Spaceborne storage module packaging method, spaceborne storage module and satellite

Abstract

The application discloses a kind of spaceborne storage module packaging method, spaceborne storage module and satellite, the method includes obtaining the model of packaging circuit module;Thermal simulation experiment is carried out based on the model of packaging circuit module, and heat flux density distribution information is obtained;Target cooling area is determined based on heat flux density distribution information;Packaging circuit module is installed on substrate;First shielding layer is manufactured using metal material of first density;The model of second shielding layer is obtained;Micro-channel heat dissipation area is determined based on target cooling area;Second shielding layer is manufactured based on the model of second shielding layer using metal material of second density;Third shielding layer formed by coating material is prepared on the inner surface of second shielding layer, to obtain composite shielding shell;Composite shielding shell is fixedly installed on substrate through insulating adhesive layer and contains packaging circuit module, to obtain spaceborne storage module.The application makes that composite shielding shell has anti-radiation effect and heat conduction effect simultaneously, which greatly improves the heat conduction efficiency.

Description

Technical Field

[0001] This invention relates to the field of storage technology, specifically to a method for packaging a spaceborne storage module, a spaceborne storage module, and a satellite. Background Technology

[0002] The onboard storage module is a core data storage component of a satellite, primarily used to store mission commands, payload observation data, onboard AI edge computing results, and inter-satellite routing cache information during the spacecraft's on-orbit operation. The onboard storage module must withstand high-energy particle radiation such as cosmic rays and solar storms. Damage to the onboard storage module could lead to significant losses, including the loss of critical data and mission interruptions. With the accelerated deployment of low-Earth orbit satellite constellations and the substantial increase in single-satellite computing power, the thermal load on the onboard storage module has also surged, placing higher demands on the combined effectiveness of its radiation protection and heat dissipation.

[0003] In existing technologies, to address the issue of easily damaged spaceborne storage modules in the high-radiation environment of space, a common approach is to install a radiation shielding layer (i.e., a radiation shielding shell) on the outside of the spaceborne storage module. These radiation shielding layers are often made of high-density metal materials with high atomic numbers, such as tantalum and lead. By utilizing their excellent radiation blocking ability, the ionizing radiation dose received by the storage chip is reduced, thus avoiding problems such as memory cell logic flipping and chip damage caused by single-event effects.

[0004] However, while radiation shielding layers achieve good radiation protection, they have poor thermal conductivity, and to ensure sufficient shielding effectiveness, they typically need to be quite thick, which hinders heat dissipation from the spaceborne storage module. Furthermore, the lack of air convection in the vacuum environment of space further impedes heat dissipation from the spaceborne storage module. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this application provides a method for packaging a spaceborne storage module, a spaceborne storage module, and a satellite. By using a second-density metal material to manufacture a second shielding layer based on a model of the second shielding layer, including a microfluidic heat dissipation area, the composite shielding shell simultaneously possesses radiation protection and thermal conductivity effects. While ensuring effective shielding against high-energy electrons, protons, and other radiating particles, it significantly improves thermal conductivity efficiency.

[0006] To address the above problems, the present invention provides the following technical solution: In a first aspect, embodiments of this application provide a method for packaging a spaceborne storage module, comprising: obtaining a model of the packaged circuit module; Thermal simulation experiments were conducted based on the model of the packaged circuit module to obtain the heat flux density distribution information of the packaged circuit module. The target cooling area is determined based on the heat flux density distribution information; The packaged circuit module is mounted on the substrate; A first shielding layer is manufactured using a metal material of a first density, and the dimensions of the first shielding layer are matched to the packaged circuit module; Obtain the model of the second shielding layer; Based on the target cooling area, a microchannel heat dissipation area is determined on the model of the second shielding layer. The microchannel heat dissipation area includes a first microchannel heat dissipation area and a second microchannel heat dissipation area. The first microchannel heat dissipation area is used to introduce liquid alloy, and the second microchannel heat dissipation area is used to introduce liquid nitrogen. A second shielding layer including the microchannel heat dissipation region is manufactured based on a model of the second shielding layer using a metal material of the second density. The second shielding layer covers the inner surface of the first shielding layer. The microchannel heat dissipation region includes microchannels. The second density is less than the first density. A third shielding layer, formed by a coating material, is prepared on the inner surface of the second shielding layer to obtain a composite shielding shell. The composite shielding shell is fixedly mounted on the substrate through an insulating adhesive layer and houses the encapsulated circuit module to obtain the spaceborne storage module.

[0007] Optionally, the thermal simulation experiment based on the model of the packaged circuit module to obtain the heat flux density distribution information of the packaged circuit module includes: Based on the model of the packaged circuit module, determine the model and coordinates of multiple electronic components in the model; Based on the model numbers of the multiple electronic components, multiple functional areas are determined, including a storage core area, a control and interface area, and a power management area. The sensitive parameter matrix and power consumption matrix of each electronic component are determined based on the model number of each electronic component and a preset electronic component database; The sensitivity parameter matrix and power consumption matrix of each functional area are determined based on the sensitivity parameter matrix and power consumption matrix of all the electronic components. Thermal simulation experiments were conducted based on the model of the packaged circuit module, the sensitive parameter matrix of each functional area, and the power consumption matrix to obtain the heat flux density distribution information of the packaged circuit module.

[0008] Optionally, the thermal simulation experiment based on the model of the packaged circuit module, the sensitive parameter matrix of each functional area, and the power consumption matrix is ​​performed to obtain the heat flux density distribution information of the packaged circuit module, including: Acquire historical temperature data and historical operational data of the satellite for multiple operational periods, including periods of sunshine and periods of shadow. The heat flux data of the simulation environment are determined based on the historical temperature data; The simulation power consumption data is determined based on the historical working data. Thermal simulation experiments were conducted based on the model of the packaged circuit module, the thermal flux data of the simulation environment, the simulation power consumption data, and the sensitive parameter matrix and power consumption matrix of each functional area to obtain the thermal flux density distribution information of the packaged circuit module for each operating period.

