Thermal displacement compensation system, thermal displacement compensation method and cutting device

Abstract

The application discloses a thermal displacement compensation system, a thermal displacement compensation method and a cutting device, and belongs to the technical field of cutting devices. The thermal displacement compensation system comprises a rack, a fixing device, a first driving device, a sensor assembly and a control module. The fixing device is used for fixing a semiconductor silicon rod; the output end of the first driving device is connected with the fixing device, and the first driving device is used for driving the fixing device to move; the sensor assembly is arranged on the rack, and the sensor assembly is used for collecting temperature parameters of a measured environment; the control module is in communication connection with the first driving device and the sensor assembly respectively, and the control module can control the first driving device to drive the fixing device to move according to the temperature parameters, so that the fixing device drives the semiconductor silicon rod to move. The thermal displacement compensation system can drive the semiconductor silicon rod to perform position compensation, so as to reduce the thermal displacement deviation between the semiconductor silicon rod and a cutting part, thereby improving the size precision of a slice and the cutting quality.

Description

Technical Field

[0001] This application relates to the field of cutting equipment technology, and in particular to a thermal displacement compensation system, a thermal displacement compensation method, and a cutting equipment. Background Technology

[0002] In the semiconductor manufacturing industry, silicon single-crystal polished wafers are a core material for integrated circuits. The slicing process is a crucial step in the production of silicon single-crystal polished wafers, as it involves processing silicon single-crystal rods into thin wafers using cutting equipment. Wire cutting technology, with its advantages of high processing efficiency, low cutting loss, and ability to handle large-diameter silicon single-crystal cutting, has become the mainstream technology for silicon rod slicing. However, during wire cutting, multiple heat sources act simultaneously, and the heat accumulation causes thermal displacement mismatch, which alters the initial cutting position of the cutting wire relative to the silicon rod, leading to cutting deviations and consequently, wafer deformation, severely affecting the quality of the wafers. Summary of the Invention

[0003] This application provides a thermal displacement compensation system, a thermal displacement compensation method, and a cutting device, which can drive a semiconductor silicon rod to perform position compensation to reduce the thermal displacement deviation between the semiconductor silicon rod and the cutting part, thereby improving the dimensional accuracy and cutting quality of the slice.

[0004] To achieve the above objectives, according to a first aspect of this application, a thermal displacement compensation system is provided, comprising: frame; Fixing device, the fixing device being used to fix a semiconductor silicon rod; A first driving device, the output end of which is connected to the fixed device, is used to drive the fixed device to move. A sensor assembly, which is mounted on the frame, is used to collect temperature parameters of the measured environment; The control module is communicatively connected to the first driving device and the sensor assembly. The control module can control the first driving device to drive the fixed device to move according to the temperature parameter, so that the fixed device drives the semiconductor silicon rod to move.

[0005] Optionally, the fixing device includes a fixing part, a first guide part, and a second guide part. The fixing part is connected to the output end of the first driving device, and the semiconductor silicon rod is disposed on the fixing part. Both the first guide portion and the second guide portion extend along the direction of movement of the fixing device. The first guide portion is connected to the fixing portion, and the second guide portion is disposed on the frame. The first guide portion and the second guide portion are slidably connected.

[0006] Optionally, the frame includes a feed table for mounting the first drive device. The feed table is provided with an isolation section, which is located between the first drive device and the fixing device. The isolation section is provided with a through hole, through which the output end of the first drive device passes and connects to the fixing device.

[0007] Optionally, the sensor assembly includes multiple temperature sensors, which are respectively disposed at different locations on the rack.

[0008] Optionally, the frame includes a cutting bracket, and the plurality of temperature sensors include at least one first sensor, which is disposed on the cutting bracket and used to acquire the temperature of the cutting bracket; and / or, The plurality of temperature sensors include at least one second sensor disposed on the feed stage and used to acquire the temperature of the feed stage.

[0009] Optionally, the frame includes a first support forming a first cavity, and the thermal displacement compensation system further includes a temperature regulating device for regulating the temperature inside the first cavity; The plurality of temperature sensors include a third sensor, which is disposed within the first cavity and used to collect the temperature within the first cavity; and / or, The plurality of temperature sensors include a fourth sensor, which is positioned near the air outlet of the temperature regulating device and is used to collect the temperature at the air outlet of the temperature regulating device.

[0010] Optionally, the thermal displacement compensation system further includes a coolant supply device, the coolant supply device including a first outlet, through which the coolant flows to the semiconductor silicon rod; The plurality of temperature sensors include at least one fifth sensor and at least one sixth sensor. The fifth sensor is located near the first outlet and collects the temperature of the coolant at the first outlet. The sixth sensor is used to detect the temperature of the coolant after heat exchange with the semiconductor silicon rod.

[0011] Optionally, the control module is configured to: start timing when the temperature parameter is outside the preset value range; if the temperature parameter continues to exceed the preset value range within a first preset time period, the control module controls the first drive device to start. Timing begins when the temperature parameter is within a preset range. If the temperature parameter remains within the preset range for a second preset duration, the control module controls the first drive device to shut down.

