A silicon wafer cutting device and cutting method for producing a silicon electrode

Abstract

The application relates to the technical field of silicon electrode production, and discloses a silicon wafer cutting device and a cutting method for silicon electrode production. The device comprises a seat body, a crystal holder fixing frame is slidably arranged on the seat body, a driving source for driving the crystal holder fixing frame to ascend and descend is arranged on the seat body, and the crystal holder fixing frame is detachably arranged on the crystal holder fixing frame. A wire roller, a collecting box and a liquid box are arranged on the seat body. The liquid box is fixed to the seat body, a liquid outlet of the liquid box is rotatably arranged with a flow guide plate, and the flow guide plate is turned over by the transmission assembly during the descending of the crystal holder fixing frame. When the silicon ingot is partially cut, the flow guide plate is turned over upwards, the cooling liquid can flow out of the center of the silicon ingot and the cutting area, the flow guide plate can be automatically adjusted to turn over upwards after the cutting is performed for a period of time, the flow direction of the cooling liquid is adjusted, the cooling liquid can cool the center of the silicon ingot and the cutting area, and the problem that micro-cracks are formed at the grain boundaries or defects due to uneven temperature distribution in the silicon ingot is solved.

Description

Technical Field

[0001] This invention relates to the field of silicon electrode production technology, and specifically to a silicon wafer cutting device and cutting method for silicon electrode production. Background Technology

[0002] In the semiconductor industry, the manufacture of silicon electrodes is a key technology, and silicon electrodes typically require silicon wafers as raw materials. Silicon wafers are produced by pulling polycrystalline or pure silicon raw materials from a crucible into single-crystal silicon rods, followed by processes such as cutting, grinding, and polishing. Currently, most silicon wafer cutting machines on the market use wire cutting, which is low-cost and produces high-quality cuts. However, when cutting silicon ingots at high speeds using the cutting wire, the intense friction between the diamond particles and the silicon material generates a large amount of heat, necessitating cooling of the cutting area.

[0003] Several existing technologies exist for cooling silicon ingots during the cutting process, such as patent publication number CN109129949B. The main technique involves replenishing coolant into a replenishment tank via a replenishment pipe. When the coolant level in the replenishment tank is higher than the opening of the overflow tank, the coolant overflows from one side of the overflow tank opening and flows onto an overflow plate, forming a laminar flow. After leaving the overflow plate, it forms a water curtain and then drips onto the cutting line below. Analysis reveals that this technique has drawbacks: the coolant flow direction remains constant, and the cutting line area in contact with the coolant is limited to the two sides of the cutting area. The central area and interior of the silicon ingot are difficult to cool effectively. Furthermore, during cutting, mechanical energy is converted into heat energy. If cooling is not timely, heat will be conducted through the silicon crystals to the interior, resulting in uneven temperature distribution throughout the silicon ingot. Silicon is a typical brittle material; uneven thermal expansion generates tensile stress. When local thermal stress exceeds the strength limit of silicon, microcracks will form at grain boundaries or defects, which will then expand into penetrating cracks during subsequent processing. Based on this, the present invention provides a silicon wafer cutting device and cutting method for silicon electrode production that can automatically adjust the flow direction of coolant to cool the central region of silicon ingot in the later stage of cutting. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of the prior art by providing a silicon wafer cutting device and method for silicon electrode production, thereby solving the technical problem that the inability to automatically adjust the flow direction of the coolant makes it difficult to cool the central area of ​​the silicon ingot.

[0005] The objective of this invention can be achieved through the following technical solutions: A silicon wafer cutting apparatus for silicon electrode production, comprising: A base body on which a crystal tray fixing frame is slidably mounted and a drive source for driving the crystal tray fixing frame to rise and fall is installed. A crystal tray is detachably mounted on the crystal tray fixing frame, and a silicon ingot is bonded to the bottom of the crystal tray. The base body is provided with a wire feeding assembly, a wire taking-up assembly and a cutting cavity. The wire guide rollers are symmetrically arranged and rotatably installed in the cutting cavity, driven to rotate by the output source. Two wire splitting wheel sets are also installed in the cutting cavity. The cutting wire output by the wire feeding assembly is wound around the two wire guide rollers after passing through the wire splitting wheel sets, and then output from the cutting cavity and wound up by the wire take-up assembly. A collection box is slidably mounted on the base and located between two guide rollers. The collection box is located below the cutting area and has an open top. A liquid box, fixed to the base, has a guide plate rotatably mounted at its outlet, the guide plate being positioned towards the cutting line on the guide roller. Two liquid boxes are present, symmetrically arranged, and located on opposite sides of the cutting area. The transmission assembly is mounted on the base and connected to the crystal tray holder; when the crystal tray holder descends, the transmission assembly drives the guide plate to flip.

