Back-drilling site data determination method and circuit board processing system

Abstract

The application discloses a back drilling hole position data determination method and circuit board processing system. In the back drilling processing of a circuit board, original hole position data of multiple drillings on the circuit board are acquired, and abnormal hole position data is identified from the original hole position data of the multiple drillings. At least part of the multiple drillings is measured to acquire target measurement data of each measured drilling. The abnormal hole position data is corrected by using the target measurement data of each measured drilling to obtain corrected hole position data of the multiple drillings. Based on the technical scheme, the accuracy of the acquired back drilling hole position data can be effectively improved.

Description

Technical Field

[0001] This application belongs to the field of circuit board manufacturing technology, specifically relating to a method for determining back-drill hole position data and a circuit board processing system. Background Technology

[0002] Back-drilling technology for printed circuit boards (PCBs) is a key process in the field of high-frequency and high-speed signal transmission. Its purpose is to drill out unused through-hole stubs in multilayer boards to reduce signal reflection and attenuation.

[0003] Currently, the common practice in the industry is to directly output preliminary hole position data through 3D back drilling equipment after a back drilling process is completed, and use correction algorithms such as interpolation or model prediction to fill in the incomplete parts of the data. However, existing correction algorithms have blind spots or outliers in the corrected original hole position data, resulting in low accuracy of the final obtained hole position data. Summary of the Invention

[0004] This application provides a method for determining back-drilled hole position data and a circuit board processing system, which can effectively improve the accuracy of the obtained back-drilled hole position data.

[0005] In a first aspect, embodiments of this application provide a method for determining back-drilled hole location data, including: During the back drilling process of the circuit board, the original hole position data of multiple drill holes on the circuit board are obtained, and abnormal hole position data are identified from the original hole position data of the multiple drill holes. Measure at least a portion of the boreholes among the plurality of boreholes to obtain target measurement data for each borehole being measured; Using the target measurement data of each of the boreholes under test, the abnormal borehole position data are corrected to obtain corrected borehole position data for multiple boreholes.

[0006] In some embodiments, measuring at least a portion of the boreholes among the plurality of boreholes to obtain target measurement data for each borehole includes: Each of the at least a portion of the boreholes is probed to obtain multiple sets of probe data for each of the tested boreholes; Based on multiple sets of detection data for each borehole being tested, target measurement data for each borehole being tested is obtained.

[0007] In some embodiments, the step of probing each borehole in the at least a portion of the boreholes to obtain multiple sets of probe data for each of the tested boreholes includes: For each of the at least a portion of the boreholes, the borehole is probed multiple times at the same probe angle to obtain multiple sets of first probe data for the borehole being tested.

[0008] In some embodiments, obtaining target measurement data for each borehole based on multiple sets of detection data for each borehole includes: Multiple sets of first detection data for each borehole under test are filtered using a preset data filtering algorithm to obtain multiple sets of first filtered detection data for each borehole under test. Based on multiple sets of first-filter detection data for each borehole under test, target measurement data for each borehole under test is obtained.

[0009] In some embodiments, obtaining target measurement data for each borehole based on multiple sets of first filtered detection data for each borehole includes: For each borehole being tested, multiple sets of first-filtered detection data for the borehole are fused to obtain the target measurement data for the borehole. The data fusion includes any one of taking the average, taking the median, or weighted average.

[0010] In some embodiments, the step of probing each borehole in the at least a portion of the boreholes to obtain multiple sets of probe data for each of the tested boreholes includes: For each of the at least some of the boreholes, the borehole is probed at multiple different probe angles to obtain multiple sets of second probe data for the borehole being probed.

[0011] In some embodiments, obtaining target measurement data for each borehole based on multiple sets of detection data for each borehole includes: Multiple sets of second detection data for each borehole under test are filtered using a set threshold range to obtain multiple sets of second filtered detection data for each borehole under test. Based on multiple sets of second-filtered detection data for each borehole under test, target measurement data for each borehole under test is obtained.

