Display device and foldable electronic device including the same

Abstract

A display device and a foldable electronic device including the same are provided. The display device includes a display panel; and a panel support member disposed on the display panel and including a folding portion and a non-folding portion disposed at at least one side of the folding portion. The folding portion includes a plurality of slits penetrating the panel support member and a plurality of bars alternately disposed with the plurality of slits. The panel support member further includes a plating layer covering at least a portion of the folding portion and including a metal material, and the plating layer is disposed on an inner side surface of the plurality of slits.

Description

[0001] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2024-0182057, filed on December 9, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to a display device and a foldable electronic device including the display device. Background Technology

[0003] With the development of the information society, the demand for display devices used to display images has increased and diversified. Display devices can be liquid crystal displays (LCDs), field emission displays (FEDs), or light-emitting diode displays (LEDs). Light-emitting diode displays can include organic light-emitting diode displays that use organic light-emitting diode elements as light-emitting elements, inorganic light-emitting diode displays that use inorganic light-emitting diode elements as light-emitting elements, etc.

[0004] Recently, in order to increase the portability of display devices and provide wide displays, flexible display devices in which the display area is flexible or foldable display devices in which the display area is foldable have been released. Summary of the Invention

[0005] This disclosure provides a display device with improved shock resistance and a foldable electronic device including the display device.

[0006] However, the scope of this disclosure is not limited to those set forth herein. These and other aspects of the disclosure will become more apparent to those skilled in the art from the following detailed description of the disclosure.

[0007] According to an aspect of this disclosure, a display device is provided, comprising: a display panel; and a panel support member disposed on the display panel and including a folded portion and a non-folded portion disposed on at least one side of the folded portion. The folded portion includes a plurality of slits penetrating the panel support member and a plurality of strips alternately disposed with the plurality of slits. The panel support member further includes a plating layer covering at least a portion of the folded portion and comprising a metallic material, and the plating layer is disposed on the inner surfaces of the plurality of slits.

[0008] In the embodiments, the metal material of the coating includes at least one of nickel, chromium, copper, zinc, gold, silver, palladium, tin, aluminum, iron, cobalt, and alloys thereof.

[0009] In one embodiment, the width of one of the slits is greater than or equal to the thickness of the portion of the panel support member excluding the coating.

[0010] In one embodiment, the coating includes a first side surface coating disposed on one side of one of the plurality of slits and a second side surface coating disposed on the other side of the slit. The panel support member includes an opening disposed in the space between the first side surface coating and the second side surface coating, and the width of the opening is smaller than the width of the slit.

[0011] In this embodiment, the width of the opening is 50 μm or less.

[0012] In one embodiment, the thickness of the coating is less than half the thickness of the portion of the panel support member excluding the coating.

[0013] In the embodiments, the thickness of the coating is 40 μm or less.

[0014] In one embodiment, the coating is also disposed on at least one of the upper and lower surfaces of the panel support member.

[0015] In an embodiment, the coating includes a side surface coating disposed on the inner surfaces of the plurality of slits. The coating also includes at least one of an upper surface coating disposed on the upper surface of the panel support member and a lower surface coating disposed on the lower surface of the panel support member.

[0016] In this embodiment, the upper surface coating is applied to the folded portion but not to the non-folded portion.

[0017] In this embodiment, the panel support member comprises a metal plate or a fiber polymer.

[0018] According to an aspect of this disclosure, a display device is provided, comprising: a display panel; and a panel support member disposed on the display panel and including a folded portion and a non-folded portion disposed on at least one side of the folded portion. The folded portion includes a plurality of slits penetrating the panel support member and a plurality of strips alternately disposed with the plurality of slits. The panel support member further includes a plating layer covering at least a portion of the folded portion, and the plating layer includes side surface plating layers disposed on the inner surfaces of the plurality of slits.

[0019] In one embodiment, the coating further includes an upper surface coating disposed on the upper surface of the panel support member and a lower surface coating disposed on the lower surface of the panel support member. Each of the upper surface coating and the lower surface coating is disposed on a plurality of strips.

[0020] In this embodiment, the upper and lower surface coatings are not applied to the non-folded portion.

[0021] In one embodiment, the thickness of the panel support member in the area overlapping with the folded portion is greater than the thickness of the panel support member in the area overlapping with the non-folded portion.

[0022] In one embodiment, at least one of the upper surface coating and the lower surface coating is also disposed on the non-folded portion.

[0023] In one embodiment, the thickness of the coating is less than half the thickness of the portion of the panel support member excluding the coating.

[0024] In this embodiment, the coating comprises a metallic material.

[0025] In this embodiment, the panel support member comprises a metal plate or a fiber polymer.

[0026] According to an aspect of this disclosure, a foldable electronic device including a display device is provided. The display device includes: a display panel; a window member disposed above the display panel; an upper protective member disposed on the window member; a cover window disposed on the upper protective member; a panel protective member disposed below the display panel; and a panel support member disposed below the panel protective member, and includes a folding portion and a non-folding portion disposed on at least one side of the folding portion. The folding portion includes a plurality of slits penetrating the panel support member and a plurality of strips alternately disposed with the plurality of slits. The panel support member also includes a plating layer covering at least a portion of the folding portion and comprising a metallic material, and the plating layer is disposed on the inner surface of the plurality of slits.

[0027] Impact resistance can be improved for display devices and foldable electronic devices including such display devices according to embodiments of the present disclosure.

[0028] The effects of this disclosure are not limited to those described above, and various other effects are included in this specification. Attached Figure Description

[0029] The above and other aspects and features of this disclosure will become more apparent from the detailed description of embodiments thereof with reference to the accompanying drawings.

[0030] Figure 1 This is a perspective view showing the unfolded state of the display device according to an embodiment.

[0031] Figure 2 This is a perspective view showing the folded state of the display device according to an embodiment.

[0032] Figure 3 This is a perspective view showing the unfolded state of the display device according to an embodiment.

[0033] Figure 4 This is a perspective view showing the folded state of the display device according to an embodiment.

[0034] Figure 5 This is an exploded perspective view showing a display device according to an embodiment.

[0035] Figure 6It is along Figure 5 A sectional view taken by line X1-X1'.

[0036] Figure 7 This is a cross-sectional view showing an example of a display panel according to an embodiment.

[0037] Figure 8 This is a plan view showing the panel support member according to an embodiment.

[0038] Figure 9 yes Figure 8 A magnified view of region A.

[0039] Figure 10 It is along Figure 8 The sectional view taken by line X2-X2'.

[0040] Figure 11 This is a cross-sectional view showing an impact resistance test of a display device according to an embodiment.

[0041] Figure 12 This is a cross-sectional view showing the impact resistance test of a display device based on a comparative example.

[0042] Figure 13 This is a cross-sectional view showing a panel support member according to an embodiment.

[0043] Figure 14 This is a cross-sectional view showing a panel support member according to an embodiment.

[0044] Figure 15 This is a cross-sectional view showing a panel support member according to an embodiment.

[0045] Figure 16 This is a cross-sectional view showing a panel support member according to an embodiment. Detailed Implementation

[0046] The inventive concept will now be described more fully below with reference to the accompanying drawings, in which embodiments of the inventive concept are illustrated. However, the inventive concept may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art.

[0047] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on said other layer or substrate, or an intervening layer may be present. Throughout the specification, the same reference numerals denote the same components.

[0048] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0049] Figure 1 This is a perspective view showing the unfolded state of the display device 10 according to an embodiment. Figure 2 This is a perspective view showing the folded state of the display device 10 according to an embodiment.

[0050] Reference Figure 1 and Figure 2 Electronic device 1 displays moving or still images. Electronic device 1 can refer to any electronic device that provides a display screen. For example, televisions, laptops, monitors, billboards, Internet of Things (IoT) devices, mobile phones, smartphones, tablet PCs, electronic watches, smartwatches, watch phones, head-mounted displays, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, game consoles, digital cameras, camcorders, etc., that provide a display screen can be included in electronic device 1.

[0051] Electronic device 1 may include display device 10 providing a display screen. Display device 10 is a device for displaying moving or still images. Examples of display devices may include inorganic light-emitting diode displays, organic light-emitting diode displays, quantum dot light-emitting displays, plasma displays, field emission displays, etc. In the following, examples of organic light-emitting diode displays being used as display device 10 will be described by way of example, but this disclosure is not limited thereto, and the same technical spirit can be applied to other display devices where applicable.

[0052] exist Figure 1 The image shows the first state of the display device 10, which is not folded at the fold lines FL1 and FL2 and is unfolded. Figure 2 The image shows the second state of the display device 10 folded at fold lines FL1 and FL2.

[0053] The display device 10 may have a quadrilateral shape, such as a rectangle, in a plan view. Each corner of the display device 10 may have a right-angle shape or a circular (or rounded) shape in a plan view. The front surface of the display device 10 may include two short sides disposed in a first direction DR1 and two long sides disposed in a second direction DR2.

