Wafer automatic unloading device

Abstract

The present application relates to wafer production technical field, disclose a kind of wafer automatic discharging device, including rack, transmission mechanism and separation mechanism;Multiple transmission mechanisms are parallelly distributed on rack;Transmission mechanism is connected with heating mechanism;Heating mechanism is connected with placing table;Separation mechanism includes moving assembly, suction cup assembly and line scraping component;Moving assembly is located above the end of transmission mechanism, moving assembly is connected with mounting seat;Suction cup assembly and line scraping component are located on mounting seat.When wafer is transported to the first end of transmission mechanism with placing table, and placed on heating mechanism, heating mechanism is heated to the placing table, then the heated placing table is transmitted to its end by transmission mechanism, then the suction cup assembly and line scraping component are moved to the wafer above by moving assembly, at this time, suction cup assembly is first moved down and wafer top surface is adsorbed, then the separation line of line scraping component is cut into the contact surface of wafer bottom surface and placing table, to realize the separation of both.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing technology, and in particular to an automatic wafer feeding device. Background Technology

[0002] In the semiconductor manufacturing field, wafers, as the fundamental material for integrated circuit manufacturing, have extremely high requirements for precision and quality in their production and processing. After completing the front-end processes, wafers typically need to undergo grinding and thinning to obtain the required thickness and flatness, thereby meeting the needs of subsequent chip manufacturing processes.

[0003] Currently, in most wafer grinding processes, the wafer is fixed to a ceramic disk by attaching it with wax. The ceramic disk is then placed in grinding equipment, which grinds and thins the wafer surface. Specifically, the adhesiveness of the wax allows the wafer to adhere tightly to the ceramic disk, preventing displacement or damage during the rotating grinding process, thus ensuring that the quality of the ground wafer meets the process standards.

[0004] However, after the grinding process, to remove the wafer from the ceramic disk, the disk is typically heated to soften the wax, and then a suction cup or scraper is used to separate the ground wafer from the disk. However, the thinned wafer is quite thin, ranging from 0.08 to 0.11 mm, and the wax adheres tightly to the ceramic disk, making it impossible to remove using conventional methods. Even with a 120°C heated ceramic disk and suction cup, verification showed that even a vacuum of -90 kMA could not remove the wafer. Currently, a method of heating the ceramic disk to 120°C and manually peeling it off from the side with a 0.02 mm thin sheet is used. However, this manual operation is unstable and uneven in force, leading to wafer breakage, increased defect rate, and reduced wafer production quality.

[0005] Therefore, a new technical solution needs to be researched to address the above problems. Summary of the Invention

[0006] In view of this, the present invention addresses the deficiencies of the prior art, and its main objective is to provide an automatic wafer feeding device.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] An automated wafer unloading device includes a frame, a transport mechanism, and a separation mechanism. Multiple sets of the transport mechanisms are arranged side-by-side on the frame. A heating mechanism is slidably connected to each transport mechanism. A placement stage for wafer fixation is detachably connected to each heating mechanism. The separation mechanism includes a moving component, a suction cup component, and a wire scraper component. The moving component spans across and is positioned above the end of the transport mechanism. A mounting base is connected to the moving component, and the moving component is used to adjust the spatial position of the mounting base. The suction cup component and the wire scraper component are mounted on the mounting base. The suction cup component is used to adsorb the top surface of the wafer, and the wire scraper component is used to separate the bottom surface of the wafer from the contact surface on the placement stage.

[0009] As further explained, the wire scraper assembly includes a first rotary motor, a rotary shaft, and a fan-shaped connecting plate; the first rotary motor is located at the top of the mounting base, and the suction cup assembly is located on the side of the first rotary motor away from the moving assembly; the rotary shaft is rotatably connected to the mounting base and connected to the output end of the first rotary motor, and the axis of the rotary shaft is parallel to the axis of the suction cup assembly; the fan-shaped connecting plate is located at the end of the rotary shaft away from the first rotary motor; a first pull post and a second pull post are arranged front and rear on the central symmetrical axis of the fan-shaped connecting plate, and an arc-shaped groove for the suction cup assembly to move is provided on the fan-shaped connecting plate, the arc-shaped groove being located between the first pull post and the second pull post; a separation line connects the first pull post and the second pull post.

