Magnetic device and power conversion apparatus

Abstract

This application provides a magnetic device and a power conversion device, relating to the field of magnetic device technology. In the power conversion device, the magnetic device is disposed on one side of a circuit board. The magnetic device includes a first winding, a magnetic core post, and a plastic magnetic component. The first winding includes an insulating layer wrapped around its surface and wound around the outside of the magnetic core post. The plastic magnetic component covers the magnetic core post and part of the first winding, and fills the space between the magnetic core post and the first winding. The plastic magnetic component is stacked with the circuit board, and the end of the first winding is exposed outside the plastic magnetic component and electrically connected to the circuit board. The magnetic device is encapsulated by the plastic magnetic component, facilitating miniaturization design. The plastic magnetic component can magnetically shield the first winding, which helps reduce magnetic losses. The insulating layer can ensure high withstand voltage insulation of the first winding and improve the stability and reliability of the first winding during the processing of the magnetic device.

Description

Technical Field

[0001] This application relates to the field of magnetic device technology, and in particular to a magnetic device and power conversion equipment. Background Technology

[0002] In power conversion equipment (such as photovoltaic optimizers), magnetic devices are key components for energy conversion and signal transmission, and their size determines the overall size of the power conversion equipment. In existing technologies, when high-voltage current needs to be applied to the windings of magnetic devices, the manufacturing process requires placing the windings in a mounting housing, which is then filled with a molding compound for encapsulation. The molding compound integrates the mounting housing and windings. Due to the large size of the mounting housing, magnetic devices suffer from significant size limitations, making miniaturization difficult. Summary of the Invention

[0003] This application provides a magnetic device and a power conversion device, which aims to solve the technical problem that magnetic devices are not conducive to miniaturization design.

[0004] In a first aspect, embodiments of this application provide a power conversion device. The power conversion device includes a circuit board and magnetic components, with the magnetic components disposed on one side of the circuit board. The magnetic components include a first winding, a core post, and a plastic magnetic component. The first winding includes an insulating layer wrapped around its surface and is wound around the outside of the core post. The plastic magnetic component covers the core post and a portion of the first winding, and the plastic component fills the space between the core post and the first winding. The plastic magnetic component is stacked on top of the circuit board, with the end of the first winding exposed outside the plastic magnetic component and electrically connected to the circuit board.

[0005] In this embodiment, the magnetic device is electrically connected to other electronic devices via a circuit board. The stacked arrangement of the plastic magnetic component and the circuit board increases the contact area between them, improving the structural stability and reliability of the magnetic device and the circuit board. During the processing of the magnetic device, an insulating layer is first formed on the surface of the first winding. The first winding and the magnetic core pillar are placed in a mold, with the first winding wound around the outside of the magnetic core pillar. A plastic magnetic material is filled into the mold, softened under high temperature and pressure, and then cooled to form the plastic magnetic component, thus forming the magnetic device. The plastic magnetic component covers the magnetic core pillar and part of the first winding, with the end of the first winding exposed outside the plastic magnetic component. The first winding is isolated from the plastic magnetic component by the insulating layer. The magnetic device can be removed from the mold. The magnetic device encapsulates the first winding and the magnetic core pillar through the plastic magnetic component. When the first winding is energized, it can generate a magnetic field, which can be concentrated in the central column of the magnetic core. By adjusting the permeability of the central column of the magnetic core, the electromagnetic loss and bias of the magnetic device can be adjusted, thereby adjusting the current carrying efficiency of the first winding and realizing flexible adjustment of the performance of the magnetic device.

[0006] In existing technologies, when high-voltage current needs to be applied to the windings of magnetic devices, the manufacturing process requires placing the windings in a mounting housing, then filling the housing with a molding compound for encapsulation. The molding compound is fixedly connected to the mounting housing, and the mounting housing is integrated into the magnetic device. Compared to existing technologies, the magnetic device in this application, encapsulated with a plastic magnetic component, avoids introducing an additional mounting housing. This reduces the board area occupied by the magnetic device and its axial dimensions along the core column, thus reducing its volume and facilitating miniaturization and lightweight design of the magnetic device and power conversion equipment. Furthermore, the appearance of the magnetic device can be simplified and standardized, facilitating storage and automated manufacturing. Additionally, because the plastic magnetic component is magnetic, it can suppress leakage magnetic flux generated when the first winding is energized. The plastic magnetic component provides magnetic shielding for the first winding, reducing magnetic losses and improving current-carrying efficiency. While maintaining current-carrying efficiency, this reduces the volume of the first winding and lowers the manufacturing cost of the magnetic device.

[0007] Furthermore, both the insulating layer and the plastic magnetic component possess insulating properties, enabling high-voltage insulation of the first winding. Moreover, during the fabrication of the magnetic device, the insulating layer protects the first winding, preventing deformation under high-voltage conditions and avoiding direct contact between the first winding and the high-temperature plastic magnetic material. This prevents a reaction between the first winding and the plastic magnetic material, improving the stability and reliability of the first winding during the fabrication process, reducing the fabrication difficulty, and increasing the fabrication efficiency of the magnetic device.

[0008] In one possible implementation, the magnetic device further includes a first magnetic element with a receiving hole. The receiving hole is located in the first magnetic element along the axial direction of the magnetic core column. At least a portion of the magnetic core column and a portion of the first winding are received in the receiving hole. The end of the first winding is located outside the receiving hole. A plastic magnetic element covers the first magnetic element.

[0009] In this way, the magnetic field generated when the first winding is energized can be concentrated not only in the core column but also in the first magnetic component, which helps reduce the magnetic loss of the magnetic device and improve the current carrying efficiency of the first winding. Moreover, during the processing of the magnetic device, the first magnetic component can be placed in the mold first, and the core column and the first winding can then be housed in the receiving hole. The magnetic device can be formed by filling the mold with plastic magnetic material once, which avoids filling the plastic magnetic material multiple times during the processing of the magnetic device and helps improve the processing efficiency of the magnetic device.

[0010] In one possible implementation, the first magnetic component is provided with a mounting hole that extends through the first magnetic component along the axial direction of the magnetic core column. In the radial direction of the magnetic core column, the mounting hole is located on one side of the receiving hole. A first winding portion passes through the mounting hole, and the end of the first winding is located outside the mounting hole.

[0011] In this way, the first winding can be accommodated in the receiving hole along the axial direction of the central column of the magnetic core and inserted into the mounting hole, realizing the assembly of the first winding and the first magnetic component. This facilitates assembly and helps improve the structural stability and reliability of the magnetic device. Moreover, by limiting the first winding with the first magnetic component, it is possible to prevent the first winding from tilting due to shaking or vibration during the processing of the magnetic device, which helps improve the stability and reliability of the first winding during the processing of the magnetic device.

[0012] In one possible implementation, the end of the first winding is exposed outside the radial side of the plastic magnetic component on the central column of the magnetic core, and the power conversion device further includes a first conductive component disposed between the end of the first winding and the circuit board.

[0013] In this way, the end of the first winding is electrically connected to the circuit board through the first conductive element. Furthermore, the portion of the first winding wound around the outside of the magnetic core post avoids significant bends, which improves the structural stability and reliability of the first winding. Additionally, the length of the first winding can be designed to be shorter, which helps reduce its parasitic resistance and improves its current-carrying efficiency.

[0014] In one possible implementation, the end of the first winding is exposed outside the side of the plastic magnet on the axial side of the column in the core.

[0015] This helps to reduce the radial dimensions of the magnetic device in the core, improves the space utilization of the magnetic device, reduces the board area occupied by the magnetic device, and facilitates the miniaturization design of the magnetic device.

[0016] In one possible implementation, the first winding includes a first end portion, and the first winding also includes a first main body portion and a first connecting portion. The first main body portion is wound around the outside of the magnetic core column. In the axial direction of the magnetic core column, one end of the first connecting portion is disposed at one end of the first main body portion, and the other end is disposed at the first end portion. In a direction perpendicular to the axial direction of the magnetic core column, the first end portion is located on one side of the first connecting portion and is perpendicular to the axial direction of the magnetic core column. The first end portion is stacked with the circuit board, and the side of the first end portion in the axial direction of the magnetic core column is flush with the side of the plastic magnetic component in the axial direction of the magnetic core column.

[0017] In this way, magnetic components can be directly mounted on the circuit board, eliminating the need for through-holes on the circuit board for insertion into the ends of the first winding. This reduces the thickness of the circuit board and simplifies wiring. Furthermore, the mounting method of magnetic components onto the circuit board is compatible with automated design, improving assembly efficiency.

[0018] In one possible implementation, the magnetic device further includes a second winding wound around the central post of the magnetic core and located between the first winding and the central post of the magnetic core. The cross-sectional area of ​​the second winding is smaller than that of the first winding. A portion of the second winding is covered by a plastic magnetic component, and the end of the second winding is exposed outside the plastic magnetic component.

[0019] In the fabrication of magnetic devices, the first winding, second winding, and core post can be encapsulated in a single process using a plastic magnetic component. A single magnetic device can integrate multiple functions (such as filtering, power transmission, or signal transmission) through the first and second windings, avoiding the need for multiple magnetic devices on a circuit board to integrate multiple functions, thus facilitating miniaturization of the circuit board and power conversion equipment. Furthermore, the magnetic fields generated when the first and second windings are energized can both be concentrated in the core post. By adjusting the permeability of the core post, the current-carrying efficiency of the first and second windings can be adjusted simultaneously. Additionally, the heat generated by the first winding can be transferred to the outside of the magnetic device through its ends, and the heat generated by the second winding can also be transferred to the outside of the magnetic device through its ends. Moreover, the first and second windings can be wound separately, and the number of turns in each winding can be adjusted independently. Simultaneous winding of the first and second windings can be avoided, reducing the fabrication difficulty and cost of the magnetic device.

[0020] In one possible implementation, the ends of the first winding and the second winding are located on opposite sides of the core column in the radial direction.

[0021] The design that limits the positional relationship between the ends of the first winding, the ends of the second winding, and the central column of the magnetic core can prevent the heat generated by the first winding and the second winding from being transferred between their ends, which is beneficial to improving the heat dissipation efficiency of the first and second windings.

[0022] In one possible implementation, the magnetic device further includes a second winding, with the first winding and the second winding wound in parallel around the outside of the central column of the magnetic core, and a portion of the second winding covered by a plastic magnetic component, with the end of the second winding exposed outside the plastic magnetic component.

[0023] This ensures that the projection of the first winding along the axial direction of the magnetic core column has a large overlap area with the projection of the second winding along the axial direction of the magnetic core column. This is beneficial for improving the space utilization of the first winding, the second winding, and the magnetic core column, reducing the radial dimensions of the magnetic device in the magnetic core column, and facilitating the miniaturization design of the magnetic device.

[0024] In one possible implementation, the magnetic device further includes a heat-conducting element, which is partially disposed within the plastic magnetic component. The heat-conducting element is in contact with the insulating layer and partially exposed to the outside of the plastic magnetic component. The thermal conductivity of the heat-conducting element is greater than that of the plastic magnetic component.

