inductor component

Abstract

Provided is an inductor component (2) including: an inductor wiring (10) extending along a plane; pad portions (10A, 10B) at both ends of the inductor wiring (10); a vertical wiring (20) extending perpendicularly to the plane from the pad portions (10A, 10B); and first and second magnetic layers (30, 40) sandwiching the inductor wiring (10), the first and second magnetic layers (30, 40) having uniaxial magnetic anisotropy with the same axis direction, the inductor wiring (10) not extending orthogonally to one of the anisotropy axes (X-axis) in the entire region. By providing the inductor component (2), the magnetic flux generated by the inductor wiring is directed toward one of the anisotropy axes, and the influence of the other anisotropy axis can be suppressed.

Description

Technical Field

[0001] The present invention relates to an inductor component having inductor wiring extending in a planar shape.

[0002] This application claims priority based on Japanese Patent Application No. 2023-191720 filed in Japan on November 9, 2023, the entire contents of which are incorporated herein by reference. Background Technology

[0003] Inductor components with inductor wiring extending in a planar shape are becoming increasingly common. Regarding such inductor components, a circuit is disclosed that has inductor wiring covered by a layer having uniaxial magnetic anisotropy (see, for example, Patent Document 1). In the circuit described in Patent Document 1, the inductor wiring has orthogonal long and short sides connected in sequence, with the long and short sides respectively arranged parallel to the two anisotropic axes of the uniaxial magnetic anisotropy. Therefore, for example, since the magnetic flux generated by the inductor wiring on the long side can be directed towards one anisotropic axis, improvements in inductance acquisition efficiency or DC superposition characteristics can be expected.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2014-199902

[0005] However, since the long side and the short side are orthogonal, the magnetic flux generated by the inductor wiring on the short side is directed towards the other anisotropic axis. As a result, the effect of one anisotropic axis is weakened by the influence of the other axis, making it difficult to obtain the desired characteristics. Summary of the Invention

[0006] Therefore, the object of this disclosure is to provide an inductor component in which the magnetic flux generated by the inductor wiring is oriented toward one anisotropic axis and is able to suppress the influence of the other anisotropic axis.

[0007] One aspect of the inductor component disclosed herein includes:

[0008] Inductor wiring extends along the plane;

[0009] The pads are located at both ends of the aforementioned inductor wiring;

[0010] Vertical wiring extends perpendicularly from the aforementioned pad portion relative to the aforementioned plane; and

[0011] The first magnetic layer and the second magnetic layer sandwich the aforementioned inductor wiring.

[0012] The first magnetic layer and the second magnetic layer described above have uniaxial magnetic anisotropy along the same axis.

[0013] The aforementioned inductor wiring extends throughout the region without being orthogonal to one of the anisotropic axes.

[0014] According to this disclosure, since the inductor wiring extends between two ends separated in the direction of one anisotropic axis, most of the magnetic flux is directed towards the other anisotropic axis, thus achieving the effect of directing the magnetic flux towards the other anisotropic axis. Furthermore, since the inductor wiring extends without being orthogonal to one anisotropic axis throughout the entire area, the influence of that anisotropic axis can be suppressed. Therefore, it is possible to reliably obtain effects such as improved inductance acquisition efficiency (when the other anisotropic axis is an easy axis), improved DC superposition characteristics, or suppressed iron losses (when the other anisotropic axis is a difficult axis). Moreover, since the inductor component is connected to an external circuit via vertical wiring, it is possible to effectively mount the inductor component. Attached Figure Description

[0015] Figure 1 This is a top view schematically illustrating an inductor component according to a first embodiment of the present invention.

[0016] Figure 2 It means Figure 1 The side sectional view of section A-A.

[0017] Figure 3 It is a graph showing the B-H curves (hysteresis curves) of the easy axis and the difficult axis.

[0018] Figure 4A This is a schematic diagram illustrating a method for manufacturing an inductor component according to a first embodiment of the present invention, and is a side view showing step 1 of preparing substrate material.

[0019] Figure 4B This is a side view of step 2, which follows step 1, where a first magnetic layer is deposited on the substrate material.

[0020] Figure 4C This is a side view representing step 3, which follows step 2, where a first insulating layer is stacked on top of the first magnetic layer.

[0021] Figure 4D This is a side view of step 4, which follows step 3, where inductor wiring is formed on the first insulating layer.

[0022] Figure 4E This is a side view of step 5, which follows step 4, where a second insulating layer is stacked on top of the first insulating layer containing the inductor wiring.

[0023] Figure 4F This is a side view representing step 6, which follows step 5, where a second magnetic layer is laminated onto the second insulating layer.

[0024] Figure 4GThis is a side view of step 7, which follows step 6, to form a via from the surface side of the second magnetic layer.

[0025] Figure 4H This is a side view of step 8, which follows step 7 and involves forming vertical wiring in the through-hole.

[0026] Figure 4I This is a side view of step 9, which is the process following step 8, where the substrate material is ground to achieve a substrate of a specified thickness.

[0027] Figure 4J This is a side view of step 10, which follows step 9 and involves using a cutting mechanism to produce individual pieces.

[0028] Figure 4K This is a side view of the inductor component formed by monolithization in process 10.

[0029] Figure 5 This is a top view schematically illustrating a modified example 1 of the inductor component according to the first embodiment of the present invention.

[0030] Figure 6 It means Figure 5 The side sectional view of section B-B.

[0031] Figure 7 This is a schematic side sectional view of a modified example 2 of the inductor component according to the first embodiment of the present invention.

[0032] Figure 8 This is a schematic side sectional view of a modified example 3 of the inductor component according to the first embodiment of the present invention.

[0033] Figure 9 This is a schematic top view of an inductor component according to a second embodiment of the present invention.

[0034] Figure 10A It means Figure 9 The side sectional view of section C-C.

[0035] Figure 10B It means Figure 9 The side sectional view of section D-D.

[0036] Figure 11A This is a schematic diagram illustrating a modified example 1 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10A A side sectional view of a section at the same location.

[0037] Figure 11B This is a schematic diagram illustrating a modified example 1 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10BA side sectional view of a section at the same location.

[0038] Figure 12 This is a schematic diagram illustrating a modified example 2 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location.

[0039] Figure 13 This is a top view schematically illustrating an example of an inductor component with multiple inductor wires arranged along a plane.

[0040] Figure 14 This is a schematic diagram illustrating an inductor component according to a third embodiment of the present invention, and is shown in relation to... Figure 10B A side sectional view of a section at the same location.

[0041] Figure 15 This is a schematic diagram illustrating an inductor component according to a fourth embodiment of the present invention, and is shown in relation to... Figure 2 A side sectional view of a section at the same location. Detailed Implementation

[0042] Hereinafter, embodiments and variations for carrying out the present invention will be described with reference to the accompanying drawings. In each drawing, corresponding components having the same function are labeled with the same reference numerals. For ease of explanation and understanding, separate embodiments may be shown for convenience, but partial substitutions or combinations of structures shown in different embodiments are possible. In the embodiments described later, descriptions of matters shared with the foregoing embodiments are omitted, and only differences are explained. In particular, the same effects achieved by the same structure are not mentioned sequentially in each embodiment. The sizes and positional relationships of the components shown in the drawings are sometimes enlarged for clarity of explanation.

[0043] The accompanying drawings show an inductor component with a generally rectangular shape, placed on a horizontal plane with the substrate side facing down. The long side direction is taken as the X-axis, the short side direction as the Y-axis, and the height direction, which is orthogonal to both the long and short side directions, as the Z-axis.

[0044] (Inductor component according to the first embodiment of the present invention)

[0045] First, refer to Figures 1 to 3 The inductor component of the first embodiment of the present invention will be described. Figure 1 This is a top view schematically illustrating an inductor component according to a first embodiment of the present invention. Figure 2 It means Figure 1 The side sectional view of section A-A. Figure 3It is a graph showing the B-H curves (hysteresis curves) for the easy and difficult axes. Furthermore, in Figure 1 In the image, the inductor wiring is shown in perspective using solid lines.

