A method of making a tgv tapered via

By depositing a metal protective layer on a glass substrate and selectively etching with an etchant, the fabrication of TGV tapered through-holes with controllable taper was achieved, solving the taper control problem in the prior art and improving the sealing and reliability of electronic devices.

CN122180393APending Publication Date: 2026-06-0910TH RES INST OF CETC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
10TH RES INST OF CETC
Filing Date
2026-01-26
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing technologies make it difficult to effectively control and manufacture TGV tapered through-holes with controllable taper, resulting in longer conductive paths, increased resistance, and filling defects, which affect the sealing and reliability of electronic devices.

Method used

A tapered through-hole pattern modification region is formed on a glass substrate using laser induction. After depositing a metal protective layer, selective etching with an etchant is used. By controlling the removal rate and time of the metal protective layer, precise etching of the tapered through-hole is achieved, forming a tapered through-hole with controllable taper.

Benefits of technology

It improves the etching uniformity and precision of tapered through holes, reduces metal buildup and void formation, enhances sealing and flow channel continuity, reduces the risk of stress concentration, and is suitable for high-density integrated electronic devices.

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Abstract

This invention relates to the field of 3D integrated packaging adapter board manufacturing technology, specifically disclosing a method for fabricating TGV tapered through-holes, comprising the following steps: Step S1: Cleaning and drying the glass substrate; Step S2: Irradiating the pre-fabricated tapered through-hole area on the glass substrate using a laser to form a corresponding tapered through-hole pattern modification area on the glass substrate; Step S3: Depositing a metal protective layer on one side surface of the glass substrate; Step S4: Treating the glass substrate with an etching solution, utilizing the difference in etching rates between the metal protective layer and the glass substrate to etch the tapered through-hole until the tapered through-hole reaches a predetermined diameter; Step S5: Cleaning to obtain the complete structure of the target tapered through-hole. This invention deposits a metal protective layer on the surface of the pre-fabricated tapered through-hole area on the glass substrate and uses an etching solution to etch the pre-fabricated tapered through-hole area, improving the uniformity and precision of the etching process and ensuring the controllability of the tapered through-hole shape and taper.
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