Method for manufacturing electronic module, electronic module and electronic device

Abstract

The embodiment of the application belongs to the technical field of electronic products, and provides a preparation method of an electronic module, the electronic module and electronic equipment. The preparation method of the electronic module comprises the following steps: forming a semi-cured coil module and a semi-cured support body, the semi-cured coil module comprising a semi-cured base body and a metal conductor which are arranged in a stack; arranging the semi-cured coil module and the semi-cured support body in a stack; and hot-pressing the semi-cured coil module and the semi-cured support body to make the semi-cured base body and the semi-cured support body cured to form a base body and a support body, and the metal conductor partially embedded in the base body and / or the support body. The electronic module prepared by the preparation method of the electronic module provided in the embodiment of the application can have a flat appearance and high strength.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and in particular to a method for preparing an electronic module, the electronic module, and an electronic device. Background Technology

[0002] Mobile phones, tablets and other electronic devices play a very important role in people's daily lives. Electronic devices can integrate electronic components such as wireless charging coils or antennas.

[0003] Electronic devices include a housing, on which a wireless charging coil or antenna can be mounted. For example, the wireless charging coil or antenna can be integrally molded with the housing or press-fitted onto the housing. The coefficients of thermal expansion of the wireless charging coil or antenna are different from those of the housing. During manufacturing, the shrinkage rates of the wireless charging coil or antenna differ from those of the housing, resulting in an uneven surface on the housing. Alternatively, cavities can be created within the housing to house the wireless charging coil or antenna and connect it to the housing. Creating cavities within the housing reduces the strength of the electronic device's housing.

[0004] In related technologies, the process of integrating electronic devices onto a housing makes it difficult for the housing of electronic devices to have both a flat appearance and high strength. Summary of the Invention

[0005] This application provides a method for preparing an electronic module, an electronic module, and an electronic device. The electronic module prepared using the method can have both a flat appearance and high strength.

[0006] The first aspect of this application provides a method for manufacturing an electronic module, including:

[0007] A semi-cured coil module is formed and a semi-cured support is formed. The semi-cured coil module includes a semi-cured substrate and a metal conductor stacked together.

[0008] The semi-cured coil module and the semi-cured support are stacked together;

[0009] The semi-cured coil module and the semi-cured support are thermo-pressed together to cure the semi-cured substrate and the semi-cured support to form the substrate and the support, and the metal conductor portion is embedded in the substrate and / or the support.

[0010] The method for fabricating the electronic module according to this application involves hot-pressing a semi-cured coil module and a semi-cured support in a semi-cured state. Since the semi-cured substrate and support possess a certain degree of fluidity, they can achieve good matching with the external contour of the metal conductor during the pressing process. Furthermore, the semi-cured substrate and support begin curing from a semi-cured state, resulting in a small difference in their shrinkage rates, which reduces the unevenness of the electronic module's appearance, giving it a smooth surface. In addition, the semi-cured substrate and support begin curing from a semi-cured state, leading to high bonding strength at their interface during pressing and curing, resulting in high strength for the electronic module. Moreover, this fabrication process does not require reducing the thickness of the support, thus further increasing the strength of the electronic module.

[0011] In some possible implementations, stacking the semi-cured coil module and the semi-cured support includes: providing a first semi-cured support on one side of the semi-cured coil module; and curing the first semi-cured support to form a first support.

[0012] In some possible implementations, stacking the semi-cured coil module and the semi-cured support includes: providing a second semi-cured support on the other side of the semi-cured coil module; and curing the second semi-cured support to form a second support.

[0013] The semi-cured coil module and the semi-cured support are stacked and then pressed together. Therefore, according to the specific structural requirements of the electronic module, only the stacking position and number of layers of the semi-cured coil module and the semi-cured support need to be changed during the stacking process. Compared with injection molding, which requires re-molding or opening a cavity, which requires changing the internal structure of the cavity, the manufacturing method of the electronic module has a lower cost.

[0014] In some possible implementations, forming a semi-cured coil module includes: providing a metal conductor on one side of the semi-cured substrate.

[0015] In some possible implementations, the stacking of the semi-cured coil module and the semi-cured support includes the metal conductor being positioned away from the first semi-cured support. Therefore, the orientation of the metal conductor can be set according to the specific structural requirements of the electronic module.

[0016] In some possible implementations, forming a semi-cured coil module includes: providing a first metal conductor and a second metal conductor on both sides of the semi-cured substrate. This results in a higher power output for the coil module.

[0017] Semi-cured coil modules are semi-finished products used in the preparation of coil modules. Metal conductors can be set according to different power requirements of the coil modules, making the specifications of the coil modules more diverse.

[0018] In some possible implementations, stacking the semi-cured coil module and the semi-cured support includes: when the semi-cured support includes a first semi-cured support, the first metal conductor faces the first semi-cured support, and the second metal conductor faces away from the first semi-cured support; or, when the semi-cured support includes a first semi-cured support and a second semi-cured support, the first metal conductor faces the first semi-cured support, and the second metal conductor faces the second semi-cured support. Therefore, when only one layer of semi-cured support is needed, only the first semi-cured support needs to be placed on one side of the first metal conductor; when two layers of semi-cured support are needed, the first semi-cured support can be placed on one side of the first metal conductor, and the second semi-cured support can be placed on one side of the second metal conductor. Increasing the number of semi-cured support layers does not increase the fabrication process of the electronic module, and the fabrication method of the electronic module has high compatibility.

[0019] In some possible implementations, after heat-pressing the semi-cured coil module and the semi-cured support, the process includes: making the first metal conductor and the second metal conductor conductive. Making the first metal conductor and the second metal conductor conductive after heat-pressing avoids damaging the connection structure between them during the heat-pressing process, thus making the connection between the first metal conductor and the second metal conductor more reliable.

[0020] In some possible implementations, making the first and second metal conductors conductive includes: forming a first via on the second metal conductor and the substrate; and filling the first via with a conductive agent to make the first and second metal conductors conductive. Thus, only a first via needs to be formed on the second metal conductor and the substrate to electrically connect the first and second metal conductors via a conductive agent. Compared to related technologies that require forming vias in both conductors and the substrate between the conductors, and depositing a conductive layer on the inner wall of the via to connect the conductors on both sides, the above method is less costly and more reliable in connecting the first and second metal conductors by filling with a conductive agent.

