Method of designing microchannel for a vapor chamber, product and storage medium

Abstract

This application discloses a microchannel design method, product, and medium for a heat exchanger, comprising: receiving design constraint parameters; the design constraint parameters including: surface design domain parameters of the heat exchanger and initial shape parameters of the trenches; forming an initial microchannel layout diagram with multiple trenches deployed within the surface design domain according to the surface design domain parameters and the initial shape parameters of the trenches; solving for the optimal curve shape parameters based on a preset parameterized model between the curve shape parameters of the trenches and the heat dissipation efficiency of the heat exchanger, with the goal of maximizing the heat dissipation efficiency of the heat exchanger; and obtaining a microchannel design diagram of the heat exchanger based on the optimal curve shape parameters; wherein, the curve shape parameters characterize the bending morphology of the trenches.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, and in particular to a heat spreader microchannel design method, product and storage medium. Background Technology In practical applications of electronic products, such as mobile phone thermal imaging products, the circuit boards carrying their chips inevitably generate a large amount of heat during operation, which can easily lead to severe overheating. To ensure the normal operation of the product and extend its service life, corresponding heat dissipation devices need to be designed to quickly reduce the product temperature and improve heat dissipation efficiency.

[0002] However, existing electronic products, such as mobile phone thermal imaging products, mostly rely on the back cover for heat dissipation. This method has many drawbacks: on the one hand, heat tends to concentrate in localized areas of the back cover, leading to uneven heat dissipation; on the other hand, the back cover has low heat dissipation efficiency, failing to achieve efficient heat diffusion, resulting in poor overall heat dissipation. This ultimately leads to severe overheating of the electronic product, not only seriously affecting the user experience but also potentially causing damage to core components such as chips due to overheating. Summary of the Invention

[0003] To address the existing technical problems, this application provides a vapor chamber microchannel design method, product, and medium that can improve the heat dissipation efficiency of electronic products.

[0004] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows: In a first aspect, embodiments of this application provide a method for designing a heat spreader microchannel, including: Receive design constraint parameters; the design constraint parameters include: surface design domain parameters of the heat spreader and initial shape parameters of the trench; Based on the surface design domain parameters and the initial shape parameters of the trenches, an initial microchannel layout diagram is formed in which multiple trenches are deployed within the surface design domain. Based on a parameterized model relating the preset groove curve shape parameters to the heat dissipation efficiency of the heat spreader, the optimal curve shape parameters are solved with the goal of maximizing the heat dissipation efficiency of the heat spreader, and the microchannel design diagram of the heat spreader is obtained based on the optimal curve shape parameters. The curve shape parameter characterizes the bending morphology of the groove.

[0005] Secondly, embodiments of this application provide a computer program product, including a computer program that, when executed by a processor, implements the heat spreader microchannel design method described in any embodiment of this application.

[0006] Thirdly, embodiments of this application provide a computer-readable storage medium, including a computer program stored on the computer-readable storage medium, wherein when the computer program is executed by a processor, it implements the heat spreader microchannel design method described in any embodiment of this application.

[0007] In the heat exchanger microchannel design method provided in the above embodiments, design constraint parameters are received, including: first, surface design domain parameters for defining the arrangement range of heat exchanger microchannels; and second, initial groove shape parameters for determining the basic morphology of the microchannels. Based on the surface design domain parameters and the initial groove shape parameters, the arrangement planning of multiple grooves within the surface design domain of the heat exchanger is completed to form an initial microchannel layout diagram. For the grooves in the layout diagram, curve shape parameters for characterizing their curved bending shape are extracted, and a parameterized model between the curve shape parameters and the heat dissipation efficiency of the heat exchanger is established in advance. Based on the parameterized model, the optimal curve shape parameters are solved with the optimization objective of maximizing the heat dissipation efficiency of the heat exchanger, and the optimal curve shape parameters are applied to the initial microchannel layout to obtain a heat exchanger microchannel design diagram that meets the heat dissipation performance requirements.

[0008] Furthermore, the surface design parameters may include indicators such as the surface boundary dimensions of the heat spreader, and the initial shape parameters of the trenches may include parameters such as trench length, width, and number. The curve shape parameters may include specific parameters such as radius of curvature and bending angle. Based on the heat spreader microchannel design method provided in this application embodiment, a heat spreader microchannel design diagram maximizing the heat dissipation efficiency of the heat spreader is obtained. The heat spreader prepared using the obtained heat spreader microchannel design diagram can be placed between the mobile phone thermal imaging circuit board and the back cover for auxiliary heat dissipation. By optimizing the shape design of the microchannels on the heat spreader, the heat exchange performance of mobile phone thermal imaging products can be effectively improved, alleviating the problem of severe overheating in various product models and ensuring the stable and reliable operation of mobile phone thermal imaging products. The heat spreader microchannel design method, through a complete process of constraint input, initial layout, model establishment, and optimization solution, realizes the feasibility and standardization of microchannel design, as well as the maximization of heat dissipation efficiency of the heat spreader, combining scientific rigor and practicality. This effectively improves the heat dissipation efficiency of electronic products, such as mobile phone thermal imaging products, ensuring the stable and reliable operation of electronic products.

