Molded coil, reactor, method for manufacturing a molded coil, and method for manufacturing a reactor
By designing the fitting groove and clamping surface of the sensor bracket, the problem of the sensor being affected by resin spraying pressure and heat during the molding coil process is solved, thereby reducing the number of parts and improving production efficiency.
CN122158320APending Publication Date: 2026-06-05TAMURA KK
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TAMURA KK
- Filing Date
- 2025-12-05
- Publication Date
- 2026-06-05
AI Technical Summary
Technical Problem
In the prior art, the sensor is prone to lead wire breakage and thermal melting caused by resin spraying pressure during the molding process, which also increases the number of parts and production steps.
Method used
The sensor bracket design features a fitting groove and a clamping surface. The fitting groove surrounds the main body of the sensor, while the clamping surface holds the sensor in place with elastic and fixed plates, ensuring that the sensor is not damaged during molding and reducing the number of parts.
Benefits of technology
It effectively protects the sensor from resin spraying pressure and heat effects, reduces the number of parts, and improves production efficiency.
✦ Generated by Eureka AI based on patent content.
Smart Images

Figure CN122158320A_ABST
Abstract
Provided are a molded coil, a reactor, and a manufacturing method for the molded coil and the reactor, which reduce the number of components and improve production efficiency. The molded coil (5) has a sensor holder (72) provided to a coil (2) with a sensor (4) mounted thereto, and a coil molding resin (91) covering at least the coil (2) and a portion of the sensor (4). The sensor holder (72) has an insertion groove (76) into which the sensor (4) is inserted. The insertion groove (76) has an opening (77) that surrounds a main body portion of the sensor (4) entirely, and a pair of clamping surfaces (81, 82) that clamp the sensor (4) from both sides in the insertion groove (76). One of the clamping surfaces (81, 82) is an elastic plate (83) that extends in a depth direction of the insertion groove (76), with one end fixed and the other end free. In the mounting process, the sensor is pressed into the insertion groove while elastically deforming the elastic plate.
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