Preparation method of anti-radiation hot melt adhesive

Abstract

The application belongs to the technical field of hot melt adhesives, and particularly relates to a preparation method of an anti-radiation hot melt adhesive. The preparation method of the anti-radiation hot melt adhesive is as follows: 70-80 parts of bio-based dimer acid type polyamide, 8-10 parts of functional polypropylene are melt blended according to weight parts, then 3-5 parts of silane propylene-based biphenylimidazole and 1-2 parts of an antioxidant are added for continuous stirring to obtain premix, the premix is added into a double-screw extruder for melt extrusion, cooling, and the anti-radiation hot melt adhesive is obtained. The anti-radiation hot melt adhesive provided by the application has good tensile strength, elongation at break and shear strength, especially excellent anti-radiation performance, no obvious aging and yellowing, and can meet the long-term stable use requirements of integrated circuit modules in a radiation environment.

Description

Technical Field

[0001] This invention belongs to the field of hot melt adhesive technology, and specifically relates to a method for preparing an anti-radiation hot melt adhesive. Background Technology

[0002] Integrated circuit modules are the core of modern electronic systems. They integrate miniature components such as resistors, capacitors, inductors, diodes, and transistors onto a tiny wafer (usually silicon) using semiconductor technology, and then encapsulate them in a protective shell using hot melt adhesive to form a unit with a specific function. Hot melt adhesive is mainly used for structural fixation, sealing protection, wire reinforcement, and temporary bonding. Commonly used types of hot melt adhesives include polyolefin hot melt adhesives, polyamide hot melt adhesives, polyurethane hot melt adhesives, and ethylene-vinyl acetate adhesives. Among them, polyamide hot melt adhesives have excellent high-temperature resistance. Its chemical and oil resistance, as well as electrical insulation properties, make it widely used in integrated circuit packaging and electronic assembly. When integrated circuit modules are used in special fields such as aerospace and nuclear industry, they need to be exposed to radiation environments such as gamma rays and electron beams for a long time. The hot melt adhesive used for packaging must have excellent radiation resistance, and at the same time, it must meet the requirements of high bonding strength, fast curing speed, solvent-free and environmentally friendly, and good compatibility with chip substrates. This is to prevent molecular chain breakage, aging and yellowing after irradiation, which would lead to a significant decrease in bonding strength or even delamination, and thus fail to meet the requirements of long-term stable operation of integrated circuit modules.

[0003] Chinese Patent Application No. CN202211481364.7 discloses a polyamide hot melt adhesive, its preparation method, and its application. The raw materials for preparing the polyamide hot melt adhesive include the following components: 600-700 parts of diacid, 20-80 parts of diamine, 100-500 parts of polyetheramine, 10-50 parts of aminosulfonic acid, 10-50 parts of silicone oil, 20-200 parts of resin, 10-40 parts of antioxidant, 2-20 parts of catalyst, and 10-40 parts of colorant. This polyamide hot melt adhesive significantly improves the adhesion, hardness, and resilience of hot melt adhesives, making it suitable for injection molding processes and enabling the processing of sensitive electronic components. The patent application CN202410620085.7 discloses a copolyamide hot melt adhesive and its preparation method. It uses a condensation polymerization reaction to polycondense a diacid and a diamine to form a polyamide resin. Amino acids, tackifying resins, and antioxidants are added to the polyamide resin, and the mixture is heated and stirred to obtain the copolyamide hot melt adhesive. The resulting polyamide resin has high purity, improving the performance and stability of the copolyamide hot melt adhesive. While the polyamide hot melt adhesive provided by the aforementioned patent meets the basic performance requirements of encapsulation hot melt adhesives, its radiation resistance is poor, failing to meet the requirements for encapsulation hot melt adhesives for integrated circuit modules in special fields. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a method for preparing an anti-radiation hot melt adhesive. The anti-radiation hot melt adhesive provided by this invention comprises bio-based dimer acid polyamide, functional polypropylene, silane-propylene-bibenzamide, and an antioxidant. The anti-radiation hot melt adhesive has good tensile strength, elongation at break, and shear strength, and is particularly excellent in radiation resistance, with no obvious aging or yellowing, thus meeting the long-term stable use requirements of integrated circuit modules under irradiation environments.