[0054] In the accompanying drawings, the first direction DR1 and the second direction DR2 are horizontal directions and intersect each other. For example, the first direction DR1 and the second direction DR2 may be orthogonal to each other. Furthermore, the third direction DR3 may be a vertical direction that intersects (e.g., is orthogonal) the first direction DR1 and the second direction DR2. Unless otherwise defined, the direction indicated by the arrows of the first direction DR1, the second direction DR2, and the third direction DR3 may be referred to as one side, and the direction opposite to said one side may be referred to as the other side. Furthermore, as used herein, the terms "on," "upper side," "upper part," "top," and "upper surface" refer to the direction pointed to by the arrow of the third direction DR3 in the accompanying drawings, and the terms "below," "lower side," "lower part," "bottom," and "lower surface" refer to the direction opposite to the direction pointed to by the arrow of the third direction DR3 in the accompanying drawings.

[0055] The display device 10 may include a display area DA and a non-display area NDA. The shape of the display area DA in the plan view may follow the shape of the display device 10 in the plan view. For example, when the shape of the display device 10 in the plan view is rectangular, the shape of the display area DA in the plan view may also be rectangular.

[0056] The display area DA can be an area that displays an image by including multiple pixels. The non-display area NDA can be an area that does not display an image because it does not include pixels. The non-display area NDA can be disposed around the display area DA. The non-display area NDA can be disposed to surround the display area DA, but the embodiments of this disclosure are not limited thereto. The display area DA can be partially surrounded by the non-display area NDA.

[0057] The display device 10 can be held in a first state as an unfolded state or a second state as a folded state. In an embodiment, the display device 10 can be in the following state: Figure 2 The display areas DA shown are folded in an inward folding manner, with the display areas facing each other. In this case, when the display device 10 is folded, the front surfaces of the display device 10 can face each other. In an embodiment, the display device 10 can be folded in an outward folding manner, such that the rear surfaces of the display device 10 face each other.

[0058] The display device 10 may include a folded region FDA, a first non-folded region NFA1, and a second non-folded region NFA2. The folded region FDA may be an area of ​​the display device 10 that is bent or folded, and the first non-folded region NFA1 and the second non-folded region NFA2 may be areas of the display device 10 that are not bent or folded. In an embodiment, the first non-folded region NFA1 and the second non-folded region NFA2 may be flat areas of the display device 10.

[0059] The first non-folding region NFA1 may be located on one side of the folding region FDA (e.g., the left side). The second non-folding region NFA2 may be located on the other side of the folding region FDA (e.g., the right side). The folding region FDA is the area defined by the first fold line FL1 and the second fold line FL2, and may be an area where the display device 10 is bent at a predetermined curvature. The first fold line FL1 may be the boundary between the folding region FDA and the first non-folding region NFA1, and the second fold line FL2 may be the boundary between the folding region FDA and the second non-folding region NFA2.

[0060] The first fold line FL1 and the second fold line FL2 can be as follows: Figure 1 and Figure 2 As shown, it extends along the second direction DR2, and in this case, the display device 10 can be folded based on the second direction DR2. Therefore, the length of the display device 10 along the first direction DR1 can be reduced by approximately half, thus allowing the user to easily carry the display device 10.

[0061] The first non-foldable region NFA1 can be located on one side of the foldable region FDA (e.g., the left side). The second non-foldable region NFA2 can be located on the other side of the foldable region FDA (e.g., the right side). Here, left side can refer to one side on the first direction DR1, and right side can refer to the other side on the first direction DR1.

[0062] When the first fold line FL1 and the second fold line FL2 are as follows Figure 1 and Figure 2 As shown, when extending in the second direction DR2, the length of the folded region FDA in the second direction DR2 can be greater than the length of the folded region FDA in the first direction DR1. Furthermore, the length of the first non-folded region NFA1 in the second direction DR2 can be greater than the length of the first non-folded region NFA1 in the first direction DR1. The length of the second non-folded region NFA2 in the second direction DR2 can be greater than the length of the second non-folded region NFA2 in the first direction DR1.

[0063] Each of the display area DA and the non-display area NDA can be superimposed with at least one of the folded area FDA, the first non-folded area NFA1, and the second non-folded area NFA2. Figure 1 and Figure 2 The diagram shows each of the display area DA and the non-display area NDA superimposed with the folded area FDA, the first non-folded area NFA1, and the second non-folded area NFA2.

[0064] Figure 3 This is a perspective view showing the unfolded state of the display device 10 according to an embodiment. Figure 4This is a perspective view showing the folded state of the display device 10 according to an embodiment.

[0065] Apart from Figure 1 and Figure 2 In addition, refer to Figure 3 and Figure 4 ,exist Figure 3 The image shows the first state of the display device 10, which is not folded at the fold lines FL1 and FL2 and is unfolded. Figure 4 The image shows the second state of the display device 10 folded at fold lines FL1 and FL2.

[0066] Figure 3 and Figure 4 Implementation examples and Figure 1 and Figure 2 The difference in the embodiment is that the first fold line FL1 and the second fold line FL2 extend in the first direction DR1, and the display device 10 is folded in the second direction DR2. Therefore, the length of the display device 10 in the second direction DR2 is reduced by approximately half. Thus, in Figure 3 and Figure 4 In the middle, omission and Figure 1 and Figure 2 The description of the content of the embodiment is repeated.

[0067] In the first state in which the display device 10 is unfolded, the long side of the display device 10 can extend along the second direction DR2, and the short side of the display device 10 can extend along the first direction DR1.

[0068] The first fold line FL1 and the second fold line FL2 can be as follows: Figure 3 and Figure 4 As shown, it extends in the first direction DR1, and in this case, the display device 10 can be folded based on the first direction DR1.

[0069] The first non-foldable region NFA1 can be located on one side of the foldable region FDA (e.g., the lower side). The second non-foldable region NFA2 can be located on the other side of the foldable region FDA (e.g., the upper side). Here, the upper side can refer to one side on the second direction DR2, and the lower side can refer to the other side on the second direction DR2.

[0070] When the first fold line FL1 and the second fold line FL2 are as follows Figure 3 and Figure 4As shown, when extending in the first direction DR1, the length of the folded region FDA in the first direction DR1 can be greater than the length of the folded region FDA in the second direction DR2. Furthermore, the length of the first non-folded region NFA1 in the second direction DR2 can be greater than the length of the first non-folded region NFA1 in the first direction DR1. The length of the second non-folded region NFA2 in the second direction DR2 can be greater than the length of the second non-folded region NFA2 in the first direction DR1.

[0071] Figure 5 This is an exploded perspective view showing the display device 10 according to an embodiment. Figure 6 It is along Figure 5 A sectional view taken by line X1-X1'.

[0072] Reference Figure 5 and Figure 6 The display device 10 according to the embodiment may include a cover window (CCW), an upper protective member 100, a window member 200, a first adhesive member 300, a display panel 400, a panel protective member 500, a lower panel member 600, a panel support member 700, a second adhesive member 800, a lower anti-view member (LPU), a digital converter member 900, a metal support member 1000, a buffer member 1100, and a third adhesive member 1200.

[0073] Display panel 400 can be a panel for displaying images. Display panel 400 can be an organic light-emitting display panel including an organic light-emitting layer, a quantum dot light-emitting display panel including a quantum dot light-emitting layer, an inorganic light-emitting display panel using inorganic semiconductor elements as light-emitting elements, or a micro light-emitting display panel using micro light-emitting diodes as light-emitting elements. In the following description, display panel 400 will primarily be described as an organic light-emitting display panel, but this disclosure is not limited thereto.

[0074] The display panel 400 may include a light-transmitting area LTA superimposed on a third-party DR3 with an optical element OPD. The optical element OPD is an optical sensor for sensing light and may be, for example, a camera sensor, a proximity sensor, or an illuminance sensor. The light-transmitting area LTA may be part of the display area DA.

[0075] The light-transmitting region LTA may include a transmissive area that allows light to pass through it. In an embodiment, the light-transmitting region LTA may be a through-hole penetrating the display panel 400. The light transmittance of the light-transmitting region LTA may be higher than that of the display region DA excluding the light-transmitting region LTA. Furthermore, due to the transmissive area of ​​the light-transmitting region LTA, the pixel density or integration in the light-transmitting region LTA may be lower than that in the display region DA excluding the light-transmitting region LTA. For example, the number of pixels per unit area in the light-transmitting region LTA may be smaller than the number of pixels per unit area in the display region DA excluding the light-transmitting region LTA. In an embodiment, the pixels per inch (PPI) in the light-transmitting region LTA may be smaller than the PPI in the display region DA excluding the light-transmitting region LTA.

