; control the operating speed of the lifting mechanism according to the second speed data until the current position of the wafer is the first position; control the operating speed of the lifting mechanism according to the first speed data until the epitaxial process position is reached; the third speed is greater than the second speed; the third acceleration is greater than the second acceleration; and the third deceleration is greater than the second deceleration.

[0254] In some possible embodiments, the lifting mechanism is further provided with a third position; the third position is located between the first position and the second position;

[0255] While controlling the operating speed of the lifting mechanism based on the second speed data until the wafer is in the first position, the speed of the lifting mechanism is zero in the third position.

[0256] In some possible embodiments, the lifting mechanism is further provided with a fourth position and a fifth position; the fourth position and the fifth position are located between the wafer pick-up position and the wafer placement position, and the fourth position is higher than the fifth position;

[0257] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as the fourth speed data when the wafer target position is the wafer placement position and the current wafer position is between the fifth position and the wafer placement position; the fourth speed data includes the second running direction, the fourth speed, the fourth acceleration, and the fourth deceleration;

[0258] The control module is configured to control the operating speed of the lifting mechanism based on the fourth speed data until the wafer placement position is reached.

[0259] In some possible embodiments,

[0260] The speed data determination module is configured to determine the speed data corresponding to the target wafer position as the fifth speed data and the fourth speed data when the target wafer position is the wafer placement position and the current wafer position is between the fourth and fifth positions; the fifth speed data includes the second running direction, the fifth speed, the fifth acceleration, and the fifth deceleration;

[0261] The control module is configured to control the operating speed of the lifting mechanism according to the fifth speed data until the current position of the wafer is the fifth position; control the operating speed of the lifting mechanism according to the fourth speed data until the wafer placement position is reached; the fourth speed is greater than the fifth speed; the fourth acceleration is greater than the fifth acceleration; the fourth deceleration is greater than the fifth deceleration.

[0262] In some possible embodiments,

[0263] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as the sixth speed data, the fifth speed data, and the fourth speed data when the wafer target position is the wafer placement position and the current wafer position is higher than the fourth position; the sixth speed data includes the second running direction, the sixth speed, the sixth acceleration, and the sixth deceleration;

[0264] The control module is configured to control the operating speed of the lifting mechanism based on the sixth speed data until the current wafer position is the fourth position; control the operating speed of the lifting mechanism based on the fifth speed data until the current wafer position is the fifth position; control the operating speed of the lifting mechanism based on the fourth speed data until the wafer placement position is reached; the sixth speed is greater than the fifth speed; the sixth acceleration is greater than the fifth acceleration; the sixth deceleration is greater than the fifth deceleration.

[0265] In some possible embodiments, the lifting mechanism is further provided with a first position and a second position; the first position and the second position are located between the epitaxial process position and the wafer pick-up position, and the first position is higher than the second position;

[0266] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as the seventh speed data when the wafer target position is the wafer pick-up position and the current wafer position is between the wafer pick-up position and the second position; the seventh speed data includes the second running direction, the seventh speed, the seventh acceleration, and the seventh deceleration;

[0267] The control module is configured to control the operating speed of the lifting mechanism based on the seventh speed data until it reaches the wafer pick-up position.

[0268] In some possible embodiments,

[0269] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as the eighth speed data and the seventh speed data when the wafer target position is the wafer pick-up position and the current wafer position is between the first position and the second position; the eighth speed data includes the second running direction, the eighth speed, the eighth acceleration, and the eighth deceleration;

[0270] The control module is configured to control the operating speed of the lifting mechanism according to the eighth speed data until the current position of the wafer is the second position; and to control the operating speed of the lifting mechanism according to the seventh speed data until the wafer pick-up position is reached; the seventh speed is greater than the eighth speed; the seventh acceleration is greater than the eighth acceleration; and the seventh deceleration is greater than the eighth deceleration.

[0271] In some possible embodiments,

[0272] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as the ninth speed data, the eighth speed data, and the seventh speed data when the wafer target position is the wafer pick-up position and the current wafer position is higher than the first position; the ninth speed data includes the second running direction, the ninth speed, the ninth acceleration, and the ninth deceleration;

[0273] The control module is configured to control the operating speed of the lifting mechanism according to the ninth speed data until the current position of the wafer is the first position; control the operating speed of the lifting mechanism according to the eighth speed data until the current position of the wafer is the second position; control the operating speed of the lifting mechanism according to the seventh speed data until the wafer is picked up; the ninth speed is greater than the eighth speed; the ninth acceleration is greater than the eighth acceleration; the ninth deceleration is greater than the eighth deceleration.

