Probeless high-precision positioning antenna based on coupled feed

Abstract

The application discloses a kind of high-precision positioning antennas based on coupling feed without probe, belong to antenna technical field.The antenna includes PCB substrate, feed network, integrated dielectric substrate, feed metallization via and radiating sheet.Feed network is through PCB substrate upper and lower surfaces;The feed metallization via is arranged in integrated dielectric substrate, its bottom end is connected with feed network by non-contact electromagnetic coupling, top end is electrically connected to radiating sheet, and constitutes L1 frequency band main radiating unit.The application replaces traditional physical probe with metallization via, eliminates welding process defects and conductor loss, improves antenna Q value and phase center stability;Coupling structure is located in bottom layer, gap is accurately controlled by laminating process, and environmental interference resistance is strong;Overall structure is compatible with standard PCB manufacturing process, applicable to L1 / L2 dual-frequency GNSS high-precision positioning scene, especially suitable for high dynamic applications such as vehicle-mounted, unmanned aerial vehicle etc.

Description

Technical Field

[0001] This invention belongs to the field of antenna technology, and in particular relates to a probeless high-precision positioning antenna based on coupled feeding. Background Technology

[0002] Existing high-precision positioning antennas often employ physical probe feeding, achieving signal transmission through direct contact between the probe and the radiating layer. A small number use top-coupled feeding, where the probe is coupled to the radiating patch (even top-coupled feeding requires probe soldering), which has the following drawbacks: 1. Probe welding is prone to process defects such as incomplete welding and cold welding; especially in high-frequency bands (such as L1 / L2 dual-band GNSS applications), even small assembly errors can lead to significant impedance mismatch, which in turn causes phase center drift, seriously affecting positioning accuracy and multipath suppression capability. 2. High-frequency probe conductor losses are significant. Due to the enhanced skin effect, the current is concentrated on the probe surface, leading to increased ohmic losses and a decrease in radiation efficiency of more than 10%. 3. Insufficient structural stability: The probe is prone to micro-deformation, fatigue fracture or even detachment when subjected to mechanical vibration or high and low temperature cycles, making it difficult to guarantee long-term reliability. It is especially unsuitable for high dynamic application scenarios such as vehicle-mounted and drone-based applications. 4. Low assembly efficiency: It relies on manual alignment and soldering, which not only results in poor production consistency but also makes it difficult to integrate into automated SMT production lines, thus restricting large-scale mass production capabilities and cost control.

[0003] The aforementioned problems have become key bottlenecks restricting the further popularization of high-precision GNSS antennas in fields such as autonomous driving, precision agriculture, and intelligent surveying and mapping. Summary of the Invention

[0004] The purpose of this invention is to eliminate the negative impact of existing probe-based positioning antennas and improve coupling stability and positioning accuracy by proposing a probeless high-precision positioning antenna based on coupling feeding.

[0005] To achieve the above objectives, the present invention adopts the following technical solutions: A probeless high-precision positioning antenna based on coupled feeding includes a PCB substrate, a feeding network, an integrated dielectric substrate, feeding metallized vias, and a radiating plate. The feeding network extends from the lower surface of the PCB substrate to its upper surface. The feeding metallized vias are disposed on the integrated dielectric substrate, with the bottom end of the feeding metallized vias coupled to the feeding network, and the top end of the feeding metallized vias extending to the upper surface of the integrated dielectric substrate. The radiating plate is located at the top end of the feeding metallized vias and is electrically connected to the feeding metallized vias.

[0006] Furthermore, the antenna signal is transmitted to the radiating plate via electromagnetic coupling through the feed network to excite the feed metallized vias.

[0007] Furthermore, the power-feed metallized via extends through the integrated dielectric substrate, with its upper end connected to the radiating plate and its lower end extending outward to form a terminal plate structure. The shape of the power-feed metallized via is an inverted "T" shape from the side.

[0008] Furthermore, the end of the power supply network is a sheet-like structure, forming a power supply network end extension portion. The end of the power supply metallized via is a sheet-like structure, forming a power supply metallized via end extension portion. The power supply network end extension portion is coupled to the power supply metallized via end extension portion. The size of the power supply network end extension portion is greater than or equal to the size of the power supply metallized via end extension portion.

