A hanging basket shaking device for wafer cleaning

By designing a basket shaking device for wafer cleaning, residual droplets and powder on the wafer surface are removed by using inertial force, which solves the problem of particulate contamination in the wafer drying process, improves drying efficiency and operational reliability, and ensures the cleanliness and uniformity of the wafer.

CN122180343APending Publication Date: 2026-06-09昆山日月同芯半导体有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
昆山日月同芯半导体有限公司
Filing Date
2026-03-13
Publication Date
2026-06-09

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Abstract

This invention discloses a wafer cleaning basket shaking device, relating to the field of semiconductor equipment manufacturing technology. An operating box is fixedly connected to the upper surface of the movable base. A cleaning basket is provided on one side of the operating box. An operating groove is formed inside the operating box, and an operating slider is slidably connected inside the operating groove. A sealing groove is formed on the inner wall of the operating groove near the cleaning basket. A driving groove is formed on the lower inner wall of the operating box. The shaking mechanism, employing a swinging motion, after cleaning, uses multi-frequency, low-arc reciprocating motion. During the drainage and initial drying stages, the continuous inertial force causes the droplets adhering to the wafer surface to detach. The inertial force generated by the swinging motion effectively peels off loose residual powder from the surface and carries it into the flowing liquid for simultaneous discharge. This significantly reduces the risk of particle residue while improving drying efficiency.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment manufacturing technology, specifically to a wafer cleaning basket shaking device. Background Technology

[0002] Wafer cleaning baskets are key tools used in semiconductor manufacturing to hold and hold wafers for batch cleaning and wet processing. They are typically made of high-purity, corrosion-resistant materials, and their structural design includes precision slots or supports to ensure that wafers remain vertically or horizontally separated in the cleaning tank. This prevents wafers from colliding or becoming contaminated during chemical immersion, rinsing, and drying, while allowing cleaning agents and deionized water to fully contact the wafer surface, thereby efficiently removing particles, organic matter, and metallic impurities. They are important support fixtures for ensuring the uniformity and reliability of the wafer cleaning process.

[0003] The process of using a wafer cleaning basket begins with the precise and safe loading of multiple wafers into its specially designed slots. The entire basket is then immersed in a series of chemical cleaning tanks and ultrapure water rinsing tanks arranged in the process sequence. The basket is transported and lifted by a robotic arm or track. Its open structure design ensures that the chemical solutions and ultrapure water can flow and exchange fully on the wafer surface, efficiently removing contaminants while maintaining physical isolation between wafers to avoid scratches and cross-contamination. Finally, after completing all cleaning, rinsing, and nitrogen drying steps, the basket carrying the clean wafers is removed, ready for the next semiconductor manufacturing process.

[0004] The residual water film formed on the wafer surface due to the surface tension of the liquid carries a large amount of deionized water or chemical residues to the subsequent drying tank. This not only significantly increases the load and time of the drying process, but also leaves watermarks, streaks, or spots caused by the concentration of contaminants on the wafer surface due to uneven liquid evaporation. At the same time, residual droplets can also become attachment points for particulate contamination, thereby directly reducing the cleanliness and drying uniformity of the wafer, and ultimately posing a potential risk to the yield and reliability of semiconductor devices. Summary of the Invention

[0005] Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a wafer cleaning basket shaking device, which solves the problems mentioned in the background section.

[0006] Technical solution To achieve the above objectives, the present invention provides the following technical solution: a wafer cleaning basket shaking device, comprising a movable base, an operation box fixedly connected to the upper surface of the movable base, a cleaning basket provided on one side of the operation box, an operation slide groove provided inside the operation box, an operation slider slidably connected inside the operation slide groove, a sealing groove provided on the inner wall of the operation slide groove near the cleaning basket, the sealing groove passing through the operation box and communicating with the outside, a drive groove provided on the lower inner wall of the operation box, and an electric telescopic rod provided inside the drive groove; The operating slider is provided with a driving mechanism on the side of the cleaning basket. The surface of the driving mechanism is provided with a clamping mechanism to fix the cleaning basket. The surface of the driving mechanism is provided with a shaking mechanism to remove residual water droplets and dust from the semiconductor surface inside the cleaning basket. The side of the operating slider away from the cleaning basket is provided with a limit mechanism. The inside of the operating slide is provided with a power mechanism.

[0007] Preferably, the operating slider has a lifting groove on the side near the cleaning basket, and a lifting plate is slidably connected inside the lifting groove. The lifting plate is L-shaped, and the horizontal part of the lifting plate is located inside the lifting groove. Limiting grooves are formed on both inner walls of the lifting groove. Limiting sliders are fixedly connected to both sides of the horizontal part of the lifting plate, and the limiting sliders extend into the limiting grooves adjacent to them. A hanging frame is fixedly connected to the lower end of the vertical part of the lifting plate near the cleaning basket. A lifting guide rail is fixedly connected to the side of the cleaning basket near the operating slider. The lifting guide rail is slidably connected inside the hanging frame. The output shaft of the electric telescopic rod extends into the lifting groove, and the output shaft of the electric telescopic rod is fixedly connected to the horizontal part of the lifting plate.