[0009] In the above embodiments, the computer program product, the computer-readable storage medium, and the corresponding vapor chamber microchannel design method embodiments belong to the same concept and thus have the same technical effects as the vapor chamber microchannel design method embodiments, and will not be described again here. Attached Figure Description

[0010] Figure 1 A schematic diagram of a microchannel design method for a heat spreader; Figure 2A flowchart of a vapor chamber microchannel design method as an optional specific example; Figure 3 This is a schematic diagram of a structure in which multiple trenches are arranged in a straight parallel pattern in one embodiment; Figure 4 This is a schematic diagram of a structure in another embodiment where multiple trenches are arranged in a grid pattern. Figure 5 This is a schematic diagram of a structure in another embodiment where multiple grooves are arranged in parallel curves. Detailed Implementation

[0011] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0012] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0013] In the following description, the phrase "some embodiments" refers to a subset of all possible embodiments. It should be noted that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0014] In the following description, the terms "first, second, and third" are used merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, and third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0015] Please see Figure 1 The heat exchanger microchannel design method provided in one embodiment of this application includes the following steps: S101, Receive design constraint parameters; the design constraint parameters include: surface design domain parameters of the heat spreader and initial shape parameters of the trench.

[0016] S103, according to the surface design domain parameters and the initial shape parameters of the trench, an initial microchannel layout diagram is formed in which multiple trenches are deployed within the surface design domain.

[0017] S105, based on the parameterized model between the preset groove curve shape parameters and the heat dissipation efficiency of the heat spreader, the optimal curve shape parameters are solved with the goal of maximizing the heat dissipation efficiency of the heat spreader, and the heat spreader microchannel design diagram is obtained according to the optimal curve shape parameters; wherein, the curve shape parameters characterize the bending shape of the groove.

[0018] A vapor chamber is a highly efficient heat dissipation element based on two-phase vapor-liquid heat transfer. It typically consists of upper and lower cover plates, capillary structures, support columns, and a working fluid. The capillary structures mainly consist of microchannels or grooves. The working fluid primarily includes water and ethanol. The working principle of a vapor chamber is as follows: different sides or different parts of the same side of the upper and lower cover plates form a heat source end in contact with the heat source and a cold source end away from the heat source end. The working fluid evaporates and absorbs heat at the heat source end and condenses and releases heat at the cold source end. The capillary force of the capillary structure facilitates the return flow of the working fluid from the condensation end to the heat source end, thereby rapidly dissipating heat and achieving temperature uniformity. Grooves are recessed structures machined on the surface of the vapor chamber, forming the basic shape of the microchannels. The cross-section of the grooves can be rectangular, trapezoidal, triangular, etc., with characteristic dimensions generally on the micrometer scale, providing a capillary return path for the working fluid. Microchannels are tiny flow paths with characteristic dimensions on the micrometer scale, used for working fluid transport and heat exchange. In this design method, microchannels refer to closed or semi-closed flow channels formed by grooves for capillary reflux of the working fluid inside the heat exchanger.

[0019] Design constraint parameters refer to the basic parameters required for designing microchannels in a vapor chamber. In this embodiment, the design constraint parameters include surface design domain parameters of the vapor chamber and initial trench shape parameters. The surface design domain parameters of the vapor chamber are the boundary limiting parameters of the microchannel arrangement range on the vapor chamber, typically including geometric dimensions such as length, width, thickness, and height of the microchannel arrangement range. The initial trench shape parameters are the basic morphological parameters of the trenches that constitute the basic form of the microchannels, and may include parameters such as the cross-sectional shape, width, spacing, and orientation of the trenches. The curve shape parameters are parameters used to characterize the bending morphology of the trenches, including but not limited to the radius of curvature, rate of change of curvature, bending angle, arc length ratio, and inflection point coordinates of the trench centerline. In the design of vapor chamber microchannels, adjusting the curve shape parameters can change the bending path of the trenches, thereby affecting the flow path of the working fluid inside the vapor chamber and altering the heat dissipation efficiency of the vapor chamber.

[0020] The heat dissipation efficiency of a vapor chamber refers to its heat transfer capacity per unit time and unit temperature difference, and is an indicator of its heat dissipation performance. The parameterized model between the groove curve shape parameters and the vapor chamber heat dissipation efficiency is a mathematical model that establishes a quantitative correspondence between these parameters, based on mathematical modeling methods. This parameterized model can be constructed through theoretical derivation, numerical simulation (such as CFD (fluid dynamics) simulation), and experimental fitting, using preset curve shape parameters as variables and vapor chamber heat dissipation efficiency as the dependent variable to establish a mapping relationship between the curve shape parameters and the efficiency, providing a computational basis for finding the optimal curve shape parameters. The vapor chamber microchannel design drawing refers to the engineering drawing that directly guides the fabrication and manufacturing of the vapor chamber microchannel after the optimal curve shape parameters have been determined. A vapor chamber microchannel design typically includes detailed parameters such as the final layout location, bending path, cross-sectional dimensions, slot spacing, and inflection point coordinates of the microchannels (grooves), as well as boundary dimension annotations for the surface design domain. This meets the requirements of subsequent etching, milling, and other processing techniques. CFD (Computational Fluid Dynamics) simulation refers to a simulation technique that uses numerical calculation methods to solve the governing equations of fluid flow and heat transfer, simulating the flow state, temperature distribution, and heat transfer process of the working fluid inside the vapor chamber. In vapor chamber microchannel design, using CFD simulation to build a parametric model, verify the vapor chamber's heat dissipation efficiency, and optimize the microchannel design can avoid the cost and cycle time losses caused by repeated experiments. The optimal curve shape parameter refers to the curve shape parameter obtained through parametric modeling within the range of design constraints, which maximizes the vapor chamber's heat dissipation efficiency or meets the set range of heat dissipation efficiency requirements.

