Circuit board structure and laser radar

Abstract

The application relates to the technical field of flexible circuit boards, and provides a circuit board structure and a laser radar. The circuit board structure comprises a substrate, a main control circuit board, a flexible circuit board and a scanning module, the first end of the flexible circuit board is fixedly connected with the main control circuit board, and the second end of the flexible circuit board is located between the scanning module and the substrate; the substrate comprises a first positioning column extending in a first direction, the second end of the flexible circuit board comprises a first positioning hole, and the first positioning column is embedded in the first positioning hole; the substrate further comprises a second positioning column extending in the first direction, the scanning module comprises a second positioning hole, the second positioning column is embedded in the second positioning hole, and the difference between the aperture of the first positioning hole and the outer diameter of the first positioning column is greater than the difference between the aperture of the second positioning hole and the outer diameter of the second positioning column. Based on the circuit board structure, efficient assembly of the flexible circuit board can be realized in limited space, and the laser radar is conducive to miniaturization design.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit board mounting technology, and in particular to a circuit board structure and a lidar. Background Technology

[0002] LiDAR is a high-precision detection instrument that integrates components such as a scanning module, a transmitting module, a receiving module, and a main control circuit board. Flexible printed circuit boards (FPCs) are widely used to meet the wiring requirements of LiDAR.

[0003] Traditional flexible circuit board mounting technology requires sufficient insertion and removal space, making it difficult to meet the increasingly stringent miniaturization requirements of LiDAR applications. To address this challenge, existing technologies typically employ floating connectors. Floating connectors automatically engage after structural components are mated. However, floating connectors suffer from lower stability, complex structure, and higher cost. Summary of the Invention

[0004] The purpose of this invention is to provide a circuit board structure and a lidar, which aims to improve assembly efficiency within a limited space and facilitate the miniaturization of lidar design.

[0005] In a first aspect, this application provides a circuit board structure, which includes a substrate, a main control circuit board, a flexible circuit board, and a scanning module. The main control circuit board is fixed to the substrate, a first end of the flexible circuit board is fixedly connected to the main control circuit board, and a second end of the flexible circuit board is located between the scanning module and the substrate.

[0006] The substrate includes a first positioning post extending along a first direction, and the second end of the flexible circuit board includes a first positioning hole, wherein the first direction is the thickness direction of the substrate, and the first positioning post is embedded in the first positioning hole.

[0007] The substrate also includes a second positioning post extending along the first direction, and the scanning module includes a second positioning hole, wherein the second positioning post is embedded in the second positioning hole, and the difference between the diameter of the first positioning hole and the outer diameter of the first positioning post is greater than the difference between the diameter of the second positioning hole and the outer diameter of the second positioning post.

[0008] In some embodiments, the scanning module includes a rotating mirror, a rotating mirror circuit board, and a rotating mirror bracket, wherein the rotating mirror bracket includes the second positioning hole, the rotating mirror circuit board is located between the rotating mirror bracket and the rotating mirror, and the second end of the flexible circuit board is located between the rotating mirror bracket and the substrate.

[0009] In some embodiments, the rotating mirror support further includes a third positioning hole, and the substrate further includes a third positioning post extending along the first direction, wherein the third positioning post is embedded in the third positioning hole, and the third positioning hole is a strip-shaped hole. The strip-shaped hole is used to define a single position adjustment direction, thereby limiting the scanning module to adjust its pose in a single direction, thus achieving more rapid and accurate alignment between the second positioning hole and the second positioning post, and improving assembly efficiency.

[0010] In some embodiments, the diameter of the third positioning hole is larger than the outer diameter of the third positioning post. The third positioning hole can serve as a coarse positioning hole to assist in the rapid positioning of the fine positioning hole (second positioning hole). The cooperation between the third positioning hole and the third positioning post further restricts the relative position between the scanning module and the substrate, based on the movable embedding of the first positioning post and the first positioning hole. At the same time, a certain amount of float is still retained, which facilitates the precise alignment of the second positioning post and the second positioning hole within a smaller pose adjustment range of the scanning module, thereby improving assembly efficiency.

[0011] In some embodiments, the rotating mirror bracket further includes a first through hole, the rotating mirror circuit board includes a first connector, and the second end of the flexible circuit board further includes a second connector, wherein the first connector passes through the first through hole and is fixedly connected to the second connector.

