A highly adaptive compensation control method for die bonding dispensing

Abstract

The application relates to the technical field of semiconductor packaging, and discloses a height self-adaptive compensation control method and system for die bonding dispensing, which comprises the following steps: acquiring a reference surface image of a substrate to be processed, extracting all dispensing point position plane coordinate information, combining dispensing needle head vertical displacement calibration data, generating a global height reference parameter and taking the global height reference parameter as the only height reference value of the operation; then, according to the global height reference parameter and chip specification parameters, generating dispensing needle head vertical displacement values and dispensing travel path values of each dispensing point position and issuing the values for execution; synchronously collecting post-dispensing surface images of each point position during dispensing, extracting glue layer contour information and comparing the glue layer contour information with standard glue layer features to obtain comparison values; when the comparison values exceed a threshold value, suspending the operation and adjusting the needle head displacement, and when all the comparison values meet the threshold value, completing the operation and outputting a completion instruction, so that self-adaptive compensation control of the dispensing height is realized. The application can improve the glue layer quality consistency and operation yield of all dispensing point positions on the whole board.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor packaging, and in particular to a height adaptive compensation control method for die bonding dispensing. Background Technology

[0002] In the entire semiconductor packaging manufacturing process, die bonding and dispensing are the core processes for achieving mechanical fixation and electrical interconnection between the chip and the substrate. The control precision of the dispensing operation and the consistency of the adhesive layer quality directly determine the die bonding yield and the long-term operational reliability of the packaged devices. As semiconductor devices continue to iterate towards miniaturization, high density, and high integration, chip package sizes are constantly shrinking, and the tolerance requirements for adhesive layer thickness control in die bonding and dispensing are becoming increasingly stringent. Even slight deviations in the vertical displacement of the dispensing needle during the dispensing process can cause problems such as uneven adhesive layer thickness, adhesive overflow, and chip bonding failure, thereby directly affecting the performance and production yield of the entire batch of packaged products.

[0003] Currently, in the semiconductor packaging industry, the height control of the dispensing needle in the die bonding and dispensing process generally adopts a combination of full-stroke parameter calibration before the equipment leaves the factory and benchmark point calibration before a single batch of operations. By using the pre-calibrated needle vertical displacement parameters, a unified height control benchmark is set for the dispensing operations of the same batch of substrates to be processed. Some application solutions will collect flatness data from multiple points before operating on a single substrate to adapt to the flatness deviation of the substrate itself, thereby meeting the basic height control requirements of the die bonding and dispensing operation.

[0004] As can be seen from the above, how to improve the consistency of adhesive layer quality and the yield rate of all dispensing points on the entire board still needs to be solved. Summary of the Invention

[0005] In order to improve the consistency of adhesive layer quality and the yield rate of all dispensing points on the entire board, this application provides a height adaptive compensation control method for die bonding dispensing.

[0006] In a first aspect, this application provides a height adaptive compensation control method for die bonding dispensing, employing the following technical solution:

[0007] A height adaptive compensation control method for die bonding dispensing includes:

[0008] Acquire the reference surface image of the substrate to be processed on the die bonding platform, extract the planar coordinate information of all dispensing points on the substrate to be processed, and combine it with the vertical displacement calibration data of the dispensing needle to generate a global height reference parameter covering all dispensing points. The global height reference parameter is used as the only height reference value for the entire die bonding and dispensing process.

[0009] Based on the global height reference parameters and combined with the chip specification parameters corresponding to each dispensing point, the vertical displacement value of the dispensing needle corresponding to each dispensing point is generated, and the travel path value of the dispensing operation is generated simultaneously and sent to the dispensing operation execution unit.

[0010] During the dispensing operation of the dispensing unit along the travel path to complete the dispensing operation at each dispensing point, the surface image after dispensing at each dispensing point is collected simultaneously, the adhesive layer contour information of each dispensing point is extracted, and the adhesive layer contour information is compared with the standard adhesive layer features corresponding to the global height reference parameters to obtain the comparison value of each dispensing point.

[0011] When the comparison value of any dispensing point exceeds the preset threshold, the current dispensing operation is immediately paused. The vertical displacement value of the dispensing needle is adjusted and the operation continues. When the comparison value of all dispensing points meets the preset threshold, the operation is completed and the operation completion command is output.

[0012] Optionally, the step of acquiring a reference surface image of the substrate to be processed on the die bonding platform and extracting the planar coordinate information of all dispensing points on the substrate to be processed includes:

[0013] The acquired reference surface image of the substrate to be processed is subjected to distortion correction and grayscale normalization to eliminate lens distortion and illumination deviation during the acquisition process. The pixel coordinates of the preset positioning mark points on the substrate surface are extracted to complete the conversion and calibration between pixel coordinates and physical coordinates of the die bonding platform.

[0014] Based on the transformed and calibrated physical coordinate system, the distribution position of all dispensing points on the substrate to be processed is identified, the planar coordinate information corresponding to each dispensing point is extracted, and the coordinate sorting and duplicate point rejection verification of all dispensing points are completed.

[0015] Optionally, the step of incorporating the vertical displacement calibration data of the dispensing needle includes:

[0016] Obtain vertical displacement calibration data of the dispensing needle within the full stroke range of the die bonding platform. The vertical displacement calibration data includes the correspondence between the vertical movement of the dispensing needle in different planar coordinates and the actual needle drop height.

[0017] The extracted planar coordinates of each dispensing point are matched and bound one-to-one with the vertical displacement calibration data to establish a unique mapping relationship between the planar coordinates and vertical displacement of each dispensing point.

[0018] Optionally, the step of generating a global height reference parameter covering all dispensing points and using the global height reference parameter as the sole height reference value for the entire die bonding and dispensing operation includes:

[0019] Based on the unique mapping relationship between the planar coordinates and vertical displacement of each dispensing point, and combined with the flatness data of the reference surface of the substrate to be processed, a global height reference parameter covering all dispensing points is generated.

[0020] The generated global height reference parameters are verified for accuracy at all points. Once the verification is successful, the global height reference parameters are written into the storage unit of this die bonding and dispensing operation and locked as the only callable height reference value for the entire process of this die bonding and dispensing operation. No other height reference values ​​are generated during this operation.