[0012] In some embodiments, filtering multiple sets of second detection data for each borehole using a set threshold range to obtain multiple sets of filtered second detection data for each borehole includes: For each borehole being tested, the second detection data that is not within the set threshold range is removed from the multiple sets of second detection data of the borehole being tested, and the remaining second detection data is used as the multiple sets of second filtered detection data of the borehole being tested.

[0013] In some embodiments, obtaining target measurement data for each borehole based on multiple sets of second filtered detection data for each borehole includes: For each borehole being tested, multiple sets of second-filtered detection data for that borehole are fused to obtain the target measurement data for that borehole. The data fusion includes any one of taking the average, taking the median, or weighted average.

[0014] In some embodiments, correcting the abnormal borehole location data using target measurement data for each of the measured boreholes includes: From the target measurement data of each borehole being measured, obtain the target measurement data corresponding to the abnormal borehole location data; The abnormal borehole data is corrected using the target measurement data corresponding to the abnormal borehole data.

[0015] In some embodiments, the original hole position data of the plurality of holes is obtained by a circuit board processing device during the processing, and the original hole position data includes the depth data of the holes.

[0016] In some embodiments, measuring at least a portion of the boreholes among the plurality of boreholes to obtain target measurement data for each borehole includes: The target measurement data for each of the multiple drill holes is obtained by measuring all the drill holes using a probe measuring device; or... The abnormal boreholes are measured by the probe measuring device to obtain target measurement data for each borehole being measured, wherein the abnormal borehole is the borehole corresponding to the abnormal borehole location data.

[0017] Secondly, embodiments of this application provide a circuit board processing system, which includes circuit board processing equipment and probe measuring equipment, and is configured to perform a method for determining back drill hole position data as provided in the first aspect.

[0018] The method for determining back-drill hole position data in this application embodiment involves acquiring the original hole position data of multiple drill holes on the circuit board during back-drilling processing, and identifying abnormal hole position data from the original hole position data of the multiple drill holes; then, using the target measurement data of each drill hole being measured, correcting the abnormal hole position data to obtain corrected hole position data of the multiple drill holes. Since the accuracy of the target measurement data of each drill hole being measured is higher, the accuracy of the corrected hole position data of the multiple drill holes will also be improved. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A flowchart illustrating the method for determining back-drill hole location data provided in an embodiment of this application; Figure 2 A flowchart illustrating the steps for acquiring target measurement data for each borehole under test, as provided in an embodiment of this application. Figure 3 This is another flowchart illustrating the steps for acquiring target measurement data for each borehole tested, as provided in the embodiments of this application. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0022] In the description of this application, it should be understood that "multiple" means two or more, and at least one means one, two or more, unless otherwise expressly and specifically limited.

[0023] A circuit board processing device includes a base, a crossbeam, a spindle assembly, and a worktable. The worktable is mounted on the base and moves along a second direction. The crossbeam is mounted above the worktable. At least one spindle assembly slides on the crossbeam and moves along a first direction. Each spindle assembly holds a cutting tool at its bottom end, and the cutting tool moves along a third direction to process the circuit board carried on the worktable. The first, second, and third directions are perpendicular to each other. In the context of this invention, the circuit board processing device can be implemented as a drilling device, a drilling and milling integrated device, etc., and is not limited thereto.

[0024] In circuit board processing equipment, the worktable supports the circuit boards. Circuit boards come in various specifications, such as different areas, thicknesses, hardness, and processing parameters. These circuit boards are fixed to the worktable in different ways, such as using bakelite boards, pneumatic clamps, or vacuum adsorption. The worktable has at least one processing area, and each processing area holds one circuit board. Each spindle assembly corresponds to one circuit board in one processing area for processing that circuit board.

[0025] Due to the diversity of PCB materials (such as multilayer boards and flexible boards) and the differences in drilling processes, the drilling data obtained by PCB processing equipment after a single drilling process is often incomplete. For example, in the absence of reference points around the drilled hole, correction algorithms struggle to predict missing hole positions using point cloud data, resulting in blind spots or outliers in the original hole position data. Furthermore, the logic of existing correction algorithms is based on fixed rules or historical data and cannot fully adapt to all board designs. For instance, when the hole diameter, hole spacing, or material properties of the board exceed the preset range of the correction algorithm, the correction results will deviate. These limitations mean that the corrected data may still contain errors, especially in high-density or irregularly shaped PCBs, where abnormal hole position data (such as coordinate offsets or depth anomalies) cannot be effectively identified and corrected.