[0012] In some embodiments, the substrate further includes a first protrusion extending along the first direction, and a second positioning post extending along the first direction from the first protrusion. The sum of the length of the first protrusion along the first direction and the length of the second positioning post along the first direction constitutes a third length, which is greater than the length of the first positioning post along the first direction. During installation, the rotating mirror bracket will first contact the second and third positioning posts for precise positioning and embedding, without first contacting the first positioning post, thus preventing the first positioning post from affecting the installation of the scanning module.

[0013] In some embodiments, the substrate further includes a second protrusion extending along the first direction, wherein the first protrusion abuts against the surface of the rotating mirror bracket facing the substrate, and the second protrusion abuts against the surface of the rotating mirror bracket facing the substrate. The length of the second protrusion along the first direction is equal to the length of the first protrusion along the first direction. The first protrusion, in conjunction with a plurality of second protrusions, serves to separate the rotating mirror bracket and the substrate to accommodate the second end of the flexible circuit board. This prevents the second end of the flexible circuit board from contacting the substrate or the rotating mirror bracket and thus bearing assembly stress, ensuring the successful setting of the gap between the second end of the flexible circuit board and the substrate. Simultaneously, the first protrusion and the plurality of second protrusions can also serve as limiting members for the scanning module in the first direction to control the mounting position of the scanning module in the first direction. The dispersed first protrusion and the plurality of second protrusions also provide stable support, improving the mounting stability of the scanning module.

[0014] In some embodiments, the substrate further includes a third protrusion extending along the first direction, the third protrusion including a fourth positioning post extending along the first direction, the main control circuit board including a fourth positioning hole and a third connector, and the first end of the flexible circuit board including the fourth connector, wherein the fourth positioning post is embedded in the fourth positioning hole, and the third connector is fixedly connected to the fourth connector. The third protrusion is used to support and fix the main control circuit board, and the third protrusion is also used to separate the substrate and the main control circuit board to prevent the main control circuit board from being subjected to excessive installation stress or stress caused by substrate deformation.

[0015] In some embodiments, a gap along the first direction exists between the second end of the flexible circuit board and the substrate. This gap effectively prevents hard contact between the flexible circuit board and the substrate or rotating mirror circuit board, preventing stress caused by the installation process or external environmental impacts from damaging the flexible circuit board, and improving the operational stability and reliability of the flexible circuit board.

[0016] Secondly, this application provides a lidar, including a transmitting module, a receiving module, and a circuit board structure as described in any one of the above.

[0017] The beneficial effects of the circuit board structure and lidar provided by this invention are as follows: A preset adjustment margin is provided between the first positioning hole at the second end of the flexible circuit board and the first positioning post of the substrate. While achieving initial positioning between the second end of the flexible circuit board and the substrate, adjustment space is reserved for the pose adjustment of the second end of the flexible circuit board. This allows for precise alignment of the scanning module and the substrate, requiring only slight adjustments to the pose of the second end of the scanning module or the flexible circuit board to achieve insertion between the first connector on the rotating mirror assembly circuit board and the second connector at the second end of the flexible circuit board. This reduces the installation difficulty of the flexible circuit board within a limited space, improves the assembly efficiency of the circuit board structure, and facilitates the miniaturization of lidar. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a circuit board structure provided in an embodiment of the present invention;

[0020] Figure 2 An exploded view of a circuit board structure provided in an embodiment of the present invention;

[0021] Figure 3 for Figure 1 A cross-sectional view of the circuit board structure along line AA;

[0022] Figure 4 for Figure 1 A cross-sectional view of the circuit board structure along line BB;

[0023] Figure 5 This is a schematic diagram of the installation of a scanning module in an embodiment of the present invention;

[0024] Figure 6 This is a schematic diagram of the installation of a scanning module in an embodiment of the present invention;

[0025] Figure 7 This is a schematic diagram of the installation of a scanning module in an embodiment of the present invention;

[0026] Figure 8 This is a schematic diagram of a circuit board structure according to an embodiment of the present invention.

