Intelligent cooling system

Abstract

This invention discloses an intelligent cooling system for regulating the temperature of a heat-generating component. The system includes a control device and a cooling module. The cooling module includes a drive device controlled by a processor in the control device. The cooling device contacts the heat-generating component and is controlled by the drive device. A temperature sensor is mounted on the cooling device to sense the temperature value generated by the cooling device and transmits the temperature value to the processor. When the processor determines that the temperature value is greater than or equal to a default temperature value, it controls the drive device to lower the temperature of the coolant inside the cooling device. This invention can automatically determine the status of the cooling device and perform cooling only when necessary, effectively saving energy.

Description

Technical Field

[0001] This invention relates to a cooling technology, and more particularly to an intelligent cooling system that can automatically adjust the timing of cooling. Background Technology

[0002] Processors performing artificial intelligence (AI) calculations are computationally intensive and must operate for extended periods, leading to a continuous rise in processor temperature. Inadequate heat dissipation can impact processing speed and, in the long run, shorten the processor's lifespan. Therefore, in addition to improving algorithms, developing more efficient temperature control for processors is a crucial aspect of AI technology development.

[0003] Therefore, an intelligent cooling system is needed that can intelligently adjust the temperature of the water cooling device. Summary of the Invention

[0004] The main objective of this invention is to provide an intelligent cooling system that can automatically determine the status of the cooling device and adjust the temperature of the cooling device only when necessary, thereby avoiding continuous operation of the system for a long time and effectively saving energy.

[0005] This invention provides an intelligent cooling system for regulating the temperature of a heat-generating component. The intelligent cooling system includes a control device and a cooling module. The control device includes a processor. The cooling module is connected to the control device and includes a drive device, a cooling device, and a temperature sensor. The drive device is connected to the processor to receive control from the processor; the cooling device contacts the heat-generating component and is connected to the drive device to receive control from the drive device, and contains a first coolant. The temperature sensor is connected to the processor and disposed on the cooling device to sense the temperature value generated by the cooling device and transmit the temperature value to the processor. When the processor determines that the temperature value is greater than or equal to a default temperature value, it controls the drive device to lower the temperature of the first coolant in the cooling device.

[0006] The feature is that the cooling module further includes a coolant cooling device, which is connected to the drive device and the cooling device, and the coolant cooling device contains a second coolant.

[0007] The feature is that the first outlet of the driving device is connected to the second inlet of the cooling device, the second outlet of the cooling device is connected to the third inlet of the coolant cooling device, and the third outlet of the coolant cooling device is connected to the first inlet of the driving device. When the processor determines that the temperature value is greater than or equal to the default temperature value, it controls the driving device to drive the second coolant in the coolant cooling device to flow to the cooling device, and the first coolant in the cooling device to flow to the coolant cooling device.

[0008] The feature is that the cooling module further includes a plurality of first tubes, which are respectively connected to the first outlet and the second inlet, the second outlet and the third inlet, and the third outlet and the first inlet.

[0009] The feature is that the cooling device is further provided with a heat exchanger containing a third coolant. The first outlet of the driving device is connected to the fourth inlet of the heat exchanger, the fourth outlet of the heat exchanger is connected to the third inlet of the coolant cooling device, and the third outlet of the coolant cooling device is connected to the first inlet of the driving device. When the processor determines that the temperature value is greater than or equal to the default temperature value, it controls the driving device to drive the second coolant in the coolant cooling device to flow to the heat exchanger, and the third coolant in the heat exchanger to flow to the coolant cooling device.

[0010] The feature is that the cooling module further includes a plurality of second tubes, which are respectively connected to the first outlet and the fourth inlet, the fourth outlet and the third inlet, and the third outlet and the first inlet.

[0011] The feature is that the cooling device further includes a heat exchanger containing a third coolant. The fourth outlet of the heat exchanger is connected to the fifth inlet of the coolant cooling device, and the fifth outlet of the coolant cooling device is connected to the fourth inlet of the heat exchanger. A switch assembly is also provided on the fifth outlet or the fifth inlet to connect to the processor and receive control from the processor. When the processor determines that the temperature value is greater than or equal to the default temperature value: The processor controls the switch assembly to turn on, causing the drive unit to propel the second coolant in the coolant cooling device to the heat exchanger, and the third coolant in the heat exchanger to the coolant cooling device; or The processor control switch assembly is turned off, stopping the flow of the second coolant into the heat exchanger.