[0012] Optionally, the control module includes: A data storage unit is used to store the temperature parameters output by the sensor assembly; The monitoring unit is used to monitor whether the temperature parameter is within a preset value range within the first preset time period or the second preset time period; A startup unit is used to start or stop the first drive device according to the monitoring results of the monitoring unit; The central control unit is used to calculate the movement distance of the fixed device.

[0013] According to a second aspect of this application, a thermal displacement compensation method is provided, applied to a thermal displacement compensation system as described in any one of the above claims, the thermal displacement compensation method comprising: The sensor assembly collects temperature parameters of the measured environment; The control module controls the first drive device to start based on the temperature parameter, so as to drive the fixed device to move.

[0014] Optionally, the step of the control module controlling the first driving device to start based on the temperature parameter to drive the fixed device to move includes: The control module detects the temperature parameter in real time and determines whether the temperature parameter is within the preset range. When the temperature parameter is outside the preset range, the control module controls the first drive device to start, so as to drive the fixed device to move.

[0015] Optionally, the step of the control module controlling the first driving device to start based on the temperature parameter to drive the fixed device to move includes: The control module detects the temperature parameter in real time and determines whether the temperature parameter is within the preset range. Timing begins when the temperature parameter is outside the preset value range. If the temperature parameter continues to exceed the preset value range within a first preset time period, the control module controls the first drive device to start. Timing begins when the temperature parameter is within a preset range. If the temperature parameter remains within the preset range for a second preset duration, the control module controls the first drive device to shut down.

[0016] According to a third aspect of this application, a cutting device is also provided, including a thermal displacement compensation system as described in any one of the above.

[0017] In the thermal displacement compensation system, thermal displacement compensation method, and cutting equipment of this application embodiment, the control module is communicatively connected to the first driving device and the sensor assembly respectively. The control module can control the first driving device to drive the fixing device to move according to the temperature parameters, so that the fixing device drives the semiconductor silicon rod to move, thereby reducing the thermal displacement deviation between the semiconductor silicon rod and the cutting part, thereby improving the dimensional accuracy and cutting quality of the slice.

[0018] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0021] Figure 1 This is a schematic diagram of a thermal displacement compensation system provided in an exemplary embodiment of this disclosure; Figure 2 This is a three-dimensional structural example diagram of the thermal displacement compensation system provided in the exemplary embodiments of this disclosure; Figure 3 This is a schematic diagram of another thermal displacement compensation system provided in an exemplary embodiment of this disclosure; Figure 4 This is an exploded structural diagram of the thermal displacement compensation system provided in an exemplary embodiment of this disclosure; Figure 5 This is a planar structural example diagram of the thermal displacement compensation system provided in an exemplary embodiment of this disclosure; Figure 6 This is a schematic diagram of the control module provided in an exemplary embodiment of this disclosure.

[0022] Explanation of reference numerals in the attached figures: 1. Frame; 11. Feeding table; 111. Isolation section; 112. Through hole; 12. Cutting bracket; 13. First bracket; 131. First cavity; 14. Second bracket; 141. Second cavity; 142. Second liquid outlet; 2. Fixing device; 21. Fixing part; 22. First guide part; 23. Second guide part; 3. First driving device; 31. Output end; 4. Sensor assembly; 41. First sensor; 42. Second sensor; 43. Third sensor; 44. Fourth sensor; 45. Fifth sensor; 46. Sixth sensor; 5. Control module; 51. Data storage unit; 52. Monitoring unit; 53. Start-up unit; 54. Central control unit; 6. Temperature regulation device; 61. Air outlet; 7. Coolant supply device; 71. First liquid outlet; 8. Cutting section; 200. Semiconductor silicon rod. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "up," "down," "left," and "right" generally refer to up, down, left, and right in the actual use or working state of the device, specifically the drawing directions in the accompanying drawings.

[0024] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] During in-line dicing, multiple heat sources act simultaneously. Due to the significant difference in thermal expansion coefficients between the frame and the silicon ingot, their thermal deformation cannot be synchronized. This heat accumulation leads to thermal displacement mismatch, altering the initial cutting position of the dicing line relative to the silicon ingot. This results in cutting deviations, causing dimensional errors on the silicon wafer, severely impacting dicing quality, reducing wafer yield, and hindering the stability of subsequent processes. Related technologies employ passive insulation or simple overall temperature control. For example, cooling the cutting area through a coolant circulation system or using an air conditioning system for large-scale temperature control of the environment surrounding the cutting equipment. While these methods can stabilize the overall temperature environment to some extent, their response speed is slow and they cannot quickly respond to dynamically changing heat loads within the cutting equipment.

[0026] In view of this, this application provides a thermal displacement compensation system, a thermal displacement compensation method, and a cutting device, which are described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0027] According to the first aspect of this application, referring to Figure 1 One embodiment of this application provides a thermal displacement compensation system, which may include: a frame 1, a fixing device 2, a first driving device 3, a sensor assembly 4, and a control module 5.

