Wafer carrier and wafer bonding apparatus

By designing a switching component for the wafer carrier and using negative pressure adsorption technology, the problems of contamination of the bonding surface and alignment accuracy in wafer bonding equipment were solved, achieving a highly efficient and stable wafer bonding process and improving product quality and efficiency.

CN122161408APending Publication Date: 2026-06-05天津中科晶禾电子科技有限责任公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
天津中科晶禾电子科技有限责任公司
Filing Date
2026-05-09
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Existing wafer bonding equipment has difficulty effectively reducing the contact between the bonding surface and the wafer carrier during the loading process, which leads to contamination. Furthermore, it cannot stably support the second wafer, affecting alignment accuracy and bonding quality.

Method used

A wafer carrier is designed, including a support base and a switching component arranged around it. By switching the position of the moving base, differentiated loading and alignment of a first wafer with the bonding surface facing down and a second wafer with the bonding surface facing up can be achieved. The limiting component abuts against the sidewall of the wafer to reduce contact contamination of the bonding surface, and a stable support is achieved through negative pressure adsorption.

Benefits of technology

It improves the alignment accuracy and quality stability of wafer bonding, reduces contamination on the bonding surface, enhances bonding efficiency and product yield, and meets the versatility and applicability requirements of wafer carriers.

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    Figure CN122161408A_ABST
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Abstract

The present application relates to the technical field of wafer bonding, and discloses a wafer carrier plate and a wafer bonding device. The wafer carrier plate comprises a bearing base and a plurality of switching assemblies; the bearing base is provided with a suction air channel, and the upper surface of the bearing base is provided with a suction hole communicating with the suction air channel; the plurality of switching assemblies are arranged around the bearing base; the switching assembly comprises a support seat and a limiting piece; the support seat comprises a movable seat movably arranged in the vertical direction, and the plurality of movable seats can synchronously switch between a first position and a second position; and the limiting piece is movably arranged on the upper surface of the movable seat in the horizontal direction. The wafer carrier plate can meet the requirements of feeding, aligning and bonding of the first wafer with the bonding surface downward and the second wafer with the bonding surface upward through the synchronous position switching of the movable seat in the switching assembly and the abutting limiting of the limiting piece, can satisfy the differentiated feeding of the wafer, reduce the pollution of the bonding surface, improve the versatility and applicability of use, and can ensure the quality of the bonding process.
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