[0021] In some possible implementations, when the support body includes a second support body, before forming the first via on the second metal conductor and the substrate, a second via aligned with the first via is formed on the second support body, the diameter of the second via being larger than that of the first via. By making the diameter of the second via larger than that of the first via, more conductive agent can be filled in the second via, further improving the conductivity of the first and second metal conductors.

[0022] In some possible implementations, when the support includes a second support, providing a first via on the second metal conductor and the substrate simultaneously includes providing a second via on the second support, aligned with the first via, wherein the diameter of the second via is equal to the diameter of the first via. Therefore, the creation of the second via and the first via can be completed in the same process step, simplifying the fabrication process of the electronic module.

[0023] In some possible implementations, providing a second via aligned with the first via on the second support also includes providing a third via on the second support to allow the second metal conductor to communicate with an external conductive element. By providing both the third via and the second via on the second support, the third via can be created simultaneously with the second via, thereby further simplifying the fabrication process of the electronic module.

[0024] In some possible implementations, after hot-pressing the semi-cured coil module and the semi-cured support, an isolation layer is provided on the side of the substrate away from the first support, thereby avoiding the high-temperature process of hot pressing from affecting the magnetic resistance of the isolation layer.

[0025] In some possible implementations, after heat-pressing the semi-cured coil module and the semi-cured support, a decorative layer is provided on the side of the first support away from the substrate, thereby avoiding the impact of heat pressing on the appearance of the decorative layer.

[0026] The second aspect of this application provides an electronic module, including a coil module and a support. The coil module includes a substrate and a metal conductor. When the substrate and the support are in a semi-cured state, the coil module and the support are pressed together, and the metal conductor portion is embedded into the substrate and the support and / or the support.

[0027] In some possible implementations, the support includes a first support located on one side of the coil module. The first support can protect the coil module inside the housing of the electronic device, thereby providing both support and protection for the coil module.

[0028] In some possible implementations, the support further includes a second support located on the opposite side of the coil module. The first support, coil module, and second support can form a stacked sandwich structure, thereby further increasing the strength of the electronic module. Furthermore, the second support faces inwards towards the housing of the electronic device, thereby preventing the coil from contacting other electronic components within the device and causing a short circuit, thus improving the safety of the electronic module.

[0029] In some possible implementations, the metal conductor is positioned away from the first support, and the metal conductor portion is embedded in the substrate. Positioning the metal conductor on one side of the substrate can reduce the cost of the coil module. Positioning the metal conductor away from the first support facilitates electrical connection between the metal conductor and the circuit board.

[0030] In some possible implementations, the metal conductor includes a first metal conductor and a second metal conductor, which are located on opposite sides of the substrate. This can improve the power of the coil module. When the first metal conductor and the second metal conductor are electrically connected, the first metal conductor can also be electrically connected to the circuit board through the second metal conductor, making the electrical connection between the coil module and the circuit board relatively simple.

[0031] In some possible implementations, when the electronic module includes a first support, the first metal conductor faces the first support, is partially embedded in the substrate and partially embedded in the first support, and the second metal conductor faces away from the first support, is partially embedded in the substrate, and does not have a second support. The second metal conductor is directly connected to the circuit board, simplifying the electrical connection between the coil module and the circuit board. Alternatively, when the electronic module includes a first support and a second support, the first metal conductor faces the first support, is partially embedded in the substrate and partially embedded in the first support; the second metal conductor faces the second support, is partially embedded in the substrate and partially embedded in the second support. A second support is provided on the second metal conductor to protect it and prevent short circuits caused by contact with other components in the electronic device.

[0032] In some possible implementations, a first via is formed in the second metal conductor and the substrate, and the first via is filled with a conductive agent to make the first metal conductor and the second metal conductor conductive. By forming a first via in the second metal conductor and the substrate and filling the first via with a conductive agent to electrically connect the first metal conductor and the second metal conductor, the first metal conductor and the second metal conductor do not require additional lead wires for electrical connection, which simplifies the structure of the electronic module.

[0033] In some possible embodiments, a second through-hole is provided in the second support body, the second through-hole communicating with the first through-hole, and both the second and first through-holes are filled with a conductive agent. Filling both the second and first through-holes with conductive agent can increase the amount of conductive agent, thereby improving the conductivity of the first and second metal conductors.

[0034] In some possible implementations, the diameter of the second via is larger than that of the first via, allowing for the filling of more conductive agent and further improving the conductivity of the first and second metal conductors. Alternatively, the diameter of the second via can be equal to that of the first via, enabling drilling of both vias in a single operation to simplify the manufacturing process of the electronic module.

[0035] In some possible implementations, the second support is provided with a third through hole to allow the second metal conductor to communicate with the conductive element.

[0036] In some possible implementations, an isolation layer is also included, disposed on the side of the coil module facing away from the first support. The isolation layer can be a nanocrystalline layer, which can act as a magnetic shield, reducing interference between the magnetic field in the coil module and other components in the electronic device.

[0037] In some possible implementations, a decorative layer is also included, which is disposed on the side of the first support away from the coil module. The decorative layer can enhance the appearance of the electronic device.

[0038] In some possible implementations, the coil module is an antenna module or a wireless charging module, and the support is the housing of the electronic device.

[0039] A third aspect of this application provides an electronic device, including an electronic module prepared by the above-described method or the above-described electronic module. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0041] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0042] Figure 3 This is a schematic diagram of the structure of the electronic module provided in the embodiments of this application;

[0043] Figure 4 For along Figure 3 Sectional view of the middle AA plane Figure 1 ;

[0044] Figure 5 Schematic diagram of the fabrication process of the electronic module provided in the embodiments of this application Figure 1 ;

[0045] Figure 6 For along Figure 3 Sectional view of the middle AA plane Figure 2 ;

[0046] Figure 7 For along Figure 3 Sectional view of the middle AA plane Figure 3 ;

[0047] Figure 8 For along Figure 3 Sectional view of the middle AA plane Figure 4 ;

[0048] Figure 9 For along Figure 3 Sectional view of the middle AA plane Figure 5 ;

[0049] Figure 10 Schematic diagram of the fabrication process of the electronic module provided in the embodiments of this application Figure 2 ;

[0050] Figure 11 Schematic diagram of the fabrication process of the electronic module provided in the embodiments of this application Figure 3 ;

[0051] Figure 12 For along Figure 3 Sectional view of the middle AA plane Figure 6 ;

[0052] Figure 13 For along Figure 3 Sectional view of the middle AA plane Figure 7 ;

[0053] Figure 14 For along Figure 3 Sectional view of the middle AA plane Figure 8 ;

[0054] Figure 15 For along Figure 3 Sectional view of the middle AA plane Figure 9 ;

[0055] Figure 16 For along Figure 3 Sectional view of the middle AA plane Figure 10 ;

[0056] Figure 17 For along Figure 3 A cross-sectional view of the BB plane;

[0057] Figure 18 A flowchart illustrating the method for fabricating an electronic module provided in this application embodiment;

[0058] Figure 19 A schematic diagram illustrating the fabrication process of the semi-cured coil module in the electronic module provided in this application embodiment.