[0021] Optionally, during the process of the dispensing operation unit completing the dispensing operation at each dispensing point along the travel path, the method further includes simultaneously acquiring a post-dispensing surface image of each dispensing point.

[0022] Based on the global height reference parameters locked in this die bonding and dispensing operation, acquisition trigger signals are generated that match the dispensing action timing of the dispensing operation execution unit one by one.

[0023] The acquisition trigger signal is synchronously sent to the image acquisition unit, which controls the image acquisition unit to simultaneously acquire the surface image of the dispensing point after dispensing at the same moment that the dispensing operation execution unit completes the dispensing operation of a single dispensing point and lifts the needle away from the glue surface.

[0024] For each surface image acquired synchronously after dispensing, a unique identifier matching the planar coordinates of the corresponding dispensing point is added to ensure that the image is bound to the corresponding dispensing point.

[0025] Optionally, the step of extracting the adhesive layer contour information for each dispensing point includes:

[0026] The collected surface images with unique identifiers after dispensing are preprocessed to eliminate image noise and illumination interference. Based on the physical coordinate system corresponding to the global height reference parameters of this die bonding and dispensing operation, the matching and calibration of image coordinates and physical coordinates are completed.

[0027] In the calibrated image, the closed contour of the adhesive layer boundary, the coordinates of the center position of the adhesive layer, and the horizontal and vertical spreading dimensions of the adhesive layer at the corresponding dispensing point are extracted and integrated into the adhesive layer contour information of the dispensing point.

[0028] Optionally, the step of comparing the adhesive layer contour information with the standard adhesive layer features corresponding to the global height reference parameters to obtain the comparison value of each dispensing point includes:

[0029] Retrieve the standard adhesive layer features corresponding to the global height reference parameters locked in this die bonding and dispensing operation. The standard adhesive layer features include the standard adhesive layer outline, standard spread size, and standard center position tolerance range that match the global height reference parameters.

[0030] The adhesive layer contour information of a single dispensing point is compared with the corresponding standard adhesive layer features one by one to obtain three core values: adhesive layer contour overlap, spreading size deviation, and center position offset.

[0031] The overlap of the adhesive layer contour, the deviation of the spreading size, and the offset of the center position are weighted and integrated to generate a unique comparison value for each dispensing point. The binding relationship between the comparison value and the unique identifier of the corresponding dispensing point is established, and the comparison values ​​of all dispensing points are obtained.

[0032] Secondly, this application provides a height adaptive compensation control system for die bonding and dispensing, which adopts the following technical solution:

[0033] A height adaptive compensation control system for die bonding dispensing includes:

[0034] The global height reference generation module acquires the reference surface image of the substrate to be processed on the die bonding platform, extracts the planar coordinate information of all dispensing points on the substrate to be processed, and combines it with the vertical displacement calibration data of the dispensing needle to generate a global height reference parameter covering all dispensing points. The global height reference parameter is used as the only height reference value for the entire die bonding and dispensing process.

[0035] The dispensing operation parameter generation module generates the vertical displacement value of the dispensing needle for each dispensing point based on the global height reference parameter and the chip specification parameter corresponding to each dispensing point. It also generates the travel path value of the dispensing operation and sends it to the dispensing operation execution unit.

[0036] The real-time adhesive layer detection and comparison module simultaneously acquires surface images of each adhesive layer after dispensing while the dispensing operation execution unit completes the dispensing operation at each dispensing point along the travel path, extracts the adhesive layer contour information of each dispensing point, compares the adhesive layer contour information with the standard adhesive layer features corresponding to the global height reference parameters, and obtains the comparison value of each dispensing point.

[0037] The closed-loop control execution module immediately pauses the current dispensing operation when the comparison value of any dispensing point exceeds the preset threshold. After adjusting the vertical displacement value of the dispensing needle, the operation continues. When the comparison values ​​of all dispensing points meet the preset threshold, the operation is completed and a completion command is output.

[0038] Thirdly, this application provides an electronic device that adopts the following technical solution:

[0039] An electronic device includes a processor running a program of the height adaptive compensation control method for die bonding dispensing as described in any one of the preceding claims.

[0040] Fourthly, this application provides a storage medium, which adopts the following technical solution:

[0041] A storage medium storing a program for the height adaptive compensation control method for die bonding dispensing as described in any one of the above.

[0042] In summary, this application includes at least one of the following beneficial technical effects:

[0043] By generating a global height reference parameter through a single data acquisition and locking it as the unique height reference for the entire process, and combining the vertical displacement calibration data of the dispensing needle with the flatness data of the substrate, a unified and accurate height control reference is established for all dispensing points on the entire board. This eliminates the reference deviation and cumulative error caused by independent calibration of multiple points from the source. At the same time, based on this global reference, the vertical displacement value and travel path of the needle at each dispensing point are uniformly generated to ensure that the dispensing action of the entire board is executed in a consistent, synchronous and uniform manner, which significantly improves the stability and uniformity of the dispensing height control of the entire board.

[0044] During the dispensing process, images of the adhesive layer are synchronously acquired at each point and compared in real time. Based on the standard adhesive layer features corresponding to the global height benchmark, quantitative detection of the contour, size, and position is completed. Once a deviation occurs, the process is immediately paused and the vertical displacement of the needle is adaptively adjusted to achieve online closed-loop compensation during the dispensing process and quickly correct adhesive layer abnormalities. There is no lag detection and no batch accumulation of defects throughout the process, ensuring that every dispensing point meets the process requirements, significantly reducing the overall scrap rate of the board, and steadily improving the overall yield of die bonding and dispensing operations from the overall manufacturing process. Attached Figure Description

[0045] Figure 1 This is a flowchart illustrating a height adaptive compensation control method for die bonding dispensing according to an exemplary embodiment.

[0046] Figure 2 This is a structural block diagram of a height adaptive compensation control method apparatus for die bonding dispensing, according to an exemplary embodiment. Detailed Implementation

[0047] The embodiments of this application are described in detail below, and examples of the embodiments are shown in the accompanying drawings.

[0048] In the description of this specification, the references to "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0049] This application discloses a height adaptive compensation control method for die bonding dispensing, referring to Figure 1, including:

[0050] S100: Acquire the reference surface image of the substrate to be processed on the die bonding platform, extract the planar coordinate information of all dispensing points on the substrate to be processed, and combine it with the vertical displacement calibration data of the dispensing needle to generate a global height reference parameter covering all dispensing points. The global height reference parameter is used as the only height reference value for the entire die bonding and dispensing process.