[0005] The technical solution adopted by the present invention to achieve the above objectives is as follows: A method for preparing a radiation-resistant hot melt adhesive, characterized by comprising the following steps: S1. Weigh out 70-80 parts by weight of bio-based dimer acid type polyamide, 8-10 parts by weight of functional polypropylene, 3-5 parts by weight of silane-propylene-bibenzimidazole, and 1-2 parts by weight of antioxidant for later use. S2. Add bio-based dimer polyamide and functional polypropylene to a high-speed mixer, melt-blend, then add silane-propylene-bibenzamide and antioxidant, and continue stirring for 20-30 minutes to obtain a premix. S3. Add the premixed material to a twin-screw extruder, melt-extrude, and cool to obtain radiation-resistant hot melt adhesive.

[0006] Further, the antioxidant mentioned in step S1 is any one or a mixture of several of antioxidant 1010, antioxidant 168, and antioxidant 1076.

[0007] Furthermore, the melt blending temperature in step S2 is 180-200℃, and the time is 30-40 min.

[0008] Furthermore, the melt extrusion temperature in step S3 is 210-230°C.

[0009] Furthermore, the preparation method of the functional polypropylene is as follows: add polypropylene to xylene solution, stir to swell, add functional nano silicon nitride and dicumyl peroxide, place at 110-120℃, stir and react for 3-4 hours to obtain functional polypropylene.

[0010] Furthermore, the mass ratio of the polypropylene, functional nano-silicon nitride, and dicumyl peroxide is 1:0.1-0.2:0.008-0.01.

[0011] Furthermore, the preparation method of the functional nano silicon nitride is as follows: disperse nano silicon nitride in a 50-60% ethanol aqueous solution, add silanepropenylbibenzamide, stir evenly, adjust the pH of the solution to 6-6.5, place at 50-60℃, and stir for 4-5 hours to obtain functional nano silicon nitride.

[0012] Furthermore, the mass ratio of the nano-silicon nitride to silanepropenylbibenzamide is 1:0.08-0.1.

[0013] Furthermore, the preparation method of the silanepropenylbibenzimidazole is as follows: A1. Add 4-bromo-2-isopropyl-1H-imidazole, 3-chloropropene and triethylamine to acetonitrile solution, stir well, place at 50-60℃, stir and react for 4-5 hours, then add benzidine, raise the temperature to 70-75℃, and continue stirring and reacting for 3-4 hours to obtain propenyl benzidine. A2. Add propenyl bifenimazole and triethylamine to anhydrous tetrahydrofuran solution, stir well, and slowly add 3-chloropropyltrimethoxysilane dropwise under nitrogen protection. After the addition is complete, place at 40-50℃ and stir for 5-6 hours to obtain silane propenyl bifenimazole.

[0014] Further, the molar ratio of 4-bromo-2-isopropyl-1H-imidazolium, 3-chloropropene, benzidine, and triethylamine in step A1 is 1:1.1-1.2:0.4-0.5:1.6-1.8.

[0015] Further, the molar ratio of propenyl bibenzamide, 3-chloropropyltrimethoxysilane, and triethylamine in step A2 is 1:2.1-2.2:1.3-1.5.