[0027] In the figure, the reference numerals are as follows: 100, substrate; 110, first positioning post; 120, second positioning post; 130, first boss; 140, second boss; 150, fourth positioning post; 160, third boss; 170, third positioning post; 200, main control circuit board; 210, fourth positioning hole; 220, third connector; 300, flexible circuit board; 310, first end; 311, fourth connector; 320, second end; 321, first positioning hole; 322, second connector; 400, scanning module; 401, second positioning hole; 402, third positioning hole; 410, rotating mirror; 420, rotating mirror circuit board; 421, first connector; 430, rotating mirror bracket; 431, first through hole. Detailed Implementation

[0028] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0029] To meet the wiring requirements of LiDAR (LiDAR) systems, FPCs (Flexible Printed Circuits) are widely used to connect the various electronic components within the LiDAR system. However, traditional FPC mounting techniques require sufficient space for insertion and removal, making it difficult to adapt to the increasingly stringent miniaturization requirements of LiDAR applications. In particular, to connect the scanning module mounted on the substrate and the main control circuit board, the FPC typically needs to be positioned in a narrow space between the scanning module and the substrate to avoid obstructing the rotating scanning module, posing a significant challenge to FPC positioning and installation. Existing technologies typically use floating connectors to address these issues. Floating connectors automatically engage after structural components are mated. However, floating connectors suffer from low stability, complex installation and maintenance, and high cost, failing to meet the stringent miniaturization requirements of LiDAR systems in automotive applications.

[0030] In one embodiment, combined Figure 1 and Figure 2This application provides a circuit board structure. The circuit board structure includes a substrate 100, a main control circuit board 200, a flexible circuit board 300, and a scanning module 400. The main control circuit board 200 and the scanning module 400 are both fixedly mounted on the substrate 100. The substrate 100 is fixed inside the lidar housing, or the substrate 100 is part of the lidar housing. The scanning module 400 includes a motor, a scanning element, a control circuit board corresponding to the scanning element, and a mounting bracket corresponding to the scanning element. The scanning element is a rotating mirror, a galvanometer mirror, or a tilting mirror, used to rotate under the drive of the motor to reflect the scanning beam or echo beam. The control circuit board corresponding to the scanning element is used to control the motor's operation and adjust operating parameters such as motor speed, operating voltage, operating current, and operating time according to control commands sent by the main control circuit board 200.

[0031] In one embodiment, combined Figures 1 to 4 The scanning element is a rotating mirror 410, and the corresponding control circuit board is a rotating mirror circuit board 420. The scanning module 400 includes a motor (not shown in the figure), a rotating mirror 410, a rotating mirror circuit board 420, and a rotating mirror support 430. The rotating mirror circuit board 420 and the main control circuit board 200 are electrically connected based on a flexible circuit board 300. The first end 310 of the flexible circuit board 300 is fixedly connected to the main control circuit board 200, which is fixedly mounted on the substrate 100. The second end 320 of the flexible circuit board 300 is located between the rotating mirror support 430 and the substrate 100.

[0032] In one example, the substrate 100 includes a first positioning post 110 extending along a first direction, and the second end 320 of the flexible circuit board 300 includes a first positioning hole 321. The first direction is the thickness direction (Z-axis direction) of the substrate 100. The first positioning post 110 is embedded in the first positioning hole 321 along the first direction to achieve initial positioning between the substrate 100 and the flexible circuit board 300. The substrate 100 also includes a second positioning post 120 and a third positioning post 170 extending along the first direction. The rotating mirror support 430 includes a second positioning hole 401 and a third positioning hole 402. The second positioning post 120 passes through the second positioning hole 401, and the third positioning post 170 passes through the third positioning hole 402 to limit the relative position between the rotating mirror support 430 and the substrate 100.

[0033] In one example, the rotating mirror bracket 430 has a first through hole 431, and the rotating mirror circuit board 420 is located between the rotating mirror bracket 430 and the rotating mirror 410, making the entire scanning module 400 more compact. The rotating mirror circuit board 420 is surrounded and protected by the rotating mirror bracket 430 and the rotating mirror 410, reducing potential damage to the rotating mirror circuit board 420 caused by vibration or external interference. The rotating mirror circuit board 420 includes a first connector 421, and the second end 310 of the flexible circuit board 300 includes a second connector 322 facing the rotating mirror circuit board 420. The first connector 421 and the second connector 322 are non-floating connectors. The first connector 421 passes through the first through hole 431 along a first direction and is then embedded in the second connector 322 to achieve electrical connection between the rotating mirror circuit board 420 and the main control circuit board 200.