[0021] In the heat exchanger microchannel design method provided in the above embodiments, design constraint parameters are received. These parameters include: first, surface design domain parameters used to define the microchannel arrangement range of the heat exchanger; and second, initial groove shape parameters used to determine the basic morphology of the microchannels. Based on the surface design domain parameters and the initial groove shape parameters, the arrangement of multiple grooves within the surface design domain of the heat exchanger is planned to form an initial microchannel layout diagram. For the grooves in the layout diagram, curve shape parameters are extracted to characterize their curvature, and a parameterized model is established between the curve shape parameters and the heat dissipation efficiency of the heat exchanger. Based on the parameterized model, the optimal curve shape parameters are solved with the goal of maximizing the heat dissipation efficiency of the heat exchanger, and these optimal curve shape parameters are applied to the initial microchannel layout to obtain a heat exchanger microchannel design diagram that meets the heat dissipation performance requirements. Specifically, the surface design domain parameters may include indicators such as the surface boundary dimensions of the heat exchanger, the initial groove shape parameters may include parameters such as groove length, width, and number, and the curve shape parameters may be refined into specific parameters such as radius of curvature and bending angle. This invention aims to introduce an ultra-thin vapor chamber with microchannels between the thermal imaging circuit board and the back cover of a mobile phone to assist in heat dissipation. By optimizing the shape design of the microchannels on the ultra-thin vapor chamber, the heat exchange performance of mobile phone thermal imaging products is significantly improved, alleviating the problem of severe overheating in various product models and ensuring the stable and reliable operation of mobile phone thermal imaging products. This vapor chamber microchannel design method, through a complete process of constraint input, initial layout, model establishment, and optimization solution, achieves the feasibility and standardization of microchannel design, as well as maximizing the heat dissipation efficiency of the vapor chamber. It combines scientific rigor and practicality, thereby significantly improving the heat dissipation efficiency of electronic products, such as mobile phone thermal imaging products, and ensuring their stable and reliable operation.

[0022] Optionally, the surface design domain parameters of the heat spreader include: The surface boundary length and surface boundary width of the heat spreader.

[0023] The surface design parameters of the heat spreader can specifically include the surface boundary length and surface boundary width values, which define the area for arranging microchannels on the heat spreader. The surface boundary length refers to the maximum extension dimension of the effective heat dissipation plane of the heat spreader along a specified direction (such as the length direction of the heat spreader), while the surface boundary width is the maximum extension dimension along another direction perpendicular to the length direction (such as the width direction of the heat spreader). Together, they define the size and shape of the two-dimensional planar space on the surface of the heat spreader where microchannel trenches can be planned and arranged. By specifying the exact values ​​of these two parameters, the boundary range of the microchannel layout can be determined, preventing the trench design from exceeding the effective heat dissipation area of ​​the heat spreader.

[0024] Optionally, step S103 includes: The surface design domain is determined based on the surface design domain parameters; the surface design domain parameters of the heat spreader include the surface boundary length value and the surface boundary width value of the heat spreader. Based on the initial shape parameters of the trench, determine the target shape of the trench; According to the equal division rule, the surface design domain is divided using the groove of the target shape as the graphic repeating unit to obtain the initial microchannel layout diagram.

[0025] The surface design parameters of the heat spreader can specifically include the surface boundary length and surface boundary width values, which define the area for arranging microchannels on the heat spreader. The surface boundary length refers to the maximum extension dimension of the effective heat dissipation plane of the heat spreader along a specified direction (such as the length direction of the heat spreader), while the surface boundary width is the maximum extension dimension along another direction perpendicular to the length direction (such as the width direction of the heat spreader). Together, they define the size and shape of the two-dimensional planar space on the surface of the heat spreader where microchannel trenches can be planned and arranged. By specifying the exact values ​​of these two parameters, the boundary range of the microchannel layout can be determined, preventing the trench design from exceeding the effective heat dissipation area of ​​the heat spreader.

[0026] The regular arrangement of trenches is achieved through the collaborative constraints of two types of parameters: surface design domain parameters and initial trench shape parameters. Specifically, this involves: using surface design domain parameters, such as the length and width of the heat spreader surface boundary, to delineate the effective area for microchannel placement, thus clarifying the specific range and boundaries of the surface design domain and preventing subsequent trench layout from exceeding the physical size limitations of the heat spreader; simultaneously, using preset initial trench shape parameters, such as the trench cross-sectional shape, width, spacing, and orientation, to form the target shape of the trench, i.e., the trench pattern repeating unit. Based on this, following an equal division rule, the trench pattern repeating unit is evenly divided and arranged within the defined surface design domain, so that multiple trenches are evenly and orderly distributed along the length or width direction of the surface design domain with equal spacing, forming the initial microchannel layout diagram.

[0027] Optionally, the step of dividing the surface design domain according to the equal division rule, using the grooves of the target shape as graphic repeating units to obtain an initial microchannel layout map, includes: Based on the boundary length and width values ​​of the surface design domain, using the target-shaped grooves as graphic repeating units, the length, width, estimated number of grooves, and spacing between adjacent grooves are determined to obtain an initial microchannel layout diagram; or, The design constraint parameters also include the number of grooves; based on the boundary length value, boundary width value, and number of grooves of the surface design domain, the length, width, and spacing between adjacent grooves are determined using the grooves of the target shape as graphic repeating units to obtain the initial microchannel layout diagram.

[0028] An initial microchannel layout pattern is obtained by using grooves of the target shape as pattern repeating units. Specifically, this can include the following two parallel implementation methods: The first implementation uses the boundary length and width values ​​of the surface design domain as basic spatial constraints. Simultaneously, it treats the grooves of the target shape as graphic repeating units, dividing the surface design domain space using equal division rules. Combining this with the basic morphological parameters of the groove target shape, it reverse-calculates the estimated number of grooves that can be accommodated within the surface design domain. Simultaneously, it determines the actual length and width of each groove, as well as the equal spacing between adjacent grooves, ultimately forming an initial microchannel layout diagram. This method eliminates the need to pre-define the number of grooves, autonomously adapting to the size of the surface design domain space and the target shape of the grooves, ensuring maximum space utilization.