[0025] In this way, the heat generated by the first winding can be transferred to the external environment through the insulation layer and the thermally conductive components. The design of the thermally conductive components having a higher thermal conductivity than the plastic magnetic components is beneficial for improving the heat dissipation efficiency of the first winding and for increasing the current carrying capacity of the first winding.

[0026] In one possible implementation, the heat-conducting element is exposed on the exterior of the plastic magnetic element on the side facing away from the circuit board.

[0027] The area of ​​the plastic magnetic component facing away from the circuit board is large enough, and the area of ​​the heat-conducting component exposed from the side of the plastic magnetic component facing away from the circuit board can be designed to be even larger, which is beneficial to improving the heat dissipation efficiency of the heat-conducting component for the first winding.

[0028] In one possible implementation, the heat-conducting element is located on the side of the insulating layer facing away from the core pillar in the radial direction of the core pillar.

[0029] This ensures that the insulating layer can contact the heat-conducting component on one side of the radial direction of the magnetic core column, which helps to increase the contact area between the heat-conducting component and the insulating layer, improves the heat transfer efficiency between the heat-conducting component and the insulating layer, and improves the heat dissipation efficiency of the first winding.

[0030] In one possible implementation, the size of the heat-conducting element is larger than the size of the core column along its axial direction.

[0031] This is beneficial for increasing the axial dimension of the heat-conducting component in the magnetic core, increasing the contact area between the heat-conducting component and the insulating layer, and improving the heat dissipation efficiency of the first winding.

[0032] In one possible implementation, there are multiple first windings and multiple core columns. Multiple core columns are arranged sequentially at intervals in the radial direction of the core columns. A first winding is wound around the outside of a core column, and the ends of multiple first windings are exposed on one side of the plastic magnetic component.

[0033] In the fabrication of magnetic devices, an insulating layer can be first applied to the surface of each first winding. Then, multiple first windings and multiple magnetic core pillars are housed in a mold. A plastic magnetic component is formed by filling the mold with a plastic magnetic material, achieving one-time encapsulation. In this way, different first windings can perform different functions, integrating different functions within the magnetic device. This avoids the need to place multiple magnetic devices on a circuit board to integrate multiple functions, facilitating the miniaturization design of circuit boards and power conversion equipment. Furthermore, the ends of multiple first windings are exposed on one side of the plastic magnetic component, improving the space utilization of the magnetic device, promoting miniaturization, and facilitating wiring on the circuit board for electrical connection between the circuit board and the ends of the multiple first windings. In one possible implementation, the power conversion device further includes a housing, with magnetic components and a circuit board housed within the housing, and the side of the plastic magnetic component facing away from the circuit board contacting the housing.

[0034] The heat generated by the first winding can be transferred to the external environment through the plastic magnetic component and the housing. The design of the plastic magnetic component in contact with the housing helps to shorten the heat dissipation path of the first winding and improves the heat dissipation efficiency of the first winding.

[0035] In one possible implementation, the permeability of the core column is greater than that of the plastic magnetic component.

[0036] The design of having a magnetic permeability greater than that of the plastic magnetic component ensures that most of the magnetic field generated when the first winding is energized is concentrated in the magnetic core. By adjusting the magnetic permeability of the magnetic core, the electromagnetic loss and bias of the magnetic device can be adjusted stably and quickly, thereby adjusting the current carrying efficiency of the first winding.

[0037] In one possible implementation, the insulating layer comprises multiple insulating films, which are sequentially wrapped around the surface of the first winding, and the insulating layer is elastic.

[0038] The plastic magnetic material used to form plastic magnetic parts has poor flowability, and the softening process under high temperature and pressure exerts significant pressure on the insulating layer. A single-layer insulating layer contains pores, making it prone to breakage under high pressure. The insulating layer consists of multiple insulating films, sequentially covering each other. The outer insulating film can cover the pores of the inner insulating film, making the insulating layer elastic. This reduces the impact of pores on the pressure resistance of the insulating layer, improving its pressure resistance. The insulating layer can withstand greater stress deformation, preventing breakage due to stress impact under high pressure during the processing of magnetic devices. This improves the structural stability and reliability of the insulating layer, enhancing the processing stability of magnetic devices. Furthermore, it improves the voltage resistance of the insulating layer, facilitating the application of magnetic devices in high-voltage current environments.

[0039] Secondly, embodiments of this application also provide a magnetic device. The magnetic device includes a first winding, a magnetic core post, and a plastic magnetic component. The first winding includes an insulating layer that wraps around the surface of the first winding. The first winding is wound around the outside of the magnetic core post. The plastic magnetic component covers the magnetic core post and part of the first winding, and the plastic magnetic component fills the space between the magnetic core post and the first winding. The end of the first winding is exposed outside the plastic magnetic component. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0041] Figure 1 This is a structural block diagram of a photovoltaic power generation system provided in an embodiment of this application under one application scenario; Figure 2 This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application; Figure 3 yes Figure 2 The diagram shows a cross-section of the power conversion device along line AA. Figure 4 yes Figure 2 A three-dimensional structural diagram of the magnetic components and circuit board of the power conversion device shown; Figure 5 yes Figure 4 The diagram shows a cross-section of the magnetic device along line BB. Figure 6 yes Figure 4 The diagram shown is a three-dimensional structural schematic of the magnetic device, omitting the plastic magnetic component. Figure 7 yes Figure 6 An exploded view of the three-dimensional structure of the magnetic device shown. Figure 8 This is a partial three-dimensional structural diagram of another magnetic device and circuit board provided in an embodiment of this application; Figure 9 yes Figure 8 The diagram shows an exploded view of the three-dimensional structure of the magnetic device and the circuit board. Figure 10 yes Figure 8 The diagram shown is a three-dimensional structural schematic of the magnetic device, omitting the plastic magnetic component. Figure 11 yes Figure 10 The diagram shown is an exploded 3D structure of the magnetic device without the insulating layer. Figure 12 This is a schematic diagram of another magnetic device provided in an embodiment of this application; Figure 13 yes Figure 12The diagram shown is a three-dimensional structural schematic of the magnetic device, omitting the plastic magnetic component. Figure 14 yes Figure 13 An exploded view of the three-dimensional structure of the magnetic device shown. Figure 15 yes Figure 14 A schematic diagram of the structure of the first magnetic component of the magnetic device shown from another angle; Figure 16 This is a partial three-dimensional structural diagram of another magnetic device and circuit board provided in an embodiment of this application; Figure 17 yes Figure 16 A three-dimensional schematic diagram of the magnetic device shown from another angle; Figure 18 yes Figure 16 The diagram shown is a three-dimensional structural schematic of the magnetic device, omitting the plastic magnetic component. Figure 19 yes Figure 18 The diagram shown is an exploded 3D structure of the magnetic device without the insulating layer. Figure 20 This is a partial three-dimensional structural diagram of another magnetic device and circuit board provided in an embodiment of this application; Figure 21 yes Figure 20 The diagram shows a cross-section of the magnetic device along the CC line. Figure 22 This is a schematic diagram of another power conversion device provided in an embodiment of this application; Figure 23 This is a schematic diagram of another magnetic device provided in an embodiment of this application; Figure 24 yes Figure 23 An enlarged view of section XXIV of the magnetic device shown. Detailed Implementation

[0042] This application provides a magnetic device and a power conversion device. The magnetic device can be applied to the power conversion device. The power conversion device can be applied to a photovoltaic power generation system. The power conversion device can be an inverter, transformer, or photovoltaic optimizer, or other electronic equipment used for power conversion. It should be noted that, in this application embodiment, "equal" between feature A and feature B can mean completely equal, or a small deviation is allowed. "Parallel" between feature A and feature B can mean completely parallel, or a small deviation is allowed; for example, feature A and feature B can have an angle, which can be 0°, 5°, or 15°, etc.

[0043] The embodiments of this application are described below with reference to the accompanying drawings.

[0044] Please see Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a structural block diagram of a photovoltaic power generation system 1 provided in an application scenario according to an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a power conversion device 100 provided in an embodiment of this application. Figure 3 yes Figure 2 The diagram shows a cross-section of the power conversion device 100 along line AA.

[0045] like Figure 1 As shown, the photovoltaic power generation system 1 converts the direct current (DC) output from the photovoltaic modules 2 into alternating current (AC) and supplies it to the power grid or load 3. The load can be an electronic device that uses AC power, such as a motor, fan, or air conditioner. Multiple photovoltaic modules 2 are connected in series. The photovoltaic power generation system 1 includes multiple power conversion devices 100, which may include multiple first power conversion devices 100a and second power conversion devices 100b. The first power conversion devices 100a can be photovoltaic optimizers, and the second power conversion devices 100b can be inverters. Each first power conversion device 100a is electrically connected to a second power conversion device 100b and is also electrically connected to a corresponding photovoltaic module 2. The DC output from each photovoltaic module 2 is transmitted to the second power conversion device 100b via the corresponding first power conversion device 100a. The second power conversion device 100b converts the DC output from the photovoltaic module 2 into AC power. The AC power output from the second power conversion device 100b is then supplied to the power grid or load 3.

[0046] In the corresponding first power conversion device 100a and photovoltaic module 2, the first power conversion device 100a can step down the voltage and increase the current of the photovoltaic module 2. Due to factors such as light intensity, temperature, and shading, the output power of each photovoltaic module 2 is different. By stepping down and increasing the current of a portion of the photovoltaic modules 2 through the first power conversion device 100a, the multiple photovoltaic modules 2 connected in series can output maximum power to the second power conversion device 100b, thereby supplying the grid or load 3. In the corresponding first power conversion device 100a and photovoltaic module 2, the first power conversion device 100a can also perform maximum power point tracking (MPPT) on the photovoltaic module 2 to ensure that the photovoltaic module 2 always outputs maximum power.

[0047] In power conversion equipment, magnetic devices are key components for energy conversion and signal transmission, and their size determines the overall size of the power conversion equipment. In existing technologies, when high-voltage current needs to be applied to the windings of magnetic devices, the manufacturing process requires placing the windings in a mounting housing, which is then filled with a molding compound for encapsulation. The molding compound integrates the mounting housing and windings. However, due to the large size of the mounting housing, magnetic devices suffer from significant size limitations, making miniaturization difficult.

[0048] like Figure 2 and Figure 3 As shown, in view of the above-mentioned technical problems, this application provides a magnetic device 20 and a power conversion device 100. By changing the packaging method of the magnetic device 20, the board area and volume of the magnetic device 20 are reduced, thereby realizing the miniaturized design of the magnetic device 20 and the power conversion device 100.

[0049] Next, taking the first power conversion device 100a as an example, the specific structure of the power conversion device 100 provided in the embodiments of this application will be described.

[0050] like Figure 1 , Figure 2 and Figure 3 As shown, the power conversion device 100 may include a circuit board 10 and a magnetic device 20, as well as a housing 30, a power device 40, a capacitor 50, a plurality of first connection terminals 60, and a plurality of second connection terminals 70. In the thickness direction of the circuit board 10, the magnetic device 20 is disposed on one side of the circuit board 10. The power device 40, capacitor 50, first connection terminals 60, and second connection terminals 70 may be disposed on the side of the circuit board 10 facing the magnetic device 20. Alternatively, the power device 40, capacitor 50, first connection terminals 60, and second connection terminals 70 may also be disposed on the side of the circuit board 10 away from the magnetic device 20. In the thickness direction of the circuit board 10, the power device 40, capacitor 50, first connection terminals 60, and second connection terminals 70 may be disposed on the same side or different sides of the circuit board 10.