[0009] Optionally, determining the target cooling area based on the heat flux density distribution information includes: A heat flux density distribution map is determined based on the heat flux density distribution information; The heat flux density distribution map is segmented by a threshold to identify hotspot centers where the heat flux density exceeds the heat flux density threshold; A hotspot influence domain is generated based on the hotspot center; The adjacent hotspot influence areas are merged to obtain the continuous target cooling area.

[0010] Optionally, determining the microchannel heat dissipation area on the model of the second shielding layer based on the target cooling area includes: The target cooling area of ​​the model of the packaged circuit module is projected onto the model of the second shielding layer to obtain the first area; Obtain the sensitive parameter matrix of each functional area of ​​the packaged circuit module; The radiation-sensitive area is determined based on the sensitivity parameter matrix of each functional area; The radiation-sensitive area of ​​the model of the packaged circuit module is projected onto the model of the second shielding layer to obtain the second region; The intersection of the first region and the second region is defined as the first microchannel heat dissipation region; The second microchannel heat dissipation region is defined as the region in the first region excluding the intersection region.

[0011] Optionally, the step of fixing the composite shielding shell onto the substrate using an insulating adhesive layer and accommodating the packaged circuit module to obtain the spaceborne storage module includes: The composite shielding shell is fixedly mounted on the substrate through an insulating adhesive layer and houses the packaged circuit module. The cooling device is fixedly mounted on the substrate and connected to the microfluidic liquid of the second shielding layer to obtain the spaceborne storage module.

[0012] Optionally, a magnetic switch is provided in the microchannel for opening or closing the microchannel. The second shielding layer includes a magnetic switch connection port. The composite shielding shell is fixedly mounted on the substrate through an insulating adhesive layer to accommodate the encapsulated circuit module, resulting in a spaceborne storage module, comprising: The composite shielding shell is fixedly mounted on the substrate through an insulating adhesive layer and accommodates the encapsulated circuit module. The magnetron device is fixedly mounted on the substrate and electrically connected to the magnetron switch connection port to obtain the spaceborne storage module.

[0013] Optionally, the insulating adhesive layer includes multiple adhesive regions, the multiple adhesive regions having different coefficients of thermal expansion, and the coefficients of thermal expansion of the multiple adhesive regions along the longitudinal direction of the composite shielding shell toward the substrate are successively close to the coefficient of thermal expansion of the substrate.

[0014] Secondly, embodiments of this application provide a spaceborne storage module, which is a spaceborne storage module manufactured using the spaceborne storage module packaging method described in the first aspect.

[0015] Thirdly, embodiments of this application provide a satellite, which includes the onboard storage module as described in the second aspect.

[0016] This application provides a method for packaging a spaceborne storage module, a spaceborne storage module, and a satellite. This application manufactures a second shielding layer, including a microfluidic heat dissipation area, based on a model of a second shielding layer using a metal material of second density. This allows the composite shielding shell to have both radiation protection and thermal conductivity effects, significantly improving thermal conductivity while ensuring effective shielding against high-energy electrons, protons, and other radiation particles. Attached Figure Description

[0017] Figure 1 This is a flowchart illustrating the onboard storage module packaging method provided in this application embodiment.

[0018] Figure 2 This is a cross-sectional schematic diagram of the radiation-proof spaceborne storage module of the present invention.

[0019] Figure 3 This is a block diagram showing the module connection of Embodiments 3 and 4 of the present invention.

[0020] Figure 4 This is one of the structural schematic diagrams of the microchannel of the present invention.

[0021] Figure 5 This is the second schematic diagram of the microchannel structure of the present invention. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "multiple" means two or more, unless otherwise explicitly specified.

[0024] This application provides a method for packaging a spaceborne storage module, a spaceborne storage module, and a satellite. By using a second-density metal material to manufacture a second shielding layer based on a model of the second shielding layer, including a microfluidic heat dissipation area, the composite shielding shell can simultaneously have anti-radiation and thermal conductivity effects. While ensuring effective shielding against high-energy electrons, protons, and other radiating particles, it significantly improves thermal conductivity efficiency.

[0025] This application relates to integrated circuit manufacturing and packaging technologies, specifically 3D packaging technology and multi-chip packaging technology (multi-component integration technology). The classification number of this application belongs to H01L21 or H01L23.

[0026] This application relates to the field of aerospace electronic equipment and satellite radiation hardening. It employs a composite shielding structure specifically designed for spaceborne chips (including a high-density metal first shielding layer and a nano-composite ceramic coating second shielding layer) and an intelligent thermal management method based on radiation detection and active cooling to achieve effective protection against high-energy particles in space and dynamic thermal regulation. The spaceborne chip radiation hardening method of this application is applicable to satellite manufacturing, spacecraft systems, or spaceborne electronic equipment; therefore, the classification number for this application can be H05K9 / 00 or H01L23 / 552, and the keyword is multi-chip. This application also relates to the field of emerging software and new information technology services; therefore, the classification number for this application can be G06F30. The spaceborne chip radiation hardening method of this application also relates to the fields of intelligent control and thermal management.

[0027] The packaging method for the onboard storage module provided in this application will be described in detail below with reference to the accompanying drawings.

[0028] Please see Figure 1 , Figure 1 This is a flowchart illustrating the onboard storage module packaging method provided in an embodiment of this application. Figure 1 As shown, the onboard storage module packaging method includes steps S100 to S500.

[0029] Step S100: Obtain the model of the packaged circuit module.

[0030] Optionally, the packaged circuit module includes a memory chip.

[0031] Optionally, the packaged circuit module includes multiple memory chips.

[0032] Optionally, the housing of the encapsulated circuit module is made of radiation-resistant material.

[0033] Step S200: Conduct thermal simulation experiments based on the model of the packaged circuit module to obtain the heat flux density distribution information of the packaged circuit module.

[0034] Optionally, step S200 includes steps S210 to S250.

[0035] Step S210: Determine the model and coordinates of multiple electronic components in the model based on the model of the packaged circuit module.

[0036] Step S220: Determine multiple functional areas based on the models of multiple electronic components.

[0037] The system includes multiple functional areas such as the storage core area, the control and interface area, and the power management area.