[0012] The control device is characterized by further including a memory and a power detector. The memory is connected to the processor and has a default temperature value. The power detector is connected to the processor and the drive device to detect the power consumption of the drive device, transmit the power consumption to the processor and store it in the memory, so that the processor can control the power consumption of the drive device according to the power consumption.

[0013] Its distinguishing feature is that the surface of the cooling device is further provided with heat sinks. Attached Figure Description

[0014] Figure 1 This is a system block diagram of the first embodiment of the present invention.

[0015] Figure 2 This is a system block diagram of the second embodiment of the present invention.

[0016] Figure 3 This is a system block diagram of the third embodiment of the present invention.

[0017] Figure 4 This is a system block diagram of the fourth embodiment of the present invention.

[0018] Explanation of main component symbols Intelligent cooling system 1~4 Control device 10 Processor 12 Memory 14 Power Detector 16 Cooling module 20 Drive unit 21 First Exit 210 First entrance 211 Cooling device 22 Second Exit 220 Second entrance 221 Heatsink 222 Temperature sensor 23 Coolant cooling device 24 Third Exit 240 Third entrance 241 Fifth Entrance 242 Fifth Exit 243 Switch assembly 244 First tube body 25 Heat exchanger 26 Fourth Exit 260 Fourth entrance 261 Second tube body 27 Third tube body 28 The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0019] To facilitate understanding and implementation of the present invention by those skilled in the art, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0020] This invention relates to an intelligent cooling system that addresses the problem of overheating caused by electronic components. The intelligent cooling system's cooling device conforms to the electronic components to absorb their heat, and may heat up as a result. The intelligent cooling system can detect the temperature of the cooling device, automatically determine its status, and adjust the temperature only when necessary, preventing prolonged continuous operation and effectively saving energy. It can also record power consumption, allowing for future restrictions on operating the intelligent cooling system with minimal power consumption, effectively stabilizing power usage and preventing unnecessary power consumption.

[0021] The intelligent cooling system of this invention includes several embodiments. Please refer to... Figure 1 This invention describes a first embodiment of an intelligent cooling system 1. The intelligent cooling system 1 can be used to regulate the temperature of heat-generating components, which may be electronic devices, chips, hard drives, processors, or other heat-generating electronic components or devices. The intelligent cooling system 1 includes a control device 10 and a cooling module 20. The control device 10 includes a processor 12, a memory 14, and a power detector 16. The processor 12 is connected to the memory 14 and the power detector 16 respectively to receive signal information provided by the memory 14 and the power detector 16, and the processor 12 controls the operation of the memory 14 and the power detector 16.

[0022] The memory 14 stores a default temperature value. The power detector 16 detects the power consumption of the cooling module 20, transmits the power consumption data to the processor 12, and stores it in the memory 14. This allows the processor 12 to select the most suitable power consumption from multiple power consumption records as a reference for controlling the power consumption of the cooling module 20 in the future. In this embodiment, the most suitable power consumption is the minimum power consumption.

[0023] The cooling module 20 is connected to the control device 10. The cooling module 20 includes a drive device 21, a cooling device 22, a temperature sensor 23, a coolant cooling device 24, and a plurality of first tubes 25. The drive device 21 is connected to the processor 12 to receive control from the processor 12. The drive device 21 connects the cooling device 22 and the coolant cooling device 24 to drive the exchange of coolant between the two devices. In this embodiment, the drive device 21 can be a pump or a valve, etc. When the drive device 21 is a pump, it generates driving force to drive the flow of coolant in the cooling device 24. When the drive device 21 is a valve, the opening of the valve allows the coolant to flow and exchange between the cooling device 22 and the coolant cooling device 24 through thermal convection.

[0024] The cooling device 22 contains a first coolant. In this embodiment, the cooling device 22 can be a coolant tank. The cooling device 22 is used to contact the heating element and remove the heat energy from the heating element. The cooling device 22 is connected to the driving device 21 and is controlled by the driving device 21.

[0025] Temperature sensor 23 is connected to processor 12 and disposed on cooling device 22 to sense the temperature of cooling device 22, generate temperature value, and transmit temperature value to processor 12.

[0026] The coolant cooling device 24 contains a second coolant. The coolant cooling device 24 is connected to the drive device 21 and the cooling device 22.

[0027] In this embodiment, the drive device 21, the cooling device 22, and the coolant cooling device 24 are interconnected. Please refer to [link / reference needed]. Figure 1 The structure of the drive device 21, cooling device 22 and coolant cooling device 24 connected in this embodiment will be described in detail.