[0051] The housing 30 may include a receiving cavity 31, in which the magnetic device 20, circuit board 10, power device 40, and capacitor 50 are housed. A portion of the first connection terminal 60 and a portion of the second connection terminal 70 are housed in the receiving cavity 31 (i.e., the housing 30). The first connection terminal 60 partially penetrates the cavity wall of the receiving cavity 31 and partially lies outside the housing 30. The second connection terminal 70 partially penetrates the cavity wall of the receiving cavity 31 and partially lies outside the housing 30. In the first power conversion device 100a, one of the plurality of first connection terminals 60 can be electrically connected to the positive electrode of the photovoltaic module 2, and another first connection terminal 60 can be electrically connected to the negative electrode of the photovoltaic module 2. Similarly, one of the plurality of second connection terminals 70 can be electrically connected to the positive input terminal of the second power conversion device 100b, and another second connection terminal 70 can be electrically connected to the negative input terminal of the second power conversion device 100b.

[0052] In the corresponding first power conversion device 100a and photovoltaic module 2, the photovoltaic module 2 is electrically connected to the magnetic device 20, power device 40, and capacitor 50 through multiple first connection terminals 60 and circuit board 10. The circuit board 10 is electrically connected to the second power conversion device 100b through multiple second connection terminals 70. The magnetic device 20, power device 40, and capacitor 50 work together to step down the voltage and increase the current of the photovoltaic module 2, so that the multiple photovoltaic modules 2 connected in series can output maximum power to the grid or load 3, and can also perform maximum power point tracking on the photovoltaic module 2. For example, the magnetic device 20 is an inductor. The power device 40 can be, but is not limited to, an IGBT (Insulated Gate Bipolar Transistor) chip, an FRD (Fast Recovery Diode) chip, or a MOSFET (Metal Oxide Semiconductor Field-Effect Transistor) chip.

[0053] Please see Figure 4 , Figure 5 , Figure 6 and Figure 7 and combined Figure 2 and Figure 3 , Figure 4 yes Figure 2 A three-dimensional structural diagram of the magnetic device 20 of the power conversion device 100 in conjunction with the circuit board 10. Figure 5 yes Figure 4 The diagram shows a cross-section of the magnetic device 20 along line BB. Figure 6 yes Figure 4The magnetic device 20 shown is a three-dimensional structural diagram omitting the plastic magnetic component 24. Figure 7 yes Figure 6 An exploded view of the three-dimensional structure of the magnetic device 20 shown.

[0054] like Figure 4 , Figure 5 and Figure 6 As shown, the magnetic device 20 may include a first winding 21, a magnetic core post 22, and a plastic magnetic component 24. The first winding 21 includes an insulating layer 23, which wraps around the surface of the first winding 21. For ease of description, embodiments of this application define a first direction (e.g., the X-axis direction shown in the figure) and a second direction (e.g., the Y-axis direction shown in the figure), and the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure), the first direction, and the second direction are perpendicular to each other. The first direction and the second direction are different radial directions of the first winding 21. Figure 4 , Figure 5 and Figure 6 In the illustrated embodiment, the axial direction of the magnetic core post 22 is parallel to the thickness direction of the circuit board 10, and the axial direction of the magnetic core post 22 is perpendicular to the circuit board 10. That is, the magnetic device 20 is disposed on one side of the circuit board 10 along the axial direction of the magnetic core post 22. Of course, the axial direction of the magnetic core post 22 can also be perpendicular to the thickness direction of the circuit board 10.

[0055] The first winding 21 is wound around the outside of the magnetic core post 22. The first winding 21 and the magnetic core post 22 are spaced apart. A plastic magnetic component 24 covers the magnetic core post 22 and part of the first winding 21, and fills the space between the magnetic core post 22 and the first winding 21. The plastic magnetic component 24 is stacked with the circuit board 10. Specifically, in the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure), the plastic magnetic component 24 is located on one side of the circuit board 10 and stacked with the circuit board 10. The end 211 of the first winding 21 is exposed outside the plastic magnetic component 24 and is electrically connected to the circuit board 10. The permeability of the magnetic core post 22 is greater than the permeability of the plastic magnetic component 24. For example, the first winding 21 can be made of metallic materials including, but not limited to, copper or aluminum. The magnetic core post 22 can be made of magnetic materials including, but not limited to, ferrite, iron alloy, or amorphous nanocrystalline soft magnetic materials. The plastic magnetic component 24 can be made of a plastic magnetic material. Plastic magnetic material is a material formed by combining magnetic powder with polymer materials. For example, the magnetic powder can be, but is not limited to, ferromagnetic powder or ferrite powder. The polymer material can be, but is not limited to, epoxy resin, plastic, or rubber. The plastic magnetic component 24 has both magnetic and insulating properties. The shape of the projection of the plastic magnetic component 24 along the axial direction of the central column 22 of the magnetic core can be, but is not limited to, various shapes such as rectangle, circle, or trapezoid.

[0056] like Figure 4 , Figure 5 and Figure 6As shown, the insulating layer 23 contacts and is disposed between the plastic magnetic component 24 and the first winding 21. The insulating layer 23 covers a portion of the surface of the first winding 21, with the end 211 of the first winding 21 exposed outside the insulating layer 23. The first winding 21 is isolated from the plastic magnetic component 24 by the insulating layer 23. Specifically, the plastic magnetic component 24 is covered with at least a portion of the insulating layer 23. The insulating layer 23 can cover a portion of the first winding 21 through processes including but not limited to spraying or film coating. The resistivity of the insulating layer 23 is greater than the resistivity of the plastic magnetic component 24. Figure 4 , Figure 5 and Figure 6 In the illustrated embodiment, the plastic magnetic component 24 partially covers the insulating layer 23, and the partial insulating layer 23 is located on the outside of the plastic magnetic component 24. Of course, the plastic magnetic component 24 may also cover the entire insulating layer 23. The insulating layer 23 may be made of insulating materials including but not limited to polyimide or glass fiber.

[0057] In this embodiment of the application, the magnetic device 20 is connected to the circuit board 10 (e.g., Figure 2 The magnetic device 20 (as shown) is electrically connected to other electronic devices (such as power device 40, capacitor 50, first connection terminal 60, and second connection terminal). The magnetic component 24 is stacked with the circuit board 10, which increases the contact area between the magnetic component 24 and the circuit board 10, thus improving the structural stability and reliability of the magnetic device 20 and the circuit board 10. During the processing of the magnetic device 20, an insulating layer 23 can be first formed on the surface of the first winding 21; the first winding 21 and the magnetic core column 22 are placed in a mold, with the first winding 21 wound around the outside of the magnetic core column 22; a magnetic material is filled into the mold, softened under high temperature and pressure, and then cooled to form the magnetic component 24, thereby forming the magnetic device 20. The magnetic component 24 covers the magnetic core column 22 and part of the first winding 21, with the end 211 of the first winding 21 exposed outside the magnetic component 24. The first winding 21 is isolated from the magnetic component 24 by the insulating layer 23.

[0058] exist Figure 4 , Figure 5 and Figure 6In the illustrated embodiment, during the processing of the magnetic device 20, an insulating layer 23 is first formed on the surface of the first winding 21. The first winding 21 is placed in the processing cavity of the mold, with the end of the first winding 21 located outside the processing cavity. A plastic magnetic material is filled into the processing cavity, pre-fixing the first winding 21 within it. The plastic magnetic material accumulates at the bottom of the processing cavity and partially covers the first winding 21. A magnetic core post 22 is inserted into the first winding 21 and partially embedded in the plastic magnetic material, so that the first winding 21 is wound around the outside of the magnetic core post 22. The processing cavity is filled with plastic magnetic material, covering the portion of the first winding 21 within the processing cavity and the entire magnetic core post 22. The plastic magnetic material is processed using a hot-pressing process to form a plastic magnetic part 24. Specifically, the plastic magnetic material undergoes high-temperature and high-pressure treatment. After softening under high temperature and pressure, the plastic magnetic material is cooled to form the plastic magnetic part 24, thereby forming the magnetic device 20.

[0059] The magnetic device 20 can be removed from the mold. The magnetic device 20 is encapsulated within the first winding 21 and the core post 22 by a plastic magnetic component 24. With this structure, the magnetic device 20 can be extremely thin along the axial direction of the core post 22 (e.g., the Z-axis direction shown in the diagram). For example, the axial dimension of the magnetic device 20 along the core post 22 can be less than 7 mm. When the first winding 21 is energized, it generates a magnetic field, which can be concentrated in the core post 22. By adjusting the permeability of the core post 22, the electromagnetic loss and bias of the magnetic device 20 can be adjusted, thereby adjusting the current-carrying efficiency of the first winding 21, achieving flexible adjustment of the performance of the magnetic device 20.

[0060] In the prior art, when the winding of the magnetic device 20 needs to be supplied with high voltage current, the processing of the magnetic device 20 requires placing the winding in a mounting shell, and then filling the mounting shell with a molding compound to achieve encapsulation. The molding compound is fixedly connected to the mounting shell, and the mounting shell is integrated into the magnetic device 20. Compared with the prior art, the magnetic device 20 in this application is encapsulated by a plastic magnetic component 24, which avoids introducing an additional mounting shell into the magnetic device 20. This is beneficial to reducing the board area occupied by the magnetic device 20 and the axial dimension (e.g., the Z-axis direction shown in the figure) of the magnetic device 20 in the core column 22, which is beneficial to reducing the volume of the magnetic device 20 and facilitating the miniaturization and lightweight design of the magnetic device 20 and the power conversion device 100.

[0061] Furthermore, the appearance of the magnetic device 20 can be simplified and standardized, facilitating storage and automated processing. Additionally, since the plastic magnetic component 24 is magnetic, it can suppress leakage magnetic flux generated when the first winding 21 is energized. The plastic magnetic component 24 can achieve magnetic shielding of the first winding 21, which helps reduce magnetic losses and improves current-carrying efficiency. While ensuring the current-carrying efficiency of the first winding 21, it also helps reduce its volume and processing cost.

[0062] Furthermore, both the insulating layer 23 and the plastic magnetic component 24 are insulating, enabling high-voltage insulation of the first winding 21. For example, the magnetic device 20 can withstand voltages higher than 150V. Moreover, during the processing of the magnetic device 20, the insulating layer 23 protects the first winding 21, preventing deformation under high-voltage conditions and direct contact between the first winding 21 and the high-temperature plastic magnetic material. This prevents a reaction between the first winding 21 and the plastic magnetic material, improving the stability and reliability of the first winding 21 during the processing of the magnetic device 20, reducing the processing difficulty of the magnetic device 20, and increasing the processing efficiency of the magnetic device 20.

[0063] The design of having a magnetic permeability greater than that of the plastic magnetic component 24 ensures that most of the magnetic field generated when the first winding 21 is energized will be concentrated in the magnetic core 22. By adjusting the magnetic permeability of the magnetic core 22, the electromagnetic loss and bias of the magnetic device 20 can be adjusted stably and quickly, thereby adjusting the current carrying efficiency of the first winding 21.