[0059] Figure label:

[0060] 1000 - Electronic devices;

[0061] 10 - Display screen;

[0062] 20 - Housing; 21 - Mid-frame; 21a - Mid-plate; 21b - Frame; 22 - Back cover;

[0063] 30 - Circuit board;

[0064] 40-coil;

[0065] 50-Camera module;

[0066] 100 - Electronic module; 100a - Electronic module body; 100b - Camera mounting part; 100c - Mounting hole; 100d - Fastening part;

[0067] 110 - Coil module; 110a - First side; 110b - Second side; 110' - Semi-cured coil module;

[0068] 111-Matrix; 111'-Semi-cured matrix; 1111-First via; 1112-Conductive agent;

[0069] 112 - Metallic conductor; 112' - Copper foil; 112” - Copper layer; 1121 - First metallic conductor; 1122 - Second metallic conductor;

[0070] 120 - Support body; 120' - Semi-cured support body;

[0071] 121-First support; 121'-First semi-cured support;

[0072] 122-Second support; 122'-Second semi-cured support; 1221-Second through hole; 1222-Third through hole;

[0073] 130 - Isolation layer; 131 - Fourth via;

[0074] 140 - Decorative layer;

[0075] 200 - Mask. Detailed Implementation

[0076] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0077] This application provides an electronic device. The electronic device can be referred to as a user equipment (UE) or terminal, etc. For example, the electronic device can be a portable Android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication capabilities, a computing device, an in-vehicle device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical care, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, etc. This application does not specifically limit the form of the electronic device.

[0078] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0079] See Figure 1 As shown, the example given is an electronic device 1000 that is a handheld device with wireless communication capabilities. For example, a handheld device with wireless communication capabilities could be a mobile phone.

[0080] Please continue reading Figure 1 As shown, the electronic device 1000 includes a display screen 10 and a housing 20. The housing 20 is the main support structure of the electronic device 1000. The display screen 10 is mounted on the housing 20. The display screen 10 provides a display interface and a user interface for the electronic device 1000.

[0081] Figure 2 This is an exploded view of an electronic device provided in an embodiment of this application.

[0082] See Figure 2As shown, the housing 20 includes a middle frame 21 and a back cover 22. The middle frame 21 includes a middle plate 21a and a frame 21b connected to each other. The frame 21b can be a rectangular frame, surrounding and connecting to the peripheral edge of the middle plate 21a. The display screen 10 can be mounted on the frame 21b, forming a cavity with the middle plate 21a. The cavity between the display screen 10 and the middle plate 21a can accommodate other components of the electronic device 1000, such as a front-facing camera.

[0083] See also Figure 2 As shown, the back cover 22 is installed on the side of the middle frame 21 away from the display screen 10 and is connected to the frame 21b. The back cover 22 and the middle frame 21 can also form another cavity inside the electronic device 1000, in which components such as the circuit board 30 or the battery can be installed.

[0084] Electronic devices can be mounted on the circuit board 30. For example, electronic devices may include processor modules, system-on-chip (SoC), storage modules, communication modules, radio frequency modules, charging management modules, power management ICs (PMICs), etc.

[0085] See Figure 2 As shown, the electronic device 1000 also includes a coil 40, which can be used as a wireless charging coil or antenna for the electronic device 1000. The coil 40 can be disposed on the rear cover 22, which is used to mount and support the coil 40. The coil 40 can be electrically connected to the circuit board 30 through a conductive element, which can be a flexible circuit board or a lead wire.

[0086] In related technologies, when the coil is mounted on the back cover, the coil and back cover can be integrally molded together via injection molding or press-fitted together. The coefficients of thermal expansion of the coil and the back cover are inconsistent. During manufacturing, the shrinkage rate of the coil differs from that of the housing, resulting in an uneven surface on the back cover. Alternatively, a cavity can be created within the back cover to house the coil and connect it to the back cover. However, the thickness of the back cover itself is relatively small; creating a cavity within it reduces the strength of the back cover, weakening the bond between the coil and the back cover, further reducing the overall strength of the coil and back cover. The process of integrating electronic components onto a housing makes it difficult for the housing of electronic devices to simultaneously achieve a smooth appearance and high strength.

[0087] Based on this, the present application provides a method for preparing an electronic module, an electronic module, and an electronic device. The electronic module prepared by the method for preparing an electronic module can have both a flat appearance and high strength.

[0088] The structure of the electronic module will be explained below.

[0089] Figure 3 This is a schematic diagram of the structure of the electronic module provided in the embodiments of this application; Figure 4 For along Figure 3 Sectional view of the middle AA plane Figure 1 .

[0090] See Figure 3 and Figure 4 As shown, the electronic module 100 includes a coil module 110 and a support 120. The coil module 110 includes a substrate 111 and a metal conductor 112. When the substrate 111 and the support 120 are in a semi-cured state, the coil module 110 and the support 120 are pressed together so that the metal conductor 112 is partially embedded in the substrate 111 and / or the support 120.

[0091] The coil module 110 can be an antenna module, for example, the coil module 110 can transmit or receive signals. The coil module 110 can also be a wireless charging module. An external charging device generates an alternating magnetic field. When the external charging device is close to the coil module 110, the coil module 110 generates an induced voltage in the alternating magnetic field. The coil module 110 is electrically connected to the circuit board 30, thereby enabling wireless charging of the electronic device 1000.

[0092] The support 120 can be the housing 20 of the electronic device 1000, for example, in Figure 3 and Figure 4 In the illustrated embodiment, the support 120 is the rear cover 22 of the housing 20. In other embodiments, the support 120 may be other components of the housing 20. The support 120 may be made of resin or glass fiber resin.

[0093] The base 111 of the coil module 110 is used to support the metal conductor 112. The base 111 of the coil module 110 can also be resin or glass fiber resin.

