A master device and a vehicle

Abstract

The application provides a master control device and a vehicle. The master control device comprises a circuit board, an antenna assembly and a heat dissipation assembly. The circuit board has a first surface and a second surface arranged oppositely. The antenna assembly is fixed to the first surface. The heat dissipation assembly comprises a heat dissipation shell and a first partition plate. The heat dissipation shell is in abutment with the second surface. The first partition plate is located in an inner cavity of the heat dissipation shell and is fixedly connected with the heat dissipation shell. The first partition plate is used for separating the inner cavity of the heat dissipation shell into a first cavity and a second cavity. The first cavity is opposite to the antenna assembly. The master control device reuses the heat dissipation shell, so that the heat dissipation shell can not only realize heat dissipation effect, but also shield interference generated by other electronic elements on the circuit board, so as to improve the anti-interference capability of the antenna assembly. In addition, the heat dissipation shell has two heat dissipation cavities, so that partitioned heat dissipation can be realized on the antenna assembly and other electronic elements on the circuit board, and the heat dissipation effect is better.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and more specifically, to a master control device and a vehicle. Background Technology

[0002] The main control unit of a vehicle is usually equipped with a main control system and a wireless communication structure for network communication to meet different driving needs. The main control unit generates a lot of heat when it is running. Therefore, related technologies usually also include a heat dissipation structure to cool the main control unit.

[0003] In related technologies, the heat dissipation structure and wireless communication structure are usually set on two opposite sides of the main control device. The wireless communication structure is usually also equipped with an independent shield to shield other interference signals in the main control device. The shield is large in size, which makes the overall size of the main control device too large, which is not conducive to miniaturization. Summary of the Invention

[0004] To address the aforementioned issues, this application provides a main control device and a vehicle, aiming to solve the problem that the overall size of the main control device is too large, which is not conducive to miniaturization.

[0005] In a first aspect, this application provides a main control device, including a circuit board, an antenna assembly, and a heat dissipation assembly; the circuit board has a first side and a second side disposed opposite to each other; the antenna assembly is fixed to the first side; the heat dissipation assembly includes a heat dissipation shell and a first partition, the heat dissipation shell abuts against the second side, the first partition is located in the inner cavity of the heat dissipation shell and is fixedly connected to the heat dissipation shell, the first partition is used to divide the inner cavity of the heat dissipation shell into a first cavity and a second cavity, the first cavity being opposite to the antenna assembly.

[0006] In this implementation, the heat dissipation housing is reused. The first cavity within the heat dissipation housing not only dissipates heat from the antenna assembly but also shields against interference from the main control system and other electronic components on the circuit board. This improves the antenna assembly's anti-interference capability, thereby enhancing its radiation performance and ensuring the reliability of the main control device. Consequently, there is no need for an additional shielding cover within the main control device to isolate the antenna assembly, reducing manufacturing costs and decreasing the overall size of the main control device, thus minimizing its space requirements in the vehicle and enabling its miniaturization. Furthermore, the heat dissipation assembly in this application has independent first and second cavities, allowing for zoned heat dissipation of the antenna assembly and other electronic components on the circuit board. Compared to the overall heat dissipation of related technologies, the heat dissipation housing in this application provides superior heat dissipation.

[0007] In one possible implementation, the antenna assembly includes a first onboard antenna and a second onboard antenna; the first onboard antenna is fixed to a first radiating area on a first surface; the second onboard antenna is fixed to a second radiating area on the first surface; wherein the first radiating area and the second radiating area are spaced apart to allow the first onboard antenna and the second onboard antenna to be spaced apart.

[0008] In this implementation, the first onboard antenna and the second onboard antenna are spaced apart to avoid signal crosstalk between the first onboard antenna and the second onboard antenna, which would affect the stability and efficiency of their respective data transmission, thereby improving the signal transmission reliability and efficiency of the first onboard antenna and the second onboard antenna.

[0009] In one possible implementation, the heat dissipation assembly further includes a second partition and a third partition; the second partition and the third partition are located in the first cavity and are fixedly connected to the heat dissipation shell, and the second partition and the third partition are spaced apart to divide the first cavity into a first isolation cavity, a second isolation cavity and a third isolation cavity, the first isolation cavity being opposite to the first onboard antenna and the third isolation cavity being opposite to the second onboard antenna.

[0010] In this implementation, the first onboard antenna corresponds to an independent first isolation cavity. This first isolation cavity not only provides independent heat dissipation for the first onboard antenna but also shields the electronic components within the first cavity and the interference generated by the second onboard antenna, thereby improving the anti-interference capability of the first onboard antenna and ensuring its radiation performance. Similarly, the second onboard antenna corresponds to an independent third isolation cavity. This third isolation cavity not only provides independent heat dissipation for the second onboard antenna but also shields the electronic components within the first cavity and the interference generated by the first onboard antenna, further improving its anti-interference capability and ensuring its radiation performance. This, in turn, enhances the overall anti-interference capability of the antenna assembly, ensuring its radiation performance and ultimately guaranteeing the reliability of the main control device.