[0076] The window member 200 can be attached to the front surface of the display panel 400 via the first adhesive member 300. The window member 200 can be made of a transparent material such as glass or plastic. For example, the window member 200 can be ultra-thin glass (UTG) or a transparent polyimide film with a thickness of 0.1 mm or less.

[0077] The first adhesive member 300 may be disposed on the rear surface of the window member 200. For example, the first adhesive member 300 may be disposed between the window member 200 and the display panel 400. The window member 200 and the display panel 400 may be bonded to each other through the first adhesive member 300. The first adhesive member 300 may include a transparent adhesive, such as pressure-sensitive adhesive (PSA) or optically clear adhesive (OCA). The first adhesive member 300 may include an acrylic adhesive material.

[0078] The upper protective member 100 may be disposed on the front surface of the window member 200. The upper protective member 100 may be attached to the front surface of the window member 200. The upper protective member 100 may perform at least one of the following functions of the window member 200: anti-scattering function, shock absorption function, anti-scratch function, anti-fingerprint function, and anti-glare function.

[0079] In some embodiments, a light-blocking pattern may be formed on the rear surface of the upper protective member 100. The light-blocking pattern may be disposed at the edge of the upper protective member 100 or disposed adjacent to the edge of the upper protective member 100. The light-blocking pattern may include a light-blocking material capable of blocking light. For example, the light-blocking pattern may be made of an inorganic black pigment such as carbon black, an organic black pigment, or an opaque metallic material.

[0080] A cover window (CCW) can be disposed on the upper protective member 100. The cover window (CCW) can be a protective film used to protect the display device 10 from external impacts. The cover window (CCW) can be attached to or removed from the display device 10 by an adhesive member. That is, the cover window (CCW) can be a variable window. In embodiments, the cover window (CCW) may include at least one of flexible polyethylene terephthalate (PET) and thermoplastic polyurethane (TPU), but is not limited thereto.

[0081] A panel protection member 500 can be disposed on the rear surface of the display panel 400. The panel protection member 500 serves to support the display panel 400 and protect its rear surface. The panel protection member 500 can be made of a plastic such as polyethylene terephthalate (PET) or polyimide. Figure 5 and Figure 6 The diagram shows that panel protection member 500 is also provided in the folding area FDA of display device 10, but the embodiments disclosed herein are not limited thereto. For example, panel protection member 500 may be removed from the folding area FDA of display device 10 to allow display device 10 to fold smoothly.

[0082] The under-panel member 600 may be disposed on the rear surface of the panel protection member 500. The under-panel member 600 may include at least one of a light-blocking layer for absorbing light incident from the outside, a buffer layer for absorbing external impacts, and a heat dissipation layer for effectively dissipating heat from the display panel 400.

[0083] A light-blocking layer blocks light transmission to prevent components such as the digitizer component 900 located beneath the light-blocking layer from being viewed from above the display panel 400. The light-blocking layer may include a light-absorbing material such as black pigment or black dye.

[0084] The buffer layer absorbs external impacts to prevent damage to the display panel 400. The buffer layer can be formed as a single layer or multiple layers. For example, the buffer layer can be made of a polymer resin (such as polyurethane, polycarbonate, polypropylene, or polyethylene), or may include a resilient material (such as a sponge formed by foam rubber, urethane materials, or acrylic materials).

[0085] The heat dissipation layer may include a first heat dissipation layer and a second heat dissipation layer. The first heat dissipation layer may include graphite, carbon nanotubes, etc., and the second heat dissipation layer may be formed as a thin metal film such as copper, nickel, ferrite or silver that can shield electromagnetic waves and has excellent thermal conductivity.

[0086] In some embodiments, the lower panel component 600 may be omitted.

[0087] The panel support member 700 can be disposed on the rear surface of the panel lower member 600. The panel support member 700 can be a rigid member whose shape or volume is not easily changed due to external pressure. Since the panel support member 700 is disposed on the rear surface of the display panel 400 and is a rigid member whose shape or volume is not easily changed due to external pressure, the panel support member 700 can support the display panel 400.

[0088] In an embodiment, the panel support member 700 may be made of a polymer including carbon fiber or glass fiber. In this case, since the panel support member 700 is made of a polymer including carbon fiber or glass fiber, the panel support member 700 allows the magnetic field or electromagnetic signals of the digitizer member 900 to pass through it. Therefore, a panel support member 700 that can support the display panel 400 without reducing the touch sensitivity of the digitizer member 900 can be provided.

[0089] In this embodiment, the panel support member 700 may be a metal plate. For example, the panel support member 700 is a metal plate and may be made of metal or metal alloy. The panel support member 700 may include, but is not limited to, copper (Cu), aluminum (Al), stainless steel (SUS) and / or alloys thereof.

[0090] The panel support member 700 may include a through-hole STH superimposed on the third-direction DR3 with an optical device OPD. The through-hole STH may be superimposed on the third-direction DR3 with a light-transmitting area LTA of the display panel 400. The area of ​​the through-hole STH may be larger than the area of ​​the light-transmitting area LTA. The optical device OPD can sense light incident from the front surface of the display device 10 through the light-transmitting area LTA and the through-hole STH.

[0091] The panel support member 700 may include a grating pattern disposed in the folding region FDA to allow for easy bending within the folding region FDA. The panel support member 700 may include a grating pattern disposed in the folding region FDA, and therefore can be easily bent when the display device 10 is folded.

[0092] The lower anti-viewing member (LPU) can be disposed on the rear surface of the panel support member 700. The lower anti-viewing member (LPU) can be stacked with the folding area (FDA). The lower anti-viewing member (LPU) can be disposed on the same layer as the second adhesive member 800. The lower anti-viewing member (LPU) can be disposed between the second-first adhesive member 810 and the second-second adhesive member 820. The lower anti-viewing member (LPU) can prevent the grating pattern of the panel support member 700 from being viewed from the outside. The lower anti-viewing member (LPU) may include a flexible material to reduce the folding stress of the display device 10.

[0093] The second adhesive member 800 may be disposed on the front surface of the digitizer member 900. For example, the second adhesive member 800 may be disposed between the panel support member 700 and the digitizer member 900. The panel support member 700 and the digitizer member 900 may be joined to each other by the second adhesive member 800. The second adhesive member 800 may include a transparent adhesive, such as pressure-sensitive adhesive (PSA) or optically clear adhesive (OCA). The second adhesive member 800 may include an acrylic adhesive material.

[0094] In some embodiments, the second adhesive member 800 may include a second-first adhesive member 810 superimposed on the first digital converter member 910 and a second-second adhesive member 820 superimposed on the second digital converter member 920. The second-first adhesive member 810 and the second-second adhesive member 820 may be spaced apart from each other and the lower visibility member LPU is disposed therebetween.

[0095] The digital converter component 900 may include a first digital converter component 910 and a second digital converter component 920. The first digital converter component 910 and the second digital converter component 920 may be disposed on the rear surface of the panel support component 700. The first digital converter component 910 and the second digital converter component 920 may be attached to the rear surface of the panel support component 700 by means of a second adhesive component 800.

[0096] The first digitizer component 910 and the second digitizer component 920 may not be disposed in the folding region FDA to reduce the folding stress on the display device 10. The first digitizer component 910 may be disposed in the first non-folding region NFA1, and the second digitizer component 920 may be disposed in the second non-folding region NFA2. The gap between the first digitizer component 910 and the second digitizer component 920 may overlap with the folding region FDA and may be less than the width of the folding region FDA. The width of the folding region FDA may be the length of the folding region FDA in the second direction DR2.

[0097] The first digitizer component 910 and the second digitizer component 920 may include electrode patterns for sensing the proximity or contact of an electronic pen, such as a stylus supporting electromagnetic resonance (EMR). The first digitizer component 910 and the second digitizer component 920 may sense magnetic fields or electromagnetic signals emitted from the electronic pen based on the electrode patterns, and determine the point where the sensed magnetic field or electromagnetic signal is strongest as the touch coordinate.

[0098] Magnetic metal powder can be disposed on the rear surfaces of the first digit converter component 910 and the second digit converter component 920. In this case, magnetic fields or electromagnetic signals passing through the first digit converter component 910 and the second digit converter component 920 can flow into the magnetic metal powder. Therefore, due to the magnetic metal powder, the phenomenon of magnetic fields or electromagnetic signals from the first digit converter component 910 and the second digit converter component 920 being emitted onto the rear surface of the display device 10 can be reduced.

[0099] The metal support member 1000 may include a first metal support member 1010 and a second metal support member 1020. The first metal support member 1010 may be disposed on the rear surface of the first digital converter member 910, and the second metal support member 1020 may be disposed on the rear surface of the second digital converter member 920.

