A radar package antenna layout structure and millimeter wave radar

Abstract

The application provides a radar package antenna layout structure and a millimeter wave radar, comprising: a package antenna substrate; a multiple-input multiple-output (MIMO) antenna array arranged on a top layer of the package antenna substrate, the MIMO antenna array comprising a transmitting antenna array and a receiving antenna array; a metal isolation strip arranged between the transmitting antenna array and the receiving antenna array; and an electromagnetic bandgap structure array group arranged between transmitting antenna units in the transmitting antenna array, each electromagnetic bandgap structure array in the electromagnetic bandgap structure array group comprising a plurality of electromagnetic bandgap structure units, and a short side of each electromagnetic bandgap structure unit being arranged perpendicularly to an electric field radiation plane of the transmitting antenna unit. The application solves the problem of a decrease in isolation caused by a compact layout.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and more specifically, to a radar packaged antenna layout structure and millimeter-wave radar. Background Technology

[0002] With the widespread adoption of smart home applications, millimeter-wave radar needs to meet stringent requirements for miniaturization, low cost, and high integration to be embedded in devices such as televisions, air conditioners, lighting fixtures, routers, and wall sockets, enabling ubiquitous sensing. Therefore, millimeter-wave radar must evolve towards chip-based and modular designs, significantly reducing size, power consumption, and cost to adapt to the large-scale deployment of consumer electronics products.

[0003] However, miniaturization has led to increasingly compact antenna layouts and a continuous reduction in the spacing between antenna elements, which in turn exacerbates the electromagnetic coupling effect between elements and enhances the surface wave effect, resulting in core performance bottlenecks such as a severe decrease in isolation. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a radar package antenna layout structure and a millimeter-wave radar, which aims to overcome at least one of the above-mentioned defects.

[0005] In a first aspect, this application provides a radar packaged antenna layout structure, including: Encapsulated antenna substrate; A multiple-input multiple-output (MIMO) antenna array is disposed on the top layer of the packaged antenna substrate, and the MIMO antenna array includes a transmit antenna array and a receive antenna array; A metal isolation strip is disposed between the transmitting antenna array and the receiving antenna array; An electromagnetic bandgap structure array group is disposed between the transmitting antenna elements in the transmitting antenna array. Each electromagnetic bandgap structure array group includes multiple electromagnetic bandgap structure elements, and the short side of each electromagnetic bandgap structure element is arranged perpendicular to the electric field radiation surface of the transmitting antenna element.

[0006] In one possible implementation, the transmitting antenna array includes two transmitting antenna elements, and the electromagnetic bandgap structure array group is disposed between the two transmitting antenna elements; The electromagnetic bandgap structure array comprises two arrays, each consisting of electromagnetic bandgap structure units arranged in at least three rows and three columns periodically.

[0007] In one possible implementation, each electromagnetic bandgap structural unit includes: Two H-shaped metal layers are stacked together, and the short sides of the two H-shaped metal layers are perpendicular to the electric field radiation surface of the transmitting antenna element. A circular metal layer is disposed below the two H-shaped metal layers and stacked with the two H-shaped metal layers; A first metal pillar penetrates the two H-shaped metal layers and the circular metal layer, and electrically connects the two H-shaped metal layers and the circular metal layer to the ground plane.

[0008] In one possible implementation, two electromagnetic bandgap structure arrays are symmetrically arranged between the two transmitting antenna elements, such that the ground plane areas on both sides of each transmitting antenna element are equal.

[0009] In one possible implementation, it also includes: Two metal loading structures are respectively disposed at both ends of the receiving antenna array.

[0010] In one possible implementation, each of the metal loading structures consists of rectangular metal patches arranged in a multi-row, multi-column array, with each rectangular metal patch grounded via a second metal pillar.

[0011] In one possible implementation, the metal isolation strip comprises a plurality of parallel rectangular metal sheets, each rectangular metal sheet having the same length as the packaged antenna substrate.

[0012] In one possible implementation, the receiving antenna array includes four receiving antenna elements arranged in a straight line, the line connecting the four receiving antenna elements being parallel to the line connecting the two transmitting antenna elements, and all four receiving antenna elements and the two transmitting antenna elements using an electric field as a horizontal radiating surface.

[0013] In one possible implementation, it also includes: The chip is mounted on the back side of the packaged antenna substrate using a flip-chip bonding process.

[0014] Secondly, this application provides a millimeter-wave radar, including the radar packaged antenna layout structure as described in the first aspect.