[0046] In this embodiment, the inductor component 2 has a first magnetic layer 30 formed on a substrate 60, a first insulating layer 50A formed on the first magnetic layer 30, an inductor wiring 10 formed on the first insulating layer 50A, and a second insulating layer 50B covering the inductor wiring 10. A second magnetic layer 40 is formed on the second insulating layer 50B. The inductor wiring 10 extends along a plane and has pad portions 10A and 10B at both ends. Vertical wiring 20 extending perpendicularly to the plane extending relative to the inductor wiring 10 is formed from the pad portions 10A and 10B at both ends. In this embodiment, the inductor wiring 10 is disposed between the first magnetic layer 30 and the second magnetic layer 40 in the Z-axis direction.

[0047] In this embodiment, a high-resistivity silicon substrate is used as the substrate 60. However, it is not limited to this; any other inorganic substrate, such as a glass substrate or a ceramic substrate, can be used as the substrate 60. From the viewpoint of suppressing eddy current generation, a substrate with high insulation is preferred. The thickness of the substrate 60 can be 5 μm, but it is not limited to this. In this embodiment, the layers constituting the inductor component 2, represented by the first magnetic layer 30, are formed on the inorganic substrate, thus ensuring chip strength even when thin.

[0048] However, as referenced Figure 7 As will be described later, an inductor component 6 without a substrate 60 can also be used. Alternatively, an organic insulating layer can be formed between the substrate 60 and the first magnetic layer 30.

[0049] The first magnetic layer 30 and the second magnetic layer 40 are formed by a stack of an inorganic insulating layer and an inorganic magnetic layer. The thicknesses of the first magnetic layer 30 and the second magnetic layer 40 are typically around 5 to 6 μm, but are not limited to this. The materials and detailed structures of the first magnetic layer 30 and the second magnetic layer 40 will be described in more detail in the description of the manufacturing method.

[0050] In this embodiment, the first insulating layer 50A and the second insulating layer 50B are formed of polyimide. However, they are not limited to this, and other organic resins, such as epoxy resin and phenolic resin, or combinations thereof, can also be used, and insulating fillers may also be included. Furthermore, they can also be formed from inorganic insulators such as SiO2 and TaO. In this embodiment, the thickness of the first insulating layer 50A is 5 μm, but it is not limited to this. The thickness of the second insulating layer 50B is a value obtained by adding approximately 2 to 10 μm to the thickness of the inductor wiring 10.

[0051] The inductor wiring 10 and vertical wiring 20, which have pads 10A and 10B at both ends, are formed of a conductive material with low resistance, such as copper, silver, or gold. Preferably, a conductor containing copper or a copper compound is used. The vertical wiring 20 is electrically connected to the inductor wiring 10 via the pads 10A and 10B at both ends. In this embodiment, a flat wire with a cross-sectional size of 40μm × 20μm is used as the inductor wiring 10, but it is not limited to this. Flat wires of different sizes or wiring other than flat wires can also be used.

[0052] The vertical length of the vertical wiring 20 is determined by the thickness of the second insulating layer 50B and the second magnetic layer 40, as well as the amount of protrusion from the surface of the second magnetic layer 40. In this embodiment, the amount of protrusion of the vertical wiring 20 from the surface of the second magnetic layer 40 is 5 μm, but it is not limited to this.

[0053] The inductor component 2 constructed as described above has a roughly rectangular parallelepiped shape. If the length of the long side (X-axis direction) is set as L, the length of the short side (Y-axis direction) is set as W, and the length of the height (Z-axis direction) is set as T, then it has dimensions of L×W×T=1.0mm×0.5mm×0.5mm. However, this is just an example; inductor components with other arbitrary dimensions can be used.

[0054] By electrically connecting the vertical wiring 20 protruding from the surface of the second magnetic layer 40 to an external circuit, current can flow into the inductor wiring 10 through the vertical wiring 20 to generate magnetic flux, thus functioning as an inductor.

[0055] like Figure 2 As shown, in this embodiment, the vertical wiring 20 is formed such that the cross-sectional area increases from the end face 20A on the opposite side to the end face 10A and 10B that are in contact with the pad portions 10A and 10B. This increases the connection strength between the end face 20A and external circuits and external terminals, and suppresses connection resistance.

[0056] In this embodiment, such as Figure 2 As shown, the vertical wiring 20 extends through the second magnetic layer 40. Thus, when viewed from above, the second magnetic layer 40 is formed to cover the entire circumference of the vertical wiring 20, and the area of ​​the second magnetic layer 40 is maximized in the planar direction. This improves the inductor's acquisition efficiency and suppresses leakage flux.

[0057] Furthermore, in the inductor component 2 of this embodiment, multiple conductive layers are formed on the end face 20A of the vertical wiring 20. For example, by forming a Ni layer as a conductive layer on the end face 20A, electromigration resistance can be provided, and by forming an Au layer, Sn layer, or the like as conductive layers, solder wetting properties can be provided. As a result, appropriate functionality can be provided for connection with external circuits.

[0058] <Direction of Inductor Wiring>

[0059] The inductor component 2, which has a generally rectangular shape, has pad portions 10A and 10B arranged at both ends in the long side direction (X-axis direction). The inductor wiring 10 extends in a serpentine pattern from one pad portion 10A (10B) to draw a smooth curve in the long side direction and reaches the other pad portion 10B (10A). Thus, a so-called zigzag inductor is constructed.

[0060] The first magnetic layer 30 and the second magnetic layer 40, arranged vertically and horizontally sandwiching the inductor wiring 10, have uniaxial magnetic anisotropy along the same axis. In this embodiment, the two anisotropic axes (easy axis and difficult axis) of the first magnetic layer 30 and the second magnetic layer 40 are compared with those when viewing the inductor component 2 from above (refer to...). Figure 1 The long side (X-axis direction) and short side (Y-axis direction) of the magnetic layer 30 are parallel. In addition, considering manufacturing deviations, "the first magnetic layer 30 and the second magnetic layer 40 have uniaxial magnetic anisotropy with the same axis" means that the angle formed by the anisotropy axes of the first magnetic layer 30 and the second magnetic layer 40 converges to less than 10 degrees.

[0061] The anisotropy axes of the first magnetic layer 30 and the second magnetic layer 40, which have uniaxial magnetic anisotropy with the same axis, will be described in more detail. As a method for determining the easy and difficult axes of uniaxial magnetic anisotropy, for example, the B-H curve can be obtained by rotating the sample by 90 degrees, measuring the magnetic layer using a VSM (vibrating sample type magnetometer), and obtaining the curve. The B-H curve is also called the hysteresis curve. An example of a measured B-H curve is shown below. Figure 3 . Figure 3 The vertical axis of the graph shows the magnetic flux density B (in tons), and the horizontal axis shows the magnetic field strength H (in meters).

[0062] If the permeability is set to μ, then the relationship B = μH holds. That is, Figure 3The slope of the B-H curve shown represents the permeability μ. A steeply rising B-H curve represents the easy axis (easily magnetized axis), while a gently sloping B-H curve represents the difficult axis (difficult to magnetize axis). If the direction of the magnetic flux generated by the current flowing in the inductor wiring 10 is parallel to the easy axis, the acquisition efficiency of the inductor can be improved. On the other hand, if the direction of the magnetic flux generated by the current flowing in the inductor wiring 10 is parallel to the difficult axis, the DC superposition characteristic can be improved or the iron loss can be reduced. Furthermore, for the test specimen for uniaxial magnetic anisotropy testing, a planar shape of circular or square is preferred to eliminate the influence of shape anisotropy, but even other shapes can be measured.