[0016] The present invention has the following beneficial effects: This invention prepares a silanepropenylbiphenylimidazolium containing siloxane bonds, a biphenyl structure, an isopropylimidazolium structure, and a propenyl group by reacting 4-bromo-2-isopropyl-1H-imidazolium with 3-chloropropene, benzidine, and 3-chloropropyltrimethoxysilane in sequence. Then, the silanepropenylbiphenylimidazolium is grafted onto the surface of nano-silicon nitride through a reaction of the siloxane bonds, thus preparing functional nano-silicon nitride. Finally, the propenyl groups on the surface of the functional nano-silicon nitride react with polypropylene to graft the functional nano-silicon nitride onto the polypropylene molecular chain. The silanepropenylbiphenylimidazolium prepared by this invention contains siloxane bonds, a biphenyl structure, and an isopropylimidazolium structure. The siloxane bonds enable it to act as a silane coupling agent, improving the performance of bio-based dimer acid polymers. The bonding force and compatibility between amides and functional polypropylene contribute to obtaining hot melt adhesives with good overall performance. The functional polypropylene prepared in this invention has nano-silicon nitride, biphenyl structures, and isopropyl imidazole structures grafted onto its polypropylene molecular chains. Nano-silicon nitride has good radiation resistance and exhibits excellent structural stability and mechanical property retention under various high-energy radiation environments, which can enhance the radiation resistance of the hot melt adhesive. The grafted biphenyl and isopropyl imidazole structures have stable conjugated systems, which improve the structural stability of the polypropylene molecular chains and help enhance its radiation resistance. In particular, the combined effect of the biphenyl and isopropyl imidazole structures in silanepropenylbiphenylimidazolium enhances the radiation resistance of the hot melt adhesive.

[0017] The radiation-resistant hot melt adhesive provided by this invention comprises bio-based dimer acid polyamide, functional polypropylene, silane-propylene-bibenzimidazole, and antioxidants; wherein the functional polypropylene and silane-propylene-bibenzimidazole can enhance the radiation resistance of the hot melt adhesive. The radiation-resistant hot melt adhesive provided by this invention has good tensile strength, elongation at break, and shear strength, and especially excellent radiation resistance, with no obvious aging or yellowing, which can meet the long-term stable use requirements of integrated circuit modules in irradiated environments. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The technical features designed in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] In the technical solution of this invention, all chemical reagents used are commercially available. Specifically, the bio-based dimer polyamide contains ≥70% bio-based raw materials; the polypropylene used is random copolymer polypropylene with a density of 0.85-0.95 g / cm³. 3 The melt index is 1-15 g / 10 min (230℃); antioxidant 1010 CAS No. 6683-19-8, antioxidant 168 CAS No. 31570-04-4, antioxidant 1076 CAS No. 2082-79-3, triethylamine CAS No. 121-44-8, 4-bromo-2-isopropyl-1H-imidazolium CAS No. 1256643-65-8, 3-chloropropene CAS No. 107-05-1, benzidine CAS No. 92-87-5, chloropropyltrimethoxysilane CAS No. 2530-87-2, acetonitrile CAS No. 75-05-8, tetrahydrofuran CAS No. 109-99-9, ethanol CAS No. 64-17-5, xylene CAS No. 1330-20-7.