[0100] The first metal support member 1010 and the second metal support member 1020 may not be disposed in the folding region FDA to reduce the folding stress of the display device 10. The first metal support member 1010 may be disposed in the first non-folding region NFA1, and the second metal support member 1020 may be disposed in the second non-folding region NFA2. The gap between the first metal support member 1010 and the second metal support member 1020 may overlap with the folding region FDA and may be smaller than the width of the folding region FDA.

[0101] The first metal support member 1010 and the second metal support member 1020 may include a material with high rigidity to support the first digital converter member 910 and the second digital converter member 920, respectively. For example, the first metal support member 1010 and the second metal support member 1020 may include stainless steel such as SUS316.

[0102] The buffer member 1100 may include a first buffer member 1110 and a second buffer member 1120. The first buffer member 1110 and the second buffer member 1120 may absorb external impacts to prevent damage to the panel support member 700 and the digital converter member 900. The first buffer member 1110 and the second buffer member 1120 may include a resilient material, such as a sponge formed from foam rubber, urethane, or acrylic materials.

[0103] The first buffer member 1110 may be disposed on the rear surface of the first metal support member 1010, and the second buffer member 1120 may be disposed on the rear surface of the second metal support member 1020. The first buffer member 1110 and the second buffer member 1120 may not be disposed in the folding region FDA to reduce the folding stress of the display device 10. The first buffer member 1110 may be disposed in the first non-folding region NFA1, and the second buffer member 1120 may be disposed in the second non-folding region NFA2. The gap between the first buffer member 1110 and the second buffer member 1120 may overlap with the folding region FDA and may be smaller than the width of the folding region FDA.

[0104] The third adhesive member 1200 can be disposed on the rear surface of the first metal support member 1010 and the rear surface of the second metal support member 1020. The third adhesive member 1200 can also be disposed at the edge of the first metal support member 1010 and the edge of the second metal support member 1020. Figure 5 and Figure 6 The diagram shows a third adhesive member 1200 disposed on both sides of the first buffer member 1110 and the second buffer member 1120, but this disclosure is not limited thereto. For example, the third adhesive member 1200 may be configured to surround the first buffer member 1110 and the second buffer member 1120.

[0105] The third adhesive member 1200 can be a waterproof tape or waterproof component that attaches the rear surfaces of the first metal support member 1010 and the second metal support member 1020 to the front surface of the frame disposed on the rear surface of the buffer member 1100. Therefore, the third adhesive member 1200 can prevent moisture or dust from penetrating into the display device 10. In other words, a display device 10 that is waterproof and dustproof can be provided.

[0106] In one embodiment, the third adhesive member 1200 does not surround the first buffer member 1110 and the second buffer member 1120, and may be configured to overlap with a magnet for holding the display device 10 folded on a third-direction DR3. In this case, the third adhesive member 1200 can serve as a magnetic shielding member capable of shielding the magnetic force of the magnet to prevent the digitizer member 900 or the display panel 400 from being affected by magnetic forces.

[0107] Figure 7 This is a cross-sectional view showing an example of a display panel 400 according to an embodiment.

[0108] Reference Figure 7The display panel 400 may include a substrate SUB, a display layer DISL disposed on the substrate SUB, and a touch sensing layer TDL disposed on the display layer DISL. The display layer DISL may include a thin film transistor layer TFTL, a light-emitting element layer EML, and a packaging layer TFEL.

[0109] The thin-film transistor layer (TFTL) can be disposed on the substrate (SUB). The TFTL may include a barrier film (BR), a thin-film transistor (TFT1), a first capacitor electrode (CAE1), a second capacitor electrode (CAE2), a first anode connection electrode (ANDE1), a second anode connection electrode (ANDE2), a gate insulating film (130), a first interlayer insulating film (141), a second interlayer insulating film (142), a first planarization film (160), and a second planarization film (180).

[0110] The substrate SUB can be made of an insulating material such as a polymer resin. For example, the substrate SUB can be made of polyimide. The substrate SUB can be a flexible substrate that can be bent, folded, and rolled up.

[0111] A barrier film BR can be disposed on a substrate SUB. The barrier film BR is a film used to protect the thin-film transistor layer TFTL (TFT1) and the light-emitting layer 172 of the light-emitting element layer EML from moisture penetration through the substrate SUB (which is susceptible to moisture penetration). The barrier film BR can comprise multiple inorganic films stacked alternately. For example, the barrier film BR can be formed as multiple films in which one or more inorganic films, such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide layers, are stacked alternately.

[0112] The thin-film transistor TFT1 can be disposed on the barrier film BR. The active layer ACT1 of the thin-film transistor TFT1 can be disposed on the barrier film BR. The active layer ACT1 of the thin-film transistor TFT1 may include polycrystalline silicon (e.g., low-temperature polycrystalline silicon), monocrystalline silicon, amorphous silicon, or oxide semiconductor.

[0113] The active layer ACT1 may include a channel region CHA1, a source region TS1, and a drain region TD1. The channel region CHA1 may be a region superimposed on the gate electrode TG1 on the third direction DR3, which is the thickness direction of the substrate SUB. The source region TS1 may be located on one side of the channel region CHA1, and the drain region TD1 may be located on the other side of the channel region CHA1. The source region TS1 and the drain region TD1 may be regions on the third direction DR3 that are not superimposed on the gate electrode TG1. The source region TS1 and the drain region TD1 may be regions that are conductive by doping silicon semiconductors or oxide semiconductors with ions or impurities.

[0114] The gate insulating film 130 can be disposed on the active layer ACT1 of the thin-film transistor TFT1. The gate insulating film 130 can be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0115] The gate electrode TG1 and the first capacitor electrode CAE1 of the thin-film transistor TFT1 can be disposed on the gate insulating film 130. The gate electrode TG1 can be stacked with the channel region CHA1 on the third-direction DR3. Figure 7 The diagram shows that the gate electrode TG1 and the first capacitor electrode CAE1 are spaced apart from each other, but the gate electrode TG1 and the first capacitor electrode CAE1 can also be connected to each other and integrally formed. Each of the gate electrode TG1 and the first capacitor electrode CAE1 can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0116] The first interlayer insulating film 141 can be disposed on the gate electrode TG1 and the first capacitor electrode CAE1 of the thin-film transistor TFT1. The first interlayer insulating film 141 can be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating film 141 can be formed as multiple inorganic films.

[0117] The second capacitor electrode CAE2 can be disposed on the first interlayer insulating film 141. The second capacitor electrode CAE2 can be stacked with the first capacitor electrode CAE1 on the third-direction DR3. Furthermore, when the gate electrode TG1 and the first capacitor electrode CAE1 are integrally formed together, the second capacitor electrode CAE2 can be stacked with the gate electrode TG1 on the third-direction DR3. Since the first interlayer insulating film 141 has a predetermined dielectric constant, the capacitor can be formed from the first capacitor electrode CAE1, the second capacitor electrode CAE2, and the first interlayer insulating film 141 disposed between the first capacitor electrode CAE1 and the second capacitor electrode CAE2. The second capacitor electrode CAE2 can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0118] The second interlayer insulating film 142 can be disposed on the second capacitor electrode CAE2. The second interlayer insulating film 142 can be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer insulating film 142 can be formed as multiple inorganic films.

[0119] The first anode connection electrode ANDE1 can be disposed on the second interlayer insulating film 142. The first anode connection electrode ANDE1 can be connected to the drain region TD1 of the thin-film transistor TFT1 through the first connection contact hole ANCT1 penetrating the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142. The first anode connection electrode ANDE1 can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0120] A first planarization film 160 for planarizing the steps caused by the thin-film transistor TFT1 can be disposed on the first anode connection electrode ANDE1. The first planarization film 160 can be formed as an organic film made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0121] The second anode connection electrode ANDE2 can be disposed on the first planarization film 160. The second anode connection electrode ANDE2 can be connected to the first anode connection electrode ANDE1 through the second connection contact hole ANCT2 penetrating the first planarization film 160. The second anode connection electrode ANDE2 can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0122] The second planarization film 180 can be disposed on the second anode connection electrode ANDE2. The second planarization film 180 can be formed as an organic film made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0123] A light-emitting element layer (EML), including a light-emitting element (LEL) and a dam 190, can be disposed on a second planarization film 180. Each of the light-emitting elements (LEL) includes a pixel electrode 171, a light-emitting layer 172, and a common electrode 173.

[0124] Pixel electrode 171 can be disposed on the second planarization film 180. Pixel electrode 171 can be connected to the second anode connection electrode ANDE2 through the third connection contact hole ANCT3 penetrating the second planarization film 180.