[0008] Preferably, the driving mechanism includes a central connecting rod rotatably connected to the side of the operating slider near the cleaning basket. A horizontal plate is fixedly connected to the end of the central connecting rod away from the operating box. Two side support blocks are symmetrically arranged on the side of the horizontal plate away from the operating box. A lead screw is rotatably connected between the two side support blocks. A drive motor is fixedly connected to the side support block away from the lead screw. The output shaft of the drive motor is fixedly connected to the lead screw. Two transmission blocks are symmetrically threaded on the surface of the lead screw.

[0009] Preferably, the clamping mechanism includes a main body block fixedly connected to the side of the two transmission blocks away from the horizontal plate, a transmission guide rail fixedly connected to the side of the horizontal plate away from the operating box, two guide rail blocks symmetrically slidably connected to the surface of the transmission guide rail, the guide rail blocks being fixedly connected to adjacent main body blocks, side wall support plates fixedly connected to both sides of the washing basket, clamping blocks fixedly connected to the lower surfaces of the two main body blocks, and clamping grooves provided on the side of the two clamping blocks that are close to each other.

[0010] Preferably, the shaking mechanism includes a drive gear rotatably connected to the surface of the operating slider near the cleaning basket via a rotating shaft, a collar is fixedly sleeved on the surface of the central connecting rod, a central connecting rod is fixedly connected to the surface of the collar, an adjusting groove is provided on the surface of the central connecting rod, and an abutment shaft is fixedly connected to the surface of the drive gear near the cleaning basket, the abutment shaft extending into the interior of the adjusting groove.

[0011] Preferably, the operating slider is rotatably connected to a variable gear on the side surface near the cleaning basket via a rotating shaft. The variable gear meshes with the drive gear. Multiple side tooth blocks are arranged linearly from top to bottom on the inner wall of the sealing groove. The side of the drive gear near the cleaning basket is aligned with the side of the operating box near the cleaning basket. The side tooth blocks are located on the sliding path of the variable gear, and the variable gear meshes with the side tooth blocks.

[0012] Preferably, the limiting mechanism includes a limiting groove formed inside the operating slider, a rotating circular plate rotatably connected inside the limiting groove, one end of the central connecting rod extending into the limiting groove and fixedly connected to the rotating circular plate, a horizontal plate groove formed on the inner wall of the limiting groove away from the washing basket, an adjusting horizontal plate slidably connected inside the horizontal plate groove, two central locking grooves symmetrically formed on the side of the rotating circular plate near the adjusting horizontal plate, a central arc groove formed on the inner wall of the central locking groove, and two limiting locking shafts symmetrically fixedly connected on the side of the adjusting horizontal plate near the rotating circular plate, the limiting locking shafts extending into the central locking grooves adjacent to them.

[0013] Preferably, the power mechanism includes a contraction groove formed on the inner wall of the horizontal plate groove on the side away from the central connecting rod. The contraction groove passes through the operating slider and is located on the side away from the central connecting rod. A drive shaft is slidably connected inside the contraction groove. The drive shaft is fixedly connected to the adjusting horizontal plate. An expansion groove is formed on the inner wall of the contraction groove. An expansion ring is slidably connected inside the expansion groove. The expansion ring is fixedly sleeved on the surface of the drive shaft. An adjusting spring is fixedly connected to the inner wall of the expansion groove. The adjusting spring is fixedly connected to the expansion ring.

[0014] Preferably, the inner wall of the operating chute away from the cleaning basket has an extension groove, both ends of which are set as inclined surfaces, and the intersection of the vertical part of the extension groove and the inclined surface part is located at both ends of the side tooth block.

[0015] Beneficial effects The wafer cleaning basket shaking device provided by this invention has the following beneficial effects: 1. The oscillating mechanism, after cleaning, uses multi-frequency, low-arc reciprocating motion to cause the droplets adhering to the wafer surface to detach through continuous inertial force during the drainage and initial drying stages. The inertial force generated by the oscillation effectively peels off loose residual powder on the surface and carries it into the flowing liquid for simultaneous discharge. This significantly reduces the risk of particle residue while improving drying efficiency.