[0020] Example 1 This embodiment provides a method for preparing silanepropenyl bibenzamide: ; A1. Add 10.0 g of 4-bromo-2-isopropyl-1H-imidazole, 4.5 g of 3-chloropropene, and 9.6 g of triethylamine to 300 mL of acetonitrile solution, stir well, and place at 50 °C for 5 h. Then add 4.4 g of benzidine, raise the temperature to 70 °C, and continue stirring for 4 h. After the reaction is complete, remove the acetonitrile solution, and extract, concentrate, and dry to obtain 9.5 g of propenyl benzidine imidazole. The molar ratio of 4-bromo-2-isopropyl-1H-imidazole, 3-chloropropene, benzidine, and triethylamine is 1:1.1:0.45:1.8. Propylene bifenimazole: ESI (m / z): 481.7 [M+H] + , 1 H-NMR (600MHz, DMSO-d6, δppm): 8.82 (s, 2H), 7.55 (d, J=8.5Hz, 4H), 7.38 (d, J=8.5Hz, 4H), 6.85 (s, 2 H), 6.07-6.10 (m, 2H), 5.32-5.36 (m, 4H), 5.10-5.14 (m, 4H), 3.18-3.23 (m, 2H), 1.24-1.30 (m, 12H); A2. Add 9.5g of propenylbibenzimidazole and 2.6g of triethylamine to 200mL of anhydrous tetrahydrofuran solution, stir well, and slowly add 8.2g of 3-chloropropyltrimethoxysilane dropwise under nitrogen protection. After the addition is complete, place the solution at 45℃ and stir for 5h. After the reaction is complete, remove the anhydrous tetrahydrofuran, remove impurities with diethyl ether, filter, and dry to obtain 13.8g of silane propenylbibenzimidazole; wherein the molar ratio of propenylbibenzimidazole, 3-chloropropyltrimethoxysilane, and triethylamine is 1:2.1:1.3. Silanepropenylbibenzamide: ESI (m / z): 806.2 [M+H] + , 1 H-NMR (600MHz, DMSO-d6, δppm): 7.56 (d, J=8.5Hz, 4H), 7.37 (d, J=8.5Hz, 4H), 6.84 (s, 2H), 6.08-6.10 (m, 2H), 5.34-5.37 (m, 4H), 5.11-5.15 (m, 4H), 3.18-3.22 (m, 2H), 3.93-3.96 (m, 4H), 3.55 (s, 18H), 1.48-1.51 (m, 4H), 1.25-1.30 (m, 12H), 0.56-0.60 (m, 4H).

[0021] Example 2 This embodiment provides a method for preparing radiation-resistant hot melt adhesive, including the following steps: S1. Weigh out 80 parts by weight of bio-based dimer acid type polyamide, 10 parts by weight of functional polypropylene, 5 parts by weight of silane-propylene-bibenzimidazole, and 1.5 parts by weight of antioxidant for later use; wherein the antioxidant is antioxidant 1010. S2. Add bio-based dimer polyamide and functional polypropylene to a high-speed mixer for melt blending. Then add silane-propylene-based bifenimazole and antioxidant, and continue stirring for 30 minutes to obtain a premix. The melt blending temperature is 200℃ and the time is 30 minutes. S3. Add the premixed material to a twin-screw extruder, melt extrude, and cool to obtain radiation-resistant hot melt adhesive; wherein the melt extrusion temperature is 220℃.

[0022] The preparation method of functional polypropylene is as follows: polypropylene is added to xylene solution, stirred and swollen, functional nano silicon nitride and dicumyl peroxide are added, and the mixture is placed at 120℃ and stirred for 3 hours. After the reaction is completed, the mixture is cooled, filtered, washed and dried to obtain functional polypropylene; wherein the mass ratio of polypropylene, functional nano silicon nitride and dicumyl peroxide is 1:0.2:0.01.

[0023] The preparation method of functional nano silicon nitride is as follows: nano silicon nitride is dispersed in 60% ethanol aqueous solution, silanepropenylbibenzamide is added, stirred evenly, the pH value of the solution is adjusted to 6.5, and the solution is placed at 50℃ and stirred for 5 hours. After the reaction is completed, the solution is filtered, washed and dried to obtain functional nano silicon nitride; wherein the mass ratio of nano silicon nitride to silanepropenylbibenzamide is 1:0.1.

[0024] Example 3 This embodiment provides a method for preparing radiation-resistant hot melt adhesive, including the following steps: S1. Weigh out 75 parts by weight of bio-based dimer acid type polyamide, 9 parts by weight of functional polypropylene, 3 parts by weight of silane-propylene-bibenzimidazole, and 1 part by weight of antioxidant for later use; wherein the antioxidant is antioxidant 168. S2. Add bio-based dimer polyamide and functional polypropylene to a high-speed mixer for melt blending. Then add silane-propylene-based bibenzamide and antioxidant, and continue stirring for 25 minutes to obtain a premix. The melt blending temperature is 190℃ and the time is 35 minutes. S3. Add the premixed material to a twin-screw extruder, melt extrude, and cool to obtain radiation-resistant hot melt adhesive; wherein the melt extrusion temperature is 230℃.