[0006] As a further aspect of the present invention: the liquid tank includes: A box body, fixed to a base, with a partition fixed inside, the inner cavity of the box body divided into an injection chamber and an overflow chamber by the partition, and a gap between the bottom of the partition and the bottom plate of the box body; the injection chamber is connected to an infusion tube, and the injection chamber communicates with the overflow chamber; and An overflow plate is fixed to the box body and arranged at an angle. The top of the overflow plate is connected to an opening at the top of the overflow cavity, and its bottom is rotatably connected to a guide plate.

[0007] As a further aspect of the present invention: the transmission assembly includes: The positioning rod is fixed to the crystal tray fixing frame, and a lifting plate is fixed to its bottom; A rotating shaft, rotatably mounted on a base and rotatably connected to the bottom of an overflow plate, is also fixedly connected to a guide plate; and The transmission rod has one end fixedly connected to the rotating shaft, and the other end is rotatably mounted with a movable block. The movable block is slidably mounted on the base, and the two are elastically connected. The position of the movable block interferes with the movement path of the lifting plate. When the lifting plate descends to contact the movable block, the lifting plate continues to descend, causing the movable block to descend. The movable block then drives the rotating shaft to rotate through the transmission rod, causing the guide plate to flip upward.

[0008] As a further aspect of the present invention: a guide rod is fixed on the rotating shaft, and the guide rod slides in conjunction with an arc-shaped groove formed on the base.

[0009] As a further embodiment of the present invention: a pressure box is fixed on the base and is located above the box body. The pressure box has an outlet on the side near the guide plate, and a sealing plate is slidably installed at the outlet. The sealing plate is connected to the transmission assembly. An inclined guide plate is fixed at the bottom of the pressure box. The top of the guide plate is connected to the outlet, and its bottom faces the guide plate. When the lifting plate descends and drives the guide plate to flip upward, the transmission assembly drives the sealing plate to rise so that the outlet switches to a flow state, and the coolant in the pressure box flows to the guide plate.

[0010] As a further aspect of the present invention: a magnetic strip is fixed inside the sealing plate, and the transmission assembly further includes: The first rack is fixed to the lifting plate; A gear, rotatably mounted on a housing, on which a second rack is slidably mounted, both the first and second racks meshing with the gear, with the gear positioned between them; and The magnetic block is attracted to the magnetic strip and slides into a vertical groove on the outer wall of the pressure chamber. The magnetic block is fixedly connected to the second rack via a connecting rod.

[0011] As a further aspect of the present invention, the liquid tank is provided with a splash-proof component.

[0012] As a further aspect of the present invention: the splash-proof component includes: A fixed baffle is attached to both sides of the box body, with its top higher than the opening of the box body and the top of the overflow plate. A storage groove is provided at the end of the fixed baffle near the guide plate. The movable baffle is fixed to both sides of the guide plate, and a connecting block is fixed to the end of the baffle near the fixed baffle. The connecting block is connected to the inner wall of the storage slot through a folding plate.

[0013] A method for dicing silicon wafers for silicon electrode production, the method being applied to the silicon wafer dicing apparatus for silicon electrode production as described above, the method comprising the following steps: Step S1: The cutting wire output from the wire feeding assembly is wound onto two wire separating rollers, then onto two guide rollers, and finally wound up by the wire take-up assembly; Step S2: Coolant is discharged from the outlet of the liquid box and flows through the guide plate to the cutting line on the guide roller; Step S3: Attach the silicon ingot to the bottom of the crystal tray, and then install the crystal tray on the crystal tray holder; Step S4: The drive source drives the crystal holder to descend. When the silicon ingot contacts the cutting line on the wire roller, the silicon ingot is cut into a silicon wafer, and the silicon wafer falls into the collection box. Step S5: During the descent of the crystal holder, the guide plate is rotated by the transmission component, so that when the silicon ingot is partially cut, the guide plate rotates upward, which can allow coolant to flow out of the silicon ingot and the center of the cutting area.