[0051] Among them, reference Figure 1 In this embodiment of the invention, the specific execution process of S100 is as follows:

[0052] S101, perform the reference surface image acquisition operation of the substrate to be processed. After the substrate to be processed is transferred to the die bonding platform and vacuum adsorption clamping and fixing is completed, the global image acquisition unit above the platform is activated to complete the image acquisition of the entire reference surface area of ​​the substrate to be processed, and obtain the reference surface acquisition image of the substrate to be processed. Ensure that the acquired image completely covers all areas on the substrate to be glued, with no blind spots or distortion obstruction.

[0053] S102, preprocessing operation is performed on the acquired reference surface image of the substrate to be processed. Specifically, distortion correction and grayscale normalization are performed on the acquired reference surface image to eliminate image deviation caused by lens distortion and uneven lighting during image acquisition, and improve image clarity and feature recognition.

[0054] S103 After completing image preprocessing, extract the pixel coordinates of the preset positioning markers on the substrate surface and perform a conversion and calibration operation between the pixel coordinates and the physical coordinates of the die bonding platform. Based on the converted and calibrated physical coordinate system, identify the distribution position of all dispensing points on the substrate to be processed, extract the planar coordinate information corresponding to each dispensing point, and complete the coordinate sorting and duplicate point rejection verification of all dispensing points to ensure that the coordinates of the dispensing points are not repeated or omitted.

[0055] S104, acquire vertical displacement calibration data of the dispensing needle within the full stroke range of the die bonding platform. The vertical displacement calibration data includes the correspondence between the vertical movement of the dispensing needle in different planar coordinates and the actual needle drop height. Match and bind the extracted planar coordinate information of each dispensing point with the vertical displacement calibration data one by one to establish a unique mapping relationship between the planar coordinates and vertical displacement of each dispensing point.

[0056] S105 generates a global height reference parameter covering all dispensing points based on the unique mapping relationship between the planar coordinates and vertical displacement of each dispensing point, combined with the flatness data of the reference surface of the substrate to be processed. The generated global height reference parameter is then verified for accuracy at all points. After the verification is passed, the global height reference parameter is written into the storage unit of this die bonding and dispensing operation and locked as the only callable height reference value in the entire process of this die bonding and dispensing operation. No other height reference values ​​are generated during this operation.

[0057] By acquiring images of the entire board's reference surface, the planar coordinates of all dispensing points are extracted in a unified manner. Combined with the vertical displacement calibration data of the dispensing needle's full stroke, a global height reference parameter covering all dispensing points is generated and locked as the unique height reference value for the entire process. This solves the problem of inconsistent references caused by independent height calibration of multiple points and avoids the generation of cumulative height errors during the dispensing process. At the same time, by establishing a dedicated mapping relationship for all points and verifying the accuracy of all points, the accuracy and uniqueness of the global height reference parameter are ensured, providing a stable and unified height reference for the entire dispensing process. This significantly improves the height control accuracy and the consistency of adhesive layer quality across all points in the die bonding dispensing operation.

[0058] S200, based on global height reference parameters and combined with chip specification parameters corresponding to each dispensing point, generates vertical displacement values ​​of the dispensing needle for each dispensing point, and simultaneously generates travel path values ​​for the dispensing operation, which are then sent to the dispensing operation execution unit.

[0059] In this embodiment of the invention, the specific execution process of S200 is as follows:

[0060] S201 After completing the generation and locking of the global height reference parameter, start the dispensing processing parameter generation operation. Confirm that the unique height reference value within this die bonding and dispensing operation cycle is the global height reference parameter generated in step S100. The generation of all dispensing processing parameters is based on this global height reference parameter to ensure the consistency of the parameter generation reference.

[0061] S202, based on the global height reference parameters locked in this die bonding and dispensing operation, extract the chip specification parameters corresponding to each dispensing point. The chip specification parameters include chip size, preset thickness of die bonding adhesive layer, and adhesive quantity requirements. Combined with the exclusive mapping relationship between the planar coordinates and vertical displacement of each dispensing point, generate the vertical displacement value of the dispensing needle corresponding to each dispensing point point by point, ensuring that the vertical displacement value of each point is generated based on the same global height reference without reference deviation.

[0062] S203, based on the planar coordinate information and sorting results of all dispensing points, combined with the motion stroke limit of the die bonding platform and the movement acceleration parameters of the dispensing needle, plans and generates the optimal travel path value for the dispensing operation, ensuring that the travel path covers all dispensing points, and that the total path stroke is the shortest and there is no invalid back-and-forth movement.

[0063] S204 synchronously sends the vertical displacement values ​​of the dispensing needles and the travel path values ​​of the dispensing operation for all generated dispensing points to the dispensing operation execution unit at the same time, and controls the dispensing operation execution unit to start the dispensing operation based on the same global height reference parameter, so as to ensure the reference uniformity and execution continuity of the dispensing action.

[0064] By synchronously generating and distributing the vertical displacement values ​​of the dispensing needles and the dispensing path values ​​for all dispensing points using global height reference parameters, the system achieves the same-source generation and synchronous execution of processing parameters for all dispensing points. This replaces the serial mode of generating parameters point by point and executing them step by step in the existing technology. This ensures the reference uniformity of processing parameters for all dispensing points, further improving the control accuracy of dispensing height, and significantly shortens the dispensing operation cycle of a single substrate, thereby improving the mass production efficiency of the die bonding and dispensing process. At the same time, since all processing parameters are generated based on the same global height reference, it avoids height control deviations caused by multiple reference parameters, ensuring the consistency and accuracy of dispensing operations across the entire board.

[0065] S300, during the dispensing operation of each dispensing point along the travel path of the dispensing operation execution unit, simultaneously acquires the surface image of each dispensing point after dispensing, extracts the adhesive layer contour information of each dispensing point, compares the adhesive layer contour information with the standard adhesive layer features corresponding to the global height reference parameters, and obtains the comparison value of each dispensing point.

