Stretchable panel

Abstract

A stretchable panel includes a substrate, a plurality of island elements, a plurality of wire structures, and a plurality of dummy structures. The substrate has a plurality of cutout regions. The plurality of island elements and the plurality of wire structures are disposed on the substrate and do not overlap the plurality of cutout regions. The plurality of wire structures connect the plurality of island elements. The plurality of dummy structures are disposed within the plurality of cutout regions. One of the plurality of dummy structures is disposed between any two adjacent ones of the plurality of wire structures. The any two adjacent ones of the plurality of wire structures and the one of the plurality of dummy structures are structurally spaced apart.

Description

Technical Field

[0001] This invention relates to a panel, and more particularly to a stretchable panel. Background Technology

[0002] With the rapid development of electronic technology, electronic products are constantly being innovated. To enable electronic products to be applied in various fields, the characteristics of stretchability, thinness, and unrestricted shape are increasingly valued. In other words, electronic products are increasingly required to have different shapes depending on the application method and environment; therefore, electronic products need to be stretchable. To enable electronic products to have the ability to stretch and deform in any direction, multiple island-shaped components are interconnected on a substrate via multiple stretchable wires, and the substrate is hollowed out in areas where there are no island-shaped components and stretchable wires. However, in the etching process of the substrate, existing technologies are prone to problems such as etching residue or over-etching of other film layers. Summary of the Invention

[0003] This invention provides a stretchable panel with a high etching yield of its substrate.

[0004] The stretchable panel of the present invention includes a substrate, a plurality of island-shaped elements, a plurality of conductive structures, and a plurality of dummy structures. The substrate has a plurality of cutout areas. The plurality of island-shaped elements and the plurality of conductive structures are disposed on the substrate and do not overlap the plurality of cutout areas. The plurality of conductive structures connect the plurality of island-shaped elements. The plurality of dummy structures are disposed within the plurality of cutout areas. One of the plurality of dummy structures is disposed between any two adjacent conductive structures. The substrate and the plurality of adjacent conductive structures are structurally spaced apart from the plurality of dummy structures.

[0005] Based on the above, in a stretchable panel according to an embodiment of the present invention, the substrate has multiple cutout areas that do not overlap with the multiple island elements and multiple wire structures. These cutout areas are provided with multiple dummy structures spaced apart from the multiple island elements and multiple wire structures. During the formation of the multiple cutout areas, the arrangement of these dummy structures provides a more accurate basis for switching etching process parameters, which helps to improve etching yield. Attached Figure Description

[0006] Figure 1 This is a top view of a stretchable panel according to a first embodiment of the present invention;

[0007] Figure 2A and Figure 2B yes Figure 1 A cross-sectional view of the stretchable panel;

[0008] Figures 3A to 3G yes Figure 1 A cross-sectional schematic diagram of the manufacturing process of a stretchable panel;

[0009] Figure 4 yes Figure 1 A top view of another variant of the stretchable panel;

[0010] Figure 5 This is a top view schematic diagram of a stretchable panel according to a second embodiment of the present invention;

[0011] Figure 6 yes Figure 5 A top view schematic diagram of another variant implementation of the stretchable panel.

[0012] Symbol Explanation

[0013] 10, 10A, 20, 20A: Stretchable panels

[0014] 50: Stretchable substrate

[0015] 60: Adhesive layer

[0016] 100, 101, 102, 103, 104: Island-shaped elements

[0017] 110: Light-emitting element

[0018] 120, 121, 122, 123, 124: Conductor Structure

[0019] 130, 131a, 131b, 132, 131-A: Dummy Structure

[0020] 180: Functional protective film

[0021] 181: Substrate layer

[0022] 182: Release adhesive layer

[0023] CL1~CL3: Conductive layers

[0024] CR: Carrier board

[0025] d1~d4: Shortest distance

[0026] FP: Functional pattern

[0027] HA, HA1a, HA1b, HA2: Hollowed-out areas

[0028] H1, H2, H3: Height

[0029] INS0~INS3: Insulation layer

[0030] INSP: Insulating Pattern

[0031] L1, L2: Length

[0032] MSK: Hard Mask

[0033] P: Pitch

[0034] PDL: Pixel Driver Layer

[0035] SB:Substrate

[0036] SBP: Substrate Pattern

[0037] Wd: Component width

[0038] Ws: Structural width

[0039] X, Y, Z: Direction

[0040] A-A', B-B': section line Detailed Implementation

[0041] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0042] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it may be directly on or connected to the other element, or an intermediate element may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element, no intermediate element is present. As used herein, "connection" can refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may involve the presence of other elements between the two elements.