[0028] like Figure 1 As shown, the first outlet 210 of the drive device 21 is connected to the second inlet 221 of the cooling device 22 through the first pipe body 25, the second outlet 220 of the cooling device 22 is connected to the third inlet 241 of the coolant cooling device 24 through the first pipe body 25, and the third outlet 240 of the coolant cooling device 24 is connected to the first inlet 211 of the drive device 21 through the first pipe body 25.

[0029] Next, the operation embodiment of the first embodiment will be described. Please refer to [link / reference]. Figure 1 First, the temperature sensor 23 continuously detects the temperature of the cooling device 22 and generates a temperature value, which is then transmitted to the processor 12. Upon receiving the temperature value, the processor 12 reads the default temperature value stored in the memory 14 to determine whether the temperature value is greater than or equal to the default temperature value. In this embodiment, the default temperature value can be 60 degrees Celsius, but it is not limited to this. When the processor 12 determines that the temperature value is greater than or equal to the default temperature value, the processor 12 controls the drive device 21 to operate. The cooling device 22 can also consist of multiple cooling devices 22. The way and structure of connecting multiple cooling devices 22 to the drive device 21 and the coolant cooling device 24 are the same, so they will not be described again. The processor 12 can also simultaneously determine whether the temperature of other multiple cooling devices 22 is greater than or equal to the default temperature value. This default temperature value can be set to 58 degrees Celsius. As long as the cooling device 22 reaches the default temperature value, the processor 12 can control the drive device 21 to operate.

[0030] In this embodiment, the drive device 21 is a pump that drives the second coolant in the coolant cooling device 24 to flow through the first pipe 25 to the cooling device 22, while the first coolant in the cooling device 22 flows through the first pipe 25 to the coolant cooling device 24. When the drive device 21 is a valve, the processor 12 controls the valve to open. Due to the physical characteristics of heat exchange, the second coolant in the coolant cooling device 24 automatically flows through the first pipe 25 to the cooling device 22, and the first coolant in the cooling device 22 flows through the first pipe 25 to the coolant cooling device 24. Through the above-mentioned exchange of coolant, the temperature of the cooling device 22 can be reduced, and the heat energy of the heating component can be removed, thereby achieving the effect of reducing the temperature of the heating component.

[0031] Meanwhile, the power detector 16 can record the power consumption of the drive device 21 and transmit the power consumption data to the processor 12 before storing it in the memory 14. Subsequently, the processor 12 can select the drive device 21 to operate with the minimum power consumption, effectively stabilizing power consumption and avoiding unnecessary power consumption.

[0032] Next, please refer to Figure 2 The following describes the second embodiment of this invention. In this embodiment, the intelligent cooling system 2 includes a control device 10 and a cooling module 20. The structure of the control device 10 is the same as that in the first embodiment, so it will not be described again.

[0033] The cooling module 20 is connected to the control device 10. In this embodiment, the cooling module 20 includes a drive device 21, a cooling device 22, a heat exchanger 26, a temperature sensor 23, a coolant cooling device 24, and a plurality of second tubes 27. The drive device 21 is connected to the processor 12 to receive control from the processor 12. The state, location, and operation of the temperature sensor 23 are the same as in the first embodiment, therefore, the temperature sensor 23 will not be described again in this embodiment.

[0034] In this embodiment, the drive device 21 connects the heat exchanger 26 and the coolant cooling device 24 to drive the coolant in the heat exchanger 26 and the coolant cooling device 24 to exchange coolant. In this embodiment, the drive device 21 can be a pump or a valve, etc. When the drive device 21 is a pump, it can generate driving force to drive the coolant in the coolant cooling device 24 to flow to the heat exchanger 26. When the drive device 21 is a valve, the opening of the valve allows the coolant to flow automatically through thermal convection, exchanging coolant in the heat exchanger 26 and the coolant cooling device 24.

[0035] In this embodiment, the cooling device 22 contains a first coolant, and the cooling device 22 can be a coolant tank. The cooling device 22 is used to contact the heating element and remove the heat energy from the heating element. The coolant cooling device 24 contains a second coolant. The heat exchanger 26 contains a third coolant.