[0066] In this embodiment of the invention, the specific execution process of S300 is as follows:

[0067] S301: While the dispensing operation execution unit is performing the dispensing action, a synchronous visual detection operation is initiated. Based on the global height reference parameters locked in this die bonding and dispensing operation, a collection trigger signal is generated that matches the dispensing action timing of the dispensing operation execution unit one by one, ensuring that the triggering timing is completely consistent with the completion time of the dispensing action at the corresponding dispensing point.

[0068] S302, the generated acquisition trigger signal is synchronously sent to the image acquisition unit, controlling the image acquisition unit to synchronously acquire the surface image of the dispensing point at the same moment that the dispensing operation execution unit completes the dispensing operation of a single dispensing point and lifts the needle away from the glue surface; for each synchronously acquired surface image after dispensing, a unique identifier matching the corresponding dispensing point's planar coordinate information is added to ensure that the image is bound to the corresponding dispensing point one by one, without data mismatch.

[0069] S303 preprocesses the acquired surface image with a unique identifier after dispensing to eliminate image noise and lighting interference. Based on the physical coordinate system corresponding to the global height reference parameters of this die bonding and dispensing operation, it completes the matching calibration of image coordinates and physical coordinates to ensure the accurate correspondence between image features and the physical coordinates of dispensing points.

[0070] S304. In the calibrated image, extract the closed contour of the adhesive layer boundary, the coordinates of the center position of the adhesive layer, and the horizontal and vertical spreading dimensions of the adhesive layer at the corresponding dispensing point, and integrate them into the adhesive layer contour information of the dispensing point.

[0071] S305, retrieve the standard adhesive layer features corresponding to the global height reference parameters locked in this die bonding and dispensing operation. The standard adhesive layer features include the standard adhesive layer outline, standard spread size, and standard center position tolerance range that match the global height reference parameters. Compare the adhesive layer outline information of a single dispensing point with the corresponding standard adhesive layer features item by item to obtain the three core values ​​of adhesive layer outline overlap, spread size deviation, and center position offset.

[0072] S306, the overlap of the adhesive layer contour, the deviation of the spreading size, and the offset of the center position are weighted and integrated to generate a unique comparison value for the dispensing point, and a binding relationship is established between the comparison value and the unique identifier of the corresponding dispensing point, thus completing the acquisition of comparison values ​​for all dispensing points.

[0073] By acquiring trigger signals based on global height reference parameters, the dispensing action of a single dispensing point is completed synchronously with image acquisition. This replaces the existing technology's mode of unified detection or independent triggering of time-division detection after the entire dispensing process is completed, ensuring the synchronization of the detection stage and the dispensing process in terms of timing. At the same time, by extracting adhesive layer features based on the same global height reference parameter and performing item-by-item comparison and weighted calculation, it is ensured that the comparison value of each dispensing point is generated based on the same reference. In addition, the single-point synchronous detection mode realizes real-time quality control throughout the entire dispensing process, enabling the acquisition of the dispensing quality status of each point in real time during the operation.

[0074] S400: When the comparison value of any dispensing point exceeds the preset threshold, the current dispensing operation is immediately paused, the vertical displacement value of the dispensing needle is adjusted, and the operation continues. When the comparison value of all dispensing points meets the preset threshold, the operation is completed and the operation completion command is output.

[0075] In this embodiment of the invention, the specific execution process of S400 is as follows:

[0076] S401, obtain the comparison value of each dispensing point output in step S300, retrieve the preset dispensing quality deviation threshold, compare the comparison value of each dispensing point with the preset threshold one by one to determine the compliance of the dispensing quality of the corresponding dispensing point.

[0077] S402, when the comparison value of any dispensing point exceeds the preset threshold, immediately send a work pause command to the dispensing operation execution unit to immediately stop the subsequent movement and dispensing action of the current dispensing operation, so as to avoid the continuous increase of defective dispensing points; at the same time, based on the comparison value that exceeds the threshold, combined with the chip specification parameters and global height reference parameters corresponding to the dispensing point, calculate the compensation adjustment value of the vertical displacement of the dispensing needle, and complete the adaptive adjustment of the vertical displacement value of the dispensing needle.

[0078] S403: After adjusting the vertical displacement value of the dispensing needle, a work continuation command is sent to the dispensing operation execution unit to control the dispensing operation execution unit to continue the subsequent dispensing operation from the current pause point. At the same time, the synchronous image acquisition, feature extraction and comparison operation of step S300 is repeated for the adjusted dispensing point to confirm that the adjusted comparison value meets the preset threshold.

[0079] S404. When the comparison values ​​of all dispensing points meet the preset threshold, it is confirmed that the dispensing quality of all points in the entire die bonding dispensing process is compliant. Based on the global height reference parameters locked in this die bonding dispensing operation, the final compliance review of the adhesive layer characteristics of the substrate that has completed the full board dispensing operation is carried out to ensure that all dispensing points of the substrate meet the die bonding process requirements and that no inspection items are missed.

[0080] S405 After the final compliance review of all points is passed, the operation completion instruction for this die bonding and dispensing operation is generated and output. The die bonding operation platform is controlled to transfer the substrate with completed dispensing to the next process station. At the same time, the global height reference parameters locked in the storage unit of this die bonding and dispensing operation are cleared, completing the closed-loop operation of the entire process cycle and preparing for the die bonding and dispensing operation of the next substrate to be processed.

[0081] By comparing the results of synchronous detection at a single point, real-time height adaptive compensation is achieved during the dispensing process. When a dispensing quality deviation occurs at any point, the operation can be paused immediately and the vertical displacement can be adaptively adjusted. This enables rapid response and closed-loop compensation for dispensing height anomalies, avoiding the problem of scrapping the entire board due to defects only after the entire board has been dispensed. This significantly reduces raw material waste and production costs in the packaging process.

[0082] Meanwhile, by conducting compliance verification based on the same global height reference parameter throughout the entire process, the accuracy of dispensing quality inspection is ensured, which can significantly improve the yield of die bonding and dispensing products. In addition, by clearing the global height reference parameter after the operation cycle, the reference parameters of each operation cycle are ensured to be independent of each other and free from data crosstalk, thus guaranteeing the uniqueness and accuracy of the dispensing height reference of each substrate during mass production.