[0028] Specifically, refer to Figure 1 and Figure 2 The frame 1 serves as the installation foundation and support structure for the entire thermal displacement compensation system. The frame 1 can be made of rigid materials, such as metal, which possesses excellent rigidity and stability. The frame 1 provides a stable mounting platform for components such as the fixing device 2, the first drive device 3, and the sensor assembly 4, ensuring that each component maintains a stable relative position during the cutting process and preventing the frame 1's own shaking from affecting the compensation accuracy.

[0029] Reference Figure 2 The fixing device 2 is used to fix the semiconductor silicon rod 200, such as a single-crystal silicon rod, and can prevent the semiconductor silicon rod 200 from shifting or shaking during the cutting process. As an example, the semiconductor silicon rod 200 can be cut by the cutting part 8 to form slices, such as a cutting line. The cutting part 8 can be connected to a second driving device (not shown), which can drive the cutting part 8 to cut the semiconductor silicon rod 200.

[0030] As an example, refer to Figure 2The fixing device 2 may include a fixing part 21, a first guide part 22, and a second guide part 23. The fixing part 21 can be connected to the output end 31 of the first driving device 3, and the semiconductor silicon rod 200 is detachably disposed on the fixing part 21. The fixing part 21 can adopt a clamping type, adsorption type, or other structural form, and can be adjusted according to the shape and size of the semiconductor silicon rod 200. The first guide part 22 and the second guide part 23 can both extend along the moving direction of the fixing device 2. The first guide part 22 can be fixedly connected to the fixing part 21, and the second guide part 23 can be fixedly disposed on the frame 1, and the first guide part 22 and the second guide part 23 are slidably connected. Through the cooperation of the first guide part 22 and the second guide part 23, the moving trajectory of the fixing device 2 can be restricted to ensure that it moves in a preset direction, such as the axial direction of the semiconductor silicon rod 200, avoiding deviation or jamming, thereby improving the accuracy and stability of the movement of the semiconductor silicon rod 200.

[0031] Reference Figures 3 to 5 The first driving device 3 serves as the power source for displacement compensation, and its output terminal 31 can be connected to the fixed device 2. The first driving device 3 drives the fixed device 2 to move along a preset direction. The fixed device 2 can synchronously move the semiconductor silicon rod 200 to reduce the thermal displacement deviation between the semiconductor silicon rod 200 and the cutting part 8. The first driving device 3 can be, for example, a linear motor. A linear motor can directly convert electrical signals into linear displacement without intermediate transmission mechanisms. It has advantages such as fast response speed, high positioning accuracy (up to the micrometer level), and stable operation, meeting the high precision and fast response requirements of thermal displacement compensation for the first driving device 3. In other embodiments, the first driving device 3 can also adopt a combination of a servo motor and transmission mechanisms such as ball screws and racks and pinions, which can also achieve precise linear drive.

[0032] Reference Figure 1 Sensor assembly 4 can be mounted on rack 1. Sensor assembly 4 is used to collect temperature parameters of the measured environment to provide data support for the decision-making of control module 5. Sensor assembly 4 can collect temperature parameters of the measured environment in real time to ensure that control module 5 can quickly analyze and judge the temperature parameters, thereby improving the response speed of the thermal displacement compensation system.

[0033] Reference Figure 1 and Figure 3The control module 5 is the core control unit of the thermal displacement compensation system. It can communicate with both the first driving device 3 and the sensor assembly 4. The control module 5 can control the first driving device 3 to move the fixing device 2 based on temperature parameters, thereby causing the fixing device 2 to move the semiconductor silicon rod 200 and achieve thermal displacement compensation. The control module 5 can also control the shutdown and operating parameters of the first driving device 3, such as its operating direction and speed, to control the moving direction and speed of the semiconductor silicon rod 200.

[0034] In some embodiments, the control module 5 can receive and process temperature parameters from the temperature sensor, make judgments and calculations according to a preset control algorithm, and finally generate control commands to send to the first driving device 3, controlling the first driving device 3 to drive the fixing device 2 and the semiconductor silicon rod 200 to adjust their displacement, so as to compensate for the thermal displacement deviation caused by temperature changes.

[0035] Control module 5 is configured to: start timing when the temperature parameter is outside the preset value range; if the temperature parameter continues to exceed the preset value range within a first preset time period, control module 5 controls the first drive device 3 to start. Conversely, start timing when the temperature parameter is within the preset value range; if the temperature parameter remains within the preset value range within a second preset time period, control module 5 controls the first drive device 3 to shut down. The first and second preset time periods can be the same or different. By setting the first and second preset time periods, i.e., using delayed judgment control logic, instantaneous temperature fluctuations or noise interference can be filtered out to avoid frequent start-stop or oscillation of the first drive device 3, thereby improving the accuracy and operational stability of the thermal displacement compensation system. The preset value is a preset temperature value, which can be a point value or a range value. As an example, when the preset value is a range value, the preset value range can be 25℃±2℃.

[0036] As an example, refer to Figure 6 The control module 5 can be a PLC (Programmable Logic Controller). The control module 5 includes a data storage unit 51, a monitoring unit 52, a start-up unit 53, and a central control unit 54. The units work together to achieve intelligent control of the thermal displacement compensation process.