[0015] This application provides a radar packaged antenna layout structure and a millimeter-wave radar, including: a packaged antenna substrate; a multiple-input multiple-output (MIMO) antenna array disposed on the top layer of the packaged antenna substrate, the MIMO antenna array including a transmitting antenna array and a receiving antenna array; a metal isolation strip disposed between the transmitting antenna array and the receiving antenna array; and an electromagnetic bandgap structure array group disposed between the transmitting antenna elements in the transmitting antenna array, each electromagnetic bandgap structure array group including multiple electromagnetic bandgap structure elements, the short side of each electromagnetic bandgap structure element being perpendicular to the electric field radiation surface of the transmitting antenna element. This application solves the problem of reduced isolation caused by a compact layout.

[0016] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a radar packaged antenna layout structure provided in an embodiment of this application; Figure 2 This is a schematic diagram of the electromagnetic bandgap structure unit provided in the embodiments of this application; Figure 3 This is a schematic diagram of the metal loading structure provided in an embodiment of this application.

[0019] Reference numerals: 101-Encapsulated antenna substrate; 102-Transmitting antenna element; 103-Receiving antenna array; 104-Electromagnetic bandgap structure array group; 1041-H-shaped metal layer; 1042-Circular metal layer; 1043-First metal pillar; 105-Metal loading structure; 1051-Rectangular metal patch; 1052-Second metal pillar; 106-Metal isolation strip. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. Based on the embodiments of this application, every other embodiment obtained by those skilled in the art without inventive effort falls within the scope of protection of this application.

[0021] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0022] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.

[0023] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.

[0024] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0025] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0026] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” may be used herein to describe the relationship between one element and another as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also the different orientations of the device during use or operation.

[0027] For example, if the device in the accompanying drawings is flipped, an element described as being "above" or "upper" relative to another element will subsequently be "below" or "lower" relative to that other element. Therefore, the term "above" includes both "above" and "below" orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relationship terms used herein will be interpreted accordingly.

[0028] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0029] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0030] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.

[0031] First, the applicable application scenarios of this application will be introduced. This application can be applied to the field of antenna technology.

[0032] Research has revealed that with the continuous development of smart home applications, the industry has placed new demands on millimeter-wave radar for miniaturization, low cost, and high integration. To achieve ubiquitous sensing, millimeter-wave radar needs to be seamlessly embedded in televisions, air conditioners, lighting fixtures, routers, and even wall sockets. Therefore, it must develop towards chip-based and modular designs to significantly reduce size, power consumption, and cost, adapting to large-scale deployments in consumer electronics.

[0033] In the field of millimeter-wave radar, existing antenna technologies mainly include PCB (Printed Circuit Board) antennas and packaged antennas that can be integrated with chips. Currently, PCB antennas are more widely used, often employing array configurations to improve performance, but their large size makes them difficult to meet the needs of space-constrained products. Using a single-element antenna, however, is limited by the high loss of PCB materials and the constraints of manufacturing processes on antenna design, resulting in poor overall performance. In contrast, packaged antenna technology can significantly reduce size, improve integration, and increase design flexibility, making it more suitable for the aforementioned development needs. However, as antennas are miniaturized and compacted along with the overall module design, the reduced spacing between elements exacerbates electromagnetic coupling, leading to critical issues such as decreased isolation and distorted radiation patterns.

[0034] Based on this, the embodiments of this application provide a radar packaged antenna layout structure and a millimeter-wave radar, aiming to solve the problems of enhanced electromagnetic coupling, decreased isolation and radiation pattern distortion caused by the reduced spacing of miniaturized antennas.

[0035] Example 1: Please see Figure 1 , Figure 1 This is a schematic diagram of a radar encapsulated antenna layout structure provided in an embodiment of this application. Figure 1 As shown in the figure, the radar packaged antenna layout structure provided in this application embodiment includes: packaged antenna substrate 101, chip, MIMO antenna array, metal isolation strip 106, and electromagnetic bandgap structure array group 104.

[0036] Here, a chip mounted by flip-chip bonding is disposed on the back side of the packaged antenna substrate 101, and the packaged antenna substrate 101 is preferably a millimeter-wave packaged antenna substrate.

[0037] The MIMO antenna array is disposed on the top layer of the packaged antenna substrate 101. The chip and the MIMO antenna array are electrically connected through internal wiring of the substrate. The MIMO antenna array includes a transmitting antenna array and a receiving antenna array 103.

[0038] Here, a chip mounted via flip-chip bonding is disposed on the back side of the packaged antenna substrate 101. The chip uses flip-chip technology, with the chip lead pads on the bottom layer of the packaged substrate, while the packaged antenna unit is placed on the top layer of the packaged substrate. This integration method integrates the antenna and the chip into one unit, reducing the overall size, lowering transmission loss, and improving the system's integration and reliability, meeting the stringent requirements of miniaturization and modularity in consumer electronics.