[0094] Figure 5 Schematic diagram of the fabrication process of the electronic module provided in the embodiments of this application Figure 1 .

[0095] See Figure 5 As shown, the metal conductor 112 can be pressed onto the substrate 111 to form a semi-cured coil module 110', and then the semi-cured coil module 110' is pressed onto the semi-cured support 120'. Before pressing the semi-cured coil module 110' onto the semi-cured support 120', the substrate in the semi-cured coil module 110' is in a semi-cured state. Figure 5The semi-cured substrate 111' is shown, and the support 120 is shown as a semi-cured support 120'. First, a semi-cured coil module 110' having the semi-cured substrate 111' is stacked together with the semi-cured support 120'; then, the semi-cured coil module 110' and the semi-cured support 120' are pressed together, which can be hot pressing. During the pressing process, the semi-cured substrate 111' and the semi-cured support 120' have a certain degree of fluidity; therefore, as the semi-cured substrate 111' and the semi-cured support 120' gradually solidify into the substrate 111 and the support 120, the metal conductor 112 will gradually embed into the substrate 111 and / or the support 120. Figure 3 and Figure 4 In the embodiment shown, a metal conductor 112 is provided on the side of the substrate 111 away from the support 120. Therefore, the metal conductor 112 is partially embedded into the substrate 111 during the pressing process.

[0096] The semi-cured substrate 111' and semi-cured support 120' have a certain degree of fluidity. Therefore, the semi-cured substrate 111' and semi-cured support 120' can be well matched with the appearance contour of the metal conductor 112 during the pressing process. Furthermore, the semi-cured substrate 111' and semi-cured support 120' start to cure from the semi-cured state, and the difference in their shrinkage rates is small. This can reduce the unevenness of the appearance of the electronic module 100, so that the electronic module 100 has a smooth appearance.

[0097] The semi-cured substrate 111' and the semi-cured support 120' cure simultaneously, forming an adhesive force at their interface. This results in a strong bond between the substrate 111 and the support 120, thereby increasing the strength of the electronic module 100. Furthermore, the thickness of the support 120 can remain constant, further enhancing the strength of the electronic module 100.

[0098] The specific structure of the electronic module 100 will be described below.

[0099] Figure 6 For along Figure 3 Sectional view of the middle AA plane Figure 2 ; Figure 7 For along Figure 3 Sectional view of the middle AA plane Figure 3 .

[0100] See Figure 6 and Figure 7 As shown, the coil module 110 has a first side 110a and a second side 110b opposite in the delay thickness direction. Figure 6In the embodiment shown, the support 120 includes a first support 121, which is located on one side of the coil module 110.

[0101] A first support 121 can be provided on the first side 110a of the coil module 110. When assembling the electronic device 1000, the first support 121 can face the outside of the electronic device 1000. The first support 121 can protect the coil module 110 inside the housing 20 of the electronic device 1000, thereby supporting and protecting the coil module 110 at the same time.

[0102] exist Figure 7 In the embodiment shown, the support 120 further includes a second support 122, which is located on the other side of the coil module 110.

[0103] The second support 122 is disposed on the second side 110b of the coil module 110, that is, the second support 122 and the first support 121 are disposed on opposite sides of the coil module 110. The first support 121, the coil module 110 and the second support 122 can form a stacked sandwich structure, thereby further increasing the strength of the electronic module 100. In addition, the second support 122 faces the interior of the housing 20 of the electronic device 1000, thereby preventing the coil module 110 from contacting other electronic components inside the electronic device 1000 and causing a short circuit, thus improving the safety of the electronic module 100.

[0104] Please continue reading Figure 6 and Figure 7 As shown, in one possible implementation, the metal conductor 112 is disposed away from the first support 121, and the metal conductor 112 is partially embedded in the substrate 111.

[0105] Only one layer of metal conductor 112 can be disposed on the substrate 111, and the metal conductor 112 is disposed on the second side 110b of the substrate 111. Therefore, in Figure 6 In the illustrated embodiment, the electronic module 100 includes only the first support 121, and during pressing, the metal conductor 112 is partially embedded into the substrate 111. Figure 7 In the illustrated embodiment, the electronic module 100 includes a first support 121 and a second support 122. A metal conductor 112 is partially embedded in the substrate 111 and partially embedded in the second support 122. Placing the metal conductor 112 on one side of the substrate 111 reduces the cost of the coil module 110. Positioning the metal conductor 112 on the side opposite to the first support 121 facilitates electrical connection between the metal conductor 112 and the circuit board 30.

[0106] Figure 8 For along Figure 3Sectional view of the middle AA plane Figure 4 ; Figure 9 For along Figure 3 Sectional view of the middle AA plane Figure 5 .

[0107] See Figure 8 and Figure 9 As shown, the metal conductor 112 includes a first metal conductor 1121 and a second metal conductor 1122. The first metal conductor 1121 and the second metal conductor 1122 are located on opposite sides of the substrate 111, and the first metal conductor 1121 and the second metal conductor 1122 are connected.

[0108] By providing a first metal conductor 1121 and a second metal conductor 1122 on the first side 110a and the second side 110b of the substrate 111, the power of the coil module 110 can be increased, and the first metal conductor 1121 and the second metal conductor 1122 can be made conductive. When the second metal conductor 1122 is electrically connected to the circuit board 30, the first metal conductor 1121 can also be electrically connected to the circuit board 30 through the second metal conductor 1122, making the electrical connection method between the coil module 110 and the circuit board 30 relatively simple.

[0109] Please continue reading Figure 8 As shown, when only the first support 121 is provided in the electronic module 100, the first metal conductor 1121 faces the first support 121, the first metal conductor 1121 is partially embedded in the substrate 111 and partially embedded in the first support 121, and the second metal conductor 1122 is away from the first support 121, the second metal conductor 1122 is partially embedded in the substrate 111.

[0110] Figure 10 Schematic diagram of the fabrication process of the electronic module provided in the embodiments of this application Figure 2 .

[0111] See Figure 10As shown, the semi-cured state of the first support 121 is the first semi-cured support 121'. When the semi-cured coil module 110' and the first semi-cured support 121' are pressed together, the first metal conductor 1121 faces the first semi-cured support 121', and the second metal conductor 1122 is placed away from the first support 121. Thus, during pressing, the side of the first metal conductor 1121 facing the first support 121 is embedded into the first support 121, and the side of the first metal conductor 1121 facing the base 111 is embedded into the base 111. This also improves the bonding force between the first metal conductor 1121 and the coil module 110. The side of the second metal conductor 1122 facing the base 111 is embedded into the base 111. The second metal conductor 1122 does not have a second support 122; it is directly connected to the circuit board 30, simplifying the electrical connection between the coil module 110 and the circuit board 30.

