A frequency response optimization structure of a high-speed direct modulation laser chip

Abstract

The application relates to the technical field of laser structure, in particular to a frequency response optimization structure of a high-speed direct modulation laser chip. The application comprises a frequency response optimization structure of a high-speed direct modulation laser chip, which comprises a heat dissipation shell, a PCB board assembly arranged in the heat dissipation shell, and a plurality of heat dissipation assemblies mounted in the heat dissipation shell. According to the grade of the PCBA heating chip, the electric telescopic rod drives the telescopic ring to extend outward, the telescopic ring drives the shielding plate to move outward, a corresponding size of the heat dissipation hole is formed, an air pressure difference is generated between the box shell and the external air, a large amount of airflow in the box shell is rapidly converted with the external air for the second time, compared with the traditional contact and conduction of objects, the heat dissipation can be better accelerated, and the laser is more stable during high-speed operation.

Description

Technical Field

[0001] This invention relates to the field of laser structure technology, and in particular to a frequency response optimization structure for a high-speed direct-modulation laser chip. Background Technology

[0002] High-speed direct-modulation lasers are semiconductor lasers that directly modulate the output optical power and wavelength through current injection, achieving the conversion of electrical signals to optical signals without the need for an external modulator. Furthermore, due to their simple structure, low cost, and low power consumption, they are widely used in short-distance high-speed optical communications (such as data center interconnects, 5G fronthaul / midhaul, and local area networks), fiber optic sensing, and consumer electronics optical interconnects.

[0003] When a high-speed direct-modulation laser is modulated at high speed, the rapid response frequency of the chip causes instantaneous current injection, leading to a rapid accumulation of Joule heat in the active region of the chip (with a time constant on the order of microseconds). This results in an increase in carrier temperature, which alters the effective mass and recombination rate, leading to a prolonged carrier relaxation time. While the heat on the chip's surface can be dissipated through heat conduction mechanisms during normal operation, conventional heat conduction mechanisms cannot completely dissipate the heat during high-speed operation, thus significantly impacting the chip's lifespan. Summary of the Invention The purpose of this invention is to address the problems existing in the background art by proposing a frequency response optimization structure for a high-speed direct-modulation laser chip.

[0004] The technical solution of the present invention: a frequency response optimization structure for a high-speed direct-modulation laser chip, including a housing, a circuit board assembly disposed inside the housing, multiple heat dissipation components installed inside the housing, and a temperature sensor connected to the heat dissipation components via an electrical signal disposed inside the housing. Two of the heat dissipation components are fixedly installed on the inner wall of the housing shell, and the output end is fixedly installed with a heat-conducting rotating rod. There are multiple sets of heat-conducting rotating rods, and the remaining heat-conducting rotating rods are rotatably installed on the inner wall of the housing shell. The outer side of the heat-conducting rotating rod is provided with a telescopic ring through an electric telescopic rod. An auxiliary heat dissipation assembly is installed on the side of the housing away from the circuit board assembly. The auxiliary heat dissipation assembly includes a set of arc-shaped guide rails slidably mounted on the outside of the gear. Two sets of hinge rods are hinged to the outside of the set of arc-shaped guide rails. The two sets of hinge rods are set in a hinged state. A positioning rod is hinged to the bottom of the hinge rod. A baffle plate is hinged to the outside of the positioning rod. A sliding groove is opened on the inner wall of the housing. The baffle plate is slidably mounted inside the sliding groove.

[0005] Optionally, multiple laser chips are fixedly mounted on the outside of the circuit board assembly, and a heat-conducting plate is provided between the housing and the circuit board assembly. A heat dissipation protrusion adapted to the multiple laser chips is fixedly mounted on one side of the heat-conducting plate.

[0006] Optionally, the heat generated by the laser chip can be conducted to the heat-conducting plate through the heat dissipation boss and then dissipated into the air.

[0007] Optionally, the heat dissipation protrusion has a concave-convex structure, and the distance between the upper surface of the heat dissipation protrusion and the height of the packaging surface of the laser chip is consistent.

[0008] Optionally, the circuit board assembly includes a circuit board with bolt holes at its four corners. The inner wall of the housing is provided with holes at its four corners that match the bolt holes. The circuit board is fixedly installed inside the housing by bolts.