[0037] The data storage unit 51, such as a memory card, is used to store the temperature parameters output by the sensor assembly 4. These temperature parameters include, for example, real-time acquired temperature data, historical temperature change curves, and preset value ranges. By storing historical data, the compensation algorithm of the central control unit 54 can be supported. For example, by analyzing the correspondence between historical temperature changes and thermal displacement, the compensation strategy can be optimized, thereby improving the compensation accuracy.

[0038] The monitoring unit 52, for example, is a timer module of a PLC. The monitoring unit 52 monitors whether the temperature parameter is within a preset value range within a first preset duration and a second preset duration. For example, both the first and second preset durations are set to 30 seconds. Setting the first and second preset durations can prevent the first drive device 3 from being erroneously started or stopped due to instantaneous temperature fluctuations, thus improving the stability of the thermal displacement compensation system. For example, when the temperature parameter briefly exceeds the preset value range but returns to normal within a short time, it can be determined as an instantaneous interference, and compensation does not need to be initiated.

[0039] The start-up unit 53, for example, is a digital output module of a PLC. The start-up unit 53 is used to start or stop the first drive device 3 based on the monitoring results of the monitoring unit 52. When the monitoring unit 52 detects that the temperature parameter continuously exceeds a preset value range for a first preset time period, the start-up unit 53 outputs a start signal to control the first drive device 3 to start. When the monitoring unit 52 detects that the temperature parameter continuously remains within a preset value range for a second preset time period, the start-up unit 53 outputs a stop signal to control the first drive device 3 to stop.

[0040] The central control unit 54, such as the CPU (Central Processing Unit) module of a PLC, is used to calculate the moving distance of the fixed device 2. For example, the central control unit 54 runs an adaptive control algorithm to calculate the target moving distance of the fixed device 2 based on the temperature parameters collected by the sensor assembly 4. The central control unit 54 can have a built-in thermal displacement compensation model. This model is derived from parameters such as the difference in thermal expansion coefficients between the frame 1 material and the semiconductor silicon rod 200 material, the amount of temperature change, and structural dimensions, using the heat conduction equation and the thermal expansion formula to derive the thermal displacement. The central control unit 54 reads the temperature parameters of the sensor assembly 4 in real time, calculates the required thermal displacement compensation amount, converts this compensation amount into a control signal, and sends it to the first drive device 3 to control the first drive device 3 to drive the fixed device 2 to move the corresponding distance, thus achieving precise compensation. The thermal expansion coefficient of the semiconductor silicon rod 200 is, for example, 2.6 × 10⁻⁶. -6 / ℃, the coefficient of thermal expansion of frame 1 is, for example, 12×10⁻⁶℃. -6 / ℃.

[0041] In this application, the control module 5 is communicatively connected to the first driving device 3 and the sensor assembly 4. The control module 5 can control the first driving device 3 to move the fixing device 2 based on temperature parameters, enabling the fixing device 2 to move the semiconductor silicon rod 200 and achieve thermal displacement compensation. The sensor assembly 4 can collect temperature parameters in real time, and the control module 5 can quickly analyze and judge the temperature parameters, promptly activating the first driving device 3 to drive the semiconductor silicon rod 200 for position compensation, thereby reducing the thermal displacement deviation between the semiconductor silicon rod 200 and the cutting part 8, thus improving the dimensional accuracy and cutting quality of the slices. Compared to traditional solutions such as coolant circulation and air conditioning temperature control, the thermal displacement compensation system of this application adopts an active compensation method, resulting in a faster response speed and timely response to dynamically changing heat loads. It can reduce interference caused by ambient temperature fluctuations and internal load changes, thus improving the stability of the relative position between the cutting part 8 and the semiconductor silicon rod 200, thereby improving the dimensional accuracy and cutting quality of the slices.

[0042] In some embodiments, refer to Figure 1 and Figure 4 The frame 1 may include a feed table 11 for mounting the first drive device 3, and the control module 5 may also be mounted on the feed table 11. The fixing device 2, the first drive device 3, some sensor components 4, and the control module 5 are integrated into the feed table 11 of the frame 1, making the thermal displacement compensation system more compact. The feed table 11 may be provided with an isolation section 111, which may be located between the first drive device 3 and the fixing device 2. The isolation section 111 may have a through hole 112 through which the output end 31 of the first drive device 3 can be connected to the fixing device 2. The isolation section 111 can isolate the first drive device 3 from the cutting area, preventing chips, coolant, etc. generated during the cutting process from entering the interior of the first drive device 3, thereby improving the operating accuracy of the first drive device 3 and extending its service life. Meanwhile, the isolation section 111 can also play a certain role in heat insulation, reducing the heat generated by the first driving device 3 during operation from being transferred to the cutting area, thereby reducing the deformation fluctuation of the semiconductor silicon rod 200 caused by temperature changes, and also reducing the heat transferred from the cutting area to the first driving device 3, thereby reducing the performance fluctuation of the first driving device 3 caused by temperature changes.