[0063] In this embodiment, there may be a case where the difficult axis of the first magnetic layer 30 and the second magnetic layer 40, which have uniaxial magnetic anisotropy, is oriented towards the long side direction (X-axis direction) and the easy axis is oriented towards the short side direction (Y-axis direction), and conversely, the easy axis is oriented towards the long side direction (X-axis direction) and the difficult axis is oriented towards the short side direction (Y-axis direction).

[0064] In both cases, the two ends of the inductor wiring 10 are separated along one of the anisotropic axes (X-axis direction) of the uniaxial magnetic anisotropy, either the difficult axis or the easy axis. Furthermore, the two ends of the inductor wiring 10 can be at the same position or at different positions along the other anisotropic axis (Y-axis direction). The inductor wiring 10 extends in a serpentine pattern along one anisotropic axis (X-axis direction) between the pads 10A and 10B at both ends. It is particularly noteworthy that the inductor wiring 10 does not extend orthogonally to one anisotropic axis (X-axis direction) throughout the entire region. That is, the inductor wiring 10 extending between the pads 10A and 10B at both ends always has a vector component along one anisotropic axis (X-axis direction). There will be no case where it lacks a vector component along one anisotropic axis (X-axis direction) and only has a vector component along the other anisotropic axis (Y-axis direction).

[0065] This can also be described as: the wiring centerline G passing through the center in the width direction relative to the inductor wiring 10 (refer to...) Figure 1 It extends throughout the entire region without being orthogonal to one of the anisotropic axes (X-axis direction). Alternatively, it can be described as the angle between the wiring centerline G and one of the anisotropic axes (X-axis direction) being less than 90 degrees.

[0066] In the inductor wiring extending along the plane, there is a spiral wiring. If the case of rotating the spiral wiring of the inductor wiring by 360 degrees is considered as 1 turn, then in this embodiment, it can also be described as an inductor wiring 10 connection configuration of less than 0.5 turns.

[0067] When the inductor wiring 10 extends along one anisotropic axis (X-axis direction), due to the vector component in the direction of one anisotropic axis (X-axis direction), most of the magnetic flux is directed towards the other anisotropic axis (Y-axis direction). Assuming that the inductor wiring 10 has a region extending perpendicular to the direction of one anisotropic axis (X-axis direction), in that region, all the magnetic flux is directed towards the direction of one anisotropic axis (X-axis direction), and therefore will be affected by it.

[0068] In this embodiment, since the inductor wiring 10 extends along one anisotropic axis (X-axis direction), most of the magnetic flux is directed towards the other anisotropic axis (Y-axis direction). This provides the effect of directing the magnetic flux towards the other anisotropic axis (Y-axis direction). Furthermore, since the inductor wiring 10 extends non-orthogonally to one anisotropic axis (X-axis) throughout the entire area, the influence of that axis (X-axis) is suppressed. This reliably improves the inductance acquisition efficiency, enhances DC superposition characteristics, or suppresses iron losses. Moreover, since the inductor component 2 is connected to an external circuit via the vertical wiring 20, mounting the inductor component 2 can be effectively achieved.

[0069] When one anisotropic axis towards the longer side (X-axis) is the difficult axis, the inductance efficiency can be improved because most of the magnetic flux passes through the easy axis (Y-axis). On the other hand, when one anisotropic axis towards the longer side (X-axis) is the easy axis, the DC superposition characteristic can be improved or the iron loss can be reduced because most of the magnetic flux passes through the difficult axis (Y-axis).

[0070] When the inductor component 2 has a generally cuboid shape as described above, with the easy axis oriented towards the long side of the cuboid, the following advantages are also available. Considering the influence of shape-based magnetic anisotropy, using the long side as the easy axis facilitates anisotropic axis control. Furthermore, the two ends of the inductor wiring 10 are separately arranged in the direction of this easy axis, and the pads 10A and 10B at both ends are arranged to overlap at least partially when viewed from the direction of the easy axis. Therefore, since the inductor wiring extends non-orthogonally to the easy axis throughout the entire area, most of the magnetic flux passes through the easy axis, enabling improved DC superposition characteristics and suppression of iron losses.

[0071] <Manufacturing Method of Inductor Components>

[0072] Next, refer to Figures 4A to 4K The manufacturing method of the inductor component 2 described above will be explained. Figure 4A This is a schematic diagram illustrating a method for manufacturing an inductor component according to a first embodiment of the present invention, and is a side view showing step 1 of preparing substrate material. Figure 4BThis is a side view of step 2, which follows step 1, where a first magnetic layer is deposited on the substrate material. Figure 4C This is a side view representing step 3, which follows step 2, where a first insulating layer is stacked on top of the first magnetic layer. Figure 4D This is a side view of step 4, which follows step 3, where inductor wiring is formed on the first insulating layer. Figure 4E This is a side view of step 5, which follows step 4, where a second insulating layer is stacked on top of the first insulating layer containing the inductor wiring. Figure 4F This is a side view representing step 6, which follows step 5, where a second magnetic layer is laminated onto the second insulating layer. Figure 4G This is a side view of step 7, which follows step 6, to form a via from the surface side of the second magnetic layer. Figure 4H This is a side view of step 8, which follows step 7 and involves forming vertical wiring in the through-hole. Figure 4I This is a side view of step 9, which involves grinding the substrate material to achieve a substrate of a specified thickness, following step 8. Figure 4J This is a side view of step 10, which follows step 9 and involves using a cutting mechanism to produce individual pieces. Figure 4K This is a side view of the inductor component formed by monolithization in process 10.

[0073] - Process 1

[0074] First, such as Figure 4A As shown, step 1, preparing substrate material S, is performed. Substrate material S is formed from high-resistivity silicon as described above. The thickness of substrate material S shown is greater than the final thickness of the finished substrate 60. A process is performed where multiple inductor components are formed on a single substrate material S, and then monolithically assembled to obtain individual inductor components 2.

[0075] - Process 2

[0076] Next, as Figure 4B As shown, process 2 involves stacking a first magnetic layer 30 on a substrate material S. Figure 4B As shown in the enlarged view on the right, the first magnetic layer 30 is composed of a stack of an inorganic insulating layer 30A and an inorganic magnetic layer 30B. For example, the inorganic insulating layer 30A and the inorganic magnetic layer 30B are sequentially stacked by sputtering. Therefore, the inorganic insulating layer 30A can also be called the sputtered insulating layer 30A, and the inorganic magnetic layer 30B can also be called the sputtered magnetic layer 30B.

[0077] As an example of imparting uniaxial magnetic anisotropy to the first magnetic layer 30, the following can be illustrated: By sputtering an inorganic magnetic layer 30B in a magnetic field, the atoms inside the inorganic magnetic layer 30B can be arranged in desired positions, with the easy axis oriented towards the direction of the applied magnetic field. If the direction of the applied magnetic field is oriented towards the long side of the inductor component 2, the easy axis is oriented towards the long side; if the direction of the applied magnetic field is oriented towards the short side of the inductor component 2, the difficult axis is oriented towards the long side.

[0078] Inorganic insulating layers 30A can be formed from inorganic insulators such as SiO2 and TaO. In addition, inorganic magnetic layers 30B can be formed from composites of CZT (Co-Zr-Ta), FeNi alloys, magnetic materials, and inorganic materials. The interlayer thickness between inorganic magnetic layers 30B is preferably thinner than that of each individual inorganic magnetic layer 30B. Since the function of the inorganic insulating layers 30A is to insulate between the inorganic magnetic layers 30B or to protect the inorganic magnetic layers 30B from stress during processing, a thinner layer increases the proportion of the magnetic layers in the overall laminate. By arranging inorganic insulating layers 30A such as TaO and SiO2 between the inorganic insulating layers 30B, the inorganic magnetic layers 30B are insulated from each other, and eddy currents in the inorganic magnetic layers 30B can be suppressed, thus enabling the realization of an inductor component 2 with a high Q value at high frequencies.