[0083] Based on the solutions in the embodiments of this application, and combined with the mass production scenario of high-density IC packaging die bonding and dispensing, the die bonding and dispensing process of IC packaging is the core process to achieve reliable bonding between the chip and the substrate. As IC chips develop towards miniaturization and high-density integration, the chip size is reduced to the millimeter level or even the sub-millimeter level. The thickness control tolerance of the adhesive layer in die bonding and dispensing has reached the ±5 micrometer level, which places extremely stringent requirements on the height control accuracy of the dispensing needle and the consistency of the adhesive layer quality across the entire board.

[0084] Traditional die bonding and dispensing solutions generally employ needle vertical displacement calibration before the equipment leaves the factory, combined with a few reference points height calibration before processing a single substrate, to set uniform height control parameters for all dispensing points on the board. However, there is no real-time detection or compensation process during the operation. Some solutions use a point-by-point height calibration mode, which can adapt to substrate flatness deviations to some extent, but it significantly extends the operation cycle. Furthermore, the adhesive layer quality deviation caused by needle wear and adhesive volume fluctuations during the operation cannot be corrected in real time, which easily leads to defects such as uneven adhesive layer thickness, adhesive overflow, and chip adhesion. It is difficult to balance product yield and mass production efficiency, and it cannot meet the mass production requirements of high-density, high-precision IC packaging.

[0085] After using the solution in this embodiment of the invention, step S100 is executed first. After the substrate to be processed is transferred to the die bonding platform and vacuum adsorption is completed, the global image acquisition unit completes the image acquisition of the entire reference surface of the substrate. After image preprocessing, coordinate transformation calibration, and extraction of the planar coordinates of all dispensing points, combined with the vertical displacement calibration data of the dispensing needle throughout its stroke, a unique mapping relationship between the planar coordinates and vertical displacement of each dispensing point is established. A global height reference parameter covering all dispensing points is generated and locked as the unique height reference value for the entire process of this operation. There is no need to perform height calibration point by point, which significantly shortens the reference calibration time before the operation and ensures the uniformity of the height reference of all points on the board.

[0086] After step S100 is completed, step S200 is automatically initiated. Based on the generated and locked global height reference parameters, combined with the chip specification parameters corresponding to each dispensing point, the vertical displacement value of the dispensing needle is generated point by point. At the same time, the optimal travel path value covering all points is planned and generated. Both types of parameters are simultaneously sent to the dispensing operation execution unit, which controls the dispensing operation execution unit to start a continuous dispensing operation based on a unified reference. This replaces the traditional solution of generating parameters point by point and executing step by step, which greatly reduces the dispensing operation time of a single substrate. Moreover, all dispensing actions are executed based on the same global height reference, eliminating the cumulative height error caused by independent calibration of multiple points from the root.

[0087] While the dispensing unit performs the dispensing operation along the travel path, step S300 is automatically executed. Based on the global height reference parameters, an acquisition trigger signal matching the timing of the dispensing action is generated. At the same moment that dispensing at a single point is completed and the needle is lifted from the adhesive surface, the surface image of that point after dispensing is synchronously acquired. After image preprocessing and extraction of adhesive layer contour information, the image is compared and weighted with the standard adhesive layer features corresponding to the global height reference parameters, and the comparison value of that point is obtained in real time. The entire detection process is carried out synchronously with the dispensing operation without the need for additional detection cycles. Moreover, all detection calculations are completed based on the same global height reference, which significantly improves the recognition accuracy of dispensing quality deviations and the reliability of detection results.

[0088] Finally, step S400 is executed, which performs compliance judgment based on the real-time acquired comparison values. When the comparison value of any point exceeds the preset threshold, the current dispensing operation is immediately paused. Based on the deviation value, adaptive compensation adjustment of the vertical displacement of the dispensing needle is performed. After the adjustment is completed, the subsequent dispensing operation continues, realizing real-time closed-loop compensation in the dispensing process and avoiding the batch generation of defective points. When the comparison values ​​of all points meet the preset threshold, the final full-point compliance review is completed, and the operation completion instruction is generated and output. The substrate is transferred to the next process, and the global height reference parameter of this operation is cleared, completing the full-process closed-loop operation of this operation cycle.

[0089] This solution significantly improves the height control accuracy of die bonding and dispensing without extending the dispensing cycle of a single substrate, achieving consistent quality control of the adhesive layer at all dispensing points on the board. Simultaneously, through real-time synchronous detection and height adaptive compensation during the process, it effectively solves dispensing defects caused by needle wear, adhesive volume fluctuations, and substrate flatness deviations, resulting in a substantial improvement and stable guarantee of product yield. Furthermore, it enables rapid response and closed-loop handling of dispensing anomalies, significantly reducing the loss of valuable raw materials such as substrates and chips during production. It perfectly solves the technical problems of low dispensing accuracy, poor adhesive layer consistency, and the difficulty in balancing mass production efficiency and yield caused by inconsistent height control benchmarks and lack of real-time compensation in traditional die bonding and dispensing solutions, fully meeting the mass production requirements of high-density, high-precision IC packaging die bonding and dispensing.

[0090] In this embodiment of the application, the method further includes the following steps in generating global height reference parameters covering all dispensing points:

[0091] First, after distortion correction and grayscale normalization preprocessing are performed on the acquired reference surface image of the substrate to be processed, image deviations caused by lens distortion and uneven illumination are eliminated. The pixel coordinates of at least two sets of diagonally distributed positioning markers on the substrate surface are extracted. Based on the coordinates of multiple sets of markers, the conversion and calibration between pixel coordinates and physical coordinates of the die bonding platform are completed to ensure the accuracy and reliability of coordinate conversion.

[0092] In addition, based on the transformed and calibrated physical coordinate system, the distribution position of all dispensing points on the substrate to be processed is identified, the planar coordinate information of each dispensing point is extracted, the coordinate sorting of all dispensing points and the duplicate point rejection verification are completed, and the coordinate recognition accuracy of each dispensing point is verified one by one. When the verification deviation exceeds the preset coordinate tolerance threshold, the coordinate recognition and extraction operation of that point is re-executed. After the verification is passed, the integration of the coordinate information of all points is completed.