[0043] The isolation section 111 and the feed stage 11 can be integrally formed or separate structures. As an example, when the isolation section 111 and the feed stage 11 are separate structures, the isolation section 111 can be made of a material with low thermal conductivity, or it can be a cavity structure filled with heat-insulating material. The diameter of the through hole 112 can be slightly larger than the diameter of the output end 31 to avoid contact friction, and flexible heat-insulating material can also be filled in the gap. In this way, most of the heat generated by the first drive device 3 is blocked by the isolation section 111, and the mechanical thrust of the first drive device 3 can be transferred out through the output end 31 to reduce the source of thermal interference.

[0044] In some embodiments, refer to Figure 1 The sensor assembly 4 may include multiple temperature sensors, which can be respectively set at different positions on the frame 1 to collect the temperature of different areas, thereby enabling timely acquisition of temperature changes between the frame 1 and the semiconductor silicon rod 200. The temperature sensors can be high-precision temperature sensors, such as PT100 sensors or thermocouples. PT100 sensors have high measurement accuracy and good stability, exhibiting good linearity within a temperature range of -200℃ to 650℃, meeting the temperature measurement requirements of the cutting and processing environment. Thermocouples offer advantages such as fast response speed, simple structure, and low cost, making them suitable for rapid capture of temperature changes. Furthermore, the sensor assembly 4 may also include a conversion element (not shown) and a signal processing circuit (not shown). The conversion element converts the physical quantity (such as temperature) collected by the temperature sensor into an electrical signal, while the signal processing circuit performs filtering, amplification, and analog-to-digital conversion on the electrical signal to ensure accurate and stable output temperature parameters, facilitating data reading and analysis by the control module 5.

[0045] In some embodiments, refer to Figure 1 The frame 1 may include a cutting bracket 12, and multiple temperature sensors may include at least one first sensor 41. The first sensor 41 is disposed on the cutting bracket 12 and is used to collect the temperature of the cutting bracket 12. The cutting bracket 12 is used to mount the cutting part 8. The temperature change of the cutting bracket 12 directly affects the positional stability of the cutting part 8. By monitoring the temperature of the cutting bracket 12 in real time through the first sensor 41, the displacement of the cutting part 8 caused by the temperature change can be obtained. In this embodiment, there can be multiple first sensors 41, for example, four first sensors 41. The four first sensors 41 can collect the temperature at different positions of the cutting bracket 12, thereby more accurately collecting the temperature change of the cutting bracket 12.

[0046] Reference Figure 1The multiple temperature sensors may further include at least one second sensor 42. The second sensor 42 can be disposed on the feed stage 11 and used to collect the temperature of the feed stage 11. The feed stage 11 is the mounting carrier of the first drive device 3. Temperature changes in the feed stage 11 will cause changes in the position of the first drive device 3, thereby affecting the displacement compensation accuracy. Furthermore, the semiconductor silicon rod 200 is connected to the output terminal 31 of the first drive device 3 through the fixing part 21, causing changes in the position of the semiconductor silicon rod 200. By monitoring the temperature of the feed stage 11 through the second sensor 42, reference temperature data can be provided for compensation calculation. In this embodiment, the number of second sensors 42 can be one.

[0047] In some embodiments, refer to Figure 1 The frame 1 may further include a first support 13, which forms a first cavity 131. The fixing device 2, the first driving device 3, the sensor assembly 4, and the control module 5 may be disposed within the first cavity 131 to reduce external environmental interference. The thermal displacement compensation system may further include a temperature regulating device 6, such as an air conditioner, which is used to regulate the temperature within the first cavity 131 to regulate and maintain the temperature of the cutting environment.

[0048] Among them, reference Figure 1 The temperature sensor may further include at least one third sensor 43, which may be disposed within the first cavity 131 and used to collect the ambient temperature within the first cavity 131. When the ambient temperature within the first cavity 131 is lower than a preset value, the temperature regulating device 6 can provide hot air to raise the ambient temperature within the first cavity 131. When the ambient temperature within the first cavity 131 is higher than the preset value, the temperature regulating device 6 can provide cold air to lower the ambient temperature within the first cavity 131. In this embodiment, the number of third sensors 43 may be one.

[0049] Reference Figure 1 The temperature sensor may further include at least one fourth sensor 44. The fourth sensor 44 may be positioned close to the air outlet 61 of the temperature regulating device 6. The air outlet 61 of the temperature regulating device 6 is connected to the first cavity 131 and is used to collect the temperature at the air outlet 61 of the temperature regulating device 6. The fourth sensor 44 is used to monitor the temperature of the regulated air sent into the first cavity 131 by the temperature regulating device 6 in real time, thereby obtaining the working status and response speed of the temperature regulating device 6. In this embodiment, the number of fourth sensors 44 may be one.

[0050] Through the cooperation of the third sensor 43 and the fourth sensor 44, the working effect of the temperature regulating device 6 can be monitored in real time, ensuring that the temperature inside the first cavity 131 remains stable within a preset range. Simultaneously, the ambient temperature data collected by the third sensor 43 and the fourth sensor 44 can serve as background parameters or feedforward inputs for the compensation algorithm, helping the thermal displacement compensation system distinguish between displacement caused by overall changes in ambient temperature and displacement caused by local heat sources. In some embodiments, the temperature regulating device 6 can be communicatively connected to the control module 5, which can control the start-up or shutdown of the temperature regulating device 6, as well as the temperature and flow rate of the gas output by the temperature regulating device 6.