[0125] In the top-emitting structure where light is emitted from the light-emitting layer 172 toward the common electrode 173, the pixel electrode 171 can be made of a metallic material with high reflectivity, such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of aluminum (Al) and indium tin oxide (ITO) (ITO / Al / ITO), a stacked structure of silver (Ag) and ITO (ITO / Ag / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO)). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0126] The dam 190 can be formed to separate the pixel electrodes 171 on the second planarization film 180 to define the light-emitting portions EA1 and EA2. The dam 190 can be configured to cover the edges of the pixel electrodes 171. The dam 190 can be formed as an organic film made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0127] Each of the first light-emitting portion EA1 and the second light-emitting portion EA2 refers to the pixel electrode 171, the light-emitting layer 172 and the common electrode 173 being stacked sequentially, and the holes from the pixel electrode 171 and the electrons from the common electrode 173 recombine with each other in the light-emitting layer 172 to emit light in each region.

[0128] The light-emitting layer 172 can be disposed on the pixel electrode 171 and the dam 190. The light-emitting layer 172 may include organic materials to emit light of a predetermined color. For example, the light-emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer.

[0129] The common electrode 173 can be disposed on the light-emitting layer 172. The common electrode 173 can be configured to cover the light-emitting layer 172. The common electrode 173 can be a common layer formed in both the first light-emitting part EA1 and the second light-emitting part EA2.

[0130] In the top-emitting structure, the common electrode 173 can be made of a transparent conductive material (TCO) such as ITO or indium zinc oxide (IZO) that allows light to pass through it, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the common electrode 173 is made of a semi-transmissive conductive material, the luminous efficiency can be increased through a microcavity.

[0131] Spacer 191 may be disposed on dam 190. Spacer 191 may be used to support the mask during the manufacturing process of manufacturing the light-emitting layer 172. Spacer 191 may be formed as an organic film made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0132] In some embodiments, the display panel 400 may further include a capping layer CPL disposed on the common electrode 173. The capping layer CPL may include inorganic materials. For example, the capping layer CPL may include at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride.

[0133] The encapsulation layer TFEL can be disposed on the cover layer CPL. The encapsulation layer TFEL may include at least one inorganic film to prevent oxygen or moisture from penetrating into the light-emitting element layer EML. In addition, the encapsulation layer TFEL may include at least one organic film to protect the light-emitting element layer EML from foreign matter such as dust. For example, the encapsulation layer TFEL may include a first encapsulation inorganic film TFE1, an encapsulation organic film TFE2, and a second encapsulation inorganic film TFE3.

[0134] A first encapsulating inorganic film TFE1 can be disposed on a cover layer CPL, an encapsulating organic film TFE2 can be disposed on the first encapsulating inorganic film TFE1, and a second encapsulating inorganic film TFE3 can be disposed on the encapsulating organic film TFE2. Each of the first encapsulating inorganic film TFE1 and the second encapsulating inorganic film TFE3 can be formed as a plurality of films in which one or more inorganic films, including silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers, are alternately stacked. The encapsulating organic film TFE2 can be an organic film made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0135] The touch sensing layer TDL can be disposed on the encapsulation layer TFEL. The touch sensing layer TDL includes a first touch insulating film TINS1, a connection electrode BE, a second touch insulating film TINS2, a driving electrode TE, a sensing electrode RE, and a third touch insulating film TINS3.

[0136] The first touch insulating film TINS1 can be disposed on the encapsulation layer TFEL. The first touch insulating film TINS1 can be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0137] The connecting electrode BE can be disposed on the first touch insulating film TINS1. The connecting electrode BE can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0138] The second touch insulating film TINS2 can be disposed on the connecting electrode BE. The second touch insulating film TINS2 can be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. In an embodiment, the second touch insulating film TINS2 can be formed as an organic film made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0139] The driving electrode TE and the sensing electrode RE can be disposed on the second touch insulating film TINS2. Each of the driving electrode TE and the sensing electrode RE can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0140] The driving electrode TE and the sensing electrode RE can be stacked on the third-party DR3 with the connecting electrode BE. The driving electrode TE can be connected to the connecting electrode BE through the touch contact hole TCNT1 that penetrates the second touch insulating film TINS2.

[0141] The third touch insulating film TINS3 can be formed on the driving electrode TE and the sensing electrode RE. The third touch insulating film TINS3 can be used to flatten the steps formed by the driving electrode TE, the sensing electrode RE and the connecting electrode BE. The third touch insulating film TINS3 can be formed as an organic film made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0142] Figure 8 This is a plan view showing the panel support member 700 according to an embodiment. Figure 9 yes Figure 8 A magnified view of region A. Figure 10 It is along Figure 8 The sectional view taken by line X2-X2'.

[0143] Reference Figures 8 to 10 The panel support member 700 may include a folded portion 710, a first non-folded portion 720, and a second non-folded portion 730. The folded portion 710 may be disposed in a folded region FDA, the first non-folded portion 720 may be disposed in a first non-folded region NFA1, and the second non-folded portion 730 may be disposed in a second non-folded region NFA2.

[0144] In some embodiments, the folded region FDA may be the region provided with the folded portion 710, and the first non-folded region NFA1 and the second non-folded region NFA2 may be the regions provided with the first non-folded portion 720 and the second non-folded portion 730, respectively.

[0145] The folding portion 710 may be the portion that is folded when the display device 10 is folded. The folding portion 710 may be disposed in the second direction DR2 between the first non-folding portion 720 and the second non-folding portion 730.

[0146] The first non-folding portion 720 and the second non-folding portion 730 can be portions that are not folded when the display device 10 is folded. The first non-folding portion 720 can be disposed on one side of the folding portion 710 in the second direction DR2, and the second non-folding portion 730 can be disposed on the other side of the folding portion 710 in the second direction DR2.

[0147] In some embodiments, the through-hole STH penetrating the panel support member 700 may be provided in the first non-folding portion 720 or the second non-folding portion 730. For example, as Figure 8 As shown, the through hole STH can be configured to be adjacent to one side of the first non-folded portion 720 in the second direction DR2.

[0148] The folded portion 710 may include a grating pattern. For example, the folded portion 710 may include a plurality of bar arrays (BARs) and a plurality of slits (SLTs) disposed between the plurality of bar arrays.

[0149] like Figure 9 As shown, the multiple bars may include multiple horizontal bars all extending in the second direction DR2 and multiple vertical bars all extending in the first direction DR1. The multiple bars of the folded portion 710 can be seamlessly connected to each other, and the first non-folded portion 720 and the second non-folded portion 730 can be seamlessly connected to each other.

[0150] like Figure 10 As shown, each of the plurality of slits SLT can be a hole that penetrates the third-direction DR3 and passes through the panel support member 700. Figure 9 As shown, each of the plurality of slits SLT can extend in the first direction DR1. For example, the length of each of the plurality of slits SLT in the first direction DR1 can be greater than the length of each of the plurality of slits SLT in the second direction DR2. The folding portion 710 can be flexible by including the plurality of slits SLT. That is, when the display device 10 is folded, the folding portion 710 can be stretched in the second direction DR2.

[0151] In the display device 10 according to this embodiment, the panel support member 700 may further include a plating layer 750. The plating layer 750 can be formed by plating the main body of the panel support member 700 (the remaining portion of the panel support member 700 other than the plating layer 750) with a metal material.

[0152] The coating 750 can be disposed inside the plurality of slit SLTs. For example, the coating 750 can be disposed on the inner surface of the plurality of slit SLTs. The coating 750 includes a first side surface coating disposed on one side of each of the plurality of slit SLTs and a second side surface coating disposed on the other side thereon. Since the coating 750 is disposed on the inner surface of the plurality of slit SLTs, the panel support member 700 can include a plurality of openings OP having dimensions smaller than the dimensions of the plurality of slit SLTs. That is, each of the plurality of openings OP is disposed in the space between the first side surface coating and the second side surface coating.

[0153] The width W_OP of each of the plurality of openings OP can be smaller than the width W_SLT of each of the plurality of slits SLT. Here, the width W_OP of each of the plurality of openings OP and the width W_SLT of each of the plurality of slits SLT refer to the length of the opening OP in the short side direction and the length of the slit SLT in the short side direction, respectively (e.g., the length of the opening OP in the second direction DR2 and the length of the slit SLT in the second direction DR2).

[0154] exist Figure 10 The diagram shows that the width W_SLT of each of the plurality of slits SLT is smaller than the thickness TH1 of the portion of the panel support member 700 excluding the plating 750, but this is for illustrative purposes only and the disclosure is not limited thereto. That is, the relationship between the width W_SLT of each of the plurality of slits SLT and the thickness TH1 of the portion of the panel support member 700 excluding the plating 750 is... Figure 10 The relationships shown are irrelevant.

[0155] In some embodiments, the width W_SLT of each of the plurality of slits SLT may be greater than or equal to the thickness TH1 of the portion of the panel support member 700 excluding the plating 750. In another embodiment, the width W_SLT of each of the plurality of slits SLT may be greater than or equal to 0.8 times the thickness TH1 of the portion of the panel support member 700 excluding the plating 750.