[0038] Optionally, multiple functional areas may also include other areas.

[0039] For example, the storage core area includes electronic data storage components such as NAND flash memory arrays, DRAM caches, and EEPROM configuration chips.

[0040] For example, the control and interface area includes control and communication components such as the main controller, interface, bus transceiver, and clock management chip.

[0041] For example, the power management area includes power-related components such as linear regulators, surge protection devices, filter capacitors, and power switches.

[0042] Step S230: Determine the sensitive parameter matrix and power consumption matrix of each electronic component based on the model number of each electronic component and the preset electronic component database.

[0043] Optionally, the sensitivity parameter matrix of the electronic component includes thermal sensitivity parameters and radiation sensitivity parameters.

[0044] Optionally, heat-sensitive parameters include the maximum rated junction temperature, junction-shell thermal resistance, and the length of the module with the maximum heat flux density.

[0045] Optionally, radiation-sensitive parameters include single-particle flip radiation threshold and total dose radiation tolerance threshold.

[0046] Optionally, the power consumption matrix of the electronic component includes static standby power consumption, rated operating power consumption, and peak full-load power consumption.

[0047] Step S240: Determine the sensitivity parameter matrix and power consumption matrix of each functional area based on the sensitivity parameter matrix and power consumption matrix of all electronic components.

[0048] Optionally, for each functional area, the sensitivity parameter matrix of all electronic components in the functional area is weighted and aggregated using the area proportion of each electronic component in its functional area as the weight, to obtain the sensitivity parameter matrix of the functional area.

[0049] Optionally, for each functional area, the power consumption matrix of all electronic components in the functional area is weighted and aggregated using the area ratio of each electronic component within its functional area as the weight, to obtain the power consumption matrix of the functional area.

[0050] Step S250: Based on the model of the packaged circuit module, the sensitive parameter matrix of each functional area and the power consumption matrix, perform a thermal simulation experiment to obtain the heat flux density distribution information of the packaged circuit module.

[0051] Optionally, a fully parameterized digital twin model of the packaged circuit module is constructed based on the model of the packaged circuit module, the sensitive parameter matrix of each functional area, and the power consumption matrix. A thermal simulation experiment is then conducted based on the digital twin model using finite element analysis software to obtain the heat flux density distribution information of the packaged circuit module.

[0052] Optionally, step S250 includes steps S251 to S254.

[0053] Step S251: Acquire historical temperature data and historical operational data of the satellite for multiple operational periods.

[0054] Several operating periods include sunshine periods and shadow periods.

[0055] While in orbit, satellites experience extreme temperature fluctuations during periods of sunshine and shadow, as well as changes in the dynamic read / write power consumption of their onboard storage modules. This method ensures that the resulting heat flux density distribution information closely reflects the actual operating conditions of the onboard storage modules, thereby improving the accuracy of the target cooling area.

[0056] Step S252: Determine the heat flux data of the simulation environment based on historical temperature data.

[0057] Optionally, the heat flux data of the simulation environment can be determined based on historical temperature data for each operating period.

[0058] Step S253: Determine the simulation power consumption data based on historical working data.

[0059] The simulated power consumption data and the simulated environment heat flow data are synchronized time series.

[0060] Step S254: Based on the model of the packaged circuit module, the thermal flux data of the simulation environment, the simulation power consumption data, and the sensitive parameter matrix and power consumption matrix of each functional area, a thermal simulation experiment is conducted to obtain the thermal flux density distribution information of the packaged circuit module for each operating period.

[0061] Optionally, finite element analysis software is used to conduct thermal simulation experiments based on the model of the packaged circuit module, the thermal flux data of the simulation environment, the simulation power consumption data, and the sensitive parameter matrix and power consumption matrix of each functional area, to obtain the thermal flux density distribution information of the packaged circuit module for each operating period. Specifically, the boundary conditions of the thermal simulation are constructed based on the thermal flux data of the simulation environment; the heat density distribution information of each functional area at different simulation times is determined based on the model of the packaged circuit module, the power consumption matrix of each functional area, and the simulation power consumption data; and the heat flux density distribution information of the packaged circuit module for each operating period is determined based on the boundary conditions of the thermal simulation and the heat density distribution information of each functional area at different simulation times.

[0062] Step S300: Determine the target cooling area based on heat flux density distribution information.

[0063] Optionally, step S300 includes steps S310 to S340.

[0064] Step S310: Determine the heat flux density distribution map based on the heat flux density distribution information.

[0065] Optionally, a heat flux density distribution map for each operating period is determined based on the heat flux density distribution information for each operating period. Specifically, the heat flux density in the heat flux density distribution information is a vector, and the heat flux density distribution map is determined based on the magnitude of each heat flux density vector in the heat flux density distribution information.

[0066] Step S320: Perform threshold segmentation on the heat flux density distribution map to identify hotspot centers where the heat flux density exceeds the heat flux density threshold.

[0067] The heat flux density in the heat flux density distribution diagram is a scalar.

[0068] Optionally, the heat flux density threshold is preset.

[0069] Optionally, the heat flux density threshold of each functional area is determined based on the sensitive parameter matrix of each functional area, and the area where the functional area is located in the heat flux density distribution map is segmented based on the heat flux density threshold of the functional area to identify the hot spot center where the heat flux density exceeds the heat flux density threshold.

[0070] Optionally, the formula for calculating the heat flux density threshold is: , in: Indicates the first Heat flux density threshold for each functional zone Indicates the first Each functional area corresponds to a preset threshold coefficient; the more sensitive the functional area, the higher its sensitivity. The smaller. Indicates the first The modulus of the maximum heat flux density in the sensitive parameter matrix of each functional area.

[0071] For example, the storage core area The value is 0.3, for the control and interface area. The value is 0.4, in the power management area. It is 0.5.

[0072] Optionally, multiple hotspot centers can be identified based on heat flux density distribution maps of multiple operating periods.

[0073] Step S330: Generate the hotspot influence domain based on the hotspot center.

[0074] Optionally, a hotspot influence domain can be generated by expanding based on multiple hotspot centers using a preset expansion radius.