[0043] As used herein, “about,” “approximately,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement under discussion and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the use of “about,” “approximately,” or “substantially” herein may be chosen based on the optical, etched, or other properties to select a more acceptable range of deviations or standard deviations, and may not require a single standard deviation to apply to all properties.

[0044] Figure 1 This is a top view of a stretchable panel according to a first embodiment of the present invention. Figure 2A and Figure 2B yes Figure 1 A cross-sectional view of the stretchable panel. Figures 3A to 3G yes Figure 1 A cross-sectional view of the manufacturing process of the stretchable panel. Figure 2A correspond Figure 1 The section line A-A'. Figure 2B correspond Figure 1 The section line B-B'. For clarity, Figure 1 Only shown Figure 2A and Figure 2B Part of the membrane layer.

[0045] Please refer to Figure 1 , Figure 2A and Figure 2B The stretchable panel 10 includes a substrate SB, a plurality of island elements 100, and a plurality of wire structures 120. The plurality of island elements 100 and the plurality of wire structures 120 are disposed on the substrate SB. The substrate SB may be made of an organic polymer, such as: elastic rubber material, polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonate (PC), polyether sulfone (PES), polyarylate, other suitable materials, or combinations of at least two of the foregoing materials, but is not limited thereto.

[0046] In this embodiment, a plurality of island elements 100 may be arranged in an array on the substrate SB. For example, the plurality of island elements 100 may be arranged at the same pitch P along directions X and Y, but this is not a limitation. In other embodiments, the plurality of island elements 100 may be arranged at different pitch intervals along directions X and Y.

[0047] For clarity, Figure 1 Only four island elements are shown: island element 101, island element 102, island element 103, and island element 104. For example, island element 101 and island element 102 may be arranged adjacent to each other and spaced apart along direction X, while island element 103 and island element 104 may be arranged adjacent to each other and spaced apart along direction X. Island element 101 and island element 103 may be arranged adjacent to each other and spaced apart along direction Y, while island element 102 and island element 104 may be arranged adjacent to each other and spaced apart along direction Y. In this embodiment, direction X intersects (e.g., perpendicular to, but not limited to) direction Y.

[0048] Any two adjacent island elements 100 can be electrically connected to each other via a wire structure 120. For example, in this embodiment, the island element 100 may include an insulating layer INSO, a pixel driving layer PDL, and a light-emitting element 110. The pixel driving layer PDL includes, for example, at least one pixel circuit, wherein the pixel circuit may include at least one active element and is used to control the light-emitting element 110 to emit light. It should be understood that the number of pixel circuits in the pixel driving layer PDL may be adjusted accordingly based on the number of light-emitting elements 110 configured in the island element 100. In this embodiment, the light-emitting element 110 is, for example, a micro light-emitting diode (micro-LED), but is not limited thereto.

[0049] On the other hand, in this embodiment, each of the plurality of wire structures 120 is provided with a plurality of insulating layers INS0~INS3 and a plurality of conductive layers CL1~CL3 that are alternately stacked along the Z direction (i.e., the stacking direction). For example, the film structure of the pixel driving layer PDL may be similar to (but not limited to) the film structure of the wire structure 120. That is, in this embodiment, the respective film layers of the plurality of insulating layers INS1~INS3 and the plurality of conductive layers CL1~CL3 of the wire structure 120 may also be used to form the pixel circuit of the pixel driving layer PDL of the island element 100, but are not limited thereto. The island element 100 may receive at least one control signal from the system end via the corresponding at least one wire structure 120, and the pixel circuit of the pixel driving layer PDL may drive the light-emitting element 110 according to the at least one control signal.