[0025] The preparation method of functional polypropylene is as follows: polypropylene is added to xylene solution, stirred and swollen, functional nano silicon nitride and dicumyl peroxide are added, and the mixture is placed at 115℃ and stirred for 3.5h. After the reaction is completed, the mixture is cooled, filtered, washed and dried to obtain functional polypropylene; wherein the mass ratio of polypropylene, functional nano silicon nitride and dicumyl peroxide is 1:0.15:0.009.

[0026] The preparation method of functional nano-silicon nitride is as follows: nano-silicon nitride is dispersed in 55% ethanol aqueous solution, silanepropenylbibenzamide is added, stirred evenly, the pH value of the solution is adjusted to 6.3, and the solution is placed at 55℃ and stirred for 4 hours. After the reaction is completed, the solution is filtered, washed and dried to obtain functional nano-silicon nitride; wherein the mass ratio of nano-silicon nitride to silanepropenylbibenzamide is 1:0.09.

[0027] Example 4 This embodiment provides a method for preparing radiation-resistant hot melt adhesive, including the following steps: S1. Weigh out 70 parts by weight of bio-based dimer acid type polyamide, 8 parts by weight of functional polypropylene, 4 parts by weight of silane-propylene-bibenzimidazole, and 2 parts by weight of antioxidant for later use; wherein the antioxidant is antioxidant 1076. S2. Add bio-based dimer polyamide and functional polypropylene to a high-speed mixer for melt blending. Then add silane-propylene-based bifenimazole and antioxidant, and continue stirring for 20 minutes to obtain a premix. The melt blending temperature is 180℃ and the time is 40 minutes. S3. Add the premixed material to a twin-screw extruder, melt extrude, and cool to obtain radiation-resistant hot melt adhesive; wherein the melt extrusion temperature is 210℃.

[0028] The preparation method of functional polypropylene is as follows: polypropylene is added to xylene solution, stirred and swollen, functional nano silicon nitride and dicumyl peroxide are added, and the mixture is placed at 110℃ and stirred for 4 hours. After the reaction is completed, the mixture is cooled, filtered, washed and dried to obtain functional polypropylene; wherein the mass ratio of polypropylene, functional nano silicon nitride and dicumyl peroxide is 1:0.1:0.008.

[0029] The preparation method of functional nano silicon nitride is as follows: nano silicon nitride is dispersed in 50% ethanol aqueous solution, silanepropenylbibenzamide is added, stirred evenly, the pH value of the solution is adjusted to 6, and the solution is placed at 60℃ and stirred for 4.5h. After the reaction is completed, the functional nano silicon nitride is obtained by filtration, washing and drying; wherein the mass ratio of nano silicon nitride to silanepropenylbibenzamide is 1:0.08.

[0030] Comparative Example 1 This embodiment provides a method for preparing radiation-resistant hot melt adhesive, including the following steps: S1. Weigh out 80 parts by weight of bio-based dimer polyamide, 10 parts by weight of functional polypropylene, and 1.5 parts by weight of antioxidant for later use; wherein the antioxidant is antioxidant 1010. S2. Add bio-based dimer polyamide and functional polypropylene to a high-speed mixer for melt blending. Then add silane-propylene-based bifenimazole and antioxidant, and continue stirring for 30 minutes to obtain a premix. The melt blending temperature is 200℃ and the time is 30 minutes. S3. Add the premixed material to a twin-screw extruder, melt extrude, and cool to obtain radiation-resistant hot melt adhesive; wherein the melt extrusion temperature is 220℃.