[0079] Furthermore, if the inorganic magnetic layer 30B is thickened with materials such as CZT (Co-Zr-Ta) or FeNi alloy, eddy currents will be generated within the magnetic layer; therefore, a thinner thickness is preferred. Specifically, it is preferable to be thinner than the skin depth derived from the circuit operating frequency, such as the switching frequency of a DC-DC converter. On the other hand, since the inductor is a current-carrying element, the inductor wiring thickness of 10 is preferred to allow for the flow of a large amount of current.

[0080] Considering these factors, in the inductor component 2 of this embodiment, the thickness of the first magnetic layer 30 in the direction orthogonal to the plane is less than the thickness of the inductor wiring 10. By making the inorganic magnetic layer 30B thinner, eddy currents generated within the inorganic magnetic layer 30B can be suppressed, and by increasing the thickness of the inductor wiring 10, an inductor component 2 with low DC resistance and high inductor acquisition efficiency can be achieved.

[0081] Furthermore, in this embodiment, an inorganic insulating layer 30A is provided on the surface of the first magnetic layer 30, which is composed of a laminate of an inorganic insulating layer 30A and an inorganic magnetic layer 30B. Thus, since the inorganic insulating layer 30A is provided on the surface of the first magnetic layer 30, reliable insulation from peripheral components such as wiring can be achieved. The same applies to the second magnetic layer 40, which will be described later.

[0082] - Process 3

[0083] Next, as Figure 4CAs shown, step 3 involves stacking a first insulating layer 50A onto the first magnetic layer 30 formed in step 2. Specifically, the first insulating layer 50A can be formed by coating the first magnetic layer 30 with polyimide, which is an organic resin, and then curing it.

[0084] - Process 4

[0085] Next, as Figure 4D As shown, step 4 involves forming inductor wiring 10 on the first insulating layer 50A formed in step 3 using an electric field electrolytic plating method. Specifically, a seed layer composed of Ti / Cu is formed on the first insulating layer 50A using a sputtering method. Then, a dry film resist (DFR) is laminated onto the seed layer, and photolithography is used to expose the seed layer with a shape corresponding to the inductor wiring. Then, power is supplied from the seed layer, and the plating is separated on the exposed seed layer using an electric field electrolytic plating method to form the inductor wiring. Then, by stripping the dry film resist (DFR) and etching the seed layer, isolated inductor wiring is obtained. This forms the inductor wiring 10 with a serpentine shape.

[0086] - Process 5

[0087] Next, as Figure 4E As shown, step 5 involves stacking a second insulating layer 50B on a first insulating layer 50A, on which the inductor wiring 10 formed in step 4 is disposed. Specifically, similar to the first insulating layer 50A, the second insulating layer 50B can be formed by coating polyimide, an organic resin, with the coating and curing it. Thus, the second insulating layer 50B is formed to cover the side and top surfaces of the inductor wiring 10. In this way, a first insulating layer 50A and a second insulating layer 50B surrounding the inductor wiring 10 are formed.

[0088] - Process 6

[0089] Next, as Figure 4F As shown, step 6 involves stacking a second magnetic layer 40 on the second insulating layer 50B formed in step 5. The second magnetic layer 40 can also be stacked using the same steps as the first magnetic layer 30. Similar to the first magnetic layer 30, the easy axis of the inorganic magnetic layer can be aligned with the direction of the applied magnetic field by sputtering in a magnetic field. By ensuring that the applied magnetic field directions are the same when forming the first magnetic layer 30 and the second magnetic layer 40, the first magnetic layer 30 and the second magnetic layer 40 can possess uniaxial magnetic anisotropy along the same axis.

[0090] - Process 7

[0091] Next, as Figure 4GAs shown, step 7 involves forming a via from the surface side of the second magnetic layer 40 formed in step 6. Specifically, a laser is irradiated from the surface side of the second magnetic layer to remove a portion of the second magnetic layer 40 and the second insulating layer 50B, forming a via BH that reaches the pad portions 10A and 10B of the inductor wiring 10. The formed via BH has a shape that narrows as it extends from the surface side of the second magnetic layer into the interior.

[0092] - Process 8

[0093] Next, as Figure 4H As shown, step 8 is performed to form vertical wiring 20 in the via BH formed in step 7. When the via BH is formed by laser irradiation, resin residue called smear is generated. First, a desmearing process is performed to remove the smear (resin residue) generated during laser processing. After cleaning the via BH in the desmearing process, vertical wiring 20 is formed in the via BH. Vertical wiring 20 can be formed in the via BH by electrolytic plating, using the same method as the inductor wiring 10 described above. Using electrolytic plating allows for the low-resistance vertical wiring 20 to be obtained at a low cost. Furthermore, vertical wiring 20 can also be formed by plating processes other than electrolytic plating, such as sputtering, vapor deposition, and coating.

[0094] - Process 9

[0095] Next, as Figure 4I As shown, following step 8, step 9 involves grinding the substrate material S to form a substrate 60 of a predetermined thickness. However, this is not a limitation; if the thickness of the substrate material S is a predetermined thickness, step 9 can be omitted. For example, if a temporary bonding layer is pre-formed on the substrate material S, and a first magnetic layer 30 is formed on the temporary bonding layer, the substrate material S can be removed from the first magnetic layer 30 after steps 1 to 8. Thus, a substrate 60 can be obtained as shown in step 9. Figure 7 The inductor component 6 shown is without a substrate.

[0096] - Process 10

[0097] Next, as Figure 4J As shown, following step 9 (or step 8 depending on the situation), step 10, which involves single-piece processing using a cutting mechanism, is performed. Figure 4K The image shows an inductor component 2 formed by being monolithized through process 10.

[0098] (A variation of the first embodiment)

[0099] Next, refer to Figures 5 to 8 A variation of the first embodiment described above will be explained.

[0100] <Variation Example 1>

[0101] First, refer to Figure 5 and Figure 6 A modified example 1 of the inductor component of the first embodiment will be described. Figure 5 This is a top view schematically illustrating a modified example 1 of the inductor component according to the first embodiment of the present invention. Figure 6 It means Figure 5 The side sectional view of section B-B. Furthermore, in Figure 5 In the diagram, like perspective, solid lines are used to represent vertical wiring and inductor wiring.

[0102] In the inductor component 4 of Modified Example 1, the difference from the inductor component 2 of the first embodiment described above is that a third insulating layer 70, which serves as an inorganic insulating layer, is also formed on the surface of the stacked second magnetic layer 40. The periphery of the side of the vertical wiring 20 is covered by the third insulating layer 70. The third insulating layer 70 can be formed of the same material as the first insulating layer 50A and the second insulating layer 50B described above, or it can be formed of a different material.

[0103] In this way, since the side facing the direction parallel to the plane in the vertical wiring 20 is covered by the third insulating layer 70, current leakage to the second magnetic layer 40 and the like can be suppressed.

[0104] The surface 70A of the third insulating layer 70 is formed flush with the end face 20A of the vertical wiring 20, and the external terminal 80 is formed to contact the surface 70A of the third insulating layer 70 and the end face 20A of the vertical wiring 20. The external terminal 80, like the vertical wiring 20, can be formed by electrolytic plating, sputtering, electroless plating, etc.

[0105] Thus, when viewed from the vertical direction, the external terminal 80, extending along a plane parallel to the plane, overlaps with the second magnetic layer 40. In other words, when viewed from above, the external terminal 80 extends further outward compared to the second magnetic layer 40. Therefore, since the external terminal 80 is connected to the vertical wiring 20 and extends along a plane parallel to the plane, and the external terminal 80 is formed to overlap with the second magnetic layer 40 when viewed from the vertical direction, the external terminal 80 can be enlarged, resistance reduced, and fixing strength improved.

[0106] <Variation Example 2>

[0107] Next, refer to Figure 7 A modified example 2 of the inductor component of the first embodiment will be described. Figure 7 This is a schematic side sectional view of a modified example 2 of the inductor component according to the first embodiment of the present invention.