[0050] For conductivity considerations, the conductive layer of the wire structure 120 can be made of a metallic material. For example, in this embodiment, the conductive layer of the wire structure 120 can be a stacked structure of titanium, aluminum, and titanium layers. However, the invention is not limited thereto. According to other embodiments, the conductive layer of the wire structure 120 can also be made of other conductive materials, such as alloys, nitrides of metallic materials, oxides of metallic materials, oxynitrides of metallic materials, or stacked layers of metallic materials and other conductive materials. In this embodiment, the insulating layer can be made of organic materials, such as polyesters, polyolefins, polyacrylonitriles, polycarbonates, polyoxyalkylene compounds, polystyrene, polyethers, polyketides, polyols, polyaldehydes, or other suitable materials, or combinations thereof, but is not limited thereto. In other embodiments, the insulating layer can also be made of inorganic materials, such as silicon oxide, silicon nitride, silicon oxynitride, other suitable materials, or stacked layers of at least two of the above materials.

[0051] In this embodiment, each wire structure 120 can extend back and forth between two adjacent island elements 100 (e.g., Figure 1(As shown). When the stretchable panel 10 is stretched along the X or Y direction, the bent wire structure 120 ensures that the two adjacent island elements 100 can maintain their electrical connection with each other even when the spacing increases.

[0052] For example, the plurality of wire structures 120 include wire structure 121, wire structure 122, wire structure 123, and wire structure 124. Wire structure 121 extends in a bent direction X and connects island element 101 and island element 102. Wire structure 122 extends in a bent direction X and connects island element 103 and island element 104. Wire structure 123 extends in a bent direction Y and connects island element 101 and island element 103. Wire structure 124 extends in a bent direction Y and connects island element 102 and island element 104.

[0053] Furthermore, the substrate SB has multiple cutout areas HA in regions where the multiple island elements 100 and multiple wire structures 120 are not provided. That is, the island elements 100 and the wire structures 120 do not overlap in these cutout areas HA along the Z direction. Notably, the stretchable panel 10 also includes multiple dummy structures 130 disposed within these cutout areas HA. A dummy structure 130 may be provided between any two adjacent wire structures 120.

[0054] For example, the hollow area HA1a between adjacent wire structures 121 and 122 that bend and extend in the same direction X can be provided with a dummy structure 131a, wherein the dummy structure 131a is located in the hollow area HA1a within the region with the maximum width along the direction Y (i.e., the maximum gap between wire structures 121 and 122 along the direction Y, such as...). Figure 1 As shown). In this embodiment, the projected profile of the dummy structure 131a in direction Z is, for example, an ellipse, and its major axis is parallel to the direction of the maximum width of the hollow area HA1a (e.g., direction Y). Similarly, two adjacent wire structures that bend and extend in the same direction Y (e.g.,...) Figure 1 The cutout area HA1b between the wire structure 123 or wire structure 124 and another wire structure (not shown) may be provided with another dummy structure 131b. Since the cutout area HA1b has the maximum width along the X direction, the major axis of the ellipse of the dummy structure 131b is perpendicular to the major axis of the ellipse of the dummy structure 131a. However, the invention is not limited to this. In some other variations, the dummy structure may be a polygonal structure that retains the aforementioned major and minor axis design.

[0055] First, it should be noted that because the cutout area HA1a (or cutout area HA1b) between two adjacent conductor structures 120 that bend and extend in the same direction is too large within the maximum width region, the etching rate in the manufacturing process is difficult to control, resulting in over-etching of the side edges of some insulating layers of the conductor structures and exposing part of the conductive layer. Therefore, by setting up dummy structures 131a and 131b, the etching uniformity of cutout areas HA1a and HA1b can be effectively improved, thereby avoiding the aforementioned problem of over-etching. In this embodiment, the dummy structure 131a has a length L1 and a length L2 along the X and Y directions, respectively. Preferably, the ratio of length L2 to length L1 is greater than or equal to 1 and less than or equal to 5.5 and / or the ratio of length L2 to pitch P is greater than or equal to 0.15 and less than or equal to 0.75. Although the major axis direction of the dummy structure 131b is different from that of the dummy structure 131a, the dimensional ratio of its major axis to its minor axis or pitch P is similar to that of the dummy structure 131a, and will not be elaborated further here.