[0016] 2. After the cleaning basket completes the swing cleaning operation, it is first precisely positioned horizontally and then mechanically fixed to ensure that the cleaning basket and the wafer it carries always maintain a strictly horizontal posture during the subsequent lifting, transfer and drying processes. This ensures that the cleaning basket is accurately placed into the cleaning tank, avoiding mechanical collisions caused by tilting and enhancing the safety and reliability of the operation process. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 For the present invention Figure 3 A magnified view of part A in the image; Figure 4 This is a schematic diagram of the internal structure of the slider of the present invention; Figure 5 This is a schematic diagram of the internal side view structure of the slider of the present invention; Figure 6 This is a schematic diagram of the hanging frame connection structure of the present invention; Figure 7 This is a schematic diagram of the central connecting rod connection structure of the present invention; Figure 8 This is a schematic diagram of the internal structure of the rotating circular plate of the present invention; Figure 9 This is a schematic diagram of the central arc groove location structure of the present invention.

[0018] The labels in the diagram represent: 1. Movable base; 11. Control box; 12. Control slide; 13. Control slider; 14. Cleaning basket; 15. Drive slot; 16. Lifting slot; 17. Lifting plate; 18. Hanging frame; 19. Limiting slide; 110. Limiting slider; 111. Lifting guide rail; 2. Side wall support plate; 21. Central connecting rod; 22. Horizontal plate; 23. Side support block; 24. Lead screw; 25. Drive motor; 26. Transmission block; 3. Transmission guide rail; 31. Guide rail block. 32. Main body block; 33. Clamping block; 4. Side tooth block; 41. Drive gear; 42. Collar; 43. Central connecting rod; 44. Adjusting slide groove; 45. Abutting shaft; 46. Variable gear; 5. Limiting groove; 51. Rotating circular plate; 52. Horizontal plate groove; 53. Adjusting horizontal plate; 54. Limiting retaining shaft; 55. Central arc surface groove; 56. Central retaining groove; 6. Extension groove; 61. Contraction groove; 62. Drive shaft; 63. Outer expansion groove; 64. Outer expansion ring; 65. Adjusting spring. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] refer to Figures 1 to 9 A preferred embodiment of the present invention, a wafer cleaning basket shaking device, will be described in detail below, including a movable base 1, an operation box 11 fixedly connected to the upper surface of the movable base 1, a cleaning basket 14 provided on one side of the operation box 11, an operation slide groove 12 provided inside the operation box 11, an operation slider 13 slidably connected inside the operation slide groove 12, a sealing groove provided on the inner wall of the operation slide groove 12 near the cleaning basket 14, the sealing groove passing through the operation box 11 and communicating with the outside, the width of the operation slide groove 12 being greater than the sealing groove, ensuring that the operation slider 13 slides stably up and down inside the operation slide groove 12, a drive groove 15 provided on the lower inner wall of the operation box 11, and an electric telescopic rod provided inside the drive groove 15; A drive mechanism is provided on the surface of the operating slider 13 near the cleaning basket 14. A clamping mechanism is provided on the surface of the drive mechanism to fix the cleaning basket 14. The drive mechanism provides power to the clamping mechanism to fix the cleaning basket 14. The position of the operating slider 13 is adjusted by an electric telescopic rod to transport the cleaning basket 14. A shaking mechanism is provided on the surface of the drive mechanism to remove residual water droplets and dust from the semiconductor surface inside the cleaning basket 14. A limit mechanism is provided on the side of the operating slider 13 away from the cleaning basket 14 to ensure that the cleaning basket 14 is always in a horizontal and stable state when no shaking operation is performed. A power mechanism is provided inside the operating slide 12.

[0021] like Figure 4 In the center, the operating slider 13 has a lifting groove 16 near the cleaning basket 14. A lifting plate 17 is slidably connected inside the lifting groove 16. The lifting plate 17 is L-shaped, with its horizontal portion located inside the lifting groove 16. Limiting grooves 19 are provided on both inner walls of the lifting groove 16. Limiting sliders 110 are fixedly connected to both sides of the horizontal portion of the lifting plate 17. The limiting sliders 110 extend into the limiting grooves 19. By sliding the limiting sliders 110 inside the limiting grooves 19, the lifting plate 17 is driven to slide stably up and down inside the lifting groove 16 along the limiting grooves 19. A hanging frame 18 is fixedly connected to the lower end of the vertical section 17 near the cleaning basket 14. A lifting guide rail 111 is fixedly connected to the cleaning basket 14 near the operating slider 13. The lifting guide rail 111 is slidably connected inside the hanging frame 18. The output shaft of the electric telescopic rod extends into the interior of the lifting groove 16. The output shaft of the electric telescopic rod is fixedly connected to the horizontal part of the lifting plate 17. The hanging frame 18 and the lifting guide rail 111 are both arc-shaped. Initially, the hanging frame 18 is located directly below the lifting guide rail 111, and at this time, the limiting slider 110 is located at the lower end of the limiting groove 19. The output shaft of the electric telescopic rod is slidably connected to the bottom of the operating slider 13.

