Transfer apparatus and control method thereof

Abstract

The application discloses a transfer equipment and a control method thereof. The transfer equipment comprises a turnover mechanism, a buffer mechanism and a transfer mechanism. The turnover mechanism is used for picking up and turning over a wafer chip on a wafer platform. The buffer mechanism comprises at least two parallelly arranged buffer platforms, and the buffer platforms are used for buffering a plurality of wafer chips. The transfer mechanism is used for transferring the wafer chip picked up by the turnover mechanism to the buffer platforms. When the wafer chips buffered by one of the buffer platforms reach a preset number, the transfer mechanism transfers the wafer chips to another buffer platform. The application can realize parallel operation of the turnover process and the subsequent bonding process, reduce the waiting time of the bonding equipment in the dipping of flux and the mounting process, improve the overall mounting efficiency and capacity of the equipment, and meet the demand of large-scale production.

Description

Technical Field

[0001] This application relates to the field of chip manufacturing technology, and in particular to a transfer device and its control method. Background Technology

[0002] As electronic devices become increasingly miniaturized and highly integrated, the market demand for chip packaging capacity continues to rise. In related technologies, chip transfer equipment typically employs a wafer-by-wafer flipping operation, while the accompanying bonding equipment features a single bonding head structure. This allows for sequential execution of core processes such as flux application and placement on the wafers flipped by the chip transfer equipment. However, each process consumes significant redundant idle time, limiting the increase in equipment placement capacity and making it difficult to meet the demands of large-scale mass production. Summary of the Invention

[0003] This application aims to at least solve one of the aforementioned technical problems existing in the prior art. Therefore, the purpose of this application is to provide a transfer device capable of parallel operation of the flipping process and subsequent bonding processes, reducing the idle travel waiting time of the bonding equipment during flux application and placement processes, improving the overall placement efficiency and capacity of the equipment, and meeting the needs of large-scale mass production.

[0004] This application also proposes a control method based on the above-mentioned transfer equipment.

[0005] The transfer device according to a first aspect embodiment of this application includes: A flipping mechanism for picking up and flipping wafer chips on a wafer platform; A caching mechanism, comprising at least two parallel caching platforms, wherein the caching platforms are used to cache multiple wafer chips; A transfer mechanism is used to transfer the wafer chip picked up by the flipping mechanism to the cache platform. When the number of wafer chips cached on one of the cache platforms reaches a preset number, the transfer mechanism transfers the wafer chip to another cache platform.

[0006] The transfer device according to the embodiments of this application has at least the following beneficial effects: the caching mechanism includes at least two parallel caching platforms, each of which can cache multiple wafer chips, enabling the bonding equipment to perform placement operations on multiple wafer chips, reducing the idle standby time of the bonding equipment due to waiting for a single wafer chip to complete flipping and transfer; at the same time, when the number of wafer chips cached on one of the caching platforms reaches a preset number, the transfer mechanism transfers the wafer chips to the other caching platform, realizing the parallel operation of the flipping process and the subsequent bonding process, reducing the idle travel waiting time of the bonding equipment during flux application and placement processes, making the flipping and placement process a continuous flow operation, improving the overall placement efficiency and capacity of the equipment, and meeting the needs of large-scale mass production.

[0007] According to some embodiments of this application, the caching mechanism further includes a first driving component corresponding to each of the caching platforms. The caching platform is connected to the driving end of the corresponding first driving component, and the first driving component is used to drive the corresponding caching platform to move along a first direction.

[0008] According to some embodiments of this application, the transfer device further includes a fluxing mechanism disposed on one side of the buffer platform, the fluxing mechanism being used to provide flux.

[0009] According to some embodiments of this application, the flipping mechanism is configured as two, and the two flipping mechanisms can alternately pick up the wafer chips on the wafer platform.