[0112] Please continue reading Figure 9 As shown, when the electronic module 100 includes a first support 121 and a second support 122, the first metal conductor 1121 faces the first support 121, and the first metal conductor 1121 is partially embedded in the substrate 111 and partially embedded in the first support 121; the second metal conductor 1122 faces the second support 122, and the second metal conductor 1122 is partially embedded in the substrate 111 and partially embedded in the second support 122.

[0113] Figure 11 Schematic diagram of the fabrication process of the electronic module provided in the embodiments of this application Figure 3 .

[0114] See Figure 11As shown, the semi-cured state of the second support 122 is the second semi-cured support 122'. When the semi-cured coil module 110', the first semi-cured support 121', and the second semi-cured support 122 are pressed together, the first metal conductor 1121 faces the first semi-cured support 121', and the second metal conductor 1122 faces the second semi-cured support 122'. Thus, during pressing, the side of the first metal conductor 1121 facing the first support 121 is embedded into the first support 121, and the side of the first metal conductor 1121 facing the base 111 is embedded into the base 111. Therefore, the first metal conductor 1121 can also improve the bonding force between the first support 121 and the coil module 110. The side of the second metal conductor 1122 facing the substrate 111 is embedded in the substrate 111, and the side of the second metal conductor 1122 facing the second support 122 is embedded in the second support 122. This improves the bonding force between the second metal conductor 1122 and the coil module 110. The second support 122 is provided on the second metal conductor 1122, protecting it from short circuits caused by contact with other devices in the electronic device 1000.

[0115] Please continue reading Figure 8 and Figure 9 As shown, a first via 1111 is formed in the second metal conductor 1122 and the substrate 111. The first via 1111 is filled with a conductive agent 1112 so that the first metal conductor 1121 and the second metal conductor 1122 are connected.

[0116] Specifically, a first via 1111 can be formed by drilling a hole in the second metal conductor 1122 and the substrate 111 using laser drilling. Due to the limitations of the laser optical path, the first via 1111 can be conical. In other embodiments, the first via 1111 can also be cylindrical.

[0117] A conductive agent 1112 is filled into the first via 1111. The conductive agent 1112 contacts the inner wall of the first via 1111 at the second metal conductor 1122, and contacts the side of the first metal conductor 1121 facing the substrate 111 at the first metal conductor 1121. Thus, the first metal conductor 1121 and the second metal conductor 1122 can be electrically connected through the conductive agent 1112. The conductive agent 1112 can be conductive silver paste or conductive copper paste. By creating the first via 1111 in the second metal conductor 1122 and the substrate 111, and filling the first via 1111 with the conductive agent 1112 to electrically connect the first metal conductor 1121 and the second metal conductor 1122, the first metal conductor 1121 and the second metal conductor 1122 do not require additional lead wires for electrical connection, thus simplifying the structure of the electronic module 100.

[0118] Please continue reading Figure 9 As shown, a second through hole 1221 is provided in the second support body 122. The second through hole 1221 is connected to the first through hole 1111. Both the second through hole 1221 and the first through hole 1111 are filled with conductive agent.

[0119] When the electronic module 100 includes a second support 122, a second via 1221 needs to be formed in the second support 122. A laser can pass through the second via 1221 to form a first via 1111 in the second metal conductor 1122 and the substrate 111. Furthermore, both the second via 1221 and the first via 1111 are filled with a conductive agent 1112, which increases the amount of conductive agent 1112, thereby improving the conductivity of the first metal conductor 1121 and the second metal conductor 1122.

[0120] Please continue reading Figure 9 As shown, the diameter of the second via 1221 can be equal to the diameter of the first via 111.

[0121] When the diameter of the second via 1221 is equal to the diameter of the first via 1111, the second via 1221 and the first via 1111 can be drilled in one operation, simplifying the processing steps of the electronic module 100. It should be noted that the statement that the diameter of the second via 1221 is equal to the diameter of the first via 1111 refers to the situation where the tolerance of laser drilling is not considered.

[0122] Figure 12 For along Figure 3 Sectional view of the middle AA plane Figure 6 .

[0123] See Figure 12 As shown, the diameter of the second via 1221 is larger than the diameter of the first via 1111.

[0124] When the diameter of the second via 1221 is larger than that of the first via 1111, the second via 1221 needs to be first opened on the second support 122, and then the first via 1111 is opened in the second metal conductor 1122 and the substrate 111. By making the diameter of the second via 1221 larger than that of the first via 1111, more conductive agent 1112 can be filled in the second via 1221, further improving the conductivity of the first metal conductor 1121 and the second metal conductor 1122.

[0125] Please continue reading Figure 7 , Figure 9 and Figure 12 As shown, a third through hole 1222 is provided on the second support 122 so that the second metal conductor 1122 can be used to communicate with the conductive element.

[0126] When the electronic module 100 includes a second support body 122, a third via 1222 needs to be opened on the second support body 122 to expose part of the metal conductor 112. The conductive element can be inserted into the third via 1222 to be electrically connected to the metal conductor 1122.

[0127] Figure 13 For along Figure 3 Sectional view of the middle AA plane Figure 7 ; Figure 14 For along Figure 3 Sectional view of the middle AA plane Figure 8 ; Figure 15 For along Figure 3 Sectional view of the middle AA plane Figure 9 ; Figure 16 For along Figure 3 Sectional view of the middle AA plane Figure 10 .

[0128] See Figures 13 to 16 As shown, the electronic module 100 also includes an isolation layer 130, which is disposed on the side of the coil module 110 away from the first support 121.

[0129] The isolation layer 130 can be a nanocrystalline layer. The isolation layer 130 can act as a magnetic shield, reducing interference between the magnetic field in the coil module 110 and other components in the electronic device 1000. Figure 13 and Figure 14 In the illustrated embodiment, the insulating layer 130 can be bonded to the second side 110b of the coil module 110. Figure 15 and Figure 16 In the embodiment shown, the isolation layer 130 can be bonded to the side of the second support 1221 opposite to the substrate 111.