[0093] Furthermore, vertical displacement calibration data of the dispensing needle within the entire stroke range of the die bonding platform is obtained. The planar coordinate information of all points is matched and bound one by one with the vertical displacement calibration data to establish a unique mapping relationship between the planar coordinates and vertical displacement of each dispensing point. The accuracy of the mapping relationship of each point is verified one by one to ensure the accuracy of the mapping relationship.

[0094] Finally, based on the unique mapping relationship of each point and combined with the flatness data of the reference surface of the substrate to be processed, a global height reference parameter covering all dispensing points is generated. The generated global height reference parameter is verified for accuracy at all points. After the verification is passed, it is written to the storage unit of this operation and locked as the unique height reference value that can be called throughout the entire operation. At the same time, a reference uniqueness verification is performed to confirm that no other height reference value is involved in the entire operation.

[0095] By using high-precision coordinate calibration of multiple marker points, full-point coordinate identification and verification, establishment of exclusive mapping relationships, and full-point accuracy closed-loop verification, the generation accuracy and uniqueness of global height reference parameters are further improved, providing stable and reliable reference support for the whole process of dispensing height control and detection, and fundamentally avoiding the cumulative error problem caused by multi-reference height control.

[0096] In this embodiment of the application, the method further includes, during the process of synchronously acquiring surface images of each dispensing point after dispensing:

[0097] Based on the global height reference parameters locked in this die bonding and dispensing operation, a unique acquisition trigger clock signal is generated. The trigger timing of this clock signal is calibrated to match the dispensing action timing of the dispensing operation execution unit one by one, ensuring that the triggering time is completely consistent with the completion of the dispensing operation at the corresponding dispensing point and the moment when the needle is lifted off the glue surface.

[0098] The generated acquisition trigger clock signal is synchronously sent to the image acquisition unit, establishing a one-to-one trigger association between the clock signal and the image acquisition unit. This ensures that the signal is sent to the image acquisition unit without delay or discrepancy. At the same time, the signal sending status is monitored in real time to ensure the synchronization between signal sending and dispensing action.

[0099] Furthermore, by acquiring a trigger clock signal, the image acquisition unit is controlled to simultaneously perform the post-dispensing surface image acquisition operation at the same moment that the dispensing operation execution unit completes the dispensing operation at a single dispensing point and lifts the needle away from the glue surface. The timing of the image acquisition unit's actions is monitored in real time to ensure that there is no timing difference between the completion of the image acquisition action and the dispensing action.

[0100] Finally, for each surface image acquired synchronously after dispensing, a unique identifier matching the corresponding dispensing point's planar coordinate information is added, along with a unique timestamp corresponding to the acquisition trigger clock signal. This ensures that the image, dispensing point, and acquisition timing are bound one-to-one. The integrity and binding relationship of the acquired images are verified, and invalid images without unique identifiers or with mismatched timestamps are removed.

[0101] By using a unique synchronous trigger clock signal that precisely matches the timing of the dispensing action, the completion of the dispensing action and image acquisition are accurately synchronized, completely eliminating the timing difference in image acquisition and avoiding detection deviations caused by asynchronous processing and acquisition. At the same time, the dual binding of a unique identifier and a timestamp ensures the precise matching of the image for inspection with the corresponding dispensing point, avoiding misjudgments and missed judgments caused by data crosstalk in mass production, and further improving the reliability and accuracy of synchronous inspection.

[0102] In this embodiment of the application, the method further includes the following steps in the process of extracting the adhesive layer contour information of each dispensing point and generating comparison values:

[0103] The collected surface images after dispensing, which are marked with unique identifiers and timestamps, are preprocessed, including Gaussian filtering to eliminate image noise, grayscale equalization to eliminate illumination interference, and edge enhancement processing to improve the recognition of adhesive layer boundaries.

[0104] Based on the physical coordinate system corresponding to the global height reference parameters of this die bonding and dispensing operation, the matching and calibration of the image coordinates and physical coordinates of the preprocessed image are completed to ensure that the pixel coordinates in the image correspond one-to-one with the physical coordinates of the die bonding platform, thus eliminating the viewing angle deviation during the image acquisition process.

[0105] In the calibrated image, the closed contour of the adhesive layer boundary at the corresponding dispensing point is extracted using a sub-pixel edge detection algorithm. Based on the closed contour, the coordinates of the center position of the adhesive layer and the horizontal and vertical spreading dimensions of the adhesive layer are obtained. The adhesive layer contour information at the dispensing point is then integrated to generate the adhesive layer contour information. The integrity of the extracted adhesive layer contour information is verified to ensure that the contour is unbroken and the features are complete.

[0106] The standard adhesive layer features corresponding to the global height reference parameters locked in this operation are retrieved. The extracted adhesive layer contour information is compared with the standard adhesive layer features item by item to obtain three core values: adhesive layer contour overlap, spreading size deviation, and center position offset. Based on the preset weight coefficient, the three core values ​​are weighted and integrated to generate a unique comparison value for the adhesive point.

[0107] Finally, a unique identifier and timestamp are established between the comparison values ​​and the corresponding dispensing points. After the binding relationship is verified, the comparison values ​​are output to the process control unit in real time to ensure that the comparison values ​​and the corresponding dispensing points are accurately matched and there is no data mismatch problem.

[0108] By employing high-precision image preprocessing, sub-pixel-level adhesive layer contour extraction, and item-by-item comparison and weighted integration based on the same global benchmark, the precise quantification of dispensing quality deviations was achieved, significantly improving the accuracy and reliability of the comparison values.

[0109] In this embodiment of the application, the method further includes the following steps in adjusting the vertical displacement value of the dispensing needle based on the comparison value:

[0110] When the comparison value of any dispensing point exceeds the preset threshold, a work pause command is immediately issued to the dispensing operation execution unit to simultaneously stop the platform movement and needle dispensing action of the dispensing operation execution unit, and the work pause status is confirmed in real time to ensure that no subsequent dispensing action will continue to be executed.

[0111] Based on the comparison values ​​exceeding the threshold, the deviation of three core values—adhesive layer contour overlap, spreading size deviation, and center position offset—is obtained through reverse analysis. Combined with the global height reference parameters, chip specification parameters, and dispensing process parameters corresponding to the dispensing point, a correspondence between the deviation and the height compensation amount is established, and the precise compensation adjustment value for the vertical displacement of the dispensing needle is calculated.