[0010] According to some embodiments of this application, the flipping mechanism includes a flipping arm, a rotation drive, and a second drive. The flipping arm is used to pick up a wafer chip on the wafer platform. The flipping arm is connected to the drive end of the rotation drive. The rotation drive can drive the flipping arm to rotate so as to flip the wafer chip. The rotary drive is connected to the drive end of the second drive, and the second drive can drive the rotary drive to move along the second direction to pick up the wafer chip.

[0011] According to some embodiments of this application, the transfer mechanism includes a transfer arm, a third driving member and a fourth driving member. The transfer arm is connected to the driving end of the third driving member. The third driving member can drive the transfer arm to move along a second direction so that the transfer arm picks up the wafer chip after it has been flipped by the flipping mechanism. The third driving member is connected to the driving end of the fourth driving member. The fourth driving member can drive the third driving member to move along a third direction, so that the transfer arm can transfer the picked-up wafer chip to the cache platform. The second direction is perpendicular to the third direction.

[0012] The control method according to the second aspect of this application, using the transfer device according to the first aspect of this application, includes the following steps: The flipping mechanism picks up and flips the wafer chips on the wafer platform; The transfer mechanism transfers the wafer chip flipped by the flipping mechanism to one of the cache platforms; When the number of wafer chips cached by one of the cache platforms reaches a preset number, the cache platform moves to the loading position of the bonding equipment, and the transfer mechanism transfers the wafer chips flipped by the flipping mechanism to another cache platform.

[0013] The control method according to the embodiments of this application has at least the following beneficial effects: The wafer chip is picked up and flipped by the flipping mechanism, and simultaneously transferred to a buffer platform by the transfer mechanism. After a preset quantity is buffered on one of the buffer platforms, the wafer chip can be directly moved to the loading position of the bonding equipment for batch placement. The transfer mechanism simultaneously switches to another buffer platform to continue the transfer operation, ensuring that the bonding equipment can obtain a continuous supply of wafer chips without waiting for individual wafer chips to complete flipping and transfer, shortening the overall equipment operation cycle, improving placement capacity and operational efficiency, and adapting to the capacity requirements of large-scale mass production. Furthermore, this application achieves coordinated and parallel connection between the flipping process, the transfer process, and the bonding and placement process by executing the wafer chip picking and flipping, transfer buffering, and buffer platform switching loading processes in steps, reducing redundant idle travel waiting time between processes, and improving the overall placement capacity and production efficiency of the production line composed of the transfer equipment and the bonding equipment.

[0014] According to some embodiments of this application, the flipping mechanism picks up and flips the wafer chip on the wafer platform, including: The second driving component of the flipping mechanism drives its rotation driving component to move along the second direction, and the flipping arm of the flipping mechanism picks up the wafer chip on the wafer platform. The rotating drive of the flipping mechanism drives the flipping arm to rotate, thereby flipping the wafer chip.

[0015] The transfer mechanism transfers the wafer chip flipped by the flipping mechanism to one of the cache platforms, including: According to some embodiments of this application, after the transfer mechanism transfers a wafer chip to the cache platform, the cache platform moves a preset distance along a first direction so that the wafer chips on the cache platform are distributed sequentially along the first direction.

[0016] According to some embodiments of this application, when the number of wafer chips cached by one of the cache platforms reaches a preset number, the cache platform moves to the loading position of the bonding equipment, and the transfer mechanism transfers the wafer chips flipped by the flipping mechanism to another cache platform, including: When the wafer chip cached by one of the cache platforms is picked up by the bonding device, the cache platform moves to the loading position of the transfer mechanism, and the number of wafer chips cached by the other cache platform reaches a preset number.

[0017] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0018] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is one of the structural schematic diagrams of the transfer device according to an embodiment of this application; Figure 2 This is a second schematic diagram of the structure of the transfer device according to an embodiment of this application; Figure 3 for Figure 2 Enlarged view of section A; Figure 4 for Figure 1 The diagram shows the structure of the buffer mechanism of the transfer device; Figure 5 for Figure 1 The diagram shows the structure of the adhesive application mechanism in the transfer device. Figure 6 for Figure 1 A schematic diagram of the structure of the transfer device's flipping mechanism when picking up a wafer chip; Figure 7 for Figure 1 A schematic diagram of the flipping mechanism of the transfer device when flipping a wafer chip; Figure 8 for Figure 1 The diagram shows the structural schematic of the transfer mechanism of the transfer equipment. Figure 9 This is a flowchart illustrating the control method of an embodiment of this application.