[0011] In one possible implementation, the heat dissipation assembly further includes a support plate located within the second isolation cavity. One end of the support plate abuts against one side of the second partition, and the other end of the support plate abuts against the side of the third partition facing the second partition.

[0012] In this implementation, the support plate abuts against the second and third partitions, thereby improving the support reliability of the second and third partitions, and further improving the support reliability of the heat dissipation shell on the circuit board.

[0013] In one possible implementation, the first onboard antenna includes a first feed line and a first ground line; the first feed line includes a first feed section, a second feed section, and a third feed section, one end of the first feed section has a first feed point, the first feed point is connected to the circuit board, one end of the second feed section is angularly connected to the other end of the first feed line, and the third feed section is connected to the first feed section; one end of the first ground line is grounded, and the other end of the first ground line is angularly connected to the other end of the second feed section.

[0014] In one possible implementation, the second onboard antenna includes a second feed line and a second ground line; the second feed line includes a fourth feed section, a fifth feed section, and a sixth feed section, one end of the fourth feed section has a second feed point, the second feed point is connected to the circuit board, one end of the fifth feed section is angularly connected to the other end of the fourth feed section, and the sixth feed section is connected to the fourth feed section; one end of the second ground line is grounded, and the other end of the second ground line is angularly connected to the other end of the fifth feed section.

[0015] In one possible implementation, the first onboard antenna is a single-frequency antenna, and the second onboard antenna is a dual-frequency antenna.

[0016] In one possible implementation, the main control device further includes a cover plate covering the second surface. The cover plate has a first groove and a second groove recessed on the second surface. The bottom wall of the first groove has a first opening, and the first onboard antenna is located at the first opening. The bottom wall of the second groove has a second opening, and the second onboard antenna is located at the second opening.

[0017] In this implementation, the cover plate and the heat dissipation shell protect the circuit board and the electronic components on it, ensuring the reliable operation of the circuit board and the electronic components on it. Secondly, the bottom wall of the second groove has a second opening, and the second onboard antenna is located at the second opening. This means the cover plate does not obstruct the first and second onboard antennas, ensuring the reliability of the signals transmitted by the first and second onboard antennas.

[0018] In one possible implementation, the main control device further includes multiple conductive elements, which are attached around the first radiation area and the second radiation area, with the bottom walls of the first groove and the second groove abutting against the multiple conductive elements.

[0019] In this implementation, the cover plate achieves close contact with the first radiation area and the second radiation area through multiple conductive components, thereby improving the connection tightness between the cover plate and the first surface of the circuit board.

[0020] Secondly, this application provides a vehicle, which includes a vehicle body and a main control device as described in any of the optional embodiments of the first aspect, wherein the main control device is mounted on the vehicle body. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a main control device provided in a related technical embodiment;

[0022] Figure 2 This is a schematic diagram of another main control device provided in a related technical embodiment;

[0023] Figure 3 This is a schematic diagram of the structure of a vehicle provided in an embodiment of this application;

[0024] Figure 4 This is a schematic diagram of the structure of a main control device provided in an embodiment of this application;

[0025] Figure 5 This is an exploded view of a main control device provided in an embodiment of this application;

[0026] Figure 6 This is an exploded view of another main control device provided in an embodiment of this application;

[0027] Figure 7 This is an exploded view of another main control device provided in the embodiments of this application;

[0028] Figure 8 This is a schematic diagram of the structure of a first onboard antenna provided in an embodiment of this application;

[0029] Figure 9 This is a schematic diagram of the structure of a second onboard antenna provided in an embodiment of this application;

[0030] Figure 10 This is an exploded view of another main control device provided in the embodiments of this application;

[0031] Figure 11 This is an exploded view of another main control device provided in the embodiments of this application;

[0032] Figure 12 This is a top view of a main control device provided in an embodiment of this application;

[0033] Figure 13 This is an exploded view of another main control device provided in the embodiments of this application.

[0034] The following are the labeling elements in the figure:

[0035] 1' Main control unit; 11' Metal housing; 11A' Recess; 12' Heat sink fins; 13' Antenna assembly; 131' Plastic structural component; 132' Antenna;

[0036] 1. Main control unit; 11. Circuit board; 111. First side; 112. Second side; 111A. First radiation area; 111B. Second radiation area; 12. Antenna assembly; 121. First onboard antenna; 1211. First feed line; 1211A. First feed section; 1211B. Second feed section; 1211C. Third feed section; 1212. First grounding wire; 1213. First clearance area; 122. Second onboard antenna; 1221. Second feed line; 1221A. Fourth feed section; 1221B. Fifth feed section; 1221C. Sixth feed section ; 1222, Second grounding wire; 13, Heat dissipation assembly; 131, Heat dissipation shell; 131A, First cavity; 131B, Second cavity; 131C, First isolation cavity; 131D, Second isolation cavity; 131E, Third isolation cavity; 132, First partition; 133, Second partition; 134, Third partition; 135, Support plate; 136, Heat dissipation fins; 14, Cover plate; 141, First groove; 141A, First opening; 142, Second groove; 142A, Second opening; 15, Conductive component; 2, Vehicle body; AA, First direction; BB, Second direction. Detailed Implementation

[0037] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, and circuits have been omitted so as not to obscure the description of this application with unnecessary detail.