[0010] As further explained, a locking element for fixing the position of the second pull post is provided between the second pull post and the fan-shaped connecting plate; a connecting cap for connecting the disconnect line is connected to one end of the second pull post, and the connecting cap is movably connected to the second pull post; an outer edge is provided on the end of the second pull post near the connecting cap, and a spring is provided between the outer edge and the connecting cap, which is sleeved between the second pull post and the connecting cap.

[0011] As further explained, the separating line is a metal wire or carbon fiber wire, and the diameter of the separating line is 0.01-0.02 mm.

[0012] As further explained, the placement platform is provided with multiple sets of upwardly protruding support parts; between the multiple sets of support parts are guide blocks for guiding the wire scraping assembly; the top surface of the guide block is provided with a downwardly recessed arc groove.

[0013] As further explained, the suction cup assembly includes a lifting cylinder and a suction cup; the lifting cylinder is located on one side of the mounting base; the output end of the lifting cylinder is connected to the suction cup, and the suction cup is vertically arranged and connected to an external negative pressure device.

[0014] As further explained, the moving component includes a horizontal moving module and a lifting module; the horizontal moving module spans across the end of the transmission mechanism via a bracket; the lifting module is movably connected to the horizontal moving module and is connected to the mounting base.

[0015] As further explained, the heating mechanism includes a sliding plate, a rotating platform, and a heating plate; the sliding plate is slidably connected to the transmission mechanism; the rotating platform is rotatably connected to the sliding plate, and a second rotating motor is provided between the rotating platform and the sliding plate; the heating plate is disposed on the rotating platform, and a heat insulation plate is provided between the heating plate and the rotating platform.

[0016] As further explained, the heat insulation plate is provided with multiple sets of upwardly extending limiting posts, which pass through the heating plate and extend outward from the top surface of the heating plate; an installation cavity for limiting and fixing the placement platform is formed between the inner sides of the multiple sets of limiting posts, and the placement platform can be put into or taken out of the installation cavity.

[0017] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0018] 1. By setting up a heating mechanism and a separation mechanism, when the polished wafer is transported to the beginning of the transfer mechanism along with the placement stage and placed on the heating mechanism, the placement stage is heated by the heating mechanism, which gradually softens the wax used to fix the placement stage and the wafer. Then, the heated placement stage is transferred to its end by the transfer mechanism. Subsequently, the suction cup assembly and the wire scraper assembly are moved to the wafer to be separated by the moving assembly. At this time, the suction cup assembly first moves down and uses appropriate suction force to adsorb the top surface of the wafer. Then, the separation line of the wire scraper assembly cuts into the contact surface between the bottom surface of the wafer and the placement stage to achieve separation between the two. This avoids the damage to the wafer caused by traditional separation methods and improves the production quality of the wafer.

[0019] 2. By using metal or carbon fiber wires for the separation line, with a diameter controlled between 0.01 and 0.02 mm, this fine yet high-strength separation line generates sufficient separation force when cutting into the contact surface between the wafer's bottom surface and the placement stage. This also avoids the risk of wafer damage caused by thicker wires forcibly cutting into the wafer's bottom surface and placement stage, effectively reducing the risk of thin wafer damage. Furthermore, the metal or carbon fiber wires possess excellent flexibility and wear resistance, maintaining stable performance during repeated use, ensuring the reliability and consistency of the separation operation, and further guaranteeing wafer quality and the smooth progress of subsequent processing steps. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of an automatic wafer unloading device provided by the present invention;

[0022] Figure 2 A schematic diagram of the overall structure of the separation mechanism provided by the present invention;

[0023] Figure 3 A schematic diagram of the internal structure of the separation mechanism provided by the present invention;

[0024] Figure 4 A schematic diagram of the overall structure of the heating mechanism provided by the present invention;

[0025] Figure 5 This is a schematic diagram of the overall structure of the support portion provided by the present invention.