[0019] Reference numerals: 100, Tilting mechanism; 110, Tilting arm; 120, Rotation drive component; 130, Second drive component; 200. Cache mechanism; 210. Cache platform; 220. First driver; 300. Transfer mechanism; 310. Transfer arm; 320. Third drive component; 330. Fourth drive component; 400. Adhesive dispensing mechanism; 500. Alignment mechanism. Detailed Implementation

[0020] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0021] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0024] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0025] Reference Figures 1 to 4The first aspect of this application provides a transfer device, including a flipping mechanism 100, a caching mechanism 200, and a transfer mechanism 300. The flipping mechanism 100 is used to pick up and flip wafer chips on a wafer platform (not shown in the figure). The caching mechanism 200 includes at least two parallel caching platforms 210, which are used to cache multiple wafer chips. The transfer mechanism 300 is used to transfer the wafer chips picked up by the flipping mechanism 100 to the caching platform 210. When the number of wafer chips cached by one of the caching platforms 210 reaches a preset number, the transfer mechanism 300 transfers the wafer chips to the other caching platform 210.

[0026] Specifically, the caching mechanism 200 includes at least two parallel caching platforms 210, each capable of caching multiple wafer chips. This allows the bonding equipment to perform placement operations on multiple wafer chips, reducing idle standby time caused by waiting for a single wafer chip to complete flipping and transfer. Simultaneously, when one caching platform 210 has accumulated a preset number of wafer chips, the transfer mechanism 300 transfers the wafer chips to the other caching platform 210, enabling parallel operation of the flipping process and subsequent bonding processes. This reduces idle travel waiting time during flux application and placement, allowing the flipping and placement processes to form a continuous, streamlined operation, improving overall equipment placement efficiency and capacity, and meeting the needs of large-scale mass production.

[0027] Reference Figures 2 to 4In some embodiments, the cache mechanism 200 further includes a first driving member 220 corresponding to each cache platform 210. The cache platform 210 is connected to the driving end of the corresponding first driving member 220, and the first driving member 220 is used to drive the corresponding cache platform 210 to move along a first direction. Specifically, there are two cache platforms 210, each having a first end and a second end arranged opposite to each other along the first direction. After the transfer mechanism 300 transfers a wafer chip to the first end of one of the cache platforms 210, the first driving member 220 drives the cache platform 210 to move a preset distance along the first direction, so that the transfer mechanism 300 can continue to place the next wafer chip on the cache platform 210, realizing the orderly arrangement of the wafer chips along the first direction on the cache platform 210, ensuring the regularity of the wafer chip cache. When the number of wafer chips cached on the cache platform 210 reaches a preset quantity, the first driving unit 220 can drive the cache platform 210 to move to the loading position of the bonding equipment. This allows the bonding equipment to simultaneously transfer multiple wafer chips from the cache platform 210 to the next process. Simultaneously, the transfer mechanism 300 can switch to another cache platform 210 to perform wafer chip transfer and placement operations. The first driving unit 220 drives the orderly arrangement of wafer chips on the other cache platform 210 until the preset number of wafer chips on that cache platform 210 is reached. The two cache platforms 210 alternately load wafer chips through the driving of the first driving unit 220 and the coordinated operation of the transfer mechanism 300, ensuring a continuous supply of wafer chips to the bonding equipment, reducing idle travel time between processes, improving overall equipment operating efficiency and mounting capacity, and meeting the production needs of large-scale mass production. Furthermore, after the bonding equipment completes the wafer chip mounting process, the wafer chips cached on another buffer platform 210 reach a preset quantity and are moved to the loading position of the bonding equipment, realizing the alternating feeding of the two buffer platforms 210. This ensures that the bonding equipment can continuously acquire wafer chips to be mounted, avoiding idle standby time caused by waiting for wafer chip supply. This further improves the synergistic parallel effect of the flipping process, transfer process and mounting process, and improves the compactness and continuity of the overall equipment operation cycle, thereby further increasing the equipment mounting capacity.