[0036] The coolant cooling device 24 is connected to the drive device 21 and the heat exchanger 26. In the first embodiment, the cooling device 22 removes heat from the heating element through the exchange of the first and second coolants, while in this embodiment, the heat is removed through the heat exchanger 26. Specifically, the first outlet 210 of the drive device 21 is connected to the fourth inlet 261 of the heat exchanger 26 through the second pipe 27, the fourth outlet 260 of the heat exchanger 26 is connected to the third inlet 241 of the coolant cooling device 24 through the second pipe 27, and the third outlet 240 of the coolant cooling device 24 is connected to the first inlet 211 of the drive device 21 through the second pipe 27. The flow of the third coolant contained in the heat exchanger 26 helps to cool the first coolant in the cooling device 22, thereby removing heat from the cooling device 22 and the heating element.

[0037] Next, the operation embodiment of the second embodiment will be described. Please refer to [link / reference]. Figure 2 First, the temperature sensor 23 continuously detects the temperature of the cooling device 22, generates a temperature value, and transmits the temperature value to the processor 12. Next, the processor 12 reads the default temperature value stored in the memory 14 to determine whether the temperature value is greater than or equal to the default temperature value. In this embodiment, the default temperature value can be 60 degrees Celsius, but it is not limited to this. When the processor 12 determines that the temperature value is greater than or equal to the default temperature value, the processor 12 controls the drive device 21 to operate. The cooling device 22 can also be multiple cooling devices 22. The way and structure of multiple cooling devices 22 connecting to the drive device 21 and the coolant cooling device 24 are the same, so they will not be described again. The processor 12 can also simultaneously determine whether the temperature of other multiple cooling devices 22 is greater than or equal to the default temperature value. This default temperature value can be set to 58 degrees Celsius. As long as the cooling device 22 reaches the default temperature value, the processor 12 can control the drive device 21 to operate.

[0038] In this embodiment, the drive device 21 is a pump that drives the second coolant in the coolant cooling device 24 to flow through the second pipe 27 to the heat exchanger 26, while the third coolant in the heat exchanger 26 flows through the second pipe 27 to the coolant cooling device 24. When the drive device 21 is a valve, the processor 12 controls the valve to open. Due to the physical characteristics of heat exchange, the second coolant in the coolant cooling device 24 automatically flows through the second pipe 27 to the heat exchanger 26, while the third coolant in the heat exchanger 26 flows through the second pipe 27 to the coolant cooling device 24. Through the exchange of the coolant, the temperature of the cooling device 22 can be reduced, and the heat energy of the heating element can be removed, thereby achieving the effect of reducing the temperature of the heating element.

[0039] Meanwhile, the power detector 16 can record the power consumption of the drive device 21 and transmit the power consumption data to the processor 12 before storing it in the memory 14. Subsequently, the processor 12 can select the drive device 21 to operate with the minimum power consumption, effectively stabilizing power consumption and avoiding unnecessary power consumption.

[0040] Next, the third embodiment of this case will be described. Please refer to... Figure 3 In this embodiment, the intelligent cooling system 3 includes a control device 10 and a cooling module 20. The structure of the control device 10 is the same as that in the first embodiment, so it will not be described again.

[0041] The cooling module 20 is connected to the control device 10. In this embodiment, the cooling module 20 includes a drive device 21, a cooling device 22, a heat exchanger 26, a temperature sensor 23, a coolant cooling device 24, a plurality of first tubes 25, and a plurality of third tubes 28. The drive device 21 is connected to the processor 12 to receive control from the processor 12. The state, location, and operation of the temperature sensor 23 are the same as in the first embodiment; therefore, the temperature sensor 23 will not be described again in this embodiment.

[0042] In this embodiment, the cooling device 22 contains a first coolant, and the cooling device 22 can be a coolant tank. The cooling device 22 is used to contact the heating element and remove the heat energy from the heating element. The coolant cooling device 24 contains a second coolant. The heat exchanger 26 contains a third coolant.

[0043] In this embodiment, the first outlet 210 of the drive device 21 is connected to the second inlet 221 of the cooling device 22 through the first tube 25, the second outlet 220 of the cooling device 22 is connected to the third inlet 241 of the coolant cooling device 24 through the first tube 25, and the third outlet 240 of the coolant cooling device 24 is connected to the first inlet 211 of the drive device 21 through the first tube 25.

