Curable resin composition and printed circuit board

By mixing carboxyl-containing resin, inorganic filler, and photopolymerization initiator with oxime ester bonds in a specific ratio, a curable resin composition is formed and used in printed circuit boards. This solves the problem of sensitivity decreasing over time and enables printed circuit boards with high-precision patterns and high reliability.

CN122145992APending Publication Date: 2026-06-05TAMURA KK
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TAMURA KK
Filing Date
2025-12-03
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

The problem of decreased sensitivity over time in curable resin compositions containing inorganic fillers of alkaline earth metals and photopolymerization initiators with oxime ester bonds.

Method used

Liquid A is mixed with liquid B. Liquid A contains a carboxyl-containing resin and an inorganic filler, while liquid B contains an epoxy compound and a photopolymerization initiator with oxime ester bonds. The specific component ratio is carboxyl-containing resin: inorganic filler: photopolymerization initiator with oxime ester bonds = 50:5:0.05~50:100:6. This curable resin composition is used to form a cured printed circuit board.

Benefits of technology

It improves the sensitivity and stability of the cured material of printed circuit boards to the effects of years, enables the formation of high-precision patterns, and enhances the adhesion and deep curing of the bonded materials.

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Abstract

Provided are a curable resin composition and a printed circuit board, specifically a curable resin composition capable of using an inorganic filler containing an alkaline earth metal and a photopolymerization initiator having an oxime ester bond in combination, and a printed circuit board having a cured product of the curable resin composition, and in which a decrease in sensitivity caused by aging is less likely to occur. A curable resin composition obtained by mixing a liquid A containing a carboxyl group-containing resin (A) and an inorganic filler (B) with a liquid B containing an epoxy compound (C) and a photopolymerization initiator having an oxime ester bond (D), wherein the inorganic filler (B) contains an inorganic filler containing an alkaline earth metal (B-1).
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