[0029] In the second implementation, when the design constraints also include the number of grooves, the boundary length and width of the surface design domain are used as the spatial basis, and the preset number of grooves is taken as a premise. Similarly, the grooves of the target shape are used as graphic repeating units and arranged according to the equal division rule. Based on the boundary length and width of the surface design domain and the preset number of grooves, the equal spacing between two adjacent grooves is calculated, and the length and width of each groove are determined, ensuring that all preset number of grooves are evenly and orderly distributed within the surface design domain, ultimately generating the initial microchannel layout diagram. This method can strictly match the preset number of grooves, meeting the design specifications for specific scenarios. For example, a nonlinear mapping relationship between groove geometric parameters and heat dissipation efficiency of the heat sink can be established through parametric analysis. For parallel or grid microchannel grooves, the length of each parallel or grid microchannel groove can be uniformly determined through parametric analysis. ,width and the spacing between two adjacent lines All parallel or mesh microchannel trenches have the same length, width, and spacing. The influence of trench geometry parameters on the heat dissipation efficiency of the heat exchanger is explored by adjusting the values ​​of Ls, Ws, and ds. The nonlinear input-output relationship between these values ​​and the heat dissipation efficiency of the heat exchanger is established using simulation software, as shown in the following equation: in, For the heat dissipation efficiency of the heat sink, the function f (·) represents the nonlinear mapping relationship obtained by fitting simulation data, with the length of the trench as the input. With width The output is the corresponding heat dissipation efficiency of the heat sink. Using simulation modeling, Ls, Ws, and... The nonlinear relationship between them provides a quantitative basis for the subsequent construction of a complete parametric model and optimization of curve shape parameters.

[0030] Both of the above implementation methods are based on the principle of equal division to achieve a regular arrangement of trenches. The specific method can be flexibly selected according to actual design requirements to ensure the rationality and standardization of the initial layout of the microchannel.

[0031] Optionally, the method for establishing the parameterized model includes: Using the length, width, and spacing between two adjacent trenches as input parameters, a parameterized relationship is established between the curve shape parameters of the trenches and the heat dissipation efficiency of the heat spreader. Based on the parametric relationship, the corresponding heat dissipation efficiency value of the heat spreader is obtained by simulating the heat dissipation through fluid dynamics heat dissipation simulation method. A mathematical expression is formed by data fitting, and a parametric model between the curve shape parameters of the trench and the heat dissipation efficiency of the heat spreader is obtained.

[0032] The construction of the parameterized model mainly involves defining input parameters, performing simulation analysis and verification, and using data fitting modeling to establish a quantifiable correlation between the curve shape parameters and the heat dissipation efficiency of the heat exchanger. Specifically, this can be achieved by first using the length, width, and spacing between adjacent grooves as basic input parameters to define the basic constraints, and then using the curve shape parameters representing the groove's curvature as variables to establish a preliminary parameterized relationship between the curve shape parameters and the heat dissipation efficiency of the heat exchanger. Based on this preliminary parameterized relationship, and relying on fluid dynamics heat dissipation simulation methods, simulation models are built for the groove structures corresponding to different curve shape parameters to simulate the fluid flow state and heat transfer process inside the grooves during heat exchanger operation. The heat dissipation efficiency values ​​of the heat exchanger under different curve shape parameters are output, forming a complete dataset matching the curve shape parameters and the heat dissipation efficiency of the heat exchanger. Finally, this dataset is subjected to data fitting processing. Mathematical algorithms such as polynomial fitting and response surface fitting are used to fit the discrete simulation data, generating a mathematical expression that accurately describes the quantitative correlation between the curve shape parameters and the heat dissipation efficiency of the heat exchanger, thus obtaining the final parameterized model between the groove curve shape parameters and the heat dissipation efficiency of the heat exchanger.

[0033] Optionally, the method for establishing the parameterized model includes: Keeping the width of the groove constant, the curve change form of the groove is determined by the curve distance function. Based on the fluid dynamics heat dissipation simulation method, the heat dissipation efficiency value of the heat exchange plate corresponding to the groove shape under different values ​​of the curve distance function is simulated, and the correspondence between the curve distance function and the heat dissipation efficiency of the heat exchange plate is constructed. Using the initial shape parameters of the trench as the coefficient factors of each trigonometric function term in the multi-order trigonometric function expansion, the curve distance function is parametrically modeled by using the multi-order trigonometric function discrete expansion method, and a mapping relationship between the curve shape parameters of the trench and the curve distance function is established. Based on the mapping relationship and the correspondence between the curve distance function and the heat dissipation efficiency of the heat exchanger, a parameterized model of the relationship between the curve shape parameters and the heat dissipation efficiency of the heat exchanger is obtained.

[0034] In the above embodiments, a precise quantitative mapping relationship between curve shape parameters and heat dissipation efficiency of the vapor chamber is constructed through the logic of defining curve variation forms, parameterizing function modeling, and propagating correlations. Specifically, this can be achieved by: keeping the trench width as a fundamental parameter constant, first using the curve distance function L( The curve variation of the trench is clearly defined, and its implicit function is: Where F represents the actual curve shape of the trench, L( ) is the curve distance function.

[0035] Furthermore, relying on fluid dynamics heat dissipation simulation methods, the distance function L( of this curve) is analyzed. The heat dissipation simulation was performed on the trench shapes corresponding to different values, and the heat dissipation efficiency of the heat sink under each trench shape was output, thereby establishing a one-to-one correspondence between the curve distance function and the heat dissipation efficiency of the heat sink. Then, the initial shape parameters of the trench were used as coefficient factors of each trigonometric function term in the multi-order trigonometric function expansion, and the curve distance function L( Parametric modeling is performed to establish a direct mapping relationship between the curve shape parameters of the trench and the curve distance function. Finally, based on the established mapping relationship between the curve shape parameters and the curve distance function, as well as the correspondence between the curve distance function and the heat dissipation efficiency of the heat exchange plate, a closed loop is formed through relationship transmission, and finally a parametric model of the influence of the change of the trench curve shape parameters on the heat dissipation efficiency of the heat exchange plate is obtained.