[0038] Vehicles typically include a main control unit to meet diverse driving needs. With the continuous advancement of communication and vehicle technologies, the functions of these main control units (such as navigation, driver assistance, and autonomous driving) are becoming increasingly sophisticated. Currently, main control units usually consist of a main control system and a wireless communication structure. The main control system implements basic functions, while the wireless communication structure facilitates network communication. During operation, the main control unit generates heat. It's worth noting that this heat is generated by the electronic components (such as microprocessors) performing extensive data processing. To prevent overheating of these components and potential performance degradation or even damage, related technologies typically incorporate heat dissipation structures to cool the main control unit and prevent overheating of its electronic components.

[0039] For example, such as Figure 1As shown, the main control device 1' in the related technology may include a metal housing 11', heat dissipation fins 12', and an antenna assembly 13'. The heat dissipation fins 12' and the antenna assembly 13' are fixed to the metal housing 11' respectively. The heat dissipation fins 12' and the antenna assembly 13' are arranged adjacent to each other. The heat dissipation fins 12' are used to dissipate heat from the main control device 1' to avoid overheating of the electronic components in the main control device 1'. However, in the related technology, while the heat dissipation fins 12' meet the heat dissipation requirements, they and the antenna assembly 13' are usually arranged adjacent to each other on the same surface of the main control device 1' and are independent of each other. That is, the antenna assembly 13' and the heat dissipation fins 12' are arranged in a flat manner on the same surface of the main control device 1' and occupy a large area, resulting in a large planar area corresponding to the main control device 1', which is not conducive to miniaturization.

[0040] Among them, such as Figure 2 As shown, the antenna assembly 13' includes a plastic structural component 131' and an antenna 132'. A groove 11A' is provided on the metal housing 11'. The plastic structural component 131' is movably connected to the metal housing 11'. The antenna 132' is fixed to the plastic structural component 131' and connected to the circuit board in the main control device 1' via a cable to achieve communication functionality. When the plastic structural component 131' covers the groove 11A', the antenna 132' is located within the groove 11A'. However, the plastic structural component 131' is exposed. If it accidentally comes into contact with other metal objects, the absorption and reflection effects of metal on electromagnetic waves will severely interfere with the signal transmission of the antenna 132', causing a significant decrease in the performance of the antenna 132', and potentially even signal interruption, affecting the normal operation of the main control device 1'. Furthermore, the plastic structural component 131', antenna 132', and metal housing 11' require direct assembly and fitting, which is complex. Secondly, in related technologies, antenna 132' is usually a flexible printed circuit (FPC) antenna, which has a high cost.

[0041] Related technologies also provide a main control device where the heat dissipation structure and wireless communication structure are located on two opposite surfaces of the main control device, occupying a relatively small area, far smaller than the area occupied by laying the antenna assembly and heat dissipation fins flat on the same surface of the main control device. However, in this related technology, the wireless communication structure is usually equipped with an independent shielding cover to shield against other interference in the main control device. The shielding cover is relatively large, resulting in an excessively large overall size of the main control device, which is not conducive to miniaturization.

[0042] Therefore, this application provides a main control device and a vehicle. The main control device reuses a heat dissipation housing, which not only achieves heat dissipation but also shields against interference from other electronic components on the circuit board, thereby improving the anti-interference capability of the antenna assembly. Furthermore, the heat dissipation housing has two heat dissipation cavities to achieve zoned heat dissipation for the antenna assembly and other electronic components on the circuit board, resulting in better heat dissipation performance.

[0043] The main control device and vehicle provided in this application are described below with reference to the accompanying drawings.

[0044] like Figure 3 As shown in the illustration, this application provides a vehicle comprising a main control device 1 and a vehicle body 2. The main control device 1 is mounted on the vehicle body 2. It is worth noting that the installation location of the main control device 1 may include, but is not limited to, the area behind the instrument panel, inside the center console, in the trunk area, or in a specific reserved space in the vehicle chassis within the vehicle body 2. The main control device 1 is electrically connected to the center console screen in the vehicle body 2 to realize functions such as display control, multimedia playback, navigation, vehicle networking services, mobile phone interconnection, voice recognition and control, and vehicle status display, thereby improving the user's interactive experience with the vehicle.

[0045] In one example, please refer to Figure 4 and Figure 5 As shown, the main control device 1 provided in this application includes a circuit board 11, an antenna assembly 12, and a heat dissipation assembly 13. The circuit board 11 has a first surface 111 and a second surface 112 that are disposed opposite to each other. The antenna assembly 12 is fixed to the first surface 111 of the circuit board 11. Thus, the antenna assembly 12 provided in this application is directly integrated on the circuit board 11, that is, the antenna assembly 12 provided in this application is an onboard antenna. There is no need to assemble and mount the antenna assembly 12 and the circuit board 11, which simplifies the operation steps. Compared with an externally pulled antenna, directly integrating the antenna assembly 12 on the circuit board 11 reduces the production complexity and labor costs, thereby reducing certain costs.