[0112] Based on the calculated compensation adjustment values, the vertical displacement value of the dispensing needle is adaptively adjusted. The accuracy of the adjusted vertical displacement value is verified to ensure that the adjusted value meets the reference requirements of the global height reference parameter. After the verification is passed, the operation continuation instruction is issued to the dispensing operation execution unit.

[0113] After resuming operations, for the first point where dispensing has been adjusted, the synchronous image acquisition, feature extraction, and comparison operation are repeated to confirm that the adjusted comparison value meets the preset threshold. If it still exceeds the threshold, the deviation disassembly and compensation adjustment operation is repeated until the comparison value meets the requirements, forming a highly compensated closed-loop verification.

[0114] At the same time, all relevant data for this height compensation adjustment will be fully stored and recorded, including information on abnormal locations, values ​​of individual deviations, compensation adjustment values, comparison results after adjustment, and the time of occurrence of the abnormality, forming a complete abnormal compensation event archive.

[0115] By accurately calculating the compensation amount based on the component deviation and performing closed-loop verification after adjustment, precise adaptive compensation for the vertical displacement of the dispensing needle is achieved, ensuring the effectiveness of the compensation adjustment and avoiding secondary defects caused by over-compensation or under-compensation. At the same time, the complete recording of abnormal data throughout the entire process provides reliable data support for process optimization, improving the practicality and mass production adaptability of the solution.

[0116] In this embodiment of the application, the method further includes the following steps during the process of completing the die bonding and dispensing operation and outputting the operation completion instruction:

[0117] When the comparison values ​​of all dispensing points meet the preset threshold, based on the global height reference parameters locked in this die bonding and dispensing operation, a final compliance check of the adhesive layer characteristics of the substrate with full dispensing points is performed, covering all dispensing points on the substrate to ensure that no inspection items are missed and to ensure that the dispensing quality of the entire board meets the requirements of the die bonding process.

[0118] After the final compliance review of all points is passed, the operation completion instruction for this die bonding and dispensing operation is generated and output. The die bonding operation platform is controlled to transfer the substrate with completed dispensing to the next die bonding process station. At the same time, the global height reference parameters locked in the storage unit of this die bonding and dispensing operation are cleared to ensure that the reference parameters of each operation cycle are independent of each other and there is no cross-cycle data crosstalk.

[0119] While generating the job completion instruction, the entire process data, including global height reference parameters, vertical displacement values ​​of all points, travel path values, comparison values ​​of all points, compensation and adjustment records, and verification data, are stored together to form a traceability archive of the entire die bonding and dispensing operation for a single substrate, ensuring that the archive data is complete and traceable.

[0120] Finally, after completing the substrate transfer operation, the operation traceability file is uploaded to the production management system to achieve traceability management of the entire product processing process, meet the production control and compliance requirements of the semiconductor packaging industry, and at the same time perform a full equipment reset operation to prepare for the die bonding and dispensing operation of the next substrate to be processed.

[0121] By conducting final full feature verification of finished products, clearing the work cycle benchmark closed loop, and managing full-process traceability files, we not only ensure the quality of finished product shipments but also avoid data crosstalk in mass production. At the same time, we meet the production control and compliance requirements of the semiconductor packaging industry and improve the mass production adaptability of the solution.

[0122] This application discloses a height adaptive compensation control method for die bonding dispensing, referring to... Figure 2 ,include:

[0123] The global height reference generation module 001 acquires the reference surface image of the substrate to be processed on the die bonding platform, extracts the planar coordinate information of all dispensing points on the substrate to be processed, and combines it with the vertical displacement calibration data of the dispensing needle to generate a global height reference parameter covering all dispensing points. The global height reference parameter is used as the only height reference value for the entire die bonding and dispensing process.

[0124] The dispensing operation parameter generation module 002 generates the vertical displacement value of the dispensing needle corresponding to each dispensing point based on the global height reference parameter and the chip specification parameter corresponding to each dispensing point. It also generates the travel path value of the dispensing operation and sends it to the dispensing operation execution unit.

[0125] The real-time adhesive layer detection and comparison module 003, during the dispensing operation of the dispensing operation execution unit along the travel path to complete the dispensing operation of each dispensing point, synchronously collects the surface image of each dispensing point after dispensing, extracts the adhesive layer contour information of each dispensing point, compares the adhesive layer contour information with the standard adhesive layer features corresponding to the global height reference parameters, and obtains the comparison value of each dispensing point.

[0126] The closed-loop control execution module 004 immediately pauses the current dispensing operation when the comparison value of any dispensing point exceeds the preset threshold. After adjusting the vertical displacement value of the dispensing needle, the operation continues. When the comparison values ​​of all dispensing points meet the preset threshold, the operation is completed and a completion command is output.

[0127] This application also discloses an electronic device, including a processor, wherein the processor runs a program of the height adaptive compensation control method for die bonding and dispensing as described in any one of the above embodiments.

[0128] This application also discloses a storage medium storing a program for the height adaptive compensation control method for die bonding and dispensing as described in any one of the above embodiments.

[0129] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A height adaptive compensation control method for die bonding dispensing, characterized in that, include: Acquire the reference surface image of the substrate to be processed on the die bonding platform, extract the planar coordinate information of all dispensing points on the substrate to be processed, and combine it with the vertical displacement calibration data of the dispensing needle to generate a global height reference parameter covering all dispensing points. The global height reference parameter is used as the only height reference value for the entire die bonding and dispensing process. Based on the global height reference parameters and combined with the chip specification parameters corresponding to each dispensing point, the vertical displacement value of the dispensing needle corresponding to each dispensing point is generated, and the travel path value of the dispensing operation is generated simultaneously and sent to the dispensing operation execution unit. During the dispensing operation of the dispensing unit along the travel path to complete the dispensing operation at each dispensing point, the surface image after dispensing at each dispensing point is collected simultaneously, the adhesive layer contour information of each dispensing point is extracted, and the adhesive layer contour information is compared with the standard adhesive layer features corresponding to the global height reference parameters to obtain the comparison value of each dispensing point. When the comparison value of any dispensing point exceeds the preset threshold, the current dispensing operation is immediately paused. The vertical displacement value of the dispensing needle is adjusted and the operation continues. When the comparison value of all dispensing points meets the preset threshold, the operation is completed and the operation completion command is output.