[0026] To address the issue of low accuracy in borehole location data in existing technologies, this application provides a method for determining back-drilled borehole location data. Please refer to [link to relevant documentation]. Figure 1 The method for determining the back-drilled hole location data includes: Step S101: During the back drilling process of the circuit board, the original hole position data of multiple drill holes on the circuit board is obtained, and abnormal hole position data is identified from the original hole position data of multiple drill holes.

[0027] In some embodiments, the original hole location data of the plurality of holes is obtained by the circuit board processing equipment during the processing, and the original hole location data includes the depth data of the holes.

[0028] Specifically, during back-drilling, circuit board processing equipment uses the drill bit as a probe element. By detecting changes in the electrical signals generated when the drill bit contacts different copper layers inside the circuit board, it obtains the depth data of each drill hole, such as the position of each copper layer, the drilling depth, and the interlayer distance. This measurement method relies on the physical contact between the drill bit and the copper layers and can obtain the position information of the drill hole in real time during the processing. However, due to factors such as tool wear, board deformation, and poor contact, the original hole position data obtained may be inaccurate or incomplete.

[0029] In some embodiments, the raw borehole location data of multiple boreholes can be output in the form of digital files. Common formats include, but are not limited to, CSV tables, XML structured files, JSON data packets, or proprietary binary formats. Furthermore, the raw borehole location data can be 3D point cloud data or 3D depth data, etc., and this specification does not impose specific limitations.

[0030] In some embodiments, data analysis can be performed directly on the original hole position data of multiple drill holes to identify abnormal hole position data. The abnormal hole position data may include the original hole position data of one or more drill holes. During data analysis, if the original hole position data of a certain drill hole is found to be empty, then the original hole position data of that drill hole is added to the abnormal hole position data. If the original hole position data of a certain drill hole is found to have data overflow, such as the drill hole depth exceeding the thickness of the circuit board, then the original hole position data of that drill hole is added to the abnormal hole position data. If the original hole position data of a certain drill hole is found to have data offset, such as the measured value corresponding to the original hole position data of that drill hole exceeding a set deviation from the average value of its adjacent drill holes (the set deviation could be 2 or 3 times the standard deviation of the adjacent drill holes), then the original hole position data of that drill hole is added to the abnormal hole position data.

[0031] In some embodiments, after obtaining the original hole position data of multiple boreholes, a correction algorithm can be used to correct the original hole position data of multiple boreholes to obtain corrected hole position data of multiple boreholes; abnormal hole position data can be identified from the corrected hole position data of multiple boreholes. Abnormal hole position data is data that the correction algorithm failed to correct or failed to correct. At this time, abnormal hole position data may include the corrected hole position data of one or more boreholes.

[0032] Specifically, when identifying abnormal hole position data from the corrected hole position data, it is also possible to analyze whether the corrected hole position data of each hole meets the abnormality judgment conditions. The abnormality judgment conditions include data missing, data overflow, and measurement values ​​exceeding the set deviation. When it is found that a certain hole meets any of the abnormality judgment conditions, the corrected hole position data of the hole is added to the abnormal hole position data. At this time, the corrected hole position data of the hole can be marked as the abnormality identifier corresponding to the abnormal hole position data.