[0014] The beneficial effects of this invention are: (1) In this invention, during the descent of the crystal holder, the guide plate is rotated by the transmission component, so that when the silicon ingot is partially cut, the guide plate rotates upward, and coolant flows out to the center of the silicon ingot and the cutting area. This enables the guide plate to be automatically rotated upward after a period of cutting to adjust the flow direction of the coolant, so that the coolant can cool the center of the silicon ingot and the cutting area, avoiding the problem of uneven temperature distribution inside the silicon ingot leading to the formation of microcracks at the grain boundary or defect. (2) In this invention, when the crystal holder is lowered, the lifting plate is lowered synchronously. When the silicon ingot contacts the cutting line, the cutting line can cut it. After the cutting is carried out for a period of time, the lifting plate is lowered to contact the movable block. Then the crystal holder continues to lower to continue cutting. At this time, the continued descent of the lifting plate can press down the movable block. The movable block drives the rotating shaft to rotate through the transmission rod, so that the guide plate flips upward. In this way, the guide plate can spray coolant to the center of the cutting area and the silicon ingot, and accurately cool the silicon ingot and the cutting position. (3) In this invention, the flow rate of coolant is automatically increased after the guide plate flips up, avoiding the problem that the flow rate of coolant slows down after the angle between the guide plate and the horizontal plane is reduced, and also improving the cooling effect on the inside of silicon ingot. Attached Figure Description

[0015] The invention will now be further described with reference to the accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the structure of the guide roller in this invention; Figure 3 This is a schematic diagram of the splitter wheel assembly in this invention; Figure 4 This is a schematic diagram of the flow guide plate in this invention; Figure 5 In this invention Figure 4 A magnified schematic diagram of the structure at point A; Figure 6 This is a schematic diagram of the transmission component in this invention; Figure 7 This is a structural schematic diagram of the contact state between the lifting plate and the movable block in this invention; Figure 8 In this invention Figure 7 A magnified schematic diagram of the structure at point B; Figure 9 This is a schematic diagram of the guide plate in the flip-up state in this invention; Figure 10 This is a schematic diagram of the structure of the magnetic block in this invention.

[0017] In the diagram: 1. Base; 2. Crystal holder fixing frame; 3. Crystal holder; 4. Wire roller; 5. Pressure roller; 6. Transition roller; 7. Height transition roller; 8. Vertical transition roller; 9. Horizontal transition roller; 10. Wire separating roller group; 11. Wire guide roller; 12. Collection box; 13. Cutting line; 14. Liquid box; 1401. Box body; 1402. Injection chamber; 1403. Infusion tube; 1404. Overflow chamber; 1405. Partition plate; 1406. Overflow plate; 15. Guide plate; 16. Transmission assembly; 1601. Positioning rod; 1602 1603. Lifting plate; 1604. Rotating shaft; 1605. Transmission rod; 1606. Guide rod; 1607. Arc groove; 1608. Movable block; 1609. First rack; 1610. Gear; 1611. Second rack; 1612. Connecting rod; 1613. Magnetic block; 1614. Vertical groove; 17. Splash-proof assembly; 1701. Fixed cover plate; 1702. Movable cover plate; 1703. Connecting block; 1704. Folding plate; 1705. Storage slot; 18. Pressurization box; 19. Sealing plate; 20. Drainage plate. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figures 1-10 As shown, the present invention is a silicon wafer cutting device for silicon electrode production, comprising: A base 1 is provided with a crystal tray fixing frame 2 slidably mounted on it and a drive source for driving the crystal tray fixing frame 2 to rise and fall. A crystal tray 3 is detachably mounted on the crystal tray fixing frame 2, and a silicon ingot is bonded to the bottom of the crystal tray 3. The base 1 is provided with a wire feeding assembly, a wire taking assembly and a cutting cavity. The wire guide rollers 11 are symmetrically arranged and rotatably installed in the cutting cavity and driven to rotate by the output source. Two wire splitting wheel sets 10 are also installed in the cutting cavity. The cutting wire 13 output by the wire feeding assembly is wound around the two wire guide rollers 11 after passing through the wire splitting wheel sets 10, and then output from the cutting cavity and is wound up by the wire take-up assembly. A collection box 12 is slidably mounted on the base 1 and located between two guide rollers 11. The collection box 12 is located below the cutting area and has an open top. Liquid tank 14 is fixed to the base 1, and a guide plate 15 is rotatably mounted on its outlet. The guide plate 15 is arranged facing the cutting line 13 on the guide roller 11. There are two liquid tanks 14, which are symmetrically arranged and located on both sides of the cutting area. The transmission assembly 16 is mounted on the base 1 and connected to the crystal holder fixing frame 2; when the crystal holder fixing frame 2 descends, the transmission assembly 16 drives the guide plate 15 to flip.