[0009] Furthermore, the number of the power-feeding metallized vias is four, and they are centrally symmetrically distributed.

[0010] Furthermore, the outermost periphery of the integrated dielectric substrate is provided with a ring of at least eight metallized vias, which are electrically connected to the radiating sheet.

[0011] Furthermore, the inner layer of the integrated dielectric substrate is embedded with a ring-shaped L2 band radiation layer, which is electrically connected to the L1 radiation sheet through four symmetrically distributed connection holes.

[0012] Compared with existing technologies, the advantages of this probeless high-precision positioning antenna based on coupled feeding are: 1. This invention uses an integrated metallized via to completely replace the traditional metal probe, fundamentally eliminating welding process defects (such as cold solder joints) and the risk of probe breakage, significantly improving the long-term reliability and environmental adaptability of the product (stable performance within the operating temperature range of -40°C to +85°C). 2. This invention employs a contactless coupling feeding mechanism to significantly reduce conductor loss, resulting in a 15-25% improvement in measured radiation efficiency in the L1 / L2 dual-band, an increase in antenna Q value, and enhanced phase center stability (phase center offset <2mm), meeting the requirements for centimeter-level high-precision positioning. 3. The coupling structure of this invention is located on the bottom layer of the PCB, and the coupling gap is precisely controlled by the lamination thickness. It has good repeatability and is minimally affected by external mechanical vibration or thermal expansion and contraction, thus improving structural stability by more than 30%. 4. The overall structure of this invention is compatible with standard PCB manufacturing processes (such as laser drilling, electroplating filling, and lamination molding), requiring no additional manual assembly steps. It can be directly integrated into automated SMT production lines, reducing the unit production cost by more than 15% and increasing the yield rate to more than 98%. 5. The electromagnetic shielding wall formed by the metallized via array of the present invention effectively suppresses edge diffraction and surface waves, improves the symmetry of the radiation pattern and the ability to suppress multiple paths, and is particularly suitable for high-precision navigation applications in complex electromagnetic environments such as urban canyons and forest areas. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the cross-sectional structure of the present invention; Figure 3 This is a partial enlarged view of the coupling portion between the power supply network and the power supply metallized via of the present invention; Figure 4 This is a gain curve diagram comparing the present invention with that of a conventional probe antenna.

[0014] In the diagram: 100 - PCB substrate, 101 - power supply network, 200 - integrated dielectric substrate, 201 - radiating sheet, 300 - power supply metallized via, 400 - metallized via array, 500 - power supply network end extension, 600 - power supply metallized via end extension. Detailed Implementation

[0015] The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0016] Reference Figures 1 to 4 A probe-free high-precision positioning antenna based on coupled feeding includes a PCB substrate 100, a feeding network 101, an integrated dielectric substrate 200, a feeding metallized via 300, and a radiating plate 201. The feeding network 101 has a sheet-like structure at its end, which extends from the lower surface of the PCB substrate 100 to its upper surface to form a feeding network end extension 500. The feeding network 101 adopts a low-loss microstrip line design and has a 1-to-4 phase shift power divider function, which can accurately control the phase difference of each port and ensure excellent circular polarization performance. The feeding network end extension 500 is located below the feeding metallized via 300, and a fixed coupling gap (typically 0.1–0.3 mm) is reserved between them. This gap can be precisely controlled by the PCB lamination process to avoid the positional deviation caused by manual assembly of traditional probes.

[0017] The feed metallized via 300 penetrates the integrated dielectric substrate 200. The upper end of the feed metallized via 300 is connected to the radiating plate 201. The lower end of the feed metallized via 300 is a sheet-like structure, extending outward to form a feed metallized via end extension 600. The shape of the feed metallized via 300 is an inverted "T" shape from the side. This structure not only enhances mechanical strength but also expands the coupling area and improves energy transmission efficiency. The feed metallized via end extension 600 is coupled to the feed network end extension 500. It should be noted that the above coupling connection refers to the transmission of energy and signals through the interaction of electric and magnetic fields. It adopts a non-contact method to achieve a probe-free effect, without any welding or physical contact, and completely eliminates probe-related failure modes. The size of the feed network end extension (500) is greater than or equal to the size of the feed metallized via end extension (600). The top end of the feed metallized via 300 extends to the upper surface of the integrated dielectric substrate 200.