[0033] For example, in a batch of 12-layer PCBs with a designed thickness of 2.8mm, back-drilling is required for signal vias between layers 3 and 5, with a target drilling depth of 1.2mm (i.e., stub length ≤ 0.1mm). This back-drilling is performed using PCB fabrication equipment. The equipment uses the drill bit as a probe element to acquire the original hole position data for each drilled hole during the back-drilling process. For instance, if 1000 holes are drilled, the original hole position data for each of the 1000 holes will be acquired, along with a raw data file consisting of the 1000 original hole position data for each of the 1000 drilled holes. Then, a correction algorithm is used to correct the original hole position data for each drilled hole in the raw data file, and... Abnormal hole position data identification: If hole 003 is identified with a measurement depth field of "null" and a correction status of "Fail", then the original hole position data of hole 003 is determined to be abnormal hole position data; if hole 004 is identified with a measurement depth of 3.512mm, which is greater than the plate thickness of 2.8mm, and a correction status of "Fail", then the original hole position data of hole 004 is determined to be abnormal hole position data; if hole 010 is identified with a measurement depth of 1.543mm, and the average value of adjacent normal holes such as holes 005~009 is 1.200mm, and the deviation of hole 010 from the average value of adjacent normal holes is 28.6% > the set deviation of 25%, and the correction status is "Fail", then the original hole position data of hole 010 is determined to be abnormal hole position data.

[0034] Step S102: Measure at least a portion of the boreholes among the multiple boreholes to obtain target measurement data for each borehole being measured.

[0035] In some embodiments, when measuring each borehole in at least a portion of the boreholes, each borehole in at least a portion of the boreholes is probed to obtain multiple sets of probe data for each borehole being measured; and based on the multiple sets of probe data for each borehole being measured, target measurement data for each borehole being measured is obtained.

[0036] Specifically, probe detection can be used to detect each borehole in at least a portion of the boreholes, thereby obtaining multiple sets of detection data for each borehole under test. After obtaining multiple sets of detection data for each borehole under test, these multiple sets of detection data can be used as the target measurement data for each borehole under test. Alternatively, the multiple sets of detection data for each borehole under test can be filtered to obtain multiple sets of filtered detection data for each borehole under test. Then, based on the multiple sets of filtered detection data for each borehole under test, the target measurement data for each borehole under test can be obtained. The target measurement data for a borehole under test includes the multiple sets of filtered detection data for that borehole. The number of multiple sets of filtered detection data for a borehole under test can be the same as or less than the number of multiple sets of detection data for that borehole under test.

[0037] In some embodiments, the target measurement data for each borehole is obtained through a probe measurement device. The circuit board processing equipment and the probe measurement device can be two separate devices, or they can be integrated into one unit, in which case the probe measurement device can be integrated into the circuit board processing equipment. The following example uses the circuit board processing equipment and the probe measurement device as two separate devices.

[0038] Specifically, after back-drilling the circuit board using circuit board processing equipment, the circuit board can be placed on a probe measuring device for testing. At this time, the probe can be used to detect each hole in at least a portion of the drill holes, and obtain multiple sets of detection data for each drill hole being tested.

[0039] In some embodiments, the probe measurement device can be a vision inspection device with a probe. The circuit board is pre-calibrated by the vision inspection device. Based on the calibration, the coordinates of the location of each drill hole in at least a portion of the drill holes can be more accurately identified. After the coordinates of the location of each drill hole are identified, the probe is used to detect each drill hole, thereby making the accuracy of the multiple sets of detection data of each drill hole obtained more accurate.

[0040] In some embodiments, when probing each borehole in at least a portion of the boreholes with a probe, all boreholes of the plurality of boreholes can be measured by a probe measuring device to obtain target measurement data for each borehole being measured. In this case, at least a portion of the boreholes refers to all boreholes of the plurality of boreholes.

[0041] In some embodiments, when probing each borehole in at least a portion of the boreholes using a probe, abnormal boreholes can also be measured using a probe measuring device to obtain target measurement data for each borehole being tested. Here, abnormal boreholes are the boreholes corresponding to abnormal hole location data. In this case, at least a portion of the boreholes only includes abnormal boreholes, effectively reducing the number of boreholes that need to be probed, thereby improving detection efficiency. Of course, at least a portion of the boreholes may include other parts of the multiple boreholes besides abnormal boreholes; this specification does not impose specific limitations.