[0009] Optionally, the housing shell has positioning protrusions around its interior perimeter, and the circuit board has positioning grooves around its perimeter that match the positioning protrusions. Current injection lines and modulation interface lines are fixedly installed at both ends of the housing shell, respectively.

[0010] Optionally, multiple storage holes are provided on both sides of the outer shell of the box, a second spring is fixedly installed between the directional rod extending to one side of the storage hole and the outer shell of the box, and a first spring is fixedly installed between the baffle plate and the slide groove.

[0011] Optionally, a cooling fan is fixedly installed on the outer side of the heat-conducting rotating rod, and a gear is fixedly installed on the side of the heat-conducting rotating rod away from the cooling fan. There are multiple gears, and a conveyor belt is meshed with the outer sides of the multiple gears.

[0012] Optionally, the number of the arc-shaped guide rails is two sets. The other set of arc-shaped guide rails is slidably installed on the top of the telescopic ring, and a heat transfer telescopic rod is fixedly installed on the top of the other set of arc-shaped guide rails. The heat transfer telescopic rod is fixedly installed on the bottom end of the heat-conducting plate.

[0013] Optionally, the heat-conducting rotating rod, the heat-transfer telescopic rod, and the telescopic ring are all made of heat-dissipating material.

[0014] In summary, this application includes at least one of the following beneficial technical effects: 1. Based on the heat-generating chip level of the PCBA, the electric telescopic rod drives the telescopic ring to extend outward, and the telescopic ring drives the baffle to move outward, forming a heat dissipation hole of corresponding size. This creates an air pressure difference between the outer shell of the cabinet and the outside air, so that a large amount of airflow inside the cabinet rapidly converts with the outside air. Compared with the traditional material-to-material heat conduction, it can better accelerate the dissipation of heat, making the laser more stable when it runs at high speed. 2. The telescopic ring conducts heat to the heat-conducting rotating rod through the electric telescopic rod. Multiple heat-conducting rotating rods are in direct contact with the outer shell of the housing, thereby conducting heat to the outside. If a large amount of heat is generated inside the laser chip, the cooling fan will start, which will cool the heat on the surface of the heat-conducting rotating rod, which serves as the main support, thereby improving the cooling efficiency of the chip. 3. The heat dissipation shell increases the contact area between the chip and the surrounding air. According to the principle of heat transfer, heat will be transferred from the hotter heat dissipation shell to the cooler surrounding air. The heat will be dissipated into the air through natural convection or forced convection, thereby achieving heat dissipation of the chip and ensuring that its internal components work normally within a suitable temperature range, avoiding damage due to overheating. Attached Figure Description

[0015] Figure 1 A schematic diagram of the structure optimized for frequency response; Figure 2 This is a schematic diagram of the circuit board assembly of the present invention; Figure 3 This is a schematic diagram of the structure of the heat dissipation shell of the present invention; Figure 4 This is a schematic diagram of the slide groove of the present invention; Figure 5 for Figure 4 Enlarged view of region A in the middle; Figure 6 This is a schematic diagram of the heat dissipation component of the present invention; Figure 7 for Figure 6 Enlarged view of region B in the middle; Figure 8 This is a schematic diagram of the auxiliary heat dissipation component of the present invention; Figure 9 for Figure 8 Enlarged view of the central C region; Figure 10 This is a schematic diagram of the directional rod of the present invention.

[0016] Reference numerals: 1. Housing shell; 2. Circuit board assembly; 201. Circuit board; 202. Positioning groove; 203. Bolt hole; 3. Laser chip; 4. Heat dissipation boss; 5. Heat conduction plate; 6. Current injection line; 7. Modulation interface line; 8. Heat dissipation assembly; 801. Miniature DC brushless motor; 802. Heat conduction rotating rod; 803. Cooling fan; 804. Telescopic ring; 805. Gear; 806. Conveyor belt; 807. Heat transfer telescopic rod; 808. Electric telescopic rod; 9. Auxiliary heat dissipation assembly; 901. Baffle plate; 902. Positioning long rod; 903. Slide groove; 904. First spring; 905. Second spring; 906. Arc-shaped guide rail frame; 907. Directional long rod; 908. Hinge rod. Detailed Implementation

[0017] The technical solution of this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0018] The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of this application provided in the drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application.