[0039] In this embodiment, the transmitting antenna array includes two transmitting antenna elements 102 (Tx), and the receiving antenna array 103 includes four receiving antenna elements (Rx) arranged in a straight line. The four receiving antenna elements are arranged in a straight line with a spacing of half a working wavelength (λ / 2), and the two transmitting antenna elements 102 are arranged in a straight line with a spacing of two working wavelengths (2λ), and the lines connecting the transmitting antenna elements 102 are parallel to the lines connecting the receiving antenna elements.

[0040] The four receiving antenna elements and two transmitting antenna elements 102 can be various types of microstrip antenna elements. This application does not depend on a specific antenna element type, but is applicable to a wide range of microstrip antenna elements. This provides flexibility in antenna element selection while ensuring the performance advantages brought by the layout and isolation structure, and helps to optimize the performance of the overall antenna module based on different application requirements.

[0041] All four receiving antenna elements and two transmitting antenna elements 102 use the electric field as the horizontal radiating surface, thereby increasing the coverage capability in the horizontal direction and helping to retain a certain coverage capability in the elevation direction.

[0042] Specifically, the 2T4R MIMO (Multiple-Input Multiple-Output) layout of this application virtually constructs an 8×1 virtual linear array through signal processing. The equivalent aperture of this virtual array far exceeds the actual physical size, thereby significantly improving the angle measurement resolution and accuracy in the horizontal direction, and realizing high-performance angle measurement in a small size.

[0043] A metal isolation strip 106 is disposed between the transmitting antenna array and the receiving antenna array 103. The metal isolation strip 106 comprises a plurality of parallel rectangular metal sheets, each rectangular metal sheet having the same length as the encapsulated antenna substrate 101. The metal isolation strip 106 is composed of at least four rectangular metal sheets, the width of which is preferably 0.25 mm, and the length which is consistent with the length of the encapsulated antenna substrate 101. The rectangular metal sheets are arranged in parallel, and the spacing between the rectangular metal sheets is preferably 0.25 mm.

[0044] An electromagnetic bandgap structure array group 104 is arranged between the transmitting antenna elements 102 in the array of transmitting antenna elements 102. Each electromagnetic bandgap structure array in the electromagnetic bandgap structure array group 104 includes multiple electromagnetic bandgap structure elements. The short side of each electromagnetic bandgap structure element is arranged perpendicular to the electric field radiation surface of the transmitting antenna element 102. This "90-degree rotation" vertical arrangement is intended to reduce the negative impact of the electromagnetic bandgap structure array on the original radiation pattern of the transmitting antenna element 102.

[0045] In this embodiment of the application, an electromagnetic bandgap structure array group 104 is disposed between two transmitting antenna units 102. The electromagnetic bandgap structure array includes two arrays, each consisting of at least three rows and three columns of periodically arranged electromagnetic bandgap structure units.

[0046] In a preferred embodiment, the electromagnetic bandgap structure array can be composed of five rows and three columns of cells. The number of rows and columns can be adjusted according to the actual layout space; typically, an array configuration of three or more rows and three columns is sufficient to produce a significant surface wave suppression effect. Where size allows, increasing the array size can usually further improve performance.

[0047] Two electromagnetic bandgap structure arrays are symmetrically arranged between two transmitting antenna elements 102 so that the grounding layer areas on both sides of each transmitting antenna element 102 are equal, which helps to make the radiation pattern of the electric field more symmetrical from left to right and optimize the radiation performance.

[0048] It should be noted that the physical isolation between the transmitting antenna elements 102 already meets the basic requirements. However, the metal isolation band 106 introduced in this application to improve the isolation between the transmitting antenna element 102 and the receiving antenna element may negatively affect the isolation between the transmitting antenna elements 102. However, the decrease in isolation is not severe and only occurs at certain frequency points. To compensate for this effect and minimize the impact on the electric field radiating surface of the transmitting antenna element 102, this application adopts an H-shaped electromagnetic bandgap element with its short arm perpendicular to the electric field radiating surface of the transmitting antenna element 102, so as to maintain the integrity of the radiation pattern to the greatest extent while improving antenna isolation.