[0075] Step S340: Merge adjacent hot spot influence areas to obtain a continuous target cooling area.

[0076] Optionally, for all hotspot influence domains corresponding to the running period, a region growing algorithm is used to merge adjacent hotspot influence domains to generate multiple continuous connected domains. Then, contour smoothing is performed on the multiple continuous connected domains to generate the final target cooling area, and the contour, coordinate range and area of ​​the target cooling area are output.

[0077] Step S400: Mount the packaged circuit module onto the substrate.

[0078] Optionally, the packaged circuit module can be soldered onto the substrate.

[0079] Step S500: The first shielding layer is manufactured using a metal material of the first density.

[0080] The size of the first shielding layer is matched with that of the packaged circuit module.

[0081] Optionally, the first density is greater than 10 g / cm³. 3 (grams per cubic centimeter).

[0082] For example, the first density metallic material includes at least one of lead and tungsten.

[0083] Step S600: Obtain the model of the second shielding layer.

[0084] Step S700: Determine the microchannel heat dissipation area on the model of the second shielding layer based on the target cooling area.

[0085] Optionally, the microchannel heat dissipation area includes a first microchannel heat dissipation area and a second microchannel heat dissipation area, and the coolant types of the first microchannel heat dissipation area and the second microchannel heat dissipation area are different.

[0086] Optionally, the first microfluidic heat dissipation area is used to introduce liquid alloy, and the second microfluidic heat dissipation area is used to introduce liquid nitrogen. The liquid alloy not only has high thermal conductivity but also radiation shielding function.

[0087] Optionally, step S700 includes steps S710 to S760.

[0088] Step S710: Project the target cooling area of ​​the packaged circuit module model onto the model of the second shielding layer to obtain the first region.

[0089] Optionally, the relative positions of the packaged circuit module model and the second shielding layer model after installation are determined based on the preset installation information of the packaged circuit module model and the second shielding layer model. Then, the target cooling area of ​​the packaged circuit module model is orthographically projected onto the second shielding layer model along the normal vector of the upper surface of the packaged circuit module to obtain the first region.

[0090] Step S720: Obtain the sensitive parameter matrix for each functional area of ​​the packaged circuit module.

[0091] The method for determining the sensitivity parameter matrix is ​​as described above. In step S720, the determined sensitivity parameter matrix is ​​obtained directly.

[0092] Step S730: Determine the radiation-sensitive area based on the sensitivity parameter matrix of each functional area.

[0093] Optionally, the functional areas in the sensitive parameter matrix whose single-particle flip radiation threshold is lower than a preset spaceborne radiation environment threshold are defined as radiation-sensitive areas.

[0094] Step S740: Project the radiation-sensitive area of ​​the packaged circuit module model onto the model of the second shielding layer to obtain the second region.

[0095] The method for determining the second region is the same as the method for determining the first region.

[0096] Step S750: The intersection area of ​​the first region and the second region is determined as the first microchannel heat dissipation region.

[0097] The first microchannel heat dissipation area is used to introduce liquid alloy. The liquid alloy not only has high thermal conductivity but also radiation shielding capabilities. In this way, areas requiring both heat dissipation and radiation protection can simultaneously achieve both.

[0098] Optionally, the liquid alloy includes gallium-based liquid alloys. Gallium-based liquid alloys have a much higher thermal conductivity than water and thermal grease, enabling them to dissipate heat from the onboard storage module extremely quickly. Gallium-based liquid alloys can also shield electromagnetic radiation.

[0099] Step S760: Determine that the second microchannel heat dissipation area includes the area in the first area excluding the intersection area.

[0100] The second microchannel heat dissipation area is used to introduce liquid nitrogen.

[0101] The first microchannel heat dissipation area and the second microchannel heat dissipation area are not connected.

[0102] Optionally, the microchannels in the first microchannel heat dissipation area are arranged in a serpentine pattern (i.e., a combination of multiple curves).

[0103] Optionally, the microchannels in the second microchannel heat dissipation area are arranged in a serpentine pattern (i.e., a combination of multiple curves).

[0104] Optionally, the second microchannel heat dissipation region also includes the intersection region of the first region. The microchannels in the first microchannel heat dissipation region intersect with the microchannels in the second microchannel heat dissipation region. In this way, liquid alloy and liquid nitrogen can be used simultaneously for cooling in the intersection region of the first and second regions, and radiation protection can also be achieved.

[0105] Step S800: A second shielding layer, including a microchannel heat dissipation region, is manufactured based on a model of the second shielding layer using a metal material of the second density.

[0106] The second shielding layer covers the inner surface of the first shielding layer, and the microchannel heat dissipation area includes microchannels. The second density is less than the first density.

[0107] For example, the second density metallic material includes at least one of copper, iron, and aluminum.

[0108] The inner surface of the first shielding layer refers to the surface of the first shielding layer that directly faces the packaged circuit module.

[0109] Optionally, a magnetic switch is provided in the microchannel for opening or closing the microchannel, and the second shielding layer includes a magnetic switch connection port.

[0110] Alternatively, the microchannels are arranged in a serpentine or other curved shape in the heat dissipation area.

[0111] Optionally, the first magnetic switch is used to control the opening or closing of the microchannel in the first microchannel heat dissipation area, and the second magnetic switch is used to control the opening or closing of the microchannel in the second microchannel heat dissipation area. The first magnetic switch and the second magnetic switch are different.

[0112] Optionally, the first microchannel heat dissipation area and the second microchannel heat dissipation area are isolated from each other.

[0113] Step S900: Prepare a third shielding layer formed by coating material on the inner surface of the second shielding layer to obtain a composite shielding shell.

[0114] Step S910: The composite shielding shell is fixedly mounted on the substrate through an insulating adhesive layer and accommodates the encapsulated circuit module to obtain the spaceborne storage module.

[0115] Optionally, two opposing composite shielding shells are fixedly mounted on the substrate and house the packaged circuit module through an insulating adhesive layer, so that part of the substrate and the packaged circuit module are located in the space formed by the two opposing composite shielding shells.

