Epoxy resin encapsulating adhesive with high bonding strength, preparation method and application thereof
By adding cyanate ester resin to epoxy encapsulant to form an interpenetrating network, the problem of insufficient adhesion of epoxy resin to recycled PPA plastic is solved, achieving improved high bonding strength and hermeticity, making it suitable for LED encapsulation.
CN122146206APending Publication Date: 2026-06-05BEIJING KMT TECH
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING KMT TECH
- Filing Date
- 2026-02-04
- Publication Date
- 2026-06-05
Smart Images
Figure SMS_1
Abstract
The present application relates to the field of LED packaging material, in particular to a kind of high bonding strength epoxy resin packaging glue, preparation method and application.The present application provides a kind of epoxy resin packaging glue, epoxy resin packaging glue includes component A and component B, component A includes the following weight parts of component: epoxy resin 100 parts, antioxidant 0.01~5 parts, filler 1~100 parts, cyanate ester resin 1~100;Component B includes the following weight parts of component: anhydride 100 parts, accelerator 0.01~10 parts and coupling agent 0.01~5 parts.The present application adds cyanate ester resin in epoxy resin packaging glue, can significantly improve the bonding performance of epoxy resin packaging glue.
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