[0022] like Figure 2 and Figure 3In the drive mechanism, there is a central connecting rod 21 rotatably connected to the side of the operating slider 13 near the cleaning basket 14. The central connecting rod 21 is rotatably connected to the operating slider 13 through a bearing. A horizontal plate 22 is fixedly connected to the end of the central connecting rod 21 away from the operating box 11. Two side support blocks 23 are symmetrically arranged on the side of the horizontal plate 22 away from the operating box 11. A lead screw 24 is rotatably connected between the two side support blocks 23. Both ends of the lead screw 24 are threaded, and the thread directions at both ends of the lead screw 24 are opposite. A drive motor 25 is fixedly connected to the side support block 23 away from the lead screw 24. The output shaft of the drive motor 25 is fixedly connected to the lead screw 24. Two transmission blocks 26 are symmetrically threaded on the surface of the lead screw 24. Through the threads at both ends of the lead screw 24, the two transmission blocks 26 are driven to move away from or closer to each other. Initially, the transmission blocks 26 are located at the ends of the lead screw 24 where the threads at both ends are far apart. like Figure 3 The clamping mechanism includes a main body block 32 fixedly connected to the side of the two transmission blocks 26 away from the horizontal plate 22. A transmission guide rail 3 is fixedly connected to the side of the horizontal plate 22 away from the operating box 11. Two guide rail blocks 31 are symmetrically slidably connected to the surface of the transmission guide rail 3. The guide rail blocks 31 are fixedly connected to the adjacent main body block 32. The guide rail blocks 31 slide on the surface of the transmission guide rail 3, thereby driving the main body block 32 to slide stably back and forth along the surface of the transmission guide rail 3. Side wall support plates 2 are fixedly connected to both sides of the cleaning basket 14. Clamping blocks 33 are fixedly connected to the lower surface of the two main body blocks 32. A clamping groove is opened on the side of the two clamping blocks 33 that are close to each other. The side wall support plate 2 extends into the clamping groove and fits against the inner wall of the clamping groove, thereby ensuring that the side wall support plate 2 will not shake inside the clamping groove.

[0023] When the cleaning basket 14 is being cleaned, the clamping groove is aligned with the side wall support plate 2 under the drive of the operation box 11. At this time, the drive motor 25 drives the lead screw 24 to rotate through the output shaft, and the two transmission blocks 26 move closer to each other through the thread on the surface of the lead screw 24, and slide stably along the surface of the transmission guide rail 3 until the two clamping blocks 33 clamp and fix the cleaning basket 14. Then, the cleaning basket 14 is transported through the movable base 1 and the operation box 11, thereby transporting the cleaning basket 14 to the cleaning area for cleaning.

[0024] like Figure 7In the middle, the shaking mechanism includes a drive gear 41 that is rotatably connected to the surface of the operating slider 13 near the cleaning basket 14 via a rotating shaft. A collar 42 is fixedly sleeved on the surface of the central connecting rod 21. A central connecting rod 43 is fixedly connected to the surface of the collar 42. An adjustment groove 44 is opened on the surface of the central connecting rod 43. An abutment shaft 45 is fixedly connected to the surface of the drive gear 41 near the cleaning basket 14. The abutment shaft 45 extends into the interior of the adjustment groove 44. Initially, the central connecting rod 43 is in a vertical state under the push of the abutment shaft 45, and the transverse plate 22 is in a horizontal state. The operating slider 13 is rotatably connected to a variable gear 46 on the side of the cleaning basket 14 via a rotating shaft. The variable gear 46 meshes with the drive gear 41. Multiple side tooth blocks 4 are arranged linearly from top to bottom on the inner wall of the sealing groove. The side of the drive gear 41 near the cleaning basket 14 is aligned with the side of the operating box 11 near the cleaning basket 14 to ensure that the central connecting rod 43 will not collide with the inner wall of the sealing groove when it swings. The side tooth blocks 4 are located on the sliding path of the variable gear 46 and mesh with the side tooth blocks 4. The diameter of the variable gear 46 is larger than the diameter of the drive gear 41 to ensure that the drive gear 41 has sufficient speed and rotation time when the variable gear 46 drives the drive gear 41 to rotate.