[0034] In one embodiment, reference Figure 4 The diameter φa of the first positioning hole 321 is greater than the outer diameter φb of the first positioning post 110, and the difference between their diameters is called the first diameter difference. The diameter of the second positioning hole 401 is slightly greater than or equal to the outer diameter of the second positioning post 120, or the second positioning hole 401 and the second positioning post 120 are interference-fitted (the outer diameter of the second positioning post 120 is slightly greater than the diameter of the second positioning hole 401). The difference between the diameter of the second positioning hole 401 and the outer diameter of the second positioning post 120 is called the second diameter difference. The first diameter difference is greater than the second diameter difference. In the circuit board structure of this application, the first positioning hole 321 is used as a coarse positioning hole, and the second positioning hole 401 is set as a fine positioning hole, so as to realize the movable embedding of the first positioning post 110 and the first positioning hole 321, thereby realizing the initial positioning of the second end 320 of the flexible circuit board 300, and reserving adjustment margin for the subsequent fine positioning of the second end 320 of the flexible circuit board 300. In addition, it is beneficial to quickly align the second positioning hole 401 and the second positioning post 120.

[0035] In one embodiment, the first aperture difference is related to the mounting tolerance of the first connector 421 on the rotating mirror circuit board 420. The mounting tolerance of the first connector 421 refers to the mounting tolerance in a plane perpendicular to the first direction. The first aperture difference should be consistent with the mounting tolerance of the first connector 421 to allow for a certain amount of movement in the flexible circuit board 300 or the scanning module 400, thereby ensuring that the first connector 421 and the second connector 322 can be aligned. For example, the mounting tolerance of the first connector 421 is ±0.5 mm, and the first aperture difference is greater than 0.7 mm.

[0036] In one embodiment, the diameter φa of the first positioning hole 321 is 120% to 300% of the outer diameter φb of the first positioning post 110. On the one hand, φa is greater than or equal to 120%*φb to ensure the movable insertion between the first positioning post 110 and the first positioning hole 321 under the condition of adapting tolerances, and to realize the initial positioning of the second end 320 of the flexible circuit board 300 on the substrate 100, which helps to reduce the assembly difficulty. On the other hand, φa is less than or equal to 300%*φb to limit the relative displacement between the first positioning post 110 and the first positioning hole 321, thereby controlling the floating amount of the second end 320 of the flexible circuit board 300. This reduces the insertion difficulty between the first connector 421 and the second connector 322 in the subsequent precise positioning process. It is beneficial to realize the rapid alignment between the second end 320 of the flexible circuit board 300 and the rotating mirror circuit board 420, as well as the rapid insertion between the second positioning hole 401 on the rotating mirror bracket 430 and the second positioning post 120 of the substrate 100, thereby improving the assembly efficiency.

[0037] The diameter φa of the first positioning hole 321 refers to the diameter of the inscribed circle of the first positioning hole 321 projected onto the first plane (a plane perpendicular to the first direction). When the projection of the first positioning hole 321 onto the first plane is a circle, the diameter of that circle is the diameter φa of the first positioning hole 321. When the projection of the first positioning hole 321 onto the first plane is a polygon, the diameter of the inscribed circle of that polygon is the diameter φa of the first positioning hole 321. The diameter of the second positioning hole 401 refers to the diameter of the inscribed circle of the projection of the second positioning hole 401 onto the first plane. In one example, both the first positioning hole 321 and the second positioning hole 401 are circular, and the diameter of each positioning hole is the diameter of the circle corresponding to each hole. Both the first positioning post 321 and the second positioning post 120 are cylindrical, and the outer diameter of the positioning post is the diameter of the cylinder.

[0038] In some embodiments, the shape of the first positioning hole 321 and / or the second positioning hole 401 includes one or more combinations of circles, ellipses, rectangles, or rhombuses, without specific limitations. Circular positioning holes offer good rotational symmetry and stability, and the arc-shaped hole walls reduce stress concentration during insertion between the positioning hole and the positioning post. This reduces the contact area between the positioning hole and the positioning post, thereby reducing contact stress and thus installation stress. Rectangular positioning holes provide a larger contact area and stronger mechanical support, enhancing the limiting effect through planar contact between the positioning hole and the positioning post, and also withstanding greater mechanical stress by increasing the contact area. In one embodiment, the outer diameter profile of the first positioning post 110 is the same as the diameter profile of the first positioning hole 321. This increases the contact area between them, facilitating better stress dispersion and enhancing the limiting effect. Furthermore, it helps control assembly tolerances, ensuring that the difference between the diameter of the first positioning hole 321 and the outer diameter of the first positioning post 110 meets the intended design target.