[0274] In some possible embodiments, the lifting mechanism is further provided with a fourth position and a fifth position; the fourth position and the fifth position are located between the wafer pick-up position and the wafer placement position, and the fourth position is higher than the fifth position;

[0275] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as the tenth speed data when the wafer target position is the wafer pick-up position and the current wafer position is between the fourth position and the wafer pick-up position; the tenth speed data includes the first running direction, the tenth speed, the tenth acceleration, and the tenth deceleration;

[0276] The control module is configured to control the operating speed of the lifting mechanism based on the tenth speed data until it reaches the wafer pick-up position.

[0277] In some possible embodiments,

[0278] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as eleventh speed data and tenth speed data when the wafer target position is the wafer pick-up position and the current wafer position is between the fourth and fifth positions; the eleventh speed data includes the first running direction, eleventh speed, eleventh acceleration and eleventh deceleration;

[0279] The control module is configured to control the operating speed of the lifting mechanism according to the eleventh speed data until the current position of the wafer is the fourth position; control the operating speed of the lifting mechanism according to the tenth speed data until the wafer pick-up position is reached; the tenth speed is greater than the eleventh speed; the tenth acceleration is greater than the eleventh acceleration; the tenth deceleration is greater than the eleventh deceleration.

[0280] In some possible embodiments,

[0281] The speed data determination module is configured to determine the speed data corresponding to the wafer target position as the twelfth speed data, the eleventh speed data, and the tenth speed data when the wafer target position is the wafer pick-up position and the current wafer position is lower than the fifth position; the twelfth speed data includes the first running direction, the twelfth speed, the twelfth acceleration, and the twelfth deceleration;

[0282] The control module is configured to control the operating speed of the lifting mechanism based on the twelfth speed data until the wafer is currently at the fifth position; control the operating speed of the lifting mechanism based on the eleventh speed data until the wafer is currently at the fourth position; control the operating speed of the lifting mechanism based on the tenth speed data until the wafer is picked up; the twelfth speed is greater than the eleventh speed; the twelfth acceleration is greater than the eleventh acceleration; the twelfth deceleration is greater than the eleventh deceleration.

[0283] It should be noted that the apparatus provided in the above embodiments is only illustrated by the division of the above functional modules when implementing its functions. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. In addition, the apparatus and method embodiments provided in the above embodiments belong to the same concept, and the specific implementation process can be found in the method embodiments, which will not be repeated here.

[0284] On the other hand, embodiments of this application disclose an electronic device, including: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to execute instructions to implement the above-described lifting control method.

[0285] On the other hand, embodiments of this application disclose a computer-readable storage medium that, when the instructions in the computer-readable storage medium are executed by the processor of an electronic device, enables the electronic device to perform the above-described lifting control method.

[0286] On the other hand, embodiments of this application disclose a computer program product, which includes a computer program stored in a readable storage medium. At least one processor of a computer device reads and executes the computer program from the readable storage medium, causing the device to perform the above-described lifting control method.

[0287] The electronic devices described in this application can be any electronic product or device such as smartphones, desktop computers, tablets, laptops, digital assistants, augmented reality (AR) / virtual reality (VR) devices, smart voice interaction devices, smart home appliances, smart wearable devices, and in-vehicle terminal devices, or any intermediate product including the aforementioned storage devices.

[0288] It should be noted that the order of the embodiments described above is merely for descriptive purposes and does not represent the superiority or inferiority of the embodiments. Furthermore, specific embodiments have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims can be performed in a different order than that shown in the embodiments and still achieve the desired result. Additionally, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0289] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the device embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0290] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0291] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A lifting control method, characterized in that, A lifting mechanism for a base used in epitaxial equipment includes: Determine the target wafer position and the current wafer position; the target wafer position includes one of multiple operating positions of the lifting mechanism; the multiple operating positions are determined based on the mechanical structure of the epitaxial equipment and the wafer lifting station; If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on the distance.

2. The lifting control method according to claim 1, characterized in that, The lifting mechanism has multiple operating positions, including an epitaxial process position from high to low, a wafer pick-up position, and a wafer placement position; The current position of the wafer is any position between the epitaxial process position and the wafer placement position.

3. The lifting control method according to claim 2, characterized in that, The lifting mechanism is further provided with a first position and a second position; the first position and the second position are located between the epitaxial process position and the wafer picking position, and the first position is higher than the second position; If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the epitaxial process position, and the current wafer position is between the first position and the epitaxial process position, the speed running data corresponding to the target wafer position is determined as the first speed data; the first speed data includes a first running direction, a first speed, a first acceleration, and a first deceleration; The operating speed of the lifting mechanism is controlled based on the first speed data until the epitaxial process position is reached.