[0108] In Modification 2, the inductor component 6 does not have a substrate 60. Because it lacks a substrate 60, the inductor component 6 can be made thinner and lighter. Furthermore, the vertical wiring 20 (the vertical wiring on the left side of the attached drawing) is similar to that in Modification 1 described above; the vertical wiring 20, which is connected to the pad portion 10A of the inductor wiring 10, is covered by a third insulating layer 70, and an external terminal 80 is formed on the end face 20A of the vertical wiring 20.

[0109] On the other hand, the other vertical wiring 22 (the vertical wiring on the right side of the figure) is connected to the surface of the first magnetic layer 30 side (the lower side of the figure) of the pad portion 10B of the inductor wiring 10. The other vertical wiring 22 penetrates the first magnetic layer 30 and protrudes to the outside. In this way, in Modification 2, a thin inductor component 6 can be realized, and since it is connected to the external circuit from the top and bottom, the freedom of mounting position is improved.

[0110] <Variation Example 3>

[0111] Next, refer to Figure 8 A variation 3 of the inductor component of the first embodiment will be described. Figure 8 This is a schematic side sectional view of a modified example 3 of the inductor component according to the first embodiment of the present invention.

[0112] The inductor component 6 of Modification 3 includes a substrate 60. The vertical wiring 20 (the vertical wiring on the left side of the figure) is similar to that of Modifications 1 and 2 described above. The vertical wiring 20 connected to the pad portion 10A of the inductor wiring 10 is covered by a third insulating layer 70, and an external terminal 80 is formed on the end face 20A of the vertical wiring 20.

[0113] On the other hand, the other vertical wiring 22 (the vertical wiring on the right side of the figure) is connected to the surface of the first magnetic layer 30 side (the lower side of the figure) of the pad portion 10B of the inductor wiring 10, similar to that in Variation 2. In Embodiment 3, the other vertical wiring 22 penetrates the first magnetic layer 30 and further penetrates the substrate 60. Moreover, the end face 22A of the other vertical wiring 22 is configured to be flush with the surface of the substrate 60 and exposed externally.

[0114] Thus, in Embodiment 3, since the vertical wiring 20 passes through the substrate 60, which serves as an inorganic substrate, it can be connected to external circuits from both above and below, thereby increasing the freedom of installation position. Furthermore, the presence of the inorganic substrate also ensures the strength of the substrate.

[0115] As in variations 2 and 3 above, by extending vertical wiring 20 and 22 on both sides of the clamping inductor wiring 10, it is possible to connect to the external circuit from above and below, thus increasing the freedom of installation position.

[0116] (Inductor component according to the second embodiment of the present invention)

[0117] Next, refer to Figure 9 , Figure 10A as well as Figure 10B The inductor component of the second embodiment of the present invention will be described. Figure 9 This is a schematic top view of an inductor component according to a second embodiment of the present invention. Figure 10A It means Figure 9 The side sectional view of section C-C. Figure 10B It means Figure 9 A side sectional view of section D-D. Figure 9 In the diagram, the inductor wiring is represented by solid lines, similar to perspective.

[0118] In the inductor component 102 of the second embodiment of the present invention, the inductor wiring extends differently than in the first embodiment, and the points where the two inductor wirings 110 are arranged along the plane are different. Each inductor wiring 110 is formed by connecting two regions extending parallel to the direction (X-axis direction) of one of the difficult and easy axes of uniaxial magnetic anisotropy, and extending in a region extending in a direction intersecting the direction (X-axis direction) of the anisotropy axis. The region extending in the direction intersecting the direction (X-axis direction) of one of the anisotropy axes of the inductor wiring 110 also extends in a direction that is not orthogonal to one of the anisotropy axes (X-axis), just like in the first embodiment described above.

[0119] In other words, in the inductor component 102 of the second embodiment, the two ends of the inductor wiring 110 are also separately arranged in the direction of one of the difficult and easy anisotropic axes (X-axis direction) in the uniaxial magnetic anisotropy, and the inductor wiring 110 extends in a manner that is not orthogonal to one of the anisotropic axes (X-axis) throughout the entire region. Furthermore, the positions of the two ends of the inductor wiring 10 in the direction of the other anisotropic axis (Y-axis direction) can be the same or different.

[0120] In the second embodiment, the inductor wiring 110 extends in a different manner than in the first embodiment, but for the stacked structure, it is almost the same as in the first embodiment. For example... Figure 10B As shown, a first insulating layer 150A is stacked on a substrate 160, and a first magnetic layer 130 is stacked and disposed between the first insulating layers 150A. Inductor wiring 110 is formed on the first insulating layers 150A, and a second insulating layer 150B is stacked to cover the inductor wiring 110, and a second magnetic layer 140 is stacked to cover the second insulating layer 150B. In this embodiment, no insulating layer is formed on the second magnetic layer 140.

[0121] The cross-sectional dimensions of the inductor wiring 110 can be 40 μm × 20 μm, the thickness of the substrate 160 can be 5 μm, and the thicknesses of the first magnetic layer 130 and the second magnetic layer 140 can each be 5 to 6 μm. The thickness of the first insulating layer 150A is obtained by adding approximately 2 to 10 μm to the thickness of the first magnetic layer 130. The thickness of the second insulating layer 150B is obtained by adding approximately 2 to 10 μm to the thickness of the inductor wire 10. Furthermore, the protrusion of the vertical wiring 120 from the surface of the second magnetic layer 140 can be 5 μm, and the dimensions of the inductor component 102, which has a generally rectangular parallelepiped shape, can be 1.0 mm × 0.5 mm × 1 × 0.5 mm. However, these dimensions are just examples and are not limited to them.

[0122] The materials of each component are the same as those in the first embodiment, and the inductor component 102 of the second embodiment can be manufactured using the same manufacturing method as in the first embodiment.

[0123] In this embodiment, the number of inductor wirings 110 arranged along the plane in one inductor component 102 is two, but it is not limited to this. Any number of inductor wirings 110, more than three, can be arranged along the plane. In this case, it is possible to illustrate the case where multiple inductor components 102 are arranged symmetrically with respect to a centerline extending along the long side direction (X-axis direction) of the inductor component 102 having a rectangular planar shape.

[0124] In this embodiment, since multiple inductor wirings 110 are arranged along a plane, an inductor array element can be formed. Therefore, space can be saved because the mounting spacing can be omitted.

[0125] Here, Figure 13 This is a top view schematically illustrating an example of an inductor component with multiple inductor wires arranged along a plane. (Example) Figure 13 As shown, by arranging the multiple inductor wirings 110 along a plane, the planar shapes of the first magnetic layer 130 and the second magnetic layer 140 can be made close to square. Therefore, since the influence of shape magnetic anisotropy can be reduced, the range of material selection and other methods can be broadened.

[0126] As for the near-square shape, if we define the dimension along one anisotropic axis (X-axis direction) as P and the dimension along the other anisotropic axis (Y-axis direction) as Q, then the ratio of the two, that is, the value of Q / P, is preferably in the range of 0.5 or more and 1 or less, more preferably in the range of 0.7 or more and 1 or less. Considering that the first magnetic layer 130 and the second magnetic layer 140 are not of the same shape, when viewing the plane extending from the inductor wiring 110 in the vertical direction, at least one of the first magnetic layers 130 and the second magnetic layer 140 overlaps with the plurality of inductor wirings 110. The ratio of the dimension along one anisotropic axis (X-axis direction) to the dimension along the other anisotropic axis (Y-axis direction) of the shape is preferably in the range of 0.5 or more and 1 or less, more preferably in the range of 0.7 or more and 1 or less.