[0064] like Figure 4 , Figure 6 and Figure 7 As shown, in some embodiments, the end 211 of the first winding 21 is exposed outside the plastic magnet 24 on one side of the core post 22 in the radial direction (e.g., the Y-axis direction illustrated). Power conversion device 100 (e.g.) Figure 3(As shown) It also includes a first conductive element 80, which is disposed between the end 211 of the first winding 21 and the circuit board 10. The first conductive element 80 is made of conductive materials including but not limited to copper, aluminum, or silver. In this way, the end 211 of the first winding 21 is electrically connected to the circuit board 10 through the first conductive element 80. Moreover, large bends can be avoided between the end 211 of the first winding 21 and the portion of the first winding 21 wound around the outside of the magnetic core column 22, which is beneficial to improving the structural stability and reliability of the first winding 21. In addition, the length of the first winding 21 can be designed to be shorter, which is beneficial to reducing the parasitic resistance of the first winding 21 and improving the current carrying efficiency of the first winding 21. It should be noted that the first winding 21 is made of cable. The length of the first winding 21 refers to the length of the cable. In some other embodiments, the end 211 of the first winding 21 may also be exposed outside the plastic magnetic element 24 on the axial side of the magnetic core column 22.

[0065] exist Figure 4 , Figure 6 and Figure 7 In the illustrated embodiment, the end 211 of the first winding 21 includes a first end 2111 and a second end 2112. The first winding 21 also includes a first main body 212, a first connecting portion 213, and a second connecting portion 214. The first main body 212 is wound around the outside of the magnetic core post 22. The first main body 212 is disposed between the first connecting portion 213 and the second connecting portion 214. Specifically, one end of the first main body 212 is connected to the first connecting portion 213, and the other end is connected to the second connecting portion 214. In a second direction (e.g., the Y-axis direction shown in the figure), the first connecting portion 213 and the second connecting portion 214 are located on one side of the first main body 212 and both extend along the second direction. In the second direction, the first end 2111 (second end 2112) is disposed on the side of the first connecting portion 213 (second connecting portion 214) away from the first main body 212 and extends along the second direction. In this configuration, the first end 2111 and the second end 2112 are spaced apart along the axial direction (e.g., the Z-axis direction shown in the figure) of the magnetic core column 22; and also spaced apart along the first direction (e.g., the X-axis direction shown in the figure). This arrangement avoids large bends between the first end 2111 and the second end 2112 and the first main body 212, which improves the structural stability of the first winding 21, shortens its length, and increases its current-carrying efficiency.

[0066] The insulating layer 23 covers the first main body portion 212, the first connecting portion 213, and the second connecting portion 214, with the first end portion 2111 and the second end portion 2112 located outside the insulating layer 23. The portion of the first main body portion 212 covered by the insulating layer 23 is located within the plastic magnetic component 24. In a second direction (e.g., the Y-axis direction shown in the figure), the first connecting portion 213, the second connecting portion 214, the portion of the insulating layer 23 covering the first connecting portion 213, the portion of the insulating layer 23 covering the second connecting portion 214, the first end portion 2111, and the second end portion 2112 are located outside one side of the plastic magnetic component 24. Of course, the first connecting portion 213, the second connecting portion 214, the portion of the insulating layer 23 covering the first connecting portion 213, and the portion of the insulating layer 23 covering the second connecting portion 214 may also be located within the plastic magnetic component 24. Since both the first end 2111 and the second end 2112 are located outside one side of the plastic magnetic component 24 in the second direction (e.g., the Y-axis direction shown in the figure), this is beneficial to improving the space utilization of the magnetic device 20, reducing the size of the magnetic device 20 in the second direction, reducing the board area and volume of the magnetic device 20, and facilitating the miniaturization design of the magnetic device 20.

[0067] In this configuration, a first conductive element 80 is disposed between the circuit board 10 and the end 211 of the first winding 21 along the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure). Specifically, the first conductive element 80 includes a first sub-conductive element 81 and a second sub-conductive element 82. Along the axial direction of the magnetic core post 22, the first sub-conductive element 81 and the second sub-conductive element 82 are stacked on the side of the circuit board 10 facing the plastic magnetic component 24, and the first end 2111 (second end 2112) is stacked on the side of the first sub-conductive element 81 (second sub-conductive element 82) facing away from the circuit board 10. Thus, the first end 2111 (second end 2112) is electrically connected to the circuit board 10 through the first sub-conductive element 81 (second sub-conductive element 82), resulting in a simple, stable, and easy-to-design structure. For example, the first conductive element 80 is a terminal block. In other embodiments, the first conductive element 80 may also be a cable, copper busbar, or other conductive device.

[0068] In some embodiments, there are multiple first windings 21 and multiple core posts 22, and multiple insulating layers 23. Multiple core posts 22 are arranged at intervals in the radial direction. Specifically, multiple core posts 22 are arranged at intervals in the first direction (e.g., the X-axis direction shown in the figure). One first winding 21 is wound around the outside of one core post 22. Multiple first windings 21 are arranged at intervals in the first direction. An insulating layer 23 contacts and is disposed between one first winding 21 and the plastic magnetic component 24. One first winding 21 is isolated from the plastic magnetic component 24 by an insulating layer 23. The ends 211 of the multiple first windings 21 are exposed on one side of the plastic magnetic component 24. It should be noted that the number of turns of the multiple first windings 21 can be the same or different.

[0069] exist Figure 4 , Figure 6 and Figure 7 In the illustrated embodiment, the ends 211 of the plurality of first windings 21 are exposed outside one side of the plastic magnetic component 24 in the second direction (e.g., the Y-axis direction shown in the figure). Specifically, the first end 2111 and the second end 2112 of each first winding 21 are located outside one side of the plastic magnetic component 24 in the second direction. Multiple first conductive elements 80 are present, and the end 211 of one first winding 21 is electrically connected to the circuit board 10 through one first conductive element 80. See the preceding text for details, which will not be repeated here. Alternatively, the ends 211 of the plurality of first windings 21 may also be exposed outside one side of the plastic magnetic component 24 in the axial direction (e.g., the Z-axis direction shown in the figure) of the magnetic core post 22. The ends 211 of the first windings 21 may contact the circuit board 10. The first conductive elements 80 may also be omitted.

[0070] During the processing of the magnetic device 20, an insulating layer 23 can be first set on the surface of each first winding 21. Then, multiple first windings 21 and multiple magnetic core pillars 22 are housed in a mold. By filling the mold with plastic magnetic material, a plastic magnetic part 24 is formed, achieving one-time encapsulation and integral molding of the magnetic device 20. In this way, different first windings 21 can perform different functions, and different functions can be integrated in the magnetic device 20. This avoids setting multiple magnetic devices 20 on the circuit board 10 to integrate multiple functions, which is beneficial to the circuit board 10 and the power conversion device 100 (such as...). Figure 3 The miniaturized design (as shown) is achieved. Moreover, the ends 211 of the multiple first windings 21 are exposed on the outside of one side of the plastic magnetic component 24, which is beneficial to improving the space utilization of the magnetic device 20, the miniaturization design of the magnetic device 20, and the wiring on the circuit board 10 so that the circuit board 10 can be electrically connected to the ends 211 of the multiple first windings 21.

[0071] like Figure 4 , Figure 5 and Figure 7 As shown, in some embodiments, the magnetic device 20 further includes a second winding 25, which is wound around the core post 22 and located between the first winding 21 and the core post 22. The second winding 25 is spaced apart from the first winding 21 and the core post 22 radially. The cross-sectional area of ​​the second winding 25 is smaller than that of the first winding 21. The cross-sectional area of ​​the end portion 251 of the second winding 25 is smaller than that of the end portion 211 of the first winding 21. A plastic magnetic component 24 covers a portion of the second winding 25, with the end portion 251 of the second winding 25 exposed outside the plastic magnetic component 24. The end portion 251 of the second winding 25 is electrically connected to the circuit board 10. The cross-section of the first winding 21 is perpendicular to the length direction of the wire used to form the first winding 21, and the cross-section of the second winding 25 is perpendicular to the length direction of the wire used to form the second winding 25.

[0072] During the fabrication of the magnetic device 20, the first winding 21, the second winding 25, and the core post 22 can be encapsulated in one piece by the plastic magnetic component 24, allowing the magnetic device 20 to be integrally formed. A single magnetic device 20 can integrate multiple functions (such as filtering, power transmission, or signal transmission) through the first winding 21 and the second winding 25, avoiding the need to place multiple magnetic devices 20 on the circuit board 10 to integrate multiple functions. This is beneficial for the circuit board 10 and the power conversion device 100 (such as...). Figure 2 The design features a miniaturized form factor (as shown). Furthermore, the magnetic fields generated when the first winding 21 is energized and those generated when the second winding 25 is energized can both be concentrated in the core post 22. By adjusting the permeability of the core post 22, the current-carrying efficiency of the first winding 21 and the second winding 25 can be adjusted simultaneously. Additionally, the heat generated by the first winding 21 can be transferred to the outside of the magnetic device 20 through its end 211, and the heat generated by the second winding 25 can be transferred to the outside of the magnetic device 20 through its end 251. Moreover, the first winding 21 and the second winding 25 can be wound separately, and the number of turns in the first winding 21 and the second winding 25 can be adjusted separately. This avoids the need for simultaneous winding of the first winding 21 and the second winding 25, reducing the processing difficulty of the first winding 21 and the second winding 25, and consequently reducing the processing cost of the magnetic device 20.

[0073] Furthermore, in the radial direction of the core post 22, the end 211 of the first winding 21 and the end 251 of the second winding 25 are located on opposite sides of the core post 22. Specifically, in the second direction (e.g., the Y-axis direction shown in the figure), the end 211 of the first winding 21 and the end 251 of the second winding 25 are located on opposite sides of the core post 22. The design that defines the positional relationship between the end 211 of the first winding 21, the end 251 of the second winding 25, and the core post 22 can prevent the heat generated by the operation of the first winding 21 and the second winding 25 from being transferred between the end 211 of the first winding 21 and the end 251 of the second winding 25, which is beneficial to improving the heat dissipation efficiency of the first winding 21 and the second winding 25.

[0074] exist Figure 4 , Figure 5 and Figure 7 In the illustrated embodiment, the end 251 of the second winding 25 includes a third end 2511 and a fourth end 2512. The second winding 25 also includes a second main body 252, a third connecting portion 253, and a fourth connecting portion 254. The second main body 252 is wound around the outside of the magnetic core post 22. In the radial direction of the magnetic core post 22, the second main body 252 is spaced apart from the first winding 21. One end of the second main body 252 is connected to the third connecting portion 253, and the other end is connected to the fourth connecting portion 254. In the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure), the third connecting portion 253 is located on the side of the first winding 21 away from the second end 2112, and the fourth connecting portion 254 is located on the side of the first winding 21 away from the first end 2111. Both the third connecting portion 253 and the fourth connecting portion 254 extend along a second direction (e.g., the Y-axis direction shown in the figure) in a direction away from the first end 2111. In the second direction, the third end portion 2511 (fourth end portion 2512) is disposed on the side of the third connecting portion 253 (fourth connecting portion 254) facing away from the second main body portion 252 and extends along the second direction.

