Pressure sensor and electronic device
The MEMS pressure sensor design, which utilizes a stacked structure and anodic bonding, solves the problems of complex packaging, high cost, and low reliability in existing technologies, achieving miniaturization and improved reliability of the sensor.
CN122149731APending Publication Date: 2026-06-05BEIJING BOE SENSOR TECH CO LTD +2
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING BOE SENSOR TECH CO LTD
- Filing Date
- 2026-04-29
- Publication Date
- 2026-06-05
AI Technical Summary
Technical Problem
Existing MEMS pressure sensors have complex packaging, high cost, and low reliability, and are prone to breakage under vibration or impact.
Method used
A differential pressure sensor, a first substrate, and a second substrate are stacked together and connected by anodic bonding to form an absolute pressure sensor. A water-proof ring and a redistribution layer are set between the substrates to realize the electrical connection between the electronic components and the sensor.
Benefits of technology
The sensor size has been reduced, the reliability of electrical connections and waterproofing have been improved, and the problem of wire bond breakage has been avoided.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122149731A_ABST
Abstract
The application provides a pressure sensor and an electronic device, wherein the pressure sensor comprises: a differential pressure sensor, a first substrate and a second substrate which are sequentially stacked; a third substrate in the differential pressure sensor is connected with the first substrate through anode bonding to form an absolute pressure sensor; the first substrate has a first through hole penetrating a thickness direction; the second substrate has a second through hole penetrating the thickness direction, and an electronic element is arranged on a side of the second substrate away from the first substrate; and the electronic element is electrically connected with the differential pressure sensor through the second through hole and the first through hole in sequence.
Need to check novelty before this filing date? Find Prior Art