[0026] The following are the labeling elements in the figure:

[0027] 10. Frame; 11. Transmission mechanism; 12. Placement platform; 121. Bearing unit; 122. Guide block; 123. Arc groove;

[0028] 20. Heating mechanism; 21. Sliding plate; 22. Rotary table; 23. Heating plate; 24. Second rotary motor; 25. Heat insulation plate; 26. Limiting post;

[0029] 30. Moving component; 31. Mounting base; 32. Horizontal moving module; 33. Lifting module;

[0030] 40. Suction cup assembly; 41. Lifting cylinder; 42. Suction cup;

[0031] 50. Wire scraper assembly; 51. First rotary motor; 52. Rotating shaft; 53. Fan-shaped connecting plate; 54. First pull wire post; 55. Second pull wire post; 551. Connecting cap; 552. Outer edge; 56. Arc groove; 57. Separation line. Detailed Implementation

[0032] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0033] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0034] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0036] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0037] In one embodiment of the present invention, such as Figure 1-5 As shown, an automated wafer unloading device is provided, including a frame 10 (not shown), a transport mechanism 11, and a separation mechanism. Multiple sets of transport mechanisms 11 are arranged side-by-side on the frame 10. A heating mechanism 20 is slidably connected to the transport mechanism 11. A placement stage 12 for wafer fixation is detachably connected to the heating mechanism 20. The separation mechanism includes a moving component 30, a suction cup assembly 40, and a wire scraper assembly 50. The moving component 30 is positioned across the top of the end of the transport mechanism 11, and a mounting base 31 is connected to the moving component 30. The moving component 30 is used to adjust the spatial position of the mounting base 31. The suction cup assembly 40 and the wire scraper assembly 50 are mounted on the mounting base 31. The suction cup assembly 40 is used to adsorb the top surface of the wafer, and the wire scraper assembly 50 is used to separate the bottom surface of the wafer from the contact surface on the placement stage 12.

[0038] like Figure 1 As shown, in this embodiment, the transmission mechanism 11 is configured as two sets, and the two sets of transmission mechanisms 11 are arranged side by side below the separation mechanism to form a separation dual station, which improves the separation efficiency of the wafer, reduces the standby time of the separation operation, and thus improves the production efficiency of the wafer.

[0039] In other embodiments, the number of transmission mechanisms 11 can be set to multiple groups, such as three groups, four groups, etc. The specific number can be determined according to the actual production situation, as long as it can meet the production needs.

[0040] By setting up a heating mechanism 20 and a separation mechanism, when the polished wafer is transported to the beginning of the transfer mechanism 11 along with the placement stage 12 and placed on the heating mechanism 20, the placement stage 12 is heated by the heating mechanism 20, so that the wax used to fix the placement stage 12 and the wafer gradually softens. Then, the heated placement stage 12 is transferred to its end by the transfer mechanism 11. Subsequently, the suction cup assembly 40 and the wire scraper assembly 50 are moved to the wafer to be separated by the moving assembly 30. At this time, the suction cup assembly 40 first moves down and uses appropriate suction force to adsorb the top surface of the wafer. Then, the separation line 57 of the wire scraper assembly 50 cuts into the contact surface between the bottom surface of the wafer and the placement stage 12 to achieve separation of the two. This avoids the damage to the wafer caused by the traditional separation method and improves the production quality of the wafer.

[0041] Preferably, such as Figure 2-3 As shown, the wire scraper assembly 50 includes a first rotary motor 51, a rotary shaft 52, and a fan-shaped connecting plate 53. The first rotary motor 51 is located at the top of the mounting base 31, and the suction cup assembly 40 is located on the side of the first rotary motor 51 away from the moving assembly 30. The rotary shaft 52 is rotatably connected to the mounting base 31 and connected to the output end of the first rotary motor 51, and the axis of the rotary shaft 52 is parallel to the axis of the suction cup assembly 40. The fan-shaped connecting plate 53 is located at the end of the rotary shaft 52 away from the first rotary motor 51. A first pull post 54 and a second pull post 55 are arranged front and rear on the central axis of symmetry of the fan-shaped connecting plate 53, and an arc-shaped groove 56 for the suction cup assembly 40 to move is provided on the fan-shaped connecting plate 53. The arc-shaped groove 56 is located between the first pull post 54 and the second pull post 55. A separation line 57 connects the first pull post 54 and the second pull post 55.