[0036] Optionally, the curve distance function is parametrically modeled using a multi-order trigonometric function discretization method, and the mapping relationship between the curve shape parameters of the trench and the curve distance function is established as follows: in, The amplitude of a higher-order trigonometric function. Here, m is the curve shape parameter, m is the total order of the multi-order trigonometric function expansion, and n is the number of orders traversed from 1 to m. Pi is a constant.t For parameter variables, t ∈[0,1], parameter variable t It can represent the variation along the length direction, and sin is the sine function.

[0037] In the above embodiments, the curve distance function is discretized using multi-order trigonometric functions. Parametric modeling is performed to achieve a quantitative description of the morphology of parallel curves or mesh microchannel trenches, and a nonlinear mapping relationship between multi-order curve shape parameters and curve distance functions is established.

[0038] in, represents the curve distance function, used to describe the curve shape of parallel curves or grid microchannel trenches along the length direction, i.e. the bending offset law of the trench; m represents the total order of the multi-order trigonometric function expansion. The higher the order, the higher the accuracy of the expansion in describing the trench curve shape; n represents the order traversal variable, taking a positive integer value from 1 to m, corresponding to the basis functions of each order of trigonometric function. This represents the shape parameters of a multi-order curve, used to adjust the contribution weights of trigonometric basis functions of various orders. Its value changes directly affect the final characteristics of the groove curve shape. It represents the amplitude of higher-order trigonometric functions, used to define the inherent fluctuation amplitude of the basis functions of the corresponding order trigonometric functions, and determines the degree of fluctuation of each order waveform in the curve shape; The term represents the trigonometric basis functions of different orders n. The basis functions of different orders n have different periods and are used to describe the fluctuation characteristics of different frequencies in the shape of the curve. t represents the parameter variable, which takes the value range t∈[0,1]. It represents the positional proportion along the length of the groove. For example, t=0 represents the starting point of the groove, and t=1 represents the ending point of the groove. The continuous change of t can reflect the continuous fluctuation law of the curve shape along the length of the groove. π is the constant of pi. sin is the sine function.

[0039] By using the above-mentioned multi-order trigonometric function discretization, the curve shape of parallel curves or mesh microchannel trenches can be transformed into curve shape parameters. Quantitative regulation, through adjustment The value of can change the contribution weights of the trigonometric basis functions of different orders, thereby obtaining curve distance functions of different shapes. This enables parametric control of the groove curve morphology.

[0040] Optionally, based on the mapping relationship and the correspondence between the curve distance function and the heat dissipation efficiency of the heat spreader, the parameterized model between the curve shape parameter and the heat dissipation efficiency of the heat spreader is obtained as follows: in, Here, m is the curve shape parameter, m is the total order of the multi-order trigonometric function expansion, and n is the number of orders traversing from 1 to m. The upper and lower limits are and , To improve the heat dissipation efficiency of the heat spreader. The objective function of the parameterized model is the negative of the heat dissipation efficiency of the heat sink. The amplitude of a higher-order trigonometric function. Pi is a constant. t For parameter variables, t ∈[0,1], this variable represents the variation along the length direction, and sin is the sine function.

[0041] Based on the aforementioned correspondence between the curve distance function and the heat dissipation efficiency of the heat exchanger, as well as the mapping relationship between the curve shape parameter and the curve distance function, a parameterized model between the curve shape parameter and the heat dissipation efficiency of the heat exchanger can be constructed.

[0042] in, The objective function represents the curve shape parameters to be optimized, which are the sets of curve shape parameters corresponding to each order in the multi-order trigonometric function expansion. These parameters are the variables that control the shape of the groove curve. =- In The heat dissipation efficiency of the vapor chamber is represented by the curve distance function. The corresponding groove morphology was obtained through hydrodynamic heat dissipation simulation. Since the optimization objective of this model is to maximize the heat dissipation efficiency of the heat exchanger, the objective function is... Set as the inverse of the heat dissipation efficiency of the heat exchanger, and minimize this inverse to achieve the actual requirement of maximizing the heat dissipation efficiency of the heat exchanger. = Constraint condition 1 is the multi-order trigonometric function expansion of the curve distance function, which represents the mapping relationship between the aforementioned curve shape parameters and the curve distance function, and is used to constrain the curve shape parameters. Distance function of groove curve morphology The correspondence; ≤ Constraint 2 represents the curve shape parameters. The range of values ​​is constrained, where They are respectively The lower and upper limits are used to ensure that the parameter values ​​comply with the processing technology and physical space constraints of the microchannel trench; m is the total order of the multi-order trigonometric function expansion; n is the order traversal variable, with values ​​ranging from 1 to m; t represents the amplitude of a higher-order trigonometric function, used to define the inherent fluctuation amplitude of each order of the basis functions of each order of trigonometric functions; t∈[0,1] is a parameter variable, representing the positional proportion along the length of the groove; π is the constant of pi; sin is the sine function.

[0043] In the above embodiments, the logic of the parameterized model of the curve shape parameter and the heat dissipation efficiency of the heat sink is as follows: using the curve shape parameter As the control object, the curve shape of the trench is associated with constraint 1 and constraint 2, i.e., the curve distance function. Then through the objective function The heat dissipation efficiency of the heat sink is ultimately achieved by optimizing the curve shape parameters. The design goal is to obtain the groove curve shape that maximizes the heat dissipation efficiency of the heat sink.