[0051] In some embodiments, refer to Figure 1 The thermal displacement compensation system may further include a coolant supply device 7, which provides coolant to dissipate the frictional heat generated during the cutting process, thereby cooling the semiconductor silicon rod 200. The coolant supply device 7 may include a first outlet 71 through which coolant flows to the semiconductor silicon rod 200. The first outlet 71 may be, for example, a nozzle, through which coolant is sprayed onto the semiconductor silicon rod 200. There may be one or more first outlets 71. In this embodiment, there may be two first outlets 71, which can spray coolant onto the semiconductor silicon rod 200 from two different directions.

[0052] Reference Figure 1 The frame 1 may further include a second support 14, which may be disposed within the first support 13. The second support 14 may form a second cavity 141 for receiving the coolant after heat exchange with the semiconductor silicon rod 200. The second support 14 may be provided with a second outlet 142 for allowing the coolant after heat exchange with the semiconductor silicon rod 200 to flow out. In some embodiments, the second outlet 142 may be connected to a coolant supply device 7, allowing the coolant after heat exchange with the semiconductor silicon rod 200 to flow back to the coolant supply device 7, thus achieving coolant recycling.

[0053] Reference Figure 1The multiple temperature sensors may include at least one fifth sensor 45 and at least one sixth sensor 46. The fifth sensor 45 may be positioned near the first outlet 71 and collect the temperature of the coolant at the first outlet 71. The sixth sensor 46 may be positioned on the return path of the coolant after heat exchange with the semiconductor silicon rod 200, and may be positioned near the second outlet 142. The sixth sensor 46 is used to detect the temperature of the coolant after heat exchange with the semiconductor silicon rod 200. By comparing the detection data of the fifth sensor 45 and the sixth sensor 46, the heat generated during the cutting process can be obtained, providing an accurate basis for calculating the thermal displacement compensation. In some embodiments, the coolant supply device 7 may be communicatively connected to the control module 5. The control module 5 may control the start-up or shutdown of the coolant supply device 7, and may also control the flow rate and temperature of the coolant sprayed from the first outlet 71 of the coolant supply device 7.

[0054] According to a second aspect of this application, one embodiment of this application provides a thermal displacement compensation method applied to a thermal displacement compensation system as described above. The thermal displacement compensation method includes the following steps.

[0055] Sensor component 4 collects temperature parameters of the measured environment.

[0056] Specifically, multiple temperature sensors in sensor assembly 4 collect temperature data from various locations in real time, including the temperature of the cutting support 12, the temperature of the feed table 11, the ambient temperature inside the first cavity 131, the temperature at the air outlet 61 of the temperature regulating device 6, the coolant temperature at the first outlet 71 of the coolant supply device 7, and the coolant temperature after heat exchange. The temperature sensors convert the collected temperature physical quantities into electrical signals, which are then filtered, amplified, and converted from analog to digital by the signal processing circuit before being output as standardized temperature parameters to the control module 5.

[0057] The control module 5 controls the first drive device 3 to start based on the temperature parameters, so as to drive the fixed device 2 to move.

[0058] Specifically, the control module 5 receives the temperature parameters output by the sensor assembly 4 and determines whether the temperature parameters are within the preset range. The preset range is, for example, a temperature threshold range pre-set based on parameters such as the material properties of the semiconductor silicon rod 200, the cutting process requirements, and the thermal expansion coefficient of the frame 1. This range ensures that the thermal displacement between the frame 1 and the semiconductor silicon rod 200 is within an acceptable error range and will not affect the cutting accuracy.

[0059] When the temperature parameter is outside the preset range, the control module 5 can control the first drive device 3 to start, so as to drive the fixed device 2 to move.

[0060] In another embodiment, timing begins when the temperature parameter is outside the preset value range. If the temperature parameter continues to exceed the preset value range within a first preset time period, the control module 5 controls the first drive device 3 to start. Timing begins when the temperature parameter is within the preset value range. If the temperature parameter continues to be within the preset value range within a second preset time period, the control module 5 controls the first drive device 3 to shut down.

[0061] Specifically, if the temperature parameter is outside the preset value range, the monitoring unit 52 of the control module 5 starts timing; if the temperature parameter continues to exceed the preset value range within the first preset time period, it is determined that there is a thermal displacement mismatch and compensation action needs to be initiated; if the temperature parameter recovers to the preset value range during the timing process, the timing is terminated and compensation action is not initiated to avoid false compensation.

[0062] If the temperature parameter is within the preset range, the monitoring unit 52 of the control module 5 will also start timing; if the temperature parameter remains within the preset range for a second preset duration, it is determined that the current thermal displacement mismatch has been compensated or there is no thermal displacement mismatch, and the control module 5 controls the first drive device 3 to shut down to avoid unnecessary energy consumption and mechanical wear; if the temperature parameter exceeds the preset range again during the timing process, the timing will be terminated, and the current operating state of the first drive device 3 will be maintained or the operating parameters will be adjusted according to the new temperature parameter.