[0042] During wafer unloading, the moving component 30 moves the suction cup component 40 and the wire scraper component 50 above the wafer to be separated and moves them downwards. At this time, the separation line 57 is located on the outside of the wafer and abuts against the placement stage 12. The suction cup component 40 uses appropriate suction force to adhere the top surface of the wafer. Then, the first rotary motor 51 is activated, which drives the fan-shaped connecting plate 53 to swing around the rotation axis 52, so that the separation line 57 cuts into the contact surface between the bottom surface of the wafer and the placement stage 12, realizing the separation of the two. This avoids the damage to the wafer caused by traditional separation methods and improves the wafer production quality. At the same time, by setting the arc groove 56, interference between the suction cup component 40 and the movement of the fan-shaped connecting plate 53 is avoided, ensuring the smooth coordination of all components of the separation mechanism.

[0043] Furthermore, a locking element (not shown) for fixing the position of the second pull post 55 is provided between the second pull post 55 and the sector-shaped connecting plate 53. The sector-shaped connecting plate 53 has two sets of opposing clamping blocks corresponding to the second pull post 55, with a gap between the two sets of clamping blocks. One end of the locking element passes through one set of clamping blocks and is threadedly connected to the other set of clamping blocks to fix the position of the second pull post 55 on the sector-shaped connecting plate 53. A connecting cap 551 for connecting the separating line 57 is connected to one end of the second pull post 55, and the connecting cap 551 is movably connected to the second pull post 55. An outer edge 552 is provided on the end of the second pull post 55 near the connecting cap 551, and a spring (not shown) is provided between the outer edge 552 and the connecting cap 551, sleeved between the second pull post 55 and the connecting cap 551. The movable connection design of the spring and the connecting cap 551 allows for adjustment of the tension of the separation line 57, ensuring that the separation line 57 located between the first pull post 54 and the second pull post 55 remains taut at all times. This prevents the separation line 57 from becoming loose due to improper tension, which could damage the thin wafer and improve the quality of thin wafer separation.

[0044] Furthermore, the separation line 57 is made of metal wire or carbon fiber, with a diameter of 0.01-0.02 mm. By selecting metal wire or carbon fiber for the separation line 57 and controlling its diameter to 0.01-0.02 mm, this fine yet high-strength separation line 57 can generate sufficient separation force when cutting into the contact surface between the wafer's bottom surface and the placement stage 12. This also avoids the risk of wafer damage caused by a thicker wire forcibly cutting into the contact surface, effectively reducing the risk of thin wafer damage. Moreover, the metal wire or carbon fiber wire has good flexibility and wear resistance, maintaining stable performance during repeated use, ensuring the reliability and consistency of the separation operation, further guaranteeing wafer quality and the smooth progress of subsequent processing.

[0045] In this embodiment, the metal wires are made of materials such as tungsten wire, high-carbon steel, and nickel-titanium. The tensile strengths of the tungsten wire, high-carbon steel, and nickel-titanium wires should be 2800-3000 MPa, 2000-2200 MPa, and 1500-1800 MPa, respectively, while the tensile strength of the carbon fiber wire is 6300-8000 MPa. Different materials of metal wire or carbon fiber wire have their own characteristics; for example, tungsten wire has high strength, high-carbon steel has good wear resistance, and nickel-titanium has shape memory properties. Combined with a fine diameter of 0.01-0.02 mm, for thin wafers, sufficient separation force can be ensured while minimizing damage to the wafer, reducing the risk of thin wafer damage, and improving production quality.

[0046] Furthermore, such as Figure 4-5As shown, the placement stage 12 is provided with multiple sets of upwardly protruding support portions 121. Guide blocks 122 are provided between the multiple sets of support portions 121 to guide the wire scraper assembly 50. The top surface of the guide block 122 is provided with a downwardly recessed arc groove 123. By providing the support portions 121, stable support can be provided for the thin wafers, and multiple sets of wafers can be formed into multiple individual modules on the placement stage 12. Simultaneously, by providing the guide blocks 122 and the arc groove 123, the separation line 57 of the wire scraper assembly 50 can be guided to accurately cut into the contact surface between the bottom surface of the wafer and the placement stage 12, avoiding damage to the thin wafers due to operational deviations, and improving the accuracy and safety of thin wafer separation.