[0042] Since the original hole position data is acquired simultaneously during the back drilling process on the circuit board processing equipment, normal hole positions have been initially screened out. Subsequently, only a probe measuring device is needed to precisely correct the few abnormal hole position data identified. Compared to measurement and correction using a single circuit board processing device, this method effectively improves the accuracy of abnormal hole position data correction. Furthermore, compared to a single probe measuring device requiring measurement of all drilled holes individually, this solution significantly reduces the number of drilled holes that need to be measured, thereby significantly improving the overall efficiency of abnormal hole position data correction.

[0043] In some embodiments, when probing each borehole in at least a portion of the boreholes with a probe, for each borehole in at least a portion of the boreholes, the borehole can be probed multiple times at the same probe angle, or the borehole can be probed at multiple different probe angles, thereby obtaining multiple sets of probe data for each borehole being tested.

[0044] In some embodiments, taking the drilling hole being probed multiple times at the same probe angle as an example, for each drilling hole, the control probe is probed multiple times at the same probe angle to obtain multiple sets of first probe data for the tested drilling hole.

[0045] Specifically, after acquiring multiple sets of first detection data for each borehole under test, the target measurement data for each borehole under test can be obtained directly based on the multiple sets of first detection data for each borehole under test. At this time, for each borehole in at least a portion of the boreholes, the multiple sets of first detection data for the borehole under test can be fused to obtain the target measurement data for the borehole under test. The data fusion includes any one of the following: taking the average, taking the median, weighted average, etc.

[0046] In some embodiments, such as Figure 2 As shown, after acquiring multiple sets of first detection data for each borehole under test, the steps for acquiring target measurement data for each borehole under test include steps S201-S202.

[0047] Step S201: Use a preset data filtering algorithm to filter multiple sets of first detection data for each borehole to obtain multiple sets of first filtered detection data for each borehole.

[0048] Step S202: Based on multiple sets of first-filter detection data for each borehole being tested, obtain the target measurement data for each borehole being tested.

[0049] The number of multiple sets of first filter detection data for a single borehole is no greater than the number of multiple sets of first filter detection data for that borehole.

[0050] Specifically, during the process of probing each hole in at least a portion of the drill holes using a probe in a probe measuring device, a circuit board can be mounted and fixed on the worktable of the probe measuring device. The worktable is rotated to a reference angle, such as 0°, 180°, or 90°. While keeping the reference angle constant, a single detection angle of 90° is determined. Then, each hole in at least a portion of the drill holes is probed multiple times using a probe at a detection angle of 90°. For example, for a specific drill hole, the drill hole can be probed N times using a probe at a detection angle of 45°, obtaining N measurement values ​​detected at the 45° detection angle. N is an integer greater than 1, such as 3, 5, 7, 10, 15, or 25. These N measurement values ​​at the 45° detection angle constitute multiple sets of first detection data for the drill hole being tested. The number of multiple sets of first detection data for each drill hole can be stored in a list format, such as [D1, D2, D3, ... D2]. n ], the unit is mm or μm, where n is an integer greater than 3.

[0051] In some embodiments, given that gross errors (i.e., outliers significantly deviating from the normal range) may occur during probe measurement due to factors such as debris inside the borehole, burrs on the borehole wall, and unstable probe sliding, a preset data filtering algorithm can be used to preprocess multiple sets of first detection data for each borehole under test. After removing or correcting outlier data, multiple sets of first filtered detection data for each borehole under test can be obtained. The data filtering algorithm can be any of the following: 3-sigma, interquartile range method, or absolute median difference method.

[0052] Specifically, taking the 3-sigma data filtering algorithm as an example, for multiple sets of first detection data of a certain borehole under test, the mean and standard deviation of the corresponding borehole are obtained. If the mean of the borehole is denoted as μ and the standard deviation as σ, under the assumption of normal distribution, 99.7% of the data caused by normal random error should fall within the range of (μ-3σ, μ+3σ). At this time, it is possible to detect whether each set of first detection data of the borehole is within the range of (μ-3σ, μ+3σ), and remove the first detection data that is not within the range of (μ-3σ, μ+3σ). The remaining first detection data is used as the multiple sets of first filtered detection data of the borehole under test.