[0116] Optionally, the composite shielding shell is fixedly mounted on the substrate through an insulating adhesive layer and houses the encapsulated circuit module. The cooling device is fixedly mounted on the substrate and connected to the microfluidic liquid of the second shielding layer to obtain the spaceborne storage module.

[0117] Optionally, the cooling device includes a coolant and a coolant control unit for controlling the coolant return flow.

[0118] Optionally, the composite shielding shell is fixedly mounted on the substrate through an insulating adhesive layer and houses the encapsulated circuit module. The magnetron device is fixedly mounted on the substrate and electrically connected to the magnetron switch connection port to obtain the spaceborne storage module.

[0119] Optionally, the magnetic switch is used to independently open or close the corresponding microchannel, and the magnetic control device is used to achieve: (1) switching the coolant type according to the radiation intensity; (2) automatically switching to the backup microchannel when an abnormal pressure is detected in a single microchannel.

[0120] Optionally, the magnetic control device is used to implement steps S920 to S950.

[0121] Step S920: Acquire radiation detection data from the spaceborne radiation monitor and temperature monitoring data from the spaceborne storage module.

[0122] Step S930: When the radiation intensity is determined to be greater than the preset radiation intensity threshold based on the radiation detection data, the magnetic control switch of the first microfluidic channel heat dissipation area is turned on so that the liquid alloy flows into the first microfluidic channel heat dissipation area.

[0123] In this way, even when the radiation intensity is high, the first microchannel heat dissipation area can still achieve a radiation protection effect.

[0124] Step S940: When it is determined based on radiation detection data that the current radiation intensity is not greater than the preset radiation intensity threshold, and based on temperature monitoring data it is determined that the operating temperature of the onboard storage module is not higher than the preset temperature threshold, keep the magnetic switch of the first microchannel heat dissipation area closed and the magnetic switch of the second microchannel heat dissipation area open.

[0125] This method allows for liquid nitrogen cooling of the onboard storage module and saves power.

[0126] Step S950: When it is determined based on radiation detection data that the current radiation intensity is not greater than the preset radiation intensity threshold, and based on temperature monitoring data it is determined that the operating temperature of the onboard storage module is higher than the preset temperature threshold, keep the magnetic switch of the first microchannel heat dissipation area open, and keep the magnetic switch of the second microchannel heat dissipation area open.

[0127] This method enables rapid heat dissipation from the onboard storage module.

[0128] Optionally, the control pin of each magnetic switch is led out to the magnetic switch connection port on the outer wall of the second shielding layer, so that the magnetic control device can control a single magnetic switch.

[0129] Optionally, the insulating adhesive layer includes multiple adhesive regions with different coefficients of thermal expansion. The coefficients of thermal expansion of these adhesive regions along the longitudinal direction of the composite shielding shell towards the substrate are sequentially close to the coefficient of thermal expansion of the substrate. This approach mitigates the problem of coefficient of thermal expansion mismatch and reduces the likelihood of thermal fatigue cracking and debonding of the insulating adhesive layer during high and low temperature cycling.

[0130] Optionally, the substrate is an aluminum nitride ceramic substrate. Aluminum nitride ceramic substrates have the characteristics of high thermal conductivity and high insulation. Their coefficient of thermal expansion is similar to that of silicon chips, with small thermal expansion mismatch. Aluminum nitride ceramic substrates also have excellent radiation resistance.

[0131] Optionally, an insulating adhesive layer can be formed by repeatedly coating epoxy adhesive with a nano-alumina composite material. By adjusting the mass fraction of nano-alumina in the composite material in each coating, multiple adhesive zones with different coefficients of thermal expansion can be created.

[0132] This application also provides a spaceborne storage module, which is a spaceborne storage module manufactured using the spaceborne storage module packaging method described above.

[0133] Please see Figures 2 to 5 , Figure 2 This is a cross-sectional schematic diagram of the radiation-proof spaceborne storage module of the present invention. Figure 3 This is a block diagram showing the module connection of Embodiments 3 and 4 of the present invention. Figure 4This is one of the structural schematic diagrams of the microchannel of the present invention. Figure 5 This is the second schematic diagram of the microchannel structure of the present invention.

[0134] like Figures 2 to 5 As shown, this embodiment provides a radiation-resistant spaceborne storage module, which includes a substrate 2; The packaged circuit module 1 is bonded to the substrate 2; A composite shielding shell 3 covers the outside of the substrate 2 and forms a sealed package with the substrate 2, comprising: The first shielding layer 31 is made of a metal alloy material of a first density and is used to block high-energy protons and heavy ions. For example, the first density is greater than 15 g / cm³.

[0135] The second shielding layer 32 covers the inner surface of the first shielding layer 31. The second shielding layer is made of a metal material of a second density, which is less than the first density. The second shielding layer includes a microchannel heat dissipation area, which includes a first microchannel heat dissipation area and a second microchannel heat dissipation area. The first microchannel heat dissipation area is used to introduce liquid alloy, and the second microchannel heat dissipation area is used to introduce liquid nitrogen.

[0136] The third shielding layer 33 covers the inner surface of the second shielding layer 32.

[0137] Optionally, the third shielding layer 33 is made of a ceramic-coated material to attenuate high-energy electrons.

[0138] In this embodiment, the material of the first shielding layer 31 includes at least one of tungsten, lead and tantalum, and the material of the third shielding layer 33 is a nano-zirconia-aluminum composite coating.

[0139] For example, the second density metallic material includes at least one of copper, iron, and aluminum.

[0140] Example 1 like Figures 1 to 3 As shown, the composite shielding shell 3 includes a first shielding layer 31, a second shielding layer 32, and a third shielding layer 33. Exemplarily, the first shielding layer 31 is made of a tungsten alloy material with a density of 19.3 g / cm³, and its shape is a cover, completely covering the encapsulated circuit module 1. This layer is mainly used to block high-energy protons and heavy ions. Simulation tests show that this tungsten alloy layer achieves a shielding efficiency of 92% against protons with an energy of 100 MeV.