[0031] The preparation method of functional polypropylene is the same as that in Example 2.

[0032] Comparative Example 2 This comparative example provides a method for preparing a radiation-resistant hot melt adhesive, comprising the following steps: S1. Weigh out 80 parts by weight of bio-based dimer acid type polyamide, 10 parts by weight of polypropylene, 5 parts by weight of silane-propylene-bibenzimidazole, and 1.5 parts by weight of antioxidant for later use; wherein the antioxidant is antioxidant 1010. S2. Add bio-based dimer polyamide and functional polypropylene to a high-speed mixer for melt blending. Then add silane-propylene-based bifenimazole and antioxidant, and continue stirring for 30 minutes to obtain a premix. The melt blending temperature is 200℃ and the time is 30 minutes. S3. Add the premixed material to a twin-screw extruder, melt extrude, and cool to obtain radiation-resistant hot melt adhesive; wherein the melt extrusion temperature is 220℃.

[0033] Comparative Example 3 This comparative example provides a method for preparing a radiation-resistant hot melt adhesive, comprising the following steps: S1. Weigh out 80 parts by weight of bio-based dimer polyamide, 10 parts by weight of polypropylene, and 1.5 parts by weight of antioxidant for later use; wherein the antioxidant is antioxidant 1010. S2. Add bio-based dimer polyamide and polypropylene to a high-speed mixer, melt-blend, then add antioxidant, and continue stirring for 30 minutes to obtain a premix; wherein the melt-blending temperature is 200℃ and the time is 30 minutes. S3. Add the premixed material to a twin-screw extruder, melt extrude, and cool to obtain radiation-resistant hot melt adhesive; wherein the melt extrusion temperature is 220℃.

[0034] Performance testing The performance of the radiation-resistant hot melt adhesives provided in Examples 2 to 4 and Comparative Examples 1 to 3 was tested. The tensile strength was tested according to GB / T 7124-2008 standard; the elongation at break was tested according to GB / T 1040.3-2006 standard; the shear strength test was conducted on a chip silicon substrate, and the sample was a radiation-resistant hot melt adhesive film (12.5mm×25mm×2mm). The shear strength at 20°C was tested using an electronic universal testing machine. At the same time, the tensile strength, elongation at break, and shear strength after 100kGy γ-ray irradiation were also tested. The test results are shown in Table 1 below.

[0035] Table 1 As shown in Table 1, the radiation-resistant hot melt adhesives provided in Examples 2 to 4 of the present invention have good tensile strength, elongation at break, and shear strength. In particular, after irradiation with 100 kGy γ-rays, they can still maintain high tensile strength, elongation at break, and shear strength, without obvious aging or yellowing, indicating that the radiation-resistant hot melt adhesives provided in the present invention have excellent radiation resistance. Compared with Comparative Examples 1 to 3, the radiation-resistant hot melt adhesive provided in Example 2 of the present invention includes functional polypropylene and silane-propylene-biphenyl imidazole. The silane-propylene-biphenyl imidazole contains siloxane bonds, biphenyl structures, and isopropyl imidazole structures. The siloxane bonds enable it to act as a silane coupling agent, improving the bonding force and compatibility between bio-based dimer polyamide and functional polypropylene, which helps to obtain a hot melt adhesive with better overall performance. The functional polypropylene molecular chain is grafted with nano-silicon nitride, biphenyl structure, and isopropyl imidazole structure. Nano-silicon nitride has good radiation resistance and exhibits excellent structural stability and mechanical property retention under various high-energy radiation environments (such as electron beams, gamma rays, neutron irradiation, etc.), which can enhance the radiation resistance of hot melt adhesive. The grafted biphenyl and isopropyl imidazole structures have stable conjugated systems, which improve the structural stability of the polypropylene molecular chain and help enhance its radiation resistance. In particular, it works together with the biphenyl and isopropyl imidazole structures in silanepropenylbiphenylimidazole to enhance the radiation resistance of hot melt adhesive.