[0046] The heat dissipation component 13 abuts against the second side 112 of the circuit board 11. The heat dissipation component 13 can dissipate the heat generated by the circuit board 11 during operation, so as to avoid overheating of the electronic components on the circuit board 11, thereby ensuring the operational reliability of the electronic components on the circuit board 11 and ensuring the overall operational reliability of the main control device 1. It is worth noting that in order for the antenna assembly 12 to transmit signals normally, the heat dissipation component 13 and the antenna assembly 12 provided in this application need to be located on different sides of the circuit board 11. That is, when the antenna assembly 12 is fixed to the first side 111 of the circuit board 11, the heat dissipation component 13 needs to abut against the second side 112 of the circuit board 11; when the antenna assembly 12 is fixed to the second side 112 of the circuit board 11, the heat dissipation component 13 needs to abut against the first side 111 of the circuit board 11. This application does not impose specific restrictions on this. Thus, this application places the heat dissipation component 13 and the antenna component 12 on opposite sides of the circuit board 11, so as to ensure that the antenna component 12 can transmit signals normally while deeply integrating the heat dissipation component 13 and the antenna component 12. That is, compared with the related technology that the heat dissipation fins 12' and the antenna component 13' are laid flat on the same plane, this application places the heat dissipation component 13 and the antenna component 12 on opposite sides of the circuit board 11, which greatly reduces the area occupied by the heat dissipation component 13 and the antenna component 12 on the circuit board 11, thereby reducing the overall size of the main control device 1, reducing the space occupied by the main control device 1 in the vehicle, and making the main control device 1 suitable for miniaturization.

[0047] Optionally, circuit board 11 is a printed circuit board (PCB), such as... Figure 4 As shown, the circuit board 11 typically also includes a main control system 113 for implementing basic functions. The main control system 113 includes at least... Figure 3 The circuit board 111 includes multiple electronic components, and the main control system 113 can be disposed on the first side 111 and / or the second side 112 of the circuit board 11. It is worth noting that, in order to prevent electromagnetic radiation generated by the electronic components in the main control system 113 from affecting the reception of the antenna assembly 12, or to prevent strong external signals received by the antenna assembly 12 from interfering with the normal operation of the main control system 113, the main control system 113 and the antenna assembly 12 are disposed alternately on the first side 111 or the second side 112 of the circuit board 11.

[0048] In one example, such as Figure 6As shown, the heat dissipation assembly 13 includes a heat dissipation shell 131 and a first partition 132. The heat dissipation shell 131 abuts against the second surface 112. The first partition 132 is located in the inner cavity of the heat dissipation shell 131 and is fixedly connected to the heat dissipation shell 131. The first partition 132 is used to divide the inner cavity of the heat dissipation shell 131 into a first cavity 131A and a second cavity 131B. The first cavity 131A is opposite to the antenna assembly 12. That is, when the antenna assembly 12 is fixed to the first surface 111 of the circuit board 11, the first cavity 131A is located on the second surface 112 of the circuit board 11, opposite to the first surface 111 where the antenna assembly 12 is fixed. At this time, the first cavity 131A is the isolation cavity corresponding to the antenna assembly 12, and the second cavity 131B is the heat dissipation cavity corresponding to the main control system 113 and other electronic components on the circuit board 11. The first cavity 131A not only dissipates heat from the antenna assembly 12, but also shields against interference from the main control system 113 and other electronic components on the circuit board 11, thereby improving the anti-interference capability of the antenna assembly 12 and enhancing its radiation performance (compared to antennas in related technologies, the antenna assembly 12 provided in this application can improve radiation performance by 20%), thus ensuring the reliability of the main control device 1. Furthermore, it eliminates the need for an additional shielding cover to isolate the antenna assembly 12 within the confined space of the main control device 1, reducing manufacturing costs.

[0049] Thus, the first cavity 131A within the heat dissipation housing 131 not only dissipates heat from the antenna assembly 12 but also shields against interference generated by the main control system and other electronic components on the circuit board 11, thereby improving the anti-interference capability of the antenna assembly 12 and enhancing its radiation performance, ultimately ensuring the reliability of the main control device 1. This eliminates the need for an additional shielding cover within the main control device 1 to isolate the antenna assembly 12 separately, reducing manufacturing costs and decreasing the overall size of the main control device 1, thus minimizing its space requirements in the vehicle and enabling its miniaturization. Furthermore, the heat dissipation housing 131 in this application has two heat dissipation cavities (i.e., the first cavity 131A and the second cavity 131B) to achieve zoned heat dissipation for the antenna assembly 12 and other electronic components on the circuit board 11. Compared to the overall heat dissipation of related technologies, the heat dissipation housing 131 provided in this application offers superior heat dissipation performance.