[0063] As an example, when the control module 5 determines that a compensation action needs to be initiated, the central control unit 54 runs an adaptive control algorithm to calculate the target moving distance of the fixed device 2 based on the temperature parameters collected by the sensor assembly 4. The central control unit 54 can retrieve preset parameters such as the thermal displacement compensation model, the thermal expansion coefficients of the frame 1 material and the semiconductor silicon rod 200 material, and the cutting length of the semiconductor silicon rod 200 from the data storage unit 51, and combine them with the real-time collected temperature changes to calculate the current required thermal displacement compensation amount, i.e., the target distance that the fixed device 2 needs to move.

[0064] Subsequently, the central control unit 54 can convert the target movement distance into a corresponding control signal (such as a pulse signal, voltage signal, etc.) and send it to the first drive device 3 through the start unit 53. After receiving the control signal, the first drive device 3 starts and drives the fixing device 2 to move along the preset direction to the target position, thereby causing the semiconductor silicon rod 200 to move, compensating for the thermal displacement mismatch between the frame 1 and the semiconductor silicon rod 200, ensuring that the position of the cutting part 8 relative to the semiconductor silicon rod 200 remains stable, thereby improving the cutting accuracy.

[0065] During the operation of the first driving device 3, the sensor assembly 4 continuously collects the temperature parameters of the measured environment. The control module 5 can receive and analyze these temperature parameters in real time and dynamically adjust the operating parameters of the first driving device 3 according to temperature changes. For example, if the temperature continues to rise, resulting in an increase in thermal displacement, the central control unit 54 recalculates the compensation amount and controls the first driving device 3 to continue driving the fixed device 2 to move until the temperature parameters return to the preset range. If the temperature decreases, resulting in a decrease in thermal displacement, the first driving device 3 is controlled to drive the fixed device 2 to move in the opposite direction, thus achieving dynamic and real-time thermal displacement compensation.

[0066] According to a third aspect of this application, an embodiment of this application also provides a cutting device, including a thermal displacement compensation system as described above.

[0067] As an example, the calculation process for the compensation displacement of the thermal displacement compensation system is as follows. With a reference temperature T0 of 23℃ and a linear expansion coefficient α of the semiconductor silicon rod 200 of 2.6 × 10⁻⁶, the compensation displacement is calculated as follows. -6 Taking / ℃ as an example, the displacement adjustment amount is the reverse compensation value of the thermal deformation amount. That is, when the semiconductor silicon rod 200 undergoes thermal expansion and contraction, the first driving device 3 adaptively adjusts the displacement to ensure that the cutting trajectory remains unchanged. The temperature change ΔT is the difference between the actual temperature and the reference temperature, directly reflecting the degree to which the temperature deviates from the process reference. ΔT=(T0+(( Tsi(t)- T(t)))-T0, where, Tsi(t) is the difference between the detection value of the sixth sensor 46 and the detection value of the fifth sensor 45. T(t) is the difference between the detection value of the fourth sensor 44 and the detection value of the third sensor 43. The cumulative cutting length of the semiconductor silicon rod 200 at the reference temperature is L(t). Where R is the radius of the semiconductor silicon rod 200, and Vs is the feeding speed of the feed table 11. The cumulative linear expansion displacement of the semiconductor silicon rod 200 at time t is ΔL. , where k is the correction coefficient. , where δ target δ represents the target thickness of the previous slice. thickness k is the actual measured thickness of the previous slice. old This is the correction factor for the previous cut. If... Tsi(t) < If T(t), then ΔT < 0, the semiconductor silicon rod 200 contracts upon cooling, and the compensation displacement is in the opposite direction to the contraction direction of the semiconductor silicon rod 200: Sc = ΔL. If Tsi(t) > If T(t), then ΔT>0. When the semiconductor silicon rod 200 is heated and expands, the displacement in the opposite direction of the expansion direction of the semiconductor silicon rod 200 is: Sc=-ΔL.

[0068] As an example, at t=10min, the feeding speed of the feed table Vs=0.5mm / min, the radius R of the semiconductor silicon rod 200 is 150mm, and the difference between the detection value of the sixth sensor 46 and the detection value of the fifth sensor 45 is... Tsi(t) = 1℃, the difference between the detection value of the fourth sensor 44 and the detection value of the third sensor 43. Given T(t) = 0, reference temperature T0 = 23℃, and k = 1, calculate the compensation displacement: Temperature change ΔT = (T0 + (( Tsi(t)- T(t)))-T0=(23+1-0)-23=1℃; The cumulative cutting length L (10 min) of semiconductor silicon rod 200 at the reference temperature is approximately 490.35 mm; Thermal deformation ΔL = 490.35 × 2.6 × 10 6 ×1×1≈1.275μm; The reverse compensation displacement Sc = -1.275 μm.