[0053] In some embodiments, for each borehole in at least a portion of the boreholes, multiple sets of first filtered detection data of the borehole to be tested are fused to obtain target measurement data of the borehole to be tested, wherein the data fusion includes any one of taking the average, taking the median, and weighted average.

[0054] Specifically, after acquiring multiple sets of first-filter detection data for each borehole under test, if the data is fused to take the average value, then for each borehole in at least a portion of the boreholes, the average value of the multiple sets of first-filter detection data for that borehole is taken as the target measurement data for that borehole; if the data is fused to take the median, then for each borehole, the median of the multiple sets of first-filter detection data for that borehole is taken as the target measurement data for that borehole.

[0055] Thus, after filtering multiple sets of first detection data for each borehole using a data filtering algorithm, the multiple sets of first filtered detection data for each borehole can reflect the true distribution of measurement values. At this point, regardless of whether the average, median, or weighted average is used, the results are highly close to the true values, making the accuracy of the target measurement data obtained for each borehole higher.

[0056] In some embodiments, taking the detection of the borehole at multiple different detection angles as an example, for each borehole, the borehole is detected at multiple different detection angles to obtain multiple sets of second detection data for the borehole being tested.

[0057] Specifically, during the process of probing each hole in at least a portion of the drill holes using a probe in a probe measuring device, a circuit board can be mounted and fixed on the worktable of the probe measuring device. The worktable is rotated to a reference angle, such as 0°, 180°, or 90°. While keeping the reference angle constant, multiple different detection angles are determined. These multiple different detection angles can be at least two of, for example, 45°, 55°, 90°, and 135°. For each different detection angle, the probe is used to probe each hole in at least a portion of the drill holes at that detection angle, acquiring second detection data for each tested hole at that detection angle. Subsequently, the probe is rotated sequentially to other detection angles, and each hole in at least a portion of the drill holes is probed again at each other detection angle, acquiring second detection data for each tested hole at each other detection angle. The number of second detection data points obtained for each tested hole at any detection angle can be one or more. For example, taking a certain borehole as an example, if multiple different detection angles are 55°, 95° and 235°, then multiple sets of second detection data of the borehole to be tested are obtained, including the detection data obtained when the probe detection angle is 55°, the detection data obtained when the probe detection angle is 95°, and the detection data obtained when the probe detection angle is 235°.

[0058] In some embodiments, after acquiring multiple sets of second detection data for each borehole, the target measurement data for each borehole can be directly obtained based on the multiple sets of second detection data for each borehole. At this time, for each borehole, the multiple sets of second detection data for the borehole can be fused to obtain the target measurement data for the borehole. The data fusion includes any one of averaging, medianing, weighted averaging, etc.

[0059] In some embodiments, such as Figure 3 As shown, after acquiring multiple sets of second detection data for each borehole under test, the steps for acquiring target measurement data for each borehole under test include steps S301-S302.

[0060] Step S301: Filter multiple sets of second detection data for each borehole using a set threshold range to obtain multiple sets of second filtered detection data for each borehole.

[0061] Step S302: Based on multiple sets of second-filter detection data for each borehole being tested, obtain the target measurement data for each borehole being tested.

[0062] Specifically, the threshold range can be generated based on the statistical characteristics of multiple sets of second detection data for each borehole being tested. This allows the threshold range for each borehole to be the same or different, and the statistical characteristics can be the median or average, etc. Taking the median as an example, for each borehole being tested, the threshold range can be determined based on the median of multiple sets of second detection data. If the median of the borehole is denoted as... Let the allowable deviation be denoted as Δ, then the set threshold range for the borehole being tested is determined as [ -Δ, +Δ].

[0063] In some embodiments, when acquiring multiple sets of second filtered detection data for each borehole under test, for each borehole under test, second detection data that is not within a set threshold range can be removed from the multiple sets of second detection data for that borehole under test, and the remaining second detection data can be used as the multiple sets of second detection data for that borehole under test.

[0064] In some embodiments, for each borehole being tested, multiple sets of second-filtered detection data of the borehole being tested can be fused to obtain the target measurement data of the borehole being tested. The data fusion includes any one of taking the average, taking the median, or weighted average.