[0056] From another perspective, the dummy structure 131a has a minimum distance d1 with the conductor structure 121, while the dummy structure 131a has a minimum distance d2 with the conductor structure 122. Preferably, the ratio of the minimum distance d1 (or minimum distance d2) to the length L1 can be greater than or equal to 0.25 and less than or equal to 0.45. Accordingly, during the extension and retraction of the stretchable panel 10, the conductor structures 121 and 122 can be prevented from contacting the dummy structure 131a. Since the minimum distance between the dummy structure 131b and the conductor structure 123 or conductor structure 124 is also configured with a similar ratio relationship, it will not be described further here.

[0057] Furthermore, a dummy structure 132 may be provided in the hollow area HA2 between adjacent wire structures 121 and 123 that bend and extend in different directions. The dummy structure 132 is located in the hollow area HA2 within the region with the maximum width along the X direction (i.e., the maximum gap between wire structures 121 and 123 along the X direction, such as...). Figure 1 (As shown). In this embodiment, the projected profile of the dummy structure 132 in the Z direction is, for example, a semicircle, but is not limited thereto. In other modified embodiments, the projected profile of the dummy structure 132 in the Z direction can be a polygon.

[0058] In this embodiment, the island element 100 has the same element width Wd along both the X and Y directions, and the dummy structure 132 has a structure width Ws along the X direction. Preferably, the ratio of the structure width Ws to the element width Wd is greater than or equal to 0.16 and less than or equal to 0.3.

[0059] Because the cutout area HA2, which extends in different directions and is too large in the maximum width region between two adjacent conductor structures 120, makes it difficult to control the etching rate during the manufacturing process. This results in over-etching of the side edges of some insulating layers of the conductor structures, exposing parts of the conductive layer. Therefore, by setting up the dummy structure 132, the etching uniformity of the cutout area HA2 can be effectively improved, thereby avoiding the aforementioned problem of over-etching.

[0060] In this embodiment, the dummy structure 132 has a minimum distance d3 with the conductor structure 121, while the dummy structure 132 has a minimum distance d4 with the conductor structure 123. Preferably, the ratio of the structure width Ws to the minimum distance d3 (or minimum distance d4) is greater than or equal to 1.2 and less than or equal to 1.7. Accordingly, during the extension and retraction of the stretchable panel 10, the conductor structure 121 and conductor structure 123 can be prevented from contacting the dummy structure 132.

[0061] Specifically, in this embodiment, each island element 100 has a wire structure 120 connected to each of its four sides, and the extension directions of the two wire structures 120 connected to any two adjacent sides are not the same. For example, wire structures 121 and 124 connecting island element 102, wire structures 124 and 122 connecting island element 104, or wire structures 122 and 123 connecting island element 103. Therefore, the aforementioned dummy structure 132 can be provided between these two adjacent wire structures with different extension directions. That is, in this embodiment, each island element 100 can have four dummy structures 132 on each of its four sides (e.g., Figure 1 (As shown). The configuration relationship between each dummy structure 132 and its two adjacent conductor structures with different extension directions is roughly similar, and will not be described in detail here.

[0062] In this embodiment, each dummy structure 132 is connected to its adjacent island element 100, but this is not a limitation. In other embodiments, if the shortest distance between the dummy structure 132 and its adjacent wire structure is large enough, the dummy structure 132 and its adjacent island element 100 may not be connected (i.e., structurally separated from each other).