[0047] Preferably, such as Figure 2-3 As shown, the suction cup assembly 40 includes a lifting cylinder 41 and a suction cup 42. The lifting cylinder 41 is located on one side of the mounting base 31. The output end of the lifting cylinder 41 is connected to the suction cup 42, which is vertically positioned and connected to an external negative pressure device. The suction force of the suction cup 42 should be maintained within the range of -60 kPa to -90 kPa to avoid excessively low or high suction force, ensuring that the suction cup 42 can properly adsorb the separated wafer. The suction cup 42 uses conventional vacuum adsorption technology, which will not be described in detail here. The lifting cylinder 41 can precisely control the lifting of the suction cup 42, allowing the suction cup 42 to accurately adsorb onto the top surface of the wafer. Combined with the external negative pressure device, the suction force of the suction cup 42 can be adjusted according to the actual situation of the thin wafer, avoiding the problem of insufficient suction force leading to failure to grip or excessive suction force causing the thin wafer to break, thus improving the stability and safety of thin wafer gripping.

[0048] Preferably, such as Figure 1 As shown, the moving component 30 includes a horizontal moving module 32 and a lifting module 33. The horizontal moving module 32 spans across the end of the transmission mechanism 11 via a bracket. The lifting module 33 is movably connected to the horizontal moving module 32 and is connected to the mounting base 31. In this embodiment, both the horizontal moving module 32 and the lifting module 33 are motor-driven lead screw structures, which will not be described in detail here. The horizontal moving module 32 and the lifting module 33 enable precise movement of the mounting base 31 in the horizontal and vertical directions, thereby accurately moving the suction cup assembly 40 and the wire scraper assembly 50 above the thin wafer to be separated, ensuring the accuracy of the separation operation and avoiding damage to the thin wafer due to inaccurate positioning.

[0049] Preferably, such as Figure 4As shown, the heating mechanism 20 includes a sliding plate 21, a rotating stage 22, and a heating plate 23. The sliding plate 21 is slidably connected to the transmission mechanism 11. The rotating stage 22 is rotatably connected to the sliding plate 21, and a second rotary motor 24 is provided between the rotating stage 22 and the sliding plate 21. The heating plate 23 is disposed on the rotating stage 22, and a heat insulation plate 25 is provided between the heating plate 23 and the rotating stage 22. The placement stage 12 is a ceramic disc, and the heating plate 23 is a conventional heating plate 23 with built-in heating wires, which will not be described in detail here. In this embodiment, the second rotary motor 24 is fixed to the center of the sliding plate 21 by a bracket, and the rotating stage 22 is rotatably connected to the sliding plate 21 and connected to the output end of the second rotary motor 24. The rotating stage 22 is driven to rotate by the second rotary motor 24 to realize the position transfer between the groups of wafers on the placement stage 12.

[0050] When the wafer-grinding stage 12 is transferred to the heating plate 23, the heating plate 23 heats the stage 12, causing the wax used to fix the stage 12 and the wafer to gradually soften. Then, it is transferred on the transfer mechanism 11 via the sliding plate 21, and the heated stage 12 is transferred to its end. At the same time, by setting up a rotating stage 22 and a second rotating motor 24, when a group of wafers is unloaded, the second rotating motor 24 drives the rotating stage 22 to rotate, so that the next group of wafers to be separated can be moved to the bottom of the separation component, so that all wafers can be better separated in the future, thus improving the wafer separation efficiency.

[0051] Furthermore, the heat insulation plate 25 is provided with multiple sets of upwardly extending limiting posts 26, which pass through the heating plate 23 and extend outward from the top surface of the heating plate 23. A mounting cavity for limiting and fixing the placement stage 12 is formed between the inner sides of the multiple sets of limiting posts 26, allowing the placement stage 12 to be placed into or removed from the mounting cavity. The mounting cavity formed by the limiting posts 26 can limit and fix the placement stage 12, ensuring that the placement stage 12 can be stably fixed on the heating plate 23, thus guaranteeing the stability of the thin wafer during heating.