[0019] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] In the description of this application, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] like Figure 1 and Figure 2 As shown, the present invention proposes a frequency response optimization structure for a high-speed direct-modulation laser chip, including a housing 1, a circuit board assembly 2 disposed inside the housing 1, multiple laser chips 3 fixedly mounted on the outside of the circuit board assembly 2, a heat-conducting plate 5 disposed between the housing 1 and the circuit board assembly 2, and a heat dissipation protrusion 4 adapted to the multiple laser chips 3 fixedly mounted on one side of the heat-conducting plate 5. When the laser chips 3 operate at high speed, the heat generated can be conducted to the heat-conducting plate 5 through the heat dissipation protrusion 4 and then dissipated into the air.

[0023] In one implementation, the outer casing 1 is the basic framework of the entire heat dissipation structure. It is mainly installed inside the laser to house the laser chip 3 and store the heat generated during its high-frequency response. The outer casing 1 is equipped with covers at both the top and bottom. In this application, only the cover that serves as the top cover is shown. The circuit board assembly 2 is the mounting carrier for electronic components. It is mainly used to carry and connect various electronic components, including the laser chip 3, to realize circuit functions.

[0024] It is worth noting that multiple laser chips 3 are disposed on the circuit board assembly 2, and these laser chips 3 are the main source of heat generated during the operation of the laser. They generate heat due to current flow and the operation of electronic components during operation. The heat dissipation protrusion 4 is directly close to the Joule region of the laser chip 3, and it can absorb the heat around the laser chip 3.

[0025] Furthermore, when the laser is operating normally, a significant amount of heat from the laser chip 3 on the circuit board assembly 2 is transferred to the heat dissipation protrusion 4 via thermal conduction. The heat dissipation protrusion 4 acts as a heat conduction bridge, further transferring heat to the outer casing 1. Based on the principle of heat transfer, heat is transferred from the hotter outer casing 1 to the cooler surrounding air, dissipating into the air through natural or forced convection, thereby achieving heat dissipation for the laser and reducing the entry of dust into the electronic components.

[0026] Combination Figure 1 As shown, the heat dissipation protrusion 4 has a concave-convex structure, and the distance between the upper surface of the heat dissipation protrusion 4 and the height of the packaging surface of the laser chip 3 are consistent.

[0027] Specifically, the heat dissipation boss 4 has an overall concave-convex structure. This concave-convex structure is not a simple plane, but has an undulating shape. This increases the surface area of ​​the heat dissipation boss 4. Compared with a normal planar structure, the larger surface area can provide more heat exchange area within the same volume, which helps to improve heat dissipation efficiency.

[0028] The upper surface of the heat dissipation protrusion 4 is at the same height as the packaging surface of the laser chip 3. This means that the vertical distance between each position on the upper surface of the heat dissipation protrusion 4 and the packaging surface of the laser chip 3 is equal. The space between them is filled with thermal grease, which allows the heat dissipation protrusion 4 to achieve uniform and good contact with the packaging surface of the laser chip 3, ensuring that heat can be efficiently transferred from the laser chip 3 to the heat dissipation protrusion 4.

[0029] Combination Figure 1 , Figure 2 and Figure 4As shown, the circuit board assembly 2 includes a circuit board 201. The circuit board 201 has bolt holes 203 at its four corners. The inner wall of the housing 1 has holes at its four corners that match the bolt holes 203. The circuit board 201 is fixedly installed inside the housing 1 by bolts.

[0030] Specifically, the circuit board assembly 2 serves as the mounting carrier for the electronic components in the laser, enabling circuit connections and functionality. Positioning slots 202 are provided at its four corners; these slots 202 are crucial structures for securing the assembly to the outer casing 1. This ensures that bolts can pass through smoothly and achieve reliable fastening.

[0031] At the four corners inside the housing 1, holes are provided that match the positioning slots 202 on the circuit board assembly 2. The position, size, and shape of these holes correspond to the positioning slots 202 so that bolts can pass through both the positioning slots 202 of the circuit board assembly 2 and the holes inside the housing 1, thus securing the circuit board assembly 2 inside the housing 1. The bolts firmly fix the circuit board assembly 2 inside the housing 1 through the positioning slots 202.