[0044] Optionally, the parameterized model based on the preset groove curve shape parameters and the heat dissipation efficiency of the heat spreader, aiming to maximize the heat dissipation efficiency of the heat spreader, solves for the optimal curve shape parameters, including: Using curve shape parameters as optimization variables, maximizing the heat dissipation efficiency of the heat exchanger as the optimization objective, and the upper and lower limits of the curve shape parameters as constraints, different curve shape parameters and corresponding heat dissipation efficiency values ​​of the heat exchanger are calculated using a fluid dynamics heat dissipation simulation method. An objective function is constructed based on the curve shape parameters and the corresponding heat dissipation efficiency value of the heat sink. The optimal curve shape parameters are then determined by using a particle swarm optimization algorithm.

[0045] In the above embodiments, the optimal curve shape parameters are solved with the goal of maximizing the heat dissipation efficiency of the heat exchanger. The optimization method is achieved by combining direct calculation through fluid dynamics heat dissipation simulation with intelligent algorithm optimization, ensuring that the optimization process is based on real physical field calculations and the results are accurate and reliable.

[0046] Using the curve shape parameter as the optimization variable, the optimization objective is to maximize the heat dissipation efficiency of the heat exchanger. The upper and lower limits of the curve shape parameter are used as constraints. The heat dissipation efficiency values ​​of the heat exchanger corresponding to different curve shape parameters are solved directly through the fluid dynamics heat dissipation simulation method, so as to obtain the real correspondence between the curve shape parameter and the heat dissipation efficiency of the heat exchanger.

[0047] Based on the curve shape parameters and corresponding heat dissipation efficiency values ​​of the heat sink obtained from the above simulation calculations, an objective function is constructed. The optimization objective of maximizing the heat dissipation efficiency of the heat sink is transformed into an optimization form that can be recognized by intelligent algorithms. Then, the particle swarm optimization algorithm is used to iteratively search for optimization in the continuous parameter space, and finally the optimal curve shape parameters that maximize the heat dissipation efficiency of the heat sink are determined.

[0048] This method directly relies on physical simulation data for optimization, without the need to build additional models. The process is intuitive, the optimization basis is real and reliable, and the final curve shape parameters have high applicability in practical engineering.

[0049] Optionally, the parameterized model based on the preset groove curve shape parameters and the heat dissipation efficiency of the heat spreader, aiming to maximize the heat dissipation efficiency of the heat spreader, solves for the optimal curve shape parameters, including: A convolutional neural network model is established based on the parameterized model between the curve shape parameters and the heat dissipation efficiency of the heat exchanger; wherein, the convolutional neural network model is used to fit the mapping relationship between the curve shape parameters and the heat dissipation efficiency of the heat exchanger. The convolutional neural network model is trained using a training dataset. The trained convolutional neural network model is used to obtain predicted values ​​of heat dissipation efficiency of the heat exchanger corresponding to different curve shape parameters. Each training sample in the training dataset includes: a curve shape parameter sample and a heat dissipation efficiency value of the heat exchanger corresponding to the curve shape parameter sample calculated by a fluid dynamics heat dissipation simulation method. Using the curve shape parameter as the optimization variable, maximizing the heat dissipation efficiency of the heat spreader as the optimization objective, and the upper and lower limits of the curve shape parameter as constraints, an objective function is constructed based on the curve shape parameter and the corresponding predicted value of the heat dissipation efficiency of the heat spreader. The optimal curve shape parameter is determined by using a particle swarm optimization algorithm.

[0050] In the above embodiments, the optimal curve shape parameters are solved with the goal of maximizing the heat dissipation efficiency of the heat exchanger. A collaborative strategy combining data-driven modeling and intelligent algorithm optimization is adopted to achieve efficient and accurate parameter optimization. Based on the aforementioned pre-established parameterized model between the curve shape parameters and the heat exchanger efficiency, a convolutional neural network model is constructed to fit the complex nonlinear mapping relationship between the curve shape parameters and the heat exchanger efficiency. Specifically, the convolutional neural network model is used as a predictor of the heat exchanger efficiency; inputting the curve shape parameters will output the corresponding predicted value of the heat exchanger efficiency, eliminating the need for time-consuming fluid dynamics heat dissipation simulations, thereby significantly improving the computational efficiency of subsequent optimization steps.

[0051] To enable the convolutional neural network (CNN) model to possess reliable predictive capabilities through training, a training dataset is constructed. Each training sample includes a curve shape parameter sample generated through random sampling, and the corresponding real vapor chamber heat dissipation efficiency value obtained through fluid dynamics heat dissipation simulation. The CNN model is trained using a large number of training samples, allowing it to learn the correlation between the curve shape parameter and the vapor chamber heat dissipation efficiency, ultimately enabling it to output real-time predicted values ​​of the vapor chamber heat dissipation efficiency. Utilizing the self-learning capability acquired through training the CNN model reduces the computational cost of a single simulation, which can take hours, to milliseconds.

[0052] After the convolutional neural network model is trained, the curve shape parameter is used as the optimization variable, and the optimization objective is to maximize the heat dissipation efficiency of the heat sink. This is equivalent to minimizing the negative of the heat sink's heat dissipation efficiency. The upper and lower limits of the curve shape parameter are used as constraints. Based on the curve shape parameter and the corresponding predicted value of the heat sink's heat dissipation efficiency, the objective function is constructed. The particle swarm optimization algorithm is used to quickly find the optimal curve shape parameter in the continuous parameter space, and finally the optimal curve shape parameter that maximizes the heat sink's heat dissipation efficiency is determined.

[0053] The above embodiments solve the pain points of low optimization efficiency and reliance on a large number of simulation calculations of traditional parametric models by combining the acceleration of simulation with the high efficiency of particle swarm optimization through the use of convolutional neural networks. This achieves a key leap from theoretical modeling to engineering implementation and provides an efficient and executable technical path for the design of heat spreader microchannels.