[0025] After the cleaning basket 14 has finished cleaning inside the cleaning mechanism, the output shaft of the electric telescopic rod drives the lifting plate 17 to slide upward, thereby driving the hanging frame 18 to slide upward synchronously. When the lifting plate 17 slides to the upper end of the lifting groove 16, the lifting guide rail 111 extends into the interior of the hanging frame 18, thereby providing support for the cleaning basket 14. As the output shaft of the electric telescopic rod continues to slide upward, the lifting plate 17 drives the operating slider 13 to slide upward synchronously, thereby driving the cleaning basket 14 to slide upward synchronously through the clamping mechanism until the cleaning basket 14 is removed from the inside of the cleaning mechanism. As the operating slider 13 continues to slide upward, the variable gear 46 contacts the side tooth block 4. The variable gear 46 rotates under the push of the side tooth block 4, and the drive gear 41 rotates under the push of the variable gear 46. The surface contact shaft 45 provides a thrust to the inner wall of one side of the adjusting slide 44, thereby pushing the central connecting rod 43 to swing gradually away from the center line of the drive gear 41 until the contact shaft 45 is located in the middle of the adjusting slide 44. As the drive gear 41 continues to rotate, the contact shaft 45 contacts the inner wall of the opposite side of the adjusting slide 44, thereby pushing the central connecting rod 43 back until the contact shaft 45 reaches the lower end of the adjusting slide 44. At this time, the central connecting rod 43 becomes horizontal again. This process is repeated through the continuous rotation of the drive gear 41. During the reciprocating swing of the central connecting rod 43, the central connecting rod 21 drives the drive mechanism and the clamping mechanism to swing back and forth. The clamping mechanism drives the cleaning basket 14 to swing synchronously. The cleaning basket 14 is made to swing back and forth synchronously during the upward process, thereby throwing out the liquid droplets on the wafer surface inside the cleaning basket 14. After cleaning, the oscillating mechanism uses multi-frequency, low-arc reciprocating motion to cause the droplets adhering to the wafer surface to detach through continuous inertial force during the drainage and initial drying stages. The inertial force generated by the oscillation effectively peels off loose residual powder from the surface and carries it into the flowing liquid for simultaneous discharge. This significantly reduces the risk of particle residue while improving drying efficiency.

[0026] like Figure 5 and Figure 8 In the middle, the limiting mechanism includes a limiting groove 5 opened inside the operating slider 13, a rotating circular plate 51 rotatably connected inside the limiting groove 5, one end of the central connecting rod 21 extending into the interior of the limiting groove 5, and the other end of the central connecting rod 21 being fixedly connected to the rotating circular plate 51. A horizontal plate groove 52 is opened on the inner wall of the limiting groove 5 away from the washing basket 14, and an adjusting horizontal plate 53 is slidably connected inside the horizontal plate groove 52. Two central locking grooves 56 are symmetrically opened on the side of the rotating circular plate 51 near the adjusting horizontal plate 53. The inner wall is provided with a central arc groove 55. Two limiting pins 54 are symmetrically fixedly connected to the side of the adjusting horizontal plate 53 near the rotating circular plate 51. By adjusting the horizontal plate 53 to slide inside the horizontal plate groove 52, the limiting pins 54 are ensured to extend stably into the central locking groove 56. The limiting pins 54 extend into the central locking groove 56 that is close to them. Initially, the adjusting horizontal plate 53 is located inside the side of the horizontal plate groove 52 near the central connecting rod 21, and at this time the limiting pins 54 are located inside the central locking groove 56.

[0027] like Figure 5 and Figure 9 In the power mechanism, there is a contraction groove 61 on the inner wall of the horizontal plate groove 52 away from the central connecting rod 21. The contraction groove 61 passes through the operating slider 13 and is located on the side away from the central connecting rod 21. The drive shaft 62 is slidably connected inside the contraction groove 61. The drive shaft 62 is fixedly connected to the adjusting horizontal plate 53. The inner wall of the contraction groove 61 has an expansion groove 63. The expansion ring 64 is slidably connected inside the expansion groove 63. The expansion ring 64 is fixedly sleeved on the surface of the drive shaft 62. The inner wall of the expansion groove 63 is fixedly connected to an adjusting spring 65. The adjusting spring 65 is fixedly connected to the expansion ring 64. The adjusting spring 65 is located on the side of the expansion ring 64 close to the adjusting horizontal plate 53. The adjusting spring 65 applies elastic force to the expansion ring 64. Initially, the drive shaft 62 is fully contracted into the contraction groove 61. The expansion ring 64 is located inside the expansion groove 63 near the rotating circular plate 51. At this time, the adjusting spring 65 is in a compressed state under the push of the expansion ring 64.

[0028] like Figure 2In the middle, the inner wall of the operating slide 12 away from the cleaning basket 14 has an extension groove 6. Both ends of the extension groove 6 are set as inclined surfaces. The intersection of the vertical part of the extension groove 6 and the inclined surface part is located at both ends of the side tooth block 4. The depth of the extension groove 6 is greater than the sliding distance of the adjusting horizontal plate 53. When the drive shaft 62 is located in the vertical part of the extension groove 6, the limiting pin 54 is disengaged from the interior of the central arc surface groove 55. When the side tooth block 4 contacts the drive gear 41, the limiting pin 54 is disengaged from the interior of the central arc surface groove 55. When the horizontal plate 22 is in a horizontal state, the variable gear 46 meshes with the side tooth block 4. Before the variable gear 46 contacts the side tooth block 4, the horizontal plate 22 is always in a horizontal state under the restriction of the limiting pin 54, thereby ensuring that the variable gear 46 is in a meshing state every time it contacts the side tooth block 4, thus avoiding the problem of tooth collision.