[0032] Combination Figure 1 , Figure 2 As shown, the inner perimeter of the housing 1 is provided with positioning protrusions, and the perimeter of the circuit board 201 is provided with positioning grooves 202 that match the positioning protrusions.

[0033] Specifically, bolt positioning blocks are set around the inside of the outer casing 1. These bolt positioning blocks are usually structures that protrude from the inner wall of the outer casing 1. The number of bolt positioning blocks corresponds to the number of circuit boards 201 around the circuit board assembly 2. A common layout is to set a certain number of positioning protrusions on the four sides inside the outer casing 1 to achieve omnidirectional positioning.

[0034] Circuit boards 201 matching the bolt positioning blocks are provided around the circuit board assembly 2. When the circuit board assembly 2 is installed inside the housing 1, the positioning protrusions can be precisely embedded in the circuit board 201, which plays the role of positioning and fixing.

[0035] Combination Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a current injection line 6 and a modulation interface line 7 are fixedly installed at both ends of the outer casing 1.

[0036] Specifically, the current injection line 6 is located at one end of the housing 1. The current injection line 6 provides power support for the chip's operation, while the modulation interface line 7 is located at the other end of the housing 1. The modulation interface line 7 is used to connect to an external data line to realize data communication between the laser and the chip, so as to adjust the chip's operating state.

[0037] As one implementation method, such as Figures 5 to 7 As shown, multiple heat dissipation components 8 are installed inside the outer casing 1. Two of the heat dissipation components 8 include a miniature brushless DC motor 801 fixedly installed on the inner wall of the outer casing 1. A temperature sensor connected to the heat dissipation components 8 via an electrical signal is installed inside the outer casing 1. A heat-conducting rotating rod 802 is fixedly installed at the output end of the miniature brushless DC motor 801. There are multiple sets of heat-conducting rotating rods 802. The remaining heat-conducting rotating rods 802 are rotatably installed on the inner wall of the outer casing 1. A telescopic ring 804 is provided on the outer side of the heat-conducting rotating rod 802 via an electric telescopic rod 808. An auxiliary heat dissipation assembly 9 is installed on the side of the outer casing 1 away from the circuit board assembly 2. The auxiliary heat dissipation assembly 9 includes a set of arc-shaped guide rails 906 that are slidably mounted on the outside of the gear 805. Two sets of hinge rods 908 are hinged to the outside of the set of arc-shaped guide rails 906. The two sets of hinge rods 908 are set in a hinged state. A positioning rod 902 is hinged to the bottom of the hinge rod 908. A baffle plate 901 is hinged to the outside of the positioning rod 902. A sliding groove 903 is opened on the inner wall of the outer casing 1. The baffle plate 901 is slidably mounted inside the sliding groove 903.

[0038] Specifically, in order to ensure that the chip is in a sealed state under normal conditions, the two sets of shielding plates 901 are set in a closed and fitted state by the elastic force of the first spring 904 and the assistance of the electric telescopic rod 808 driving the gear 805 to retract and form the minimum diameter of the gear 805. At this time, both the inside and outside of the housing 1 are sealed, which can prevent dust from entering the equipment and prevent dust from interfering with the electronic components inside the housing 1.