[0028] Reference Figure 2 It should be noted that the first direction is the Y direction.

[0029] In some embodiments, the first driving component 220 includes a motor and a lead screw. The lead screw is connected to the driving end of the motor, and the cache platform 210 is connected to the lead screw. The motor drives the lead screw to rotate, thereby moving the cache platform 210 and adjusting its position in the first direction. This ensures that the cache platform 210 can align with the wafer chip placement station of the transfer mechanism 300 and the loading station of the bonding equipment, avoiding problems such as wafer chip placement disorder or loading failure caused by positioning deviation of the cache platform 210. This improves the regularity of the wafer chip cache arrangement and the reliability of equipment process connections. Of course, in actual design, the structure of the first driving component 220 can be designed according to actual needs.

[0030] Reference Figure 1 , Figure 5 In some embodiments, the transfer device further includes a flux-dispensing mechanism 400, which is disposed on one side of the cache platform 210. The flux-dispensing mechanism 400 is used to provide flux. The bonding device can simultaneously transfer multiple wafer chips on the cache platform 210 to the flux-dispensing mechanism 400 to dispense flux, thereby connecting the wafer chip flux-dispensing process with the mounting process, reducing redundant waiting time between processes, improving wafer chip mounting efficiency, and thus improving the overall operating capacity of the equipment.

[0031] Reference Figure 1 , Figure 2 In some embodiments, two flipping mechanisms 100 are configured, which can alternately pick up wafer chips on the wafer platform. Specifically, two flipping mechanisms 100 are configured and adopt an alternating wafer chip picking operation mode. At the same time, each flipping mechanism 100 is equipped with a transfer mechanism 300, a buffer mechanism 200, and a glue application mechanism 400, realizing dual-station flip-chip transfer operation. This enables the synchronous and parallel execution of two sets of wafer chip flip-chip transfer processes, improving the overall operational efficiency of wafer chip flipping, transfer, buffering, and glue application. Through the independent operation and collaborative cooperation of the two stations, the overall equipment operation cycle is further compressed, and the overall equipment capacity is increased.

[0032] Reference Figure 2 , Figure 3 , Figure 6 , Figure 7In some embodiments, the flipping mechanism 100 includes a flipping arm 110, a rotation drive 120, and a second drive 130. The flipping arm 110 is used to pick up a wafer chip on the wafer platform. The flipping arm 110 is connected to the drive end of the rotation drive 120, which can drive the flipping arm 110 to rotate, thereby flipping the wafer chip. The rotation drive 120 is also connected to the drive end of the second drive 130, which can drive the rotation drive 120 to move along a second direction to pick up the wafer chip. Specifically, the second drive 130 drives the flipping arm 110 to descend along the second direction via the rotation drive 120, so that the flipping arm 110 contacts and picks up the wafer chip on the wafer platform. Then, the second drive 130 drives the rotation drive 120 to rise along the second direction, and then the rotation drive 120 drives the flipping arm 110 to rotate, thereby flipping the wafer chip 180°. The coordinated operation of the flipping arm 110, the rotary drive 120, and the second drive 130 enables the continuous execution of wafer chip picking and flipping actions, reducing operational redundancy between processes and improving wafer chip flipping efficiency.

[0033] Reference Figure 2 It should be noted that the second direction is the Z direction.