[0018] The radiating plate 201 is located at the top of the feed metallized via 300 and is electrically connected to the feed metallized via 300, forming the main radiating unit of the L1 band (1575.42MHz). In this embodiment, the uppermost radiating plate 201 corresponds to the L1 band and is directly connected to the feed metallized via 300 that replaces the feed probe. A ring-shaped L2 band (1227.60MHz) radiating layer is embedded in the inner layer of the integrated dielectric substrate 200 and is electrically connected to the L1 radiating plate through four symmetrically distributed connecting holes to achieve a compact layout of dual-frequency common aperture.

[0019] The signal transmission path of the antenna of the present invention is as follows: feed network 101 → feed network end extension 500 → excite feed metallized via end extension 600 through electric field / magnetic field coupling → conduct along feed metallized via 300 to radiating plate 201 → radiate electromagnetic field.

[0020] The number of the feed metallized vias 300 is four, and they are centrally symmetrically distributed to ensure that the amplitude and phase of the four feed signals are highly consistent, thus optimizing the axial ratio and beam symmetry.

[0021] In addition, the outermost periphery of the integrated dielectric substrate 200 is provided with a ring of no less than 8 metallized via arrays 400, which are electrically connected to the radiating sheet 201. This grounding wall structure not only effectively suppresses surface wave interference and improves the front-to-back ratio, but also flexibly adjusts the impedance bandwidth (typically covering L1±30MHz, L2±20MHz and a beamwidth of 3dB with a beamwidth of approximately 120°) by adjusting the via spacing and diameter, thus meeting the requirements for high elevation angle satellite signal reception.

[0022] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A probeless high-precision positioning antenna based on coupled feeding, characterized in that, include: PCB substrate (100); A power supply network (101) is disposed within the PCB substrate (100) and extends through its upper and lower surfaces; An integrated dielectric substrate (200) is stacked on top of the PCB substrate (100); At least one power-fed metallized via (300) penetrates the integrated dielectric substrate (200), with its bottom end being non-contactly electromagnetically coupled to the power-fed network (101) and its top end extending to the upper surface of the integrated dielectric substrate (200). A radiating plate (201) is disposed at the top of the feed metallized via (300), and the radiating plate (201) is electrically connected to the feed metallized via (300), and the two constitute the L1 band main radiating element of the antenna.

2. A probeless high-precision positioning antenna based on coupled feeding according to claim 1, characterized in that, The signal from the antenna is transmitted to the radiating plate (201) via the electromagnetic coupling excitation of the feed metallized via (300) through the feed network (101).

3. A probeless high-precision positioning antenna based on coupled feeding according to claim 1, characterized in that, The power-feeding metallized via (300) penetrates the integrated dielectric substrate (200). The upper end of the power-feeding metallized via (300) is connected to the radiating plate (201). The lower end of the power-feeding metallized via (300) extends outward and forms a terminal plate structure. The shape of the power-feeding metallized via (300) is an inverted "T" shape from the side.

4. A probeless high-precision positioning antenna based on coupled feeding according to claim 1, characterized in that, The end of the power supply network (101) is a sheet structure and forms a power supply network end extension (500). The end of the power supply metallized via (300) is a sheet structure and forms a power supply metallized via end extension (600). The power supply network end extension (500) is coupled to the power supply metallized via end extension (600). The size of the power supply network end extension (500) is greater than or equal to the size of the power supply metallized via end extension (600).

5. A probeless high-precision positioning antenna based on coupled feeding according to claim 1, characterized in that, The number of the power-feeding metallized vias (300) is 4, and they are centrally symmetrically distributed.

6. A probeless high-precision positioning antenna based on coupled feeding according to claim 1, characterized in that, The outermost periphery of the integrated dielectric substrate (200) is provided with a ring of at least 8 metallized via arrays (400), which are electrically connected to the radiating sheet (201).

7. A probeless high-precision positioning antenna based on coupled feeding according to claim 1, characterized in that, The inner layer of the integrated dielectric substrate (200) is embedded with a ring-shaped L2 band radiation layer, which is electrically connected to the L1 radiation sheet through four symmetrically distributed connection holes.

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