[0044] In the third embodiment, the heat exchanger 26 is disposed within the cooling device 22. The fourth outlet 260 of the heat exchanger 26 is connected to the fifth inlet 242 of the coolant cooling device 24 via the third pipe 28, and the fifth outlet 243 of the coolant cooling device 24 is connected to the fourth inlet 261 of the heat exchanger 26 via the third pipe 28. In this embodiment, a switch assembly 244 is also provided on the fifth outlet 243 or the fifth inlet 242, or on both the fifth outlet 243 and the fifth inlet 242. The switch assembly 244 can be connected to the processor 12 via wired or wireless means to receive control from the processor 12 to turn on or off. In this embodiment, a switch assembly 244 is provided on both the fifth outlet 243 and the fifth inlet 242.

[0045] Next, the operation embodiment of the third embodiment will be described. Please refer to [link / reference]. Figure 3First, the temperature sensor 23 continuously detects the temperature of the cooling device 22, generates a temperature value, and transmits the temperature value to the processor 12. Next, after receiving the temperature value, the processor 12 reads the default temperature value stored in the memory 14 to determine whether the temperature value is greater than or equal to the default temperature value. In this embodiment, the default temperature value can be 60 degrees Celsius, but it is not limited to this. When the processor 12 determines that the temperature value is greater than or equal to the default temperature value, the processor 12 controls the drive device 21 to operate. The cooling device 22 can also be multiple cooling devices 22. The way and structure of multiple cooling devices 22 connecting to the drive device 21 and the coolant cooling device 24 are the same, so they will not be described again. The processor 12 can also simultaneously determine whether the temperature of other multiple cooling devices 22 is greater than or equal to the default temperature value. This default temperature value can be set to 58 degrees Celsius. As long as the cooling device 22 reaches the default temperature value, the processor 12 can control the drive device 21 to operate. In this embodiment, the processor 12 can perform at least three processing methods.

[0046] (1) The processor 12 turns on the switch assembly 244 and starts the drive device 21, causing the drive device 21 to drive the second coolant in the coolant cooling device 24 to flow through the third tube 28 to the heat exchanger 26, and the third coolant in the heat exchanger 26 to flow through the third tube 28 to the coolant cooling device 24. At the same time, the drive device 21 also causes the second coolant in the coolant cooling device 24 to flow through the first tube 25 to the cooling device 22, and the first coolant in the cooling device 22 to flow through the first tube 25 to the coolant cooling device 24.

[0047] (2) The processor 12 can also control the switch assembly 244 to close, so that the second coolant in the coolant cooling device 24 cannot flow through the third tube 28 to the heat exchanger 26. Correspondingly, the third coolant in the heat exchanger 26 cannot flow through the third tube 28 to the coolant cooling device 24. However, the drive device 21 is still driven, so the second coolant in the coolant cooling device 24 can still flow through the first tube 25 to the cooling device 22, and the first coolant in the cooling device 22 can flow through the first tube 25 to the coolant cooling device 24.

[0048] (3) The processor only turns on the switch assembly 244 and does not start the start drive device 21. It only uses the physical characteristics of heat exchange to make the second coolant in the coolant cooling device 24 flow through the third tube 28 to the heat exchanger 26, and the third coolant in the heat exchanger 26 flows through the third tube 28 to the coolant cooling device 24.

[0049] The temperature of the cooling device 22 can be reduced by exchanging the coolant, and the heat energy of the heating element can be removed, thereby reducing the temperature of the heating element.

[0050] Meanwhile, the power detector 16 can record the power consumption of the drive device 21 and transmit the power consumption to the processor 12 and store it in the memory 14. Subsequently, the processor 12 can select the drive device 21 to operate with the least amount of power, effectively stabilizing power consumption and avoiding unnecessary power consumption.

[0051] Next, please refer to Figure 4 This will be used to illustrate the fourth embodiment of the present invention. In this embodiment, the intelligent cooling system 4 includes a control device 10 and a cooling module 20. The structure of the control device 10 is the same as that in the first embodiment, so it will not be described again.

[0052] The cooling module 20 includes a drive unit 21, a cooling device 22, a temperature sensor 23, a coolant cooling device 24, and a plurality of third tubes 28. The fourth embodiment differs from the first embodiment only in the structure of the cooling device 22; the surface of the cooling device 22 is provided with heat sinks 222 to increase heat dissipation efficiency. The remaining structures, connections, and operations of the fourth embodiment are the same as those of the first embodiment, and therefore will not be repeated. Similarly, the heat sinks 222 can also be installed on the cooling devices 22 of the second and third embodiments, and are not limited to the cooling device 22 of the first embodiment.