[0039] In one embodiment, combined Figures 4 to 7 The assembly process of the circuit board structure in the embodiment of this application will be described, wherein the pose of each component in the scanning module 400 is adjusted as a whole.

[0040] S101, Reference Figure 4 and Figure 5 The second end 320 of the flexible circuit board 300 is moved using a jig so that the first positioning post 110 passes through the first positioning hole 321, thereby achieving the initial positioning of the second end 320 of the flexible circuit board 300. The first end 310 of the flexible circuit board 300 is fixed on the substrate 100.

[0041] S102, Reference Figure 5 After the initial positioning of the second end 320 of the flexible circuit board 300 is completed, the scanning module 400 is moved using a fixture to align the second positioning hole 401 with the second positioning post 120, and the pose of the flexible circuit board 300 or the pose of the scanning module 400 is slightly adjusted to align the first connector 421 with the second connector 322.

[0042] S103, Reference Figure 6 After step S102 is completed, a constant force F along the Z-axis is applied based on the fixture to slowly move the scanning module 400 toward the substrate 100. The second connector 322 first contacts the first connector 421. After the first connector 421 is partially inserted into the second connector 322, the second positioning post 120 contacts the second positioning hole 401. As the first connector 421 continues to slowly insert into the second connector 322, the second positioning post 120 also slowly inserts into the second positioning hole 401.

[0043] In the assembly process of the above-mentioned circuit board structure, based on the size preset method that the first hole diameter difference is greater than the second hole diameter difference, the first positioning hole 321 is set as a coarse positioning hole, and the second positioning hole 401 is set as a fine positioning hole. On the one hand, the first positioning hole 321 is set as a coarse positioning hole to realize the movable embedding of the first positioning post 110 and the first positioning hole 321. This achieves the initial positioning of the second end 320 of the flexible circuit board 300 and restricts the relative displacement between the second end 320 of the flexible circuit board 300 and the substrate 100; at the same time, the preset first hole diameter difference reserves adjustment margin for the precise positioning of the second end 320 of the flexible circuit board 300 in the subsequent step S102. On the other hand, the second positioning hole 401 is set as a fine positioning hole. When the second positioning hole 401 and the second positioning post 120 are aligned, the second end 320 of the flexible circuit board 300 only needs to be slightly adjusted in posture to achieve the alignment of the first connector 421 and the second connector 322, thereby achieving the precise positioning and fixed connection of the second end 320 of the flexible circuit board 300. Within the limited space between the rotating mirror bracket 430 and the substrate 100, the installation difficulty of the flexible circuit board 300 is reduced, which is conducive to the rapid positioning and fixed connection between the substrate 100, the scanning module 400 and the flexible circuit board 300, and is conducive to improving the assembly efficiency of the circuit board structure and the connection stability between the components.

[0044] If the second end 320 of the flexible circuit board 300 is not provided with a coarse positioning hole (first positioning hole 321) to restrict the spatial position of the second end 320 of the flexible circuit board 300, the position of the second end 320 of the flexible circuit board 300 will change significantly during the installation process. Within the limited assembly space, it is impossible to efficiently achieve rapid alignment and stable connection of the first connector 421 and the second connector 322. This FPC installation method based on the combination of coarse and fine positioning holes has better reliability and installation stability, and higher assembly efficiency compared to traditional manual assembly methods; compared to the installation method based on floating connectors, it is more adaptable to various scenarios, has better connection stability, is easier to maintain, and has lower costs.