[0050] Optionally, the overall size of the heat sink 131 is larger than the size of the circuit board 11, so that the circuit board 11 can be completely housed within the heat sink 131, thereby enabling the heat sink 131 to provide both heat dissipation and protection. The heat sink 131 can be made of metal, specifically, such as... Figure 5As shown, heat dissipation fins 136 can be provided on the outer side of the heat dissipation housing 131 away from the circuit board 11. The heat dissipation fins 136 can be made of metal material that is integral with the heat dissipation housing 131.

[0051] Optionally, the first partition 132 can be as follows: Figure 7 The "U-shaped" baffle shown can form a closed first cavity 131A to achieve a high shielding effect against interference signals. One end of the first partition 132 is fixedly connected to the heat dissipation shell 131, and the other end of the first partition 132 abuts against the circuit board 11. That is, the first partition 132 can also provide mechanical support for the circuit board 11 to improve the overall stability of the main control device 1. The specific size and shape of the first partition 132 can be set based on the size and position of the antenna assembly 12. This application does not impose specific limitations on this.

[0052] Optionally, the first partition 132 and the heat dissipation shell 131 can be an integral structure or an independent structure. This application does not impose specific restrictions on this.

[0053] Optionally, to improve the heat dissipation effect of the second cavity 131B, multiple partitions (not shown in the figure) can be provided inside the second cavity 131B. These partitions can divide the second cavity 131B into multiple heat dissipation cavities corresponding to electronic components. The specific structure of the second cavity 131B can be configured according to actual needs. For example, assuming cost savings are desired, the second cavity 131B can be a single large heat dissipation cavity; assuming improved heat dissipation is desired, the second cavity 131B can be divided into multiple heat dissipation cavities by multiple partitions to correspond to different electronic components on the circuit board 11. This application does not impose specific limitations in this regard.

[0054] Thus, this application places the heat dissipation component 13 and the antenna component 12 on opposite sides of the circuit board 11, respectively. This ensures that the antenna component 12 can transmit signals normally while deeply integrating the heat dissipation component 13 and the antenna component 12, thereby reducing the overall size of the main control device 1 and the space occupied by the main control device 1 in the vehicle, making the main control device 1 suitable for miniaturization. Furthermore, the heat dissipation housing 131 provided in this application has a first cavity 131A corresponding to the antenna component 12. The first cavity 131A can shield the interference generated by the main control system 113 and other electronic components on the circuit board 11, thereby improving the anti-interference capability of the antenna component 12, ensuring the radiation performance of the antenna component 12, and thus ensuring the reliability of the main control device 1. Secondly, the antenna assembly 12 provided in this application is directly integrated on the circuit board 11, that is, the antenna assembly 12 provided in this application is an onboard antenna, which eliminates the need to assemble and install the antenna assembly 12 and the circuit board 11, simplifying the operation steps. Moreover, compared with the externally pulled antenna, directly integrating the antenna assembly 12 on the circuit board 11 reduces the production complexity and labor costs, thereby reducing certain costs.

[0055] In one example, such as Figure 7 As shown, a first radiating region 111A and a second radiating region 111B are formed on the first surface 111. In this example, the antenna assembly 12 may include a first onboard antenna 121 and a second onboard antenna 122. The first onboard antenna 121 is fixed to the first radiating region 111A of the first surface 111, and the second onboard antenna 122 is fixed to the second radiating region 111B of the first surface 111. The first radiating region 111A and the second radiating region 111B are spaced apart to separate the first onboard antenna 121 and the second onboard antenna 122, thereby avoiding signal crosstalk between the first onboard antenna 121 and the second onboard antenna 122, which would affect the stability and efficiency of their respective data transmission, thus improving the signal transmission reliability and efficiency of the first onboard antenna 121 and the second onboard antenna 122.

[0056] In one example, such as Figure 8As shown, the first onboard antenna 121 includes a first feed line 1211 and a first ground line 1212. The first feed line 1211 includes a first feed section 1211A, a second feed section 1211B, and a third feed section 1211C. One end of the first feed section 1211A has a first feed point, which is connected to the circuit board 11. One end of the second feed section 1211B is connected to the other end of the first feed line 1211 at an angle (e.g., 90°). The third feed section 1211C is connected to the first feed section 1211A. One end of the first ground line 1212 is grounded, and the other end of the first ground line 1212 is connected to the other end of the second feed section 1211B at an angle (e.g., 90°). The third power supply unit 1211C includes a main body connected to the first power supply unit 1211A at an angle (e.g., 90°) and a bent portion connected to the main body at an angle (e.g., 90°). The bent portion is parallel to the first power supply unit 1211A along a first direction AA.

[0057] In this example, such as Figure 8 As shown, the first onboard antenna 121 also includes a first clearance area 1213, which surrounds the first feed line 1211 and the first ground line 1212, so that the first feed line 1211 and the first ground line 1212 can effectively transmit and receive wireless signals, avoid the signal being blocked or interfered with by other obstacles, and thus ensure the signal transmission reliability of the first onboard antenna 121.

