Package structure and forming method thereof, electronic device

Abstract

A packaging structure and a forming method thereof and an electronic device, the packaging structure comprising a transceiving module on a substrate, the transceiving module comprising a two-dimensional matrix cross-arranged receiving chip and a transmitting chip, forming a staggered arrangement of a surface array type transceiving interface, so that the packaging structure breaks the limitation of a one-dimensional linear arrangement of a traditional transceiving module, can integrate two-dimensional surface array type light beam transmission and signal reception on the substrate, realizes high-density transceiving channels, and is favorable for improving data acquisition density and spatial resolution in a unit area; in addition, a light-transmitting protection assembly covering the transceiving module is formed on the substrate, the light-transmitting protection assembly can transmit transmitting light emitted by the transmitting chip and reflected light for receiving by the receiving chip, so that the light-transmitting protection assembly makes the packaging structure have higher photoelectric signal transmission and detection performance while having higher reliability.

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