[0052] The above are merely preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention, as well as other specific embodiments of the present invention that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present invention.

Claims

1. An automatic wafer unloading device, characterized in that, include: frame; A transmission mechanism, wherein multiple sets of the transmission mechanisms are arranged side by side on the frame; A heating mechanism is slidably connected to the transmission mechanism; a placement stage for wafer fixation is detachably connected to the heating mechanism. The separation mechanism includes a moving component, a suction cup component, and a wire scraper component. The moving component is positioned across the upper end of the transmission mechanism and has a mounting base connected to it. The moving component is used to adjust the spatial position of the mounting base. The suction cup component and the wire scraper component are mounted on the mounting base. The suction cup component is used to adsorb the top surface of the wafer, and the wire scraper component is used to separate the bottom surface of the wafer from the contact surface on the placement stage.

2. The automatic wafer unloading device according to claim 1, characterized in that, The wire scraper assembly includes a first rotary motor, a rotary shaft, and a fan-shaped connecting plate. The first rotary motor is located at the top of the mounting base, and the suction cup assembly is located on the side of the first rotary motor away from the moving assembly. The rotary shaft is rotatably connected to the mounting base and connected to the output end of the first rotary motor, and the axis of the rotary shaft is parallel to the axis of the suction cup assembly. The fan-shaped connecting plate is located at the end of the rotary shaft away from the first rotary motor. A first pull post and a second pull post are distributed front to back on the central axis of symmetry of the fan-shaped connecting plate, and an arc-shaped groove for the suction cup assembly to move is provided on the fan-shaped connecting plate. The arc-shaped groove is located between the first pull post and the second pull post. A separation line connects the first pull post and the second pull post.

3. The automatic wafer unloading device according to claim 2, characterized in that, A locking element for fixing the position of the second pull post is provided between the second pull post and the fan-shaped connecting plate; a connecting cap for connecting the disconnect line is connected to one end of the second pull post, and the connecting cap is movably connected to the second pull post; an outer edge is provided on the end of the second pull post near the connecting cap, and a spring is provided between the outer edge and the connecting cap, which is sleeved between the second pull post and the connecting cap.

4. The automatic wafer unloading device according to claim 3, characterized in that, The separating line is a metal wire or carbon fiber wire, and the diameter of the separating line is 0.01-0.02 mm.

5. The automatic wafer unloading device according to any one of claims 2-4, characterized in that, The placement platform is provided with multiple sets of upwardly protruding support parts; between the multiple sets of support parts are guide blocks for guiding the wire scraping assembly; the top surface of the guide block is provided with a downwardly recessed arc groove.

6. The automatic wafer unloading device according to claim 1, characterized in that, The suction cup assembly includes a lifting cylinder and a suction cup; the lifting cylinder is located on one side of the mounting base; the output end of the lifting cylinder is connected to the suction cup, and the suction cup is vertically arranged and connected to an external negative pressure device.

7. The automatic wafer unloading device according to claim 1, characterized in that, The moving component includes a horizontal moving module and a lifting module; the horizontal moving module spans across the end of the transmission mechanism via a bracket; the lifting module is movably connected to the horizontal moving module and is connected to the mounting base.

8. The automatic wafer unloading device according to claim 1, characterized in that, The heating mechanism includes a sliding plate, a rotating platform, and a heating plate; the sliding plate is slidably connected to the transmission mechanism; the rotating platform is rotatably connected to the sliding plate, and a second rotating motor is provided between the rotating platform and the sliding plate; the heating plate is disposed on the rotating platform, and a heat insulation plate is provided between the heating plate and the rotating platform.

9. The automatic wafer unloading device according to claim 8, characterized in that, The heat insulation plate is provided with multiple sets of upwardly extending limiting posts, which pass through the heating plate and extend outward from the top surface of the heating plate; an installation cavity for limiting and fixing the placement platform is formed between the inner sides of the multiple sets of limiting posts, and the placement platform can be put into or taken out of the installation cavity.

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