[0141] The third shielding layer 33 is uniformly coated on the inner surface of the second shielding layer 32, and is a 50 μm thick nano-zirconia-aluminum composite coating. This coating is mainly used to attenuate high-energy electrons. Testing showed that the attenuation coefficient of this coating for high-energy electrons is 0.8 dB / μm.

[0142] Optionally, the packaged circuit module 1 includes one or more chips selected from radio frequency processing chip, baseband processing chip, memory chip and analog-to-digital conversion chip.

[0143] Optionally, an insulating adhesive layer is provided between the composite shielding shell 3 and the encapsulated circuit module 1. The insulating adhesive layer is used to fix the composite shielding shell 3 and achieve electrical insulation.

[0144] For example, the insulating adhesive layer is made of high-temperature resistant epoxy adhesive with a thickness of 20μm, which can not only firmly fix the composite shielding shell 3, but also ensure electrical insulation between the metal shell and the chip circuit.

[0145] The preparation method of this embodiment includes the following steps: Step 1: Provide the packaged circuit module; Step 2: Prepare a first shielding layer formed of a metal material of the first density. The first shielding layer is in the shape of a cover and its size matches that of the substrate. Step 3: Prepare a second shielding layer formed of a metal material of the second density. The first shielding layer is in the shape of a cover and its size matches that of the first shielding layer. Step 4: Prepare a third shielding layer formed by ceramic coating material on the inner surface of the second shielding layer to obtain a composite shielding shell; Step 5: Fix the composite shielding shell onto the substrate using an insulating adhesive layer and cover the encapsulated circuit module.

[0146] Example 2 This embodiment is basically the same as Embodiment 1, except that: The first shielding layer 31 is made of tantalum alloy material with a density of 16.6 g / cm³.

[0147] The second shielding layer 32 is disposed on the inner surface of the first shielding layer 31 (i.e., the side closest to the chip).

[0148] The third shielding layer 33 is disposed on the inner surface of the first shielding layer 32. The coating material is a nano hafnium oxide coating with a thickness of 30 μm, which is prepared by chemical vapor deposition (CVD) process.

[0149] The insulating adhesive layer is made of silicone rubber to accommodate a wider temperature range.

[0150] The other structures and preparation methods are the same as in Example 1.

[0151] Example 3 like Figure 3 and Figure 4 As shown, in this embodiment, the radiation-resistant spaceborne storage module further includes: The radiation detection unit 600 is integrated inside the packaged circuit module 1 and is used to monitor the radiation intensity or single-particle event rate of the packaged circuit module 1 in real time. An active cooling structure 800 is connected to the composite shielding shell 3 and is used to actively remove the heat generated by the radiation absorbed by the composite shielding shell 3 when the radiation detection unit 600 detects that the radiation intensity exceeds the preset radiation intensity threshold.

[0152] The controller 700 is electrically connected to the radiation detection unit 600 and the active cooling structure 800 respectively, and is used to dynamically control the start / stop or power output of the active cooling structure 800 according to the detection results of the radiation detection unit 600.

[0153] like Figure 3 and Figure 4 As shown, in this embodiment, the active cooling structure 800 includes an external coolant circulation system 840, and the microchannel heat dissipation area 321 is connected to the external coolant circulation system 840.

[0154] The coolant in the external coolant circulation system 840 enters the microchannel heat dissipation area 321 from the coolant inlet 820, and the coolant in the microchannel heat dissipation area 321 flows back into the external coolant circulation system 840 from the coolant outlet 830, thereby carrying away heat.

[0155] Optionally, the coolant includes at least one of liquid nitrogen and liquid alloy, and the wires 900 on both sides of the substrate 2 extend out from the sidewalls of the composite shielding housing 3.

[0156] Radiation detection unit 600: One or more radiation detection units 600 (such as PIN diode radiation sensors or MOSFET radiation sensors) are additionally integrated on substrate 2 for real-time monitoring of radiation intensity (such as gamma-ray flux, neutron flux, or high-energy particle event rate) inside packaged circuit module 1. The output signal of radiation detection unit 600 is connected to controller 700 within packaged circuit module 1.

[0157] Optionally, the microchannel heat dissipation region 321 is connected to an external coolant circulation system 840 (such as a micropump and radiator). A third shielding layer 33 is coated on the inner surface of the second shielding layer 32 to further attenuate high-energy electrons. Exemplarily, the third shielding layer 33 is a nano-zirconia-aluminum composite coating with a thickness of not less than 50 μm. The cover plate (not shown in the figure) is then placed on top to complete the encapsulation of the substrate, thus completing the encapsulation carrier. The first shielding layer 31 provides comprehensive physical protection for the substrate 2, while the structure of the microchannel heat dissipation region 321 can remove the heat generated by the shielding layer absorbing radiation.

[0158] Controller 700: A controller 700 is integrated inside the packaged circuit module 1 and is communicatively connected to the radiation detection unit 600 and the drive circuit (such as the micro pump control circuit) of the active cooling structure 800. The controller 700 dynamically controls the working state of the micro pump based on the real-time data from the radiation detection unit 600, thereby achieving adaptive adjustment of the cooling flow rate.

[0159] Example 4 like Figure 3 and Figure 5 As shown, in this embodiment, the controller 700 includes a comparison unit 710 and a drive unit 720. The comparison unit 710 has at least one preset radiation threshold, which is used to compare the real-time detection data of the radiation detection unit 600 with the preset threshold. The drive unit 720 outputs a corresponding control signal to the active cooling structure 800 according to the comparison result, so as to adjust the flow rate or speed of the coolant.

[0160] like Figure 3 and Figure 5 As shown, the controller 700 in this embodiment includes a comparison unit 710 and a drive unit 720.

[0161] 1. Comparison Unit 710 The comparison unit 710 is electrically connected to the radiation detection unit 600 and receives real-time monitored radiation data. The comparison unit 710 has multiple preset radiation thresholds stored in non-volatile memory, which can be configured before launch according to different mission requirements. In this embodiment, three thresholds are set: The first preset radiation intensity threshold (background threshold) is 5 rad(Si) / s, which corresponds to the normal orbital background radiation intensity. The second preset radiation intensity threshold (warning threshold) is 20 rad(Si) / s, which corresponds to entering the medium radiation zone. The third preset radiation intensity threshold (event threshold) is 50 rad(Si) / s, corresponding to extreme radiation events such as solar proton events.