[0127] In multiple inductor wirings 110 arranged along the same plane, such as Figure 9 As shown, the diagram includes both regions where the inductor wirings 110 are arranged parallel to each other and regions where they are not arranged parallel to each other. The non-parallel regions create regions where the inductor wirings 110 are close to each other and arranged parallel to each other, and regions where the inductor wirings 110 are separated from each other and arranged parallel to each other. With this configuration, the coupling coefficient can be increased in the regions where the inductor wirings 110 are close to each other, and the coupling coefficient can be decreased in the regions where the inductor wirings 110 are separated from each other. By connecting the regions where the inductor wirings 110 are arranged parallel to each other using the non-parallel regions, the coupling coefficient of the inductor can be controlled in various ways.

[0128] In addition, such as Figure 10B As shown, in the region where the inductor wirings 110 are close to each other, the second magnetic layer 140 has an uneven shape that covers the inductor wirings 110 from three directions. Thus, when viewed in a cross-section orthogonal to the extension direction of the inductor wirings 110, the second magnetic layer 140 has an uneven shape that covers the inductor wirings 110 from two directions parallel to the plane and one direction perpendicular to the plane, thereby enabling it to cover the entire circumference of the inductor wirings 110 together with the first magnetic layer 130, thereby improving the inductor acquisition efficiency.

[0129] In addition, by Figure 9 and Figure 10B As can be seen, when viewed from a vertical direction, the second magnetic layer 140 is positioned further inward than the outer surface of the inductor component 102. Therefore, during monolithic fabrication, there is no concern about damage to the magnetic layer due to cutting. For example, if the magnetic layer is stretched due to mechanical stress during cutting, leakage may occur between the stacked magnetic layers, leading to increased iron loss; however, this problem can be avoided in this embodiment.

[0130] In this embodiment, such as Figure 10AAs shown, the first magnetic layer 130 and the second magnetic layer 140 are not formed in the regions at both ends of the inductor wiring 110 having pad portions 110A and 110B. Therefore, the vertical wiring 120 connected to the pad portions 110A and 110B does not penetrate the magnetic layer. In this embodiment, a magnetic layer is disposed in the regions other than the two ends of the inductor wiring 110.

[0131] (A variation of the second embodiment)

[0132] Next, refer to Figure 11A , Figure 11B as well as Figure 12 A variation of the second embodiment described above will be explained.

[0133] <Variation Example 1>

[0134] First, refer to Figure 11A as well as Figure 11B A variation of the inductor component of the second embodiment will be described. Figure 11A This is a schematic diagram illustrating a modified example 1 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10A A side sectional view of a section at the same location. Figure 11B This is a schematic diagram illustrating a modified example 1 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location.

[0135] In the inductor component 104 of Modified Example 1, the difference from the inductor component 102 of the second embodiment described above is that a third insulating layer 170, serving as an inorganic insulating layer, is further formed on the surface of the stacked second magnetic layer 140. Thus, as... Figure 11A As shown, the sides of the vertical wiring 120 are surrounded by a third insulating layer 170. Figure 11B As shown, the second magnetic layer 140 with its concave-convex shape is also surrounded by a third insulating layer 170.

[0136] The surface 170A of the third insulating layer 170 is formed flush with the end face 120A of the vertical wiring 120, and the external terminal 180 is formed to contact the surface 170A of the third insulating layer 170 and the end face 120A of the vertical wiring 120. The external terminal 180, as described above, can be formed by electrolytic plating, sputtering, electroless plating, or the like.

[0137] As described above, in the modified example 1 of the second embodiment, since the first magnetic layer 130 and the second magnetic layer 140 are covered by the first insulating layer 150A, the second insulating layer 150B, and the third insulating layer 170, the first magnetic layer 130 and the second magnetic layer 140 can be protected from environmental loads (humidity, etc.).

[0138] Furthermore, since the surface of the third insulating layer 170, which covers the second magnetic layer 140 and serves as the outermost surface of the inductor component 104, is formed to be flatter than the uneven shape of the second magnetic layer 140, the coplanarity during installation can be improved. Here, coplanarity refers to the property or state of multiple points existing on the same plane. It is also sometimes referred to as "surface uniformity" or "terminal flatness."

[0139] <Variation Example 2>

[0140] Next, refer to Figure 12 A modified example 2 of the inductor component of the second embodiment will be described. Figure 12 This is a schematic diagram illustrating a modified example 2 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location.

[0141] In the inductor component 106 of Modified Example 2, the inductor wiring 110 extending along the plane is composed of multiple layers. Figure 12 In the example shown, two layers are formed, each consisting of two inductor wirings 110 arranged along a plane. That is, in cross-sectional view, the inductor wirings 110 are arranged in a 2×2 matrix. An insulating material (second insulating layer 150B) is filled between the layers of the inductor wirings 110. However, this is not a limitation; an inductor component 106 can be formed by arranging any number of inductor wirings 110 in a matrix configuration with any number of layers along a plane.

[0142] Thus, when the inductor wiring 110 extending along the plane is used as the first inductor wiring, a second inductor wiring extending along a plane parallel to the plane is also provided. When an insulating material is filled between the first and second inductor wirings, the degree of freedom of the inductor wiring 110 is increased. Furthermore, by filling the inductor wirings 110 with insulating resin, current leakage can be suppressed, and the inductor wirings 110 can be brought closer together, thereby enabling a thin inductor component 106.

[0143] (Inductor component according to the third embodiment of the present invention)

[0144] Next, refer to Figure 14 The inductor component of the third embodiment of the present invention will be described. Figure 14 This is a schematic diagram illustrating an inductor component according to a third embodiment of the present invention, and is shown in relation to... Figure 10B A side sectional view of a section at the same location.

[0145] The inductor component 202 of the third embodiment has the same planar shape as the inductor component 102 of the second embodiment. That is, it includes both regions where the two inductor wirings 210 are arranged parallel to each other and regions where they are not arranged parallel to each other. Figure 14 The middle section represents a cross-section of the area where the wiring 210 of the two inductors are close to each other and arranged in parallel.

[0146] In the inductor component 202 of the third embodiment, the points where the ends 230A of the first magnetic layer 230 and the end 240A of the second magnetic layer 240 have inclined portions are different from those in the inductor component 102 of the second embodiment, which is formed perpendicularly to the ends.

[0147] When the magnetic layers are formed vertically at their ends, it is necessary to perform hole processing on the magnetic layers or change the wiring design in order to change the electrical characteristics of the inductor. However, in the third embodiment, since the ends 230A and 240A of the magnetic layers 230 and 240 have inclined portions that are inclined in a direction perpendicular to the plane in a cross-sectional view orthogonal to the extension direction of the inductor wiring 110, the characteristics of the inductor can be adjusted without performing hole processing or changing the wiring design.

[0148] (Inductor component according to the fourth embodiment of the present invention)

[0149] Next, refer to Figure 15 The inductor component of the fourth embodiment of the present invention will be described. Figure 15 This is a schematic diagram illustrating an inductor component according to a fourth embodiment of the present invention, and is shown in relation to... Figure 2 A side sectional view of a section at the same location.

[0150] The inductor component 302 of the fourth embodiment has the same planar shape as the inductor component 2 of the first embodiment. That is, it is configured as a so-called zigzag inductor that extends in a serpentine shape to depict a smooth curve. However, it is not limited to this, and may also have both regions where the two inductor wires are arranged parallel to each other and regions where they are not arranged parallel to each other, just like the inductor component 102 of the second embodiment.

[0151] In the inductor component 2 of the first embodiment described above, a second insulating layer 50B is formed to surround the inductor wiring 10 formed on the first insulating layer 50A. However, in the inductor component 302 of the third embodiment, the difference is that instead of forming an insulating layer, an organic resin and inorganic filler and a composite part 352 are formed to surround the inductor wiring 30 formed on the insulating layer 350.