[0036] It should be noted that, in this document, terms such as “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for preparing a radiation-resistant hot melt adhesive, characterized in that, Includes the following steps: S1. Weigh out 70-80 parts by weight of bio-based dimer acid type polyamide, 8-10 parts by weight of functional polypropylene, 3-5 parts by weight of silane-propylene-bibenzimidazole, and 1-2 parts by weight of antioxidant for later use. S2. Add bio-based dimer polyamide and functional polypropylene to a high-speed mixer, melt-blend, then add silane-propylene-bibenzamide and antioxidant, and continue stirring for 20-30 minutes to obtain a premix. S3. Add the premixed material to a twin-screw extruder, melt-extrude, and cool to obtain radiation-resistant hot melt adhesive; The preparation method of the functional polypropylene in step S1 is as follows: add polypropylene to xylene solution, stir to swell, add functional nano silicon nitride and dicumyl peroxide, place at 110-120℃, stir and react for 3-4 hours to obtain functional polypropylene.

2. The method for preparing a radiation-resistant hot melt adhesive according to claim 1, characterized in that, In the preparation method of functional polypropylene, the mass ratio of polypropylene, functional nano-silicon nitride, and dicumyl peroxide is 1:0.1-0.2:0.008-0.

01.

3. The method for preparing an anti-radiation hot melt adhesive according to claim 1, characterized in that, The preparation method of silanepropenylbibenzimidazole in step S1 is as follows: A1. Add 4-bromo-2-isopropyl-1H-imidazole, 3-chloropropene and triethylamine to acetonitrile solution, stir well, place at 50-60℃, stir and react for 4-5 hours, then add benzidine, raise the temperature to 70-75℃, and continue stirring and reacting for 3-4 hours to obtain propenyl benzidine. A2. Add propenyl bifenimazole and triethylamine to anhydrous tetrahydrofuran solution, stir well, and slowly add 3-chloropropyltrimethoxysilane dropwise under nitrogen protection. After the addition is complete, place at 40-50℃ and stir for 5-6 hours to obtain silane propenyl bifenimazole.

4. The method for preparing a radiation-resistant hot melt adhesive according to claim 3, characterized in that, The molar ratio of 4-bromo-2-isopropyl-1H-imidazolium, 3-chloropropene, benzidine, and triethylamine in step A1 is 1:1.1-1.2:0.4-0.5:1.6-1.

8.

5. The method for preparing a radiation-resistant hot melt adhesive according to claim 3, characterized in that, The molar ratio of propenyl bibenzamide, 3-chloropropyltrimethoxysilane, and triethylamine in step A2 is 1:2.1-2.2:1.3-1.

5.

6. The method for preparing a radiation-resistant hot melt adhesive according to claim 1, characterized in that, In the preparation method of functional polypropylene, the preparation method of functional nano silicon nitride is as follows: disperse nano silicon nitride in 50-60% ethanol aqueous solution, add silanepropenylbibenzamide, stir evenly, adjust the pH of the solution to 6-6.5, place at 50-60℃, stir and react for 4-5 hours to obtain functional nano silicon nitride.

7. The method for preparing an anti-radiation hot melt adhesive according to claim 6, characterized in that, The mass ratio of the nano-silicon nitride to silanepropenylbibenzamide is 1:0.08-0.

1.

8. The method for preparing a radiation-resistant hot melt adhesive according to claim 1, characterized in that, The antioxidant mentioned in step S1 is any one or a mixture of antioxidant 1010, antioxidant 168, and antioxidant 1076.

9. The method for preparing a radiation-resistant hot melt adhesive according to claim 1, characterized in that, The melt blending temperature in step S2 is 180-200℃, and the time is 30-40 min.

10. The method for preparing a radiation-resistant hot melt adhesive according to claim 1, characterized in that, The melt extrusion temperature in step S3 is 210-230℃.

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