[0162] The comparison unit 710 compares the received radiation dose rate data with the three thresholds mentioned above in real time, and outputs the comparison result (i.e. the current radiation level) to the drive unit 720.

[0163] 2. Drive unit 720 The drive unit 720 is electrically connected to the active cooling structure 800. In this embodiment, the active cooling structure 800 includes a microchannel heat dissipation area 321, whose coolant circulation is powered by a miniature electromagnetic pump. The coolant is liquid nitrogen, and the pump supports stepless speed regulation. Based on the radiation level output by the comparison unit 710, the drive unit 720 outputs a corresponding control signal to the electromagnetic pump to precisely adjust the flow rate and velocity of the coolant.

[0164] 3. Hierarchical control logic The specific workflow of this embodiment is as follows: Mode 0: Standby mode (0 ≤ radiation intensity < first preset radiation intensity threshold) Comparison results: Normal background radiation.

[0165] Drive unit 720 operates by outputting 0mA current to the electromagnetic pump, causing the pump to stop working. The active cooling structure 800 is in the off state, relying solely on natural heat dissipation from the shielding layer and radiation from the casing. At this time, the module's power consumption is almost zero.

[0166] Mode 1: Low-power cooling mode (first preset radiation intensity threshold ≤ radiation intensity < second preset radiation intensity threshold) Comparison results: Entering the low radiation zone.

[0167] Drive unit 720 operates by outputting a first control current (e.g., 100mA) to the electromagnetic pump, causing the electromagnetic pump to run at a first speed (e.g., 1000rpm), and the coolant to circulate at a first flow rate (e.g., 5mL / min). This mode is used for pre-cooling and basic heat dissipation to prevent the slow accumulation of heat.

[0168] Mode 2: Medium power cooling mode (second preset radiation intensity threshold ≤ radiation intensity < third preset radiation intensity threshold) Comparison results: Entering the medium radiation zone.

[0169] Drive unit 720 operates by outputting a second control current (e.g., 250mA) to the electromagnetic pump, causing the electromagnetic pump to run at a second speed (e.g., 2500rpm), and the coolant to circulate at a second flow rate (e.g., 15mL / min). This mode effectively removes the additional heat generated by enhanced radiation.

[0170] Mode 3: High-power cooling mode (radiation intensity ≥ third preset radiation intensity threshold) Comparison result: Encountering an extreme radiation event.

[0171] The drive unit 720 operates by outputting a third control current (e.g., 500mA) to the electromagnetic pump, causing the pump to run at full speed (e.g., 5000rpm) and the coolant to circulate at a third flow rate (e.g., 30mL / min). Simultaneously, the drive unit 720 can also activate the backup thermoelectric cooler (TEC) to achieve maximum heat dissipation, ensuring the chip does not fail due to high temperatures in extreme environments.

[0172] 4. Closed-loop feedback regulation Optionally, to further improve control accuracy, this embodiment also includes a temperature sensor (not shown) at the outlet of the microfluidic heat dissipation area 321 to monitor the return temperature of the coolant in real time. This temperature signal is also fed back to the controller 700. When the return temperature is detected to be too high, the drive unit 720 can further fine-tune the speed of the electromagnetic pump to form a closed-loop control, ensuring the heat dissipation effect.

[0173] The cooling power is dynamically adjusted according to the radiation intensity to avoid continuous high power operation and extend the life of the cooling system. The cooling system is in the off state for most of the time (background radiation), which significantly reduces the power consumption burden of the satellite platform. The packaged circuit module 1 has the ability to sense environmental changes and actively adjust its own state, which greatly improves its adaptability and reliability in complex dynamic space environment.

[0174] This application also provides a satellite, which includes the onboard storage module described above.

[0175] In summary, the onboard storage module packaging method provided in this application has the following advantages: 1. By using a metal material of the second density to manufacture a second shielding layer based on a model of the second shielding layer, including a microchannel heat dissipation area, the composite shielding shell can simultaneously have radiation protection and thermal conductivity effects. While ensuring effective shielding against high-energy electrons, protons and other radiation particles, the thermal conductivity efficiency is greatly improved.

[0176] 2. By introducing liquid alloy through the first microchannel heat dissipation area, it is possible to achieve both heat dissipation and further radiation protection for areas that require both heat dissipation and radiation protection.

[0177] 3. Through the magnetic control device and magnetic control switch, it is possible to switch the coolant type according to the radiation intensity and automatically switch to the backup microchannel when an abnormal pressure is detected in a single microchannel.

[0178] In summary, this application provides a method for packaging a spaceborne storage module, a spaceborne storage module, and a satellite. The method for packaging the spaceborne storage module includes: obtaining a model of the packaged circuit module; conducting a thermal simulation experiment based on the model of the packaged circuit module to obtain the heat flux density distribution information of the packaged circuit module; determining a target cooling area based on the heat flux density distribution information; mounting the packaged circuit module on a substrate; manufacturing a first shielding layer using a metal material of a first density, the size of the first shielding layer matching the packaged circuit module; obtaining a model of a second shielding layer; and determining a microchannel heat dissipation area on the model of the second shielding layer based on the target cooling area. The heat dissipation area includes a first microchannel heat dissipation area and a second microchannel heat dissipation area. The first microchannel heat dissipation area is used to introduce liquid alloy, and the second microchannel heat dissipation area is used to introduce liquid nitrogen. A second shielding layer including the microchannel heat dissipation area is manufactured based on a model of a second shielding layer using a metal material of a second density. The second shielding layer covers the inner surface of the first shielding layer, and the microchannel heat dissipation area includes microchannels. A third shielding layer formed by a coating material is prepared on the inner surface of the second shielding layer to obtain a composite shielding shell. The composite shielding shell is fixedly mounted on a substrate using an insulating adhesive layer and houses the packaged circuit module to obtain a spaceborne storage module. This application, by using a metal material of a second density to manufacture a second shielding layer including the microchannel heat dissipation area based on a model of a second shielding layer, enables the composite shielding shell to simultaneously have radiation protection and thermal conductivity, significantly improving thermal conductivity while ensuring effective shielding against high-energy electrons, protons, and other radiation particles.