[0063] Furthermore, in this embodiment, each of the plurality of dummy structures 130 may be provided with a substrate pattern SBP, an insulating pattern INSP, and a functional pattern FP. The insulating pattern INSP is disposed on the substrate pattern SBP. The functional pattern FP is disposed on the insulating pattern INSP. The material of the functional pattern FP includes, for example, metal or metal oxide. For example, in this embodiment, the substrate pattern SBP and the substrate SB are the same film layer and are structurally separated from each other. More specifically, the substrate pattern SBP and the substrate SB are formed from the same substrate in an etching process of the cutout area.

[0064] On the other hand, the insulating pattern INSP and the insulating layer closest to the substrate SB among the multiple insulating layers of the wire structure 120 (e.g., insulating layer INS0) are the same film layer, and the functional pattern FP and the conductive layer closest to the substrate SB among the multiple conductive layers of the wire structure 120 (e.g., conductive layer CL1) are the same film layer. In other words, the dummy structure 130 can be formed simultaneously by the multiple film layers constituting the wire structure 120, thus avoiding the need for additional manufacturing processes.

[0065] In this embodiment, each island element 100 and the substrate SB have a height H1 along the stacking direction (e.g., direction Z), each dummy structure 130 has a height H2 along the stacking direction, and each wire structure 120 and the substrate SB have a height H3 along the stacking direction. It should be noted that the dummy structure 130, besides improving the etching uniformity of the cutout area HA, can also serve as a basis for determining the etching endpoint during the etching process. That is, the height H2 of the dummy structure 130 is less than the height H1 of the island element 100 and the substrate SB, and the height H3 of the wire structure 120 and the substrate SB. Preferably, the ratio of height H2 to height H1 can be less than or equal to 0.25.

[0066] In this embodiment, the stretchable panel 10 may further include a stretchable substrate 50 and an adhesive layer 60. The stretchable substrate 50 is disposed on the side of the substrate SB facing away from the plurality of island elements 100 and the plurality of wire structures 120. The adhesive layer 60 connects the stretchable substrate 50, the substrate SB, and the plurality of dummy structures 130. Alternatively, the substrate SB and its plurality of island elements 100, plurality of wire structures 120, and plurality of dummy structures 130 are attached to the stretchable substrate 50 via the adhesive layer 60.

[0067] The manufacturing process of the stretchable panel 10 will be described exemplarily below. First, the substrate SB, insulating layer INS0, conductive layer CL1, and functional pattern FP, insulating layer INS1, conductive layer CL2, insulating layer INS2, conductive layer CL3, and insulating layer INS3 (e.g., ...) are sequentially formed on the carrier board CR. Figure 3A(As shown). Next, the insulating layer INS3 is patterned using photolithography etching technology, and a hard mask MSK (as shown) is formed on the patterned insulating layer INS3. Figure 3B (As shown).

[0068] After forming the hard mask MSK, the first stage of the dry etching process is performed on the insulating layers INS2 and INS1 (e.g., ...). Figure 3B and Figure 3C (As shown). In this embodiment, the dry etching is, for example, reactive ion etching (RIE). When the functional pattern FP is exposed during the first stage of dry etching, the etching equipment can determine whether the first stage of etching has reached its target endpoint by detecting the characteristic spectral changes generated by the exposed functional pattern FP. That is, the functional pattern FP can serve as the basis for triggering the termination of the first stage of dry etching fabrication process.

[0069] After revealing the functional pattern FP, a second-stage dry etching process is performed on the insulating layer INS0 and the substrate SB (e.g., ...). Figure 3C and Figure 3D (As shown). In this embodiment, both stages of dry etching employ reactive ion etching, but the etching parameters are different. For example, the etching rate of the second stage may be higher than that of the first stage, but this is not a limitation.

[0070] After the second-stage dry etching process is completed, multiple cutout areas HA of the substrate SB, as well as the insulating pattern INSP of the dummy structure 130 and the substrate pattern SBP (such as...) will be formed. Figure 3D (As shown). Next, a functional protective film 180 (such as...) is attached to the side of the carrier plate CR where the dummy structure 130 is formed. Figure 3E (As shown). In this embodiment, the functional protective film 180 may include a substrate layer 181 and a release adhesive layer 182. The substrate layer 181 may include, for example, polyethylene terephthalate (PET), polyolefin (PE / PP), or polyimide (PI), but is not limited thereto. The release adhesive layer 182 may include, for example, a UV-variable adhesive layer, but is not limited thereto.