[0156] Multiple slits SLT can be formed by processing the body of the panel support member 700 via wet etching or sandblasting. The processing should be performed fully from the upper surface to the lower surface of the panel support member 700 to form slits SLT penetrating the panel support member 700. Due to the characteristics of the processing, the body of the panel support member 700 is processed in a first direction DR1 and a second direction DR2 as horizontal directions, as well as in a thickness direction (e.g., a third direction DR3), and therefore, it is not easy to make the width W_SLT of each of the multiple slits SLT smaller than the thickness TH1 of the portion of the panel support member 700 excluding the plating 750.

[0157] In some cases, depending on the processing method, the width W_SLT of each of the plurality of slits SLT can be made smaller than the thickness TH1 of the portion of the panel support member 700 excluding the plating 750. However, it is not easy to make the width W_SLT of each of the plurality of slits SLT smaller than 0.8 times the thickness TH1 of the portion of the panel support member 700 excluding the plating 750. For example, the minimum value of the width W_SLT of each of the plurality of slits SLT can be approximately 80 μm.

[0158] The display device 10 according to this embodiment includes a plating layer 750, and therefore, the width of the hole penetrating the panel support member 700 can be minimized. For example, the plating layer 750 is provided on the inner surface of the plurality of slits SLT, and therefore, the width of the hole penetrating the panel support member 700 can be reduced from the width W_SLT of each of the plurality of slits SLT to the width W_OP of each of the plurality of openings OP. That is, in the display device 10 according to this embodiment, by providing the plating layer 750 on the inner surface of the plurality of slits SLT, rather than reducing the width W_SLT of each of the plurality of slits SLT, the width of the hole penetrating the panel support member 700 can be reduced to the width W_OP of each of the plurality of openings OP. Therefore, the impact resistance of the display device 10 can be enhanced. Referring later... Figure 11 and Figure 12 This describes why the impact resistance of the display device 10 is enhanced when the width of the hole penetrating the panel support member 700 is reduced.

[0159] In some embodiments, the coating 750 may include a metallic material. For example, the coating 750 may include at least one of nickel, chromium, copper, zinc, gold, silver, palladium, tin, aluminum, iron, cobalt, and alloys thereof.

[0160] The plating 750 of the display device 10 according to this embodiment includes a metallic material, and therefore, the flexural strength of the panel support member 700 can be maintained or increased. For example, the flexural strength of the panel support member 700 may be affected by the rigidity of the material of the outermost layer of the panel support member 700 (such as the upper and lower surfaces, inner surfaces, and side surfaces). When the plating 750 includes such a metallic material, the flexural strength of the panel support member 700 can be maintained or increased compared to when the plating 750 is not present. Furthermore, the plating 750 can have advantages such as higher durability, abrasion resistance, corrosion resistance, heat resistance, and adhesive strength than when coated with polymer materials, organic materials, etc.

[0161] Although for the sake of explanation, Figure 9The coating 750 on the upper surface of the multiple bars is not shown, but as... Figure 10 As shown, the coating 750 can also be applied to the upper and lower surfaces of multiple bar bars.

[0162] For example, coating 750 may include a side surface coating 751, an upper surface coating 752, and a lower surface coating 753. The side surface coating 751 may be disposed on the inner surface of each of the plurality of slits SLT. The upper surface coating 752 may be disposed on the upper surface of each of the plurality of strip bars, the upper surface of the first non-folded portion 720, the upper surface of the second non-folded portion 730, and the upper surface of the side surface coating 751. The lower surface coating 753 may be disposed on the lower surface of each of the plurality of strip bars, the lower surface of the first non-folded portion 720, the lower surface of the second non-folded portion 730, and the lower surface coating 751. The side surface coating 751, the upper surface coating 752, and the lower surface coating 753 may be integrally connected to each other.

[0163] exist Figure 10 The diagram shows a side surface coating 751 as a vertical surface extending in the third direction DR3, and upper surface coating 752 and lower surface coating 753 as horizontal surfaces perpendicular to the third direction DR3. The thickness of each of the side surface coating 751, upper surface coating 752, and lower surface coating 753 is constant, but this disclosure is not limited thereto. That is, the thickness of each of the side surface coating 751, upper surface coating 752, and lower surface coating 753 can be determined based on the step coverage rather than being constant. For example, the side surface coating 751 may have a thickness that decreases towards the center portion (the center portion of the panel support member 700 in the third direction DR3) and may have a thickness that increases towards the edge portions adjacent to the upper surface coating 752 and lower surface coating 753.

[0164] In some embodiments, the thickness TH_750 of the coating 750 may be less than half the thickness TH1 of the portion of the panel support member 700 excluding the coating 750. For example, the thickness TH_750 of the coating 750 may be approximately 40 μm or less. Here, the thickness TH_750 of the coating 750 refers to the length of the side surface coating 751 in the second direction DR2, the length of the upper surface coating 752 in the third direction DR3, and the length of the lower surface coating 753 in the third direction DR3. Furthermore, the thickness TH_750 of the coating 750 refers to the thickness at the portion where the thickness is smallest when the thicknesses of the side surface coating 751, the upper surface coating 752, and the lower surface coating 753 are not constant.

[0165] In some embodiments, the thickness TH1 of the portion of the panel support member 700 excluding the plating 750 can be approximately 80 μm to 120 μm. The thickness TH2 of the panel support member 700 including the plating 750 can be approximately 100 μm to 150 μm.

[0166] In some embodiments, the width W_SLT of each of the plurality of slits SLT can be approximately 60 μm to 150 μm. The width W_OP of each of the plurality of openings OP can be approximately 10 μm to 100 μm. Suitablely, the width W_OP of each of the plurality of openings OP can be approximately 50 μm or less.

[0167] The display device 10 according to this embodiment includes an upper surface plating layer 752 and a lower surface plating layer 753, thus the thickness TH1 of the panel support member 700 other than the plating layer 750 can be reduced. Therefore, the width W_SLT of each of the plurality of slits SLT can also be reduced.

[0168] For example, considering the rigidity of the support for the display panel 400 and the foldability of the display device 10, the overall thickness of the panel support member 700 can have a predetermined range, ensuring that the overall thickness of the panel support member 700 is neither too small nor too large. Similar to the thickness TH2 of the panel support member 700 including the aforementioned plating layer 750, an example value for the overall thickness of the panel support member 700 can be approximately 100 μm to 150 μm.

[0169] The display device 10 according to this embodiment includes an upper surface plating layer 752 and a lower surface plating layer 753, thus the thickness TH1 of the portion of the panel support member 700 excluding the plating layer 750 can be reduced while maintaining the overall thickness of the panel support member 700. As described above, an example value for the thickness TH1 of the portion of the panel support member 700 excluding the plating layer 750 can be approximately 80 μm to 120 μm.

[0170] When the thickness TH1 of the portion of the panel support member 700 excluding the plating layer 750 is reduced as described above, the width W_SLT of each of the plurality of slits SLT can also be reduced during the slit SLT manufacturing process. Therefore, in addition to the reduction in the width of the hole penetrating the panel support member 700 due to the side surface plating layer 751, by providing the upper surface plating layer 752 and the lower surface plating layer 753, the thickness TH1 of the portion of the panel support member 700 excluding the plating layer 750 is reduced, allowing the width W_SLT of each of the plurality of slits SLT to be reduced. Therefore, the width of the hole penetrating the panel support member 700 can be further reduced.

[0171] Since the plating 750 comprises a metallic material, even if the difference between the thickness TH1 of the portion of the panel support member 700 excluding the plating 750 and the thickness TH2 of the panel support member 700 including the plating 750 is replaced by the thickness TH_750 of the plating 750, the physical properties of the panel support member 700, such as rigidity and modulus of elasticity, can be maintained at a similar level.

[0172] Figure 11 This is a cross-sectional view showing the impact resistance test of the display device 10 according to an embodiment. Figure 12 This is a cross-sectional view showing the impact resistance test of the display device 10' according to the comparative example.

[0173] Apart from Figure 6 and Figures 8 to 10 In addition, refer to Figure 11 and Figure 12 The display device 10 according to the embodiment may include a panel support member 700 and an upper member UM disposed above the panel support member 700. The display device 10' according to the comparative example may include a panel support member 700' and an upper member UM disposed above the panel support member 700'.

[0174] like Figure 6 As shown, the upper component UM of each of the display device 10 according to the embodiment and the display device 10' according to the comparative example may include a cover window CCW, an upper protective component 100, a window component 200, a first adhesive component 300, a display panel 400, a panel protective component 500, and a lower panel component 600.

[0175] The panel support member 700 of the display device 10 according to the embodiment and the reference Figures 8 to 10 The panel support member 700 described is substantially the same. The panel support member 700' of the display device 10' in the comparative example is similar to the reference... Figures 8 to 10 The difference in the described panel support member 700 is that the panel support member 700' does not include the plating 750.