4. The lifting control method according to claim 3, characterized in that, If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the epitaxial process position, and the current wafer position is between the first position and the second position, the speed running data corresponding to the target wafer position is determined to be the second speed data and the first speed data; the second speed data includes the first running direction, the second speed, the second acceleration, and the second deceleration; The operating speed of the lifting mechanism is controlled according to the second speed data until the current position of the wafer is the first position; The operating speed of the lifting mechanism is controlled based on the first speed data until the epitaxial process position is reached; The first velocity is greater than the second velocity; the first acceleration is greater than the second acceleration; the first deceleration is greater than the second deceleration.

5. The lifting control method according to claim 4, characterized in that, If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the epitaxial process position, and the current wafer position is lower than the second position, the speed operation data corresponding to the target wafer position is determined to be the third speed data, the second speed data, and the first speed data; the third speed data includes the first running direction, the third speed, the third acceleration, and the third deceleration; The operating speed of the lifting mechanism is controlled according to the third speed data until the current position of the wafer is the second position; The operating speed of the lifting mechanism is controlled according to the second speed data until the current position of the wafer is the first position; The operating speed of the lifting mechanism is controlled based on the first speed data until the epitaxial process position is reached; The third velocity is greater than the second velocity; the third acceleration is greater than the second acceleration; the third deceleration is greater than the second deceleration.

6. The lifting control method according to claim 4 or 5, characterized in that, The lifting mechanism is also provided with a third position; the third position is located between the first position and the second position. While controlling the operating speed of the lifting mechanism according to the second speed data until the current position of the wafer is the first position, the speed of the lifting mechanism at the third position is zero.

7. The lifting control method according to claim 2, characterized in that, The lifting mechanism is further provided with a fourth position and a fifth position; the fourth position and the fifth position are located between the wafer pick-up position and the wafer placement position, and the fourth position is higher than the fifth position; If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the wafer placement position, and the current wafer position is between the fifth position and the wafer placement position, the speed running data corresponding to the target wafer position is determined as the fourth speed data; the fourth speed data includes the second running direction, the fourth speed, the fourth acceleration, and the fourth deceleration; The operating speed of the lifting mechanism is controlled according to the fourth speed data until the wafer placement position is reached.

8. The lifting control method according to claim 7, characterized in that, If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the wafer placement position, and the current wafer position is between the fourth position and the fifth position, the speed operation data corresponding to the target wafer position is determined to be the fifth speed data and the fourth speed data; the fifth speed data includes the second running direction, the fifth speed, the fifth acceleration, and the fifth deceleration; The operating speed of the lifting mechanism is controlled according to the fifth speed data until the current position of the wafer is the fifth position; The operating speed of the lifting mechanism is controlled according to the fourth speed data until the wafer placement position is reached; The fourth velocity is greater than the fifth velocity; the fourth acceleration is greater than the fifth acceleration; the fourth deceleration is greater than the fifth deceleration.

9. The lifting control method according to claim 8, characterized in that, If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the wafer placement position, and the current wafer position is higher than the fourth position, the speed operation data corresponding to the target wafer position is determined to be the sixth speed data, the fifth speed data, and the fourth speed data; the sixth speed data includes the second running direction, the sixth speed, the sixth acceleration, and the sixth deceleration; The operating speed of the lifting mechanism is controlled according to the sixth speed data until the current position of the wafer is the fourth position; The operating speed of the lifting mechanism is controlled according to the fifth speed data until the current position of the wafer is the fifth position; The operating speed of the lifting mechanism is controlled according to the fourth speed data until the wafer placement position is reached; The sixth velocity is greater than the fifth velocity; the sixth acceleration is greater than the fifth acceleration; the sixth deceleration is greater than the fifth deceleration.

10. The lifting control method according to claim 2, characterized in that, The lifting mechanism is further provided with a first position and a second position; the first position and the second position are located between the epitaxial process position and the wafer picking position, and the first position is higher than the second position; If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the wafer pick-up position, and the current wafer position is between the wafer pick-up position and the second position, the speed running data corresponding to the target wafer position is determined to be the seventh speed data; the seventh speed data includes the second running direction, the seventh speed, the seventh acceleration, and the seventh deceleration; The operating speed of the lifting mechanism is controlled according to the seventh speed data until the wafer picking position is reached.