[0130] It should be noted that a fourth via 131 is also provided in the isolation layer 130. By providing the fourth via 131, the metal conductor 112 can be exposed, and the conductive element can extend into the third via 1222 to be electrically connected to the metal conductor 112. Figure 13 and Figure 14 In the embodiment shown, the fourth via 131 is aligned with the third via 1222.

[0131] Please continue reading Figures 13 to 16 As shown, the electronic module 100 also includes a decorative layer 140, which is disposed on the side of the first support 121 opposite to the coil module 110.

[0132] The first support 121 faces the outside of the electronic device 1000. A decorative layer 140 can be provided on the first support 121. For example, the decorative layer 140 can be a colored coating. The decorative layer 140 can beautify the appearance of the electronic device 1000.

[0133] Figure 17 For along Figure 3 A cross-sectional view of the BB plane.

[0134] See Figure 2 , Figure 3 and Figure 17 As shown, the electronic device 1000 also includes a camera module 50. The electronic module 100 includes an electronic module body 100a and a camera mounting portion 100b, with a mounting hole 100c in the camera mounting portion 100b. The camera module 50 is located in the mounting hole 100c and connected to the camera mounting portion 100b. To facilitate the installation of the camera module 50, the camera mounting portion 100b is bent relative to the electronic module body 100a. The electronic module 100 also includes a fastening portion 100d, which is bent relative to the electronic module body 100a toward the middle frame 21 for easy installation with the middle frame 21. In this embodiment, during pressing, both the substrate 111' and the support 120 are in a semi-cured state. Therefore, the semi-cured substrate 111' and the semi-cured support 120' are flexible and easily deformed, allowing them to better fit the outline of the electronic device 1000. The stress generated after transitioning from the semi-cured state to the cured state is also relatively small.

[0135] The following describes the manufacturing process of the electronic module 100.

[0136] Figure 18 A flowchart illustrating the preparation method of the electronic module provided in this application embodiment.

[0137] See Figure 18 As shown, the method for manufacturing the electronic module 100 includes:

[0138] S101. A semi-cured coil module 110' is formed and a semi-cured support 120' is formed. The semi-cured coil module 110' includes a semi-cured substrate 111' and a metal conductor 112 stacked together.

[0139] Figure 19 A schematic diagram illustrating the fabrication process of the semi-cured coil module in the electronic module provided in this application embodiment.

[0140] See Figure 19 As shown, the substrate and copper foil 112' are first pre-pressed together. The temperature and time of pre-pressing are controlled to ensure that the substrate is semi-cured to form a semi-cured substrate 111' and that the copper foil 112' is reliably connected to the semi-cured substrate 111'. A mask 200 is placed on the semi-cured coil module 110', and the copper foil 112' is patterned by exposure and development. A copper layer 112' is plated in the unexposed area. After removing the mask, the copper foil 112' in the exposed area is etched to form a patterned metal conductor 112. The semi-cured coil module 110' can be obtained through the above process steps. Before proceeding to the next process, the surface of the semi-cured coil module 110' can be roughened and baked at a low temperature. The strength of the semi-cured coil module 110' is sufficient to support its processing and transfer in subsequent processes.

[0141] The semi-cured support 120' can be a semi-cured resin or glass fiber resin.

[0142] S102, The semi-cured coil module 110' and the semi-cured support 120' are stacked.

[0143] Please continue reading Figure 5 and Figure 18 As shown, when the semi-cured coil module 110' and the semi-cured support 120' are stacked, the metal conductor 112 can face towards the semi-cured support 120' or away from the semi-cured support 120'. Figure 5 In the embodiment shown, the metal conductor 112 is away from the semi-cured support 120'.

[0144] S103. The semi-cured coil module 110' and the semi-cured support 120' are hot-pressed together to solidify the semi-cured substrate 111' and the semi-cured support 120' to form the substrate 111 and the support 120, and the metal conductor 112 is partially embedded in the substrate 111 and / or the support 120.

[0145] During hot pressing, a certain temperature and pressure are applied to press and connect the semi-cured coil module 110' and the semi-cured support 120'. The semi-cured substrate 111' and the semi-cured support 120' have a certain degree of fluidity; therefore, as the semi-cured substrate 111' and the semi-cured support 120' gradually solidify into the substrate 111 and the support 120, the metal conductor 112 will gradually embed into the substrate 111 and / or the support 120. Figure 3 and Figure 4 In the embodiment shown, the metal conductor 112 is located on the side of the substrate 111 away from the support 120, so the metal conductor 112 is partially embedded into the substrate 111 during the pressing process.

[0146] The semi-cured substrate 111' and semi-cured support 120' possess a certain degree of fluidity. Therefore, during the pressing process, the semi-cured substrate 111' and semi-cured support 120' can achieve good matching with the external contour of the metal conductor 112. Furthermore, since the semi-cured substrate 111' and semi-cured support 120' begin to cure from a semi-cured state, the difference in their shrinkage rates is small, which can reduce the unevenness of the electronic module 100's appearance, resulting in a smooth appearance. In addition, because the semi-cured substrate 111' and semi-cured support 120' begin to cure from a semi-cured state, the bonding force at their contact interface is high during pressing and curing, resulting in high strength of the electronic module 100. Moreover, this fabrication process does not require reducing the thickness of the support 120, thus further increasing the strength of the electronic module 100.

[0147] In one possible implementation, stacking the semi-cured coil module 110' and the semi-cured support 120' includes: providing a first semi-cured support 121' on one side of the semi-cured coil module 110'; and curing the first semi-cured support 121' to form the first support 121.

[0148] The support 120 of the electronic module 100 facing the outside of the electronic device 1000 is the first support 121. The first semi-cured support 121' can be provided on the side of the semi-cured coil module 110' facing the outside of the electronic device 1000. The first semi-cured support 121' and the semi-cured substrate 111' are cured during the hot pressing process to form a coil module 110 with the first support 121 on one side.

[0149] In another possible implementation, the stacking of the semi-cured coil module 110' and the semi-cured support 120' includes: providing a second semi-cured support 122' on the other side of the semi-cured coil module 110'; the second semi-cured support 122' is cured to form the second support 122.

[0150] Please continue reading Figure 11 As shown, semi-cured supports 120' can also be provided on both sides of the semi-cured coil module 110', with the semi-cured supports 120' on both sides being the first semi-cured support 121' and the second semi-cured support 122', respectively.