[0034] In some embodiments, the flip arm 110 uses vacuum adsorption to pick up wafer chips on the wafer platform, enabling flexible gripping of the wafer chips and avoiding stress damage or surface scratches caused by mechanical clamping. Simultaneously, the vacuum adsorption method can adapt to the picking requirements of wafer chips of different specifications, improving the adaptability of the flip mechanism 100 to wafer chips. It should be noted that the vacuum adsorption method used by the flip arm 110 to pick up wafer chips is prior art, and this application has not made any improvements to this part; therefore, its structure and principle will not be described in detail.

[0035] In some embodiments, the rotary drive 120 is configured as a motor and the second drive 130 is configured as a cylinder. Of course, in actual design, the structure of the rotary drive 120 and the structure of the second drive 130 can be designed according to actual needs.

[0036] In some embodiments, the two flipping mechanisms 100 are symmetrically arranged about the axis of the wafer platform, and the two flipping arms 110 rotate in opposite directions. The two flipping arms 110 alternately pick up wafer chips on the wafer platform, which can improve the flipping efficiency of wafer chips. Combined with the dual-station structural design, it further improves the continuous feeding capability of the equipment and adapts to the needs of large-scale mass production.

[0037] Reference Figure 2 , Figure 3 , Figure 8In some embodiments, the transfer mechanism 300 includes a transfer arm 310, a third drive member 320, and a fourth drive member 330. The transfer arm 310 is connected to the drive end of the third drive member 320, and the third drive member 320 can drive the transfer arm 310 to move along a second direction so that the transfer arm 310 picks up the wafer chip flipped by the flipping mechanism 100. The third drive member 320 is connected to the drive end of the fourth drive member 330, and the fourth drive member 330 can drive the third drive member 320 to move along a third direction so that the transfer arm 310 transfers the picked-up wafer chip to the cache platform 210. The second direction is perpendicular to the third direction. Specifically, the third drive unit 320 drives the transfer arm 310 to descend along the second direction to the first preset position. The transfer arm 310 picks up the wafer chip flipped by the flipping mechanism 100. Then, the third drive unit 320 drives the transfer arm 310 to rise along the second direction to the second preset position. Next, the fourth drive unit 330 drives the third drive unit 320 to move along the third direction above the cache platform 210. Finally, the third drive unit 320 drives the transfer arm 310 to descend along the second direction to the third preset position, and the transfer arm 310 transfers the picked-up wafer chip to the cache platform 210. The coordinated operation of the transfer arm 310, the third drive unit 320, and the fourth drive unit 330 enables the continuous operation of wafer chip picking and transfer, reducing the operation time of the transfer process. Combined with the alternating operation mode of the dual flipping mechanism 100 and the alternating loading design of the dual cache platform 210, the connection efficiency between the flipping process and the cache process is further improved, and the idle travel waiting time between processes is reduced.

[0038] Reference Figure 2 It should be noted that the third direction is the X direction.

[0039] In some embodiments, the transfer arm 310 uses vacuum adsorption to pick up the wafer chip flipped by the flipping arm 110, enabling flexible gripping of the wafer chip and avoiding stress damage or surface scratches caused by mechanical clamping. Simultaneously, the vacuum adsorption method can adapt to the picking requirements of wafer chips of different specifications, improving the adaptability of the transfer mechanism 300 to wafer chips. It should be noted that the vacuum adsorption method used by the transfer arm 310 to pick up the wafer chip is prior art, and this application has not made any improvements to this part; therefore, its structure and principle will not be described in detail.

[0040] In some embodiments, the third drive unit 320 is configured as a linear module and the fourth drive unit 330 is configured as a cylinder. Of course, in actual design, the structure of the third drive unit 320 and the structure of the fourth drive unit 330 can be designed according to actual needs.

[0041] Reference Figure 1 , Figure 2In some embodiments, the transfer device further includes an alignment mechanism 500, which is disposed above the wafer platform. The alignment mechanism 500 is used to identify and position the wafer chips on the wafer platform, thereby obtaining the position information of the wafer chips on the wafer platform, providing position guidance for the picking action of the flipping mechanism 100, avoiding the problem of picking failure or wafer chip damage caused by the flipping mechanism 100 due to positioning deviation, and improving the operation accuracy of the flipping mechanism 100 in picking wafer chips.