[0039] If the laser chip 3 generates a large amount of heat, and the sealed environment is not suitable for heat circulation, the temperature sensor controls the telescopic ring 804 to extend outward via an electrical signal. The diameter of the telescopic ring 804 begins to increase. The telescopic ring 804 is a ring assembly with multiple arc-shaped pieces slidingly connected. When each electric telescopic rod 808 drives an arc-shaped piece to adjust its height, they move synchronously under the linkage of each arc-shaped piece. After the diameter of the telescopic ring 804 opens, it presses down on the arc-shaped guide frame 906. When the telescopic ring 804 rotates with the heat-conducting rotating rod 802 and the cooling fan 803, the arc-shaped guide frame 906 simultaneously guides the rotation of the telescopic ring 804, causing the arc-shaped guide frame 906 to drive the hinge rod 908 to deflect outward along the directional rod 907. The hinge rod 908 drives the baffle plate 901 to deflect outward along the slide groove 903 through the positioning rod 902, thus... The surface of the outer shell 1 is made into a heat dissipation hole. It should be noted that the higher the temperature sensed by the temperature sensor, the longer the electric telescopic rod 808 extends. Therefore, the more heat is emitted by the laser chip 3, the more the sealing template 94 moves outward, and the larger the area of ​​the heat dissipation hole is formed. In turn, the two sets of cooling fans 803 form airflow convection. Since the heat dissipation hole is sealed under normal conditions, the outer shell 1 is in a nearly sealed state under normal conditions. At this time, as the heat dissipation hole on the surface of the outer shell 1 expands, a pressure difference is generated between the outer shell 1 and the outside air. A large amount of airflow inside the outer shell 1 is rapidly converted into the outside air. It should be noted that a filter screen can be installed at the heat dissipation hole to prevent the flow of dust. According to the above method, compared with the traditional material-to-material heat conduction, it can better accelerate the heat dissipation, making the laser more stable when operating at high speed.

[0040] It is worth noting that, such as Figures 7 to 10 As shown, multiple storage holes are provided on both sides of the outer shell 1. A second spring 905 is fixedly installed between the directional rod 907 extending to one side of the storage hole and the outer shell 1. A first spring 904 is fixedly installed between the baffle plate 901 and the slide groove 903. A cooling fan 803 is fixedly installed on the outside of the heat-conducting rotating rod 802. A gear 805 is fixedly installed on the side of the heat-conducting rotating rod 802 away from the cooling fan 803. There are multiple gears 805. A conveyor belt 806 is meshed with the outside of the multiple gears 805. There are two sets of arc-shaped guide rail frames 906. The other set of arc-shaped guide rail frames 906 is slidably installed on the top of the telescopic ring 804. A heat transfer telescopic rod 807 is fixedly installed on the top of the other set of arc-shaped guide rail frames 906. The heat transfer telescopic rod 807 is fixedly installed at the bottom of the heat-conducting plate 5. The heat-conducting rotating rod 802, the heat transfer telescopic rod 807 and the telescopic ring 804 are all made of heat-dissipating material.

[0041] Specifically, both the heat dissipation component 8 and the auxiliary heat dissipation component 9 use heat-dissipating metal or aluminum alloy impellers, resulting in an operating noise of <40dB. At the same time, based on the passive heat dissipation of the heat conduction plate 5, a micro fan mechanism is added. The diameter of the micro fan mechanism is 20mm-50mm, and the speed is 5000rpm-20000rpm. This accelerates the heat dissipation around the laser chip 3 and the heat dissipation protrusion 4 through forced convection, avoids the rapid aging of the heat dissipation protrusion 4, and improves the overall heat dissipation inside the casing 1.

[0042] To further explain, the heat transfer telescopic rod 807 contacts both the arc-shaped guide slot frame 906 and the heat-conducting plate 5. During operation, the heat-conducting plate 5 transfers heat through the heat transfer telescopic rod 807 to the arc-shaped guide slot frame 906 and the telescopic ring 804. The telescopic ring 804 then conducts the heat to the heat-conducting rotating rod 802 via the electric telescopic rod 808. The multiple heat-conducting rotating rods 802 directly contact the outer casing 1, thereby transferring the heat to the outside. If a large amount of heat is generated inside the laser chip 3, the cooling fan 803 is activated, which cools the surface of the heat-conducting rotating rods 802, which serve as the main support, thereby improving the cooling efficiency of the chip.

[0043] The above specific embodiments are merely several optional embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make modifications to the above specific embodiments.