[0069] Therefore, at t=10min, the semiconductor silicon rod 200 expands by 1.275μm due to a 1℃ increase in temperature, and the fixing device 2 needs to move in the opposite direction by -1.275μm to ensure that the cutting trajectory is consistent with the reference temperature.

[0070] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0071] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0072] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0073] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A thermal displacement compensation system, characterized in that, include: frame; A fixing device for fixing a semiconductor silicon rod to be cut; A first driving device, the output end of which is connected to the fixed device, is used to drive the fixed device to move. A sensor assembly, which is mounted on the frame, is used to collect temperature parameters of the measured environment; The control module is communicatively connected to the first driving device and the sensor assembly. The control module can control the first driving device to drive the fixed device to move according to the temperature parameter, so that the fixed device drives the semiconductor silicon rod to move.

2. The thermal displacement compensation system according to claim 1, characterized in that, The fixing device includes a fixing part, a first guide part and a second guide part. The fixing part is connected to the output end of the first driving device, and the semiconductor silicon rod is disposed on the fixing part. Both the first guide portion and the second guide portion extend along the direction of movement of the fixing device. The first guide portion is connected to the fixing portion, and the second guide portion is disposed on the frame. The first guide portion and the second guide portion are slidably connected.

3. The thermal displacement compensation system according to claim 1, characterized in that, The frame includes a feed table for mounting the first drive device. The feed table is provided with an isolation part, which is disposed between the first drive device and the fixing device. The isolation part is provided with a through hole, through which the output end of the first drive device passes and is connected to the fixing device.

4. The thermal displacement compensation system according to claim 3, characterized in that, The sensor assembly includes multiple temperature sensors, which are respectively disposed at different positions on the frame.

5. The thermal displacement compensation system according to claim 4, characterized in that, The frame includes a cutting bracket, and the plurality of temperature sensors include at least one first sensor, which is disposed on the cutting bracket and used to acquire the temperature of the cutting bracket; and / or, The plurality of temperature sensors include at least one second sensor disposed on the feed stage and used to acquire the temperature of the feed stage.

6. The thermal displacement compensation system according to claim 4, characterized in that, The frame includes a first support, which forms a first cavity. The thermal displacement compensation system also includes a temperature regulating device for regulating the temperature inside the first cavity. The plurality of temperature sensors include a third sensor, which is disposed within the first cavity and used to collect the temperature within the first cavity; and / or, The plurality of temperature sensors include a fourth sensor, which is positioned near the air outlet of the temperature regulating device and is used to collect the temperature at the air outlet of the temperature regulating device.

7. The thermal displacement compensation system according to claim 4, characterized in that, The thermal displacement compensation system also includes a coolant supply device, which includes a first outlet through which the coolant flows to the semiconductor silicon rod. The plurality of temperature sensors include at least one fifth sensor and at least one sixth sensor. The fifth sensor is located near the first liquid outlet and collects the temperature of the coolant at the first liquid outlet. The sixth sensor is used to detect the temperature of the coolant after heat exchange with the semiconductor silicon rod.

8. The thermal displacement compensation system according to claim 1, characterized in that, The control module is configured to start timing when the temperature parameter is outside the preset value range, and if the temperature parameter continues to exceed the preset value range within a first preset time period, the control module controls the first drive device to start. Timing begins when the temperature parameter is within a preset range. If the temperature parameter remains within the preset range for a second preset duration, the control module controls the first drive device to shut down.

9. The thermal displacement compensation system according to claim 8, characterized in that, The control module includes: A data storage unit is used to store the temperature parameters output by the sensor assembly; The monitoring unit is used to monitor whether the temperature parameter is within a preset value range within the first preset time period or the second preset time period; A startup unit is used to start or stop the first drive device according to the monitoring results of the monitoring unit; The central control unit is used to calculate the movement distance of the fixed device.

10. A thermal displacement compensation method, characterized in that, The thermal displacement compensation method, applied to the thermal displacement compensation system as described in any one of claims 1 to 9, comprises: The sensor assembly collects temperature parameters of the measured environment; The control module controls the first drive device to start based on the temperature parameter, so as to drive the fixed device to move.

11. The thermal displacement compensation method according to claim 10, characterized in that, The step of the control module controlling the first driving device to start based on the temperature parameter, so as to drive the fixed device to move, includes: The control module detects the temperature parameter in real time and determines whether the temperature parameter is within the preset range. When the temperature parameter is outside the preset range, the control module controls the first drive device to start, so as to drive the fixed device to move.

12. The thermal displacement compensation method according to claim 10, characterized in that, The step of the control module controlling the first driving device to start based on the temperature parameter, so as to drive the fixed device to move, includes: The control module detects the temperature parameter in real time and determines whether the temperature parameter is within the preset range. Timing begins when the temperature parameter is outside the preset value range. If the temperature parameter continues to exceed the preset value range within a first preset time period, the control module controls the first drive device to start. Timing begins when the temperature parameter is within a preset range. If the temperature parameter remains within the preset range for a second preset duration, the control module controls the first drive device to shut down.

13. A cutting device, characterized in that, Includes the thermal displacement compensation system as described in any one of claims 1 to 9.

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