11. The lifting control method according to claim 10, characterized in that, If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the wafer pick-up position, and the current wafer position is between the first position and the second position, the speed running data corresponding to the target wafer position is determined to be the eighth speed data and the seventh speed data; the eighth speed data includes the second running direction, the eighth speed, the eighth acceleration, and the eighth deceleration; The operating speed of the lifting mechanism is controlled according to the eighth speed data until the current position of the wafer is the second position; The operating speed of the lifting mechanism is controlled according to the seventh speed data until the wafer picking position is reached; The seventh velocity is greater than the eighth velocity; the seventh acceleration is greater than the eighth acceleration; the seventh deceleration is greater than the eighth deceleration.

12. The lifting control method according to claim 11, characterized in that, If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the wafer pick-up position, and the current wafer position is higher than the first position, the speed running data corresponding to the target wafer position is determined to be the ninth speed data, the eighth speed data, and the seventh speed data; the ninth speed data includes the second running direction, the ninth speed, the ninth acceleration, and the ninth deceleration; The operating speed of the lifting mechanism is controlled according to the ninth speed data until the current position of the wafer is the first position; The operating speed of the lifting mechanism is controlled according to the eighth speed data until the current position of the wafer is the second position; The operating speed of the lifting mechanism is controlled according to the seventh speed data until the wafer picking position is reached; The ninth velocity is greater than the eighth velocity; the ninth acceleration is greater than the eighth acceleration; the ninth deceleration is greater than the eighth deceleration.

13. The lifting control method according to claim 2, characterized in that, The lifting mechanism is further provided with a fourth position and a fifth position; the fourth position and the fifth position are located between the wafer pick-up position and the wafer placement position, and the fourth position is higher than the fifth position; If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the wafer pick-up position, and the current wafer position is between the fourth position and the wafer pick-up position, the speed running data corresponding to the target wafer position is determined to be the tenth speed data; the tenth speed data includes the first running direction, the tenth speed, the tenth acceleration, and the tenth deceleration; The operating speed of the lifting mechanism is controlled according to the tenth speed data until the wafer picking position is reached.

14. The lifting control method according to claim 13, characterized in that, If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the wafer pick-up position, and the current wafer position is between the fourth position and the fifth position, the speed running data corresponding to the target wafer position is determined to be the eleventh speed data and the tenth speed data; the eleventh speed data includes the first running direction, the eleventh speed, the eleventh acceleration, and the eleventh deceleration; The operating speed of the lifting mechanism is controlled according to the eleventh speed data until the current position of the wafer is the fourth position; The operating speed of the lifting mechanism is controlled according to the tenth speed data until the wafer picking position is reached; The tenth velocity is greater than the eleventh velocity; the tenth acceleration is greater than the eleventh acceleration; the tenth deceleration is greater than the eleventh deceleration.

15. The lifting control method according to claim 14, characterized in that, If there is a distance between the target position of the wafer and the current position of the wafer, the lifting mechanism is controlled by segmented operating speeds based on this distance, including: When the target wafer position is the wafer pick-up position, and the current wafer position is lower than the fifth position, the speed running data corresponding to the target wafer position is determined to be the twelfth speed data, the eleventh speed data, and the tenth speed data; the twelfth speed data includes the first running direction, the twelfth speed, the twelfth acceleration, and the twelfth deceleration; The operating speed of the lifting mechanism is controlled according to the twelfth speed data until the current position of the wafer is the fifth position; The operating speed of the lifting mechanism is controlled according to the eleventh speed data until the current position of the wafer is the fourth position; The operating speed of the lifting mechanism is controlled according to the tenth speed data until the wafer picking position is reached; The twelfth velocity is greater than the eleventh velocity; the twelfth acceleration is greater than the eleventh acceleration; the twelfth deceleration is greater than the eleventh deceleration.

16. A lifting control device, characterized in that, A lifting mechanism for a base used in epitaxial equipment includes: The position determination module is configured to determine the target position and the current position of the wafer; the target position includes one of a plurality of operating positions of the lifting mechanism; the plurality of operating positions are determined based on the mechanical structure of the epitaxial device and the wafer lifting station. The speed control module is configured to control the lifting mechanism by taking segmented running speeds based on the distance if there is a distance between the target position of the wafer and the current position of the wafer.

17. An electronic device, characterized in that, include: processor; Memory used to store the processor's executable instructions; The processor is configured to execute the instructions to implement the lifting control method as described in any one of claims 1 to 15.

18. A computer-readable storage medium, characterized in that, When the instructions in the computer-readable storage medium are executed by the processor of the electronic device, the electronic device is able to perform the lifting control method as described in any one of claims 1 to 15.

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