Claims

1. A frequency response optimization structure for a high-speed direct-modulation laser chip, comprising a housing (1) and a circuit board assembly (2) disposed inside the housing (1), characterized in that, The housing (1) is equipped with multiple heat dissipation components (8), and the housing (1) is equipped with a temperature sensor that is connected to the heat dissipation components (8) by an electrical signal. Two of the heat dissipation components (8) include (801) fixedly installed on the inner wall of the outer shell (1) of the box. The output end of the (801) is fixedly installed with a heat-conducting rotating rod (802). There are multiple sets of heat-conducting rotating rods (802). The remaining heat-conducting rotating rods (802) are rotatably installed on the inner wall of the outer shell (1). The outer side of the heat-conducting rotating rod (802) is provided with a telescopic ring (804) through an electric telescopic rod (808). An auxiliary heat dissipation assembly (9) is installed on the side of the outer shell (1) away from the circuit board assembly (2). The auxiliary heat dissipation assembly (9) includes a set of arc-shaped guide rails (906) slidably mounted on the outside of the gear (805). Two sets of hinge rods (908) are hinged to the outside of the set of arc-shaped guide rails (906). The two sets of hinge rods (908) are set in a hinged state. A positioning rod (902) is hinged to the bottom of the hinge rod (908). A baffle plate (901) is hinged to the outside of the positioning rod (902). A sliding groove (903) is opened on the inner wall of the outer shell (1). The baffle plate (901) is slidably mounted inside the sliding groove (903).

2. The frequency response optimization structure of a high-speed direct-modulation laser chip according to claim 1, characterized in that, Multiple laser chips (3) are fixedly installed on the outside of the circuit board assembly (2). A heat-conducting plate (5) is provided between the housing shell (1) and the circuit board assembly (2). A heat dissipation boss (4) adapted to the multiple laser chips (3) is fixedly installed on one side of the heat-conducting plate (5).

3. The frequency response optimization structure of a high-speed direct-modulation laser chip according to claim 2, characterized in that, The heat generated by the laser chip (3) can be conducted to the heat-conducting plate (5) through the heat dissipation boss (4) and then dissipated into the air.

4. The frequency response optimization structure of a high-speed direct-modulation laser chip according to claim 3, characterized in that, The heat dissipation protrusion (4) has a concave-convex structure, and the distance between the upper surface of the heat dissipation protrusion (4) and the height of the packaging surface of the laser chip (3) are consistent.

5. The frequency response optimization structure of a high-speed direct-modulation laser chip according to claim 1, characterized in that, The circuit board assembly (2) includes a circuit board (201), and bolt holes (203) are provided at the four corners of the circuit board (201). Holes matching the bolt holes (203) are opened on the inner wall of the housing (1) at the four corners. The circuit board (201) is fixedly installed inside the housing (1) by bolts.

6. The frequency response optimization structure of a high-speed direct-modulation laser chip according to claim 5, characterized in that, The housing (1) has positioning protrusions around its interior, and the circuit board (201) has positioning grooves (202) around its perimeter that match the positioning protrusions. The housing (1) has current injection lines (6) and modulation interface lines (7) fixedly installed at both ends.

7. The frequency response optimization structure of a high-speed direct-modulation laser chip according to claim 1, characterized in that, Multiple storage holes are provided on both sides of the outer shell (1) of the box. The directional rod (907) extends to one side of the storage hole and is fixedly installed with a second spring (905) between it and the outer shell (1). A first spring (904) is fixedly installed between the baffle plate (901) and the slide groove (903).

8. The frequency response optimization structure of a high-speed direct-modulation laser chip according to claim 1, characterized in that, A cooling fan (803) is fixedly installed on the outer side of the heat-conducting rotating rod (802). A gear (805) is fixedly installed on the side of the heat-conducting rotating rod (802) away from the cooling fan (803). There are multiple gears (805), and a conveyor belt (806) meshes with the outer sides of the multiple gears (805).

9. The frequency response optimization structure of a high-speed direct-modulation laser chip according to claim 8, characterized in that, There are two sets of the arc-shaped guide rails (906). The other set of arc-shaped guide rails (906) is slidably installed on the top of the telescopic ring (804). The top of the other set of arc-shaped guide rails (906) is fixedly installed with a heat transfer telescopic rod (807). The heat transfer telescopic rod (807) is fixedly installed at the bottom of the heat-conducting plate (5).

10. The frequency response optimization structure of a high-speed direct-modulation laser chip according to claim 9, characterized in that, The heat-conducting rotating rod (802), the heat transfer telescopic rod (807), and the telescopic ring (804) are all made of heat-dissipating material.

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