[0053] As described above, the intelligent cooling system of this invention can solve the problem of overheating caused by heat-generating components. The intelligent cooling system can detect the temperature of the cooling device, automatically determine its status, and only perform heat dissipation when necessary, effectively saving energy. Simultaneously, it can record power consumption and select the option to run the intelligent cooling system with the lowest power consumption in the future, effectively stabilizing power consumption and avoiding unnecessary power consumption.

[0054] In summary, this invention meets the requirements for an invention patent, and therefore a patent application is filed in accordance with the law. However, the above description is merely a preferred embodiment of the invention, and the scope of the invention is not limited to the described embodiments. All equivalent modifications or variations made by those skilled in the art in accordance with the spirit of the invention should be covered within the scope of the following patent application.

Claims

1. An intelligent cooling system for regulating the temperature of a heating component, characterized in that, The intelligent cooling system includes: Control device, including processor; and A cooling module, connected to the control device, the cooling module comprising: A drive unit, connected to the processor, to receive control from the processor; A cooling device, in contact with the heat-generating component and connected to the driving device to be controlled by the driving device, the cooling device containing a first coolant; and A temperature sensor is connected to the processor and disposed on the cooling device to sense the temperature value generated by the cooling device and transmit the temperature value to the processor; when the processor determines that the temperature value is greater than or equal to a default temperature value, it controls the drive device to reduce the temperature of the first coolant in the cooling device.

2. The intelligent cooling system as described in claim 1, characterized in that, The cooling module also includes a coolant cooling device connected to the drive device and the cooling device, wherein the coolant cooling device contains a second coolant.

3. The intelligent cooling system as described in claim 2, characterized in that, The first outlet of the drive device is connected to the second inlet of the cooling device, the second outlet of the cooling device is connected to the third inlet of the coolant cooling device, and the third outlet of the coolant cooling device is connected to the first inlet of the drive device. When the processor determines that the temperature value is greater than or equal to the default temperature value, it controls the drive device to drive the second coolant in the coolant cooling device to flow to the cooling device, and the first coolant in the cooling device to flow to the coolant cooling device.

4. The intelligent cooling system as described in claim 3, characterized in that, The cooling module also includes a plurality of first tubes, which are respectively connected to the first outlet and the second inlet, the second outlet and the third inlet, and the third outlet and the first inlet.

5. The intelligent cooling system as described in claim 2, characterized in that, The cooling device also includes a heat exchanger containing a third coolant. The first outlet of the drive device is connected to the fourth inlet of the heat exchanger, and the fourth outlet of the heat exchanger is connected to the third inlet of the coolant cooling device. The third outlet of the coolant cooling device is connected to the first inlet of the drive device. When the processor determines that the temperature value is greater than or equal to the default temperature value, it controls the drive device to drive the second coolant in the coolant cooling device to flow to the heat exchanger, and the third coolant in the heat exchanger flows to the coolant cooling device.

6. The intelligent cooling system as described in claim 5, characterized in that, The cooling module also includes a plurality of second tubes, which are respectively connected to the first outlet and the fourth inlet, the fourth outlet and the third inlet, and the third outlet and the first inlet.

7. The intelligent cooling system as described in claim 3, characterized in that, The cooling device also includes a heat exchanger containing a third coolant. The fourth outlet of the heat exchanger is connected to the fifth inlet of the coolant cooling device, and the fifth outlet of the coolant cooling device is connected to the fourth inlet of the heat exchanger. A switch assembly is also provided on the fifth outlet and the fifth inlet, connecting to and receiving control from the processor. When the processor determines that the temperature value is greater than or equal to the default temperature value: The processor controls the switch assembly to turn on, causing the drive device to drive the second coolant in the coolant cooling device to flow to the heat exchanger, and the third coolant in the heat exchanger to flow to the coolant cooling device. or The processor controls the switching assembly to close, stopping the flow of the second coolant into the heat exchanger.

8. The intelligent cooling system as described in claim 7, characterized in that, The cooling module also includes a plurality of third tubes, which are respectively connected to the fourth outlet and the fifth inlet, and the fifth outlet and the fourth inlet.

9. The intelligent cooling system as described in claim 1, characterized in that, The control device further includes: A memory, connected to the processor, stores the default temperature value; and A power detector is connected to the processor and the drive device to detect the power consumption of the drive device, transmit the power consumption to the processor and store it in the memory, so that the processor can control the power consumption of the drive device according to the power consumption.

10. The intelligent cooling system as described in claim 1, characterized in that, The surface of the cooling device is also provided with heat sinks.

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