[0152] In the inductor component 302 of the fourth embodiment, a magnetic composite portion 352 is provided between the first magnetic layer 330 and the second magnetic layer 340, which are inorganic magnetic layers. This magnetic composite portion 352 comprises an organic resin and an inorganic filler. The composite portion 352 is a composite of an organic resin and a magnetic filler. For example, the organic resin may be epoxy resin, acrylic resin, phenolic resin, or a combination thereof, and the magnetic filler may be ferrite, Fe-based, or Fe alloy. In addition, to adjust the insulation and coefficient of linear expansion, insulating fillers such as silica fillers may be included. Furthermore, in this embodiment, epoxy resin is used as the organic resin, and FeSiCr is used as the inorganic filler.

[0153] By incorporating Si and Cr, the crystallization of the magnetic composite portion 352 generates strain, thereby further improving the permeability of the magnetic layer. In particular, by including Si, the crystallization generates strain, increasing the permeability of the magnetic layer compared to the case with only Fe. Since Cr is easily oxidized, if Cr is present on the surface, surface Cr oxidation prevents oxidation into the interior of the magnetic composite portion 352. Thus, by including Si and Cr in the magnetic composite portion 352, a balance between magnetic saturation and the permeability of the magnetic layer can be achieved, improving the permeability of the magnetic layer and enhancing the reliability of the inductor component 302.

[0154] Reducing the distance between the first magnetic layer 330 and the second magnetic layer 340 increases the permeability of the magnetic layers, but there are concerns about increased eddy currents in the magnetic layers and a decrease in the Q value. Furthermore, the Q value, also known as the Quality Factor, represents the "sharpness" of the signal at the resonant frequency. The ratio of the resistance (R) of the inductor wiring to the inductance L corresponding to the frequency f (R / 2πf・L) is called the loss coefficient, and its reciprocal is the Q value. A higher Q value indicates lower losses, resulting in superior characteristics for high-frequency inductors.

[0155] In the inductor component 302 of this embodiment, since a magnetic composite portion 352 having organic resin and inorganic filler is provided between the first magnetic layer 330 and the second magnetic layer 340, eddy currents can be suppressed even if the distance between the first magnetic layer 330 and the second magnetic layer 340 is reduced, and the inductor component 2 can be made thinner.

[0156] Furthermore, through the magnetic composite portion 352, eddy currents can be suppressed even when the spacing between the first magnetic layer 330 and the second magnetic layer 340 is reduced, thus obtaining a high Q value. Therefore, a thin inductor component 302 can be provided that suppresses eddy currents and obtains a high Q value even when the spacing between the two magnetic layers is reduced.

[0157] (overall)

[0158] As described above, in any of the inductor components 2-8, 102-106, 302, and 402 in the above embodiments, all include: inductor wirings 10, 110, 210, and 310 extending along a plane; pad portions 10A, 10B, 110A, 110B, 210A, 210B, 310A, and 310B located at both ends of the inductor wirings; and vertical wirings 20, 120, 220, and 320 extending from the pad portions 10A, 10B, 110A, 110B, 210A, 210B, and 310B. 0A and 310B extend perpendicularly to the plane; and the first magnetic layers 30, 130, 230, 330 and the second magnetic layers 40, 140, 240, 340 sandwich inductor wiring 10, 110, 210, 310. The first magnetic layers 30, 130, 230, 330 and the second magnetic layers 40, 140, 240, 340 have uniaxial magnetic anisotropy in the same axis. The inductor wiring 10, 110, 210, 310 extends in the entire region without being orthogonal to one of the anisotropic axes (X-axis).

[0159] Since the inductor wirings 10, 110, 210, and 310 extend across the entire area without being orthogonal to one anisotropic axis (X-axis), the influence of one anisotropic axis can be suppressed. Therefore, when the anisotropic axis is oriented towards the long side, the inductance acquisition efficiency can be improved. On the other hand, when the easy axis is oriented towards the long side, the DC superposition characteristics can be improved. Furthermore, since the inductor components 2, 102, 202, and 302 are connected to the external circuit via vertical wirings 20, 120, 220, and 320, the mounting of these components can be effectively achieved.

[0160] This disclosure includes the following methods.

[0161] <1>

[0162] An inductor component comprising:

[0163] Inductor wiring extends along the plane;

[0164] The pads are located at both ends of the aforementioned inductor wiring;

[0165] Vertical wiring extends perpendicularly from the aforementioned pad portion relative to the aforementioned plane; and

[0166] The first magnetic layer and the second magnetic layer sandwich the aforementioned inductor wiring.

[0167] The first magnetic layer and the second magnetic layer described above have uniaxial magnetic anisotropy along the same axis.

[0168] The aforementioned inductor wiring extends throughout the region without being orthogonal to one of the aforementioned anisotropic axes.

[0169] <2>

[0170] According to the inductor component described in <1>, wherein,

[0171] The aforementioned anisotropic axis is the easy axis.

[0172] <3>

[0173] According to the inductor component described in <2>, wherein,

[0174] It has a roughly rectangular shape, and its easy axis is oriented towards the long side of the cuboid.

[0175] The two ends of the aforementioned inductor wiring are separated in the direction of the free axis.

[0176] Viewed from the direction of the aforementioned easy axis, at least a portion of the aforementioned pads at both ends overlap.

[0177] <4>

[0178] The inductor component according to any one of <1> to <3>, wherein,

[0179] The first magnetic layer and the second magnetic layer are composed of a stack of inorganic insulating layer and inorganic magnetic layer. The thickness of the first magnetic layer and the second magnetic layer in the direction orthogonal to the plane is less than the thickness of the inductor wiring.

[0180] <5>

[0181] According to the inductor component described in <4>, wherein,

[0182] The inorganic insulating layer is present on the surface of the first magnetic layer and the second magnetic layer, which are composed of the above-mentioned laminate.

[0183] <6>

[0184] The inductor component according to any one of <1> to <5>, wherein,

[0185] Multiple conductive layers are formed on the end face opposite to the end face that contacts the pad portion of the aforementioned vertical wiring.

[0186] <7>

[0187] The inductor component according to any one of <1> to <6>, wherein,

[0188] The aforementioned vertical wiring penetrates at least one of the aforementioned first magnetic layer and the aforementioned second magnetic layer.

[0189] <8>

[0190] The inductor component according to any one of <1> to <7>, wherein,

[0191] The side of the vertical wiring that faces the direction parallel to the plane is covered by an insulating layer.

[0192] <9>

[0193] The inductor component according to any one of <1> to <8>, wherein,

[0194] It has an external terminal that is connected to the vertical wiring and extends along a plane parallel to the plane. When the plane is viewed from the vertical direction, the external terminal overlaps with at least one of the first magnetic layer and the second magnetic layer.

[0195] <10>

[0196] The inductor component according to any one of <1> to <9>, wherein,

[0197] The first magnetic layer is formed on the inorganic substrate, and the vertical wiring extends through the inorganic substrate.

[0198] <11>

[0199] The inductor component according to any one of <1> to <10>, wherein,

[0200] The aforementioned vertical wiring extends on both sides sandwiching the aforementioned inductor wiring.

[0201] <12>

[0202] The inductor component according to any one of <1> to <11>, wherein,

[0203] Multiple inductor wirings are arranged along the same plane.

[0204] <13>

[0205] The inductor component according to any one of <1> to <12>, wherein,

[0206] Among the plurality of inductor wirings arranged along a plane, there are both regions where the inductor wirings are arranged parallel to each other and regions where the inductor wirings are not arranged parallel to each other.

[0207] <14>

[0208] The inductor component according to any one of claims 1 to 13, wherein,

[0209] When viewed in a cross-section orthogonal to the extension direction of the inductor wiring, the second magnetic layer has an uneven shape covering the inductor wiring from two directions parallel to the plane and one direction perpendicular to the plane.

[0210] <15>

[0211] The inductor component according to any one of <1> to <14>, wherein,

[0212] When viewed from a vertical direction, at least one of the first magnetic layer and the second magnetic layer is arranged inside the outer shape of the inductor component.