[0045] In one embodiment, the second end 320 of the flexible circuit board 300 is fixedly mounted between the rotating mirror bracket 430 and the substrate 100, thus obtaining the surrounding protection of the rotating mirror bracket 430 and the substrate 100. However, to prevent the flexible circuit board 300 from being subjected to stress compression, refer to... Figure 4A gap c along a first direction is provided between the second end 320 of the flexible circuit board 300 and the substrate 100. In one example, the preset value of the gap c is greater than the mounting tolerance of the scanning module 400. For example, if the mounting tolerance of the scanning module 400 in the first direction is 0.15 mm, the value of the gap c can be 0.25 mm, 0.30 mm, or 0.35 mm, etc., thereby ensuring that there is a gap c between the second end 320 of the flexible circuit board 300 and the substrate 100, and preventing the rotating mirror circuit board 430 from pressing the flexible circuit board 300 onto the substrate 100 during the assembly of the scanning module 400 onto the substrate 100 along the first direction. In another example, the preset value of the gap c is related to the effective mating length of the connector. For example, if the effective mating length threshold of the first connector 421 and the second connector 322 is 0.6 mm, and the allowance for the first connector 421 to move downwards in the first direction is 1 mm, then the preset value of the gap c should be less than 0.4 mm, such as 0.25 mm, 0.15 mm, or 0.1 mm, to ensure the reliability of the electrical connection. The setting of the gap c can effectively avoid hard contact between the flexible circuit board 300 and the substrate 100 or the rotating mirror circuit board 430, preventing stress caused by the installation process or external environmental impact from damaging the flexible circuit board 300, and improving the working stability and reliability of the flexible circuit board 300.

[0046] In one embodiment, after steps S101 to S103 are completed, refer to Figure 7 The first connector 421 is embedded in the second connector 322 along the first direction for a length of first length d, and the second positioning post 120 is embedded in the second positioning hole 401 along the first direction for a length of second length e, where the first length d is greater than the second length e. During the assembly of the scanning module 400 onto the substrate 100 along the first direction, the first connector 421 first contacts and begins to connect with the second connector 322 of the second end 320 of the flexible circuit board 300. At this time, the second positioning post 120 and the second positioning hole 401 have not yet begun to be embedded. That is, during the fine-tuning of the pose of the second end of the flexible circuit board 300, the second positioning post 120 and the second positioning hole 401 have not yet made contact, thus avoiding the stress generated during assembly between the first connector 421 and the second connector 322, which could affect the connection stability between the two connectors. When the second positioning post 120 begins to be inserted into the second positioning hole 401, the first connector 421 and the second connector 322 are already partially connected, and no further position adjustment is required. Moreover, the length of the first connector 421 embedded in the second connector 322 along the first direction is gradually increasing, so there will be no relative misalignment that could lead to connection failure or internal stress.

[0047] In one embodiment, reference Figure 2The substrate 100 also includes a first protrusion 130 and a plurality of second protrusions 140 extending along a first direction. A second positioning post 120 is formed extending from the first protrusion 130 along the first direction. The sum of the length of the first protrusion 130 along the first direction and the length of the second positioning post 120 along the first direction is a third length, which is greater than the length of the first positioning post 110 along the first direction and equal to the length of the third positioning post 170 along the first direction. Based on this, in installation step S103, the rotating mirror bracket 430 will first contact the second positioning post 120 and the third positioning post 170 for precise positioning and embedding, without first contacting the first positioning post 110, thus preventing the first positioning post 110 from affecting the installation of the scanning module 400.

[0048] In one embodiment, the length of the first boss 130 along a first direction is equal to the length of the second boss 140 along a second direction. The first boss 130 abuts against the surface of the rotating mirror bracket 430 facing the substrate 100, and each second boss 140 abuts against the surface of the rotating mirror bracket 430 facing the substrate 100. The first boss 130, in conjunction with the multiple second bosses 140, supports the rotating mirror bracket 430. The dispersed distribution of the first boss 130 and the multiple second bosses 140 provides stable support, improving the installation stability of the scanning module 400. The first boss 130, in conjunction with the multiple second bosses 140, also separates the rotating mirror bracket 430 from the substrate 100, supports the rotating mirror bracket 430, and accommodates the second end 320 of the flexible circuit board 300. This prevents the second end 320 of the flexible circuit board 300 from contacting the substrate 100 or the rotating mirror bracket 430 and thus bearing assembly stress, ensuring the successful setting of the gap c between the second end 320 of the flexible circuit board 300 and the substrate 100. Meanwhile, the first boss 130 and the plurality of second bosses 140 can also serve as limiting members of the scanning module 400 in the first direction to control the installation position of the scanning module 400 in the first direction.