[0065] Step S103: Using the target measurement data of each borehole being tested, correct the abnormal hole position data to obtain corrected hole position data for multiple boreholes.

[0066] In some embodiments, target measurement data corresponding to abnormal hole location data can be obtained from the target measurement data of each borehole being tested; the abnormal hole location data can be corrected using the target measurement data corresponding to the abnormal hole location data.

[0067] Specifically, when abnormal borehole data is identified, the identifier of each borehole corresponding to the abnormal borehole data is obtained. At this time, target measurement data corresponding to the abnormal borehole data can be obtained based on the identifier or coordinates of each borehole. Then, the abnormal borehole data is corrected using the target measurement data. For example, if the identifiers of each borehole corresponding to the abnormal borehole data are A1 and A2, the target measurement data corresponding to A1 and A2 are obtained from the target measurement data of each measured borehole based on A1 and A2. Then, the abnormal borehole data of A1 is corrected using the target measurement data corresponding to A1, and the abnormal borehole data of A2 is corrected using the target measurement data corresponding to A2.

[0068] In some embodiments, when correcting abnormal borehole position data using target measurement data corresponding to the abnormal borehole position data, if the borehole position data field of a certain borehole is empty, the target measurement data of the borehole being tested is directly written into the borehole position data field of that borehole; if the borehole position data field of a certain borehole contains data but is determined to be abnormal, the target measurement data of the borehole being tested is used to replace the data in the borehole position data field of that borehole. In this way, after correcting all abnormal borehole position data, corrected borehole position data for multiple boreholes are obtained.

[0069] Thus, during the back-drilling process of the circuit board, the original hole position data of multiple drilled holes on the circuit board is first obtained through the circuit board processing equipment. Due to differences in PCB board design, process fluctuations, and limitations in the adaptability of correction algorithms, some drilled hole data in the original hole position data may be missing, have abnormal values, or be explicitly marked as "correction failed" by the correction algorithm. For this part of the data, it is necessary to identify and extract it from the original hole position data as abnormal hole position data. In order to obtain a higher accuracy reference value, each drilled hole is repeatedly measured multiple times, from multiple angles or from a single angle, and coarse error filtering and data fusion are performed on the obtained multiple sets of detection data to obtain target measurement data with significantly improved accuracy for each drilled hole. Subsequently, using the drilled hole number or coordinates as an index, the abnormal hole position data is associated and matched with the target measurement data of the corresponding drilled hole. Then, the abnormal hole position data is corrected using the target measurement data of the corresponding drilled hole, so that the abnormal parts in the original hole position data are accurately corrected, and finally corrected hole position data is generated. Since the target measurement data used in the correction process has higher accuracy and reliability, the corrected hole position data achieves an overall improvement in accuracy.

[0070] Accordingly, this application also provides a circuit board processing system configured to perform the back-drilling hole location determination method of any of the above embodiments. The circuit board processing system may include circuit board processing equipment and a probing and measuring device. The circuit board processing equipment may be a drilling device specifically designed for drilling holes in circuit boards. The circuit board processing equipment and the probing and measuring device may be two separate devices or an integrated unit. In this application embodiment, back-drilling and other processes can be performed on the circuit board using the circuit board processing equipment.

[0071] It is understandable that this circuit board processing system can achieve all the technical features and beneficial effects of the above-mentioned circuit board processing methods, which will not be elaborated here.

[0072] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0073] The foregoing has provided a detailed description of the method for determining back-drill hole position data and the circuit board processing system provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A method for determining back-drilled hole location data, characterized in that, include: During the back drilling process of the circuit board, the original hole position data of multiple drill holes on the circuit board are obtained, and abnormal hole position data are identified from the original hole position data of the multiple drill holes. Measure at least a portion of the boreholes among the plurality of boreholes to obtain target measurement data for each borehole being measured; Using the target measurement data of each of the boreholes under test, the abnormal borehole position data are corrected to obtain corrected borehole position data for multiple boreholes.