[0020] The wire feeding assembly includes a wire roller 4, a pressure roller 5, a transition roller 6, a height transition roller 7, a vertical transition roller 8, and a horizontal transition roller 9, all mounted on the base 1. The wire take-up assembly is symmetrically arranged with the wire feeding assembly and has the same structure. The wire feeding assembly and the wire take-up assembly are located on opposite sides of the wire guide roller 11. In actual use, the parameters of the above structure are adjusted. The wire roller 4 of the wire feeding assembly unwinds the cutting wire 13, which then winds onto the pressure roller 5, then onto the transition roller 6, and finally onto the height transition roller 7. The height transition roller 7 is connected to a hydraulic cylinder, and its height... The cutting line 13 is adjustable. Then, it winds around the vertical transition wheel 8, then around the horizontal transition wheel 9, and then around the splitting wheel group 10. The splitting wheel group 10 includes two sets of splitting wheels arranged at equal intervals, and the splitting wheels are located below the guide roller 11. After being guided by the splitting wheel group 10, the cutting line 13 winds around the guide roller 11 and is arranged in parallel between multiple turns of the cutting line 13 on the two guide rollers 11. Then, the cutting line 13 passes through the horizontal transition wheel 9, vertical transition wheel 8, height transition wheel 7, transition wheel 6, and pressure wheel 5 of the take-up assembly in sequence, and is finally wound up by the wire roller 4 of the take-up assembly. The collection box 12 is equipped with a high-resolution filter and a low-resolution filter. The high-resolution filter is made of a flexible material, and its mesh diameter is larger than that of the low-resolution filter. The collection box 12 is located below the low-resolution filter and is connected to the drain pipe. In actual use, the cut silicon wafers fall onto the high-resolution filter and are intercepted. Coolant and cutting debris pass through the mesh of the high-resolution filter and fall onto the low-resolution filter. The coolant passes through the mesh of the low-resolution filter and is collected in the cavity below the low-resolution filter in the collection box 12, while the cutting debris remains on the low-resolution filter. Each liquid box 14 has a guide plate 15 at its outlet, and each guide plate 15 is connected to a transmission assembly 16. The two guide plates 15 and the two transmission assemblies 16 are symmetrically arranged.

[0021] In one embodiment, the driving source can be a hydraulic cylinder, a pneumatic cylinder, or other mechanisms capable of linear motion. This embodiment does not impose specific limitations on these components. The output source can be a motor assembly, a gear assembly or a pulley assembly driven by a motor. This embodiment does not impose specific limitations on these components. The crystal holder fixing frame 2 and the crystal holder 3 can be connected by threads or bolts. This will not be elaborated upon here.

[0022] In practical application, the cutting wire 13 is unwound by the unwinding assembly. After passing through the wire separating wheel group 10, the cutting wire 13 is wound around two guide rollers 11, with the cutting wires 13 on the two guide rollers 11 arranged in parallel. After exiting the cutting cavity, the cutting wire 13 is wound up by the take-up assembly. Coolant is discharged from the outlet of the liquid box 14 and flows through the guide plate 15 to the cutting wire 13 on the guide rollers 11, bonding the silicon ingot to the bottom of the crystal tray 3. The crystal tray 3 is then installed on the crystal tray fixing frame 2. Subsequently, the drive source drives the crystal tray fixing frame 2 to descend. When the silicon ingot contacts the cutting wire 13 on the guide rollers 11, the silicon... The ingot is cut into silicon wafers, and the silicon wafers fall into the collection box 12. During the descent of the crystal support frame 2, it drives the guide plate 15 to flip through the transmission component 16. When the silicon ingot is partially cut, the guide plate 15 flips upward, which can allow coolant to flow out of the silicon ingot and the center of the cutting area. In this way, the guide plate 15 can be automatically adjusted to flip upward after the cutting has been carried out for a period of time to adjust the flow direction of the coolant, so that the coolant can cool the silicon ingot and the center of the cutting area, avoiding the problem of uneven temperature distribution inside the silicon ingot leading to the formation of microcracks at grain boundaries or defects.

[0023] like Figures 1-9 As shown, in a preferred embodiment of the present invention, the liquid cartridge 14 includes: A box body 1401 is fixed to a base 1, and a partition 1405 is fixed inside it. The inner cavity of the box body 1401 is divided into an injection chamber 1402 and an overflow chamber 1404 by the partition 1405. There is a gap between the bottom of the partition 1405 and the bottom plate of the box body 1401. The injection chamber 1402 is connected to an infusion tube 1403, and the injection chamber 1402 communicates with the overflow chamber 1404. An overflow plate 1406 is fixed to the box body 1401 and is arranged at an angle. The top of the overflow plate 1406 is connected to the opening at the top of the overflow cavity 1404, and its bottom is rotatably connected to the guide plate 15.