[0058] For example, the dimensions of the first power supply section 1211A along the second direction BB are 1 mm, the dimensions of the second power supply section 1211B along the first direction AA are 1 mm, the dimensions of the main body of the third power supply section 1211C along the second direction BB are 2.5 mm, the dimensions of the bent portion of the third power supply section 1211C along the first direction AA are 7 mm, the dimensions of the bent portion of the third power supply section 1211C along the second direction BB are 2 mm, the dimensions of the first grounding wire 1212 along the first direction AA are 15 mm, the dimensions of the first grounding wire 1212 along the second direction BB are 2 mm, the dimensions of the first clearance area 1213 along the first direction AA are 18 mm, and the dimensions of the first clearance area 1213 along the second direction BB are 15 mm. The specific dimensions of the first power supply wire 1211, the first grounding wire 1212, and the first clearance area 1213 can be set according to actual needs, and this application does not impose specific limitations on them.

[0059] In one example, such as Figure 9As shown, the second onboard antenna 122 includes a second feed line body 1221 and a second ground line body 1222. The second feed line body 1221 includes a fourth feed section 1221A, a fifth feed section 1221B, and a sixth feed section 1221C. One end of the fourth feed section 1221A has a second feed point, which is connected to the circuit board 11. One end of the fifth feed section 1221B is connected to the other end of the fourth feed section 1221A at an angle (e.g., 90°). The sixth feed section 1221C is connected to the fourth feed section 1221A. One end of the second ground line body 1222 is grounded, and the other end of the second ground line body 1222 is connected to the other end of the fifth feed section 1221B at an angle (e.g., 90°). The sixth power supply unit 1221C includes a main body connected to the fourth power supply unit 1221A at an angle (e.g., 90°) and a bent portion connected to the main body at an angle (e.g., 90°). The bent portion is parallel to the fourth power supply unit 1221A along the first direction AA.

[0060] In this example, such as Figure 9 As shown, the second onboard antenna 122 also includes a second clearance area 1223, which surrounds the second feed line 1221 and the second ground line 1222, so that the second feed line 1221 and the second ground line 1222 can effectively transmit and receive wireless signals, avoid the signal being blocked or interfered with by other obstacles, and thus ensure the signal transmission reliability of the second onboard antenna 122.

[0061] For example, the fourth power supply section 1221A provided in this application has a dimension of 1 mm along the second direction BB, the fourth power supply section 1221A provided in this application has a dimension of 20 mm along the first direction AA, the fourth power supply section 1221A has a dimension of 1 mm along the second direction BB, the fifth power supply section 1221B has a dimension of 1.5 mm along the second direction BB, the main body of the sixth power supply section 1221C has a dimension of 2 mm along the second direction BB, the bent portion of the sixth power supply section 1221C has a dimension of 7 mm along the first direction AA, the bent portion of the sixth power supply section 1221C has a dimension of 1 mm along the second direction BB, the second clearance area 1223 has a dimension of 31 mm along the first direction AA, and the second clearance area 1223 has a dimension of 15 mm along the second direction BB. The specific dimensions of the second power supply line 1221, the second grounding line 1222, and the second clearance area 1223 can be set according to actual needs, and this application does not impose specific limitations on them.

[0062] Optionally, the first onboard antenna 121 is a single-frequency antenna, specifically a 2.4GHz Bluetooth single-frequency antenna. The 2.4GHz Bluetooth single-frequency antenna has a wide range of frequency band applicability, strong backward compatibility, longer signal wavelength, and strong penetration capability.

[0063] Optionally, the second onboard antenna 122 is a dual-band antenna, specifically a 2.4GHz + 5GHz dual-band WIFI antenna. The 2.4GHz + 5GHz dual-band WIFI antenna has a wider channel bandwidth to achieve a faster data transmission rate and is suitable for wireless network devices.

[0064] To avoid signal crosstalk between the first onboard antenna 121 and the second onboard antenna 122, and to further improve the shielding reliability of the first cavity 131A for the first onboard antenna 121 and the second onboard antenna 122, in one example, such as Figure 10 As shown, the heat dissipation assembly 13 also includes a second partition 133 and a third partition 134. The second partition 133 and the third partition 134 are located inside the first cavity 131A and are fixedly connected to the heat dissipation housing 131. The second partition 133 and the third partition 134 are spaced apart to divide the first cavity 131A into a first isolation cavity 131C, a second isolation cavity 131D and a third isolation cavity 131E. The first isolation cavity 131C is opposite to the first onboard antenna 121, and the third isolation cavity 131E is opposite to the second onboard antenna 122.