[0075] The second main body 252, the third connecting part 253, and the fourth connecting part 254 are all located within the plastic magnetic component 24. The third end 2511 and the fourth end 2512 are both exposed on the exterior of the plastic magnetic component 24 on the side opposite to the first end 2111 (i.e., the end 211 of the first winding 21). Specifically, in the second direction, the third end 2511 and the fourth end 2512 are both located on the exterior of the plastic magnetic component 24 on the side opposite to the end 211 of the first winding 21. The cross-sections of the first end 2111, the second end 2112, the third end 2511, and the fourth end 2512 are all perpendicular to the second direction. That is, the cross-sections of the end 211 of the first winding 21 and the end 251 of the second winding 25 are both perpendicular to the second direction. In some other embodiments, the end 251 of the second winding 25 may also be exposed on the exterior of the plastic magnetic component 24 on the axial side of the magnetic core post 22.

[0076] This avoids significant bending between the third end 2511 and the fourth end 2512 and the portion of the second winding 25 wound around the outside of the magnetic core pillar 22 (e.g., the second main body 252), thus improving the structural stability and reliability of the second winding 25. Furthermore, the length of the second winding 25 can be designed to be shorter, which helps reduce its parasitic resistance and improves its current-carrying efficiency. It should be noted that the second winding 25 is made of cable. The length of the second winding 25 refers to the length of the cable.

[0077] In the first direction (e.g., the X-axis direction shown in the figure), the first end 2111 and the first connecting portion 213 are located on one side of the magnetic core pillar 22, and the third end 2511 and the third connecting portion 253 are located on the other side of the magnetic core pillar 22. The second end 2112 and the second connecting portion 214 are located on one side of the magnetic core pillar 22, and the fourth end 2512 and the fourth connecting portion 254 are located on the other side of the magnetic core pillar 22. This is beneficial for improving the space utilization of the first winding 21 and the second winding 25, and for reducing the radial dimensions of the first main body portion 212 of the first winding 21 and the second main body portion 252 of the second winding 25 on the magnetic core pillar 22, which is beneficial for the miniaturization design of the magnetic device 20. Of course, in the first direction, the first end 2111 and the first connecting portion 213, and the third end 2511 and the third connecting portion 253 can also be located on the same side of the magnetic core pillar 22. The definitions of the second end portion 2112 and the second connecting portion 214, the fourth end portion 2512 and the fourth connecting portion 254 can be referred to above and will not be repeated here.

[0078] exist Figure 4 , Figure 5 and Figure 7In the illustrated embodiment, the power conversion device 100 further includes a second conductive element 90, which is disposed between the end 251 of the second winding 25 and the circuit board 10. Specifically, the second conductive element 90 includes a third sub-conductive element 91 and a fourth sub-conductive element 92. Along the axial direction of the core post 22 (e.g., the Z-axis direction shown in the figure), the third sub-conductive element 91 is disposed between the circuit board 10 and the third end 2511, and the fourth sub-conductive element 92 is disposed between the circuit board 10 and the fourth end 2512. Thus, the third end 2511 (fourth end 2512) is electrically connected to the circuit board 10 through the third sub-conductive element 91 (fourth sub-conductive element 92), resulting in a simple, stable structure that is easy to manufacture. Exemplarily, the second conductive element 90 is a terminal block. In other embodiments, the second conductive element 90 may also be a cable, copper busbar, or other conductive device.

[0079] like Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments, the side of the plastic magnetic component 24 facing away from the circuit board 10 contacts the housing 30. Specifically, in the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure), the side of the plastic magnetic component 24 facing away from the circuit board 10 is stacked with the cavity wall of the receiving cavity 31. The thermal conductivity of the housing 30 is greater than that of the plastic magnetic component 24. Exemplarily, the housing 30 may be made of metallic materials including, but not limited to, copper, aluminum, or silver.

[0080] The heat generated by the first winding 21 can be transferred to the external environment through the insulating layer 23, the plastic magnetic component 24, and the housing 30. The heat generated by the second winding 25 can also be transferred to the external environment through the plastic magnetic component 24 and the housing 30. This design helps to shorten the heat dissipation path of the first winding 21 and the second winding 25, improves the heat dissipation efficiency of the first winding 21 and the second winding 25, and improves the current carrying efficiency of the first winding 21 and the second winding 25. In some other embodiments, the plastic magnetic component 24 may also be spaced apart from the housing 30.

[0081] Please see Figure 8 , Figure 9 , Figure 10 and Figure 11 and combined Figure 4 , Figure 8 This is a partial three-dimensional structural diagram of another magnetic device 20 and circuit board 10 provided in the embodiments of this application. Figure 9 yes Figure 8 The diagram shows an exploded view of the three-dimensional structure of the magnetic device 20 and the circuit board 10. Figure 10 yes Figure 8 The magnetic device 20 shown is a three-dimensional structural diagram omitting the plastic magnetic component 24. Figure 11 yes Figure 10The diagram shows an exploded view of the three-dimensional structure of the magnetic device 20, omitting the insulating layer 23.

[0082] like Figure 4 , Figure 8 and Figure 9 As shown, Figure 8 and Figure 9 The illustrated embodiments and Figure 4 The structures of the illustrated embodiments are similar, but the difference lies in the way the end 211 of the first winding 21 is electrically connected to the circuit board 10, and the way the end 251 of the second winding 25 is electrically connected to the circuit board 10. Correspondingly, the structures of the first winding 21 and the second winding 25 are different. Figure 8 and Figure 9 In the illustrated embodiment, the first conductive element 80 and the second conductive element 90 may be omitted. The end 211 of the first winding 21 protrudes from the outer side of the plastic magnetic element 24 on the axial side (e.g., the Z-axis direction shown in the figure) of the magnetic core pillar 22. The end 251 of the second winding 25 protrudes from the outer side of the plastic magnetic element 24 on the axial side of the magnetic core pillar 22. The circuit board 10 is provided with a first insertion hole 11 and a second insertion hole 12, which penetrate the side of the circuit board 10 facing the plastic magnetic element 24 on the axial side of the magnetic core pillar 22. The end 211 of the first winding 21 is inserted into the first insertion hole 11, and the end 251 of the second winding 25 is inserted into the second insertion hole 12.

[0083] This design helps reduce the radial dimension of the magnetic device 20 within the core post 22, improves the space utilization of the magnetic device 20, reduces its footprint, and facilitates miniaturization. Furthermore, the first winding 21's end 211 is electrically connected to the circuit board 10 via the first insertion hole 11 and the second winding 25's end 251 via the second insertion hole 12. This design is simple, stable, and easy to manufacture. It is understood that the first conductive element 80 and the second conductive element 90 can be omitted.

[0084] like Figure 9 , Figure 10 and Figure 11 As shown, in Figure 9 , Figure 10 and Figure 11In the illustrated embodiment, the end 211 of the first winding 21 includes a first end 2111 and a second end 2112. The first winding 21 also includes a first main body 212, a first connecting portion 213, and a second connecting portion 214. The first main body 212 is wound around the outside of the magnetic core post 22. In the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure), one end of the first connecting portion 213 is disposed at one end of the first main body 212, and the other end is disposed at the first end 2111. The first connecting portion 213 extends along the axial direction of the magnetic core post 22. One end of the second connecting portion 214 is disposed at the other end of the first main body 212, and the other end is disposed at the second end 2112. The second connecting portion 214 extends along the axial direction of the magnetic core post 22. In the axial direction of the magnetic core post 22, the first end 2111 (second end 2112) is disposed on one side of the first connecting portion 213 (second connecting portion 214) and extends along the axial direction of the magnetic core post 22. In the second direction (e.g., the Y-axis direction shown in the figure), the first end 2111, the second end 2112, the first connecting part 213 and the second connecting part 214 are all located on one side of the magnetic core column 22.

[0085] An insulating layer 23 covers the first main body portion 212, the first connecting portion 213, and the second connecting portion 214. The first main body portion 212, the first connecting portion 213, the second connecting portion 214, and the insulating layer 23 are located within the plastic magnetic component 24. Along the axial direction of the magnetic core column 22 (e.g., the Z-axis direction shown in the figure), the first end portion 2111 and the second end portion 2112 are located on the outside of one side of the plastic magnetic component 24. There are multiple first insertion holes 11, and each of the first end portion 2111 and the second end portion 2112 is inserted into one of the first insertion holes 11. Alternatively, along the axial direction of the magnetic core column 22, a portion of the first connecting portion 213, a portion of the second connecting portion 214, and a portion of the insulating layer 23 may also be located on the outside of one side of the plastic magnetic component 24.

[0086] In this configuration, the first end 2111 and the second end 2112 are positioned opposite each other and spaced apart in the first direction (e.g., the X-axis direction shown in the figure). Specifically, the projection of the first end 2111 along the first direction overlaps with the projection of the second end 2112 along the first direction. This improves the space utilization of the first end 2111 and the second end 2112, reduces the size of the first winding 21 in the second direction (e.g., the Y-axis direction shown in the figure), reduces the size of the plastic magnetic component 24 and the magnetic device 20 in the second direction, and facilitates the miniaturization design of the magnetic device 20.

[0087] exist Figure 9 , Figure 10 and Figure 11In the illustrated embodiment, the end portion 251 of the second winding 25 includes a third end portion 2511 and a fourth end portion 2512. The second winding 25 also includes a second main body portion 252, a third connecting portion 253, and a fourth connecting portion 254. The second main body portion 252 is wound around the outside of the magnetic core column 22 and is located radially between the first winding 21 and the magnetic core column 22. The third connecting portion 253 includes a first segment 2531 and a second segment 2532. One end of the first segment 2531 is connected to one end of the second main body portion 252 and extends along a second direction (e.g., the Y-axis direction shown in the figure). One end of the second segment 2532 is connected to the other end of the first segment 2531 and extends along the axial direction of the magnetic core column 22 (e.g., the Z-axis direction shown in the figure). The third end portion 2511 is connected to the other end of the second segment 2532 and extends along the axial direction of the magnetic core column 22. In the axial direction of the magnetic core pillar 22, the first segment 2531 is located on the side of the first winding 21 facing away from the circuit board 10. In a first direction (e.g., the X-axis direction shown in the figure), the first segment 2531, the second segment 2532, and the third end 2511 are located on the side of the magnetic core pillar 22 facing away from the first end 2111. In a second direction, the second segment 2532 and the third end 2511 are located on the side of the magnetic core pillar 22 facing away from the second end 2112.

[0088] The fourth connecting portion 254 includes a third segment 2541, a fourth segment 2542, and a fifth segment 2543. One end of the third segment 2541 is connected to the other end of the second main body portion 252 and extends along the axial direction of the magnetic core column 22 (e.g., the Z-axis direction shown in the figure). One end of the fourth segment 2542 is connected to the other end of the third segment 2541 and extends along a second direction (e.g., the Y-axis direction shown in the figure). One end of the fifth segment 2543 is connected to the other end of the fourth segment 2542 and extends along the axial direction of the magnetic core column 22. The fourth end portion 2512 is connected to the other end of the fifth segment 2543 and extends along the axial direction of the magnetic core column 22. The fourth segment 2542 is located on the side of the first winding 21 facing away from the circuit board 10 along the axial direction of the magnetic core column 22. In the first direction (e.g., the X-axis direction shown in the figure), the third segment 2541, the fourth segment 2542, the fifth segment 2543, and the fourth end 2512 are located on the side of the magnetic core pillar 22 opposite to the second end 2112. In the second direction, the fifth segment 2543 and the fourth end 2512 are located on the side of the magnetic core pillar 22 opposite to the first end 2111.