[0024] In one embodiment, the infusion tube 1403 is equipped with a flow valve, which can stably and uniformly input coolant into the injection chamber 1402; the injection chamber 1402 and the overflow chamber 1404 communicate through the gap between the bottom of the partition 1405 and the bottom plate of the box 1401.

[0025] In practical application, after the infusion tube 1403 inputs coolant into the injection chamber 1402, the liquid levels in the injection chamber 1402 and the overflow chamber 1404 rise synchronously. When the overflow chamber 1404 is full, the coolant flows through its opening to the overflow plate 1406, then along the overflow plate 1406 to the guide plate 15, and finally flows through the guide plate 15 to the cutting line 13.

[0026] like Figures 3-10 As shown, in a preferred embodiment of the present invention, the transmission assembly 16 includes: The positioning rod 1601 is fixed on the crystal support bracket 2, and a lifting plate 1602 is fixed at its bottom; A rotating shaft 1603 is rotatably mounted on the base 1 and rotatably connected to the bottom of the overflow plate 1406, and the rotating shaft 1603 is fixedly connected to the guide plate 15; and The transmission rod 1604 has one end fixedly connected to the rotating shaft 1603, and the other end is rotatably mounted with a movable block 1607. The movable block 1607 is slidably mounted on the base 1, and the two are elastically connected. The position of the movable block 1607 interferes with the movement path of the lifting plate 1602. When the lifting plate 1602 descends to contact the movable block 1607, the lifting plate 1602 continues to descend, driving the movable block 1607 to descend. The movable block 1607 then drives the rotating shaft 1603 to rotate through the transmission rod 1604, so that the guide plate 15 flips upward.

[0027] It should be noted that the top of the rotating shaft 1603 is higher than the top surface of the overflow plate 1406. When the coolant on the overflow plate 1406 flows to the guide plate 15, it needs to pass over the top of the rotating shaft 1603 to slow down the flow and ensure that the coolant flows steadily and uniformly to the cutting line 13 for cooling, avoiding the problem of silicon wafer displacement or surface damage caused by excessive flow rate or pressure.

[0028] In one embodiment, the movable block 1607 and the seat 1 can be connected by a spring or by other elastic structures such as a spring sheet, which will not be elaborated here.

[0029] In practical application, in the initial state, there is a gap between the lifting plate 1602 and the movable block 1607, and the gap is greater than the distance between the bottom surface of the silicon ingot on the crystal tray 3 and the cutting line 13 on the guide roller 11. At this time, the extension direction of the guide plate 15 and the extension direction of the overflow plate 1406 are arranged collinearly. When the crystal tray fixing frame 2 descends, the lifting plate 1602 descends synchronously. When the silicon ingot contacts the cutting line 13, the cutting line 13 can cut it. After the cutting has been performed for a period of time, the lifting plate 1602 descends. When the crystal support holder 2 continues to descend to continue cutting, the continued descent of the lifting plate 1602 can press down on the movable block 1607. The movable block 1607 then drives the rotating shaft 1603 to rotate through the transmission rod 1604, causing the guide plate 15 to flip upward. This allows the guide plate 15 to spray coolant onto the center of the cutting area and the silicon ingot, precisely cooling the silicon ingot and the cutting position, thus avoiding the problem of uneven temperature distribution inside the silicon ingot leading to microcracks at grain boundaries or defects.

[0030] like Figures 7-8 As shown, in a preferred embodiment of the present invention, a guide rod 1605 is fixed on the rotating shaft 1603, and the guide rod 1605 slides in conjunction with the arc-shaped groove 1606 opened on the seat 1.

[0031] It should be noted that when the lifting plate 1602 is lowered to the lowest position, the guide rod 1605 slides to the end of the arc groove 1606.

[0032] In one embodiment, the end of the guide rod 1605 located within the arc-shaped groove 1606 is provided with a locking block, and the locking block is slidably engaged with the arc-shaped groove 1606.

[0033] In practical application, during the process of the lifting plate 1602 pressing down the movable block 1607 to drive the rotating shaft 1603 to rotate, the sliding engagement of the guide rod 1605 and the arc groove 1606 can guide the rotation of the rotating shaft 1603, ensuring that the flipping of the guide plate 15 will not deviate from the preset path.

