A self-toughening block copolymer underfill adhesive, a preparation method and application thereof

Abstract

The application discloses a self-toughening block copolymer underfill adhesive, a preparation method and application, and belongs to the technical field of microelectronic packaging materials. The method comprises the following steps: preparing a rigid chain segment A prepolymer; obtaining a flexible chain segment B; performing an active polymerization reaction on the rigid chain segment A prepolymer and the flexible chain segment B to obtain a block copolymer; performing purification treatment on the block copolymer to remove unreacted substances and a catalyst, thereby obtaining a self-toughening block copolymer resin; and obtaining the self-toughening block copolymer underfill adhesive from the self-toughening block copolymer resin. The application further discloses the self-toughening block copolymer underfill adhesive prepared by the above method and application thereof. The self-toughening block copolymer underfill adhesive prepared by the application can fundamentally eliminate the problems of poor compatibility, easy precipitation and viscosity increase of an external toughening agent, and has low viscosity, high T g , high toughness and excellent long-term reliability, and can be widely applied to the field of advanced semiconductor packaging.

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