[0049] Compared to traditional rectangular electromagnetic bandgap structures, the H-shaped electromagnetic bandgap structure used in this application employs a fractal design, enabling multi-band response and structural miniaturization. This results in smaller electromagnetic bandgap elements, facilitating compact antenna layouts and making it particularly suitable for the packaged antenna layout scenario described in this application. Furthermore, compared to conventional symmetrical electromagnetic bandgap structures, the asymmetrical nature of the H-shaped structure further reduces interference with the radiation pattern of the transmitting antenna element 102. Through these two H-shaped electromagnetic bandgap structure arrays, surface wave propagation on the ground plane between the two transmitting antenna elements 102 is effectively suppressed, significantly improving the isolation between them and preventing signal crosstalk.

[0050] Specifically, the core of the H-type electromagnetic bandgap structure unit used in this application lies in the difference in current path and coupling suppression capability caused by the geometric asymmetry of the structure. When the long side of the H-type electromagnetic bandgap structure unit is perpendicular to the electric field radiation surface direction of the transmitting antenna unit 102, it can maximize the disturbance and extension of the surface wave current path. This disturbance is equivalent to introducing significant inductive reactance, forming a high-impedance surface in a specific frequency band, thereby effectively blocking the transmission of surface waves and significantly improving the isolation between antenna units. When the short side of the H-type electromagnetic bandgap structure unit is perpendicular to the electric field radiation surface direction of the transmitting antenna unit 102, its disturbance and extension effect on the surface wave current path is not as good as when the long side is perpendicular to the electric field radiation surface. However, the short and long sides together determine the equivalent inductance and capacitance of the entire electromagnetic bandgap structure unit, thus affecting the center frequency and bandwidth of the bandgap.

[0051] Please see Figure 2 , Figure 2 This is a schematic diagram of the electromagnetic bandgap structure unit provided in an embodiment of this application. Figure 2 As shown in the figure, the electromagnetic bandgap structure unit provided in this application embodiment includes two H-shaped metal layers 1041, a circular metal layer 1042, and a first metal pillar 1043.

[0052] Two H-shaped metal layers 1041 are stacked, with their short sides perpendicular to the electric field radiating surface of the transmitting antenna element 102. A circular metal layer 1042 is disposed below and stacked with the two H-shaped metal layers 1041. A first metal pillar 1043 penetrates the two H-shaped metal layers 1041 and the circular metal layer 1042, and electrically connects the two H-shaped metal layers 1041 and the circular metal layer 1042 to the ground plane.

[0053] In this way, the electromagnetic bandgap structural unit forms an H-shaped electromagnetic bandgap structural unit. Through its unique metal stacking and via connection structure, this unit can generate an effective electromagnetic bandgap within a specified operating frequency band, thereby efficiently suppressing the propagation of surface waves.

[0054] Specifically, this application employs a double-layered H-shaped metal layer 1041, which can improve the bandgap bandwidth of the electromagnetic bandgap structure to a certain extent. The circular metal layer 1042 is mainly based on process considerations. Since metal is required around the first metal pillar 1043 to ensure process reliability, and the electromagnetic bandgap structure unit using the first metal pillar 1043 as the ground has advantages over the ungrounded electromagnetic bandgap structure in terms of smaller size, wider bandgap, and greater suppression depth.

[0055] The radar packaged antenna layout structure provided in this application embodiment also includes: two metal loading structures 105.

[0056] Please see Figure 3 , Figure 3 This is a schematic diagram of the metal loading structure 105 provided in an embodiment of this application. Figure 3 As shown in the figure, the metal loading structure 105 provided in this application embodiment includes a plurality of rectangular metal patches 1051 and a corresponding second metal column 1052.

[0057] Here, two metal loading structures 105 are respectively disposed at both ends of the receiving antenna array 103. Each metal loading structure 105 consists of rectangular metal patches 1051 arranged in a multi-row, multi-column array, and each rectangular metal patch 1051 is grounded through a second metal pillar 1052. In a specific example, the metal loading structure 105 is composed of a three-column, five-row array of rectangular metal patches 1051, and the size of the rectangular metal patches 1051 is preferably 0.38 mm × 0.28 mm. The size of the metal patches can be adjusted within a certain range, and different sizes will have a corresponding impact on the radiation pattern optimization effect.

[0058] Specifically, due to the compact half-wavelength layout of the four receiving antenna elements, the electromagnetic coupling effect between the elements is enhanced, which can easily lead to a deterioration in the radiation pattern of the elements at both ends of the array. The metal loading structure 105, through electromagnetic coupling with the edge receiving antenna elements, can enhance the radiated energy of the antenna on the loading structure side, thereby effectively correcting and optimizing the distorted radiation pattern and ensuring that the received beam has the expected shape and gain.

[0059] It should be noted that the above width and spacing values ​​are preferred examples under a specific operating frequency band. In practical applications, they can be adjusted within a certain range according to design requirements. For example, the range of variation for width and spacing can be between 0.1 mm and 0.5 mm.