2. The height adaptive compensation control method for die bonding dispensing according to claim 1, characterized in that, The steps of acquiring a reference surface image of the substrate to be processed on the die bonding platform and extracting the planar coordinate information of all dispensing points on the substrate to be processed include: The acquired reference surface image of the substrate to be processed is subjected to distortion correction and grayscale normalization to eliminate lens distortion and illumination deviation during the acquisition process. The pixel coordinates of the preset positioning mark points on the substrate surface are extracted to complete the conversion and calibration between pixel coordinates and physical coordinates of the die bonding platform. Based on the transformed and calibrated physical coordinate system, the distribution position of all dispensing points on the substrate to be processed is identified, the planar coordinate information corresponding to each dispensing point is extracted, and the coordinate sorting and duplicate point rejection verification of all dispensing points are completed.

3. The height adaptive compensation control method for die bonding dispensing according to claim 2, characterized in that, The steps involving the vertical displacement calibration data of the dispensing needle include: Obtain vertical displacement calibration data of the dispensing needle within the full stroke range of the die bonding platform. The vertical displacement calibration data includes the correspondence between the vertical movement of the dispensing needle in different planar coordinates and the actual needle drop height. The extracted planar coordinates of each dispensing point are matched and bound one-to-one with the vertical displacement calibration data to establish a unique mapping relationship between the planar coordinates and vertical displacement of each dispensing point.

4. The height adaptive compensation control method for die bonding and dispensing according to claim 3, characterized in that, The step of generating a global height reference parameter covering all dispensing points and using this global height reference parameter as the sole height reference value for the entire die bonding and dispensing operation includes: Based on the unique mapping relationship between the planar coordinates and vertical displacement of each dispensing point, and combined with the flatness data of the reference surface of the substrate to be processed, a global height reference parameter covering all dispensing points is generated. The generated global height reference parameters are verified for accuracy at all points. Once the verification is successful, the global height reference parameters are written into the storage unit of this die bonding and dispensing operation and locked as the only callable height reference value for the entire process of this die bonding and dispensing operation. No other height reference values ​​are generated during this operation.

5. The height adaptive compensation control method for die bonding dispensing according to claim 1, characterized in that, The method further includes simultaneously acquiring surface images of each dispensing point after dispensing during the dispensing operation execution unit's numerical completion of the dispensing operation along the travel path, wherein the dispensing operation execution unit performs the dispensing operation at each dispensing point. Based on the global height reference parameters locked in this die bonding and dispensing operation, acquisition trigger signals are generated that match the dispensing action timing of the dispensing operation execution unit one by one. The acquisition trigger signal is synchronously sent to the image acquisition unit, which controls the image acquisition unit to simultaneously acquire the surface image of the dispensing point after dispensing at the same moment that the dispensing operation execution unit completes the dispensing operation of a single dispensing point and lifts the needle away from the glue surface. For each surface image acquired synchronously after dispensing, a unique identifier matching the planar coordinates of the corresponding dispensing point is added to ensure that the image is bound to the corresponding dispensing point.

6. The height adaptive compensation control method for die bonding dispensing according to claim 5, characterized in that, The step of extracting the adhesive layer contour information for each dispensing point includes: The collected surface images with unique identifiers after dispensing are preprocessed to eliminate image noise and illumination interference. Based on the physical coordinate system corresponding to the global height reference parameters of this die bonding and dispensing operation, the matching and calibration of image coordinates and physical coordinates are completed. In the calibrated image, the closed contour of the adhesive layer boundary, the coordinates of the center position of the adhesive layer, and the horizontal and vertical spreading dimensions of the adhesive layer at the corresponding dispensing point are extracted and integrated into the adhesive layer contour information of the dispensing point.

7. The height adaptive compensation control method for die bonding dispensing according to claim 6, characterized in that, The step of comparing the adhesive layer contour information with the standard adhesive layer features corresponding to the global height reference parameters to obtain the comparison value of each dispensing point includes: Retrieve the standard adhesive layer features corresponding to the global height reference parameters locked in this die bonding and dispensing operation. The standard adhesive layer features include the standard adhesive layer outline, standard spread size, and standard center position tolerance range that match the global height reference parameters. The adhesive layer contour information of a single dispensing point is compared with the corresponding standard adhesive layer features one by one to obtain three core values: adhesive layer contour overlap, spreading size deviation, and center position offset. The overlap of the adhesive layer contour, the deviation of the spreading size, and the offset of the center position are weighted and integrated to generate a unique comparison value for each dispensing point. The binding relationship between the comparison value and the unique identifier of the corresponding dispensing point is established, and the comparison values ​​of all dispensing points are obtained.

8. A height adaptive compensation control system for die bonding dispensing, characterized in that, include: The global height reference generation module acquires the reference surface image of the substrate to be processed on the die bonding platform, extracts the planar coordinate information of all dispensing points on the substrate to be processed, and combines it with the vertical displacement calibration data of the dispensing needle to generate a global height reference parameter covering all dispensing points. The global height reference parameter is used as the only height reference value for the entire die bonding and dispensing process. The dispensing operation parameter generation module generates the vertical displacement value of the dispensing needle for each dispensing point based on the global height reference parameter and the chip specification parameter corresponding to each dispensing point. It also generates the travel path value of the dispensing operation and sends it to the dispensing operation execution unit. The real-time adhesive layer detection and comparison module simultaneously acquires surface images of each adhesive layer after dispensing while the dispensing operation execution unit completes the dispensing operation at each dispensing point along the travel path, extracts the adhesive layer contour information of each dispensing point, compares the adhesive layer contour information with the standard adhesive layer features corresponding to the global height reference parameters, and obtains the comparison value of each dispensing point. The closed-loop control execution module immediately pauses the current dispensing operation when the comparison value of any dispensing point exceeds the preset threshold. After adjusting the vertical displacement value of the dispensing needle, the operation continues. When the comparison values ​​of all dispensing points meet the preset threshold, the operation is completed and a completion command is output.

9. An electronic device, characterized in that, Includes a processor, wherein the processor runs a program of the height adaptive compensation control method for die bonding dispensing as described in any one of claims 1-7.

10. A storage medium, characterized in that, The program stores the height adaptive compensation control method for die bonding dispensing as described in any one of claims 1-7.

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