[0089] The second main body 252, the third connecting part 253, and the fourth connecting part 254 are located within the plastic magnetic component 24. Along the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure), the third end 2511 and the fourth end 2512 are located on the outside of one side of the plastic magnetic component 24. There are multiple second insertion holes 12, and each of the third end 2511 and the fourth end 2512 is inserted into one of the second insertion holes 12. Specifically, in the first direction (e.g., the X-axis direction shown in the figure), the third end 2511 and the fourth end 2512 are positioned opposite each other and spaced apart. See the preceding text for details, which will not be repeated here. This improves the space utilization of the third end 2511 and the fourth end 2512, reduces the size of the plastic magnetic component 24 and the magnetic device 20 in the second direction (e.g., the Y-axis direction shown in the figure), and facilitates the miniaturization design of the magnetic device 20.

[0090] Understandable. Figure 8 , Figure 9 , Figure 10 and Figure 11 In the illustrated embodiment, the way the ends 211 of the first winding 21 and 251 of the second winding 25 are electrically connected to the circuit board 10 can be applied to... Figures 1-7 In any of the embodiments shown.

[0091] Please see Figure 12 , Figure 13 , Figure 14 and Figure 15 and combined Figure 10 , Figure 12 This is a schematic diagram of another magnetic device 20 provided in the embodiments of this application. Figure 13 yes Figure 12 The magnetic device 20 shown is a three-dimensional structural diagram omitting the plastic magnetic component 24. Figure 14 yes Figure 13 An exploded view of the three-dimensional structure of the magnetic device 20 shown. Figure 15 yes Figure 14 The diagram shows the structure of the first magnetic element 26 of the magnetic device 20 from another angle.

[0092] like Figure 10 , Figure 12 , Figure 13 and Figure 14 As shown, Figure 12 , Figure 13 and Figure 14 The illustrated embodiments and Figure 10 The embodiments shown are similar in structure, but differ in the structure of the magnetic device 20, and correspondingly, the processing methods of the magnetic device 20 are different. Figure 12 , Figure 13 and Figure 14In the illustrated embodiment, the magnetic device 20 further includes a first magnetic element 26. Along the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure), the first magnetic element 26 is disposed on one side of the magnetic core post 22, with the first winding 21 and the second winding 25 located on the side of the first magnetic element 26 facing the magnetic core post 22. The first magnetic element 26 has a receiving hole 261. Along the axial direction of the magnetic core post 22, the receiving hole 261 is disposed within the first magnetic element 26. Specifically, along the axial direction of the magnetic core post 22, the receiving hole 261 penetrates at least one side of the first magnetic element 26. At least a portion of the magnetic core post 22, a portion of the first winding 21, and a portion of the second winding 25 are received within the receiving hole 261, with the end 211 of the first winding 21 and the end 251 of the second winding 25 located outside the receiving hole 261. The plastic magnetic element 24 covers the first magnetic element 26. Exemplarily, the first magnetic element 26 may be made of, but is not limited to, iron oxide, iron, or other magnetic materials.

[0093] In this way, the magnetic field generated when the first winding 21 and the second winding 25 are energized can be concentrated not only in the core post 22 but also in the first magnetic element 26, which helps to reduce the magnetic loss of the magnetic device 20 and improve the current carrying efficiency of the first winding 21 and the second winding 25. Moreover, during the processing of the magnetic device 20, the first magnetic element 26 can be placed in the mold first, and the core post 22, the first winding 21 and the second winding 25 can be housed in the receiving hole 261. The magnetic device 20 can be formed by filling the mold with plastic magnetic material once, which avoids filling the plastic magnetic material multiple times during the processing of the magnetic device 20, thus improving the processing efficiency of the magnetic device 20.

[0094] like Figure 13 , Figure 14 and Figure 15 As shown, the first magnetic element 26 further includes a mounting hole 262 and a mating mounting hole 263, both of which extend through the first magnetic element 26 along the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure). In the radial direction of the magnetic core post 22, the mounting hole 262 is located on one side of the receiving hole 261. Specifically, in the second direction (e.g., the Y-axis direction shown in the figure), the mounting hole 262 is located on one side of the receiving hole 261. A portion of the first winding 21 passes through the mounting hole 262, with its end 211 located outside the mounting hole 262. In the second direction (i.e., the radial direction of the magnetic core post 22), the mating mounting hole 263 is located on the side of the receiving hole 261 facing away from the mounting hole 262. A portion of the second winding 25 passes through the mating mounting hole 263, with its end 251 located outside the mounting hole 262.

[0095] exist Figure 13 , Figure 14 and Figure 15In the illustrated embodiment, the mounting hole 262 includes a first sub-mounting hole 2621 and a second sub-mounting hole 2622. Both the first sub-mounting hole 2621 and the second sub-mounting hole 2622 penetrate the magnetic device 20 along the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure). In a first direction (e.g., the X-axis direction shown in the figure), the first sub-mounting hole 2621 and the second sub-mounting hole 2622 are spaced apart. The first magnetic element 26 also has a mounting groove 264. In the axial direction of the magnetic core post 22, the receiving hole 261 and the mounting groove 264 penetrate the same side of the first magnetic element 26. In a second direction (e.g., the Y-axis direction shown in the figure), the mounting groove 264 connects the receiving hole 261 and the second sub-mounting hole 2622. There are multiple mating mounting holes 263. These multiple mating mounting holes 263 are spaced apart along the first direction.

[0096] In the first winding 21, along the axial direction of the core post 22 (e.g., the Z-axis direction shown in the figure), both the first end 2111 and the second end 2112 are located outside one side of the first magnetic element 26, that is, the end 211 of the first winding 21 is located outside one side of the first magnetic element 26. A portion of the first main body 212 is received in the receiving hole 261 and the mounting groove 264. Another portion of the first main body 212 is located outside the receiving hole 261 and outside one side of the first magnetic element 26 along the axial direction of the core post 22. The first main body 212 is isolated from the hole wall of the receiving hole 261 and the groove wall of the mounting groove 264 by the insulating layer 23. The first connecting portion 213 (second connecting portion 214) passes through the first sub-mounting hole 2621 (second sub-mounting hole 2622) along the axial direction of the core post 22. The first connecting portion 213 (second connecting portion 214) is isolated from the hole wall of the first sub-mounting hole 2621 (second sub-mounting hole 2622) by the insulating layer 23. There can be multiple receiving holes 261 and multiple mounting holes 262, with one receiving hole 261 and one mounting hole 262 corresponding to one first winding 21.

[0097] In the second winding 25, the end 251 of the second winding 25 is located outside one side of the first magnetic element 26 along the axial direction (e.g., the Z-axis direction shown in the figure) of the magnetic core column 22. A portion of the second main body 252 and a portion of the third segment 2541 of the fourth connecting portion 254 are received in the receiving hole 261. Another portion of the second main body 252 and another portion of the third segment 2541 are located outside the receiving hole 261 and outside one side of the first magnetic element 26 along the axial direction of the magnetic core column 22. The second segment 2532 of the third connecting portion 253 passes through a mating mounting hole 263 along the axial direction of the magnetic core column 22, and the fifth segment 2543 of the fourth connecting portion 254 passes through another mating mounting hole 263 along the axial direction of the magnetic core column 22.

[0098] In this way, the first winding 21 (second winding 25) can be accommodated in the receiving hole 261 along the axial direction of the magnetic core column 22 (e.g., the Z-axis direction shown in the figure) and inserted into the mounting hole 262 (which matches the mounting hole 263), realizing the assembly of the first winding 21 (second winding 25) and the first magnetic component 26. This facilitates assembly and helps improve the structural stability and reliability of the magnetic device 20. Moreover, by limiting the first winding 21 and the second winding 25 through the first magnetic component 26, it is possible to prevent the first winding 21 and the second winding 25 from tilting due to shaking or vibration during the processing of the magnetic device 20, which helps improve the stability and reliability of the first winding 21 and the second winding 25 during the processing of the magnetic device 20.

[0099] like Figure 12 , Figure 13 and Figure 14 As shown, the magnetic device 20 also includes a second magnetic element 26a. Along the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure), the second magnetic element 26a is disposed on the side of the magnetic core post 22 facing away from the first magnetic element 26. The first winding 21 and the second winding 25 are located on the side of the second magnetic element 26a facing the magnetic core post 22. A plastic magnetic element 24 covers the second magnetic element 26a. For example, the first magnetic element 26 can be made of materials including but not limited to iron oxide, iron, or other magnetic materials. In this way, the magnetic field generated when the first winding 21 and the second winding 25 are energized can be concentrated on the second magnetic element 26a, which helps to reduce the magnetic loss of the magnetic device 20 and improve the current-carrying efficiency of the first winding 21 and the second winding 25.

[0100] Understandable. Figure 12 , Figure 13 , Figure 14 and Figure 15 In the illustrated embodiment, the design of the first magnetic element 26 and the second magnetic element 26a can be applied to... Figures 1-11 In any of the embodiments shown.

[0101] Please see Figure 16 , Figure 17 , Figure 18 and Figure 19 and combined Figure 9 , Figure 16 This is a partial three-dimensional structural diagram of another magnetic device 20 and circuit board 10 provided in the embodiments of this application. Figure 17 yes Figure 16 The magnetic device 20 shown is a three-dimensional structural diagram from another angle. Figure 18 yes Figure 16 The magnetic device 20 shown is a three-dimensional structural diagram omitting the plastic magnetic component 24. Figure 19 yes Figure 18 The diagram shows an exploded view of the three-dimensional structure of the magnetic device 20, omitting the insulating layer 23.

[0102] like Figure 9 , Figure 16 and Figure 17 As shown, Figure 16 and Figure 17 The illustrated embodiments and Figure 9 The structures of the illustrated embodiments are similar, but the difference lies in the way the ends 211 of the first winding 21 and 251 of the second winding 25 are electrically connected to the circuit board 10. Correspondingly, the structures of the first winding 21 and the second winding 25 are different. Figure 16 and Figure 17 In the illustrated embodiment, the ends 211 of the first winding 21 and 251 of the second winding 25 are both stacked on the circuit board 10. The side of the end 211 of the first winding 21 along the axial direction (e.g., the Z-axis direction shown in the figure) of the magnetic core post 22 is flush with the side of the plastic magnetic component 24 along the axial direction of the magnetic core post 22. Specifically, the side of the first winding 21 (and the end 251 of the second winding 25) that contacts the circuit board 10 is flush with the side of the plastic magnetic component 24 that contacts the circuit board 10. It can be understood that the first insertion hole 11 and the second insertion hole 12 can be omitted.