[0042] Reference Figure 9 A second aspect of this application provides a control method using the transfer device of the first aspect of this application, comprising the following steps: S100, the flipping mechanism 100 picks up and flips the wafer chip on the wafer platform.

[0043] Step S100 includes the following steps: S110, the second driving member 130 of the flipping mechanism 100 drives its rotation driving member 120 to move along the second direction, and the flipping arm 110 of the flipping mechanism 100 picks up the wafer chip on the wafer platform. Specifically, the second driving member 130 drives the flipping arm 110 to descend along the second direction through the rotation driving member 120, so that the flipping arm 110 contacts and picks up the wafer chip on the wafer platform; S120, the rotation drive 120 of the flipping mechanism 100 drives the flipping arm 110 to rotate, thereby flipping the wafer chip. Specifically, the second drive 130 drives the rotation drive 120 to rise in the second direction, and then the rotation drive 120 drives the flipping arm 110 to rotate, thereby flipping the wafer chip 180°.

[0044] S200, the transfer mechanism 300 transfers the wafer chip flipped by the flipping mechanism 100 to one of the cache platforms 210.

[0045] Step S200 includes the following steps: S210 and the third driving unit 320 drive the transfer arm 310 to descend to the first preset position along the second direction, and the transfer arm 310 picks up the wafer chip after it has been flipped by the flipping mechanism 100. S220 and the third drive unit 320 drive the transfer arm 310 to rise along the second direction to the second preset position; S230 and the fourth driving component 330 drive the third driving component 320 to move along the third direction to above the cache platform 210; S240 and the third driving unit 320 drive the transfer arm 310 to descend along the second direction to the third preset position, and the transfer arm 310 transfers the picked-up wafer chip to the cache platform 210.

[0046] In step S200, after the transfer mechanism 300 transfers a wafer chip to the cache platform 210, the cache platform 210 moves a preset distance along the first direction, so that the wafer chips on the cache platform 210 are sequentially distributed along the first direction. Specifically, after the transfer mechanism 300 first transfers a wafer chip to the first end of one of the cache platforms 210, the first driving member 220 drives the cache platform 210 to move a preset distance along the first direction, so that the transfer mechanism 300 can continue to place the next wafer chip on the cache platform 210.

[0047] S300 When the number of wafer chips cached by one of the cache platforms 210 reaches a preset number, the cache platform 210 moves to the loading position of the bonding equipment, and the transfer mechanism 300 transfers the wafer chips flipped by the flipping mechanism 100 to another cache platform 210.

[0048] In step S300, when the number of wafer chips cached on one of the cache platforms 210 reaches a preset number, the first driving unit 220 drives the cache platform 210 to move to the loading position of the bonding device. At the same time, the transfer mechanism 300 transfers the wafer chips to the first end of the other cache platform 210.

[0049] In step S300, when the wafer chip cached by one of the cache platforms 210 is picked up by the bonding device, the cache platform 210 moves to the loading position of the transfer mechanism 300, and the wafer chip cached by the other cache platform 210 reaches a preset number.

[0050] The control method of this application picks up and flips wafer chips through a flipping mechanism 100, and simultaneously transfers the flipped wafer chips to a buffer platform 210 through a transfer mechanism 300. After a preset quantity is buffered on one of the buffer platforms 210, the wafer chips can be directly moved to the loading position of the bonding equipment for batch placement. The transfer mechanism 300 simultaneously switches to another buffer platform 210 to continue the transfer operation, ensuring that the bonding equipment can obtain a continuous supply of wafer chips without waiting for individual wafer chips to complete flipping and transfer, shortening the overall equipment operation cycle, improving placement capacity and operation efficiency, and adapting to the capacity requirements of large-scale mass production. In addition, this application achieves the coordination and parallel connection of the flipping process, the transfer buffer, and the bonding placement process by executing the wafer chip picking and flipping, transfer buffer, and buffer platform 210 switching operation in stages, reducing redundant idle travel waiting time between processes, and improving the overall placement capacity and production efficiency of the production line composed of the transfer equipment and the bonding equipment.