2. The method for determining back-drill hole location data according to claim 1, characterized in that, The step of measuring at least a portion of the multiple boreholes to obtain target measurement data for each measured borehole includes: Each borehole in at least a portion of the boreholes is probed to obtain multiple sets of probe data for each of the tested boreholes; Based on multiple sets of detection data for each borehole being tested, target measurement data for each borehole being tested is obtained.

3. The method for determining back-drill hole location data according to claim 2, characterized in that, The step of probing each of the at least a portion of the boreholes to obtain multiple sets of probe data for each of the tested boreholes includes: For each of the at least a portion of the boreholes, the borehole is probed multiple times at the same probe angle to obtain multiple sets of first probe data for the borehole being tested.

4. The method for determining back-drill hole location data according to claim 3, characterized in that, The step of obtaining target measurement data for each borehole based on multiple sets of detection data includes: Multiple sets of first detection data for each borehole under test are filtered using a preset data filtering algorithm to obtain multiple sets of first filtered detection data for each borehole under test. Based on multiple sets of first-filter detection data for each borehole under test, target measurement data for each borehole under test is obtained.

5. The method for determining back-drill hole location data according to claim 4, characterized in that, The step of obtaining target measurement data for each borehole based on multiple sets of first filtered detection data includes: For each borehole being tested, multiple sets of first-filtered detection data for the borehole are fused to obtain the target measurement data for the borehole. The data fusion includes any one of taking the average, taking the median, or weighted average.

6. The method for determining back-drill hole location data according to claim 2, characterized in that, The step of probing each of the at least a portion of the boreholes to obtain multiple sets of probe data for each of the tested boreholes includes: For each of the at least a portion of the boreholes, the borehole is probed at multiple different probe angles to obtain multiple sets of second probe data for the borehole being probed.

7. The method for determining back-drill hole location data according to claim 6, characterized in that, The step of obtaining target measurement data for each borehole based on multiple sets of detection data includes: Multiple sets of second detection data for each borehole under test are filtered using a set threshold range to obtain multiple sets of second filtered detection data for each borehole under test. Based on multiple sets of second-filtered detection data for each borehole under test, target measurement data for each borehole under test is obtained.

8. The method for determining back-drill hole location data according to claim 7, characterized in that, The step of filtering multiple sets of second detection data for each borehole using a set threshold range to obtain multiple sets of filtered second detection data for each borehole includes: For each borehole being tested, the second detection data that is not within the set threshold range is removed from the multiple sets of second detection data of the borehole being tested, and the remaining second detection data is used as the multiple sets of second filtered detection data of the borehole being tested.

9. The method for determining back-drill hole location data according to claim 8, characterized in that, The step of obtaining target measurement data for each borehole based on multiple sets of second-filtered detection data includes: For each borehole being tested, multiple sets of second-filtered detection data for that borehole are fused to obtain the target measurement data for that borehole. The data fusion includes any one of taking the average, taking the median, or weighted average.

10. The method for determining back-drill hole location data according to any one of claims 1-9, characterized in that, The step of correcting the abnormal hole location data using the target measurement data of each of the measured boreholes includes: From the target measurement data of each borehole being measured, obtain the target measurement data corresponding to the abnormal borehole location data; The abnormal borehole data is corrected using the target measurement data corresponding to the abnormal borehole data.

11. The method for determining back-drill hole location data according to claim 10, characterized in that, The original hole position data of the multiple drilled holes is obtained by the circuit board processing equipment during the processing, and the original hole position data includes the depth data of the drilled holes.

12. The method for determining back-drill hole location data according to claim 11, characterized in that, The step of measuring at least a portion of the multiple boreholes to obtain target measurement data for each borehole includes: The target measurement data for each of the multiple drill holes is obtained by measuring all the drill holes using a probe measuring device; or... The abnormal boreholes are measured by the probe measuring device to obtain target measurement data for each borehole being measured, wherein the abnormal borehole is the borehole corresponding to the abnormal borehole location data.

13. A circuit board processing system, characterized in that, The circuit board processing system includes circuit board processing equipment and probe measurement equipment, and the circuit board processing system is configured to perform the method for determining back drill hole position data as described in any one of claims 1 to 12.

Images