[0029] As the operating slider 13 continues to slide upward, the drive shaft 62 slides upward synchronously along the inner wall of the operating slide groove 12. Before the variable gear 46 contacts the side tooth block 4, the drive shaft 62, under the elastic force of the adjusting spring 65, extends along the inclined surface of the extension groove 6, thus gradually extending into the interior of the extension groove 6. At this time, the limit pin 54 gradually disengages from the interior of the central arc groove 55 under the drive of the drive shaft 62. When the drive shaft 62 is located at the junction of the vertical part and the inclined part of the extension groove 6, the limit pin 54 completely disengages from the interior of the central arc groove 55. At this time, the central arc groove 55 is in an active state, and as the drive shaft 62 continues to rise, the drive gear 41 contacts the side tooth block 4, thus facilitating subsequent shaking operations. When the shaking operation is completed and the drive gear 41 disengages from the side tooth block 4, the drive shaft 62 is located at the junction of the vertical part and the inclined part of the extension groove 6. As the drive shaft 62 continues to slide along the inclined surface of the extension groove 6, the drive shaft 62 gradually slides towards the cleaning basket 14. When the horizontal plate 22 does not shift, the limiting pin 54 smoothly enters the interior of the central locking groove 56 under the pushing action of the drive shaft 62, thereby limiting its horizontal state; When the transverse plate 22 is displaced due to external collision and is not in a horizontal state, the limiting pin 54 first contacts the arc surface of the central arc groove 55 under the pushing action of the drive shaft 62. The limiting pin 54 gradually penetrates into the central arc groove 55 and applies arc surface thrust to push the displaced transverse plate 22 to gradually become horizontal. As the limiting pin 54 continues to slide, it extends into the interior of the central locking groove 56, thereby limiting its horizontal state. After the cleaning basket 14 completes the swing cleaning operation, it is first precisely positioned horizontally and then mechanically fixed to ensure that the cleaning basket 14 and the wafer it carries always maintain a strictly horizontal posture during the subsequent lifting, transfer and drying processes. This ensures that the cleaning basket 14 is accurately placed into the cleaning tank, avoiding mechanical collisions caused by tilting and enhancing the safety and reliability of the operation process.

[0030] Working principle: When the cleaning basket 14 is being cleaned, the clamping groove is aligned with the side wall support plate 2 under the drive of the operation box 11. At this time, the drive motor 25 drives the lead screw 24 to rotate through the output shaft, and the two transmission blocks 26 move closer to each other through the thread on the surface of the lead screw 24, and slide stably along the surface of the transmission guide rail 3 until the two clamping blocks 33 clamp and fix the cleaning basket 14. Then, the cleaning basket 14 is transported through the movable base 1 and the operation box 11, thereby transporting the cleaning basket 14 to the cleaning area for cleaning.

[0031] After the cleaning basket 14 has finished cleaning inside the cleaning mechanism, the output shaft of the electric telescopic rod drives the lifting plate 17 to slide upward, thereby driving the hanging frame 18 to slide upward synchronously. When the lifting plate 17 slides to the upper end of the lifting groove 16, the lifting guide rail 111 extends into the interior of the hanging frame 18, thereby providing support for the cleaning basket 14. As the output shaft of the electric telescopic rod continues to slide upward, the lifting plate 17 drives the operating slider 13 to slide upward synchronously, thereby driving the cleaning basket 14 to slide upward synchronously through the clamping mechanism until the cleaning basket 14 is removed from the inside of the cleaning mechanism. As the operating slider 13 continues to slide upward, the variable gear 46 contacts the side tooth block 4. The variable gear 46 rotates under the push of the side tooth block 4, and the drive gear 41 rotates under the push of the variable gear 46. The surface contact shaft 45 provides a thrust to the inner wall of one side of the adjusting slide 44, thereby pushing the central connecting rod 43 to swing gradually away from the center line of the drive gear 41 until the contact shaft 45 is located in the middle of the adjusting slide 44. As the drive gear 41 continues to rotate, the contact shaft 45 contacts the inner wall of the opposite side of the adjusting slide 44, thereby pushing the central connecting rod 43 back until the contact shaft 45 reaches the lower end of the adjusting slide 44. At this time, the central connecting rod 43 becomes horizontal again. This process is repeated through the continuous rotation of the drive gear 41. During the reciprocating swing of the central connecting rod 43, the central connecting rod 21 drives the drive mechanism and the clamping mechanism to swing back and forth. The clamping mechanism drives the cleaning basket 14 to swing synchronously. The cleaning basket 14 is made to swing back and forth synchronously during the upward process, thereby throwing out the liquid droplets on the wafer surface inside the cleaning basket 14. After cleaning, the oscillating mechanism uses multi-frequency, low-arc reciprocating motion to cause the droplets adhering to the wafer surface to detach through continuous inertial force during the drainage and initial drying stages. The inertial force generated by the oscillation effectively peels off loose residual powder from the surface and carries it into the flowing liquid for simultaneous discharge. This significantly reduces the risk of particle residue while improving drying efficiency.