[0151] The semi-cured coil module 110' and the semi-cured support 120' are stacked and then pressed together. Therefore, according to the specific structural requirements of the electronic module 100, only the stacking position and number of layers of the semi-cured coil module 110' and the semi-cured support 120' need to be changed during the stacking process. Compared with injection molding, which requires re-molding, or opening a cavity, which requires changing the internal structure of the cavity, the manufacturing method of the electronic module 100 has a lower cost.

[0152] The specific configuration of the metal conductor 120 is explained below.

[0153] In one possible implementation, forming a semi-cured coil module 110' includes: providing a metal conductor 112 on one side of a semi-cured substrate 111', thereby reducing the cost of the coil module 110.

[0154] When the semi-cured coil module 110' and the semi-cured support 120' are laminated together, the metal conductor 112 can face towards the first semi-cured support 121' or away from the first semi-cured support 121'. In this embodiment, the metal conductor 112 is positioned away from the first semi-cured support 121'. Therefore, the orientation of the metal conductor 112 can be set according to the specific structural requirements of the electronic module 100.

[0155] In another possible implementation, forming a semi-cured coil module 110' includes: providing a first metal conductor 1121 and a second metal conductor 1122 on both sides of the semi-cured substrate 111', thereby making the coil module 110 have higher power.

[0156] The semi-cured coil module 110' is a semi-finished product for preparing the coil module 110. The metal conductor 1121 can be set according to the different power requirements of the coil module 110, so that the specifications of the coil module 110 are more diversified.

[0157] When the metal conductor 112 includes a first metal conductor 1121 and a second metal conductor 1122, the semi-cured coil module 110' and the semi-cured support 120' can be stacked as follows:

[0158] Please continue reading Figure 10As shown, in one possible implementation, when the semi-cured support 120' includes a first semi-cured support 121', the first metal conductor 1121 faces the first semi-cured support 121', and the second metal conductor 1122 faces away from the first semi-cured support 121'.

[0159] Please continue reading Figure 11 As shown, in another possible embodiment, when the semi-cured support 120' includes a first semi-cured support 121' and a second semi-cured support 122', the first metal conductor 1121 faces the first semi-cured support 121' and the second metal conductor 1122 faces the second semi-cured support 122'.

[0160] Therefore, when only one layer of semi-cured support 120' is needed, it is sufficient to set the first semi-cured support 121' on one side of the first metal conductor 1121. When two layers of semi-cured support 120' are required, the first semi-cured support 121' can be set on one side of the first metal conductor 1121 and the second semi-cured support 122' can be set on one side of the second metal conductor 1122. Increasing the number of semi-cured support 120' layers does not increase the fabrication process of the electronic module 100, and the fabrication method of the electronic module 100 has high compatibility.

[0161] After the semi-cured coil module 110' and the semi-cured support 120' are heat-pressed together, the process includes: making the first metal conductor 1121 and the second metal conductor 1122 conductive.

[0162] The first metal conductor 1121 and the second metal conductor 1122 are connected after hot pressing, which can avoid the hot pressing process from damaging the connection structure between the first metal conductor 1121 and the second metal conductor 1122, making the connection between the first metal conductor 1121 and the second metal conductor 1122 more reliable.

[0163] The first metal conductor 1121 and the second metal conductor 1122 can be made to conduct in the following manner.

[0164] A first via 1111 is provided on the second metal conductor 1122 and the substrate 111; a conductive agent 1112 is filled in the first via 1111 to make the first metal conductor 1121 and the second metal conductor 1122 conduct.

[0165] Therefore, by simply opening a first via 1111 on the second metal conductor 1122 and the substrate 111, the first metal conductor 1121 and the second metal conductor 1122 can be electrically connected by the conductive agent 1112. Compared to related technologies that require opening vias in both conductors and the substrate between the conductors, and depositing a conductive layer on the inner wall of the via to connect the conductors on both sides, the above method is less expensive and more reliable in connecting the first metal conductor 1121 and the second metal conductor 1122 by filling with the conductive agent 1112.

[0166] When the support body 120 includes the second support body 122, before the first via 1111 is provided on the second metal conductor 1122 and the substrate 111, the support body 120 also includes a second via 1221 that is aligned with the first via 1111, and the diameter of the second via 1221 is larger than the diameter of the first via 1111.

[0167] Since the second support 122 covers the second metal conductor 1122, a second via 1221 needs to be formed on the second support 122. By making the diameter of the second via 1221 larger than that of the first via 1111, more conductive agent 1112 can be filled in the second via 1221, further improving the conductivity of the first metal conductor 1121 and the second metal conductor 1122. Because the diameter of the second via 1221 is larger than that of the first via 1111, the second via 1221 needs to be formed before the first via 1111.

[0168] When the support body 120 includes a second support body 122, the provision of a first via 1111 on the second metal conductor 1122 and the substrate 111 also includes: the provision of a second via 1221 on the second support body 122 aligned with the first via 1111, wherein the diameter of the second via 1221 is equal to the diameter of the first via 1111.

[0169] Since the diameter of the second via 1221 is equal to the diameter of the first via 1111, the opening of the second via 1221 and the opening of the first via 1111 can be completed in the same process step, making the fabrication process of the electronic module 100 relatively simple.

[0170] The provision of a second through hole 1221 aligned with the first through hole 1111 on the second support body 122 also includes: the provision of a third through hole 1222 on the second support body 122 to allow the second metal conductor 1122 to communicate with an external conductive element.

[0171] A third via 1222 is provided on the second support 122 to expose part of the second metal conductor 1122, so that the second metal conductor 1122 can communicate with an external conductive element. By providing both the third via 1222 and the second via 1221 on the second support 122, the third via 1221 can be formed at the same time as the second via 1221, thereby further simplifying the fabrication process of the electronic module 100.

[0172] After hot-pressing the semi-cured coil module 110' and the semi-cured support 120', an isolation layer 130 is provided on the side of the substrate 111 away from the first support 121, thereby avoiding the high temperature process of hot pressing from affecting the magnetic resistance of the isolation layer 130.

[0173] After the semi-cured coil module 110' and the semi-cured support 120' are heat-pressed together, a decorative layer 140 is provided on the side of the first support 121 opposite to the substrate 111, thereby avoiding the impact of heat pressing on the appearance of the decorative layer 140.

[0174] It should be noted that you can set the isolation layer 130 first and then set the decorative layer 140, or you can set the decorative layer 140 first and then set the isolation layer 130.

[0175] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0176] In the description of this application, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, display structure, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are expressly listed, but may include other steps or units that are not expressly listed or that are inherent to such process, method, product, or device.