[0049] In one embodiment, the third positioning post 170 is embedded in the third positioning hole 402. The third positioning hole 402 is a strip-shaped hole, which is used to define a single position adjustment direction, thereby limiting the scanning module 400 to adjust its pose in a single direction, achieving more rapid and precise alignment between the second positioning hole 401 and the second positioning post 120, and improving assembly efficiency. In one example, the third positioning hole 402 is a strip-shaped hole, and the diameter of the third positioning hole 402 is larger than the outer diameter of the third positioning post 170. The third positioning hole 402 can serve as a coarse positioning hole to assist in the rapid positioning of the fine positioning hole (second positioning hole 401). The cooperation between the third positioning hole 402 and the third positioning post 170 can further limit the relative position between the scanning module 400 and the substrate 100, based on the movable embedding of the first positioning post 110 and the first positioning hole 321. At the same time, a certain amount of float is still retained, which facilitates the scanning module 400 to achieve precise alignment of the second positioning post 120 and the second positioning hole 401 within a smaller pose adjustment range, improving assembly efficiency.

[0050] In one embodiment, combined Figure 2 and Figure 8 As shown, the substrate 100 also includes a fourth positioning post 150, the main control circuit board 200 includes a fourth positioning hole 210 and a third connector 220, and the first end 310 of the flexible circuit board 300 includes a fourth connector 311. The fourth positioning post 150 is embedded in the fourth positioning hole 210 to achieve the fixed installation of the main control circuit board 200 on the substrate 100. The third connector 220 is fixedly connected to the fourth connector 311 to ensure a stable and reliable electrical connection between the flexible circuit board 300 and the main control circuit board 200.

[0051] In one embodiment, the fourth positioning hole 210 and the fourth positioning post 150 can be a clearance fit or an interference fit, that is, the diameter of the fourth positioning hole 210 can be slightly larger than, equal to or slightly smaller than the outer diameter of the fourth positioning post 150, without specific limitation. The third connector 220 is inserted into the fourth connector 311. The third connector 220 and the fourth connector 311 can also be connected by bonding, welding, snap-fit, etc., without limitation.

[0052] In one embodiment, combined Figure 2 and Figure 8The substrate 100 also includes a third protrusion 160 extending along a first direction, and a fourth positioning post 150 extending along the first direction on the third protrusion 160. The third protrusion 160 abuts against the surface of the main control circuit board 200 facing the substrate 100. The third protrusion 160 supports the main control circuit board 200 and separates the main control circuit board 200 from the substrate 100, preventing the main control circuit board 200 from being subjected to assembly stress or stress caused by deformation of the substrate 100. The third protrusion 160 also restricts the main control circuit board 200 from moving closer to the substrate 100, thereby limiting the main control circuit board 200 in the first direction.

[0053] In one embodiment, the rotating mirror circuit board 420 includes a second through hole, and the rotating mirror bracket 430 includes a fourth protrusion extending along a first direction. The rotating mirror 410 includes a mounting groove on the side facing the rotating mirror circuit board 420. The fourth protrusion passes through the second through hole along the first direction and is embedded in the mounting groove. Adhesive is filled into the fourth protrusion and the mounting groove to achieve a fixed connection. The rotating mirror circuit board 420 and the rotating mirror bracket 430 are fixedly connected by welding, fastener connection, bonding, snap-fitting, sleeve connection, etc., which will not be described in detail here.

[0054] In one embodiment, this application provides a lidar, including a processor, a transmitting module, a receiving module, and a circuit board structure as described in any of the embodiments. In one example, the processor is mounted on a main control circuit board 200. The processor controls the transmitting module to emit a scanning beam and also controls the receiving module to receive an echo beam. The processor also sends control commands to a motor via a flexible circuit board 300. The motor drives a rotating mirror 410 to rotate according to the control commands to reflect the scanning beam or the echo beam, thereby enabling the lidar to scan the target object.

[0055] In some embodiments, the processor may be a field-programmable gate array (FPGA), a system-on-chip (SoC), a central processing unit (CPU), a network processor (NP), a digital signal processing circuit, a micro controller unit (MCU), an application-specific integrated circuit (ASIC), or any combination thereof, for implementing the relevant functions.