[0034] like Figures 2-10 As shown, in a preferred embodiment of the present invention, a pressure box 18 is fixed on the base 1 and is located above the box body 1401. The pressure box 18 has an outlet on the side near the guide plate 15, and a sealing plate 19 is slidably installed at the outlet. The sealing plate 19 is connected to the transmission assembly 16. An inclined guide plate 20 is fixed at the bottom of the pressure box 18. The top of the guide plate 20 is connected to the outlet, and its bottom is arranged facing the guide plate 15. When the lifting plate 1602 descends and drives the guide plate 15 to flip upward, the transmission assembly 16 drives the sealing plate 19 to rise so that the outlet switches to a flow state, and the coolant in the pressure box 18 flows to the guide plate 15.

[0035] The sealing plate 19 has a magnetic strip fixed inside it, and the transmission assembly 16 also includes: The first rack 1608 is fixed on the lifting plate 1602; Gear 1609 is rotatably mounted on housing 1401, on which a second rack 1610 is slidably mounted. Both the first rack 1608 and the second rack 1610 mesh with gear 1609, with gear 1609 positioned between them. The magnetic block 1612 is attracted to the magnetic strip and slides in a groove 1613 on the outer wall of the pressure chamber 18. The magnetic block 1612 is fixedly connected to the second rack 1610 via a connecting rod 1611.

[0036] It should be noted that when the lifting plate 1602 descends to abut against the movable block 1607, there is still a gap between the first rack 1608 and the gear 1609; before the lifting plate 1602 descends to the lowest position, the first rack 1608 descends to mesh with the gear 1609; when the lifting plate 1602 descends to the lowest position, the first rack 1608 descends to its lowest position, and the magnetic block 1612 rises to the top of the vertical groove 1613.

[0037] In practical application, in the initial state, the sealing plate 19 is located at the lowest point of its movement path, at which point it completely blocks the opening of the pressurization box 18.

[0038] When the lifting plate 1602 descends to contact the first rack 1608 and the gear 1609, as the lifting plate 1602 continues to descend, the first rack 1608 continues to descend and drives the gear 1609 to rotate. Then, the second rack 1610 on the other side of the gear 1609 rises, and then the magnetic block 1612 rises through the connecting rod 1611. Under the action of magnetic attraction, the sealing plate 19 can rise, and the opening of the pressure box 18 switches to the flow state. The coolant inside can pass through the opening and flow along the guide plate 20 to the guide plate 15. In this way, the guide plate 15 can automatically increase the flow rate of coolant after it flips up, avoiding the problem of the coolant flow rate slowing down after the angle between the guide plate 15 and the horizontal plane narrows. It can also improve the cooling effect inside the silicon ingot.

[0039] like Figures 2-10 As shown, in a preferred embodiment of the present invention, the liquid box 14 is provided with a splash-proof component 17.

[0040] In one embodiment, the splash-proof component 17 includes: A fixed baffle 1701 is fixed to both sides of the box body 1401, and its top is higher than the opening of the box body 1401 and the top of the overflow plate 1406. A storage groove 1705 is provided at the end of the fixed baffle 1701 near the guide plate 15; and The movable baffle 1702 is fixed on both sides of the guide plate 15, and a connecting block 1703 is fixed at the end of the baffle 1701 near the fixed baffle 1701. The connecting block 1703 is connected to the inner wall of the storage groove 1705 through the folding plate 1704.

[0041] In practical applications, this embodiment, in its initial state, is as follows: Figure 6 As shown, the folding plate 1704 is in the unfolded state at this time; when the guide plate 15 flips upward, the movable baffle 1702 flips synchronously, and the connecting block 1703 flips synchronously and moves towards the storage groove 1705, and the folding plate 1704 gradually retracts and folds; when the guide plate 15 flips to the end of its movement path, it still has an angle with the horizontal direction and its bottom is still below the overflow plate 1406. At this time, the connecting block 1703 and the folding plate 1704 are both stored in the storage groove 1705, so as to prevent the coolant from spreading and achieve the same anti-splash effect when and after flipping.