[0179] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A method for packaging a spaceborne storage module, characterized in that, include: Obtain the model of the packaged circuit module; Thermal simulation experiments were conducted based on the model of the packaged circuit module to obtain the heat flux density distribution information of the packaged circuit module. The target cooling area is determined based on the heat flux density distribution information; The packaged circuit module is mounted on the substrate; A first shielding layer is manufactured using a metal material of a first density, and the dimensions of the first shielding layer are matched to the packaged circuit module; Obtain the model of the second shielding layer; Based on the target cooling area, a microchannel heat dissipation area is determined on the model of the second shielding layer. The microchannel heat dissipation area includes a first microchannel heat dissipation area and a second microchannel heat dissipation area. The first microchannel heat dissipation area is used to introduce liquid alloy, and the second microchannel heat dissipation area is used to introduce liquid nitrogen. A second shielding layer including the microchannel heat dissipation region is manufactured based on a model of the second shielding layer using a metal material of the second density. The second shielding layer covers the inner surface of the first shielding layer. The microchannel heat dissipation region includes microchannels. The second density is less than the first density. A third shielding layer, formed by a coating material, is prepared on the inner surface of the second shielding layer to obtain a composite shielding shell. The composite shielding shell is fixedly mounted on the substrate through an insulating adhesive layer and houses the encapsulated circuit module to obtain the spaceborne storage module.

2. The method of claim 1, wherein, The thermal simulation experiment based on the model of the packaged circuit module obtains the heat flux density distribution information of the packaged circuit module, including: Based on the model of the packaged circuit module, determine the model and coordinates of multiple electronic components in the model; Based on the model numbers of the multiple electronic components, multiple functional areas are determined, including a storage core area, a control and interface area, and a power management area. The sensitive parameter matrix and power consumption matrix of each electronic component are determined based on the model number of each electronic component and a preset electronic component database; The sensitivity parameter matrix and power consumption matrix of each functional area are determined based on the sensitivity parameter matrix and power consumption matrix of all the electronic components. Thermal simulation experiments were conducted based on the model of the packaged circuit module, the sensitive parameter matrix of each functional area, and the power consumption matrix to obtain the heat flux density distribution information of the packaged circuit module.

3. The method of claim 2, wherein, The thermal simulation experiment based on the model of the packaged circuit module, the sensitive parameter matrix of each functional area, and the power consumption matrix is ​​used to obtain the heat flux density distribution information of the packaged circuit module, including: Acquire historical temperature data and historical operational data of the satellite for multiple operational periods, including periods of sunshine and periods of shadow. The heat flux data of the simulation environment are determined based on the historical temperature data; The simulation power consumption data is determined based on the historical working data. Thermal simulation experiments were conducted based on the model of the packaged circuit module, the thermal flux data of the simulation environment, the simulation power consumption data, and the sensitive parameter matrix and power consumption matrix of each functional area to obtain the thermal flux density distribution information of the packaged circuit module for each operating period.

4. The method of claim 1, wherein, Determining the target cooling area based on the heat flux density distribution information includes: A heat flux density distribution map is determined based on the heat flux density distribution information; The heat flux density distribution map is segmented by a threshold to identify hotspot centers where the heat flux density exceeds the heat flux density threshold; A hotspot influence domain is generated based on the hotspot center; The adjacent hotspot influence areas are merged to obtain the continuous target cooling area.

5. The method of claim 1, wherein, The step of determining the microchannel heat dissipation region on the model of the second shielding layer based on the target cooling region includes: The target cooling area of ​​the model of the packaged circuit module is projected onto the model of the second shielding layer to obtain the first area; Obtain the sensitive parameter matrix of each functional area of ​​the packaged circuit module; The radiation-sensitive area is determined based on the sensitivity parameter matrix of each functional area; The radiation-sensitive area of ​​the model of the packaged circuit module is projected onto the model of the second shielding layer to obtain the second region; The intersection of the first region and the second region is defined as the first microchannel heat dissipation region; The second microchannel heat dissipation region is defined as the region in the first region excluding the intersection region.

6. The onboard storage module packaging method according to claim 1, characterized in that, The process of fixing the composite shielding shell onto the substrate using an insulating adhesive layer and accommodating the packaged circuit module to obtain a spaceborne storage module includes: The composite shielding shell is fixedly mounted on the substrate through an insulating adhesive layer and houses the packaged circuit module. The cooling device is fixedly mounted on the substrate and connected to the microfluidic liquid of the second shielding layer to obtain the spaceborne storage module.

7. The onboard storage module packaging method according to claim 1, characterized in that, A magnetically controlled switch is disposed in the microchannel, the magnetically controlled switch being used to open or close the microchannel, the second shielding layer including a magnetically controlled switch connection port, the composite shielding shell being fixedly mounted on the substrate through an insulating adhesive layer and accommodating the encapsulated circuit module to obtain a spaceborne storage module, comprising: The composite shielding shell is fixedly mounted on the substrate through an insulating adhesive layer and accommodates the encapsulated circuit module. The magnetron device is fixedly mounted on the substrate and electrically connected to the magnetron switch connection port to obtain the spaceborne storage module.

8. The onboard storage module packaging method according to claim 1, characterized in that, The insulating adhesive layer includes multiple adhesive regions, each with a different coefficient of thermal expansion. The coefficients of thermal expansion of the multiple adhesive regions along the longitudinal direction of the composite shielding shell toward the substrate are sequentially close to the coefficient of thermal expansion of the substrate.

9. A spaceborne storage module, characterized in that, The spaceborne storage module is a spaceborne storage module manufactured using the spaceborne storage module packaging method as described in any one of claims 1-8.

10. A satellite, characterized in that, The satellite includes the onboard storage module as described in claim 9.

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