[0065] In this example, the first onboard antenna 121 corresponds to an independent first isolation cavity 131C. The first isolation cavity 131C not only provides independent heat dissipation for the first onboard antenna 121, but also shields the electronic components within the first cavity 131A and the interference generated by the second onboard antenna 122, thereby improving the anti-interference capability of the first onboard antenna 121 and ensuring its radiation performance. The second onboard antenna 122 corresponds to an independent third isolation cavity 131E. The third isolation cavity 131E not only provides independent heat dissipation for the second onboard antenna 122, but also shields the electronic components within the first cavity 131A and the interference generated by the first onboard antenna 121, thereby improving the anti-interference capability of the second onboard antenna 122 and ensuring its radiation performance. This further improves the overall anti-interference capability of the antenna assembly 12, ensuring its radiation performance and ultimately guaranteeing the reliability of the main control device 1. Secondly, one end of the second partition 133 and one end of the third partition 134 are fixedly connected to the heat dissipation shell 131, and the other end of the second partition 133 and the other end of the third partition 134 abut against the circuit board 11. That is, at this time, the second partition 133 and the third partition 134 can also provide mechanical support for the circuit board 11 to further improve the overall stability of the main control device 1.

[0066] Optionally, the specific dimensions and shapes of the second partition 133 and the third partition 134 can be set based on the dimensions and positions of the first onboard antenna 121 and the second onboard antenna 122. This application does not impose specific limitations on this.

[0067] Optionally, the second partition 133 and the third partition 134 and the heat dissipation shell 131 can be an integral structure or an independent structure. This application does not impose specific restrictions on this.

[0068] It is worth noting that the heat dissipation structure in related technologies is usually just a heat dissipation shell or heat dissipation fins. This application is based on the fact that there is spare space inside the heat dissipation shell 131, so a first partition 132, a second partition 133, a third partition 134 and other partitions are added inside the heat dissipation shell 131 to design the interior of the heat dissipation shell 131 as an irregularly shaped shell. In this way, without increasing the volume of the heat dissipation shell 131, the heat dissipation shell 131 can simultaneously achieve the effects of isolation and zoned heat dissipation. Compared with the addition of an extra shield and the corresponding increase in the volume of the heat dissipation structure in related technologies, the volume of the heat dissipation shell 131 provided by this application is much smaller than the volume of the heat dissipation structure in related technologies.

[0069] To improve the support reliability of the second partition 133 and the third partition 134, in one example, such as Figure 10 As shown, the heat dissipation assembly 13 also includes a support plate 135, which is located within the second isolation cavity 131D. One end of the support plate 135 abuts against one side of the second partition 133, and the other end of the support plate 135 abuts against the side of the third partition 134 facing the second partition 133. Figure 10 As shown, the second partition 133, the support plate 135, and the third partition 134 together form an "H"-shaped structure. In this way, the support plate 135 abuts against the second partition 133 and the third partition 134, thereby improving the support reliability of the second partition 133 and the third partition 134, so as to further improve the support reliability of the heat dissipation shell 131 on the circuit board 11.

[0070] Optionally, the support plate 135 and the heat dissipation shell 131 can be an integral structure or an independent structure. This application does not impose specific restrictions on this.

[0071] To prevent debris or moisture in the air from causing wear and tear on the electronic components on circuit board 11, please refer to an example. Figure 11 and Figure 12 As shown, the main control device 1 also includes a cover plate 14, which covers the second surface 112. Thus, the cover plate 14 and the heat dissipation shell 131 protect the circuit board 11 and the electronic components on the circuit board 11, thereby ensuring the reliable operation of the circuit board 11 and the electronic components on the circuit board 11.

[0072] To prevent the cover plate 14 from covering the first onboard antenna 121 and the second onboard antenna 122, thereby interfering with the signals transmitted by the first onboard antenna 121 and the second onboard antenna 122, the cover plate 14 provided in this application has a first groove 141 and a second groove 142 recessed on the second surface 112. The bottom wall of the first groove 141 is provided with a first opening 141A, and the first onboard antenna 121 is located at the first opening 141A. The bottom wall of the second groove 142 is provided with a second opening 142A, and the second onboard antenna 122 is located at the second opening 142A. In this way, the cover plate 14 will not block the first onboard antenna 121 and the second onboard antenna 122, so as to ensure the reliability of the signals transmitted by the first onboard antenna 121 and the second onboard antenna 122.

[0073] In one example, such as Figure 13 As shown, the main control device 1 also includes a plurality of conductive elements 15, which are attached around the first radiation area 111A and the second radiation area 111B. The bottom walls of the first groove 141 and the second groove 142 abut against the plurality of conductive elements 15. In this example, the cover plate 14 achieves a tight fit with the first radiation area 111A and the second radiation area 111B through the plurality of conductive elements 15, thereby improving the connection tightness between the cover plate 14 and the first surface 111 of the circuit board 11.

[0074] Optionally, the conductive element 15 may be conductive foam or other conductive elements capable of achieving the above functions. This application does not impose specific limitations on this.

[0075] In summary, this application reuses the heat dissipation housing 131, enabling the first cavity 131A within the heat dissipation housing 131 to not only dissipate heat from the antenna assembly 12 but also shield against interference generated by the main control system and other electronic components on the circuit board 11. This improves the anti-interference capability of the antenna assembly 12, thereby enhancing its radiation performance and ensuring the reliability of the main control device 1. Consequently, there is no need for an additional shielding cover within the main control device 1 to isolate the antenna assembly 12 separately, reducing manufacturing costs and decreasing the overall size of the main control device 1, thus minimizing its space requirements in the vehicle and making it suitable for miniaturization. Furthermore, the heat dissipation housing 131 in this application has two heat dissipation cavities (i.e., the first cavity 131A and the second cavity 131B) to achieve zoned heat dissipation for the antenna assembly 12 and other electronic components on the circuit board 11. Compared to the overall heat dissipation of related technologies, the heat dissipation housing 131 provided in this application offers superior heat dissipation performance.