[0103] like Figure 16 , Figure 18 and Figure 19 As shown, in Figure 16 , Figure 18 and Figure 19In the illustrated embodiment, the first winding 21 has an end portion 211 including a first end portion 2111 and a second end portion 2112. The first winding 21 also includes a first main body portion 212, a first connecting portion 213, and a second connecting portion 214. The first main body portion 212 is wound around the outside of the magnetic core column 22. Along the axial direction of the magnetic core column 22 (e.g., the Z-axis direction shown in the figure), one end of the first connecting portion 213 is located at one end of the first main body portion 212, and the other end is located at the first end portion 2111. One end of the second connecting portion 214 is located at the other end of the first main body portion 212, and the other end is located at the second end portion 2112. Both the first connecting portion 213 and the second connecting portion 214 extend along the axial direction of the magnetic core column 22. In a direction perpendicular to the axial direction of the magnetic core post 22, the first end 2111 (second end 2112) is located on one side of the first connecting portion 213 (second connecting portion 214) and is perpendicular to the axial direction of the magnetic core post 22. The first end 2111 (second end 2112) is stacked with the circuit board 10. Specifically, in a second direction (e.g., the Y-axis direction shown in the figure), the first end 2111 (second end 2112) is located on the side of the first connecting portion 213 (second connecting portion 214) facing the magnetic core post 22 and extends along the second direction. Both the first end 2111 and the second end 2112 include a plane 2113, which faces the circuit board 10 and is perpendicular to the axial direction of the magnetic core post 22. The planes 2113 of both the first end 2111 and the second end 2112 are stacked with and in contact with the circuit board 10.

[0104] This design increases the contact area between the first end 2111 and the second end 2112 and the circuit board 10, thereby improving the current-carrying efficiency between the first end 2111 and the second end 2112 and the circuit board 10. Furthermore, the design of the first end 2111 (second end 2112) being positioned on the side of the first connecting portion 213 (second connecting portion 214) facing the magnetic core post 22 in the second direction helps reduce the size of the first winding 21 in the second direction, and also helps reduce the size of the plastic magnetic component 24 and the magnetic device 20 in the second direction, thus facilitating the miniaturization of the magnetic device 20.

[0105] like Figure 16 , Figure 17 and Figure 18 As shown, one side of the first end 2111 (the second end 2112) along the axial direction (e.g., the Z-axis direction shown in the figure) of the magnetic core post 22 is flush with one side of the plastic magnetic component 24 along the axial direction of the magnetic core post 22. Specifically, the plane 2113 of the first end 2111 and the plane 2113 of the second end 2112 are both flush with the side of the plastic magnetic component 24 that contacts the circuit board 10, and the side of the first end 2111 that contacts the circuit board 10 and the side of the second end 2112 that contacts the circuit board 10 are both flush with the side of the plastic magnetic component 24 that contacts the circuit board 10.

[0106] like Figure 16 , Figure 18 and Figure 19 As shown, the second winding 25 includes a third end 251 and a fourth end 2512 at its end 251. The second winding 25 also includes a second main body 252, a third connecting part 253, and a fourth connecting part 254. The connection methods of the second main body 252, the third connecting part 253, and the fourth connecting part 254 can all be referred to... Figure 9 The following is a description of the illustrated embodiment. The third end 2511 is located at one end of the second segment 2532 of the third connecting portion 253 along the axial direction (e.g., the Z-axis direction shown in the figure) of the magnetic core pillar 22. The fourth end 2512 is located at one end of the fifth segment 2543 of the fourth connecting portion 254 along the axial direction of the magnetic core pillar 22. In the second direction (e.g., the Y-axis direction shown in the figure), the third end 2511 is located on the side of the second segment 2532 of the third connecting portion 253 facing the magnetic core pillar 22 and extends along the second direction. The fourth end 2512 is located on the side of the fifth segment 2543 of the fourth connecting portion 254 facing the magnetic core pillar 22 and extends along the second direction. The third end 2511 (and fourth end 2512) are perpendicular to the axial direction of the magnetic core pillar 22 and are stacked with the circuit board 10. Specifically, both the third end 2511 and the fourth end 2512 include a mating plane 2513, which faces the circuit board 10 and is perpendicular to the axial direction of the magnetic core pillar 22. The mating planes 2513 of the third end 2511 and the fourth end 2512 are both stacked and in contact with the circuit board 10. This helps to improve the current-carrying efficiency between the third end 2511 and the fourth end 2512 and the circuit board 10. Furthermore, it facilitates the miniaturization design of the magnetic device 20. For details, please refer to the preceding text; further explanation is unnecessary.

[0107] like Figure 16 , Figure 17 and Figure 18 As shown, one side of the third end 2511 (fourth end 2512) in the axial direction (e.g., the Z-axis direction shown in the figure) of the magnetic core column 22 is flush with one side of the plastic magnetic component 24 in the axial direction of the magnetic core column 22. Specifically, the side of the third end 2511 that contacts the circuit board 10 and the side of the fourth end 2512 that contacts the circuit board 10 are both flush with the side of the plastic magnetic component 24 that contacts the circuit board 10.

[0108] In this way, the magnetic device 20 can be directly mounted on the circuit board 10, avoiding the need for through holes (e.g., first insertion hole 11) on the circuit board 10 for insertion into the end 211 of the first winding 21 and through holes (e.g., second insertion hole 12) for insertion into the end 251 of the second winding 25. This helps reduce the thickness of the circuit board 10 and simplifies the wiring process. Furthermore, the mounting method of the magnetic device 20 onto the circuit board 10 is compatible with automated design, improving the assembly efficiency of the magnetic device 20 and the circuit board 10.

[0109] Understandable. Figure 16 , Figure 17 , Figure 18 and Figure 19 In the illustrated embodiment, the way the ends 211 of the first winding 21 and 251 of the second winding 25 are electrically connected to the circuit board 10 can be applied to... Figures 1-15 In any of the embodiments shown.

[0110] Please see Figure 20 and Figure 21 and combined Figure 4 , Figure 20 This is a partial three-dimensional structural diagram of another magnetic device 20 and circuit board 10 provided in the embodiments of this application. Figure 21 yes Figure 20 The diagram shows a cross-section of the magnetic device 20 along the CC line.

[0111] like Figure 4 , Figure 20 and Figure 21 As shown, Figure 20 and Figure 21 The illustrated embodiments and Figure 4 The structures of the embodiments shown are similar, but they differ in the number of first windings 21, the number of core posts 22, and the number of insulating layers 23; the matching relationship between the first winding 21 and the second winding 25; and the way the first winding 21 and the second winding 25 are electrically connected to the circuit board 10. Figure 20 and Figure 21In the illustrated embodiment, the number of first windings 21, the number of core posts 22, and the number of insulating layers 23 are all one. The first winding 21 and the second winding 25 are wound in parallel around the outside of the core posts 22. Specifically, the first winding 21 and the second winding 25 are spaced apart along the axial direction of the core posts 22 (e.g., the Z-axis direction shown in the figure). The projection of the second winding 25 along the axial direction of the core posts 22 lies inside the projection of the first winding 21 along the axial direction of the core posts 22. A plastic magnetic component 24 covers a portion of the second winding 25, with the end 251 of the second winding 25 exposed outside the plastic magnetic component 24. The portion of the first winding 21 located within the plastic magnetic component 24 is isolated from the portion of the second winding 25 located within the plastic magnetic component 24 by the insulating layer 23 and the plastic magnetic component 24. It should be noted that the first winding 21 can be formed by the first wire, and the second winding 25 can be formed by the second wire. During the process of winding the first winding 21 and the second winding 25 in parallel around the outside of the magnetic core column 22, the first wire and the second wire are first arranged side by side and parallel, and then the first wire and the second wire are wound around the outside of the magnetic core column 22 at the same time, so that the first winding 21 and the second winding 25 are formed synchronously.

[0112] In this configuration, the end 251 of the second winding 25 and the end 211 of the first winding 21 are exposed on the same side of the plastic magnetic component 24. Specifically, in the second direction (e.g., the Y-axis direction shown in the figure), the end 251 of the second winding 25 and the end 211 of the first winding 21 are located on the same side of the plastic magnetic component 24. Of course, the end 251 of the second winding 25 and the end 211 of the first winding 21 may also be located on the same side of the plastic magnetic component 24 in the first direction (e.g., the X-axis direction shown in the figure) or the axial direction of the core post 22 (e.g., the Z-axis direction shown in the figure).

[0113] This ensures that the projection of the first winding 21 along the axial direction of the magnetic core column 22 (e.g., the Z-axis direction shown in the figure) and the projection of the second winding 25 along the axial direction of the magnetic core column 22 have a large overlap area, which is beneficial to improving the space utilization of the first winding 21, the second winding 25 and the magnetic core column 22, and to reducing the radial dimension of the magnetic device 20 in the magnetic core column 22, which is beneficial to the miniaturization design of the magnetic device 20.

[0114] exist Figure 20 and Figure 21In the illustrated embodiment, the second conductive element 90 may be omitted. The end 211 of the first winding 21 includes a first end 2111 and a second end 2112. The end 251 of the second winding 25 includes a third end 2511 and a fourth end 2512. In a second direction (e.g., the Y-axis direction shown in the illustration), the first end 2111, the second end 2112, the third end 2511, and the fourth end 2512 are located outside one side of the plastic magnetic element 24. Specifically, the projection of the first end 2111 along the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the illustration) overlaps with the projection of the third end 2511 along the axial direction of the magnetic core post 22. The projection of the second end 2112 along the axial direction of the magnetic core post 22 overlaps with the projection of the fourth end 2512 along the axial direction of the magnetic core post 22.

[0115] The first conductive element 80 includes a first sub-conductive element 81 and a second sub-conductive element 82. In the axial direction of the magnetic core column 22 (e.g., the Z-axis direction shown in the figure), both the first sub-conductive element 81 and the second sub-conductive element 82 are disposed on the side of the circuit board 10 facing the plastic magnetic element 24. In a second direction (e.g., the Y-axis direction shown in the figure), the first sub-conductive element 81 is disposed on the side opposite to the plastic magnetic element 24 at its first end 2111 and third end 2511. The second sub-conductive element 82 is disposed on the side opposite to the plastic magnetic element 24 at its second end 2112 and fourth end 2512. The first end 2111 and third end 2511 are electrically connected to the circuit board 10 through the first sub-conductive element 81. Specifically, the first sub-conductive element 81 has multiple spaced conductive channels, and the first end 2111 and third end 2511 are electrically connected to the circuit board 10 through different conductive channels. The second end 2112 and fourth end 2512 are electrically connected to the circuit board 10 through the second sub-conductive element 82. For details, please refer to the description of the first sub-conductive component 81, which will not be repeated here. This results in a simple structure that is easy to design. Understandable. Figure 20 and Figure 21 In the illustrated embodiment, the number of first windings 21, the number of core pillars 22, and the number of insulating layers 23 are all one. The first winding 21 and the second winding 25 are wound in parallel around the core pillars 22. The design of the first conductive element 80 can be applied to... Figures 1-19 In any of the embodiments shown.

[0116] Please see Figure 22 and combined Figure 3 , Figure 22 This is a schematic diagram of another power conversion device 100 provided in an embodiment of this application.