[0032] As the operating slider 13 continues to slide upward, the drive shaft 62 slides upward synchronously along the inner wall of the operating slide groove 12. Before the variable gear 46 contacts the side tooth block 4, the drive shaft 62, under the elastic force of the adjusting spring 65, extends along the inclined surface of the extension groove 6, thus gradually extending into the interior of the extension groove 6. At this time, the limit pin 54 gradually disengages from the interior of the central arc groove 55 under the drive of the drive shaft 62. When the drive shaft 62 is located at the junction of the vertical part and the inclined part of the extension groove 6, the limit pin 54 completely disengages from the interior of the central arc groove 55. At this time, the central arc groove 55 is in an active state, and as the drive shaft 62 continues to rise, the drive gear 41 contacts the side tooth block 4, thus facilitating subsequent shaking operations. When the shaking operation is completed and the drive gear 41 disengages from the side tooth block 4, the drive shaft 62 is located at the junction of the vertical part and the inclined part of the extension groove 6. As the drive shaft 62 continues to slide along the inclined surface of the extension groove 6, the drive shaft 62 gradually slides towards the cleaning basket 14. When the horizontal plate 22 does not shift, the limiting pin 54 smoothly enters the interior of the central locking groove 56 under the pushing action of the drive shaft 62, thereby limiting its horizontal state; When the transverse plate 22 is displaced due to external collision and is not in a horizontal state, the limiting pin 54 first contacts the arc surface of the central arc groove 55 under the pushing action of the drive shaft 62. The limiting pin 54 gradually penetrates into the central arc groove 55 and applies arc surface thrust to push the displaced transverse plate 22 to gradually become horizontal. As the limiting pin 54 continues to slide, it extends into the interior of the central locking groove 56, thereby limiting its horizontal state. After the cleaning basket 14 completes the swing cleaning operation, it is first precisely positioned horizontally and then mechanically fixed to ensure that the cleaning basket 14 and the wafer it carries always maintain a strictly horizontal posture during the subsequent lifting, transfer and drying processes. This ensures that the cleaning basket 14 is accurately placed into the cleaning tank, avoiding mechanical collisions caused by tilting and enhancing the safety and reliability of the operation process.

Claims

1. A wafer cleaning basket shaking device, comprising a movable base (1), characterized in that: An operation box (11) is fixedly connected to the upper surface of the movable base (1). A cleaning basket (14) is provided on one side of the operation box (11). An operation slide groove (12) is provided inside the operation box (11). An operation slider (13) is slidably connected inside the operation slide groove (12). A sealing groove is provided on the inner wall of the operation slide groove (12) near the cleaning basket (14). The sealing groove passes through the operation box (11) and communicates with the outside. A drive groove (15) is provided on the lower inner wall of the operation box (11). An electric telescopic rod is provided inside the drive groove (15). The operating slider (13) has a driving mechanism on the side of the side close to the cleaning basket (14). The surface of the driving mechanism has a clamping mechanism for fixing the cleaning basket (14). The surface of the driving mechanism has a shaking mechanism for removing residual water droplets and dust from the semiconductor surface inside the cleaning basket (14). The side of the operating slider (13) away from the cleaning basket (14) has a limit mechanism. The operating chute (12) has a power mechanism inside.

2. The wafer cleaning basket shaking device according to claim 1, characterized in that: The operating slider (13) has a lifting groove (16) on the side near the cleaning basket (14). A lifting plate (17) is slidably connected inside the lifting groove (16). The lifting plate (17) is L-shaped, and the horizontal part of the lifting plate (17) is located inside the lifting groove (16). Limiting grooves (19) are opened on both sides of the inner wall of the lifting groove (16). Limiting sliders (110) are fixedly connected to both sides of the horizontal part of the lifting plate (17). The limiting sliders (110) extend... The lifting plate (17) extends into the limiting groove (19) near it. The lower end of the vertical part of the lifting plate (17) is fixedly connected to the hanging frame (18) on the side near the cleaning basket (14). The cleaning basket (14) is fixedly connected to the lifting guide rail (111) on the side near the operating slider (13). The lifting guide rail (111) is slidably connected to the hanging frame (18). The output shaft of the electric telescopic rod extends into the lifting groove (16). The output shaft of the electric telescopic rod is fixedly connected to the horizontal part of the lifting plate (17).