[0054] Please see Figure 2 In order to gain a more comprehensive understanding of the heat spreader microchannel design method provided in the embodiments of this application, an optional specific example is used to illustrate the heat spreader microchannel design method.

[0055] S11, Receive design constraint parameters; used to receive design domain parameters of the heat spreader surface, including boundary length, width, initial shape parameters of the grooves, and optional groove quantity parameters, to provide input boundaries for subsequent design.

[0056] S13, Determine the design domain of the heat spreader; Based on the surface design domain parameters, determine the surface design domain range of the heat spreader and clarify the spatial boundary of the microchannel layout.

[0057] S15, Generate initial microchannel layout diagram; Determine the target shape of a single trench based on the initial shape parameters of the trench, and then divide the layout within the surface design domain according to the equal division rule to generate the initial parallel or grid microchannel layout diagram.

[0058] S17, a parameterized model of microchannels based on multi-order trigonometric function expansion; keeping the groove width fixed, the curve distance function is discretized and expanded through multi-order trigonometric functions to establish the mapping relationship between the curve shape parameters and the curve distance function, and the parameterized model of the curve shape parameters and the heat dissipation efficiency of the heat sink is obtained by combining fluid dynamics simulation data.

[0059] S19. Establish a parallel or grid microchannel optimization design model; based on the aforementioned parametric model, construct an optimization design model with curve shape parameters as optimization variables and maximizing the heat dissipation efficiency of the heat exchange plate as the objective.

[0060] S21, the CNN-GA optimization method is used for optimization. In this method, CNN-GA is a user-defined combination term. A convolutional neural network (CNN) is used to fit the mapping relationship between the curve shape parameters and the heat dissipation efficiency of the heat sink, and a particle swarm optimization algorithm (PSO) is used to search for the optimal curve shape parameters. The optimal curve shape parameters are obtained by establishing and training a CNN model to fit the mapping relationship between the curve shape parameters and the heat dissipation efficiency of the heat sink, and then using the particle swarm optimization algorithm (PSO). For example, the optimal curve shape parameters and the corresponding maximum heat dissipation efficiency can be obtained by using Ansys simulation software to calculate the optimization design model and combining it with traditional CNN-GA.

[0061] S23, Convergence Condition: The convergence of the optimization results is judged. If the convergence condition is not met, the model is returned to the parameterized model modeling stage for adjustment. If the convergence condition is met, the model is entered into the subsequent output stage.

[0062] S25 generates the optimal curve shape parameters; it outputs the optimal curve shape parameters that satisfy the convergence condition, providing a basis for generating the final design drawing.

[0063] S27, Output the final design drawing of the heat exchanger microchannel; Adjust the initial microchannel layout drawing according to the optimal curve shape parameters to generate the final design drawing of the heat exchanger microchannel that satisfies the goal of maximizing the heat dissipation efficiency of the heat exchanger.

[0064] In some embodiments, please refer to Figures 3 to 5 The shape design of the heat spreader grooves includes at least one of the following: parallel straight arrangement, intersecting grid arrangement, and parallel curved arrangement. Specifically, the parallel straight arrangement, such as... Figure 3 They are arranged in a linear, equally spaced pattern, guiding the directional flow of the heat transfer medium through a regular flow channel layout, achieving uniform heat diffusion; the grid is arranged in an intersecting pattern, such as... Figure 4 This structure, consisting of intersecting longitudinal and transverse flow channels forming a mesh, improves heat exchange efficiency by increasing the heat dissipation surface area, making it particularly suitable for scenarios with complex heat source distribution; curved parallel arrangement, such as... Figure 5The flow path extends in a smooth arc or S-shaped trajectory, reducing the flow resistance of the working fluid by optimizing the flow channel shape. This optimizes the heat flow distribution and reduces flow resistance, adapting to the dynamic heat flow guidance requirements of areas with concentrated heat sources. Of course, in addition to the above three implementation methods, multiple trenches can also adopt other arrangement shapes, such as straight lines + curves, various irregular arrangement shapes, etc., which are not specifically limited here.

[0065] This application also provides a computer-readable storage medium storing a computer program. When executed by a processor, this computer program implements the various processes of the above-described imaging ranging method embodiments and achieves the same technical effects. To avoid repetition, it will not be described again here. The computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, etc.

[0066] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0067] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0068] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for designing microchannels for a heat spreader, characterized in that, include: Receive design constraint parameters; The design constraint parameters include: surface design domain parameters of the heat spreader and initial shape parameters of the trench; Based on the surface design domain parameters and the initial shape parameters of the trenches, an initial microchannel layout diagram is formed in which multiple trenches are deployed within the surface design domain; Based on a parameterized model relating the preset groove curve shape parameters to the heat dissipation efficiency of the heat spreader, the optimal curve shape parameters are solved with the goal of maximizing the heat dissipation efficiency of the heat spreader, and the microchannel design diagram of the heat spreader is obtained based on the optimal curve shape parameters. The curve shape parameter characterizes the bending morphology of the groove.

2. The heat spreader microchannel design method according to claim 1, characterized in that, The step of forming an initial microchannel layout diagram with multiple trenches deployed within the surface design domain according to the surface design domain parameters and the initial shape parameters of the trenches includes: The surface design domain is determined based on the surface design domain parameters; the surface design domain parameters of the heat spreader include the surface boundary length value and the surface boundary width value of the heat spreader. Based on the initial shape parameters of the trench, determine the target shape of the trench; According to the equal division rule, the surface design domain is divided using the groove of the target shape as the graphic repeating unit to obtain the initial microchannel layout diagram.