[0117] like Figure 3 and Figure 22 As shown, Figure 22 The illustrated embodiments and Figure 3The embodiments shown are similar in structure, the difference being that the heat dissipation method of the first winding 21 of the magnetic device 20 is different. Figure 22 In the illustrated embodiment, the magnetic device 20 further includes a heat-conducting element 27, which is partially disposed within the plastic magnetic component 24. The heat-conducting element 27 is in contact with the insulating layer 23 and partially exposed outside the plastic magnetic component 24. The thermal conductivity of the heat-conducting element 27 is greater than that of the plastic magnetic component 24. For example, the heat-conducting element 27 can be made of insulating and thermally conductive materials, including but not limited to ceramics, silicon carbide, or thermally conductive silicone. In this way, the heat generated by the operation of the first winding 21 can be transferred to the external environment through the insulating layer 23 and the heat-conducting element 27. The design that the thermal conductivity of the heat-conducting element 27 is greater than that of the plastic magnetic component 24 is beneficial for improving the heat dissipation efficiency of the first winding 21 and for improving the current-carrying capacity of the first winding 21.

[0118] In this configuration, the heat-conducting element 27 is located radially on the side of the first winding 21 facing away from the magnetic core pillar 22, and is also located on the side of the insulating layer 23 facing away from the magnetic core pillar 22, in contact with the insulating layer 23. This ensures that the side of the insulating layer 23 facing radially from the magnetic core pillar 22 can contact the heat-conducting element 27, which increases the contact area between the heat-conducting element 27 and the insulating layer 23, thus improving the heat transfer efficiency between the heat-conducting element 27 and the insulating layer 23, and consequently improving the heat dissipation efficiency of the first winding 21. Furthermore, in the axial direction of the magnetic core pillar 22 (e.g., the Z-axis direction shown in the figure), the size of the heat-conducting element 27 is larger than the size of the magnetic core pillar 22. This increases the axial size of the heat-conducting element 27, further increasing the contact area between the heat-conducting element 27 and the insulating layer 23, and consequently improving the heat dissipation efficiency of the first winding 21.

[0119] Specifically, in the first direction (e.g., the X-axis direction shown in the figure), the heat-conducting element 27 is located between two adjacent first windings 21. In the heat-conducting element 27 and the two adjacent first windings 21, the insulating layer 23 contacting one first winding 21 contacts one side of the heat-conducting element 27 in the first direction, and the insulating layer 23 contacting the other first winding 21 contacts the other side of the heat-conducting element 27 in the first direction. In this way, heat can be dissipated from two adjacent first windings 21 through one heat-conducting element 27, avoiding the need for multiple heat-conducting elements 27 to dissipate heat from two adjacent first windings 21. This reduces the difficulty of setting the heat-conducting element 27 in the plastic magnetic component 24 and reduces the processing cost of the magnetic device 20. In some other embodiments, in the axial direction of the core post 22 (e.g., the Z-axis direction shown in the figure), the heat-conducting element 27 may also be located on one side of the insulating layer 23 and in contact with the insulating layer 23.

[0120] exist Figure 22In the illustrated embodiment, the heat-conducting element 27 is exposed on the exterior of the side of the plastic magnetic component 24 facing away from the circuit board 10. The side of the heat-conducting element 27 facing away from the circuit board 10 is flush with the side of the plastic magnetic component 24 facing away from the circuit board 10. The heat-conducting element 27 is in contact with the housing 30. Specifically, in the axial direction of the magnetic core post 22 (e.g., the Z-axis direction shown in the figure), the heat-conducting element 27 is stacked with the cavity wall of the receiving cavity 31. The area of ​​the side of the plastic magnetic component 24 facing away from the circuit board 10 is sufficiently large, allowing for a larger exposed area of ​​the heat-conducting element 27, which is beneficial for improving the heat dissipation efficiency of the heat-conducting element 27 for the first winding 21. Furthermore, since the heat-conducting element 27 is in contact with the housing 30, this shortens the heat dissipation path between the heat-conducting element 27 and the housing 30, further improving the heat dissipation efficiency for the first winding 21. In other embodiments, the heat-conducting element 27 may also be exposed on the exterior of the side of the plastic magnetic component 24 in the radial direction of the magnetic core post 22.

[0121] Understandable. Figure 22 In the illustrated embodiment, the design of the heat-conducting element 27 can be applied to... Figures 1-21 In any of the embodiments shown.

[0122] Please see Figure 23 and Figure 24 and combined Figure 5 , Figure 23 This is a schematic diagram of another magnetic device 20 provided in the embodiments of this application. Figure 24 yes Figure 23 An enlarged view of part XXIV of the magnetic device 20 shown.

[0123] like Figure 5 , Figure 23 and Figure 24 As shown, Figure 23 and Figure 24 The illustrated embodiments and Figure 5 The embodiments shown are similar in structure, except that the structure of the insulating layer 23 is different. Figure 23 and Figure 24 In the illustrated embodiment, the insulating layer 23 comprises multiple insulating films 231, which are sequentially wrapped around the surface of the first winding 21. The insulating layer 23 is elastic. Exemplarily, the number of insulating films 231 may be two, three, or more.

[0124] The plastic magnetic material used to form the plastic magnetic component 24 has poor fluidity, and during the softening process under high temperature and pressure, it exerts significant pressure on the insulating layer 23. A single-layer insulating layer contains pores, making it prone to breakage under high pressure. The insulating layer 23 comprises multiple insulating films 231, with the outer layer covering the pores of the inner layer. This makes the insulating layer 23 elastic, reducing the impact of pores on its pressure resistance and improving its pressure resistance. The insulating layer 23 can withstand greater stress deformation, preventing breakage due to stress impact under high pressure during the processing of the magnetic device 20. This improves the structural stability and reliability of the insulating layer 23, and enhances the processing stability of the magnetic device 20. Furthermore, it improves the voltage resistance insulation of the insulating layer 23, facilitating the application of the magnetic device 20 in high-voltage current environments. It should be noted that, in the two adjacent insulating films 231, the insulating film 231 closer to the first winding 21 is the inner insulating film 231, and the insulating film 231 farther away from the first winding 21 is the outer insulating film 231.

[0125] Understandable. Figure 23 and Figure 24 In the illustrated embodiment, the design of the insulating layer 23 can be applied to Figures 1-22 In any of the embodiments shown.

Claims

1. A power conversion device, characterized in that, The power conversion device includes a circuit board and a magnetic device. The magnetic device is disposed on one side of the circuit board and includes a first winding, a magnetic core column, and a plastic magnetic component. The first winding includes an insulating layer that wraps around the surface of the first winding. The first winding is wound around the outside of the magnetic core column. The plastic magnetic component covers the magnetic core column and part of the first winding, and fills the space between the magnetic core column and the first winding. The plastic magnetic component is stacked with the circuit board. The end of the first winding is exposed outside the plastic magnetic component and is electrically connected to the circuit board.

2. The power conversion device according to claim 1, characterized in that, The magnetic device further includes a first magnetic component, which has a receiving hole located on the axial direction of the magnetic core column. The receiving hole is disposed inside the first magnetic component, and at least a portion of the magnetic core column and a portion of the first winding are received in the receiving hole. The end of the first winding is located outside the receiving hole, and the plastic magnetic component covers the first magnetic component.

3. The power conversion device according to claim 2, characterized in that, The first magnetic component has a mounting hole that extends through the first magnetic component along the axial direction of the magnetic core column. In the radial direction of the magnetic core column, the mounting hole is located on one side of the receiving hole. The first winding portion passes through the mounting hole, and the end of the first winding is located outside the mounting hole.

4. The power conversion device according to any one of claims 1-3, characterized in that, The end of the first winding is exposed outside the radial side of the plastic magnetic component on the central column of the magnetic core. The power conversion device also includes a first conductive component, which is disposed between the end of the first winding and the circuit board.

5. The power conversion device according to any one of claims 1-3, characterized in that, The end of the first winding is exposed outside the plastic magnetic component on one side of the column in the magnetic core along the axial direction.

6. The power conversion device according to claim 5, characterized in that, The first winding includes a first end portion, and the first winding also includes a first main body portion and a first connecting portion. The first main body portion is wound around the outside of the magnetic core column. In the axial direction of the magnetic core column, one end of the first connecting portion is disposed at one end of the first main body portion, and the other end is disposed at the first end portion. In a direction perpendicular to the axial direction of the magnetic core column, the first end portion is located on one side of the first connecting portion and is perpendicular to the axial direction of the magnetic core column. The first end is stacked with the circuit board, and the first end is flush with the plastic magnetic component on the axial side of the magnetic core column on the axial side of the magnetic core column.

7. The power conversion device according to any one of claims 1-6, characterized in that, The magnetic device further includes a second winding, which is wound around the central column of the magnetic core and located between the first winding and the central column of the magnetic core. The cross-sectional area of ​​the second winding is smaller than that of the first winding. The plastic magnetic component covers part of the second winding, and the end of the second winding is exposed outside the plastic magnetic component.

8. The power conversion device according to claim 7, characterized in that, In the radial direction of the magnetic core column, the ends of the first winding and the second winding are located on opposite sides of the magnetic core column.

9. The power conversion device according to any one of claims 1-8, characterized in that, The magnetic device further includes a second winding, wherein the first winding and the second winding are wound in parallel around the outside of the central column of the magnetic core, the plastic magnetic component covers part of the second winding, and the end of the second winding is exposed outside the plastic magnetic component.

10. The power conversion device according to any one of claims 1-9, characterized in that, The magnetic device further includes a heat-conducting element, which is partially disposed in the plastic magnetic component. The heat-conducting element is in contact with the insulating layer and partially exposed to the outside of the plastic magnetic component. The thermal conductivity of the heat-conducting element is greater than that of the plastic magnetic component.

11. The power conversion device according to claim 10, characterized in that, The heat-conducting component is exposed on the exterior of the side of the plastic magnetic component facing away from the circuit board.

12. The power conversion device according to any one of claims 1-11, characterized in that, The number of the first windings and the number of the magnetic core columns are both multiple. The multiple magnetic core columns are arranged in sequence at intervals in the radial direction of the magnetic core columns. One first winding is wound around the outside of one magnetic core column. The ends of the multiple first windings are exposed on the outside of one side of the plastic magnetic component.

13. The power conversion device according to any one of claims 1-12, characterized in that, The power conversion device further includes a housing, in which the magnetic components and the circuit board are housed, and the side of the plastic magnetic component facing away from the circuit board contacts the housing.

14. The power conversion device according to any one of claims 1-13, characterized in that, The permeability of the central column of the magnetic core is greater than that of the plastic magnetic component.

15. The power conversion device according to any one of claims 1-14, characterized in that, The insulating layer comprises multiple insulating films, which are sequentially wrapped around the surface of the first winding, and the insulating layer is elastic.

16. A magnetic device, characterized in that, The magnetic device includes a first winding, a magnetic core column, and a plastic magnetic component. The first winding includes an insulating layer that wraps around the surface of the first winding. The first winding is wound around the outside of the magnetic core column. The plastic magnetic component covers the magnetic core column and part of the first winding, and the plastic component fills the space between the magnetic core column and the first winding. The end of the first winding is exposed outside the plastic magnetic component.

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