[0051] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A transfer device, characterized in that, include: A flipping mechanism for picking up and flipping wafer chips on a wafer platform; A caching mechanism, comprising at least two parallel caching platforms, wherein the caching platforms are used to cache multiple wafer chips; A transfer mechanism is used to transfer the wafer chip picked up by the flipping mechanism to the cache platform. When the number of wafer chips cached on one of the cache platforms reaches a preset number, the transfer mechanism transfers the wafer chip to another cache platform.

2. The transfer device according to claim 1, characterized in that, The caching mechanism further includes a first driving component corresponding to each of the caching platforms. The caching platform is connected to the driving end of the corresponding first driving component, and the first driving component is used to drive the corresponding caching platform to move along a first direction.

3. The transfer device according to claim 1, characterized in that, The transfer device also includes a fluxing mechanism disposed on one side of the buffer platform, the fluxing mechanism being used to provide flux.

4. The transfer device according to claim 1, characterized in that, The flipping mechanism is configured as two, and the two flipping mechanisms can alternately pick up the wafer chips on the wafer platform.

5. The transfer device according to claim 1, characterized in that, The flipping mechanism includes a flipping arm, a rotary drive, and a second drive. The flipping arm is used to pick up wafer chips on the wafer platform. The flipping arm is connected to the drive end of the rotary drive. The rotary drive can drive the flipping arm to rotate so as to flip the wafer chips. The rotary drive is connected to the drive end of the second drive, and the second drive can drive the rotary drive to move along the second direction to pick up the wafer chip.

6. The transfer device according to claim 1, characterized in that, The transfer mechanism includes a transfer arm, a third driving member and a fourth driving member. The transfer arm is connected to the driving end of the third driving member. The third driving member can drive the transfer arm to move along a second direction so that the transfer arm can pick up the wafer chip after it has been flipped by the flipping mechanism. The third driving member is connected to the driving end of the fourth driving member. The fourth driving member can drive the third driving member to move along a third direction, so that the transfer arm can transfer the picked-up wafer chip to the cache platform. The second direction is perpendicular to the third direction.

7. A control method for a transfer device according to any one of claims 1 to 6, characterized in that, Includes the following steps: The flipping mechanism picks up and flips the wafer chips on the wafer platform; The transfer mechanism transfers the wafer chip flipped by the flipping mechanism to one of the cache platforms; When the number of wafer chips cached by one of the cache platforms reaches a preset number, the cache platform moves to the loading position of the bonding equipment, and the transfer mechanism transfers the wafer chips flipped by the flipping mechanism to another cache platform.

8. The control method according to claim 7, characterized in that, The flipping mechanism picks up and flips the wafer chips on the wafer platform, including: The second driving component of the flipping mechanism drives its rotation driving component to move along the second direction, and the flipping arm of the flipping mechanism picks up the wafer chip on the wafer platform. The rotating drive of the flipping mechanism drives the flipping arm to rotate, thereby flipping the wafer chip.

9. The control method according to claim 7, characterized in that, The transfer mechanism transfers the wafer chip flipped by the flipping mechanism to one of the cache platforms, including: After the transfer mechanism transfers a wafer chip to the cache platform, the cache platform moves a preset distance along a first direction so that the wafer chips on the cache platform are distributed sequentially along the first direction.

10. The control method according to claim 7, characterized in that, When the number of wafer chips cached by one of the cache platforms reaches a preset number, the cache platform moves to the loading position of the bonding equipment, and the transfer mechanism transfers the wafer chips flipped by the flipping mechanism to another cache platform, including: When the wafer chip cached by one of the cache platforms is picked up by the bonding device, the cache platform moves to the loading position of the transfer mechanism, and the number of wafer chips cached by the other cache platform reaches a preset number.

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