3. The heat spreader microchannel design method according to claim 2, characterized in that, The process involves dividing the surface design domain according to an equal division rule, using grooves of the target shape as graphic repeating units to obtain an initial microchannel layout diagram, including: Based on the boundary length and width values ​​of the surface design domain, using the target-shaped grooves as graphic repeating units, the length, width, estimated number of grooves, and spacing between adjacent grooves are determined to obtain an initial microchannel layout diagram; or, The design constraint parameters also include the number of grooves; based on the boundary length value, boundary width value, and number of grooves of the surface design domain, the length, width, and spacing between adjacent grooves are determined using the grooves of the target shape as graphic repeating units to obtain the initial microchannel layout diagram.

4. The heat spreader microchannel design method according to claim 3, characterized in that, The method for establishing the parameterized model includes: Using the length, width, and spacing between two adjacent trenches as input parameters, a parameterized relationship is established between the curve shape parameters of the trenches and the heat dissipation efficiency of the heat spreader. Based on the parametric relationship, the corresponding heat dissipation efficiency value of the heat spreader is obtained by simulating the heat dissipation through fluid dynamics heat dissipation simulation method. A mathematical expression is formed by data fitting, and a parametric model between the curve shape parameters of the trench and the heat dissipation efficiency of the heat spreader is obtained.

5. The heat spreader microchannel design method according to claim 3, characterized in that, The method for establishing the parameterized model includes: Keeping the width of the groove constant, the curve change form of the groove is determined by the curve distance function. Based on the fluid dynamics heat dissipation simulation method, the heat dissipation efficiency value of the heat exchange plate corresponding to the groove shape under different values ​​of the curve distance function is simulated, and the correspondence between the curve distance function and the heat dissipation efficiency of the heat exchange plate is constructed. Using the initial shape parameters of the trench as the coefficient factors of each trigonometric function term in the multi-order trigonometric function expansion, the curve distance function is parametrically modeled by using the multi-order trigonometric function discrete expansion method, and a mapping relationship between the curve shape parameters of the trench and the curve distance function is established. Based on the mapping relationship and the correspondence between the curve distance function and the heat dissipation efficiency of the heat exchanger, a parameterized model of the relationship between the curve shape parameters and the heat dissipation efficiency of the heat exchanger is obtained.

6. The heat spreader microchannel design method according to claim 5, characterized in that, The curve distance function is discretized and modeled using a multi-order trigonometric function, and the mapping relationship between the curve shape parameters of the trench and the curve distance function is established as follows: in, The amplitude of a higher-order trigonometric function. Here, m is the curve shape parameter, m is the total order of the multi-order trigonometric function expansion, and n is the number of orders traversed from 1 to m. Pi is a constant. t For parameter variables, t ∈[0,1], this variable represents the variation along the length direction, and sin is the sine function.

7. The heat spreader microchannel design method according to claim 6, characterized in that, Based on the mapping relationship and the correspondence between the curve distance function and the heat dissipation efficiency of the heat exchanger, the parameterized model between the curve shape parameter and the heat dissipation efficiency of the heat exchanger is obtained as follows: in, Here, m is the curve shape parameter, m is the total order of the multi-order trigonometric function expansion, and n is the number of orders traversed from 1 to m. The upper and lower limits are and , To improve the heat dissipation efficiency of the heat spreader. The objective function of the parameterized model is the negative of the heat dissipation efficiency of the heat sink. The amplitude of a higher-order trigonometric function. Pi is a constant. t For parameter variables, t ∈[0,1], this variable represents the variation along the length direction, and sin is the sine function.

8. The heat spreader microchannel design method according to claim 7, characterized in that, The parameterized model based on the preset groove curve shape parameters and the heat dissipation efficiency of the heat spreader, with the goal of maximizing the heat dissipation efficiency of the heat spreader, solves for the optimal curve shape parameters, including: Using curve shape parameters as optimization variables, maximizing the heat dissipation efficiency of the heat exchanger as the optimization objective, and the upper and lower limits of the curve shape parameters as constraints, different curve shape parameters and corresponding heat dissipation efficiency values ​​of the heat exchanger are calculated using a fluid dynamics heat dissipation simulation method. An objective function is constructed based on the curve shape parameters and the corresponding heat dissipation efficiency value of the heat sink. The optimal curve shape parameters are then determined by using a particle swarm optimization algorithm.

9. The heat spreader microchannel design method according to claim 7, characterized in that, The parameterized model based on the preset groove curve shape parameters and the heat dissipation efficiency of the heat spreader, with the goal of maximizing the heat dissipation efficiency of the heat spreader, solves for the optimal curve shape parameters, including: A convolutional neural network model is established based on the parameterized model between the curve shape parameters and the heat dissipation efficiency of the heat exchanger; wherein, the convolutional neural network model is used to fit the mapping relationship between the curve shape parameters and the heat dissipation efficiency of the heat exchanger. The convolutional neural network model is trained using a training dataset. The trained convolutional neural network model is used to obtain predicted values ​​of heat dissipation efficiency of the heat exchanger corresponding to different curve shape parameters. Each training sample in the training dataset includes: a curve shape parameter sample and a heat dissipation efficiency value of the heat exchanger corresponding to the curve shape parameter sample calculated by a fluid dynamics heat dissipation simulation method. Using the curve shape parameter as the optimization variable, maximizing the heat dissipation efficiency of the heat spreader as the optimization objective, and the upper and lower limits of the curve shape parameter as constraints, an objective function is constructed based on the curve shape parameter and the corresponding predicted value of the heat dissipation efficiency of the heat spreader. The optimal curve shape parameter is determined by using a particle swarm optimization algorithm.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the heat spreader microchannel design method as described in any one of claims 1 to 9.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the heat spreader microchannel design method as described in any one of claims 1 to 9.

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