[0060] Specifically, due to the miniaturization of the overall package size, the distance between the transmitting antenna unit 102 and the receiving antenna unit is very close, resulting in limited physical isolation and significant electromagnetic coupling effects, which leads to a decrease in transmit-receive isolation. The added metal isolation strip 106 can effectively suppress the propagation of surface waves on the metal ground layer, thereby improving the isolation between the transmitting antenna unit 102 and the receiving antenna unit and reducing crosstalk of the transmitted signal to the receiving channel.

[0061] Compared with existing technologies, the radar packaged antenna layout structure of this application comprehensively solves multiple performance challenges caused by miniaturization and high integration requirements by systematically combining and coordinating a specific 2T4R MIMO antenna layout, a rotated asymmetric H-shaped electromagnetic bandgap structure array, a metal loading structure, and a metal isolation strip. Specifically, the 2T4R MIMO layout virtually creates an 8-element array, achieving high-precision horizontal angle measurement in a small size; the H-shaped electromagnetic bandgap structure and the metal isolation strip improve the isolation between transmitting and receiving antennas, respectively, systematically solving the signal crosstalk problem in a compact layout; the metal loading structure corrects the radiation pattern distortion of the compact receiving array, while the rotation and symmetrical arrangement of the electromagnetic bandgap structure minimizes the negative impact on the antenna radiation pattern, ensuring radiation performance; finally, the use of packaged antenna technology and flip-chip integration achieves extreme miniaturization, low cost, and high reliability of the antenna module, perfectly adapting to consumer electronics applications such as smart homes.

[0062] Example 2: This application also provides a millimeter-wave radar, including the radar packaged antenna layout structure as described in Embodiment 1.

[0063] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The scope of protection of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A radar packaged antenna layout structure, characterized in that, include: Encapsulated antenna substrate; A multiple-input multiple-output (MIMO) antenna array is disposed on the top layer of the packaged antenna substrate, and the MIMO antenna array includes a transmit antenna array and a receive antenna array; A metal isolation strip is disposed between the transmitting antenna array and the receiving antenna array; An electromagnetic bandgap structure array group is disposed between the transmitting antenna elements in the transmitting antenna array. Each electromagnetic bandgap structure array group includes multiple electromagnetic bandgap structure elements, and the short side of each electromagnetic bandgap structure element is perpendicular to the electric field radiation surface of the transmitting antenna element.

2. The layout structure according to claim 1, characterized in that, The transmitting antenna array includes two transmitting antenna elements, and the electromagnetic bandgap structure array group is disposed between the two transmitting antenna elements. The electromagnetic bandgap structure array comprises two arrays, each consisting of electromagnetic bandgap structure units arranged in at least three rows and three columns periodically.

3. The layout structure according to claim 1, characterized in that, Each electromagnetic bandgap structural unit includes: Two H-shaped metal layers are stacked together, and the short sides of the two H-shaped metal layers are perpendicular to the electric field radiation surface of the transmitting antenna element. A circular metal layer is disposed below the two H-shaped metal layers and stacked with the two H-shaped metal layers; A first metal pillar penetrates the two H-shaped metal layers and the circular metal layer, and electrically connects the two H-shaped metal layers and the circular metal layer to the ground plane.

4. The layout structure according to claim 2, characterized in that, Two electromagnetic bandgap structure arrays are symmetrically arranged between the two transmitting antenna elements so that the grounding layer areas on both sides of each transmitting antenna element are equal.

5. The layout structure according to claim 1, characterized in that, Also includes: Two metal loading structures are respectively disposed at both ends of the receiving antenna array.

6. The layout structure according to claim 5, characterized in that, Each of the metal loading structures consists of rectangular metal patches arranged in a multi-row, multi-column array, and each rectangular metal patch is grounded through a second metal pillar.

7. The layout structure according to claim 1, characterized in that, The metal isolation strip comprises multiple rectangular metal sheets arranged in parallel, each rectangular metal sheet having the same length as the packaged antenna substrate.

8. The layout structure according to claim 2, characterized in that, The receiving antenna array includes four receiving antenna elements arranged in a straight line. The line connecting the four receiving antenna elements is parallel to the line connecting the two transmitting antenna elements. All four receiving antenna elements and the two transmitting antenna elements use the electric field as the horizontal radiating surface.

9. The layout structure according to claim 1, characterized in that, Also includes: The chip is mounted on the back side of the packaged antenna substrate using a flip-chip bonding process.

10. A millimeter-wave radar, characterized in that, Includes the radar packaged antenna layout structure as described in any one of claims 1 to 9.

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