[0042] Please see Figures 1-10 As shown, the present invention provides a silicon wafer cutting method for silicon electrode production. The method is applied to the silicon wafer cutting apparatus for silicon electrode production as described in the above embodiments, and includes the following steps: Step S1: The cutting wire 13 output by the wire feeding assembly is wound onto two wire separating roller groups 10, then onto two guide rollers 11, and finally wound up by the wire taking-up assembly; Step S2: Coolant is discharged from the outlet of liquid box 14 and flows through guide plate 15 to the cutting line 13 on guide roller 11; Step S3: Attach the silicon ingot to the bottom of the crystal tray 3, and then install the crystal tray 3 on the crystal tray fixing frame 2; Step S4: The driving source drives the crystal holder 2 to descend. When the silicon ingot contacts the cutting line 13 on the wire roller 11, the silicon ingot is cut into a silicon wafer, and the silicon wafer falls into the collection box 12. Step S5: During the descent of the crystal holder 2, it drives the guide plate 15 to flip through the transmission component 16, so that when the silicon ingot is partially cut, the guide plate 15 flips upward, which can allow coolant to flow out of the silicon ingot and the center of the cutting area.

[0043] Working principle of the invention: The above embodiments of the invention provide a silicon wafer cutting device and method for silicon electrode production. A cutting wire 13 is unwound by a wire feeding assembly. After passing through a wire separating wheel group 10, the cutting wire 13 is wound onto two guide rollers 11, with the cutting wires 13 arranged in parallel on the two guide rollers 11. After exiting the cutting cavity, the cutting wire 13 is wound up by a wire take-up assembly. Coolant is discharged from the outlet of the liquid box 14 and flows through a guide plate 15 onto the cutting wire 13 on the guide rollers 11, bonding the silicon ingot to the bottom of the crystal holder 3. The crystal holder 3 is then installed on the crystal holder fixing frame 2. Subsequently, a drive source drives the crystal holder fixing frame 2 to descend. When the silicon ingot contacts... When the silicon ingot is cut into a silicon wafer by the cutting line 13 on the guide roller 11, the silicon wafer falls into the collection box 12. During the descent of the crystal support frame 2, it drives the guide plate 15 to flip through the transmission component 16. When the silicon ingot is partially cut, the guide plate 15 flips upward, which can allow coolant to flow out of the silicon ingot and the center of the cutting area. This can automatically adjust the guide plate 15 to flip upward after a period of cutting to adjust the flow direction of the coolant, so that the coolant can cool the silicon ingot and the center of the cutting area, avoiding the problem of uneven temperature distribution inside the silicon ingot leading to the formation of microcracks at grain boundaries or defects.

[0044] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A silicon wafer cutting apparatus for silicon electrode production, characterized in that, include: The base (1) has a crystal tray fixing frame (2) slidably mounted on it and a drive source for driving the crystal tray fixing frame (2) to rise and fall. The crystal tray fixing frame (2) has a crystal tray (3) detachably mounted on it, and a silicon ingot is bonded to the bottom of the crystal tray (3). The base (1) is provided with a wire feeding assembly, a wire taking assembly and a cutting cavity. The wire guide roller (11) is rotatably installed in the cutting cavity by two symmetrically arranged wire guide rollers (11) and driven to rotate by the output source. Two wire splitting wheel sets (10) are also installed in the cutting cavity. The cutting wire (13) output by the wire feeding assembly is wound around the two wire guide rollers (11) after passing through the wire splitting wheel sets (10), and then output from the cutting cavity and wound up by the wire take-up assembly. A collection box (12) is slidably mounted on a base (1) and located between two guide rollers (11). The collection box (12) is located below the cutting area and has an open top. Liquid boxes (14) are fixed to the base (1), and a guide plate (15) is rotatably mounted on the liquid outlet of the liquid box. The guide plate (15) is arranged facing the cutting line (13) on the guide roller (11). There are two liquid boxes (14), and the two liquid boxes (14) are symmetrically arranged and located on both sides of the cutting area, respectively. The transmission assembly (16) is mounted on the base (1) and connected to the crystal holder fixing frame (2); when the crystal holder fixing frame (2) descends, the transmission assembly (16) drives the guide plate (15) to flip.

2. The silicon wafer cutting apparatus for silicon electrode production according to claim 1, characterized in that, The liquid container (14) includes: A box body (1401) is fixed to a base (1), and a partition (1405) is fixed inside it. The inner cavity of the box body (1401) is divided into an injection chamber (1402) and an overflow chamber (1404) by the partition (1405). There is a gap between the bottom of the partition (1405) and the bottom plate of the box body (1401). The injection chamber (1402) is connected to an infusion tube (1403), and the injection chamber (1402) is connected to the overflow chamber (1404). An overflow plate (1406) is fixed on the box body (1401) and arranged at an angle. The top of the overflow plate (1406) is connected to the opening at the top of the overflow cavity (1404), and its bottom is rotatably connected to the guide plate (15).