[0076] This application also provides a vehicle, including, as in the following embodiments: Figure 3The vehicle body 2 shown above and the main control device 1 described in any of the above optional embodiments are included in the vehicle, which thus has all the beneficial effects of the main control device 1 in any of the above embodiments, and will not be repeated here.

[0077] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0078] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0079] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0080] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0081] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A main control device (1), applied to a vehicle, characterized in that, The main control device (1) includes: A circuit board (11) having a first side (111) and a second side (112) disposed opposite to each other; Antenna assembly (12), said antenna assembly (12) being fixed to the first surface (111); and, The heat dissipation assembly (13) includes a heat dissipation shell (131) and a first partition (132). The heat dissipation shell (131) abuts against the second surface (112). The first partition (132) is located in the inner cavity of the heat dissipation shell (131) and is fixedly connected to the heat dissipation shell (131). The first partition (132) is used to divide the inner cavity of the heat dissipation shell (131) into a first cavity (131A) and a second cavity (131B). The first cavity (131A) is opposite to the antenna assembly (12).

2. The main control device (1) according to claim 1, characterized in that, The antenna assembly (12) includes: A first onboard antenna (121) is fixed to a first radiating region (111A) of the first surface (111); and, The second plate-mounted antenna (122) is fixed to the second radiation area (111B) of the first surface (111); The first radiation area (111A) and the second radiation area (111B) are spaced apart so that the first onboard antenna (121) and the second onboard antenna (122) are spaced apart.

3. The main control device (1) according to claim 2, characterized in that, The heat dissipation assembly (13) also includes a second partition (133) and a third partition (134); The second partition (133) and the third partition (134) are located inside the first cavity (131A) and are fixedly connected to the heat dissipation shell (131). The second partition (133) and the third partition (134) are spaced apart to divide the first cavity (131A) into a first isolation cavity (131C), a second isolation cavity (131D), and a third isolation cavity (131E). The first isolation cavity (131C) is opposite to the first onboard antenna (121), and the third isolation cavity (131E) is opposite to the second onboard antenna (122).

4. The main control device (1) according to claim 3, characterized in that, The heat dissipation assembly (13) also includes: A support plate (135) is located inside the second isolation cavity (131D). One end of the support plate (135) abuts against one side of the second partition (133), and the other end of the support plate (135) abuts against the side of the third partition (134) facing the second partition (133).

5. The main control device (1) according to claim 2, characterized in that, The first onboard antenna (121) includes: A first feed line body (1211) includes a first feed section (1211A), a second feed section (1211B), and a third feed section (1211C). One end of the first feed section (1211A) has a first feed point, which is connected to the circuit board (11). One end of the second feed section (1211B) is connected at an angle to the other end of the first feed line body (1211). The third feed section (1211C) is connected to the first feed section (1211A). The first grounding wire (1212) has one end grounded and the other end of the first grounding wire (1212) is connected at an angle to the other end of the second power supply unit (1211B).

6. The main control device (1) according to claim 2, characterized in that, The second onboard antenna (122) includes: The second feed line body (1221) includes a fourth feed section (1221A), a fifth feed section (1221B), and a sixth feed section (1221C). One end of the fourth feed section (1221A) has a second feed point connected to the circuit board (11). One end of the fifth feed section (1221B) is connected at an angle to the other end of the fourth feed section (1221A). The sixth feed section (1221C) is connected to the fourth feed section (1221A). The second grounding wire (1222) has one end grounded and the other end connected at an angle to the other end of the fifth power supply unit (1221B).

7. The main control device (1) according to any one of claims 2-6, characterized in that, The first onboard antenna (121) is a single-frequency antenna, and the second onboard antenna (122) is a dual-frequency antenna.

8. The main control device (1) according to claim 7, characterized in that, The main control device (1) also includes: A cover plate (14) covers the second surface (112). The cover plate (14) has a first groove (141) and a second groove (142) recessed on the second surface (112). The bottom wall of the first groove (141) is provided with a first opening (141A), and the first onboard antenna (121) is located at the first opening (141A). The bottom wall of the second groove (142) is provided with a second opening (142A), and the second onboard antenna (122) is located at the second opening (142A).

9. The main control device (1) according to claim 8, characterized in that, The main control device (1) also includes: Multiple conductive elements (15) are attached around the first radiation area (111A) and the second radiation area (111B). The bottom wall of the first groove (141) and the bottom wall of the second groove (142) abut against the multiple conductive elements (15).

10. A vehicle, characterized in that, The vehicles include: Vehicle body (2); and, The main control device (1) as described in any one of claims 1 to 9 is mounted on the vehicle body (2).

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