[0071] It should be noted that, in order to prevent the release adhesive layer 182 from failing to adhere to the dummy structure 130 during the application process, the height H2 of the dummy structure 130 cannot be too small. Preferably, the height H2 of the dummy structure 130 is... Figure 2A The ratio of the height H3 of the conductor structure 120 to that of the substrate SB, or the height H2 of the dummy structure 130, to... Figure 2BThe ratio of the height H1 of the island-shaped element 100 to the substrate SB can be greater than or equal to 0.105. This ensures the adhesion between the functional protective film 180 and the multiple dummy structures 130, thereby avoiding the problem of splashing contamination caused by the dummy structures 130 falling out of their designed positions during subsequent manufacturing processes.

[0072] Next, remove the carrier board CR (such as Figure 3F As shown), and utilizes a functional protective film 180 to enclose multiple wire structures 120 (and Figure 3F Multiple island-shaped elements (not shown in the figure) and multiple dummy structures 130 are transferred to the stretchable substrate 50 and fixed to the stretchable substrate 50 using an adhesive layer 60 (e.g., Figure 3G (As shown). To prevent the dummy structure 130 from splashing into the area where the island element or wire structure 120 is set during the pasting process, the adhesive layer 60 may be made of a strong optical adhesive with a viscosity greater than 100 gf / 25mm, but is not limited thereto.

[0073] After attaching to the stretchable substrate 50, the release adhesive layer 182 is exposed to light (e.g., UV light, but not limited thereto) to reduce its viscosity, thereby removing the functional protective film 180 and completing the fabrication of the stretchable panel 10 of this embodiment.

[0074] It should be noted that, in addition to the aforementioned functions, the dummy structure 130 can also serve as a alignment mark for aligning the structural film layer with the machine tool during the manufacturing process of the stretchable panel 10. In particular, the elliptical major and minor axis designs of dummy structures 131a and 131b further highlight the directional alignment.

[0075] Figure 4 yes Figure 1 A top view schematic diagram of another variant embodiment of the stretchable panel. Please refer to... Figure 4 ,exist Figure 1 In another modified embodiment of the stretchable panel 10, the stretchable panel 10A may not be provided with Figure 1 Multiple dummy structures 132 in the middle.

[0076] Another embodiment will be described below to illustrate the present invention in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the foregoing embodiment, and they will not be repeated below.

[0077] Figure 5 This is a top view of a stretchable panel according to a second embodiment of the present invention. Figure 6 yes Figure 5 A top view schematic diagram of another variant embodiment of the stretchable panel. Please refer to... Figure 5 In this embodiment, the stretchable panel 20 and Figure 1The only difference between the stretchable panel 10 and the previous one is the configuration of the dummy structure. Specifically, in the stretchable panel 20 of this embodiment, the projected outline of the dummy structure 131-A in the Z direction can be circular. With this design, the dummy structure 131-A is less likely to interfere with the adjacent wire structure 120 during the stretching process of the stretchable panel 20, which helps to increase the stretchability of the stretchable panel 20.

[0078] Please refer to Figure 6 ,exist Figure 5 In another modified embodiment of the stretchable panel 20, the stretchable panel 20A may not be provided with Figure 5 Multiple dummy structures 132 in the middle.

[0079] In summary, in a stretchable panel according to an embodiment of the present invention, the substrate has multiple cutout areas that do not overlap with the multiple island elements and multiple wire structures. These cutout areas contain multiple dummy structures spaced apart from the multiple island elements and multiple wire structures. During the formation of the multiple cutout areas, the arrangement of these dummy structures provides a more accurate basis for switching etching process parameters, contributing to improved etching yield.