3. The silicon wafer cutting apparatus for silicon electrode production according to claim 2, characterized in that, The transmission assembly (16) includes: The positioning rod (1601) is fixed on the crystal support bracket (2), and a lifting plate (1602) is fixed at its bottom. A rotating shaft (1603) is rotatably mounted on a base (1) and rotatably connected to the bottom of an overflow plate (1406), and the rotating shaft (1603) is fixedly connected to a guide plate (15); and The transmission rod (1604) has one end fixedly connected to the rotating shaft (1603) and the other end rotatably mounted with a movable block (1607). The movable block (1607) is slidably mounted on the seat (1) and the two are elastically connected. The position of the movable block (1607) interferes with the movement path of the lifting plate (1602). When the lifting plate (1602) descends to contact the movable block (1607), the lifting plate (1602) continues to descend, driving the movable block (1607) to descend. Then the movable block (1607) drives the rotating shaft (1603) to rotate through the transmission rod (1604), so that the guide plate (15) flips upward.

4. The silicon wafer cutting apparatus for silicon electrode production according to claim 3, characterized in that, A guide rod (1605) is fixed on the rotating shaft (1603), and the guide rod (1605) slides in conjunction with the arc groove (1606) opened on the seat (1).

5. A silicon wafer cutting apparatus for silicon electrode production according to claim 3, characterized in that, A pressure box (18) is fixed on the seat (1), and the pressure box (18) is located above the box body (1401). The pressure box (18) has an outlet on the side near the guide plate (15), and a sealing plate (19) is slidably installed at the outlet. The sealing plate (19) is connected to the transmission assembly (16). A diverting plate (20) is fixed at the bottom of the pressure box (18). The top of the diverting plate (20) is connected to the outlet, and its bottom is arranged facing the guide plate (15). When the lifting plate (1602) descends and drives the guide plate (15) to flip upward, the transmission assembly (16) drives the sealing plate (19) to rise so that the outlet switches to the flow state, and the coolant in the pressure box (18) flows to the guide plate (15).

6. The silicon wafer cutting apparatus for silicon electrode production according to claim 5, characterized in that, The sealing plate (19) has a magnetic strip fixed inside, and the transmission assembly (16) further includes: The first rack (1608) is fixed to the lifting plate (1602); A gear (1609) is rotatably mounted on a housing (1401), on which a second rack (1610) is slidably mounted. Both the first rack (1608) and the second rack (1610) mesh with the gear (1609), with the gear (1609) positioned between them; and The magnetic block (1612) is attracted to the magnetic strip and slides in a vertical groove (1613) on the outer wall of the pressure box (18). The magnetic block (1612) is fixedly connected to the second rack (1610) through a connecting rod (1611).

7. A silicon wafer cutting apparatus for silicon electrode production according to claim 3, characterized in that, The liquid tank (14) is provided with a splash-proof component (17).

8. A silicon wafer cutting apparatus for silicon electrode production according to claim 7, characterized in that, The splash-proof component (17) includes: A fixed baffle (1701) is fixed to both sides of the box body (1401), and its top is higher than the opening of the box body (1401) and the top of the overflow plate (1406). A storage groove (1705) is provided at the end of the fixed baffle (1701) near the guide plate (15); and The movable baffle (1702) is fixed on both sides of the guide plate (15), and a connecting block (1703) is fixed at the end of the baffle (1701) near the fixed baffle (1701). The connecting block (1703) is connected to the inner wall of the storage groove (1705) through the folding plate (1704).

9. A method for cutting silicon wafers for silicon electrode production, characterized in that, The method is applied to a silicon wafer dicing apparatus for silicon electrode production as described in any one of claims 1-8 above, and the method includes the following steps: Step S1: The cutting wire (13) output by the wire feeding assembly is wound onto two wire splitting rollers (10), then onto two wire guide rollers (11), and finally wound up by the wire take-up assembly; Step S2: Coolant is discharged from the outlet of the liquid box (14) and flows through the guide plate (15) to the cutting line (13) on the guide roller (11); Step S3: Attach the silicon ingot to the bottom of the crystal tray (3), and then install the crystal tray (3) on the crystal tray fixing frame (2); Step S4: The driving source drives the crystal holder (2) to descend. When the silicon ingot contacts the cutting line (13) on the wire roller (11), the silicon ingot is cut to form a silicon wafer, and the silicon wafer falls into the collection box (12). Step S5: During the descent of the crystal holder (2), it drives the guide plate (15) to flip through the transmission component (16), so that when the silicon ingot is partially cut, the guide plate (15) flips upward, and coolant flows out to the center of the silicon ingot and the cutting area.

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