[0056] In this application, the second end 320 of the flexible circuit board 300 is initially positioned on the substrate 100 through the movable embedding of the first positioning post 110 and the first positioning hole 321. On the one hand, this can improve assembly efficiency and connection stability, and simplify the connection structure; on the other hand, the setting of the first hole diameter difference and gap c can reduce the stress borne by the second end 320 of the flexible circuit board 300, and improve connection stability and reliability. In addition, the movable embedding of the first positioning post 110 and the first positioning hole 321 means that before the precise embedding of the second positioning hole 401 and the second positioning post 120, only the pose of the second end 320 of the flexible circuit board 300 or the pose of the scanning module 400 needs to be finely adjusted to achieve a reliable connection between the first connector 421 and the second connector 322, which reduces the installation difficulty of the FPC, reduces the space required for FPC plug-in connection, and is conducive to the miniaturization of LiDAR.

[0057] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Therefore, the phrases "in one embodiment" or "in some embodiments" appear in various places throughout the specification, and not all refer to the same embodiment. Furthermore, in one or more embodiments, particular features, structures, or characteristics may be combined in any suitable manner.

[0058] In the description of this invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0059] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0060] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0061] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A circuit board structure, characterized in that, The circuit board structure includes a substrate, a main control circuit board, a flexible circuit board, and a scanning module. The main control circuit board is fixed to the substrate, a first end of the flexible circuit board is fixedly connected to the main control circuit board, and a second end of the flexible circuit board is located between the scanning module and the substrate. The substrate includes a first positioning post extending along a first direction, and the second end of the flexible circuit board includes a first positioning hole, wherein the first direction is the thickness direction of the substrate, and the first positioning post is embedded in the first positioning hole. The substrate also includes a second positioning post extending along the first direction, and the scanning module includes a second positioning hole, wherein the second positioning post is embedded in the second positioning hole, and the difference between the diameter of the first positioning hole and the outer diameter of the first positioning post is greater than the difference between the diameter of the second positioning hole and the outer diameter of the second positioning post.

2. The circuit board structure according to claim 1, characterized in that, The scanning module includes a rotating mirror, a rotating mirror circuit board, and a rotating mirror bracket. The rotating mirror bracket includes a second positioning hole. The rotating mirror circuit board is located between the rotating mirror bracket and the rotating mirror. The second end of the flexible circuit board is located between the rotating mirror bracket and the substrate.

3. The circuit board structure according to claim 2, characterized in that, The rotating mirror bracket further includes a third positioning hole, and the substrate further includes a third positioning post extending along the first direction, wherein the third positioning post is embedded in the third positioning hole, and the third positioning hole is a strip-shaped hole.

4. The circuit board structure according to claim 3, characterized in that, The diameter of the third positioning hole is larger than the outer diameter of the third positioning post.

5. The circuit board structure according to claim 2, characterized in that, The rotating mirror bracket also includes a first through hole, the rotating mirror circuit board includes a first connector, and the second end of the flexible circuit board also includes a second connector, wherein the first connector passes through the first through hole and is fixedly connected to the second connector.

6. The circuit board structure according to claim 2, characterized in that, The substrate further includes a first boss extending along the first direction, and a second positioning post extending along the first direction on the first boss. The sum of the length of the first boss along the first direction and the length of the second positioning post along the first direction is a third length, which is greater than the length of the first positioning post along the first direction.

7. The circuit board structure according to claim 6, characterized in that, The substrate further includes a second protrusion extending along the first direction, wherein the first protrusion abuts against the surface of the rotating mirror bracket facing the substrate, the second protrusion abuts against the surface of the rotating mirror bracket facing the substrate, and the length of the second protrusion along the first direction is equal to the length of the first protrusion along the first direction.

8. The circuit board structure according to claim 1, characterized in that, The substrate further includes a third protrusion extending along the first direction, the third protrusion including a fourth positioning post extending along the first direction, the main control circuit board including a fourth positioning hole and a third connector, the first end of the flexible circuit board including a fourth connector, wherein the fourth positioning post is embedded in the fourth positioning hole, and the third connector is fixedly connected to the fourth connector.

9. The circuit board structure according to claim 1, characterized in that, The second end of the flexible circuit board has a gap with the substrate along the first direction.

10. A lidar, characterized in that, It includes a transmitting module, a receiving module, and a circuit board structure as described in any one of claims 1 to 9.

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