Claims

1. A stretchable panel, comprising: The substrate has multiple cutout areas; Multiple island-shaped elements are disposed on the substrate; Multiple conductive wire structures are disposed on the substrate and connect the multiple island-shaped elements, wherein the multiple island-shaped elements and the multiple conductive wire structures do not overlap the multiple hollow areas; as well as Multiple dummy structures are disposed within the multiple hollow areas, wherein one of the multiple dummy structures is disposed between any two adjacent wire structures, and the substrate and any two adjacent wire structures are structurally spaced apart from the one of the multiple dummy structures.

2. The stretchable panel as claimed in claim 1, wherein each of the plurality of dummy structures is provided with: Substrate pattern; An insulating pattern is disposed on the substrate pattern; and A functional pattern is disposed on the insulating pattern, wherein the material of the functional pattern includes metal or metal oxide.

3. The stretchable panel as claimed in claim 2, wherein each of the plurality of conductive structures is provided with a plurality of insulating layers and a plurality of conductive layers stacked alternately, the insulating layer closest to the substrate being the same film layer as the insulating pattern, and the conductive layer closest to the substrate being the same film layer as the functional pattern.

4. The stretchable panel as claimed in claim 2, wherein the substrate pattern and the substrate are the same film layer and are structurally separate from each other.

5. The stretchable panel of claim 1, wherein the plurality of island elements includes a first island element and a second island element arranged adjacent to each other along a first direction, and a third island element and a fourth island element arranged adjacent to each other along the first direction, the first island element and the third island element arranged adjacent to each other along a second direction, the second island element and the fourth island element arranged adjacent to each other along the second direction, the first direction intersecting the second direction, the plurality of conductive structures including a first conductive structure connecting the first island element and the second island element and a second conductive structure connecting the third island element and the fourth island element, the plurality of cutout areas including a first cutout area located between the first conductive structure and the second conductive structure, and the plurality of dummy structures including a first dummy structure located in the area having the maximum width along the second direction in the first cutout area.

6. The stretchable panel of claim 5, wherein the first dummy structure has a first length and a second length along the first direction and the second direction, respectively, and the ratio of the second length to the first length is greater than or equal to 1 and less than or equal to 5.

5.

7. The stretchable panel of claim 6, wherein the plurality of island elements are arranged at pitch intervals along the second direction, and the ratio of the second length to the pitch is greater than or equal to 0.15 and less than or equal to 0.

75.

8. The stretchable panel of claim 5, wherein the first dummy structure has a first length along the first direction, the first dummy structure has a shortest distance to the first conductor structure or the second conductor structure, and the ratio of the shortest distance to the first length is greater than or equal to 0.25 and less than or equal to 0.

45.

9. The stretchable panel of claim 5, wherein the plurality of conductive structures further includes a third conductive structure connecting the first island element and the third island element, the plurality of cutout areas further includes a second cutout area located between the first conductive structure and the third conductive structure and adjacent to the first island element, and the plurality of dummy structures further includes a second dummy structure located in the area having the maximum width along the first direction in the second cutout area.

10. The stretchable panel of claim 9, wherein the first island element has an element width along the first direction, the second dummy structure has a structure width along the first direction, and the ratio of the structure width to the element width is greater than or equal to 0.16 and less than or equal to 0.

3.

11. The stretchable panel of claim 9, wherein the second dummy structure has a structural width along the first direction, the first conductor structure and the third conductor structure each have a shortest distance to the second dummy structure, and the ratio of the structural width to the shortest distance is greater than or equal to 1.2 and less than or equal to 1.

7.

12. The stretchable panel of claim 1, further comprising: A stretchable substrate is disposed on the side of the substrate opposite to the plurality of island elements and the plurality of wire structures; as well as An adhesive layer connects the stretchable substrate, the substrate, and the plurality of dummy structures.

13. The stretchable panel of claim 1, wherein each of the plurality of island elements and the substrate has a first height along the stacking direction, each of the plurality of dummy structures has a second height along the stacking direction, and the ratio of the second height to the first height is greater than or equal to 0.105 and less than or equal to 0.25.

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