[0177] The term "and / or" used in this application is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0178] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection via an intermediate medium, or the internal connection or interaction between two components. Those skilled in the art can understand the specific meaning of these terms in the embodiments of this application based on the specific circumstances.

[0179] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. A method for preparing an electronic module, characterized in that, include: A semi-cured coil module and a semi-cured support body are formed, the semi-cured coil module comprising a semi-cured substrate and a metal conductor stacked together; The semi-cured coil module and the semi-cured support are stacked together. The semi-cured coil module and the semi-cured support are thermally pressed together to cure the semi-cured substrate and the semi-cured support to form a substrate and a support, and the metal conductor portion is embedded in the substrate and / or the support.

2. The method for preparing an electronic module according to claim 1, characterized in that, The step of stacking the semi-cured coil module and the semi-cured support includes: A first semi-cured support is provided on one side of the semi-cured coil module; The first semi-cured support solidifies to form the first support.

3. The method for preparing the electronic module according to claim 2, characterized in that, The step of stacking the semi-cured coil module and the semi-cured support includes: A second semi-cured support is provided on the other side of the semi-cured coil module; The second semi-cured support solidifies to form the second support.

4. The method for preparing the electronic module according to claim 2 or 3, characterized in that, The formation of the semi-cured coil module includes: The metal conductor is disposed on one side of the semi-cured substrate.

5. The method for preparing an electronic module according to claim 4, characterized in that, The step of stacking the semi-cured coil module and the semi-cured support includes: The metal conductor is positioned away from the first semi-cured support.

6. The method for preparing the electronic module according to claim 2 or 3, characterized in that, The formation of the semi-cured coil module includes: A first metal conductor and a second metal conductor are provided on both sides of the semi-cured substrate.

7. The method for preparing an electronic module according to claim 6, characterized in that, The step of stacking the semi-cured coil module and the semi-cured support includes: When the semi-cured support includes a first semi-cured support, the first metal conductor faces the first semi-cured support, and the second metal conductor is away from the first semi-cured support. Alternatively, when the semi-cured support includes a first semi-cured support and a second semi-cured support, the first metal conductor faces the first semi-cured support, and the second metal conductor faces the second semi-cured support.

8. The method for preparing an electronic module according to claim 7, characterized in that, After the semi-cured coil module and the semi-cured support are heat-pressed together, the process includes: This makes the first metal conductor and the second metal conductor conductive.

9. The method for preparing an electronic module according to claim 8, characterized in that, Making the first metal conductor and the second metal conductor conductive includes: A first via is provided on the second metal conductor and the substrate; A conductive agent is filled into the first via to make the first metal conductor and the second metal conductor conductive.

10. The method for preparing an electronic module according to claim 9, characterized in that, When the support body includes a second support body, before the first via is formed on the second metal conductor and the substrate, it further includes, A second through hole is provided on the second support body, which is aligned with the first through hole, and the diameter of the second through hole is larger than the diameter of the first through hole.

11. The method for preparing an electronic module according to claim 9, characterized in that, When the support body includes a second support body, providing a first via on the second metal conductor and the substrate simultaneously includes: A second through hole is provided on the second support body, which is aligned with the first through hole, and the diameter of the second through hole is equal to the diameter of the first through hole.

12. The method for preparing an electronic module according to claim 11, characterized in that, The second support body is provided with a second through hole aligned with the first through hole, which also includes: A third through hole is provided on the second support body to allow the second metal conductor to communicate with the external conductive element.

13. The method for preparing the electronic module according to claim 2 or 3, characterized in that, After the semi-cured coil module and the semi-cured support are heat-pressed together, the following is included: An isolation layer is provided on the side of the substrate away from the first support.

14. The method for preparing the electronic module according to claim 2 or 3, characterized in that, After the semi-cured coil module and the semi-cured support are heat-pressed together, the following is included: A decorative layer is provided on the side of the first support that is away from the base.

15. An electronic module, characterized in that, The device includes a coil module and a support. The coil module includes a base and a metal conductor. The coil module and the support are pressed together when the base and the support are in a semi-cured state. The metal conductor is partially embedded in the base and the support and / or the support.

16. The electronic module according to claim 15, characterized in that, The support includes a first support, which is located on one side of the coil module.

17. The electronic module according to claim 16, characterized in that, The support also includes a second support, which is located on the other side of the coil module.

18. The electronic module according to claim 16 or 17, characterized in that, The metal conductor is disposed away from the first support, and the metal conductor is partially embedded in the substrate.

19. The electronic module according to claim 16 or 17, characterized in that, The metal conductor includes a first metal conductor and a second metal conductor, which are located on opposite sides of the substrate and are electrically connected.

20. The electronic module according to claim 19, characterized in that, When the electronic module includes a first support, the first metal conductor faces the first support, the first metal conductor is partially embedded in the substrate and partially embedded in the first support, and the second metal conductor faces away from the first support, the second metal conductor is partially embedded in the substrate; Alternatively, when the electronic module includes a first support and a second support, the first metal conductor faces the first support, and the first metal conductor is partially embedded in the substrate and partially embedded in the first support; The second metal conductor faces the second support, and the second metal conductor is partially embedded in the substrate and partially embedded in the second support.

21. The electronic module according to claim 20, characterized in that, A first via is formed in the second metal conductor and the substrate, and the first via is filled with a conductive agent to make the first metal conductor and the second metal conductor conductive.

22. The electronic module according to claim 21, characterized in that, The second support body has a second through hole, which communicates with the first through hole, and both the second through hole and the first through hole are filled with the conductive agent.

23. The electronic module according to claim 22, characterized in that, The diameter of the second via is greater than the diameter of the first via, or the diameter of the second via is equal to the diameter of the first via.

24. The electronic module according to claim 23, characterized in that, The second support is provided with a third through hole so that the second metal conductor can communicate with the conductive element.

25. The electronic module according to claim 16 or 17, characterized in that, It also includes an isolation layer disposed on the side of the coil module opposite to the first support.

26. The electronic module according to claim 16 or 17, characterized in that, It also includes a decorative layer, which is disposed on the side of the first support that is away from the coil module.

27. The electronic module according to any one of claims 15 to 16, characterized in that, The coil module is an antenna module or a wireless charging module, and the support is the housing of the electronic device.

28. An electronic device, characterized in that, This includes electronic modules prepared by the method of preparing electronic modules as described in any one of claims 1 to 14, or electronic modules as described in any one of claims 15 to 27.

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