[0176] Figure 11 and Figure 12 The states in which the display device 10 according to the embodiment and the display device 10' according to the comparative example are subjected to the impact resistance test based on the pen stroke are shown respectively.

[0177] like Figure 12 As shown, the display device 10' according to the comparative example does not include the plating layer 750. Therefore, the width HOL_W' of the hole penetrating the panel support member 700 is relatively large, which makes the deformation applied to the upper member UM due to the impact caused by the pen stroke potentially large.

[0178] like Figure 11As shown, the display device 10 according to the embodiment includes a plating layer 750, so the width HOL_W of the hole penetrating the panel support member 700 is relatively small, so that the deformation applied to the upper member UM due to the impact caused by the pen can be small.

[0179] For example, the strain of the upper component UM in the display device 10' according to the comparative example may be two or more times the strain of the upper component UM in the display device 10 according to the embodiment. Therefore, bright spots may appear in the display panel 400 including the upper component UM in the display device 10' according to the comparative example, while no bright spots may appear in the display panel 400 including the upper component UM in the display device 10 according to the embodiment.

[0180] As described above, the display device 10 according to this embodiment includes a plating layer 750. Therefore, the width HOL_W of the hole penetrating the panel support member 700 can be reduced, thereby enhancing the impact resistance of the display device 10. For example, in the display device 10 according to this embodiment, the width HOL_W of the hole penetrating the panel support member 700 can be defined as the width of the opening OP, and the width of the opening OP can be approximately 50 μm or less. When the width of the opening OP is approximately 50 μm or less, the strain of the upper member UM decreases, thereby enhancing the impact resistance of the display device 10.

[0181] In the following description, other embodiments of the display device 10 according to the embodiments will be described. In the following embodiments, components that are the same as those in the above embodiments will be indicated by the same reference numerals, and repeated descriptions will be omitted or simplified, and the contents that differ from those described above will be mainly described.

[0182] Figure 13 This is a cross-sectional view showing the panel support member 700 according to an embodiment.

[0183] Reference Figure 13 The display device 10 according to this embodiment and the reference 10 according to the present embodiment Figure 10 The difference between the display device 10 described in the embodiments is that it does not include the upper surface plating layer 752 and the lower surface plating layer 753.

[0184] More specifically, in the display device 10 according to this embodiment, compared with the reference... Figure 10Similar to the display device 10 described in the embodiments, the plating layer 750 can be disposed inside the plurality of slits SLT. For example, the plating layer 750 can be disposed on the inner surface of the plurality of slits SLT. Since the plating layer 750 is disposed on the inner surface of the plurality of slits SLT, the panel support member 700 can include a plurality of openings OP having dimensions smaller than the dimensions of the plurality of slits SLT. The width W_OP of each of the plurality of openings OP can be smaller than the width W_SLT of each of the plurality of slits SLT.

[0185] However, in the display device 10 according to this embodiment, the plating layer 750 may only include the side surface plating layer 751. For example, in the display device 10 according to this embodiment, the plating layer 750 may not include the plating layer according to the reference. Figure 10 The upper surface coating 752 and the lower surface coating 753 of the embodiments described above.

[0186] The coating 750 may consist only of the side surface coating 751, and therefore the coating 750 may be disposed on the inner surface of the plurality of slits SLT, but the coating 750 may not be disposed on the upper and lower surfaces of each of the plurality of strips BAR, the upper and lower surfaces of the first non-folded portion 720, the upper and lower surfaces of the second non-folded portion 730, and the upper and lower surfaces of the side surface coating 751.

[0187] The plating 750 of the panel support member 700 according to this embodiment can be formed by shielding the upper and lower surfaces of each of the plurality of strip bars, the upper and lower surfaces of the first non-folded portion 720, and the upper and lower surfaces of the second non-folded portion 730.

[0188] The display device 10 according to this embodiment does not include the upper surface plating layer 752 and the lower surface plating layer 753. Therefore, the thickness TH1 of the portion of the panel support member 700 excluding the plating layer 750 can be the same as the thickness TH2 of the panel support member 700 including the plating layer 750. That is, even if the total thickness of the panel support member 700 does not include the thickness TH_750 of the plating layer 750, the total thickness of the panel support member 700 can be the same.

[0189] Therefore, in the display device 10 according to this embodiment, the thickness of the panel support member 700 can remain constant regardless of the thickness TH_750 of the plating layer 750. Thus, the rigidity and other physical properties of the panel support member 700 can be minimized due to the influence of the plating process yield.

[0190] Figure 14 This is a cross-sectional view showing the panel support member 700 according to an embodiment. Figure 15 This is a cross-sectional view showing the panel support member 700 according to an embodiment.

[0191] Reference Figure 14 and Figure 15 The display device 10 according to this embodiment and the reference 10 according to the present embodiment Figure 10 The difference between the display device 10 of the embodiments described above and the one described above is that it does not include either the upper surface plating layer 752 or the lower surface plating layer 753.

[0192] More specifically, in the display device 10 according to this embodiment, compared with the reference... Figure 10 Similar to the display device 10 described in the embodiments, the plating layer 750 can be disposed inside the plurality of slits SLT. For example, the plating layer 750 can be disposed on the inner surface of the plurality of slits SLT. Since the plating layer 750 is disposed on the inner surface of the plurality of slits SLT, the panel support member 700 can include a plurality of openings OP having dimensions smaller than the dimensions of the plurality of slits SLT. The width W_OP of each of the plurality of openings OP can be smaller than the width W_SLT of each of the plurality of slits SLT.

[0193] However, in the display device 10 according to this embodiment, in addition to the side surface plating layer 751, the plating layer 750 may also include only either the upper surface plating layer 752 or the lower surface plating layer 753.

[0194] In an embodiment, such as Figure 14 As shown, in the display device 10 according to this embodiment, the plating layer 750 may not include the upper surface plating layer 752, but may include the lower surface plating layer 753. In this case, the plating layer 750 may include the side surface plating layer 751 and the lower surface plating layer 753, and therefore, the plating layer 750 may be provided on the inner surface of the plurality of slits SLT, the lower surface of each of the plurality of strip bars, the lower surface of the first non-folded portion 720, the lower surface of the second non-folded portion 730, and the lower surface of the side surface plating layer 751, but the plating layer 750 may not be provided on the upper surface of each of the plurality of strip bars, the upper surface of the first non-folded portion 720, the upper surface of the second non-folded portion 730, and the upper surface of the side surface plating layer 751.

[0195] according to Figure 14 The plating 750 of the panel support member 700 in the embodiment can be formed by shielding the upper surface of each of the plurality of strip bars, the upper surface of the first non-folded portion 720 and the upper surface of the second non-folded portion 730.

[0196] In an embodiment, such as Figure 15As shown, in the display device 10 according to this embodiment, the plating layer 750 may not include the lower surface plating layer 753, but may include the upper surface plating layer 752. In this case, the plating layer 750 may include the side surface plating layer 751 and the upper surface plating layer 752. Therefore, the plating layer 750 may be provided on the inner surface of the plurality of slits SLT, the upper surface of each of the plurality of strip bars, the upper surface of the first non-folded portion 720, the upper surface of the second non-folded portion 730, and the upper surface of the side surface plating layer 751. However, the plating layer 750 may not be provided on the lower surface of each of the plurality of strip bars, the lower surface of the first non-folded portion 720, the lower surface of the second non-folded portion 730, and the lower surface of the side surface plating layer 751.

[0197] according to Figure 15 The plating 750 of the panel support member 700 in the embodiment can be formed by shielding the lower surface of each of the plurality of strip bars, the lower surface of the first non-folded portion 720 and the lower surface of the second non-folded portion 730.

[0198] The display device 10 according to this embodiment includes only one of the upper surface plating layer 752 and the lower surface plating layer 753, and therefore, the thickness TH1 of the portion of the panel support member 700 other than the plating layer 750 can be smaller than the thickness TH2 of the panel support member 700 including the plating layer 750 by the thickness TH_750 of the plating layer 750.

[0199] Therefore, in the display device 10 according to this embodiment, by adjusting the thickness TH_750 of the plating layer 750, the thickness TH2 of the panel support member 700 can be adjusted, and the rigidity and other properties of the panel support member 700 can be adjusted according to the thickness TH2 of the panel support member 700.

[0200] Furthermore, for the display device 10 according to this embodiment, considering the relationship with another component disposed on the upper or lower surface of the panel support member 700, the adhesive strength of the adhesive component, etc., either the upper surface plating layer 752 or the lower surface plating layer 753 may be omitted.

[0201] Figure 16 This is a cross-sectional view showing the panel support member 700 according to an embodiment.

[0202] Reference Figure 16 The display device 10 according to this embodiment and the reference 10 according to the present embodiment Figure 10 The difference between the display device 10 of the embodiments described above and the one described is that the upper surface plating layer 752 and the lower surface plating layer 753 are not provided on the non-folded portions 720 and 730.