3. The wafer cleaning basket shaking device according to claim 1, characterized in that: The driving mechanism includes a central connecting rod (21) rotatably connected to the side of the operating slider (13) near the cleaning basket (14). A horizontal plate (22) is fixedly connected to the end of the central connecting rod (21) away from the operating box (11). Two side support blocks (23) are symmetrically arranged on the side of the horizontal plate (22) away from the operating box (11). A lead screw (24) is rotatably connected between the two side support blocks (23). A drive motor (25) is fixedly connected to the side support block (23) away from the lead screw (24). The output shaft of the drive motor (25) is fixedly connected to the lead screw (24). Two transmission blocks (26) are symmetrically threaded on the surface of the lead screw (24).

4. The wafer cleaning basket shaking device according to claim 3, characterized in that: The clamping mechanism includes a main body block (32) fixedly connected to the side of the two transmission blocks (26) away from the horizontal plate (22). The side of the horizontal plate (22) away from the operating box (11) is fixedly connected to a transmission guide rail (3). The surface of the transmission guide rail (3) is symmetrically slidably connected to two guide rail blocks (31). The guide rail blocks (31) are fixedly connected to the adjacent main body block (32). The two sides of the cleaning basket (14) are fixedly connected to side wall support plates (2). The lower surfaces of the two main body blocks (32) are fixedly connected to clamping blocks (33). The two clamping blocks (33) are provided with clamping grooves on the side that is close to each other.

5. The wafer cleaning basket shaking device according to claim 3, characterized in that: The shaking mechanism includes a drive gear (41) rotatably connected to the surface of the operating slider (13) near the cleaning basket (14) via a rotating shaft. A collar (42) is fixedly sleeved on the surface of the central connecting rod (21). A central connecting rod (43) is fixedly connected to the surface of the collar (42). An adjustment groove (44) is provided on the surface of the central connecting rod (43). An abutment shaft (45) is fixedly connected to the surface of the drive gear (41) near the cleaning basket (14). The abutment shaft (45) extends into the interior of the adjustment groove (44).

6. The wafer cleaning basket shaking device according to claim 5, characterized in that: The operating slider (13) is rotatably connected to a variable gear (46) on the side of the cleaning basket (14) via a rotating shaft. The variable gear (46) meshes with the drive gear (41). Multiple side tooth blocks (4) are arranged linearly from top to bottom on the inner wall of the sealing groove. The side of the drive gear (41) near the cleaning basket (14) is aligned with the side of the operating box (11) near the cleaning basket (14). The side tooth blocks (4) are located on the sliding path of the variable gear (46). The variable gear (46) meshes with the side tooth blocks (4).

7. The wafer cleaning basket shaking device according to claim 5, characterized in that: The limiting mechanism includes a limiting groove (5) inside the operating slider (13). A rotating circular plate (51) is rotatably connected inside the limiting groove (5). One end of the central connecting rod (21) extends into the limiting groove (5). One end of the central connecting rod (21) is fixedly connected to the rotating circular plate (51). A horizontal plate groove (52) is provided on the inner wall of the limiting groove (5) away from the cleaning basket (14). An adjusting horizontal plate (53) is slidably connected inside the horizontal plate groove (52). Two central locking grooves (56) are symmetrically provided on the side of the rotating circular plate (51) near the adjusting horizontal plate (53). A central arc groove (55) is provided on the inner wall of the central locking groove (56). Two limiting pins (54) are symmetrically fixedly connected on the side of the adjusting horizontal plate (53) near the rotating circular plate (51). The limiting pins (54) extend into the interior of the central locking groove (56) near them.

8. The wafer cleaning basket shaking device according to claim 1, characterized in that: The power mechanism includes a contraction groove (61) on the inner wall of the horizontal plate groove (52) away from the central connecting rod (21). The contraction groove (61) passes through the operating slider (13) and is located away from the central connecting rod (21). A drive shaft (62) is slidably connected inside the contraction groove (61). The drive shaft (62) is fixedly connected to the adjusting horizontal plate (53). An expansion groove (63) is provided on the inner wall of the contraction groove (61). An expansion ring (64) is slidably connected inside the expansion groove (63). The expansion ring (64) is fixedly sleeved on the surface of the drive shaft (62). An adjusting spring (65) is fixedly connected to the inner wall of the expansion groove (63). The adjusting spring (65) is fixedly connected to the expansion ring (64).

9. The wafer cleaning basket shaking device according to claim 8, characterized in that: The operating chute (12) has an extension groove (6) on the inner wall away from the cleaning basket (14). Both ends of the extension groove (6) are set as inclined surfaces. The vertical part of the extension groove (6) and the inclined surface part are respectively located at the two ends of the side tooth block (4).