[0213] <16>

[0214] According to the inductor component described in <14>, wherein,

[0215] The surface of the insulating layer covering the second magnetic layer, which forms the outermost part of the inductor component, is formed to be flatter than the uneven shape of the second magnetic layer.

[0216] <17>

[0217] The inductor component according to any one of <1> to <16>, wherein,

[0218] When the inductor wiring extending along the aforementioned plane is used as the first inductor wiring, a second inductor wiring extending along a plane parallel to the aforementioned plane is also provided, and an insulating material is filled between the first inductor wiring and the second inductor wiring.

[0219] <18>

[0220] According to the inductor component described in <12>, wherein,

[0221] When the plane is viewed from a vertical direction, at least one of the first magnetic layer and the second magnetic layer overlaps with the wiring of the plurality of inductors, and the ratio of the dimension of the shape of one of the anisotropic axes to the dimension of the other anisotropic axis is in the range of 0.5 or more and 1 or less.

[0222] <19>

[0223] The inductor component according to any one of <1> to <18>, wherein,

[0224] When viewed in a cross-section orthogonal to the extension direction of the inductor wiring, the ends of the first magnetic layer and the second magnetic layer have inclined portions that are inclined in a direction perpendicular to the plane.

[0225] <20>

[0226] The inductor component according to any one of <1> to <19>, wherein,

[0227] The first magnetic layer and the second magnetic layer are inorganic magnetic layers, and a magnetic composite portion is provided between the first magnetic layer and the second magnetic layer. The magnetic composite portion contains organic resin and inorganic filler.

[0228] The description of the above embodiments is illustrative in all respects and is not a limiting structure. Suitable modifications and alterations will be apparent to those skilled in the art. The scope of the invention is not defined by the above embodiments, but by the claims. Furthermore, the scope of the invention includes modifications derived from the embodiments within the scope equivalent to the claims.

[0229] Explanation of reference numerals in the attached figures

[0230] 2, 4, 6, 8… Inductor components; 10… Inductor wiring; 10A, 10B… Pads; 20… Vertical wiring; 20A… End face; 22… Vertical wiring; 30… First magnetic layer; 30A… Inorganic insulating layer (sputtered insulating layer); 30B… Inorganic magnetic layer (sputtered magnetic layer); 40… Second magnetic layer; 50A… First insulating layer; 50B… Second insulating layer; 60… Substrate; 70… Third insulating layer; 70A… Surface; 80… External terminal; 102, 104, 106, 108… Inductor components; 110A, 100B… Pads; 120… Vertical wiring; 120A… End face; 130… First magnetic layer; 140… Second magnetic layer; 150A… First… Insulating layer; 150B…Second insulating layer; 160…Substrate; 170…Third insulating layer; 170A…Surface; 180…External terminal; 202…Inductor component; 210…Inductor wiring; 230…First magnetic layer; 230A…End; 240…Second magnetic layer; 240A…End; 250A…First insulating layer; 250B…Second insulating layer; 260…Substrate; 302…Inductor component; 310…Inductor wiring; 310A, 310B…Pad portion; 320…Vertical wiring; 320A…End face; 330…First magnetic layer; 340…Second magnetic layer; 350…Insulating layer; 352…Composite portion; 360…Substrate; S…Base plate; BH…Through hole.

Claims

1. An inductor component comprising: Inductor wiring extends along the plane; The pads are located at both ends of the aforementioned inductor wiring; Vertical wiring extends perpendicularly from the aforementioned pad portion relative to the aforementioned plane; and The first magnetic layer and the second magnetic layer sandwich the inductor wiring from a direction perpendicular to the aforementioned plane. The first magnetic layer and the second magnetic layer described above have uniaxial magnetic anisotropy along the same axis. The aforementioned inductor wiring extends throughout the region without being orthogonal to one of the anisotropic axes.

2. The inductor component according to claim 1, wherein, The aforementioned anisotropic axis is the easy axis.

3. The inductor component according to claim 2, wherein, It has a roughly rectangular shape, and its easy axis is oriented towards the long side of the cuboid. The two ends of the aforementioned inductor wiring are separated in the direction of the aforementioned free axis. Viewed from the direction of the aforementioned easy axis, at least a portion of the aforementioned pads at both ends overlap.

4. The inductor component according to any one of claims 1 to 3, wherein, The first magnetic layer and the second magnetic layer are composed of a stack of inorganic insulating layer and inorganic magnetic layer. The thickness of the first magnetic layer and the second magnetic layer in the direction orthogonal to the plane is less than the thickness of the inductor wiring.

5. The inductor component according to claim 4, wherein, The inorganic insulating layer is present on the surface of the first magnetic layer and the second magnetic layer, which are composed of the above-mentioned laminate.

6. The inductor component according to any one of claims 1 to 5, wherein, Multiple conductive layers are formed on the end face opposite to the end face that contacts the pad portion of the aforementioned vertical wiring.

7. The inductor component according to any one of claims 1 to 6, wherein, The aforementioned vertical wiring penetrates at least one of the aforementioned first magnetic layer and the aforementioned second magnetic layer.

8. The inductor component according to any one of claims 1 to 7, wherein, The side of the vertical wiring that faces the direction parallel to the plane is covered by an insulating layer.

9. The inductor component according to any one of claims 1 to 8, wherein, It has an external terminal that is connected to the vertical wiring and extends along a plane parallel to the plane. When the plane is viewed from the vertical direction, the external terminal overlaps with at least one of the first magnetic layer and the second magnetic layer.

10. The inductor component according to any one of claims 1 to 9, wherein, The first magnetic layer is formed on the inorganic substrate, and the vertical wiring extends through the inorganic substrate.

11. The inductor component according to any one of claims 1 to 10, wherein, The aforementioned vertical wiring extends on both sides sandwiching the aforementioned inductor wiring.

12. The inductor component according to any one of claims 1 to 11, wherein, Multiple inductor wirings are arranged along the aforementioned plane.

13. The inductor component according to any one of claims 1 to 12, wherein, Among the plurality of inductor wirings arranged along the aforementioned plane, there are both regions where the inductor wirings are arranged parallel to each other and regions where the inductor wirings are not arranged parallel to each other.

14. The inductor component according to any one of claims 1 to 13, wherein, When viewed in a cross-section orthogonal to the extension direction of the inductor wiring, the second magnetic layer has an uneven shape covering the inductor wiring from two directions parallel to the plane and one direction perpendicular to the plane.

15. The inductor component according to any one of claims 1 to 14, wherein, When viewed from a vertical direction, at least one of the first magnetic layer and the second magnetic layer is arranged inside the outer shape of the inductor component.

16. The inductor component according to claim 14, wherein, The surface of the insulating layer covering the second magnetic layer, which forms the outermost part of the inductor component, is formed to be flatter than the uneven shape of the second magnetic layer.

17. The inductor component according to any one of claims 1 to 16, wherein, When the inductor wiring extending along the aforementioned plane is used as the first inductor wiring, a second inductor wiring extending along a plane parallel to the aforementioned plane is also provided, and an insulating material is filled between the first inductor wiring and the second inductor wiring.

18. The inductor component according to claim 12, wherein, When the plane is viewed from a vertical direction, at least one of the first magnetic layer and the second magnetic layer overlaps with the wiring of the plurality of inductors, and the ratio of the dimension of the shape of one of the anisotropic axes to the dimension of the other anisotropic axis is in the range of 0.5 or more and 1 or less.

19. The inductor component according to any one of claims 1 to 18, wherein, When viewed in a cross-section orthogonal to the extension direction of the inductor wiring, the ends of the first magnetic layer and the second magnetic layer have inclined portions that are inclined in a direction perpendicular to the plane.

20. The inductor component according to any one of claims 1 to 19, wherein, The first magnetic layer and the second magnetic layer are inorganic magnetic layers, and a magnetic composite portion is provided between the first magnetic layer and the second magnetic layer. The magnetic composite portion contains organic resin and inorganic filler.

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