[0203] More specifically, in the display device 10 according to this embodiment, compared with the reference... Figure 10Similar to the display device 10 described in the embodiments, the plating layer 750 can be disposed inside the plurality of slits SLT. For example, the plating layer 750 can be disposed on the inner surface of the plurality of slits SLT. Since the plating layer 750 is disposed on the inner surface of the plurality of slits SLT, the panel support member 700 can include a plurality of openings OP having dimensions smaller than the dimensions of the plurality of slits SLT. The width W_OP of each of the plurality of openings OP can be smaller than the width W_SLT of each of the plurality of slits SLT.

[0204] However, in the display device 10 according to this embodiment, the plating layer 750 in the non-folded portions 720 and 730 may differ from the plating layer 750 in the folded portion 710. For example, the upper surface plating layer 752 and the lower surface plating layer 753 may be provided on the folded portion 710, and may not be provided on the non-folded portions 720 and 730.

[0205] The side surface plating 751 may be superimposed on the folded portion 710 on the third-direction DR3, but may not be superimposed on the non-folded portions 720 and 730 on the third-direction DR3. Each of the upper surface plating 752 and the lower surface plating 753 may be superimposed on the folded portion 710 on the third-direction DR3, but may not be superimposed on the non-folded portions 720 and 730 on the third-direction DR3.

[0206] The upper surface plating 752 can be disposed on the upper surface of each of the plurality of strip bars, and the lower surface plating 753 can be disposed on the lower surface of each of the plurality of strip bars. The upper surface plating 752 may not be disposed on the upper surface of the first non-folded portion 720 and the upper surface of the second non-folded portion 730, and the lower surface plating 753 may not be disposed on the lower surface of the first non-folded portion 720 and the lower surface of the second non-folded portion 730.

[0207] The upper surface plating layer 752 may be disposed on the upper surface of the side surface plating layer 751 disposed on both sides of each of the plurality of bar bars, but may not be disposed on the upper surface of the side surface plating layer 751 adjacent to the first non-folded portion 720 and the second non-folded portion 730. The lower surface plating layer 753 may be disposed on the lower surface of the side surface plating layer 751 disposed on both sides of each of the plurality of bar bars, but may not be disposed on the lower surface of the side surface plating layer 751 adjacent to the first non-folded portion 720 and the second non-folded portion 730.

[0208] The plating 750 of the panel support member 700 according to this embodiment can be formed by shielding the upper and lower surfaces of the first non-folded portion 720 and the upper and lower surfaces of the second non-folded portion 730.

[0209] In the display device 10 according to this embodiment, the plating layer 750 is disposed in the non-folded portions 720 and 730 differently from the plating layer 750 in the folded portion 710. Therefore, the thickness of the panel support member 700 in the non-folded portions 720 and 730 and the thickness of the panel support member 700 in the folded portion 710 may be different from each other. For example, the thickness TH1 of the portion of the panel support member 700 other than the plating layer 750 in the non-folded portions 720 and 730 and the thickness TH1 of the portion of the panel support member 700 other than the plating layer 750 in the folded portion 710 may be the same as each other.

[0210] In an embodiment, the thickness TH2 of the panel support member 700 including plating 750 in the non-folded portions 720 and 730 and the thickness TH2 of the panel support member 700 including plating 750 in the folded portion 710 can be different from each other. For example, the thickness TH2_1 of the panel support member 700 including plating 750 in the region overlapping with the folded portion 710 can be greater than the thickness TH_750 of plating 750 (e.g., twice the thickness TH_750 of plating 750) than the thickness TH1 of the portion of the panel support member 700 excluding plating 750. The thickness TH2_2 of the panel support member 700 including plating 750 in the region overlapping with the non-folded portions 720 and 730 can be the same as the thickness TH1 of the portion of the panel support member 700 excluding plating 750. In other words, even if the total thickness of the panel support member 700 in the area overlapping with the non-folded portions 720 and 730 does not include the thickness TH_750 of the plating 750, the total thickness of the panel support member 700 in the area overlapping with the non-folded portions 720 and 730 can be the same.

[0211] In the display device 10 according to this embodiment, by making the arrangement of the plating 750 in the non-folded portions 720 and 730 different from the arrangement of the plating 750 in the folded portion 710, the impact resistance of the non-folded portions 720 and 730 and the folded portion 710 can be balanced. For example, when the plating 750 is not included, the folded portion 710 may have lower impact resistance than the non-folded portions 720 and 730. Therefore, by providing the upper surface plating 752 and the lower surface plating 753 only on the folded portion 710, which has relatively lower impact resistance, the impact resistance of the folded portion 710 and the non-folded portions 720 and 730 can be balanced.

[0212] In concluding this detailed description, those skilled in the art will understand that many variations and modifications can be made to the embodiments without substantially departing from the principles of this disclosure. Therefore, the disclosed embodiments of the inventive concept are used in a general and descriptive sense only and not for limiting purposes.

Claims

1. A display device, the display device comprising: Display panel; as well as A panel support member is disposed on the display panel and includes a folding portion and a non-folding portion disposed on at least one side of the folding portion. The folded portion includes multiple slits penetrating the panel support member and multiple strips alternately arranged with the multiple slits. The panel support member further includes a plating layer that covers at least a portion of the folded portion and comprises a metallic material. The coating is disposed on the inner surface of the plurality of slits.

2. The display device according to claim 1, wherein, The metallic material of the coating includes at least one of nickel, chromium, copper, zinc, gold, silver, palladium, tin, aluminum, iron, cobalt, and alloys thereof.

3. The display device according to claim 1, wherein, The width of one of the plurality of slits is greater than or equal to the thickness of the portion of the panel support member excluding the coating.

4. The display device according to claim 1, wherein, The coating includes a first side surface coating disposed on one side of one of the plurality of slits and a second side surface coating disposed on the other side of the slit. The panel support member includes an opening disposed in the space between the first side surface coating and the second side surface coating, and The width of the opening is smaller than the width of the slit.

5. The display device according to claim 4, wherein, The width of the opening is 50 μm or less.

6. The display device according to claim 1, wherein, The thickness of the coating is less than half the thickness of the portion of the panel support member excluding the coating.

7. The display device according to claim 6, wherein, The thickness of the coating is 40 μm or less.

8. The display device according to claim 1, wherein, The coating is also disposed on at least one of the upper and lower surfaces of the panel support member.

9. The display device according to claim 8, wherein, The coating includes a side surface coating disposed on the inner surface of the plurality of slits, and The coating further includes at least one of an upper surface coating disposed on the upper surface of the panel support member and a lower surface coating disposed on the lower surface of the panel support member.

10. The display device according to claim 9, wherein, The upper surface coating is applied to the folded portion but not to the non-folded portion.

11. The display device according to claim 1, wherein, The panel support component includes a metal plate or a fiber polymer.

12. A display device, the display device comprising: Display panel; as well as A panel support member is disposed on the display panel and includes a folding portion and a non-folding portion disposed on at least one side of the folding portion. The folded portion includes multiple slits penetrating the panel support member and multiple strips alternately arranged with the multiple slits. The panel support member further includes a plating layer that covers at least a portion of the folded portion, and The coating includes a side surface coating disposed on the inner surface of the plurality of slits.

13. The display device according to claim 12, wherein, The coating also includes an upper surface coating disposed on the upper surface of the panel support member and a lower surface coating disposed on the lower surface of the panel support member. Each of the upper surface coating and the lower surface coating is disposed on the plurality of strips.

14. The display device according to claim 13, wherein, The upper surface coating and the lower surface coating are not applied to the non-folded portion.

15. The display device according to claim 14, wherein, The thickness of the panel support member in the area overlapping with the folded portion is greater than the thickness of the panel support member in the area overlapping with the non-folded portion.

16. The display device according to claim 13, wherein, At least one of the upper surface coating and the lower surface coating is also disposed on the non-folded portion.

17. The display device according to claim 12, wherein, The thickness of the coating is less than half the thickness of the portion of the panel support member excluding the coating.

18. The display device according to claim 12, wherein, The coating comprises a metallic material.

19. The display device according to claim 12, wherein, The panel support component includes a metal plate or a fiber polymer.

20. A foldable electronic device, the foldable electronic device including a display device, in, The display device includes: Display panel; A window component is positioned above the display panel; Upper protective component, provided on the window component; A cover window is installed on the upper protective member; A panel protective component is disposed below the display panel; and A panel support member is disposed below the panel protection member, and includes a folded portion and a non-folded portion disposed on at least one side of the folded portion. The folded portion includes multiple slits penetrating the panel support member and multiple strips alternately arranged with the multiple slits. The panel support member further includes a plating layer that covers at least a portion of the folded portion and comprises a metallic material. The coating is disposed on the inner surface of the plurality of slits.

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